JPH0685426A - Spacer for assembling electronic part - Google Patents
Spacer for assembling electronic partInfo
- Publication number
- JPH0685426A JPH0685426A JP23066092A JP23066092A JPH0685426A JP H0685426 A JPH0685426 A JP H0685426A JP 23066092 A JP23066092 A JP 23066092A JP 23066092 A JP23066092 A JP 23066092A JP H0685426 A JPH0685426 A JP H0685426A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- spacer
- insulating member
- insulating members
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、取付板の実装面から電
子部品の頭部までの高さが所定の値になるよう該取付板
と、該電子部品との間に挿入される所定の厚みを有する
絶縁部材より成る電子部品の組立スペーサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a predetermined insertion between a mounting plate and an electronic component so that the height from the mounting surface of the mounting plate to the head of the electronic component has a predetermined value. The present invention relates to a spacer for assembling an electronic component, which includes an insulating member having a thickness.
【０００２】電子機器を構成する操作パネルに於いて
は、発光ダイオードなどの電子部品の複数個をプリント
基板などの取付板に配列することで実装し、発光ダイオ
ードの頭部を所定の高さに位置させ、頭部からの発光が
外部から容易に目視されるように形成されている。In an operation panel that constitutes an electronic device, a plurality of electronic parts such as light emitting diodes are mounted by arranging them on a mounting plate such as a printed circuit board, and the head of the light emitting diodes is mounted at a predetermined height. It is positioned so that the light emitted from the head can be easily seen from the outside.
【０００３】したがって、発光ダイオードを取付板に実
装する場合は、発光ダイオードの頭部が所定の高さに位
置されるよう、通常、発光ダイオードと、取付板との間
にスペーサが挿入されることが行われる。Therefore, when mounting the light emitting diode on the mounting plate, a spacer is usually inserted between the light emitting diode and the mounting plate so that the head of the light emitting diode is positioned at a predetermined height. Is done.
【０００４】[0004]
【従来の技術】従来は図３の従来の説明図に示すように
構成されていた。図３は従来の説明図で、(a) は側面
図、(b1)(b2)はスペーサの取付説明図である。2. Description of the Related Art Conventionally, the structure is shown in FIG. FIG. 3 is a conventional explanatory view, (a) is a side view, and (b1) and (b2) are explanatory views of spacer attachment.
【０００５】図３の(a) に示すように、押釦スイッチ12
に隣接することで発光ダイオードなどの電子部品3 をプ
リント基板などの取付板1 に実装する場合は、電子部品
3 のリード端子3Aを取付板1 のスルホールに固着させ、
電子部品3 の頭部5 が透明板11に近接するように形成さ
れる。As shown in FIG. 3A, the push button switch 12
When mounting an electronic component 3 such as a light-emitting diode on the mounting plate 1 such as a printed circuit board by adjoining the
Fix lead terminal 3A of 3 to the through hole of mounting plate 1,
The head 5 of the electronic component 3 is formed so as to be close to the transparent plate 11.
【０００６】また、取付板1 の実装面2 と、透明板11と
の間隔がL1およびL2のように異なる場合は、電子部品3
を実装する際、スペーサ13A または13B を装着すること
で電子部品3 の頭部5 が実装面2 から高さH およびH1に
することが行われる。If the mounting surface 2 of the mounting plate 1 and the transparent plate 11 have different distances such as L1 and L2, the electronic component 3
At the time of mounting, the head 13 of the electronic component 3 is set to the heights H and H1 from the mounting surface 2 by mounting the spacer 13A or 13B.
【０００７】このようなスペーサ13A または13B は、図
３の(b1)(b2)に示すように、絶縁チューブを所定の長さ
h またはh1に切断することで形成され、ベース4 から突
出するリード端子3Aに挿入することで装着され、露出し
たリード端子3Aの先端を取付板1 のスルホールに挿入す
ることで実装が行われるしたがって、実装面2 と、透明
板11との間隔L1,L2 に応じて長さがh のスペーサ13A ま
たは長さがh1のスペーサ13B を用いることで取付板1 に
電子部品3 を実装し、電子部品3 の頭部5 が透明板11に
近接させ、電子部品3 の点滅が容易に目視できるよう配
慮されていた。Such a spacer 13A or 13B has an insulating tube of a predetermined length as shown in (b1) and (b2) of FIG.
It is formed by cutting into h or h1 and is mounted by inserting it into the lead terminal 3A protruding from the base 4, and mounting is performed by inserting the exposed tip of the lead terminal 3A into the through hole of the mounting plate 1. The electronic component 3 is mounted on the mounting plate 1 by using the spacer 13A having a length h or the spacer 13B having a length h1 according to the distances L1 and L2 between the mounting surface 2 and the transparent plate 11. The head 5 of 3 was brought close to the transparent plate 11 so that blinking of the electronic component 3 could be easily seen.
【０００８】[0008]
【発明が解決しようとする課題】しかし、このようなス
ペーサ13A または13B の長さh,h1は切断によって形成さ
れるため、長さh,h1の精度が悪く、取付板1 に電子部品
3 を実装した時、傾斜などによって所定の高さH1,H2 が
得られないことがある。However, since the lengths h and h1 of the spacer 13A or 13B are formed by cutting, the accuracy of the lengths h and h1 is poor, and the electronic component is not attached to the mounting plate 1.
When 3 is mounted, the predetermined heights H1 and H2 may not be obtained due to the inclination.
【０００９】更に、電子部品2 を取付板1 に実装する組
立作業に際しては、透明板11との間隔L1,L2 に応じて長
さが異なるスペーサ13A,13B を準備し、その都度スペー
サ13A または13B 使い分けする必要がある。Further, in the assembly work for mounting the electronic component 2 on the mounting plate 1, spacers 13A and 13B having different lengths are prepared according to the distances L1 and L2 from the transparent plate 11, and the spacers 13A and 13B are prepared each time. It is necessary to use them properly.
【００１０】したがって、高さの調整作業およびスペー
サ13A,13B の挿入作業によって組立作業工数が増加する
問題を有していた。そこで、本発明では、電子部品を取
付板に実装する組立作業を容易にし、組立工数の削減を
図ることを目的とする。Therefore, there is a problem that the number of assembling steps increases due to the height adjusting operation and the spacer 13A and 13B inserting operation. Therefore, an object of the present invention is to facilitate the assembly work for mounting the electronic component on the mounting plate and reduce the number of assembly steps.
【００１１】[0011]
【課題を解決するための手段】図１は本発明の原理説明
図で、図１に示すように、取付板1 の実装面2 から電子
部品3 の頭部5 までの高さH が所定の値になるよう該実
装面2 と、該電子部品3 のベース4 との間に挿入される
所定の厚みT を有する絶縁部材6 より成る電子部品の組
立スペーサであって、前記絶縁部材6 の一面には凸部8
を形成すると共に、他面には該凸部8 に嵌合する凹部7
を形成し、必要に応じて、該絶縁部材6の２組を重ね合
わせた時、一方の該凸部8 が他方の該凹部7 に嵌合され
るように、また、前記絶縁部材6 を隣接することで配列
した時、該絶縁部材6 の互いが係止されるよう該絶縁部
材6 の側壁面6Aにガイド溝9 と、該ガイド溝9 に挿脱自
在なガイド部10とが対向することで形成されるように構
成する。FIG. 1 is a diagram for explaining the principle of the present invention. As shown in FIG. 1, the height H from the mounting surface 2 of the mounting plate 1 to the head 5 of the electronic component 3 is predetermined. A spacer for assembling an electronic component, which comprises an insulating member 6 having a predetermined thickness T, which is inserted between the mounting surface 2 and the base 4 of the electronic component 3 so that the value becomes a value. The convex part 8
And a concave portion 7 that is fitted to the convex portion 8 on the other surface.
So that when the two pairs of the insulating members 6 are overlapped, the convex portion 8 of one is fitted into the concave portion 7 of the other, and the insulating member 6 is adjacent to the insulating member 6. The guide groove 9 and the guide portion 10 that can be inserted into and removed from the guide groove 9 face each other on the side wall surface 6A of the insulating member 6 so that the insulating members 6 are locked to each other. Is formed.
【００１２】このように構成することによって前述の課
題は解決される。The above-mentioned problems can be solved by such a configuration.
【００１３】[0013]
【作用】即ち、所定の厚みT に形成された絶縁部材6 の
一面には凸部8 を、他面には凸部8 に嵌合する凹部7 を
設け、取付板1 に電子部品3 を実装する場合は、取付板
1 の実装面2 と、電子部品3 のベース4 との間に挿入す
ることで所定の高さH が形成されるようにしたものであ
る。Operation: That is, the insulating member 6 having a predetermined thickness T is provided with the convex portion 8 on one surface and the concave portion 7 fitted on the convex portion 8 on the other surface, and the electronic component 3 is mounted on the mounting plate 1. Mounting plate
A predetermined height H is formed by inserting it between the mounting surface 2 of 1 and the base 4 of the electronic component 3.
【００１４】そこで、高さH が異なる場合は、2 組の絶
縁部材6 の互いの凸部8 と、凹部7とを嵌合させること
で重ね合わせることによって対処することが行える。ま
た、絶縁部材6 の側壁面6Aにはガイド溝9 と、ガイド溝
9 に挿脱自在なガイド10部が設けられ、隣接することで
電子部品2 を配列させる場合は、隣接するガイド溝9 と
ガイド10部とを係止することが行えるように形成されて
いる。Therefore, when the heights H are different, it is possible to deal with them by fitting the convex portions 8 and the concave portions 7 of the two sets of insulating members 6 to each other so as to overlap each other. Also, on the side wall surface 6A of the insulating member 6, the guide groove 9
A guide 10 portion that can be freely inserted and removed is provided in 9 and is formed so that the adjacent guide groove 9 and the guide portion 10 can be locked when the electronic components 2 are arranged adjacent to each other.
【００１５】したがって、一種類の絶縁部材を準備する
ことで高さH の異なる電子部品の実装を行うことがで
き、しかも、絶縁部材の装着が容易であり、特に、複数
個を配列する場合は、隣接間が係止され、傾斜による高
さH の調整が不要となり、組立作業工数の削減が図れ
る。Therefore, by preparing one kind of insulating member, electronic components having different heights H can be mounted, and the insulating member can be easily mounted. Especially, when a plurality of insulating members are arranged. , Adjacent parts are locked, and adjustment of height H due to inclination is not required, and the number of assembly work steps can be reduced.
【００１６】[0016]
【実施例】以下本発明を図２を参考に詳細に説明する。
図２は本発明による一実施例の説明図で、(a) は側面
図,(b1) は絶縁部材の平面図,(b2) は絶縁部材の側面
図,(c)は連結の平面図である。全図を通じて、同一符号
は同一対象物を示す。The present invention will be described in detail below with reference to FIG.
FIG. 2 is an explanatory view of an embodiment according to the present invention, (a) is a side view, (b1) is a plan view of an insulating member, (b2) is a side view of an insulating member, and (c) is a plan view of connection. is there. Throughout the drawings, the same reference numerals denote the same objects.
【００１７】図２の(a) に示すように、取付板1 の実装
面2 と電子部品3 のベース4 との間に絶縁部材6 を挿入
することで電子部品3 の実装を行うようにしたものであ
る。また、絶縁部材6 は、図２の(b1)(b2)に示すよう
に、所定の厚みT を有し、一面には凹部7 が、他面には
凸部8 が形成され、2 組の絶縁部材6 を重ね合わせるこ
とで互いの凹部7 に凸部8 が嵌合し、互いが位置づれを
生じることのないように重ね合わされるように形成され
ており、更に、側壁面6Aはガイド溝9 と、ガイド部10と
が対向するように設けられており、ガイド溝9 とガイド
部10とにはスリット6Bが形成され、電子部品3 のリード
端子3Aが挿入される。As shown in FIG. 2A, the electronic component 3 is mounted by inserting an insulating member 6 between the mounting surface 2 of the mounting plate 1 and the base 4 of the electronic component 3. It is a thing. Further, as shown in (b1) and (b2) of FIG. 2, the insulating member 6 has a predetermined thickness T. The concave portion 7 is formed on one surface and the convex portion 8 is formed on the other surface. By stacking the insulating members 6 on each other, the projections 8 are fitted into the recesses 7 of each other, and the projections 8 are formed so as not to be misaligned with each other. 9 and the guide portion 10 are provided so as to face each other, a slit 6B is formed in the guide groove 9 and the guide portion 10, and the lead terminal 3A of the electronic component 3 is inserted.
【００１８】そこで、電子部品3 を実装面2 に実装する
場合は、実装面2 を実装面2 に載置し、電子部品3 のリ
ード端子3Aをスリット6Bを貫通させることで取付板1 の
スルホールに挿入させ、リード端子3Aの先端部を半田付
けすることで行われる。Therefore, when the electronic component 3 is mounted on the mounting surface 2, the mounting surface 2 is placed on the mounting surface 2 and the lead terminals 3A of the electronic component 3 are penetrated through the slits 6B so that the through hole of the mounting plate 1 is penetrated. It is performed by soldering the tip portion of the lead terminal 3A.
【００１９】この場合、透明板11と、取付板1 の実装面
2 との間隔がL1の時は、2 つの絶縁部材6 を重ね合わせ
ることで実装面2 から電子部品3 の頭部5 までの高さを
H に形成し、電子部品3 の頭部5 が透明板11に近接させ
ることが行え、間隔がL2の時は、1 つの絶縁部材6 を用
いることで実装面2 から電子部品3 の頭部5 までの高さ
をH1にし、電子部品3 の頭部5 が透明板11に近接させる
ことが行える。In this case, the mounting surface of the transparent plate 11 and the mounting plate 1
When the distance from L2 is L1, the height from the mounting surface 2 to the head 5 of the electronic component 3 can be increased by overlapping the two insulating members 6.
The head 5 of the electronic component 3 can be brought close to the transparent plate 11 when it is formed in H, and when the distance is L2, one insulating member 6 is used to mount the head 5 of the electronic component 3 from the mounting surface 2. It is possible to set the height up to H1 and bring the head 5 of the electronic component 3 close to the transparent plate 11.
【００２０】したがって、間隔がL1またはL2になること
で実装すべき電子部品3 の高さが異なっても厚みT の絶
縁部材6 を準備することで対処することが行え、しか
も、絶縁部材6 はモールド成形などによって製造するこ
とが容易に行え、厚みT の精度が良く、前述のような傾
斜などによる組立調整は不要となる。Therefore, even if the height of the electronic component 3 to be mounted is different due to the spacing being L1 or L2, it can be dealt with by preparing the insulating member 6 having the thickness T. It can be easily manufactured by molding, etc., the thickness T is accurate, and the assembly adjustment due to the inclination as described above is unnecessary.
【００２１】更に、電子部品3 の複数が隣接する場合
は、図２の(c) に示すように、隣接した絶縁部材6-1 の
ガイド溝9 に絶縁部材6-2 のガイド部10を挿入させ、互
いが連結されるよう係止させることが行え、絶縁部材6-
1 を取付することで次に、取付ける絶縁部材6-2 の位置
決めが自動的に行えることなる。Further, when a plurality of electronic components 3 are adjacent to each other, the guide portion 10 of the insulating member 6-2 is inserted into the guide groove 9 of the adjacent insulating member 6-1, as shown in FIG. 2 (c). And can be locked so that they are connected to each other, and the insulating member 6-
By attaching 1, the next insulating member 6-2 can be automatically positioned.
【００２２】したがって、電子部品を隣接することで連
続した組立を行う場合は、組立作業の能率を向上させる
ことができる。Therefore, when the electronic parts are adjacent to each other for continuous assembling, the efficiency of the assembling work can be improved.
【００２３】[0023]
【発明の効果】以上説明したように、本発明によれば、
実装すべき電子部品と、取付板との間には凹，凸部およ
びガイド溝，ガイド部が設けられた絶縁部材を必要に応
じて１個または２個挿入することで電子部品の高さの調
整を行うように、更に、隣接間では互いが連結されるよ
うに係止することが行える。As described above, according to the present invention,
The height of the electronic component can be increased by inserting one or two insulating members provided with recesses, protrusions, guide grooves, and guides between the electronic component to be mounted and the mounting plate as needed. Adjustments can also be made and further locking can be provided between adjacent ones so that they are connected to each other.
【００２４】したがって、従来のような実装すべき電子
部品の高さに応じてスペーサを使い分けする必要がな
く、しかも、傾斜などによる高さのバラツキが生じるこ
とがなく、組立作業工数の削減が図れ、実用的効果は大
である。Therefore, it is not necessary to properly use the spacers according to the height of the electronic components to be mounted as in the conventional case, and the height variation due to the inclination or the like does not occur, so that the number of assembling steps can be reduced. , The practical effect is great.
【図１】 本発明の原理説明図FIG. 1 is an explanatory view of the principle of the present invention.
【図２】 本発明による一実施例の説明図FIG. 2 is an explanatory diagram of an embodiment according to the present invention.
【図３】 従来の説明図FIG. 3 is a conventional explanatory diagram.
１ 取付板 ２ 実装面 ３ 電子部品 ４ ベース ５ 頭部 ６ 絶縁部材 ７ 凹部 ８ 凸部 ９ ガイド溝 10 ガイド部 6A 側壁面 1 Mounting Plate 2 Mounting Surface 3 Electronic Component 4 Base 5 Head 6 Insulation Member 7 Recess 8 Convex 9 Guide Groove 10 Guide 6A Side Wall
Claims (2)
(3) の頭部(5) までの高さ(H) が所定の値になるよう該
実装面(2) と、該電子部品(3) のベース(4) との間に挿
入される所定の厚み(T) を有する絶縁部材(6) より成る
電子部品の組立スペーサであって、 前記絶縁部材(6) の一面には凸部(8) を形成すると共
に、他面には該凸部(8)に嵌合する凹部(7) を形成し、
必要に応じて、該絶縁部材(6) の２組を重ね合わせた
時、一方の該凸部(8) が他方の該凹部(7) に嵌合される
ことを特徴とする電子部品の組立スペーサ。1. Electronic components from the mounting surface (2) of the mounting plate (1)
The height (H) to the head (5) of (3) has a predetermined value, which is inserted between the mounting surface (2) and the base (4) of the electronic component (3). A spacer for assembling an electronic component, comprising an insulating member (6) having a thickness (T), wherein a convex portion (8) is formed on one surface of the insulating member (6) and the convex portion is formed on the other surface. Form a recess (7) that fits in (8),
If necessary, when two sets of the insulating member (6) are superposed, one convex portion (8) is fitted into the other concave portion (7), which is an assembly of electronic parts. Spacer.
することで配列した時、該絶縁部材(6) の互いが係止さ
れるよう該絶縁部材(6) の側壁面(6A)にガイド溝(9)
と、該ガイド溝(9) に挿脱自在なガイド部(10)とが対向
することで形成されることを特徴とする電子部品の組立
スペーサ。2. The side wall surface (6A) of the insulating member (6) so that when the insulating members (6) are arranged adjacent to each other, the insulating members (6) are locked to each other. ) On the guide groove (9)
And an assembling spacer for an electronic component, which is formed by facing a guide portion (10) which can be inserted into and removed from the guide groove (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23066092A JPH0685426A (en) | 1992-08-31 | 1992-08-31 | Spacer for assembling electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23066092A JPH0685426A (en) | 1992-08-31 | 1992-08-31 | Spacer for assembling electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0685426A true JPH0685426A (en) | 1994-03-25 |
Family
ID=16911296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23066092A Pending JPH0685426A (en) | 1992-08-31 | 1992-08-31 | Spacer for assembling electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0685426A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0940861A2 (en) * | 1998-03-05 | 1999-09-08 | E.G.O. Control Systems GmbH & Co. KG | Light emitting diode |
| EP1333709A2 (en) * | 2002-01-30 | 2003-08-06 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Supporting device for discrete electric component |
| JP2010004454A (en) * | 2008-06-23 | 2010-01-07 | Sumitomo Electric Ind Ltd | Lamp and method of manufacturing the same |
-
1992
- 1992-08-31 JP JP23066092A patent/JPH0685426A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0940861A2 (en) * | 1998-03-05 | 1999-09-08 | E.G.O. Control Systems GmbH & Co. KG | Light emitting diode |
| EP0940861A3 (en) * | 1998-03-05 | 2000-04-05 | E.G.O. Control Systems GmbH & Co. KG | Light emitting diode |
| EP1333709A2 (en) * | 2002-01-30 | 2003-08-06 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Supporting device for discrete electric component |
| EP1333709A3 (en) * | 2002-01-30 | 2004-12-29 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Supporting device for discrete electric component |
| US7019220B2 (en) | 2002-01-30 | 2006-03-28 | Kabushiki Kaisha Tokai Rika Denki Seisakusho | Supporting device for discrete electric component |
| JP2010004454A (en) * | 2008-06-23 | 2010-01-07 | Sumitomo Electric Ind Ltd | Lamp and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19991005 |