JPH0666015B2 - External circuit connection method of liquid crystal panel - Google Patents
External circuit connection method of liquid crystal panelInfo
- Publication number
- JPH0666015B2 JPH0666015B2 JP62166417A JP16641787A JPH0666015B2 JP H0666015 B2 JPH0666015 B2 JP H0666015B2 JP 62166417 A JP62166417 A JP 62166417A JP 16641787 A JP16641787 A JP 16641787A JP H0666015 B2 JPH0666015 B2 JP H0666015B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal panel
- external circuit
- temperature
- connection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 ［発明の分野］ 本発明は、液晶パネルの外部回路接続法に関するもの
で、時に強誘電性液晶パネルの外部回路接続に適した接
続法に関するものである。Description: FIELD OF THE INVENTION The present invention relates to a method for connecting an external circuit to a liquid crystal panel, and more particularly to a connection method suitable for connecting an external circuit to a ferroelectric liquid crystal panel.
［従来技術］ 従来、FPC（フレキシブルプリント基板）と配線基板
（ガラスエポキシ基板、ガラス基板、セラミツク基板、
FPC等）とを相互に接続する一手段として絶縁性樹脂中
に導電体を分散含有させたフイルム形状の異方性導電フ
イルムを熱圧着して接続する方法が広く用いられてい
る。とくに近年、従来のCRTにかわるデイスプレイとし
て液晶表示素子やEL表示素子等の画像表示装置や従来の
CCDにかわるセンサーとしてアモルフアス−Si等を用い
た長尺一体形成の密着型イメージセンサー等の画像読取
装置の分野では、高密度分解能を持つ異方性導電フイル
ムによる接続方法は広く用いられている。[Prior Art] Conventionally, FPC (flexible printed circuit board) and wiring board (glass epoxy board, glass board, ceramic board,
As a means for connecting (FPC, etc.) to each other, a method of connecting by thermocompression bonding a film-shaped anisotropic conductive film in which a conductor is dispersed and contained in an insulating resin is widely used. In particular, in recent years, as a display replacing conventional CRTs, image display devices such as liquid crystal display elements and EL display elements and conventional
In the field of image reading devices such as a contact type image sensor of a long length integrally formed by using amorphous-Si or the like as a sensor in place of CCD, a connecting method using an anisotropic conductive film having high resolution is widely used.
又、FPCとしては、ICチツプを直接搭載することがで
き、かつ画像表示素子や画像読取素子に接続するための
配線機能を有し、なおかつ組立工程の合理化を可能なら
しめる搬送機能をも合せ持っているフイルムキヤリアテ
ープが多く用いられている。Also, as an FPC, an IC chip can be directly mounted, and it has a wiring function for connecting to an image display element or an image reading element, and also has a transfer function that enables rationalization of the assembly process. Many film carrier tapes are used.
しかしながら、従来の接続法で外部駆動回路と接続され
た表示パネルでは、抵抗が大きくなり、液晶パネルを駆
動するためには、大きな電圧を必要としていた。However, the display panel connected to the external drive circuit by the conventional connection method has a large resistance, and a large voltage is required to drive the liquid crystal panel.
また、強誘電性液晶は、それがコレステリック相または
等方相などの高温側の相に相転移されるまで加熱され、
その後強誘電性を発現するカイラルウメクチック相まで
急激に冷却されると、その結果得られた強誘電性液晶に
は、配向欠陥等の表示パネルとしての適用性を悪化させ
る現象が発生していた。特に、上述の接続法で用いた加
熱プロセスによって液晶パネルが加熱されると、液晶パ
ネルの加熱付近の強誘電性液晶が相転移を生じ、液晶パ
ネル内に相転移を生じた領域とそれを生じていない領域
とが表示ムラとして判別されてしまい、これが表示品位
を低いものにしていた問題点があった。Also, the ferroelectric liquid crystal is heated until it undergoes a phase transition to a higher temperature phase such as a cholesteric phase or an isotropic phase,
After that, when it is rapidly cooled to a chiral Umectic phase that exhibits ferroelectricity, the resulting ferroelectric liquid crystal has a phenomenon such as alignment defects that deteriorate its applicability as a display panel. It was In particular, when the liquid crystal panel is heated by the heating process used in the above connection method, the ferroelectric liquid crystal near the heating of the liquid crystal panel causes a phase transition, which causes a region in the liquid crystal panel and a region where the phase transition occurs. The non-displayed area is discriminated as display unevenness, which causes a problem of low display quality.
［発明の概要］ 本発明の目的は、前述の欠点を解決した液晶パネルの接
続法を提供すること、特に、強誘電性液晶パネルの電気
的接続時の加熱プロセスによって発生していた表示ムラ
を発生させることなく、接続部の抵抗を十分に低い値に
設定することができる液晶パネルの接続法を提供するこ
とにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid crystal panel connection method that solves the above-mentioned drawbacks, and particularly to eliminate display unevenness caused by a heating process during electrical connection of a ferroelectric liquid crystal panel. It is an object of the present invention to provide a liquid crystal panel connection method capable of setting the resistance of a connection portion to a sufficiently low value without generating the resistance.
すなわち、本発明は、強誘電性液晶を備えた液晶パネル
の駆動用電極に接続させた外部回路接続用電極と、外部
回路に接続させた外部回路電極との間に、金属膜をコー
ティングした樹脂粒子で形成した導電体粒子を分散含有
した絶縁性樹脂で形成したフィルム体を配置し、前記液
晶パネルが強誘電性液晶の相転移を生じる温度まで加熱
されない様に、該フィルム体に圧力を印加した状態下
で、該フィルム体の絶縁性樹脂を熱溶融させる温度まで
加熱し、前記２つの電極間の接続抵抗を十分に小さく設
定した後に、所定の温度まで降温し、該降温下で前記圧
力の印加を解除する液晶パネルの外部回路接続法に特徴
がある。That is, the present invention provides a resin coated with a metal film between an external circuit connecting electrode connected to a driving electrode of a liquid crystal panel including a ferroelectric liquid crystal and an external circuit electrode connected to an external circuit. A film body formed of an insulating resin containing dispersed conductive particles formed of particles is arranged, and pressure is applied to the film body so that the liquid crystal panel is not heated to a temperature at which a phase transition of a ferroelectric liquid crystal occurs. In this state, the insulating resin of the film body is heated to a temperature at which it is melted by heat, and after setting the connection resistance between the two electrodes to be sufficiently small, the temperature is lowered to a predetermined temperature and the pressure is reduced under the temperature decrease. It is characterized by the external circuit connection method of the liquid crystal panel that releases the application of the voltage.
［発明の態様の詳細な説明］ 以下、本発明を図面に従って説明する。DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION The present invention will be described below with reference to the drawings.
第１図は、本発明の接続法にって液晶パネル14と外部駆
動回路であるIC18とが電気的に接続されている態様を表
わす平面図で、第２図は本発明で用いた接続装置の断面
図である。図中、11は異方性導電接続剤、12はフイルム
・キヤリヤ・テープ、13は外部回路電極、14は液晶パネ
ルで、141は液晶パネルから延長した基板、15は外部回
路接続用電極、16はヒート・ツール、17は加熱電源、18
はIC回路、19はボンデイング部材、20は接着剤である。FIG. 1 is a plan view showing a mode in which a liquid crystal panel 14 and an IC 18 which is an external drive circuit are electrically connected by the connection method of the present invention, and FIG. 2 is a connection device used in the present invention. FIG. In the figure, 11 is an anisotropic conductive connecting agent, 12 is a film carrier tape, 13 is an external circuit electrode, 14 is a liquid crystal panel, 141 is a substrate extended from the liquid crystal panel, 15 is an external circuit connecting electrode, 16 Is a heat tool, 17 is a heating power supply, 18
Is an IC circuit, 19 is a bonding member, and 20 is an adhesive.
本発明では、異方性導電接着剤11をフイルム・キヤリヤ
・テープ12の外部回路電極13と、外部回路接続用電極15
との間に配置し、ヒート・ツール16で押圧した後、ヒー
ト・ツール16の加熱電源17に電圧を印加することによっ
て、熱圧着し、しかる後、加熱電源17の電圧を解除して
から、ヒート・ツール16の押圧を解放する。上述した操
作を繰返し行うために、加熱電源17からヒート・ツール
16にパルス電圧を印加する。In the present invention, the anisotropic conductive adhesive 11 is applied to the external circuit electrode 13 of the film carrier tape 12 and the external circuit connecting electrode 15
Between the two, and after pressing with the heat tool 16, by applying a voltage to the heating power supply 17 of the heat tool 16, thermocompression bonding, then, after releasing the voltage of the heating power supply 17, Release the pressure on the heat tool 16. From the heating power supply 17 to the heating tool to repeat the above operation.
Apply pulse voltage to 16.
第３図は、ヒート・ツール16の回路図で、図中、31はパ
ルスヒート・ツール、311は熱電対、32はトランス、33
はトリガ制御系、34はAC電源である。本発明の好ましい
具体例では、トリガ制御系33の制御によって、ヒート・
ツール31に4msec期間中に、±1Vの電圧が周波数100Hzで
出力されることができる。FIG. 3 is a circuit diagram of the heat tool 16, in which 31 is a pulse heat tool, 311 is a thermocouple, 32 is a transformer, and 33.
Is a trigger control system, and 34 is an AC power supply. In a preferred embodiment of the present invention, the heat control is controlled by the trigger control system 33.
A voltage of ± 1 V can be output to the tool 31 at a frequency of 100 Hz for a period of 4 msec.
第４図（ａ）は、熱圧着時の異方性導電フイルム11の温
度、第４図（ｂ）は加圧力を示す。即ち、プレスを開始
するとパルスヒート・ツール16により加熱され室温T
1（約23℃）からT2（約130℃）に昇温する。t1（約20
秒）後に、パルスヒート・ツール16への電圧印加を停止
し、エアーブローを行うと、t2（約25秒）後にT3（約60
℃）に降温し、この時点でパルスヒート・ツール16のプ
レスを終了させる。温度T2は異方性導電フイルム11が充
分に溶融し、温度T3は充分に接着強度が得られる条件を
選択する。第４図（ｃ）は、この時の接続抵抗値を示
し、加熱終了後、プレス終了後とも安定していることが
判る。FIG. 4A shows the temperature of the anisotropic conductive film 11 during thermocompression bonding, and FIG. 4B shows the applied pressure. That is, when the press is started, it is heated by the pulse heat tool 16 and the room temperature T
Raise the temperature from 1 (about 23 ℃) to T 2 (about 130 ℃). t 1 (about 20
After 2 seconds), when the voltage application to the pulse heat tool 16 is stopped and the air blow is performed, after t 2 (about 25 seconds), T 3 (about 60 seconds).
(C) and the press of the pulse heat tool 16 is terminated at this point. The temperature T 2 is selected so that the anisotropic conductive film 11 is sufficiently melted, and the temperature T 3 is sufficient to obtain adhesive strength. FIG. 4 (c) shows the connection resistance value at this time, and it can be seen that it is stable after heating and after pressing.
第４図（ｄ）は、接続部に最も近く（5mm離れた）強誘
導性液晶表示素子の表示部の温度データを示し、これに
よればT4は40℃であった。FIG. 4 (d) shows temperature data of the display portion of the strongly inductive liquid crystal display element closest to the connection portion (5 mm apart), and T 4 was 40 ° C. according to the data.
本発明で用いる異方性導電接着剤11は、導電性粒子を分
散含有した熱可塑性樹脂で形成したフイルムで、所定の
加熱硬化条件下で硬化体を形成することができる。この
際に用いる導電体粒子としては、Au,Ni等の金属膜をコ
ーティングした良導電性を有する粒子を用いることがで
きる。又、この樹脂球状粒子は硬化性樹脂と同程度の線
膨張係数のものを用いることができる。この導電体は、
硬化性樹脂の固形分100重量部に対して0.5〜50重量部、
好ましくは５〜20重量部の割合で含有され、又その平均
粒径は５〜50μｍ、好ましくは10〜30μｍである。The anisotropic conductive adhesive 11 used in the present invention is a film formed of a thermoplastic resin in which conductive particles are dispersed and contained, and can form a cured product under predetermined heat curing conditions. As the conductive particles used at this time, particles having good conductivity coated with a metal film of Au, Ni or the like can be used. The resin spherical particles may have a linear expansion coefficient similar to that of the curable resin. This conductor is
0.5 to 50 parts by weight with respect to 100 parts by weight of the solid content of the curable resin,
It is preferably contained in a proportion of 5 to 20 parts by weight, and its average particle size is 5 to 50 μm, preferably 10 to 30 μm.
又、本発明で用いる熱可塑性樹脂としては、スチレン−
ブタジエン共重合体、テルペンフエノール樹脂、アクリ
ルゴム、エポキシ樹脂、ポリビニルフエノール、アクリ
ルニトリル−ブタジエン共重合体、フエノール樹脂、ポ
リエステル樹脂、ナイロン等の熱溶融性樹脂を用いるこ
とができる。Further, as the thermoplastic resin used in the present invention, styrene-
A heat-melting resin such as a butadiene copolymer, a terpene phenol resin, an acrylic rubber, an epoxy resin, a polyvinyl phenol, an acrylonitrile-butadiene copolymer, a phenol resin, a polyester resin or nylon can be used.
又、本発明では、これらの樹脂を１種又は２種以上組合
わせて用いることができる。又、熱可塑性樹脂の他にエ
ポキシ接着剤、熱硬化性シリコン樹脂、熱硬化性ポリイ
ミド樹脂などの熱硬化性樹脂を用いることも可能であ
る。Further, in the present invention, these resins may be used alone or in combination of two or more. In addition to the thermoplastic resin, it is also possible to use a thermosetting resin such as an epoxy adhesive, a thermosetting silicone resin, or a thermosetting polyimide resin.
［発明の効果］ 以上説明した様に、熱可塑性樹脂中や熱硬化性樹脂中に
導電体粒子を分散、混入してフイルム状に形成した異方
性導電フイルムを用いることによって、強誘電性液晶の
相転移温度以下にプロセス温度を抑えることができ、フ
イルムキヤリアテープの接続工程中に配向乱れを起こさ
ずに接続することが可能となった。[Effects of the Invention] As described above, by using the anisotropic conductive film formed into a film by dispersing and mixing conductive particles in a thermoplastic resin or a thermosetting resin, a ferroelectric liquid crystal is obtained. The process temperature can be suppressed below the phase transition temperature of, and the film carrier tape can be connected without disturbing the orientation during the connecting process.
またパルスヒート・ツールを用いて熱圧着し、パルス電
圧印加を停止して冷却後にツール圧力を解除することに
よって接続抵抗が安定するとともに、接続信頼性が向上
した。In addition, the connection resistance was stabilized and connection reliability was improved by thermocompression bonding using a pulse heat tool, stopping the application of pulse voltage and releasing the tool pressure after cooling.
第１図は本発明の接続法で電気的接続された表示パネル
と外部駆動回路との接続の態様を示す平面図で、第２図
は本発明の接続法で用いた接続装置の断面図である。第
３図はパルスヒート・ツールの回路図である。第４図は
時間軸における特性を示す説明図である。FIG. 1 is a plan view showing a mode of connection between a display panel electrically connected by the connection method of the present invention and an external drive circuit, and FIG. 2 is a sectional view of a connection device used in the connection method of the present invention. is there. FIG. 3 is a circuit diagram of the pulse heat tool. FIG. 4 is an explanatory diagram showing characteristics on the time axis.
Claims (1)
電極に接続させた外部回路接続用電極と、外部回路に接
続させた外部回路電極との間に、金属膜をコーティング
した樹脂粒子で形成した導電体粒子を分散含有した絶縁
性樹脂で形成したフィルム体を配置し、前記液晶パネル
が強誘電性液晶の相転移を生じる温度まで加熱されない
様に、該フィルム体に圧力を印加した状態下で、該フィ
ルム体の絶縁性樹脂を熱溶融させる温度まで加熱し、前
記２つの電極間の接続抵抗を十分に小さく設定した後
に、所定の温度まで降温し、該降温下で前記圧力の印加
を解除することを特徴とする液晶パネルの外部回路接続
法。1. Resin particles coated with a metal film between an external circuit connecting electrode connected to a driving electrode of a liquid crystal panel including a ferroelectric liquid crystal and an external circuit electrode connected to an external circuit. A film body formed of an insulating resin containing conductive particles dispersed therein is placed, and pressure is applied to the film body so that the liquid crystal panel is not heated to a temperature at which a phase transition of a ferroelectric liquid crystal occurs. In a state, the insulating resin of the film body is heated to a temperature at which it is melted by heat, and after setting the connection resistance between the two electrodes to be sufficiently small, the temperature is lowered to a predetermined temperature, and the pressure A method for connecting an external circuit of a liquid crystal panel, which is characterized by releasing the application.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62166417A JPH0666015B2 (en) | 1987-07-02 | 1987-07-02 | External circuit connection method of liquid crystal panel |
| EP88106849A EP0289026B1 (en) | 1987-05-01 | 1988-04-28 | External circuit connecting method and packaging structure |
| DE3852563T DE3852563T2 (en) | 1987-05-01 | 1988-04-28 | Method of connecting an external circuit and packaging structure. |
| US07/463,486 US5042919A (en) | 1987-05-01 | 1990-01-11 | External-circuit connecting and packaging structure |
| US07/483,312 US5019201A (en) | 1987-05-01 | 1990-02-21 | External-circuit connecting method and packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62166417A JPH0666015B2 (en) | 1987-07-02 | 1987-07-02 | External circuit connection method of liquid crystal panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6410221A JPS6410221A (en) | 1989-01-13 |
| JPH0666015B2 true JPH0666015B2 (en) | 1994-08-24 |
Family
ID=15831037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62166417A Expired - Lifetime JPH0666015B2 (en) | 1987-05-01 | 1987-07-02 | External circuit connection method of liquid crystal panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0666015B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129412A (en) * | 1989-10-14 | 1991-06-03 | Mitsubishi Electric Corp | Heat tool heating controller |
| JP2522071B2 (en) * | 1989-11-07 | 1996-08-07 | 日本電気株式会社 | Liquid crystal display board |
| KR100254942B1 (en) * | 1996-09-24 | 2000-05-01 | 전주범 | A bonding method of the pad of thin film actuated mirror arrays |
| KR100232678B1 (en) * | 1996-12-18 | 1999-12-01 | 구본준 | A structure and a method of ridged bump |
-
1987
- 1987-07-02 JP JP62166417A patent/JPH0666015B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6410221A (en) | 1989-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |