JPH0645752A - Laser bonding method - Google Patents
Laser bonding methodInfo
- Publication number
- JPH0645752A JPH0645752A JP21823692A JP21823692A JPH0645752A JP H0645752 A JPH0645752 A JP H0645752A JP 21823692 A JP21823692 A JP 21823692A JP 21823692 A JP21823692 A JP 21823692A JP H0645752 A JPH0645752 A JP H0645752A
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- hole
- metal
- laser
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、レーザ接合方法に関す
る。具体的にいうと、本発明は、レーザ光を照射するこ
とにより金属端子等の金属部材を金属薄板に接合させる
ためのレーザ接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser bonding method. Specifically, the present invention relates to a laser joining method for joining a metal member such as a metal terminal to a thin metal plate by irradiating laser light.
【０００２】[0002]
【背景技術】図４に従来のレーザ接合方法を示す。この
レーザ接合方法にあっては、プリント基板３１の表面に
形成された銅箔等からなるプリントパターン３２の上に
ハンダのような金属接合用ロウ材３３を挟んで部品端子
３４を重ねる。次いで、部品端子３４の上方からレーザ
光γを照射して部品端子３４、ロウ材３３及びプリント
パターン３２を加熱し、その熱によってロウ材３３を溶
融させる。溶融したロウ材３３を部品端子３４及びプリ
ントパターン３２に十分になじませた後、レーザ光γの
照射を停止し、冷却させて部品端子３４をプリントパタ
ーン３２に接合させる。BACKGROUND ART FIG. 4 shows a conventional laser bonding method. In this laser joining method, the component terminals 34 are superposed on the printed pattern 32 made of copper foil or the like formed on the surface of the printed circuit board 31 with a brazing material 33 for metal joining such as solder sandwiched therebetween. Next, the component terminal 34, the brazing material 33, and the print pattern 32 are heated by irradiating the laser light γ from above the component terminal 34, and the brazing material 33 is melted by the heat. After the melted brazing material 33 is sufficiently blended with the component terminals 34 and the print pattern 32, the irradiation of the laser beam γ is stopped and cooled to bond the component terminals 34 to the print pattern 32.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
レーザ接合方法あっては、プリントパターン３２が部品
端子３４やロウ材３３に比べ薄いため、またプリントパ
ターン３２が熱伝導性の悪いプリント基板３１によって
外部と遮断されているため、プリントパターン３２やロ
ウ材３３の温度が部品端子３４に比べて過度に高くな
り、部品端子３４とロウ材３３とプリントパターン３２
の３者の熱バランスがとれないという問題があった。こ
のため、例えばプリントパターン３２がプリント基板３
１から剥離するといった損傷が発生していた。However, in the conventional laser joining method, the printed pattern 32 is thinner than the component terminals 34 and the brazing material 33, and the printed pattern 32 is formed by the printed circuit board 31 having poor thermal conductivity. Since the print pattern 32 and the brazing material 33 are cut off from the outside, the temperature of the print pattern 32 and the brazing material 33 becomes excessively higher than that of the component terminal 34, and the component terminal 34, the brazing material 33, and the print pattern 32.
There was a problem that the heat balance of the three parties could not be balanced. Therefore, for example, the print pattern 32 is formed on the printed circuit board 3
Damage such as peeling from No. 1 occurred.
【０００４】また、プリントパターン３２は平面的であ
り、また接合面積が小さいので部品端子３４とプリント
パターン３２の接合強度が弱かった。Further, since the print pattern 32 is flat and the joint area is small, the joint strength between the component terminal 34 and the print pattern 32 is weak.
【０００５】本発明は、叙上の従来例の欠点に鑑みてな
されたものであり、その目的とするところは、接合時に
おける接合部の熱バランスを良好に保つことができ、且
つ接合部の接合強度が強いレーザ接合方法を提供するこ
とにある。The present invention has been made in view of the above-mentioned drawbacks of the conventional examples, and an object of the present invention is to maintain a good heat balance of the joint at the time of joining and It is to provide a laser bonding method having high bonding strength.
【０００６】[0006]
【課題を解決するための手段】本発明のレーザ接合方法
は、貫通孔を開口された金属薄板の上にロウ材を挟んで
当該金属薄板に接合しようとする金属部材を重ね、上方
から当該金属部材にレーザ光を照射することにより前記
ロウ材を介して当該金属薄板と金属部材を接合すること
を特徴としている。According to the laser bonding method of the present invention, a metal member to be bonded to a metal thin plate sandwiching a brazing material is placed on a metal thin plate having a through hole, and the metal is stacked from above. It is characterized in that the metal thin plate and the metal member are joined via the brazing material by irradiating the member with laser light.
【０００７】[0007]
【作用】本発明のレーザ接合方法にあっては、ロウ材を
介して金属部材を接合される金属薄板に貫通孔を開口し
ているので、ロウ材の熱を貫通孔から適度に発散させる
ことができ、接合部の熱バランスを良好に保つことがで
きる。したがって、接合部の一部が過度に高温になり、
熱によって損傷されることを防止することができる。In the laser joining method of the present invention, since the through hole is opened in the thin metal plate to which the metal member is joined via the brazing material, the heat of the brazing material is appropriately dissipated from the through hole. It is possible to maintain good heat balance at the joint. Therefore, a part of the joint becomes too hot,
It can be prevented from being damaged by heat.
【０００８】また、金属薄板の貫通孔に溶融したロウ材
が流れ込んで固化するので、その分だけ金属部材と金属
薄板の接合面積が増大する。また、貫通孔で固化したロ
ウ材がアンカーの役目を果たすので、金属部材と金属薄
板の接合強度を強くすることができる。Further, since the molten brazing material flows into the through holes of the metal thin plate and is solidified, the joint area between the metal member and the metal thin plate increases correspondingly. In addition, since the brazing material solidified in the through holes serves as an anchor, it is possible to increase the bonding strength between the metal member and the metal thin plate.
【０００９】[0009]
【実施例】図１は本発明の一実施例によるレーザ接合方
法を示す斜視図、図２はその断面図である。このレーザ
接合方法にあっては、プリント基板１の表面にプリント
パターン（金属薄板）２が形成され、プリントパターン
２の例えば中央にプリント基板１を貫通するスルーホー
ル（貫通孔）３が形成されている。スルーホール３の内
面の金属層３ａはプリントパターン２と連続的に形成さ
れている。1 is a perspective view showing a laser joining method according to an embodiment of the present invention, and FIG. 2 is a sectional view thereof. In this laser bonding method, a printed pattern (metal thin plate) 2 is formed on the surface of the printed board 1, and a through hole (through hole) 3 penetrating the printed board 1 is formed at the center of the printed pattern 2, for example. There is. The metal layer 3a on the inner surface of the through hole 3 is formed continuously with the print pattern 2.
【００１０】このようなプリント基板１上に、プリント
パターン２及びスルーホール３を覆うようにして金属接
合用ロウ材４（例えばハンダ）を重ね、さらにその上に
部品端子（金属部材）５を重ねる。On the printed circuit board 1 as described above, a brazing material 4 (for example, solder) for metal joining is laid so as to cover the printed pattern 2 and the through holes 3, and a component terminal (metal member) 5 is further laid on it. .
【００１１】次いで、部品端子５の上方からスルーホー
ル３に向けてレーザ光αを照射する。このレーザ光αの
エネルギーによって部品端子５が加熱され、さらにはそ
の熱が伝導することによってロウ材４、プリントパター
ン２及びスルーホール３の金属層３ａが加熱される。Next, laser light α is emitted from above the component terminal 5 toward the through hole 3. The energy of the laser light α heats the component terminal 5, and the heat is conducted to heat the brazing material 4, the printed pattern 2, and the metal layer 3 a of the through hole 3.
【００１２】ロウ材４の温度がロウ材４の融点を超える
と、図３に示すように、ロウ材４が溶融し、その一部は
スルーホール３に流れ込む。ロウ材４を部品端子５、プ
リントパターン２及びスルーホール３に十分になじませ
た後、レーザ光αの照射を停止する。この後、冷却させ
てロウ材４を固化させ、レーザ接合を終了する。When the temperature of the brazing material 4 exceeds the melting point of the brazing material 4, as shown in FIG. 3, the brazing material 4 is melted and a part thereof flows into the through hole 3. After the brazing material 4 is sufficiently blended with the component terminals 5, the printed pattern 2 and the through holes 3, the irradiation of the laser light α is stopped. After that, the brazing material 4 is solidified by cooling and the laser bonding is completed.
【００１３】本実施例においては、プリントパターン２
やロウ材４の熱をスルーホール３から適度に発散させる
ことができるので、プリントパターン２やロウ材４の温
度が部品端子５に比べて過度に高温になることを防止す
ることができ、接合部全体の熱バランスを良好に保ちな
がらレーザ接合することができる。したがって、従来の
ようにプリントパターン２の温度が過度に上昇して、プ
リントパターン２がプリント基板１から剥離することが
ない。In this embodiment, the print pattern 2
Since the heat of the brazing material 4 can be appropriately dissipated from the through hole 3, it is possible to prevent the temperature of the printed pattern 2 and the brazing material 4 from becoming excessively higher than that of the component terminals 5, and the bonding can be performed. Laser bonding can be performed while maintaining good heat balance of the entire part. Therefore, unlike the conventional case, the temperature of the print pattern 2 does not excessively rise and the print pattern 2 does not peel from the printed circuit board 1.
【００１４】また、スルーホール３に流れ込んで固化し
たロウ材４が、いわばアンカーの役目を果たすので、部
品端子５とプリント基板１の接合強度が非常に強い。Further, since the brazing material 4 which has flowed into the through hole 3 and is solidified serves as an anchor, so to speak, the bonding strength between the component terminal 5 and the printed circuit board 1 is very strong.
【００１５】[0015]
【発明の効果】本発明のレーザ接合方法によれば、金属
薄板に開口した貫通孔からロウ材の熱を適度に発散させ
ることができ、接合部の熱バランスを良好に保ちながら
接合することができる。したがって、接合部の一部の温
度が過度に上昇して接合部が損傷することを防止するこ
とができる。According to the laser joining method of the present invention, the heat of the brazing material can be appropriately dissipated from the through hole opened in the thin metal plate, and the joining can be performed while maintaining a good heat balance at the joining portion. it can. Therefore, it is possible to prevent the temperature of a part of the joint from excessively rising and damaging the joint.
【００１６】また、金属薄板の貫通孔に溶融したロウ材
が流れ込んで固化する分だけ、従来より接合面積を増大
させることができ、また貫通孔で固化したロウ材がアン
カーの役目を果たすので、強い接合強度を確保すること
ができる。Further, since the molten brazing material flows into the through holes of the thin metal plate and solidifies, the joining area can be increased as compared with the conventional case, and the brazing material solidified in the through holes serves as an anchor. A strong bonding strength can be secured.
【図１】本発明の一実施例によるレーザ接合方法を示す
斜視図である。FIG. 1 is a perspective view showing a laser bonding method according to an embodiment of the present invention.
【図２】同上の断面図である。FIG. 2 is a sectional view of the same.
【図３】同上の接合後の状態を示す断面図である。FIG. 3 is a cross-sectional view showing a state after joining the same as above.
【図４】従来例によるレーザ接合方法を示す断面図であ
る。FIG. 4 is a sectional view showing a laser bonding method according to a conventional example.
１ プリント基板 ２ プリントパターン（金属薄板） ３ スルーホール（貫通孔） ４ 金属接合用ロウ材 ５ 部品端子（金属部材） α レーザ光 1 Printed circuit board 2 Print pattern (thin metal plate) 3 Through hole (through hole) 4 Brazing material for metal joining 5 Component terminal (metal member) α Laser light
Claims (1)
材を挟んで当該金属薄板に接合しようとする金属部材を
重ね、上方から当該金属部材にレーザ光を照射すること
により前記ロウ材を介して当該金属薄板と金属部材を接
合することを特徴とするレーザ接合方法。1. A brazing material is sandwiched by sandwiching a brazing material on a metal thin plate having a through hole, and irradiating the metal member with laser light from above to braze the brazing material. A laser bonding method, characterized in that the thin metal plate and a metal member are bonded to each other via a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21823692A JPH0645752A (en) | 1992-07-24 | 1992-07-24 | Laser bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21823692A JPH0645752A (en) | 1992-07-24 | 1992-07-24 | Laser bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0645752A true JPH0645752A (en) | 1994-02-18 |
Family
ID=16716736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21823692A Pending JPH0645752A (en) | 1992-07-24 | 1992-07-24 | Laser bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0645752A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2723501A1 (en) * | 1994-08-05 | 1996-02-09 | Info Realite | Reflow soldering method for electronic surface mounted component cards |
| US20170110805A1 (en) * | 2015-10-20 | 2017-04-20 | Japan Aviation Electronics Industry, Ltd. | Fixing structure and fixing method |
-
1992
- 1992-07-24 JP JP21823692A patent/JPH0645752A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2723501A1 (en) * | 1994-08-05 | 1996-02-09 | Info Realite | Reflow soldering method for electronic surface mounted component cards |
| US20170110805A1 (en) * | 2015-10-20 | 2017-04-20 | Japan Aviation Electronics Industry, Ltd. | Fixing structure and fixing method |
| US10193241B2 (en) * | 2015-10-20 | 2019-01-29 | Japan Aviation Electronics Industry, Ltd. | Fixing structure and fixing method |
| US10312603B2 (en) | 2015-10-20 | 2019-06-04 | Japan Aviation Electronics Industry, Ltd. | Fixing structure and fixing method |
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