JPH06448A - Application method for adhesive - Google Patents

Application method for adhesive

Info

Publication number
JPH06448A
JPH06448A JP15630592A JP15630592A JPH06448A JP H06448 A JPH06448 A JP H06448A JP 15630592 A JP15630592 A JP 15630592A JP 15630592 A JP15630592 A JP 15630592A JP H06448 A JPH06448 A JP H06448A
Authority
JP
Japan
Prior art keywords
adhesive
coating
shape
printed base
cobwebbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15630592A
Other languages
Japanese (ja)
Inventor
Akihiko Wachi
昭彦 和智
Seishirou Yanaike
征志郎 梁池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15630592A priority Critical patent/JPH06448A/en
Publication of JPH06448A publication Critical patent/JPH06448A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to detect abnormalities such as excess and shortage of the amt. of coating and cobwebbing of an adhesive by a method wherein a device moving to a specified position on a printed base sheet and coating the adhesive and a camera recognizing the shape of the adhesive and an image treating part are pro vided and an image information of the shape of the adhesive before and after coating of the adhesive is treated to recognize abnormality of the shape. CONSTITUTION:After coating action of an adhesive on a printed base sheet is finished at the step 4, a block number recognizing again the shape of the adhesive on the printed base sheet, a range of allowance to a standard area value and a range of allowance of cobwebbing are determined. In addition, it is determined that recognition and evaluation on every N sheet is performed during manufacturing. At the step 5, when the number of sheets reaches N sheets, the printed base sheets are not carried out, but the shape of coating of the predetermined block is recognized by means of a camera and an image treating part to judge whether the area and the cobwebbing are within the ranges of allowance. If it is acceptable, the printed base sheets are carried out and the next coating action is started, but if it is not good, an alarm lamp is turned on and the facility is stopped and the block of NG and informations on the amt. of excess or shortage and cobwebbing. are displayed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント基板上に置か
れる電子部品を保持するために塗布される接着剤の塗布
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying an adhesive applied to hold an electronic component placed on a printed circuit board.

【0002】[0002]

【従来の技術】近年、プリント基板上に装着される電子
部品を保持するために塗布される接着剤の塗布量・塗布
形状が安定した塗布装置の要求が高まってきている。
2. Description of the Related Art In recent years, there has been an increasing demand for a coating apparatus having a stable coating amount and shape of an adhesive applied to hold an electronic component mounted on a printed circuit board.

【0003】従来、この種の接着剤塗布装置には図2に
示すようなものがあった。以下、その構成について図2
を参照しながら説明する。図に示すように、接着剤1が
入った塗布ノズル2に塗布量を制御するバルブ3を設
け、塗布ノズル2はZ方向(上下)に動作可能で、Q方
向(回転)にも動作し、さらにX方向(左右)に動作す
る本体4に設置されている。前記本体4の下方にはY方
向に移動するテーブル5が設けられ、このテーブル5に
はプリント基板6がセットされ、その板面に接着剤1が
塗布される。前記テーブル5の横には、接着剤1を捨て
打ちするためのテープ7が設けられ、その形状を判断す
るカメラ8が本体4に設置されている構成になってい
る。そして、図3に示すようにコントロール部9により
プリント基板6とテープ7上への接着剤塗布するように
モータ10、11、12、13をそれぞれX、Y、Z、Q方向に
動作するようにドライバー14に指令を出す。テープ7上
への塗布動作後の形状判断を、カメラ8にて得た画像を
画像処理部15にて行い、接着剤の塗布量のコントロール
をバルブ3で行う構成としていた。
Conventionally, this type of adhesive application device has been shown in FIG. The configuration is shown below in FIG.
Will be described with reference to. As shown in the figure, the coating nozzle 2 containing the adhesive 1 is provided with a valve 3 for controlling the coating amount, and the coating nozzle 2 can operate in the Z direction (up and down) and also in the Q direction (rotation). Further, it is installed in the main body 4 which operates in the X direction (left and right). A table 5 which moves in the Y direction is provided below the main body 4, a printed circuit board 6 is set on the table 5, and the adhesive 1 is applied to the plate surface thereof. A tape 7 for discarding the adhesive 1 is provided beside the table 5, and a camera 8 for judging the shape thereof is installed in the main body 4. Then, as shown in FIG. 3, the control unit 9 controls the motors 10, 11, 12, and 13 to operate in the X, Y, Z, and Q directions so as to apply the adhesive on the printed circuit board 6 and the tape 7, respectively. Issue a command to the driver 14. The shape determination after the coating operation on the tape 7 is performed by the image processing unit 15 of the image obtained by the camera 8 and the valve 3 is used to control the application amount of the adhesive.

【0004】次に図4に基づいて動作を説明する。ま
ず、ステップで接着剤1の塗布形状を判断するための
基準面積値Sを設定する。ステップでYテーブル5に
プリント基板6が搬入規正され、ステップでテープ7
上に接着剤1を塗布して、ステップでカメラ8でその
形状を認識した面積をS′として基準面積Sと比較し、
等しければステップ4でプリント基板6上に塗布動作に
移るが、面積が小さい、あるいは大きければ、バルブ3
を制御することで塗布量を増減させ、基準値Sになるま
で塗布・認識を繰り返す。ステップで塗布動作を終了
すると、プリント基板6を搬出させ、次のプリント基板
を搬入させ、以上の動作を繰り返す。
Next, the operation will be described with reference to FIG. First, in step, a reference area value S for determining the application shape of the adhesive 1 is set. The printed circuit board 6 is loaded and regulated on the Y table 5 in step, and the tape 7 is set in step.
The adhesive 1 is applied on the surface, and the area where the shape is recognized by the camera 8 in step S is set as S ′ and compared with the reference area S,
If they are equal, the coating operation on the printed circuit board 6 is started in step 4, but if the area is small or large, the valve 3
The application amount is increased or decreased by controlling the value, and the application / recognition is repeated until the reference value S is reached. When the coating operation is completed in step, the printed board 6 is carried out, the next printed board is carried in, and the above operation is repeated.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記従来
の接着剤塗布方法では、塗布動作が終了すれば、次工程
へプリント基板は流れてしまう。塗布動作中に、接着剤
の形状が変化したり、糸引きが発生しても判断できず、
塗布量過不足による電子部品の欠落、半田付不良が発生
するという問題を有していた。
However, in the above-mentioned conventional adhesive coating method, when the coating operation is completed, the printed circuit board flows to the next step. If the shape of the adhesive changes or stringing occurs during the coating operation, it cannot be determined.
There is a problem that electronic parts are missing and soldering failure occurs due to excess or deficiency of the coating amount.

【0006】本発明は、上記従来の問題を解決するもの
で、接着剤の塗布量過不足、糸引き等の異常を検出する
ことができる接着剤塗布方法を提供することを目的とす
る。
An object of the present invention is to solve the above-mentioned conventional problems, and an object thereof is to provide an adhesive application method capable of detecting an abnormality such as an excess or deficiency of the amount of adhesive applied or stringing.

【0007】[0007]

【課題を解決するための手段】本発明は上記目的を達成
するために、塗布口を有し、プリント基板上の所定の位
置に移動して接着剤を塗布する手段と、カメラと画像処
理部を備え、接着剤塗布前と塗布後の接着剤形状をカメ
ラで認識し、カメラからの画像情報を取り込み処理して
塗布量過不足、糸引き、形状異常を検出する接着剤塗布
方法とする。
In order to achieve the above-mentioned object, the present invention has a coating port, means for moving to a predetermined position on a printed circuit board and coating an adhesive, a camera and an image processing section. The adhesive application method is characterized in that the camera recognizes the adhesive shape before and after the application of the adhesive, and the image information from the camera is processed to detect an excess or deficiency of the applied amount, stringing, and a shape abnormality.

【0008】[0008]

【作用】本発明は上記した方法において、接着剤塗布動
作前後の接着剤形状をカメラ、画像処理部によって認識
して塗布量過不足、糸引き、形状異常を検出し、プリン
ト基板の品質低下となる電子部品欠落、半田付け不良を
防止することとなる。
According to the present invention, in the above-mentioned method, the shape of the adhesive before and after the adhesive application operation is recognized by the camera and the image processing unit to detect an excess or deficiency of the applied amount, string pulling, and an abnormal shape, thereby deteriorating the quality of the printed circuit board. It is possible to prevent missing electronic parts and defective soldering.

【0009】[0009]

【実施例】以下、本発明の一実施例について図1を参照
しながら説明する。なお構成部品は従来例と同一である
ので、その構成図面および説明は省略する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. Since the constituent parts are the same as those of the conventional example, their structural drawings and description will be omitted.

【0010】図1に基づいてその動作を説明する。ステ
ップ〜は従来と同一動作であり、説明は省略する。
ステップで接着剤のプリント基板への塗布動作終了
後、プリント基板上の接着剤形状を再認識するブロック
No、基準面積値Sに対しての許容範囲、糸引きの許容範
囲を決める。また、生産している中でN板ごとに認識評
価を行うことを決める。ステップでN板になったら、
プリント基板を搬出せず、あらかじめ決めておいたブロ
ックの塗布形状を認識して、面積・糸引きが許容範囲内
に入っているか判断する。OKならば、そのプリント基
板が搬出され、次の塗布動作に入る。NGであれば、警
告灯などを点灯させ、設備を停止させて、NGのブロッ
クと過不足量・糸引きの情報を表示する。あとはオペレ
ータが判断し生産を再開させる。
The operation will be described with reference to FIG. The steps 1 to 3 are the same as the conventional operation, and the description thereof is omitted.
Block for re-recognizing the shape of the adhesive on the printed circuit board after the adhesive has been applied to the printed circuit board in step
No, the allowable range for the reference area value S, and the allowable range for stringing are determined. In addition, it is decided to perform recognition evaluation for each N plate during production. When it becomes N plate in step,
Instead of unloading the printed circuit board, recognize the predetermined coating shape of the block and judge whether the area and threading are within the allowable range. If OK, the printed circuit board is unloaded and the next coating operation starts. If it is NG, a warning light or the like is turned on, the equipment is stopped, and information about the NG block and excess / deficiency / threading is displayed. The operator then decides and restarts production.

【0011】[0011]

【発明の効果】以上の実施例から明らかなように、本発
明によれば、塗布手段と、接着剤をプリント基板上に塗
布する前と後で、塗布形状を画像処理するようにしてい
るので、接着剤の塗布量の過不足・糸引きが判断でき、
安定した塗布状態を得て、電子部品の欠落、半田付不良
を未然に防止できる接着剤塗布方法を提供できる。
As is apparent from the above embodiments, according to the present invention, the coating means and the coating shape are subjected to image processing before and after coating the adhesive on the printed circuit board. It is possible to determine whether the amount of adhesive applied is too short or too stringy.
It is possible to provide a method for applying an adhesive that can obtain a stable applied state and prevent electronic parts from being lost or defective in soldering.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例のフローチャートFIG. 1 is a flowchart of an embodiment of the present invention.

【図2】従来の塗布装置の概略構成図FIG. 2 is a schematic configuration diagram of a conventional coating device.

【図3】従来の塗布装置のブロック図FIG. 3 is a block diagram of a conventional coating device.

【図4】従来の塗布装置の動作を示すフローチャートFIG. 4 is a flowchart showing the operation of a conventional coating device.

【符号の説明】[Explanation of symbols]

1 接着剤 2 塗布ノズル 8 カメラ 9 コントロール部 15 画像処理部 1 adhesive 2 coating nozzle 8 camera 9 control unit 15 image processing unit

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 塗布口を有し、基板上の所定位置に移動
して接着剤を塗布する塗布手段と、カメラと、画像処理
部を備え、接着剤塗布前と塗布後の接着剤形状をカメラ
にて検出し、カメラからの画像情報を処理して基板上の
塗布量過不足、糸引、形状異常を判断する接着剤塗布方
法。
1. An application means having an application port, which moves to a predetermined position on a substrate to apply an adhesive, a camera, and an image processing section, and has an adhesive shape before and after application of the adhesive. An adhesive application method that detects an image from a camera and processes image information from the camera to determine whether the amount of application is excessive or insufficient on the substrate, stringing, or abnormal shape.
JP15630592A 1992-06-16 1992-06-16 Application method for adhesive Pending JPH06448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15630592A JPH06448A (en) 1992-06-16 1992-06-16 Application method for adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15630592A JPH06448A (en) 1992-06-16 1992-06-16 Application method for adhesive

Publications (1)

Publication Number Publication Date
JPH06448A true JPH06448A (en) 1994-01-11

Family

ID=15624902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15630592A Pending JPH06448A (en) 1992-06-16 1992-06-16 Application method for adhesive

Country Status (1)

Country Link
JP (1) JPH06448A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0645675A3 (en) * 1990-02-19 1995-08-16 Fuji Photo Film Co Ltd Remote management system for photographic equipment.
US6369161B1 (en) 1994-06-01 2002-04-09 The Dow Chemical Company Thermoplastic elastomeric blends
US6403710B1 (en) 1994-08-29 2002-06-11 The Dow Chemical Company Block copolymer compositions containing substantially inert thermoelastic extenders

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0645675A3 (en) * 1990-02-19 1995-08-16 Fuji Photo Film Co Ltd Remote management system for photographic equipment.
US6369161B1 (en) 1994-06-01 2002-04-09 The Dow Chemical Company Thermoplastic elastomeric blends
US6403710B1 (en) 1994-08-29 2002-06-11 The Dow Chemical Company Block copolymer compositions containing substantially inert thermoelastic extenders

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