JPH0643128B2 - Inkjet head - Google Patents

Inkjet head

Info

Publication number
JPH0643128B2
JPH0643128B2 JP58016900A JP1690083A JPH0643128B2 JP H0643128 B2 JPH0643128 B2 JP H0643128B2 JP 58016900 A JP58016900 A JP 58016900A JP 1690083 A JP1690083 A JP 1690083A JP H0643128 B2 JPH0643128 B2 JP H0643128B2
Authority
JP
Japan
Prior art keywords
layer
liquid
electrode
oxide
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58016900A
Other languages
Japanese (ja)
Other versions
JPS59143650A (en
Inventor
雅実 池田
弘人 松田
博人 高橋
辰美 庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP58016900A priority Critical patent/JPH0643128B2/en
Priority to DE19843403643 priority patent/DE3403643A1/en
Priority to FR8401676A priority patent/FR2540435B1/en
Publication of JPS59143650A publication Critical patent/JPS59143650A/en
Priority to US06/867,890 priority patent/US4694306A/en
Publication of JPH0643128B2 publication Critical patent/JPH0643128B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1604—Production of bubble jet print heads of the edge shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering

Description

【発明の詳細な説明】 本発明は、液体を噴射し、飛翔液滴を形成して記録を行
なうインクジェットヘッドに関する。The present invention relates to an inkjet head that ejects liquid to form flying droplets for recording.

インクジェット記録法（液体噴射記録法）は、記録時に
おける騒音の発生が無視し得る程度に極めて小さいとい
う点高速記録が可能であり、しかも、いわゆる普通紙に
定着という特別な処理を必要とせずに記録の行なえる点
において最近関心を集めている。The ink jet recording method (liquid jet recording method) is capable of high-speed recording in that noise generation during recording is extremely small to a negligible level, and does not require a special process of fixing on so-called plain paper. Recently, it has been attracting attention in terms of recordability.

その中で、例えば特開昭５４−５１８３７号公報、ドイ
ツ公開（ＤＯＬＳ）第２８４３０６４号公報に記載され
てある液体噴射記録法は、熱エネルギーを液体に作用さ
せて、液滴吐出の為の原動力を得るという点において、
他の液体噴射記録法とは、異なる特徴を有している。Among them, the liquid jet recording method described in, for example, Japanese Patent Laid-Open No. 54-51837 and German Patent (DOLS) 2843064, is a driving force for discharging liquid droplets by causing thermal energy to act on the liquid. In terms of
It has different characteristics from other liquid jet recording methods.

即ち、上記の公報に開示されてある記録法は、熱エネル
ギーの作用を受けた液体が急峻な体積の増大を伴う状態
変化を起こし、該状態変化に基づく作用応力によって、
記録ヘッド部先端のオリフィスより液体が吐出されて、
飛翔的液滴が形成され、該液滴が被記録部材に付着し記
録が行なわれるという特徴である。That is, in the recording method disclosed in the above publication, the liquid subjected to the action of thermal energy undergoes a state change accompanied by a sharp increase in volume, and the action stress based on the state change causes
Liquid is ejected from the orifice at the tip of the recording head,
The feature is that flying droplets are formed and the droplets adhere to the recording member to perform recording.

殊に、ＤＯＬＳ ２８４３０６４号公報に開示されてい
る液体噴射記録法は、いわゆるドロップ・オン・デマン
ド記録法に極めて有効に適用されるばかりでなく、記録
ヘッド部をフルラインタイプで高密度マルチオリフィス
化された記録ヘッドが容易に具現化出来るので、高解像
度、高品質の画像を高速で得られるという特徴を有して
いる。In particular, the liquid jet recording method disclosed in DOLS 2843064 is not only very effectively applied to the so-called drop-on-demand recording method, but the recording head portion is a full line type and has a high density multi-orifice. Since the recorded head can be easily embodied, it has a feature that an image with high resolution and high quality can be obtained at high speed.

上記の記録法に適用される装置の記録ヘッド部は、液体
を吐出する為に設けられたオリフィスと、該オリフィス
に連通し、液滴を吐出する為の熱エネルギーが液体に作
用する部分である熱作用部を構成の一部とする液流路と
を有する液吐出部と、熱エネルギーを発生する手段とし
ての電気熱変換体とを具備している。The recording head portion of the apparatus applied to the above-described recording method is an orifice provided for ejecting a liquid, and a portion communicating with the orifice so that thermal energy for ejecting a droplet acts on the liquid. It is provided with a liquid discharge part having a liquid flow path having a heat acting part as a part of its configuration, and an electrothermal converter as means for generating heat energy.

そして、この電気熱変換体は、一対の電極と、これ等の
電極に接続し、これ等の電極の間に発熱する領域（熱発
生部）を有する発熱抵抗層とを具備している。The electrothermal converter includes a pair of electrodes, and a heating resistance layer that is connected to these electrodes and has a region (heat generating portion) that generates heat between these electrodes.

この様なインクジェットヘッドの構造を示す典型的な例
が第１図（ａ）、及び第１図（ｂ）に示される。Typical examples showing the structure of such an inkjet head are shown in FIGS. 1 (a) and 1 (b).

第１図（ａ）は、本発明に係わるインクジェットヘッド
のオリフィス側から見た正面部分図、第１図（ｂ）は、
第１図（ａ）に一点鎖線ＸＹで示す部分で切断した場合
の切断面部分図である。図に示される記録ヘッド１０１
は、その表面に電気熱変換体１０２が設けられている基
板１０３の表面に、所定の線密度で所定の巾と深さの溝
が所定数設けられている溝付板１０４で覆う様に接合す
ることによって、オリフィス１０５と液吐出部１０６が
形成された構造を有している。図に示す記録ヘッドの場
合、オリフィス１０５を複数有するものとして示されて
いるが、勿論本発明においては、これに限定されるもの
ではなく単一オリフィスの場合の記録ヘッドも本発明の
範疇に入るものである。FIG. 1 (a) is a front partial view of the inkjet head according to the present invention as seen from the orifice side, and FIG. 1 (b) is
FIG. 1A is a partial sectional view of a section taken along a dashed line XY in FIG. Recording head 101 shown in the figure
Is bonded to the surface of the substrate 103, on the surface of which the electrothermal converter 102 is provided, so as to be covered with a grooved plate 104 provided with a predetermined number of grooves having a predetermined linear density and a predetermined width and depth. As a result, the orifice 105 and the liquid discharger 106 are formed. In the case of the recording head shown in the figure, it is shown as having a plurality of orifices 105, but of course, the present invention is not limited to this, and a recording head with a single orifice also falls within the scope of the present invention. It is a thing.

液吐出部１０６は、その終端に液体を吐出させる為のオ
リフィス１０５と、電気熱変換体１０２より発生される
熱エネルギーが液体に作用して気泡を発生し、その体積
の膨張と収縮による急激な状態変化を引起こすところで
ある熱作用部１０７とを有する。熱作用部１０７は、電
気熱変換体１０２の熱発生部１０８の上部に位置し、熱
発生部１０８の液体と接触する面としての熱作用面１０
９をその底面としている。The liquid ejecting portion 106 has an orifice 105 for ejecting the liquid at the end thereof, and thermal energy generated from the electrothermal converter 102 acts on the liquid to generate bubbles, and the volume thereof expands and contracts rapidly. It has a heat acting portion 107 which is a place where a state change is caused. The heat acting portion 107 is located above the heat generating portion 108 of the electrothermal converter 102, and the heat acting surface 10 is a surface of the heat generating portion 108 that comes into contact with the liquid.
9 is the bottom surface.

熱発生部１０８は、基板１０３上に設けられた下部層１
１０、該下部層１１０上に設けられた発熱抵抗層１１
１、該発熱抵抗層１１１上に設けられた上部層１１２と
で構成される。発熱抵抗層１１１には、熱を発生させる
為に該層１１１に通電する為の電極１１３、１１４がそ
の表面に設けられてある。電極１１３は、各液吐出部の
熱発生部に共通の電極であり、電極１１４は、各液吐出
部の熱発生部を選択して発熱させる為の選択電極であっ
て、液吐出部の流通路に沿って設けられてある。The heat generating portion 108 is the lower layer 1 provided on the substrate 103.
10, heating resistance layer 11 provided on the lower layer 110
1 and an upper layer 112 provided on the heating resistance layer 111. The heating resistance layer 111 is provided with electrodes 113 and 114 on its surface for supplying electricity to the layer 111 to generate heat. The electrode 113 is an electrode common to the heat generating portion of each liquid ejecting portion, and the electrode 114 is a selection electrode for selecting the heat generating portion of each liquid ejecting portion to generate heat. It is located along the road.

上部層１１２は、熱発生部１０８に於いては発熱抵抗層
１１を、使用する液体から化学的・物理的に保護する為
に発熱抵抗層１１１と液吐出部１０６の液流路を満たし
ている液体とを隔離すると共に、液体を通じて電極１１
３、１１４間が短絡するのを防止する、発熱抵抗層１１
１の保護的機能を有している。The upper layer 112 fills the heat generation resistance layer 111 and the liquid flow path of the liquid ejection unit 106 in order to chemically and physically protect the heat generation resistance layer 11 in the heat generation unit 108 from the liquid used. The electrode 11 separates from the liquid and passes through the liquid.
A heating resistance layer 11 for preventing a short circuit between 3 and 114
It has one protective function.

又、上部層１１２は、隣接する電極間に於ける電気的リ
ークを防止する役目を荷っている。The upper layer 112 also serves to prevent electrical leakage between adjacent electrodes.

殊に、各選択電極間に於ける電気的リークの防止、或は
各液流路下にある電極が何等かの理由で電極と液体とが
接触し、これに通電することによって起る電蝕の防止
は、重要であって、この為にこの様な保護層的機能を有
する上部層１１２が少なくとも液流路下に於ける電極上
に設けられている。更に、各液吐出部に設けられてある
液流路は、各液吐出部の上流に於いて、液流路の一部を
構成する共通液室を介して連通されているが、各液吐出
部に設けられた電気熱変換体に接続されている電極は、
その設計上の都合により、熱作用部の上流側に於いて前
記共通液室下を通る様に設けられている。In particular, prevention of electrical leakage between selected electrodes, or electrode corrosion caused by contact between electrodes and liquid due to some reason that the electrodes under each liquid flow path are energized Is important, and for this reason, the upper layer 112 having such a protective layer function is provided at least on the electrode below the liquid flow path. Further, the liquid flow paths provided in the respective liquid discharge parts are communicated with each other through a common liquid chamber which constitutes a part of the liquid flow paths upstream of the respective liquid discharge parts. The electrode connected to the electrothermal converter provided in the section,
For the convenience of its design, it is provided so as to pass under the common liquid chamber on the upstream side of the heat acting portion.

従って、この部分に於いても電極が液体と接触するのを
防止すべく前記した上部層が設けられているのが一般的
である。Therefore, even in this portion, the above-mentioned upper layer is generally provided in order to prevent the electrode from coming into contact with the liquid.

ところで上記の上部層１１２は、設けられる場所に依っ
て要求される特性が各々異なる。By the way, the above-mentioned upper layer 112 has different required characteristics depending on the place where it is provided.

即ち、例えば熱発生部１０８に於いては、耐熱性、
耐液性、液浸透防止性、熱伝導性、酸化防止性及
び耐破傷性に優れていることが要求され、熱発生部１
０８以外の領域に於いては熱的条件で緩和されるが液浸
透防止性、耐液性及び耐破傷性には充分優れていること
が要求される。That is, for example, in the heat generating portion 108, heat resistance,
It is required to have excellent liquid resistance, liquid permeation prevention, thermal conductivity, oxidation resistance, and puncture resistance.
In regions other than 08, it is relaxed under thermal conditions, but it is required that the liquid permeation preventive property, liquid resistance and puncture resistance are sufficiently excellent.

ところが、上記の〜の特性の総てを所望通りに充分
満足する上部層を構成する材料は、今のところなく〜
の特性を幾つかを緩和して使用しているのが現状であ
る。However, there has been no material for the upper layer which satisfies all of the above-mentioned characteristics sufficiently as desired.
It is the current situation that some of the characteristics of are used.

即ち、熱発生部１０８に於いては、，及びに優先
が置かれて材料の選択が成され、他方熱発生部１０８以
外の例えば電極部に於いては、，及びに優先が置
かれて材料の選択が成されて、夫々の該当する領域面上
に各相当する材料を以って上部層が形成されている。That is, in the heat generating portion 108, the materials are selected by giving priority to and, and in the electrode portion other than the heat generating portion 108, the material is given priority by ,, and. Is made to form an upper layer with each corresponding material on each corresponding area surface.

他方、これ等とは別に、マルチオリフィス化タイプのイ
ンクジェットヘッドの場合には、基板上に多数の微細な
電気熱変換体を同時に形成する為に、製造過程に於い
て、基板上では各層の形成と、形成された層の一部除去
の繰返しが成され、上部層が形成される段階では、上部
層の形成されるその表面はスラップウエッヂ部（段差
部）のある微細な凹凸状となっているので、この段差部
に於ける上部層の被覆性（ステップカバレージ性）が重
要となっている。On the other hand, in addition to these, in the case of a multi-orifice type inkjet head, in order to simultaneously form a large number of fine electrothermal transducers on a substrate, in the manufacturing process, each layer is formed on the substrate. When the upper layer is formed by repeating the partial removal of the formed layer, the surface on which the upper layer is formed becomes a fine uneven shape with a slap wedge portion (step portion). Therefore, the coverage (step coverage) of the upper layer at the step is important.

つまり、この段差部の被覆性が悪いと、その部分での液
体の浸透が起り、電蝕或は電気的絶縁破壊を起す誘引と
なる。That is, if the step portion has poor coverage, the liquid permeates into the step portion, which causes an electric corrosion or an electric breakdown.

又、形成される上部層がその製造法上に於いて欠陥部の
生じる確率が少なくない場合には、その欠陥部を通じ
て、液体の浸透が起り、電気熱変換体の寿命を著しく低
下させる要因となっている。In addition, if the probability that the upper layer to be formed has a defective portion in the manufacturing method is not small, the penetration of the liquid through the defective portion may cause a significant decrease in the life of the electrothermal converter. Has become.

これ等の為に、上部層は、段差部に於ける被覆性が良好
であること、形成される層にピンホール等の欠陥の発生
する確率が低く、発生しても実用上無視し得る程度或は
それ以上に少ないことが要求される。For these reasons, the upper layer has good coverage at the stepped portion, the probability that defects such as pinholes will occur in the formed layer is low, and even if it occurs, it can be practically ignored. Or even less than that is required.

しかしながら、従来に於いては、これ等の要求の総てを
満足し、総合的な使用耐久性に優れたインクジェットヘ
ッドは提案されてない。However, hitherto, an ink jet head satisfying all of these requirements and excellent in overall use durability has not been proposed.

本発明は上記の諸点に鑑み成されたものであって、頻繁
なる繰返し使用や長時間の連続使用に於いて総合的な耐
久性に優れ、初期の良好な液滴形成特性を長期に亘って
安定的に維持し得るインクジェットヘッドを提供するこ
とを主たる目的とする。The present invention has been made in view of the above points, has excellent overall durability in frequent repeated use and continuous use for a long time, and has good initial droplet formation characteristics over a long period of time. The main object is to provide an inkjet head that can be stably maintained.

又、本発明の別の目的は、製造加工上に於ける信頼性の
高いインクジェットヘッドを提供することでもある。Another object of the present invention is also to provide an inkjet head having high reliability in manufacturing and processing.

更には、マルチオリフィス化した場合にも製造歩留りの
高いインクジェットヘッドを提供することでもある。Furthermore, it is also to provide an inkjet head having a high manufacturing yield even when a multi-orifice is used.

本発明のインクジェットヘッドは、インクを吐出するオ
リフィスに連通するインク路と、 該インク路に対応して設けられ、発熱抵抗層と該発熱抵
抗層に電気的に接続する電極とを有する電気熱変換体
と、 を具備するインクジェットヘッドにおいて、 前記電極を陽極酸化させることにより形成される絶縁保
護層を有することを特徴とするインクジェットヘッド
（以下、液体噴射記録ヘッドともいう）である。The ink jet head of the present invention includes an ink passage communicating with an orifice for ejecting ink, and an electrothermal conversion device having a heating resistance layer and an electrode electrically connected to the heating resistance layer, the electrode being provided corresponding to the ink path. An inkjet head comprising a body and an insulating protective layer formed by anodizing the electrode (hereinafter, also referred to as a liquid jet recording head).

以下、図面に従って本発明を具体的に説明する。Hereinafter, the present invention will be specifically described with reference to the drawings.

第２図（ａ）には、本発明の液体噴射記録ヘッドの好適
な実施態様例２００の構造の主要部を説明する為のオリ
フィス側から見た正面部分図が、第２図（ｂ）には、第
２図（ａ）に一点鎖線ＡＡ′で示した部分で切断した場
合の切断面部分図が示されており、第２図（ａ）は、第
１図（ａ）に相当し、第２図（ｂ）は第１図（ｂ）に相
当するものである。FIG. 2 (a) is a front partial view as seen from the orifice side for explaining the main part of the structure of a preferred embodiment example 200 of the liquid jet recording head of the present invention, and FIG. Shows a partial sectional view of a section taken along the chain line AA 'in FIG. 2 (a), and FIG. 2 (a) corresponds to FIG. 1 (a). FIG. 2 (b) corresponds to FIG. 1 (b).

図に示された液体噴射記録ヘッド２００は、所望数の電
気熱変換体２０１が設けられた熱を液吐出に利用する液
体噴射記録（サーマルインクジェット：Ｔ／Ｊと略記す
る）用の基板２０２と、前記電気熱変換体２０１に対応
して設けられた溝を所望数有する溝付板２０３とでその
主要部が構成されている。A liquid jet recording head 200 shown in the drawing is provided with a substrate 202 for liquid jet recording (thermal ink jet: abbreviated as T / J) that utilizes heat for liquid discharge provided with a desired number of electrothermal converters 201. The main part is constituted by a grooved plate 203 having a desired number of grooves provided corresponding to the electrothermal converter 201.

Ｔ／Ｊ基板２０２と溝付板２０３とは、所定個所で接着
剤等で接合されることでＴ／Ｊ基板２０２の電気熱変換
体２０１の設けられている部分と、溝付板２０３の溝の
部分とによってインク路（以下、液流路という）２０４
を形成しており、該液流路２０４は、その構成の一部に
熱作用部２０５を有する。The T / J substrate 202 and the grooved plate 203 are joined to each other at a predetermined position with an adhesive or the like so that a portion of the T / J substrate 202 where the electrothermal converter 201 is provided and the groove of the grooved plate 203. And the ink path (hereinafter, referred to as a liquid flow path) 204
The liquid flow path 204 has a heat acting portion 205 in a part of its configuration.

Ｔ／Ｊ基板２０２は、シリコン、ガラス、セラミックス
等で構成されている支持体２０６、該支持体２０６上に
ＳｉＯ２等で構成される下部層２０７、発熱抵抗層２０
８、発熱抵抗層２０８の表面の両側には、液流路２０４
に沿って電極２０９，２１０、及び発熱抵抗層２０８の
電極で被覆されていない部分と、電極２０９，２１０の
部分とを覆う様に無機質材料等で構成された保護層（上
部層）２１１とを具備している。The T / J substrate 202 is a support body 206 made of silicon, glass, ceramics or the like, a lower layer 207 made of SiO 2 or the like on the support body 206, and a heating resistance layer 20.
8. The liquid flow path 204 is formed on both sides of the surface of the heat generation resistance layer 208.
A protective layer (upper layer) 211 made of an inorganic material or the like is provided so as to cover the electrodes 209 and 210 and the portion of the heating resistance layer 208 not covered by the electrodes and the portions of the electrodes 209 and 210 along It has.

電気熱変換体２０１は、その主要部として熱発生部２１
２を有し、熱発生部２１２は支持体２０６上に支持体２
０６側より順次下部層２０７、発熱抵抗層２０８、上部
層２１１とが積層されて構成されており、上部層２１１
の表面（熱作用面）２１３は、液流路２０４中を満たす
液体と直に接触している。The electrothermal converter 201 has a heat generating part 21 as its main part.
2 and the heat generating part 212 is provided on the support 206.
The lower layer 207, the heating resistance layer 208, and the upper layer 211 are laminated in this order from the 06 side, and the upper layer 211
The surface (heat-acting surface) 213 of is directly in contact with the liquid filling the liquid flow path 204.

第２図（ｂ）に示す液体噴射記録ヘッド２００の場合に
は、上部層２１１は、該層２１１の機械的な強度を一層
高める為に、層２１６，層２１７の二重層構造とされて
いて、層２１６は、例えばＳｉＯ２等の無機酸化物やＳ
ｉ３Ｎ４等の無機窒化物等の比較的電気絶縁性、熱伝導
性、及び耐熱性に優れた無機質材料で構成され、層２１
７は粘りがあって、比較的機械的強度に優れ層２１６に
対して密着性のある、例えば層２１６がＳｉＯ２で形成
されている場合にはＴａ等の金属材料で構成される。In the case of the liquid jet recording head 200 shown in FIG. 2B, the upper layer 211 has a double layer structure of layers 216 and 217 in order to further increase the mechanical strength of the layer 211. The layer 216 is made of, for example, an inorganic oxide such as SiO 2 or S.
The layer 21 is made of an inorganic material such as inorganic nitride such as i 3 N 4 which is relatively excellent in electrical insulation, thermal conductivity, and heat resistance.
7 is composed of a metal material such as Ta which has a viscosity and is relatively excellent in mechanical strength and has an adhesiveness to the layer 216, for example, when the layer 216 is formed of SiO 2 .

この様に上部層２１１の表面層を金属等の比較的粘りが
あって機械的強度のある無機質材料で構成することによ
って、熱作用面２１３に於いて、液体吐出の際に生ずる
キャビテーション作用からのショックを充分吸収するこ
とが出来、電気熱変換体２０１の寿命を格段に延ばす効
果がある。しかしながら、上部層２１１の表面層として
設けられる層２１７は、本発明に於いては、必ずしも要
するものではない。As described above, the surface layer of the upper layer 211 is made of an inorganic material such as a metal having a comparatively tenacity and a mechanical strength, so that the heat acting surface 213 is protected from the cavitation effect generated when the liquid is ejected. The shock can be sufficiently absorbed, and the life of the electrothermal converter 201 can be significantly extended. However, the layer 217 provided as the surface layer of the upper layer 211 is not always required in the present invention.

本発明は電極２０９および２１０の表面に無機絶縁材料
化された保護層２１４を、電極表面を変質させることに
よって設けるものであるが、第３図に示すように、電極
だけでなく、発熱抵抗層も含めて、電気熱変換体の表面
を変質させることによって設けることもできる。該保護
層２１４は不図示ではあるが電極２１０の延長上の、液
流路２０４の上流に設けられる共通液室の底面部分にも
少なくとも設けられる。In the present invention, the protective layer 214 made of an inorganic insulating material is provided on the surfaces of the electrodes 209 and 210 by modifying the surface of the electrodes. However, as shown in FIG. Including the above, it can be provided by modifying the surface of the electrothermal converter. Although not shown, the protective layer 214 is also provided at least on the bottom portion of the common liquid chamber provided upstream of the liquid flow path 204 on the extension of the electrode 210.

保護層２１４は電極部の表面、もしくは電極部と発熱抵
抗層の表面に設けられ、その主なる役目は、液浸透防止
と耐液作用にある。そしてさらには、共通液室より後方
の電極配線部をも被覆する様に設けることによって、電
極配線部を製造工程中に起こる電極配線部のキズの発
生、断線の発生等を防止することが出来る。The protective layer 214 is provided on the surface of the electrode portion or on the surface of the electrode portion and the heat generating resistance layer, and its main functions are to prevent liquid penetration and liquid resistance. Furthermore, by providing the electrode wiring portion behind the common liquid chamber so as to cover the electrode wiring portion, it is possible to prevent the electrode wiring portion from being damaged or broken, which may occur during the manufacturing process. .

保護層２１４は上記の役目を果すことが出来るような無
機絶縁材料で構成されるが、更に該保護層は （１）成膜性が良いこと。The protective layer 214 is made of an inorganic insulating material capable of fulfilling the above-mentioned role, and further, the protective layer (1) has a good film forming property.

（２）緻密な構造でかつピンホールやクラックがないこ
と。(2) It has a precise structure and has no pinholes or cracks.

（３）使用インクに対して変質、溶解しないこと。(3) Do not deteriorate or dissolve the ink used.

（４）成膜したときの絶縁性がよいこと。(4) Good insulation when formed.

（５）耐熱性が高いこと。(5) High heat resistance.

等の物性を具備していることが望ましい。その様な無機
絶縁材料として例えば、Ａｌ，Ｔａ，Ｔｉ，Ｚｒ，Ｈ
ｆ，Ｖ，Ｎｂ，Ｍｇ，Ｓｉ，Ｍｏ，Ｗ，Ｙ，Ｌａ等の金
属およびそれら合金の酸化物、炭化物、窒化物、硼化物
等が挙げられ、電極部表面に緻密でクラックやピンホー
ル等を生じないような無機絶縁材料層が形成されるもの
であれば良い。It is desirable to have physical properties such as. As such an inorganic insulating material, for example, Al, Ta, Ti, Zr, H
Examples include oxides, carbides, nitrides, borides, etc. of metals such as f, V, Nb, Mg, Si, Mo, W, Y, La, and their alloys. Dense cracks, pinholes, etc. on the electrode surface What is necessary is just to form an inorganic insulating material layer that does not cause

保護層２１４を電極部の表面に設ける方法として好まし
い方法は後述の実施例に示すように、電極部の表面を陽
極酸化することによって電極の表面に酸化物の被膜層を
形成させることである。この方法で形成された金属の酸
化物層は保護層として要求される上述の物性を満足する
理想的な被覆層を与える。酸化物層の形成は、電極表面
の空気又は酸素中での加熱酸化や酸化剤による化学的酸
化によって行なってもよい。又表面の変質は酸化による
酸化物層の形成に限らず、窒化、硼化、炭化等による窒
化物、硼化物、炭化物層の形成であってもよい。A preferred method for providing the protective layer 214 on the surface of the electrode portion is to form an oxide film layer on the surface of the electrode by anodizing the surface of the electrode portion, as shown in the examples below. The metal oxide layer formed by this method provides an ideal coating layer satisfying the above-mentioned physical properties required as a protective layer. The oxide layer may be formed by thermal oxidation of the electrode surface in air or oxygen or chemical oxidation with an oxidizing agent. Further, the alteration of the surface is not limited to the formation of the oxide layer by oxidation, but may be the formation of a nitride, boride, or carbide layer by nitriding, boration, carbonization, or the like.

上部層２１１を構成する材料としては、上記した無機質
材料の他に酸化チタン、酸化バナジウム、酸化ニオブ、
酸化モリブデン、酸化タンタル、酸化タングステン、酸
化クロム、酸化ジルコニウム、酸化ハフニウム、酸化ラ
ンタン、酸化イットリウム、酸化マンガン等の遷移金属
酸化物、更に酸化アルミニウム、酸化カルシウム、酸化
ストロンチウム、酸化バリウム、酸化シリコン、等の金
属酸化物及びそれらの複合体、窒化シリコン、窒化アル
ミニウム、窒化ボロン、窒化タンタル等高抵抗窒化物及
びこれら酸化物、窒化物の複合体、更にアモルファスシ
リコン、アモルファスセレン等の半導体などバルクでは
低抵抗であってもスパッタリング法、ＣＶＤ法、蒸着
法、気相反応法、液体コーティング法等の製造過程で高
抵抗化し得る薄膜材料を挙げることが出来、その層厚と
しては一般に０．１μｍ〜５μｍ、好ましくは０．２μ
ｍ〜３μｍとされるのが望ましい。As the material forming the upper layer 211, in addition to the above-mentioned inorganic materials, titanium oxide, vanadium oxide, niobium oxide,
Transition metal oxides such as molybdenum oxide, tantalum oxide, tungsten oxide, chromium oxide, zirconium oxide, hafnium oxide, lanthanum oxide, yttrium oxide, and manganese oxide, as well as aluminum oxide, calcium oxide, strontium oxide, barium oxide, silicon oxide, etc. Metal oxides and their composites, silicon nitride, aluminum nitride, boron nitride, tantalum nitride and other high resistance nitrides and composites of these oxides and nitrides, as well as semiconductors such as amorphous silicon and amorphous selenium. As for the resistance, a thin film material that can have a high resistance in the manufacturing process such as a sputtering method, a CVD method, a vapor deposition method, a gas phase reaction method, a liquid coating method, etc. can be mentioned, and its layer thickness is generally 0.1 μm to 5 μm. , Preferably 0.2μ
It is desirable to be set to m to 3 μm.

第２図（ａ）及び（ｂ）に示した実施態様の場合は、保
護層２１４と上部層２１１とが共に設けられているが、
本発明においては上部層２１１は必ずしも積層されてい
る必要はなく、電極の表面に形成された保護層２１４に
よって電極が液体から保護されていれば前述した本発明
の目的・効果を達成することが出来る。In the case of the embodiment shown in FIGS. 2A and 2B, the protective layer 214 and the upper layer 211 are both provided,
In the present invention, the upper layer 211 does not necessarily have to be laminated, and if the electrode is protected from the liquid by the protective layer 214 formed on the surface of the electrode, the above-described objects and effects of the present invention can be achieved. I can.

第２図（ａ）及び（ｂ）に示した実施態様は本発明の好
ましい実施態様であって、上部層と保護層との組合せで
構成される被覆層は、後記する他の部分の諸構成と相俟
って、総合的な使用耐久性にすぐれ、製造加工上に於け
る信頼性の高い、且マルチオリフィス化した場合にも製
造歩留りの高い液体噴射記録ヘッドを提供することが出
来る。The embodiment shown in FIGS. 2 (a) and 2 (b) is a preferred embodiment of the present invention, in which the coating layer formed by the combination of the upper layer and the protective layer is the structure of other portions described later. Combined with this, it is possible to provide a liquid jet recording head which has excellent durability in use in general, is highly reliable in the manufacturing process, and has a high manufacturing yield even when a multi-orifice is used.

下部層２０７は、主に熱発生部２１２より発生する熱の
支持体２０６側への流れを制御する層として設けられる
もので、熱作用部２０５に於いて液体に熱エネルギーを
作用させる場合には、熱発生部２１２より発生する熱が
熱作用部２０５側により多く流れるようにし、電気熱変
換体２０１への通電がＯＦＦされた際には、熱発生部２
１２に残存している熱が、支持体２０６側に速やかに流
れる様に構成材料の選択と、その層厚の設計が成され
る。下部層２０７を構成する材料としては、先に挙げた
ＳｉＯ２の他に酸化ジルコニウム、酸化タンタル、酸化
マグネシウム、酸化アルミニウム等の金属酸化物に代表
される無機質材料が挙げられる。The lower layer 207 is provided as a layer that mainly controls the flow of heat generated by the heat generating section 212 toward the support 206 side. When the heat acting section 205 applies heat energy to the liquid, The heat generated by the heat generating section 212 is made to flow more to the heat acting section 205 side, and when the electricity to the electrothermal converter 201 is turned off, the heat generating section 2 is generated.
The constituent materials are selected and the layer thickness is designed so that the heat remaining in 12 quickly flows to the support 206 side. Examples of the material forming the lower layer 207 include inorganic materials typified by metal oxides such as zirconium oxide, tantalum oxide, magnesium oxide, and aluminum oxide, in addition to the above-described SiO 2 .

発熱抵抗層２０８を構成する材料は、通電されることに
よって、所望通りの熱が発生するものであれば大概のも
のが採用され得る。As the material forming the heating resistance layer 208, almost any material can be adopted as long as it can generate desired heat when energized.

その様な材料としては、具体的には例えば窒化タンタ
ル、ニクロム、銀−パラジウム合金、シリコン半導体、
或は、ハフニウム、ランタン、ジルコニウム、チタン、
タンタル、タングステン、モリブデン、ニオブ、クロ
ム、バナジウム等の金属の硼化物等が好ましいものとし
て挙げられる。Specific examples of such a material include tantalum nitride, nichrome, silver-palladium alloy, silicon semiconductor,
Or hafnium, lanthanum, zirconium, titanium,
Preferred examples include borides of metals such as tantalum, tungsten, molybdenum, niobium, chromium and vanadium.

これ等の発熱抵抗層２０８を構成する材料の中、殊に金
属硼化物が優れたものとして挙げることが出来、その中
でも最も特性の優れているのが硼化ハフニウムであり、
次いで硼化ジルコニウム、硼化ランタン、硼化タンタ
ル、硼化バナジウム、硼化ニオブの順となっている。Among these materials constituting the heating resistance layer 208, metal borides can be mentioned as particularly excellent ones, and hafnium boride has the best characteristic among them.
Next is zirconium boride, lanthanum boride, tantalum boride, vanadium boride, and niobium boride.

発熱抵抗層２０８は、上記した材料を使用して、電子ビ
ーム蒸着やスパッターリング等の手法を用いて形成する
ことが出来る。The heat generating resistance layer 208 can be formed by using the above-mentioned materials by a method such as electron beam evaporation or sputtering.

電極２０９及び２１０を構成する材料としては、その表
面に稠密でピンホールのない無機絶縁材料層を形成する
ことが可能な導電材料、例えば、Ａｌ，Ｔａ，Ｔｉ，Ｍ
ｇ，Ｈｆ，Ｚｒ，Ｖ，Ｗ，Ｍｏ，Ｎｂ，Ｓｉ，等及びそ
れらの合金が挙げられ、これらを使用して、蒸着等の手
法で所定位置に、所定の大きさ、形状厚さで設けられ
る。As a material for forming the electrodes 209 and 210, a conductive material capable of forming a dense and pinhole-free inorganic insulating material layer on the surface thereof, for example, Al, Ta, Ti, M
g, Hf, Zr, V, W, Mo, Nb, Si, etc. and alloys thereof are used, and these are used to provide a predetermined position and a predetermined thickness by a technique such as vapor deposition. To be

溝付板２０３及び熱作用部２０５の上流側に設けられる
共通液室構成部材を構成する材料としては、記録ヘッド
の工作時の、或は使用時の環境下に於いて形状に熱的影
響を受けないか或は殆ど受けないものであって微細精密
加工が容易に適用され得ると共に面精度が所望通りに容
易に出、更には、それ等によって形成される流路中を液
体がスムーズに流れ得る様に加工し得るものであれば、
大概のものが有効である。As a material forming the common liquid chamber constituent member provided on the upstream side of the grooved plate 203 and the heat acting portion 205, there is a thermal influence on the shape under the environment of the recording head during its working or during its use. It does not receive or hardly receives it, and fine precision processing can be easily applied, surface accuracy can be easily obtained as desired, and liquid flows smoothly in the flow path formed by them. If it can be processed to obtain,
Most of them are effective.

第２図（ｃ）は、第２図（ｂ）に示す一点鎖線ＢＢ′で
切断した場合の切断面部分図である。FIG. 2 (c) is a partial cross-sectional view taken along the alternate long and short dash line BB 'shown in FIG. 2 (b).

第２図に示した液体噴射記録ヘッド２００は、第２図
（ｄ）に示す様に保護層２１４は、液流路２０４の熱作
用面２１３に接して設けられているが、変形例として熱
作用面２１３から離して保護層２１４を設けても左程差
し支えないものである。In the liquid jet recording head 200 shown in FIG. 2, the protective layer 214 is provided in contact with the heat acting surface 213 of the liquid flow path 204 as shown in FIG. It does not matter if the protective layer 214 is provided apart from the working surface 213 to the left.

以下、本発明を実施例に従って説明する。Hereinafter, the present invention will be described according to examples.

〈実施例〉 Ｓｉウエハを熱酸化により５μｍ厚のＳｉＯ２膜を形成
し基板とした。基板にスパッタにより発熱抵抗層として
ＨｆＢ２を１５００Åの厚みに形成し、続いて電子ビー
ム蒸着によりＴｉ層５０Å、Ａ１層１００００Åを連続
的に堆積した。Example An Si wafer was thermally oxidized to form a 5 μm thick SiO 2 film, which was used as a substrate. HfB 2 having a thickness of 1500Å was formed as a heat generating resistance layer on the substrate by sputtering, and subsequently, a Ti layer 50Å and an A1 layer 10000Å were successively deposited by electron beam evaporation.

フォトリソ工程により第２図（ｄ）の如きパターンを形
成、熱作用面のサイズは３０μｍ幅、１５０μｍ長でＡ
１電極の抵抗を含めて１５０オームであった。A pattern as shown in FIG. 2 (d) is formed by the photolithography process, and the size of the heat acting surface is 30 μm wide and 150 μm long.
It was 150 ohms including the resistance of one electrode.

次にＡ１電極部のみをボンディング取出し部を除いて５
０００Å陽極酸化した。Next, only the A1 electrode part, excluding the bonding extraction part,
000Å Anodized.

以下にＡ１電極部の陽極酸化工程を示す。The anodic oxidation process of the A1 electrode part will be described below.

発熱抵抗層及び電極が所定のパターンに形成された支持
体を洗浄、乾燥後、ホトレジストＯＭＲ−８３（東京応
化製）をスピンナーで塗布し、乾燥後マスクアライナー
を用いて露光し、現像処理を行ない所望の陽極酸化用パ
ターンを得た。The support on which the heating resistance layer and the electrodes are formed in a predetermined pattern is washed and dried, and then photoresist OMR-83 (manufactured by Tokyo Ohka Co., Ltd.) is applied by a spinner. A desired pattern for anodic oxidation was obtained.

次に、１０％Ｈ３ＰＯ４溶液を用い、浴温１０℃で、電
流密度５ｍＡ／ｃｍ2、対電極をＰｔとして、５分間陽
極酸化した。（陽極酸化中は試料は固定し、電解浴は充
分スターラーにより撹拌を行った。）水洗、乾燥後ＯＭ
Ｒ用剥離液でホトレジストを剥離した後、充分洗浄、乾
燥し、上面と側面への酸化層の形成工程を終えた。Next, using a 10% H 3 PO 4 solution, the bath temperature was 10 ° C., the current density was 5 mA / cm 2 , the counter electrode was Pt, and anodization was performed for 5 minutes. (During anodic oxidation, the sample was fixed and the electrolytic bath was sufficiently stirred with a stirrer.) OM after washing with water and drying
After the photoresist was stripped with the R stripping solution, the photoresist was thoroughly washed and dried to complete the step of forming an oxide layer on the upper and side surfaces.

陽極酸化層の形成に続いてＳｉＯ２スパッタ層を、ハイ
レースパッタにより２．２μｍ堆積させ、更にＴａの
０．５μｍスパッタによりＴａ層を堆積した。Subsequent to the formation of the anodized layer, a SiO 2 sputtered layer was deposited by Hiray sputtering to a thickness of 2.2 μm, and a Ta layer was further deposited by 0.5 μm sputtering of Ta.

このＴ／Ｊ基板上に溝付ガラス板を所定通りに接着し
た。即ち、第２図（ｂ）に示してあるのと同様にＴ／Ｊ
基板にインク導入流路と熱作用部を形成する為の溝付ガ
ラス板（５０μｍ×５０μｍ長さ２ｍｍ）が接着されて
いる。A grooved glass plate was adhered on the T / J substrate in a predetermined manner. That is, T / J is the same as that shown in FIG.
A glass plate with a groove (50 μm × 50 μm length 2 mm) for forming an ink introduction flow path and a heat acting portion is adhered to the substrate.

このようにして、液体噴射記録ヘッドを作成した。In this way, a liquid jet recording head was created.

この様にして作成した記録ヘッドの電気熱変換体に１０
μｓの３０Ｖの矩形電圧を８００Ｈｚで印加すると印加
信号に応じて液体がオリフィスから吐出されて、飛翔的
液滴が安定的に形成された。The electrothermal converter of the recording head thus prepared has 10
When a rectangular voltage of 30 s of 30 V was applied at 800 Hz, the liquid was ejected from the orifice according to the applied signal, and flying droplets were stably formed.

この様な液滴の形成を繰り返すと製造不良のヘッドに於
いてはＡ１電極の電蝕やＴａ保護層とＡ１電極間の絶縁
破壊などにより断線が生じインクを吐出しなくなる。こ
の時点での繰返し数を耐久回数という。When the formation of such droplets is repeated, disconnection occurs in the defective head due to electrolytic corrosion of the A1 electrode, dielectric breakdown between the Ta protective layer and the A1 electrode, etc., and ink is not ejected. The number of repetitions at this point is called the number of durability.

この耐久回数と、製品歩留りを （ａ）本実施例の構成による記録ヘッド （ｂ）本実施例において、陽極酸化層を形成させること
なく作製した記録ヘッド（比較例） （ｃ）本発明の実施例の一つであるが、本実施例におい
て、陽極酸化層を熱作用面から離して形成した記録ヘッ
ド の３例について求めた結果（各々サンプル数１０００に
ついて評価した）を第１表に示す。但し、歩留りはＴａ
層と配線部とのショートチェックの結果である。The durability count and the product yield are (a) a recording head having the configuration of this embodiment (b) a recording head manufactured in this embodiment without forming an anodized layer (comparative example) (c) implementation of the present invention As one of the examples, Table 1 shows the results (evaluated for 1000 samples each) obtained for 3 examples of the recording head in which the anodized layer was formed apart from the heat acting surface in this example. However, the yield is Ta
It is the result of the short-circuit check between the layer and the wiring part.

第１表の結果から明らかなように本発明のヘッドでは耐
久回数１０９回を安定して達成出来る。従ってマルチヘ
ッドとしての使用に適している。 As is clear from the results in Table 1, the head of the present invention can stably achieve the durability of 10 9 times. Therefore, it is suitable for use as a multi-head.

（ｂ）の構成ではＳｉＯ２、Ｔａのスパッタ層のピンホ
ールを通しての記録液の浸透によるＡ１電極の電蝕及び
Ａ１電極とＴａ層との絶縁破壊による耐久性及び歩留り
劣化が顕著であった。In the configuration (b), the durability and the yield were significantly deteriorated due to the electrolytic corrosion of the A1 electrode due to the permeation of the recording liquid through the pinholes of the sputtering layer of SiO 2 and Ta and the dielectric breakdown between the A1 electrode and the Ta layer.

（ｃ）の構成のヘッドでは（ａ）の場合よりも歩留り、
耐久回数ともやや劣った。その内容は発熱低抗体と配線
部境界部での断線が多く、この部分でのＳｉＯ２のステ
ップカバレージが悪いことによる。これは、配線部の膜
質を減少させることにより、（ａ）構成ヘッドの耐久信
頼度へ近づけることが可能である。With the head having the configuration of (c), the yield is higher than that of the case of (a),
The durability was a little inferior. The content of this is because there are many low-heat-generating antibodies and disconnection at the boundary of the wiring portion, and the step coverage of SiO 2 at this portion is poor. This can be brought closer to (a) durability reliability of the constituent head by reducing the film quality of the wiring portion.

即ち、本発明の様に電極部表面を無機絶縁材料に変える
ことにより保護層を形成することで信頼性、歩留り等が
極端に向上する。この傾向は無機質層としてＴａ等の良
好な導電度を有する保護層を上部に用いたヘッドの信頼
性向上においては更に顕著であり、Ａ１リード電極とＴ
ａ導電性保護層間の絶縁破壊による耐久性の低下は皆無
となる。That is, by forming the protective layer by changing the surface of the electrode portion to an inorganic insulating material as in the present invention, reliability, yield, etc. are extremely improved. This tendency is more remarkable in improving the reliability of the head in which the protective layer having a good conductivity such as Ta is used as the inorganic layer on the upper portion, and the A1 lead electrode and the T
a No decrease in durability due to dielectric breakdown between the conductive protection layers.

本実施例においては、電気化学的な陽極酸化を用いて酸
化層の形成を行なったが、他の部分への悪影響をなけれ
ば、加熱酸化によって酸化層を形成しても良く、また膜
質に問題がなければ、酸化剤による表面処理等による化
学的な酸化によって酸化層を形成してもかまわない。In this example, the oxide layer was formed by using electrochemical anodic oxidation. However, the oxide layer may be formed by thermal oxidation as long as it does not adversely affect other parts. If not present, the oxide layer may be formed by chemical oxidation such as surface treatment with an oxidizing agent.

さらに、無機絶縁材料２１４は、酸化物に限らず窒化、
硼化、炭化等によって、窒化物、硼化物、炭化物等を形
成しても良い。Further, the inorganic insulating material 214 is not limited to oxides, but nitrides,
Nitride, boride, carbide and the like may be formed by boration, carbonization and the like.

また、本実施例においては、陽極酸化する際熱作用面２
１３の酸化を防ぐためその部分をパターニングしたが、
発熱抵抗体２０８の酸化が無視しうる場合、または発熱
抵抗体２０８の膜厚を厚くする等の基板設計上無視しう
るようにした場合は、パターニングの必要性はない。第
３図は熱作用面２１３部をパターニングせずに陽極酸化
した場合の切断面部分図であり、第２図（ｂ）に相当す
るが、この場合は電極部だけでなく、発熱抵抗層も含め
て、電気熱変換体の表面に酸化被膜の保護層が形成され
ている。Further, in the present embodiment, the heat acting surface 2 is used during the anodic oxidation.
That part was patterned to prevent oxidation of 13,
If the oxidation of the heat generating resistor 208 can be ignored, or if the film thickness of the heat generating resistor 208 is made to be negligible in designing the substrate, patterning is not necessary. FIG. 3 is a partial cross-sectional view of a case where the thermal action surface 213 is anodized without patterning, and corresponds to FIG. 2B. In this case, not only the electrode portion but also the heating resistance layer is formed. In addition, a protective layer of an oxide film is formed on the surface of the electrothermal converter.

さらに、本実施例における陽極酸化法においてはりん酸
浴による、陽極酸化法であるが、これは陽極化成が可能
で、前記の特性をもつ保護膜を形成できる電解浴なら何
でも良く、例えば硫酸、しゅう酸、クエン酸、酒石酸、
クロム酸、ホウ酸等があげられ、それらの混浴でもかま
わない。また電解条件は成膜された２１４層が先述の特
性を得る条件であれば良く、さらに、ピンホールを減少
させるために、封孔処理、もしくは、ホウ酸＋ホウ酸ナ
トリウム等の中性浴で二次電解することによるポアフィ
リングした場合はさらに良い膜厚となる。Further, the anodic oxidation method in this embodiment is a phosphoric acid bath, which is an anodic oxidation method, but this may be any electrolytic bath capable of anodizing and forming a protective film having the above-mentioned characteristics, for example, sulfuric acid, Oxalic acid, citric acid, tartaric acid,
Examples include chromic acid and boric acid, and a mixed bath of them may be used. The electrolytic conditions may be any conditions as long as the formed 214 layer obtains the above-mentioned characteristics, and further, in order to reduce pinholes, a sealing treatment or a neutral bath such as boric acid + sodium borate is used. When the pore filling is performed by the secondary electrolysis, the film thickness becomes even better.

また、本発明における該保護層の形成方法は、Ａｕ，Ｐ
ｔ，Ａｇ等の酸化物を形成しにくい配線材料の上部に酸
化膜を容易に形成する材料を蒸着、スパッタリング、Ｃ
ＶＤ等によって層を形成し、その後その層だけを酸化す
ることによって保護層を形成することをも含む。In addition, the method for forming the protective layer in the present invention includes Au, P
A material that easily forms an oxide film is formed on the wiring material that does not easily form an oxide such as t or Ag by vapor deposition, sputtering, or C
It also includes forming a layer by VD or the like and then forming a protective layer by oxidizing only that layer.

【図面の簡単な説明】[Brief description of drawings]

第１図（ａ）、（ｂ）は夫々、従来の記録ヘッドを説明
する為のもので、第１図（ａ）は模式的正面部分図、第
１図（ｂ）は第１図（ａ）のＸＸ′一点鎖線での切断面
部分図、第２図（ａ），（ｂ），（ｃ），（ｄ）は夫々
本発明の記録ヘッドの実施態様の１つを説明する為のも
ので、第２図（ａ）は模式的正面部分図、第２図（ｂ）
は第２図（ａ）に示すＡＡ′一点鎖線での切断面部分
図、第２図（ｃ）は第２図（ｂ）に示すＢＢ′一点鎖線
での切断面部分図、第２図（ｄ）はＴ／Ｊ基板の模式的
平面部分図、第３図は本発明の他の実施例を示す模式的
断面図である。 １０１，２００……記録ヘッド １０２，２０１……電気熱変換体 １０３，２０２……基板 １０４，２０３……溝付板 １０５，２１８……オリフィス １０６，２０４……液流路 １０７，２０５……熱作用部 １０８，２１２……熱発生部 １０９，２１３……熱作用面 ２０６……支持体 １１０，２０７……下部層 １１１，２０８……発熱抵抗層 １１２，２１１……上部層 ２１６…… 〃 ２１７…… 〃 ２１４……保護層 １１３，２０９……電極（共通） １１４，２１０……〃 （選択） ２１５……発熱抵抗層の酸化物層1 (a) and 1 (b) are for explaining a conventional recording head, respectively. FIG. 1 (a) is a schematic front partial view, and FIG. 1 (b) is shown in FIG. 1 (a). XX ') is a sectional view taken along the alternate long and short dash line XX', and FIGS. 2 (a), (b), (c) and (d) are respectively for explaining one of the embodiments of the recording head of the present invention. FIG. 2 (a) is a schematic front partial view, and FIG. 2 (b).
2A is a partial sectional view taken along the dashed-dotted line AA ′ shown in FIG. 2A, FIG. 2C is a partial sectional view taken along the dashed-dotted line BB ′ shown in FIG. 2B, and FIG. d) is a schematic plan partial view of the T / J substrate, and FIG. 3 is a schematic sectional view showing another embodiment of the present invention. 101, 200 ... Recording head 102, 201 ... Electrothermal converter 103, 202 ... Substrate 104, 203 ... Grooved plate 105, 218 ... Orifice 106, 204 ... Liquid flow path 107, 205 ... Heat Action part 108,212 ...... Heat generation part 109, 213 ...... Heat action surface 206 ...... Support 110, 207 ...... Lower layer 111, 208 ...... Heating resistance layer 112, 211 ...... Upper layer 216 …… 〃 217 …… 〃 214 …… Protective layer 113, 209 …… Electrode (common) 114, 210 …… 〃 (selection) 215 …… Oxide layer of heating resistance layer

───────────────────────────────────────────────────── フロントページの続き (72)発明者 高橋 博人 東京都大田区下丸子３丁目30番２号 キヤ ノン株式会社内 (72)発明者 庄司 辰美 東京都大田区下丸子３丁目30番２号 キヤ ノン株式会社内 (56)参考文献 特開 昭58−11169（ＪＰ，Ａ) 特開 昭48−99080（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Hiroto Takahashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Tatsumi Shoji 3-30-2 Shimomaruko, Ota-ku, Tokyo Kya Non-Co. Ltd. (56) Reference JP-A-58-11169 (JP, A) JP-A-48-99080 (JP, A)

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】インクを吐出するオリフィスに連通するイ
ンク路と、 該インク路に対応して設けられ、発熱抵抗層と該発熱抵
抗層に電気的に接続する電極とを有する電気熱変換体
と、 を具備するインクジェットヘッドにおいて、 前記電極を陽極酸化させることにより形成される絶縁保
護層を有することを特徴とするインクジェットヘッド。1. An electrothermal converter having an ink passage communicating with an orifice for ejecting ink, and a heating resistance layer provided corresponding to the ink passage and having an electrode electrically connected to the heating resistance layer. An ink jet head comprising: an ink jet head having an insulating protective layer formed by anodizing the electrode.
JP58016900A 1983-02-05 1983-02-05 Inkjet head Expired - Lifetime JPH0643128B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58016900A JPH0643128B2 (en) 1983-02-05 1983-02-05 Inkjet head
DE19843403643 DE3403643A1 (en) 1983-02-05 1984-02-02 LIQUID JET RECORDING HEAD
FR8401676A FR2540435B1 (en) 1983-02-05 1984-02-03 LIQUID JET RECORDING HEAD
US06/867,890 US4694306A (en) 1983-02-05 1986-05-20 Liquid jet recording head with a protective layer formed by converting the surface of a transducer into an insulating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58016900A JPH0643128B2 (en) 1983-02-05 1983-02-05 Inkjet head

Publications (2)

Publication Number Publication Date
JPS59143650A JPS59143650A (en) 1984-08-17
JPH0643128B2 true JPH0643128B2 (en) 1994-06-08

Family

ID=11929015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58016900A Expired - Lifetime JPH0643128B2 (en) 1983-02-05 1983-02-05 Inkjet head

Country Status (4)

Country Link
US (1) US4694306A (en)
JP (1) JPH0643128B2 (en)
DE (1) DE3403643A1 (en)
FR (1) FR2540435B1 (en)

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Also Published As

Publication number Publication date
US4694306A (en) 1987-09-15
FR2540435A1 (en) 1984-08-10
FR2540435B1 (en) 1988-02-12
JPS59143650A (en) 1984-08-17
DE3403643C2 (en) 1993-01-07
DE3403643A1 (en) 1984-08-09

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