JPH0641215U - Planar antenna device - Google Patents
Planar antenna deviceInfo
- Publication number
- JPH0641215U JPH0641215U JP7538292U JP7538292U JPH0641215U JP H0641215 U JPH0641215 U JP H0641215U JP 7538292 U JP7538292 U JP 7538292U JP 7538292 U JP7538292 U JP 7538292U JP H0641215 U JPH0641215 U JP H0641215U
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- Prior art keywords
- circuit board
- planar antenna
- antenna element
- case member
- mounting plate
- Prior art date
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Abstract
(57)【要約】
【目的】 ＧＰＳ（Global Positioning System ）等
で、平面アンテナ素子を用いて電波を受信するための平
面アンテナ装置に関し、小型でノイズの影響を受けにく
い平面アンテナ装置を提供することを目的とする。
【構成】 平面アンテナ素子部１１を取付板１２を介し
て回路基板１３に積層して配置し、半田付けし、平面ア
ンテナ素子部１１，取付板１２，回路基板１３を一体的
に固着すると共に取付板１２及び回路基板１３をケース
部材１４に一体的に半田付けすることにより平面アンテ
ナ素子部１１，取付板１２，回路基板１３，ケース部材
１４を一体的に固定する。また、ケース部材１４にカバ
ー部材１５を取付け、取付板１２，ケース部材１４，カ
バー部材１５により回路基板１３をシールドする。
(57) [Summary] [Object] To provide a planar antenna device for receiving radio waves using a planar antenna element in a GPS (Global Positioning System) or the like, and to provide a planar antenna device that is small and is not easily affected by noise. With the goal. [Structure] The planar antenna element portion 11 is laminated and arranged on a circuit board 13 via a mounting plate 12 and soldered to integrally fix the planar antenna element portion 11, the mounting plate 12 and the circuit board 13 and to mount them. The plate antenna 12 and the circuit board 13 are integrally soldered to the case member 14 to integrally fix the planar antenna element portion 11, the mounting plate 12, the circuit board 13, and the case member 14. Further, the cover member 15 is attached to the case member 14, and the circuit board 13 is shielded by the mounting plate 12, the case member 14, and the cover member 15.
Description
【０００１】[0001]
本考案は平面アンテナ装置に係り、特にＧＰＳ（Global Positioning System ）等で平面アンテナ素子を用いて電波を受信するための平面アンテナ装置に関す る。 The present invention relates to a planar antenna device, and more particularly to a planar antenna device for receiving radio waves using a planar antenna element in GPS (Global Positioning System) or the like.
【０００２】[0002]
ＧＰＳは複数個のＧＰＳ衛星という人工衛星から地上に放射される電波を利用 して、利用者の現在位置（緯度、経度、高度）を知るシステムで、通常、アンテ ナユニット、受信部、信号処理部、表示部等で構成されている。 GPS is a system that knows the user's current position (latitude, longitude, altitude) by using the radio waves radiated to the ground from artificial satellites such as multiple GPS satellites. Usually, an antenna unit, receiver, signal processing Section, display section, and the like.
【０００３】 人工衛星からの電波はアンテナユニットで受信され、増幅された後、受信部に 供給される。受信部ではアンテナユニットからの信号を復調した後、信号処理部 に供給する。信号処理部は受信部からの復調データに基づいて測位等の信号処理 が行なわれる。表示部では信号処理部で測位された測位結果を地図上に表示する 。Radio waves from the artificial satellite are received by the antenna unit, amplified, and then supplied to the receiving unit. The receiving section demodulates the signal from the antenna unit and supplies it to the signal processing section. The signal processing unit performs signal processing such as positioning based on the demodulated data from the receiving unit. The display unit displays the positioning result determined by the signal processing unit on the map.
【０００４】 図１０に従来のアンテナユニットの概略構成図を示す。アンテナユニットは通 常電波を電気信号に変換するアンテナ素子部１とアンテナ素子部１で変換された 電気信号を増幅するローノイズアンプが形成された回路部２とで構成されている 。アンテナ素子部１は小型化のために絶縁基板１ａ上に導電性薄膜１ｂを形成し てなる平面アンテナ素子が用いられる。アンテナ素子部１と回路部２とは夫々別 体で構成され、ケーブル３により互いに接続され、外部ケース４内に並設され、 収納されていた。FIG. 10 shows a schematic configuration diagram of a conventional antenna unit. The antenna unit is composed of an antenna element section 1 for converting ordinary radio waves into an electric signal and a circuit section 2 having a low noise amplifier for amplifying the electric signal converted by the antenna element section 1. The antenna element unit 1 is a planar antenna element in which a conductive thin film 1b is formed on an insulating substrate 1a for downsizing. The antenna element section 1 and the circuit section 2 were separately configured, were connected to each other by the cable 3, and were arranged side by side in the outer case 4 and housed.
【０００５】[0005]
しかるに、従来のアンテナユニットは、アンテナ素子部と回路部とが夫々別体 で構成されており、アンテナ素子部と回路部とは並設され、ケーブルにより接続 されていたため、設置面積が大きくなってしまうと共に、ケーブルからノイズが 侵入しやすい等の問題点があった。 However, in the conventional antenna unit, the antenna element section and the circuit section are separately configured, and the antenna element section and the circuit section are arranged side by side and connected by a cable, so the installation area becomes large. At the same time, there was a problem that noise easily entered from the cable.
【０００６】 本考案は上記の点に鑑みてなされたもので、小型でノイズの影響を受けにくい 平面アンテナ装置を提供することを目的とする。The present invention has been made in view of the above points, and an object of the present invention is to provide a planar antenna device that is small and is not easily affected by noise.
【０００７】[0007]
本考案は、電波を受信する平面アンテナ素子と、平面アンテナ素子と接続され 、平面アンテナ素子で受信した信号を処理し、出力する回路が形成された回路基 板と、回路基板を収納する収納ケースとを有する平面アンテナ装置であって、 一面に平面アンテナ素子が取付けられ、他面に、回路基板が取付けられ、前記 アンテナ素子と前記回路基板とを積層して保持する取付板を具備し、前記回路基 板を前記収納ケースに固定することにより前記平面アンテナ素子及び前記回路基 板を前記収納ケースと一体化する構成としてなる。 The present invention is directed to a plane antenna element for receiving radio waves, a circuit board connected to the plane antenna element and having a circuit for processing and outputting a signal received by the plane antenna element, and a storage case for storing a circuit board. A planar antenna device having a flat antenna element mounted on one surface and a circuit board mounted on the other surface, and comprising a mounting plate for stacking and holding the antenna element and the circuit board, By fixing the circuit board to the storage case, the planar antenna element and the circuit board are integrated with the storage case.
【０００８】[0008]
平面アンテナ素子は取付板の一面に取付けられ、回路基板は取付板の他面に取 付けられる。回路基板を収納ケースに固定することにより平面アンテナ素子が収 納ケースに一体的に保持される。 The planar antenna element is mounted on one surface of the mounting plate, and the circuit board is mounted on the other surface of the mounting plate. By fixing the circuit board to the storage case, the planar antenna element is integrally held in the storage case.
【０００９】 このとき、平面アンテナ素子はその受信面が回路基板に平行に積層されるよう に取付部材により取付けられるため、装置本体の取付面積を小さくできる。At this time, since the planar antenna element is mounted by the mounting member so that the receiving surface thereof is laminated in parallel with the circuit board, the mounting area of the apparatus main body can be reduced.
【００１０】 また、平面アンテナ素子と回路基板とを近接して設けることができるため、ノ イズが侵入しにくくなると共に、信号損失も小さくできる。Further, since the planar antenna element and the circuit board can be provided close to each other, noise is less likely to enter and signal loss can be reduced.
【００１１】[0011]
図１は本発明の一実施例の構成図を示す。同図中、５は平面アンテナ装置本体 を示す。平面アンテナ装置本体５は内部ケース部材６内に収納され、内部ケース 部材６はさらに内部ケース部材６にネジ留めされた外装ケース部材７により被覆 される。 FIG. 1 shows a block diagram of an embodiment of the present invention. In the figure, 5 indicates a main body of the planar antenna device. The planar antenna device body 5 is housed in the inner case member 6, and the inner case member 6 is further covered with an outer case member 7 screwed to the inner case member 6.
【００１２】 内部ケース部材６は上ケース部材６ａ及び下ケース部材６ｂよりなり上ケース 部材６ａと下ケース部材６ｂとの接合部分には樹脂製のパッキン６ｃが配設され 、内部を密閉状態に保持する構成とされている。The inner case member 6 is composed of an upper case member 6a and a lower case member 6b, and a resin packing 6c is arranged at a joint portion between the upper case member 6a and the lower case member 6b to keep the inside airtight. It is configured to do.
【００１３】 下ケース部材６ｂ内部には装置本体５の取付用ネジ穴６ｂ-1が形成されている 。装置本体５は後述する取付孔を介してネジ８をネジ穴６ｂ-1に螺入することに より下ケース部材６ｂに固定される。Inside the lower case member 6b, a mounting screw hole 6b-1 for mounting the apparatus body 5 is formed. The device body 5 is fixed to the lower case member 6b by screwing a screw 8 into a screw hole 6b-1 through a mounting hole described later.
【００１４】 また、下ケース部材６ｂの外側部にはマグネット９ａ，９ｂの取付部６ｂ-2が 形成されている。マグネット９ａ，９ｂは取付部６ｂ-2にネジ留めされる。マグ ネット９ａ，９ｂにより装置を自動車のボディ等に固定する構成とされている。Further, a mounting portion 6b-2 for the magnets 9a and 9b is formed on the outer side of the lower case member 6b. The magnets 9a and 9b are screwed to the mounting portion 6b-2. The device is fixed to the body of the automobile by magnets 9a and 9b.
【００１５】 装置本体５には後述するコネクタが設けられ、このコネクタにはケーブル１０ が接続される。ケーブル１０は内部ケース部材６及び外部ケース部材７を貫通し て、外部に引き出される。The device body 5 is provided with a connector described later, and the cable 10 is connected to this connector. The cable 10 penetrates the inner case member 6 and the outer case member 7 and is pulled out to the outside.
【００１６】 図２は本考案の一実施例の装置本体５の要部の分解斜視図を示す。同図中、１ １は平面アンテナ素子、１２は取付板、１３は回路基板、１４はケース部材、１ ５はカバー部材を示す。FIG. 2 is an exploded perspective view of a main part of the apparatus main body 5 according to the embodiment of the present invention. In the figure, 11 is a planar antenna element, 12 is a mounting plate, 13 is a circuit board, 14 is a case member, and 15 is a cover member.
【００１７】 図３に平面アンテナ素子１１の構成図を示す。平面アンテナ素子１１は誘電体 セラミクス等の誘電体材料よりなる基板１１ａ上に金属等の導電材料よりなる導 電薄膜１１ｂを形成してなる。導電薄膜１１ｂはピン１１ｃを介して外部と接続 される。ピン１１ｄは導電薄膜１１ｂ上より基板１１ａに形成されたスルーホー ル１１ｄに挿入され、頭部１１ｃ-1が導電薄膜１１ｂと半田付けされ、接触し、 他端１１ｃ-2は基板１１ａ裏面に突出される。ピン１１ｄの他端１１ｃ-2が外部 回路と接続され、導電薄膜１１ｂと電気的に接続される。FIG. 3 shows a configuration diagram of the planar antenna element 11. The planar antenna element 11 is formed by forming a conductive thin film 11b made of a conductive material such as metal on a substrate 11a made of a dielectric material such as dielectric ceramics. The conductive thin film 11b is connected to the outside through the pin 11c. The pin 11d is inserted into the through hole 11d formed on the substrate 11a from above the conductive thin film 11b, and the head 11c-1 is soldered to the conductive thin film 11b to make contact, and the other end 11c-2 is projected to the back surface of the substrate 11a. It The other end 11c-2 of the pin 11d is connected to an external circuit and electrically connected to the conductive thin film 11b.
【００１８】 なお、基板１１ａの材料としては誘電体セラミクスの他、ＰＰＯ材等の樹脂材 料も考えられるが、ＰＰＯ材は基板形成時に打抜き、切削加工が必要となり、成 型が容易でない。これに対して誘電体セラミクスは金型に入れて焼結するだけで 成型が行なえ、成型が容易であるため、本実施例では基板１１ａは誘電体セラミ クスで形成されている。As a material for the substrate 11a, a resin material such as a PPO material may be used in addition to the dielectric ceramics, but the PPO material requires punching and cutting at the time of forming the substrate, so that molding is not easy. On the other hand, the dielectric ceramics can be molded simply by putting them in a mold and sintering, and in this embodiment, the substrate 11a is formed of the dielectric ceramics.
【００１９】 平面アンテナ素子１１は取付板１２に両面テープや接着剤により固定される。 図４に取付板１２の構成図を示す。取付板１２は一枚の金属板をプレス加工等に より打抜き、爪部等を折曲することにより形成される。The planar antenna element 11 is fixed to the mounting plate 12 with a double-sided tape or an adhesive. FIG. 4 shows a configuration diagram of the mounting plate 12. The mounting plate 12 is formed by punching a single metal plate by press working or the like and bending the claws or the like.
【００２０】 取付板１２には平面アンテナ素子１１の位置決め用爪部１２ａ-1〜１２ａ-7， 回路基板１３の取付用爪部１２ｂ-1〜１２ｂ-4，ケース部材１４の位置決め用穴 部１２ｃ-1〜１２ｃ-4，平面アンテナ素子１１の接続ピン１１ｃの貫通孔１２ｄ ，取付板１２の固定用貫通孔１２ｅ-1〜１２ｅ-4が一体的に形成されている。 爪部１２ａ-1〜１２ａ-7は取付板１２の上面に切起こされ、爪部１２ｂ-1〜１２ ｂ-4は取付板１２の爪部１２ａ-1〜１２ａ-7が切起こされた面とは反対の下面に 切起こされている。The mounting plate 12 has positioning claws 12a-1 to 12a-7 for the planar antenna element 11, mounting claws 12b-1 to 12b-4 for the circuit board 13, and positioning holes 12c for the case member 14. -1 to 12c-4, the through hole 12d of the connection pin 11c of the planar antenna element 11, and the fixing through holes 12e-1 to 12e-4 of the mounting plate 12 are integrally formed. The claws 12a-1 to 12a-7 are cut and raised on the upper surface of the mounting plate 12, and the claws 12b-1 to 12b-4 are surfaces on which the claws 12a-1 to 12a-7 of the mounting plate 12 are cut and raised. It is cut and raised on the lower surface opposite to.
【００２１】 平面アンテナ素子１１はピン１１ｃが突出する面に接着剤等が塗布され、取付 板１２の爪部１２ａ-1〜１２ａ-7が切起こされた上面と密着され、取付板１２に 固着される。このとき、平面アンテナ素子１１の側面は爪部１２ａ-1〜１２ａ-7 により保持され、ピン１１ｃは貫通孔１２ｄを貫通して、取付板１２の裏面に突 出する。The planar antenna element 11 is coated with an adhesive or the like on the surface from which the pin 11c protrudes, and the claws 12a-1 to 12a-7 of the mounting plate 12 are brought into close contact with the upper surface of the mounting plate 12 and fixed to the mounting plate 12. To be done. At this time, the side surface of the planar antenna element 11 is held by the claw portions 12a-1 to 12a-7, and the pin 11c penetrates the through hole 12d and projects to the back surface of the mounting plate 12.
【００２２】 取付板１２の貫通孔１２ｅ-1〜１２ｅ-4に前述のネジ８が挿入され、ネジ８を 内部ケース部材６の取付部６ｂ-1に螺入することにより装置本体５が内部ケース 部材６内に固定される。The above-described screw 8 is inserted into the through holes 12e-1 to 12e-4 of the mounting plate 12, and the screw 8 is screwed into the mounting portion 6b-1 of the inner case member 6 so that the apparatus body 5 is inserted into the inner case. It is fixed in the member 6.
【００２３】 図５に回路基板１３の構成図を示す。回路基板１３は配線がプリントされた絶 縁基板１３ａ上に電子部品チップ１３ｂ及びコネクタ１３ｃを半田付けした構成 とされている。FIG. 5 shows a configuration diagram of the circuit board 13. The circuit board 13 has a structure in which an electronic component chip 13b and a connector 13c are soldered onto an insulating board 13a on which wiring is printed.
【００２４】 絶縁基板１３ａは略正方形状で、その一部に凸部１３ａ-1を有する。また、絶 縁基板１３ａには取付板１２の爪部１２ｂ-1〜１２ｂ-4に対応して、切欠部１３ ａ-2〜１３ａ-5が形成されている。The insulating substrate 13a has a substantially square shape, and has a convex portion 13a-1 on a part thereof. Further, the insulating substrate 13a is formed with notches 13a-2 to 13a-5 corresponding to the claws 12b-1 to 12b-4 of the mounting plate 12.
【００２５】 電子部品チップ１３ｂは絶縁基板１３ａ上に表面実装され、コネクタ１３ｃは 出力端子となり絶縁基板１３ａの凸部１３ａ-1上に半田付け等により固着され、 その接続部１３ｃ-1は凸部１３ａ-1からさらに外方に突出する構成とされている 。The electronic component chip 13b is surface-mounted on the insulating substrate 13a, the connector 13c serves as an output terminal and is fixed onto the convex portion 13a-1 of the insulating substrate 13a by soldering or the like, and the connecting portion 13c-1 has a convex portion. It is configured to further project outward from 13a-1.
【００２６】 また、絶縁基板１３ａ上には平面アンテナ素子１１のピン１１ｃに対応してス ルーホール１３ａ-6が形成されており、電子部品チップ１３ｂの実装面とは反対 側の非実装面より平面アンテナ素子１１のピン１１ｃが貫通し、実装面側に突出 し、ピン１１ｃは実装面側で半田付けされ、回路との接続が行なわれる。A through hole 13a-6 is formed on the insulating substrate 13a so as to correspond to the pin 11c of the planar antenna element 11, and is more flat than the non-mounting surface opposite to the mounting surface of the electronic component chip 13b. The pin 11c of the antenna element 11 penetrates and projects to the mounting surface side, and the pin 11c is soldered on the mounting surface side to be connected to a circuit.
【００２７】 回路基板１３は電子部品チップ１３ｂの実装面が下面となり、ケース部材１４ に固定される。The circuit board 13 is fixed to the case member 14 with the mounting surface of the electronic component chip 13b serving as the lower surface.
【００２８】 図６に回路基板１３上に形成される回路のブロック構成図を示す。FIG. 6 shows a block configuration diagram of a circuit formed on the circuit board 13.
【００２９】 回路基板１３上には図６に示すようにアンプ１３ｄ，１３ｅでバンドパスフィ ルタ１３ｆを挟んでなるローノイズアンプ（ＬＮＡ）が構成されていて、平面ア ンテナ素子１１で受信した信号を増幅して出力する。As shown in FIG. 6, a low noise amplifier (LNA) is formed on the circuit board 13 by sandwiching a bandpass filter 13f with amplifiers 13d and 13e, and a signal received by the planar antenna element 11 is transmitted. Amplify and output.
【００３０】 図７にケース部材１４の構成図を示す。ケース部材１４は一枚の金属板をプレ ス加工等で打抜いた後、折曲、溶接することにより筒状に形成されている。FIG. 7 shows a configuration diagram of the case member 14. The case member 14 is formed into a tubular shape by punching a single metal plate by press working or the like, and then bending and welding.
【００３１】 ケース部材１４の端面には取付板１２の穴部１２ｃ-1〜１２ｃ-4に対応して凸 部１４ａ-1〜１４ａ-4及び、回路基板１３の凸部１３ａ-1と係合する凹部１４ｂ が形成されている。また、ケース部材１４の内側面には回路基板１３を位置決め し、かつ、固定するための爪部１４ｃ-1〜１４ｃ-4が対向する二辺に形成されて いる。爪部１４ｃ-1〜１４ｃ-4は側板部をくさび状に切起こすことにより形成さ れている。ケース部材１４の外側面には下端部付近にカバー部材１５の係止用の 凸部１４ｄが四辺に夫々３個ずつ形成されている。The end face of the case member 14 is engaged with the protrusions 14a-1 to 14a-4 corresponding to the holes 12c-1 to 12c-4 of the mounting plate 12 and the protrusion 13a-1 of the circuit board 13. The concave portion 14b is formed. Further, on the inner surface of the case member 14, claw portions 14c-1 to 14c-4 for positioning and fixing the circuit board 13 are formed on two opposite sides. The claw portions 14c-1 to 14c-4 are formed by cutting and raising the side plate portion in a wedge shape. Three protrusions 14d for locking the cover member 15 are formed on each of the four sides near the lower end of the outer surface of the case member 14.
【００３２】 ケース部材１４には回路基板１３の凸部１３ａ-1が係合する凹部１４ｂが形成 された端面側の開口部より回路基板１３が装着される。回路基板１３はその電子 部品実装面が開口部に向って装着され、実装面の縁部がケース部材１４の爪部１ ４ｃ-1〜１４ｃ-4に突当たり、位置決めされる。このとき、回路基板１３の凸部 １３ａ-1はケース部材１４の凹部１４ｂと係合し、コネクタ１３ｃと共にケース 部材１４の外部に突出する構成とされている。The circuit board 13 is attached to the case member 14 through the opening on the end face side where the concave portion 14b with which the convex portion 13a-1 of the circuit board 13 engages is formed. The circuit board 13 is mounted such that its electronic component mounting surface faces the opening, and the edge of the mounting surface abuts against the claw portions 14c-1 to 14c-4 of the case member 14 and is positioned. At this time, the convex portion 13a-1 of the circuit board 13 is engaged with the concave portion 14b of the case member 14 and protrudes to the outside of the case member 14 together with the connector 13c.
【００３３】 回路基板１３はケース部材１４の爪部１４ｃ-1と半田付けされ、ケース部材１ ４に固定される。半田付けによりケース部材１４は回路基板１３のアースと接続 され、回路基板１３側面を外部からシールドする構成とされている。The circuit board 13 is soldered to the claw portions 14 c-1 of the case member 14 and fixed to the case member 14. The case member 14 is connected to the ground of the circuit board 13 by soldering, and the side surface of the circuit board 13 is shielded from the outside.
【００３４】 また、ケース部材１４には回路基板１３上面から取付板１２が装着される。The mounting plate 12 is mounted on the case member 14 from the upper surface of the circuit board 13.
【００３５】 取付板１２は爪部１２ｂ-1〜１２ｂ-4が回路基板１３の切欠部１３ａ-2〜１３ ａ-5を貫通して、回路基板１３の電子部品チップ１３ｂ実装面に突出すると共に 、貫通孔１２ｃ-1〜１２ｃ-4にはケース部材１４の端部に形成された凸部１４ａ -1〜１４ａ-4が係合する。爪部１２ｂ-1〜１２ｂ-4は回路基板１３の電子部品チ ップ１３ｂの実装面に半田付けされ、取付板１２がケース部材１４に固定される 。In the mounting plate 12, the claw portions 12b-1 to 12b-4 penetrate the cutout portions 13a-2 to 13a-5 of the circuit board 13 and project to the mounting surface of the electronic component chip 13b of the circuit board 13. The projections 14a-1 to 14a-4 formed at the ends of the case member 14 engage with the through holes 12c-1 to 12c-4. The claws 12b-1 to 12b-4 are soldered to the mounting surface of the electronic component chip 13b of the circuit board 13 and the mounting plate 12 is fixed to the case member 14.
【００３６】 また、ケース部材１４の下面側にはカバー部材１５が係止される。A cover member 15 is locked on the lower surface side of the case member 14.
【００３７】 図８にカバー部材１５の構成図を示す。カバー部材１５は一枚の金属板をプレ ス加工等により打抜き、折曲、溶接することにより形成される。カバー部材１５ はケース部材１４の開口部に対応した平板部１５ａとその周囲に形成された周縁 部１５ｂとより構成されている。周縁部１５ｂ-1〜１５ｂ-4は平板部１５ａの四 辺夫々に平板部１５ａに対して直角に折曲された構成をなし、各辺の周縁部１５ ｂ-1〜１５ｂ-4は夫々３枚の係合片１５ｄを有する。係合片１５ｄにはケース部 材１４の下端付近に形成された凸部１４ｄと係合する係合孔１５ｃが形成される 。また、係合片１５ｄの先端部１５ｅは外方に向って折曲しており、ケース部材 １４への取付けが容易に行なえる構成とされている。FIG. 8 shows a configuration diagram of the cover member 15. The cover member 15 is formed by punching, bending, and welding a single metal plate by pressing or the like. The cover member 15 is composed of a flat plate portion 15a corresponding to the opening of the case member 14 and a peripheral edge portion 15b formed around the flat plate portion 15a. The peripheral portions 15b-1 to 15b-4 are formed by bending the four sides of the flat plate portion 15a at right angles to the flat plate portion 15a. It has a single engagement piece 15d. The engaging piece 15d is provided with an engaging hole 15c which engages with a convex portion 14d formed near the lower end of the case member 14. Further, the tip portion 15e of the engagement piece 15d is bent outward so that it can be easily attached to the case member 14.
【００３８】 カバー部材１５はケース部材１４の下部開口部に周縁部１５ｂ-1〜１５ｂ-4を 突当て、押し込むことによりケース部材１４の凸部１４ｄで周縁部１５ｂ-1〜１ ５ｂ-4が外方に開かれつつ、押込まれ、ケース部材１４の凸部１４ｄ-1〜１４ｄ -12 がカバー部材１５の係合孔１５ｃと係合した後、周縁部１５ｂ-1〜１５ｂ-4 が復元して、ケース部材１４に係止される。The peripheral edge portions 15b-1 to 15b-4 of the cover member 15 are abutted against the lower opening portion of the case member 14 and pushed in so that the peripheral edge portions 15b-1 to 15b-4 are formed at the convex portions 14d of the case member 14. After being pushed outward while opening, the convex portions 14d-1 to 14d-12 of the case member 14 engage with the engaging holes 15c of the cover member 15, and then the peripheral edge portions 15b-1 to 15b-4 are restored. And is locked to the case member 14.
【００３９】 以上により、取付板１２及びカバー部材１５はケース部材１４に導通状態で取 付けられる。回路基板１３はその周囲を取付板１２，ケース部材１４，カバー部 材１５よりなる金属板により完全に包囲され、ケース部材１４と回路基板１３の アースとが接続されることにより、外部と完全にシールドされる構成とされてい る。As described above, the mounting plate 12 and the cover member 15 are attached to the case member 14 in a conductive state. The circuit board 13 is completely surrounded by a metal plate composed of a mounting plate 12, a case member 14, and a cover member 15, and the case member 14 and the ground of the circuit board 13 are connected to each other, so that the circuit board 13 is completely connected to the outside. It is configured to be shielded.
【００４０】 図９は平面アンテナ装置の要部組立て図を示す。図９に示すように本実施例の 構成によれば、平面アンテナ素子部１１と回路基板１３とが一体化できるため、 小型化が可能であると共に、平面アンテナ素子部１１との接続も直接行なえるた め、ノイズが侵入しにくいと共に信号損失も最小限とすることができる。FIG. 9 is an assembly view of the main parts of the planar antenna device. According to the configuration of the present embodiment as shown in FIG. 9, the planar antenna element portion 11 and the circuit board 13 can be integrated, so that the size can be reduced and the connection with the planar antenna element portion 11 can be performed directly. Therefore, it is difficult for noise to enter and signal loss can be minimized.
【００４１】 また、装置本体５が一体化されると共にコネクタ１３ｃがケース部材１４より 外部に突出しているため、装置本体５の検査装置への接続が容易に行え、検査効 率を向上させることができると共に外装ケースへの取付けも容易となり、組立性 を向上させることができる。Further, since the apparatus main body 5 is integrated and the connector 13c projects outward from the case member 14, the apparatus main body 5 can be easily connected to the inspection apparatus, and the inspection efficiency can be improved. In addition, it can be easily attached to the outer case, improving the ease of assembly.
【００４２】 さらに、装置本体５の組立てにおいても、平面アンテナ素子部１１，取付板１ ２，回路基板１３，ケース部材１４を積層し、半田付けし、固定でき、半田付け 後はカバー部材１５をケース部材１４に取付けるだけで組み付けが完了するため 、組立性が良好となり、また、平面アンテナ素子部１１，取付板１２，回路基板 １３，ケース部材１４は半田付けにより一体的に固着されるため、振動や衝撃に 対して強い構造となっている。Further, also in the assembly of the apparatus main body 5, the planar antenna element portion 11, the mounting plate 12, the circuit board 13 and the case member 14 can be stacked, soldered and fixed, and the cover member 15 can be attached after soldering. Since the assembly is completed simply by attaching the case member 14, the assembling property is good, and the planar antenna element portion 11, the mounting plate 12, the circuit board 13, and the case member 14 are integrally fixed by soldering, It has a strong structure against vibration and shock.
【００４３】[0043]
上述の如く、本考案によれば、平面アンテナ素子部は回路基板が収納された収 納ケースに回路基板に積層して直接的に付けられるため、設置面積を小さくでき ると共に強度を向上させることができ、平面アンテナ素子部と回路基板とを近接 して設けることができ接続を最短距離で行なえるため、平面アンテナ素子部と回 路基板間でノイズが侵入しにくいと共に信号損失を減少させることができ、また 、構造が簡単であるため、組立性が良好である等の特長を有する。 As described above, according to the present invention, since the planar antenna element part is directly attached to the storage case in which the circuit board is housed by being stacked on the circuit board, the installation area can be reduced and the strength can be improved. Since the planar antenna element part and the circuit board can be provided close to each other and the connection can be made in the shortest distance, it is difficult for noise to enter between the planar antenna element part and the circuit board and the signal loss is reduced. In addition, since it has a simple structure, it is easy to assemble and has other features.
【図１】本考案の一実施例の概略構成図である。FIG. 1 is a schematic configuration diagram of an embodiment of the present invention.
【図２】本考案の一実施例の装置本体の分解斜視図であ
る。FIG. 2 is an exploded perspective view of an apparatus main body according to an embodiment of the present invention.
【図３】本考案の一実施例の平面アンテナ素子の構成図
である。FIG. 3 is a configuration diagram of a planar antenna element according to an embodiment of the present invention.
【図４】本考案の一実施例の取付板の構成図である。FIG. 4 is a configuration diagram of a mounting plate according to an embodiment of the present invention.
【図５】本考案の一実施例の回路基板の構成図である。FIG. 5 is a configuration diagram of a circuit board according to an embodiment of the present invention.
【図６】本考案の一実施例の回路基板の回路構成図であ
る。FIG. 6 is a circuit configuration diagram of a circuit board according to an embodiment of the present invention.
【図７】本考案の一実施例のケース部材の構成図であ
る。FIG. 7 is a configuration diagram of a case member according to an embodiment of the present invention.
【図８】本考案の一実施例のカバー部材の構成図であ
る。FIG. 8 is a configuration diagram of a cover member according to an embodiment of the present invention.
【図９】本考案の一実施例の装置本体の組立図である。FIG. 9 is an assembly view of a device body according to an embodiment of the present invention.
【図１０】従来の一例の概略構成図である。FIG. 10 is a schematic configuration diagram of a conventional example.
１１ 平面アンテナ素子部 １２ 取付板 １３ 回路基板 １４ ケース部材 １５ カバー部材 11 Planar Antenna Element Section 12 Mounting Plate 13 Circuit Board 14 Case Member 15 Cover Member
Claims (1)
平面アンテナ素子と接続され、該平面アンテナ素子部で
受信した信号を処理し、出力する回路が形成された回路
基板と、該回路基板を収納する収納ケースとを有する平
面アンテナ装置であって、 一面に前記平面アンテナ素子が取付けられ、他面に、前
記回路基板が取付けられ、前記平面アンテナ素子と前記
回路基板とを積層して保持する取付板を具備し、前記回
路基板を前記収納ケースに固定することにより前記平面
アンテナ素子及び前記回路基板を前記収納ケースと一体
化する構成としてなる平面アンテナ装置。1. A circuit board having a planar antenna element for receiving radio waves, a circuit connected to the planar antenna element, and having a circuit for processing and outputting a signal received by the planar antenna element section, and the circuit board. A planar antenna device having a housing case for housing, wherein the planar antenna element is attached to one surface, the circuit board is attached to the other surface, and the planar antenna element and the circuit board are stacked and held. A planar antenna device comprising a mounting plate, wherein the circuit board is fixed to the housing case so that the planar antenna element and the circuit board are integrated with the housing case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7538292U JPH0641215U (en) | 1992-10-29 | 1992-10-29 | Planar antenna device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7538292U JPH0641215U (en) | 1992-10-29 | 1992-10-29 | Planar antenna device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0641215U true JPH0641215U (en) | 1994-05-31 |
Family
ID=13574591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7538292U Pending JPH0641215U (en) | 1992-10-29 | 1992-10-29 | Planar antenna device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0641215U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004215193A (en) * | 2003-01-08 | 2004-07-29 | Shimada Phys & Chem Ind Co Ltd | Antenna module |
-
1992
- 1992-10-29 JP JP7538292U patent/JPH0641215U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004215193A (en) * | 2003-01-08 | 2004-07-29 | Shimada Phys & Chem Ind Co Ltd | Antenna module |
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