JPH0639704A - Polishing work surface plate - Google Patents
Polishing work surface plateInfo
- Publication number
- JPH0639704A JPH0639704A JP19948392A JP19948392A JPH0639704A JP H0639704 A JPH0639704 A JP H0639704A JP 19948392 A JP19948392 A JP 19948392A JP 19948392 A JP19948392 A JP 19948392A JP H0639704 A JPH0639704 A JP H0639704A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- passage
- refrigerant
- cooling
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はウェハーポリッシング用
のポリッシング装置に係るもので、特に加工定盤の冷却
構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for wafer polishing, and more particularly to a cooling structure for a working surface plate.
【０００２】[0002]
【従来の技術】この種の加工定盤は図６あるいは図７に
示すように構成されている。図６に示すものは、皿状の
下定盤部材１と、この下定盤部材１の上面部に取り付け
られた上定盤部材２とによって構成されている。上記下
定盤部材１の底部には冷媒供給管３が接続され、この冷
媒供給管３の内部には冷媒排気管４が挿入されている。2. Description of the Related Art A processing surface plate of this type is constructed as shown in FIG. The structure shown in FIG. 6 includes a plate-shaped lower surface plate member 1 and an upper surface plate member 2 attached to the upper surface of the lower surface plate member 1. A refrigerant supply pipe 3 is connected to the bottom of the lower surface plate member 1, and a refrigerant exhaust pipe 4 is inserted inside the refrigerant supply pipe 3.
【０００３】また、上記下定盤部材１の内部は図８にも
示すように、放射状に配設された複数枚の仕切板５…に
より仕切られて複数の室６…が構成され、これら室６…
の内部にはガイド板７が設けられている。Further, as shown in FIG. 8, the inside of the lower surface plate member 1 is partitioned by a plurality of partition plates 5 arranged radially to form a plurality of chambers 6 ... …
A guide plate 7 is provided inside.
【０００４】しかして、ポリッシング加工時には、冷媒
供給管３から冷媒が供給され、この冷媒は矢印で示すよ
うに、ガイド板７に沿って流され上定盤部材２を冷却し
たあと、冷媒排気管４から排出される。一方、図７に示
すものは、皿状の下定盤部材１１と、この下定盤部材１
１の上面部に取り付けられた上定盤部材１２とによって
構成されている。上記下定盤部材１１の底部には冷媒排
気管１３が接続され、この冷媒排気管１３の内部には冷
媒供給管１４が挿入されている。During the polishing process, however, the coolant is supplied from the coolant supply pipe 3, and this coolant flows along the guide plate 7 to cool the upper platen member 2 as shown by the arrow, and then the coolant exhaust pipe. Emitted from 4. On the other hand, what is shown in FIG. 7 is a dish-shaped lower surface plate member 11 and this lower surface plate member 1.
The upper surface plate member 12 is attached to the upper surface of the first plate 1. A refrigerant exhaust pipe 13 is connected to the bottom of the lower platen member 11, and a refrigerant supply pipe 14 is inserted inside the refrigerant exhaust pipe 13.
【０００５】また、上記下定盤部材１１の内部は図９に
も示すように、放射状に配設された複数枚の仕切板１５
…により仕切られて複数の室１６…が構成され、これら
室１６…の内部には上記冷媒供給管１４に接続する供給
管１７…が挿入されている。Further, as shown in FIG. 9, the inside of the lower surface plate member 11 has a plurality of partition plates 15 arranged radially.
A plurality of chambers 16 are constructed by being partitioned by, and supply pipes 17 connected to the refrigerant supply pipe 14 are inserted inside the chambers 16.
【０００６】しかして、ポリッシング加工時には冷媒供
給管１４から冷媒が供給され、この冷媒は複数本の供給
管１７…を介して供給され、矢印で示すように流される
ことにより、上定盤部材１２を冷却したあと、冷媒排気
管１３から排出される。During the polishing process, however, the coolant is supplied from the coolant supply pipe 14, and this coolant is supplied through the plurality of supply pipes 17 ... After being cooled, the refrigerant is discharged from the refrigerant exhaust pipe 13.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、図６お
よび図７に示すものは、いずれも、定盤内を複数の室６
…，１６…に仕切り、これら室６…，１６…に冷媒を分
配して供給するため、冷媒が室６…，１６…に均一に分
配されることが少なく、多く分配される室と少なく分配
される室とが発生する。また、冷媒供給管３，１４の断
面積に比較して冷媒通路（室６，１６）の断面積が大き
ため、冷媒通路内に冷媒が滞留してしまう。However, in both of those shown in FIGS. 6 and 7, a plurality of chambers 6 are provided in the surface plate.
, 16 ... and the refrigerant is distributed and supplied to these chambers 6 ..., 16 ... Therefore, the refrigerant is rarely evenly distributed to the chambers 6, ..., 16 ... There will be a room that will be. Further, since the cross-sectional areas of the refrigerant passages (chambers 6, 16) are larger than the cross-sectional areas of the refrigerant supply pipes 3 and 14, the refrigerant stays in the refrigerant passages.
【０００８】このように、各室６，１６に対し、冷媒の
分配量が不均一になったり、室６，１６内に冷媒が滞留
すると、冷却ムラが発生し定盤が熱変形するという問題
があった。As described above, if the distribution amount of the refrigerant becomes uneven in each of the chambers 6 and 16, or if the refrigerant stays in the chambers 6 and 16, uneven cooling occurs and the surface plate is thermally deformed. was there.
【０００９】なお、上記原因によって生じた冷却ムラに
よる定盤の熱変形を小さく抑えるために、定盤の材料と
して低熱膨張材が使われることがあるが、この場合には
材料費が非常に高く、コスト高になる。A low thermal expansion material may be used as the material of the surface plate in order to suppress the thermal deformation of the surface plate due to the uneven cooling caused by the above causes. In this case, the material cost is very high. , Costly.
【００１０】そこで、本発明は定盤の材料として低熱膨
脹材を用いることなく、冷媒の供給量のバラツキ、滞留
を防止して良好に冷却できるようにしたポリッシング用
加工定盤を提供することを目的とする。Therefore, the present invention is to provide a polishing surface plate for polishing which can prevent the variation and retention of the supply amount of the refrigerant and can cool it well without using a low thermal expansion material as the material of the surface plate. To aim.
【００１１】[0011]
【課題を解決するための手段】本発明は上記課題を解決
するため、被加工物をポリッシング加工する定盤おい
て、前記定盤内に渦巻状に設けられ冷媒を定盤の外周側
から内側中心に向かって流す第１の通路および冷媒を定
盤の内側中心から外周側に向かって流す第２の通路から
なる冷却通路と、この冷却通路の第１および第２の通路
の断面形状と略同一断面形状を有し前記第１および第２
の通路に冷媒を供給する冷媒供給路とを具備してなる。In order to solve the above-mentioned problems, the present invention provides a surface plate for polishing a work piece, wherein a coolant is provided in a spiral shape in the surface plate from the outer peripheral side to the inner side of the surface plate. A cooling passage including a first passage that flows toward the center and a second passage that allows the refrigerant to flow from the inner center of the platen toward the outer peripheral side, and the cross-sectional shapes of the first and second passages of the cooling passage. The first and second portions having the same cross-sectional shape
And a coolant supply passage for supplying a coolant to the passage.
【００１２】[0012]
【作用】冷却通路を渦巻状に構成し、この渦巻状の冷却
通路に冷媒を流すことにより、定盤の各部位に均一的に
冷媒を供給し、また、冷却通路の断面形状と冷媒供給路
の断面形状を略同一に構成することにより、冷却通路内
での冷媒の滞留を防止する。さらに、冷却通路を第１お
よび第２の通路によって構成し、第１の通路により冷媒
を定盤の外周側から内側中心に向かって流し、第２の通
路により冷媒を定盤の内側中心から外周側に向かって流
すことにより、定盤を均一的に冷却できるようにした。The cooling passage is formed in a spiral shape, and the cooling medium is supplied to the respective parts of the surface plate by flowing the cooling medium in the spiral cooling passage. By making the cross-sectional shapes of the two substantially the same, the retention of the refrigerant in the cooling passage is prevented. Further, the cooling passage is constituted by the first and second passages, the first passage allows the refrigerant to flow from the outer peripheral side of the platen toward the inner center, and the second passage causes the refrigerant to flow from the inner center of the platen to the outer periphery. The surface plate can be cooled uniformly by flowing it toward the side.
【００１３】[0013]
【実施例】以下、本発明の一実施例であるポリッシング
用加工定盤を図１および図２を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A polishing surface plate for polishing according to an embodiment of the present invention will be described below with reference to FIGS.
【００１４】図１は定盤２０を示す断面図で、この定盤
２０は下側定盤部材２１と、この下側定盤部材２１の上
面部に接合された上側定盤部材２２とによって構成され
ている。上記下側定盤部材２１の中央部には冷媒排出路
２４が形成され、この冷媒排出路２４内には冷媒供給管
２３が挿入されている。FIG. 1 is a sectional view showing a surface plate 20, which is composed of a lower surface plate member 21 and an upper surface plate member 22 joined to an upper surface of the lower surface plate member 21. Has been done. A coolant discharge passage 24 is formed in the center of the lower platen member 21, and a coolant supply pipe 23 is inserted in the coolant discharge passage 24.
【００１５】上記下側定盤部材２１の上面部すなわち、
上記上側定盤部材２２との接合面には、図２にも示すよ
うに、冷却通路３０を構成する第１および第２の渦巻状
の通路溝２５，２６が形成されている。The upper surface of the lower surface plate member 21, that is,
As shown in FIG. 2, first and second spiral passage grooves 25 and 26 forming a cooling passage 30 are formed on the joint surface with the upper surface plate member 22.
【００１６】上記第１の通路溝２５は冷媒を外周側から
定盤の内側中心に向かって流し、上記第２の通路溝２６
は冷媒を定盤の内側中心から外周側に向かって流すよう
になっている。The first passage groove 25 allows the refrigerant to flow from the outer peripheral side toward the inner center of the surface plate, and the second passage groove 26.
Is designed to flow the refrigerant from the inner center of the platen toward the outer peripheral side.
【００１７】上記第１および第２の通路溝２５，２６の
流入口２５ａ，２６ａは連通路３１，３２を介して供給
通路２７に連通され、この供給通路２７は上記冷媒供給
管２３に連通されている。前記連通路３１，３２、供給
通路２７および冷媒供給管２３により冷媒供給路２９が
構成されている。The inflow ports 25a and 26a of the first and second passage grooves 25 and 26 are communicated with the supply passage 27 through the communication passages 31 and 32, and the supply passage 27 is communicated with the refrigerant supply pipe 23. ing. The communication passages 31 and 32, the supply passage 27, and the refrigerant supply pipe 23 constitute a refrigerant supply passage 29.
【００１８】また、上記第１および第２の通路溝２５，
２６の排出口２５ｂ，２６ｂは連通路３３，３４を介し
て排出通路２８に連通され、この排出通路２８は上記冷
媒排出路２４に連通されている。Further, the first and second passage grooves 25,
The discharge ports 25b and 26b of 26 are communicated with the discharge passage 28 through the communication passages 33 and 34, and the discharge passage 28 is communicated with the refrigerant discharge passage 24.
【００１９】しかして、ポリッシング加工時には、冷媒
供給管２３から矢印で示すように、冷媒が供給され、こ
の冷媒は供給通路２７を介して連通路３１，３２に送ら
れ、この連通路３１，３２から上記第１および第２の通
路溝２５，２６の流入口２５ａ，２６ａに送られる。こ
の冷媒は図２に矢印で示すように、第１および第２の通
路溝２５，２６内に互いに逆方向に流されて定盤２０を
冷却する。この冷却後、冷媒は第１および第２の通路溝
２５，２６の排出口２５ｂ，２６ｂから排出される。そ
して、この排出された冷媒は連通路３３，３４および排
出通路２８を介して冷媒排出路２４へ送られ外部に排出
される。ところで、上記連通路３１，３２，３３，３４
は同一断面形状であるとともに、連通路３１，３２およ
び３３，３４の長さも同一にされている。During the polishing process, however, the coolant is supplied from the coolant supply pipe 23 as shown by the arrow, and this coolant is sent to the communication passages 31 and 32 through the supply passage 27, and the communication passages 31 and 32. Is sent to the inflow ports 25a and 26a of the first and second passage grooves 25 and 26. As shown by the arrows in FIG. 2, this refrigerant flows in the first and second passage grooves 25 and 26 in opposite directions to cool the surface plate 20. After this cooling, the refrigerant is discharged from the discharge ports 25b and 26b of the first and second passage grooves 25 and 26. Then, the discharged refrigerant is sent to the refrigerant discharge passage 24 through the communication passages 33 and 34 and the discharge passage 28 and is discharged to the outside. By the way, the communication passages 31, 32, 33, 34
Has the same sectional shape, and the communication passages 31, 32 and 33, 34 have the same length.
【００２０】また、冷媒供給管２３から連通路３１に至
る距離と連通路３３から冷媒排出路２４に至る距離との
和と、冷媒供給管２３から連通路３２に至る距離と連通
路３４から冷媒排出路２４に至る距離との和が等しくさ
れている。The sum of the distance from the refrigerant supply pipe 23 to the communication passage 31 and the distance from the communication passage 33 to the refrigerant discharge passage 24, the distance from the refrigerant supply pipe 23 to the communication passage 32, and the communication passage 34 from the refrigerant. The sum of the distance to the discharge path 24 is equal.
【００２１】したがって、第１および第２の通路溝２
５，２６における冷却媒体の圧力損失が同じくなり、冷
媒は第１および第２の通路溝２５，２６を均等に流れる
ことができるようになっている。Therefore, the first and second passage grooves 2
The pressure loss of the cooling medium in the cooling medium 5 and that in the cooling medium 26 are the same, so that the refrigerant can flow evenly through the first and second passage grooves 25 and 26.
【００２２】上述したように、本発明においては、冷却
通路３０を渦巻状に構成し、この渦巻状の冷却通路３０
に冷媒を流すため、冷媒は定盤２０の各部位に均一的に
流される。また、冷却通路３０の断面積と冷媒供給路２
９の断面積を略同一に構成するため、冷却通路３０内に
冷媒が滞留することもない。As described above, in the present invention, the cooling passage 30 is formed in a spiral shape, and the spiral cooling passage 30 is formed.
Since the cooling medium is flown to the cooling plate, the cooling medium is uniformly flowed to each part of the surface plate 20. Further, the cross-sectional area of the cooling passage 30 and the refrigerant supply passage 2
Since the sectional areas of 9 are substantially the same, the refrigerant does not stay in the cooling passage 30.
【００２３】また、冷却通路３０を第１および第２の通
路溝２５，２６により構成し、第１および第２の通路溝
２５，２６により、冷媒を定盤２０の内側と外側から逆
方向に流すため、定盤２０全体の温度は均一となり、定
盤２０の変形は冷却通路が一本の場合より、ずっと小さ
くなる。Further, the cooling passage 30 is constituted by the first and second passage grooves 25, 26, and the first and second passage grooves 25, 26 allow the refrigerant to flow in the opposite directions from the inside and the outside of the surface plate 20. Because of the flow, the temperature of the entire surface plate 20 becomes uniform, and the deformation of the surface plate 20 becomes much smaller than that in the case where there is only one cooling passage.
【００２４】すなわち、実際に、加工定盤によってウェ
ハーを加工すると、ウェハーが接する定盤部分の温度が
上昇し、その熱を上記冷媒及び研磨液にて奪っていくた
め、冷却通路が１本の場合には、供給側より排出側へ向
かって冷媒の温度が上昇し、定盤表面も同様な傾向とな
り定盤はその温度勾配に従って変形する。なお、本発明
は上記一実施例に限られることなく、図３に示す構成を
上記実施例に追加してもよい。That is, when the wafer is actually processed by the processing surface plate, the temperature of the surface plate portion in contact with the wafer rises, and the heat is taken away by the refrigerant and the polishing liquid, so that the cooling passage has one cooling passage. In this case, the temperature of the refrigerant increases from the supply side toward the discharge side, and the surface of the surface plate has the same tendency, and the surface plate deforms according to the temperature gradient. The present invention is not limited to the above-mentioned embodiment, and the configuration shown in FIG. 3 may be added to the above-mentioned embodiment.
【００２５】すなわち、冷却通路３０の第１および第２
の通路溝２５，２６の冷媒排出側に対向する上側定盤部
材２２に空気溜３６を形成するとともに、連通路３３，
３４にパイプ３５を挿入している。That is, the first and second cooling passages 30 are provided.
Forming an air reservoir 36 on the upper surface plate member 22 facing the refrigerant discharge side of the passage grooves 25, 26 of the communication passage 33,
A pipe 35 is inserted into the pipe 34.
【００２６】この実施例によれば、第１および第２の通
路溝２５，２６を流れてきた冷媒に混じった空気は、連
通路３４，３３に入る際、一旦、パイプ３５を乗りこえ
て連通路３４，３３に入る。このとき、冷媒より軽い空
気は空気溜３６に集められ、空気溜まりが無いときのよ
うに、連通路３４，３３の上壁部に空気が滞留すること
はない。したがって、定盤２０の表面の温度が均一とな
り、温度による変形が非常に小さくなっている。上記空
気溜３６に集まった空気は少しずつ冷媒により排出通路
２８へ運ばれていくため、最終的には空気溜３６内は冷
媒で満たされる。According to this embodiment, the air mixed with the refrigerant flowing through the first and second passage grooves 25, 26 once passes over the pipe 35 when entering the communication passages 34, 33. Enter 34, 33. At this time, the air lighter than the refrigerant is collected in the air reservoir 36, and the air does not stay in the upper wall portions of the communication passages 34 and 33 as in the absence of the air reservoir. Therefore, the surface temperature of the surface plate 20 becomes uniform, and the deformation due to the temperature is extremely small. The air collected in the air reservoir 36 is gradually carried by the refrigerant to the discharge passage 28, so that the air reservoir 36 is finally filled with the refrigerant.
【００２７】なお、上記した空気溜３６がないと、装置
の運転を停止して冷媒を止め、再度運転を再開した場合
に相手側の設備によっては冷却通路３０内に空気が溜ま
り、運転を開始しても定盤２０の表面温度が空気により
冷却が不十分となり、バラツクことがある。また、本発
明は図４および図５に示すように構成してもよい。If the above-mentioned air reservoir 36 is not provided, when the operation of the apparatus is stopped, the refrigerant is stopped, and the operation is restarted, air is accumulated in the cooling passage 30 depending on the equipment on the other side, and the operation is started. Even if the surface temperature of the surface plate 20 is insufficiently cooled by air, the surface temperature may vary. Further, the present invention may be configured as shown in FIGS. 4 and 5.
【００２８】すなわち、冷却通路としての第１および第
２の通路溝４１，４２を上側定盤部材２２側に設け、第
１および第２の通路溝４１，４２の高さを冷媒供給側４
１ａ，４２ａより排出側４１ｂ，４２ｂに向かって次第
に高くし、排出側には図３で述べたパイプ３５を備えて
いる。この実施例によれば、冷却通路３０内の空気を積
極的に排出側へ運ぶことができ、より一層、良好な冷却
が可能になる。さらに、低熱膨脹率（１×１０-6/ Ｃ°
以下）を持つ材料を上側定盤部材２２に使用することに
より変形はさらに小さくなる。また、冷媒としては、水
（チラ−水、重水）や、その他の媒体（エチレングリコ
−ル、油、ガス）などが用いられる。That is, the first and second passage grooves 41 and 42 as cooling passages are provided on the upper surface plate member 22 side, and the height of the first and second passage grooves 41 and 42 is set to the refrigerant supply side 4.
1a and 42a are gradually raised toward the discharge sides 41b and 42b, and the discharge side is provided with the pipe 35 described in FIG. According to this embodiment, the air in the cooling passage 30 can be positively carried to the discharge side, and more excellent cooling can be performed. Furthermore, a low coefficient of thermal expansion (1 × 10 -6 / C °
The deformation is further reduced by using a material having the following) for the upper surface plate member 22. As the refrigerant, water (chiller water, heavy water), other mediums (ethylene glycol, oil, gas) or the like are used.
【００２９】[0029]
【発明の効果】本発明は以上説明したように、定盤を冷
却するための冷却通路を渦巻状に形成し、この渦巻状の
冷却通路内に冷媒を流すから、従来のように定盤を各ゾ
−ンに分割して各ゾ−ンに冷媒を分配して流す場合と比
較し、定盤の各部位に対する冷媒の供給量にバラツキを
生じない。また、冷却通路と冷媒供給路の断面積を略同
一に構成するから、冷却通路内で冷却媒体が滞留するこ
ともない。したがって、定盤を斑なく均一的に冷却する
ことができ、定盤の熱変形を防止できる。As described above, according to the present invention, the cooling passage for cooling the surface plate is formed in a spiral shape, and the refrigerant flows in the spiral cooling passage. There is no variation in the amount of the refrigerant supplied to each part of the surface plate, as compared with the case where the refrigerant is distributed to each zone and the refrigerant is distributed to each zone. Further, since the cooling passage and the refrigerant supply passage have substantially the same sectional area, the cooling medium does not stay in the cooling passage. Therefore, the surface plate can be uniformly cooled without spots, and thermal deformation of the surface plate can be prevented.
【００３０】また、冷却通路を第１および第２の通路に
より構成し、これら第１および第２の通路に冷媒を互い
に逆方向に流すため、定盤全体の温度は均一となり、定
盤の変形は冷却通路が単一の場合と比較し大幅に小さく
なる。Further, since the cooling passage is constituted by the first and second passages and the refrigerants flow in the first and second passages in mutually opposite directions, the temperature of the whole surface plate becomes uniform and the surface plate is deformed. Is significantly smaller than the case with a single cooling passage.
【図１】本発明の一実施例であるポリッシング用加工定
盤を示す断面図。FIG. 1 is a cross-sectional view showing a polishing surface plate which is an embodiment of the present invention.
【図２】図１中Ａ−Ａ線に沿って示す下側定盤部材の平
面図。FIG. 2 is a plan view of a lower surface plate member taken along the line AA in FIG.
【図３】本発明の第１の他の実施例であるポリッシング
用加工定盤を示す断面図。FIG. 3 is a cross-sectional view showing a polishing surface plate which is another embodiment of the present invention.
【図４】本発明の第２の他の実施例であるポリッシング
用加工定盤を示す断面図。FIG. 4 is a sectional view showing a polishing surface plate which is a second embodiment of the present invention.
【図５】図４中Ｄ−Ｄ線に沿って示す上側定盤部材の平
面図。5 is a plan view of the upper surface plate member taken along the line D-D in FIG. 4. FIG.
【図６】第１の従来例であるポリッシング用加工定盤を
示す断面図。FIG. 6 is a cross-sectional view showing a polishing surface plate which is a first conventional example.
【図７】第２の従来例であるポリッシング用加工定盤を
示す断面図。FIG. 7 is a sectional view showing a polishing surface plate which is a second conventional example.
【図８】図６中Ｂ−Ｂ線に沿って示す下側定盤部材の平
面図。FIG. 8 is a plan view of the lower surface plate member taken along the line BB in FIG.
【図９】図７中Ｃ−Ｃ線に沿って示す下側定盤部材の平
面図。9 is a plan view of the lower surface plate member taken along line CC in FIG. 7. FIG.
２０…定盤、２５…第１の通路、２６…第２の通路、３
０…冷却通路、２９…冷媒供給路。20 ... surface plate, 25 ... first passage, 26 ... second passage, 3
0 ... Cooling passage, 29 ... Refrigerant supply passage.
Claims (3)
おいて、 前記定盤内に渦巻状に設けられ冷媒を定盤の外周側から
内側中心に向かって流す第１の通路および冷媒を定盤の
内側中心から外周側に向かって流す第２の通路からなる
冷却通路と、 この冷却通路の第１および第２の通路の断面形状と略同
一断面形状を有し前記第１および第２の通路に冷媒を供
給する冷媒供給路と、を具備してなることを特徴とする
ポリッシング用加工定盤。1. A surface plate for polishing a work piece, wherein a first passage is provided in the surface plate in a spiral shape and flows a refrigerant from an outer peripheral side of the surface plate toward an inner center of the surface plate. A cooling passage formed of a second passage that flows from the inner center toward the outer peripheral side; and a cooling passage having substantially the same cross-sectional shape as the first and second passages of the cooling passage. A processing surface plate for polishing, comprising: a coolant supply path for supplying a coolant.
めるための空気溜を設けたことを特徴とする請求項１記
載のポリッシング用加工定盤。2. The polishing surface plate for polishing according to claim 1, wherein an air reservoir for accumulating air is provided on the cooling passage side of the cooling passage.
側から流出側に向かって漸次増大させたことを特徴とす
る請求項１記載のポリッシング用加工定盤。3. The polishing surface plate for polishing according to claim 1, wherein the cooling passage has a cross-sectional area that gradually increases from the refrigerant inflow side toward the refrigerant outflow side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19948392A JP3201833B2 (en) | 1992-07-27 | 1992-07-27 | Processing surface plate for polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19948392A JP3201833B2 (en) | 1992-07-27 | 1992-07-27 | Processing surface plate for polishing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0639704A true JPH0639704A (en) | 1994-02-15 |
| JP3201833B2 JP3201833B2 (en) | 2001-08-27 |
Family
ID=16408560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19948392A Expired - Fee Related JP3201833B2 (en) | 1992-07-27 | 1992-07-27 | Processing surface plate for polishing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3201833B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US5730642A (en) * | 1993-08-25 | 1998-03-24 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical montoring |
| US6186872B1 (en) | 1997-11-21 | 2001-02-13 | Ebara Corporation | Polisher |
| WO2001040138A1 (en) * | 1999-11-30 | 2001-06-07 | Ibiden Co., Ltd. | Porous silicon carbide sintered compact and silicon carbide metal composite suitable for use in table for wafer polishing machine |
| JP2010195597A (en) * | 2009-02-20 | 2010-09-09 | Mitsubishi Materials Corp | Apparatus for producing polycrystalline silicon |
| CN102343563A (en) * | 2011-08-14 | 2012-02-08 | 上海合晶硅材料有限公司 | Large silicon wafer polishing disk |
| CN111843832A (en) * | 2020-07-30 | 2020-10-30 | 赣州市业润自动化设备有限公司 | Water-cooled grinding head for chemical mechanical grinding |
-
1992
- 1992-07-27 JP JP19948392A patent/JP3201833B2/en not_active Expired - Fee Related
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6261151B1 (en) | 1993-08-25 | 2001-07-17 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US6464561B2 (en) | 1993-08-25 | 2002-10-15 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US5842909A (en) * | 1993-08-25 | 1998-12-01 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including heater |
| US5851135A (en) * | 1993-08-25 | 1998-12-22 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US6120347A (en) * | 1993-08-25 | 2000-09-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US6306009B1 (en) | 1993-08-25 | 2001-10-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US6739944B2 (en) | 1993-08-25 | 2004-05-25 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US5762537A (en) * | 1993-08-25 | 1998-06-09 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including heater |
| US5730642A (en) * | 1993-08-25 | 1998-03-24 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical montoring |
| US6464560B2 (en) | 1993-08-25 | 2002-10-15 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US6338667B2 (en) | 1993-08-25 | 2002-01-15 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US6464564B2 (en) | 1993-08-25 | 2002-10-15 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US6186872B1 (en) | 1997-11-21 | 2001-02-13 | Ebara Corporation | Polisher |
| WO2001040138A1 (en) * | 1999-11-30 | 2001-06-07 | Ibiden Co., Ltd. | Porous silicon carbide sintered compact and silicon carbide metal composite suitable for use in table for wafer polishing machine |
| JP2010195597A (en) * | 2009-02-20 | 2010-09-09 | Mitsubishi Materials Corp | Apparatus for producing polycrystalline silicon |
| CN102343563A (en) * | 2011-08-14 | 2012-02-08 | 上海合晶硅材料有限公司 | Large silicon wafer polishing disk |
| CN111843832B (en) * | 2020-07-30 | 2021-09-07 | 广东汉岂工业技术研发有限公司 | Water-cooled grinding head for chemical mechanical grinding |
| CN111843832A (en) * | 2020-07-30 | 2020-10-30 | 赣州市业润自动化设备有限公司 | Water-cooled grinding head for chemical mechanical grinding |
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| Publication number | Publication date |
|---|---|
| JP3201833B2 (en) | 2001-08-27 |
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