JPH0637408A - Flex-ridged printed wiring board - Google Patents

Flex-ridged printed wiring board

Info

Publication number
JPH0637408A
JPH0637408A JP20960992A JP20960992A JPH0637408A JP H0637408 A JPH0637408 A JP H0637408A JP 20960992 A JP20960992 A JP 20960992A JP 20960992 A JP20960992 A JP 20960992A JP H0637408 A JPH0637408 A JP H0637408A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
section
flexible
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20960992A
Other languages
Japanese (ja)
Inventor
Hiroshi Hasegawa
宏 長谷川
Masa Akimoto
雅 秋元
Seiichi Yamaoka
誠一 山岡
Takeshi Masuo
毅 益尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP20960992A priority Critical patent/JPH0637408A/en
Publication of JPH0637408A publication Critical patent/JPH0637408A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To impart sufficient flexibility to the flexible section of a flexible printed wiring board, and to prevent generation of disconnection, etc., in a wiring drawn around in an electronic equipment by installing a cover-lay in the flexible section and obviating the mounting of the cover-lay in a ridged section. CONSTITUTION:Conductor patterns 7 are formed on both surfaces or one surface of a resin film II constituting a flexible printed wiring board FPC1, and a cover- lay 2 is provided only at a central section, thus shaping a flexible section. Rigid printed wiring board materials 4, on both surfaces or one surface of which are clad with copper, are laminated on both sides of the FPC1 through prepregs 3 for bonding, thus forming a ridged section. A through-hole is formed to the ridged section, and the conductor patterns 7 required are connected electrically by through-hole plating 5. The through-hole is formed separated by 1mm or more from the end section of the cover-lay 2, thus improving the reliability of the through-hole.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は電子機器等の高密度実装
に適するフレックス・ リジッドプリント配線板に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flex / rigid printed wiring board suitable for high-density mounting of electronic devices and the like.

【０００２】[0002]

【従来の技術】図２は従来のフレックス・ リジッドプリ
ント配線板の一例の断面図である。図面に示すように、
樹脂フイルム11の両面に導体パターン７を形成したフレ
キシブルプリント配線板１の、上記導体パターン７を覆
って、接着剤層を介してカバーレイ２が設けられてい
る。そして上記フレキシブルプリント配線板（ＦＰＣ）
１の両側に、接着シート３′を介して銅張りした硬質プ
リント配線板（ＰＷＢ）材料４が積層されて多層板を形
成し、前記ＦＰＣによるフレキシブル部分と多層板によ
るリジッド部分の２つの部分よりなっている。スルーホ
ールは上記リジッド部分に形成されており、スルーホー
ルメッキ５により必要な導体パターン７間を電気的に接
続している。2. Description of the Related Art FIG. 2 is a sectional view of an example of a conventional flex-rigid printed wiring board. As shown in the drawing,
A cover lay 2 is provided on the flexible printed wiring board 1 having conductor patterns 7 formed on both sides of a resin film 11 so as to cover the conductor patterns 7 and an adhesive layer. And the flexible printed wiring board (FPC)
On both sides of 1, a hard printed wiring board (PWB) material 4 which is copper-clad via an adhesive sheet 3'is laminated to form a multilayer board, and the two parts of the flexible part by the FPC and the rigid part by the multilayer board are formed. Has become. The through hole is formed in the rigid portion, and the required conductor patterns 7 are electrically connected by the through hole plating 5.

【０００３】[0003]

【発明が解決しようとする課題】上述した従来のフレッ
クス・ リジッドプリント配線板において、ＦＰＣのカバ
ーレイは十分な屈曲性と接着性を得るため、通常アクリ
ル系接着剤を用い、ポリイミドフィルム等を接着したも
のであるが、線膨張係数が大きく、スルーホールメッキ
の材料である金属との熱膨張率の差が大きいため、特に
部品の高密度実装による発熱の影響を受けるリジッド部
のスルーホールに歪が生じ、導電不良となる等信頼性に
問題があった。In the above-described conventional flex-rigid printed wiring board, the cover lay of the FPC is usually bonded with a polyimide film or the like in order to obtain sufficient flexibility and adhesiveness. However, since the linear expansion coefficient is large and the difference in the coefficient of thermal expansion from the metal that is the material for through-hole plating is large, there is distortion in the through-holes of the rigid part that are affected by the heat generated by high-density mounting of parts. However, there was a problem in reliability such as poor conductivity.

【０００４】[0004]

【課題を解決するための手段】本発明は上述の問題点を
解消し、高密度実装に適した信頼性の高いフレックス・
リジッドプリント配線板を提供するもので、その特徴
は、フレキシブル部分とリジッド部分よりなるプリント
配線板において、フレキシブル部分にはカバーレイを設
け、リジッド部分のフレキシブルプリント配線板にはカ
バーレイを設けていないことにある。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and provides a highly reliable flex.
The present invention provides a rigid printed wiring board, which is characterized in that a printed wiring board including a flexible portion and a rigid portion is provided with a coverlay on the flexible portion and does not have a coverlay on the flexible printed wiring board in the rigid portion. Especially.

【０００５】図１は本発明のフレックス・ リジッドプリ
ント配線板の具体例の断面図である。図面において、１
はＦＰＣで、樹脂フィルム11の両面又は片面に導体パタ
ーン７が形成されており、このようなＦＰＣ１の中央部
のみにカバーレイ２が施されている。上記ＦＰＣ１の両
側においては、接着用プリプレグ３を介して、両面又は
片面に銅張りしたＰＷＢ材料４が積層されて多層板を形
成しており、上記カバーレイ２を施した中央部のフレキ
シブル部分と、多層板を形成したリジッド部分とよりな
っている。そしてスルーホールはリジッド部分に形成し
てあり、スルーホールメッキ５により必要な導体パター
ン７間を電気的に接続している。このスルーホールはカ
バーレイ２の端面から１mm以上離して設けるのが、スル
ホールの信頼性を高める上から好ましい。FIG. 1 is a cross-sectional view of a specific example of the flex-rigid printed wiring board of the present invention. In the drawings, 1
Is an FPC, and the conductor pattern 7 is formed on both sides or one side of the resin film 11, and the coverlay 2 is applied only to the central portion of such an FPC 1. On both sides of the FPC 1, a PWB material 4 having copper on both sides or one side is laminated via an adhesive prepreg 3 to form a multilayer board, and a central flexible portion provided with the coverlay 2 is formed. , And a rigid portion forming a multilayer board. The through hole is formed in the rigid portion, and the required conductor patterns 7 are electrically connected by the through hole plating 5. It is preferable to provide the through hole at a distance of 1 mm or more from the end face of the coverlay 2 in order to improve the reliability of the through hole.

【０００６】[0006]

【作用】上述した本発明のフレックス・ リジッドプリン
ト配線板においては、フレキシブル部分にはカバーレイ
を設けてあるので十分な屈曲性が得られ、リジッド部分
にはカバーレイがなく、さらにカバーレイの端面から１
mm以上離れてスルーホールを設けてあるので、スルーホ
ールの信頼性が向上する。In the above-described flex-rigid printed wiring board of the present invention, since the cover portion is provided in the flexible portion, sufficient flexibility can be obtained, the rigid portion has no cover lay, and the end face of the cover lay is further provided. From 1
Since the through holes are provided at a distance of mm or more, the reliability of the through holes is improved.

【０００７】[0007]

【実施例】50μm 厚のポリイミドフィルム上に接着剤を
介することなく35μm の銅箔回路パターンを設けたＦＰ
Ｃ材料に、中央のフレキシブル部分には35μm 厚のアク
リル系接着剤を介して、25μm 厚のポリイミドフィルム
のカバーレイを設け、両側のリジッド部分には、 100μ
m 厚のポリイミド系プリプレグを介して 100μm 厚の銅
張りしたＰＷＢ材料をＦＰＣの両面から積層し、カバー
レイの端面から１mm以上離してスルーホールを形成し、
スルーホールメッキを施して図１の形状のフレックス・
リジッドプリント配線板を作成した。Example: FP in which a copper foil circuit pattern of 35 μm is provided on a polyimide film of 50 μm thickness without an adhesive.
On the C material, a cover layer of 25 μm thick polyimide film is provided on the central flexible part via an acrylic adhesive of 35 μm thickness, and 100 μm on the rigid parts on both sides.
100μm thick copper-clad PWB material is laminated from both sides of the FPC via m-thick polyimide prepreg, and a through hole is formed at a distance of 1mm or more from the end face of the coverlay.
The flex of the shape shown in Fig. 1 with through hole plating
A rigid printed wiring board was created.

【０００８】比較のために、比較例１としてＦＰＣの両
面にカバーレイを設けた図２の構造のフレックス・ リジ
ッドプリント配線板を作成し、さらに、比較例２とし
て、図１のカバーレイを除いたものを作成した。For comparison, as Comparative Example 1, a flex-rigid printed wiring board having a structure shown in FIG. 2 in which coverlays were provided on both sides of an FPC was prepared. Further, as Comparative Example 2, the coverlay shown in FIG. 1 was removed. Created

【０００９】上記３種類の作成品を用い、ＭＩＬ−Ｐ−
50884Ｃに準ずるサーマルショック試験と、 2.5mmＲの
摺動屈曲試験を実施した。結果は表１に示す通りで、本
発明品は良好な結果が得られた。なお、本発明はその要
旨を超えない限り、上記実施例に限定されるものではな
い。MIL-P-
A thermal shock test conforming to 50884C and a sliding bending test of 2.5 mmR were performed. The results are shown in Table 1, and good results were obtained for the products of the present invention. It should be noted that the present invention is not limited to the above embodiments unless it exceeds the gist.

【００１０】[0010]

【表１】 [Table 1]

【００１１】[0011]

【発明の効果】以上説明したように、本発明のフレック
ス・ リジッドプリント配線板によれば、フレキシブル部
分はカバーレイを有するので、十分な屈曲性を持ち、電
子機器内の引回し配線の際にも断線等が発生し難く、又
リジッド部分はカバーレイがなく、さらにカバーレイの
端面から１mm以上離してスルーホールを設けることによ
り、熱によるスルーホールの歪等が生じ難く、スルーホ
ールの信頼性が向上する。従って、電子機器の分野で発
熱の大きい高密度実装基板に用いるとき効果的である。As described above, according to the flex-rigid printed wiring board of the present invention, since the flexible portion has the coverlay, it has sufficient bendability and is suitable for routing wiring in electronic equipment. Also, the disconnection is hard to occur, the rigid part has no cover lay, and by disposing the through hole at least 1 mm away from the end face of the cover lay, distortion of the through hole due to heat does not easily occur, and the reliability of the through hole Is improved. Therefore, it is effective when used for a high-density mounting board that generates a large amount of heat in the field of electronic equipment.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のフレックス・ リジッドプリント配線板
の具体例の断面図である。FIG. 1 is a sectional view of a specific example of a flex-rigid printed wiring board of the present invention.

【図２】従来のフレックス・ リジッドプリント配線板の
一例の断面図である。FIG. 2 is a cross-sectional view of an example of a conventional flex-rigid printed wiring board.

【符号の説明】[Explanation of symbols]

１ ＦＰＣ ２ カバーレイ ３ 接着用プリプレグ ４ 銅張りＰＷＢ材料 ５ スルーホールメッキ ６ ソルダーレジスト ７ 導体パターン 1 FPC 2 Coverlay 3 Adhesive prepreg 4 Copper-clad PWB material 5 Through-hole plating 6 Solder resist 7 Conductor pattern

───────────────────────────────────────────────────── フロントページの続き (72)発明者 益尾 毅 愛知県名古屋市南区菊住一丁目７番10号 住友電気工業株式会社名古屋製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takeshi Masio 1-7-10 Kikuzumi, Minami-ku, Aichi Prefecture Nagoya City Sumitomo Electric Industries, Ltd. Nagoya Works

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 樹脂フィルム上に接着剤を介さずに導電
性回路パターンを形成したフレキシブルプリント配線板
の一部に、銅張りした硬質プリント配線板材料を積層し
て多層板を形成し必要な回路間をスルーホールメッキで
接続したフレキシブル部分とリジッド部分よりなるプリ
ント配線板において、フレキシブル部分にはカバーレイ
を設け、リジッド部分のフレキシブルプリント配線板に
はカバーレイを設けていないことを特徴とするフレック
ス・ リジッドプリント配線板。1. A multilayer printed circuit board is formed by laminating a copper-clad hard printed circuit board material on a part of a flexible printed circuit board having a conductive circuit pattern formed on a resin film without using an adhesive. In a printed wiring board consisting of a flexible portion and a rigid portion in which circuits are connected by through-hole plating, a coverlay is provided on the flexible portion, and no coverlay is provided on the flexible printed wiring board at the rigid portion. Flex-rigid printed wiring board. 【請求項２】 リジッド部分に形成されたスルーホール
メッキが、フレキシブル部分に設けたカバーレイの端面
から１mm以上離れていることを特徴とする請求項１記載
のフレックス・ リジッドプリント配線板。2. The flex-rigid printed wiring board according to claim 1, wherein the through-hole plating formed on the rigid portion is separated from the end face of the coverlay provided on the flexible portion by 1 mm or more.
JP20960992A 1992-07-13 1992-07-13 Flex-ridged printed wiring board Pending JPH0637408A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20960992A JPH0637408A (en) 1992-07-13 1992-07-13 Flex-ridged printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20960992A JPH0637408A (en) 1992-07-13 1992-07-13 Flex-ridged printed wiring board

Publications (1)

Publication Number Publication Date
JPH0637408A true JPH0637408A (en) 1994-02-10

Family

ID=16575643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20960992A Pending JPH0637408A (en) 1992-07-13 1992-07-13 Flex-ridged printed wiring board

Country Status (1)

Country Link
JP (1) JPH0637408A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105453A1 (en) * 1999-07-09 2004-12-02 Kenichi Hirahara Through hole electrical connection structure for flexible multilayer circuit board and method for forming the same
JP2006222330A (en) * 2005-02-14 2006-08-24 Nippon Mektron Ltd Multilayer flexible wiring circuit board and its manufacturing method
KR100661297B1 (en) * 2005-09-14 2006-12-26 삼성전기주식회사 Rigid-flexible printed circuit board for package on package, and manufacturing method
KR100674304B1 (en) * 2005-10-11 2007-01-24 삼성전기주식회사 Method for manufacturing of rigid-flexible printed circuit board
JP2007129153A (en) * 2005-11-07 2007-05-24 Cmk Corp Rigid-flex multilayer printed wiring board
JP2010040934A (en) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd Rigid flex circuit board
JP2012169523A (en) * 2011-02-16 2012-09-06 Nec Toppan Circuit Solutions Inc Manufacturing method of rigid flexible printed wiring board
JP2015005717A (en) * 2013-06-21 2015-01-08 サムソン エレクトロ−メカニックス カンパニーリミテッド． Rigid-flexible printed circuit board and method of manufacturing the same
CN110248500A (en) * 2019-06-24 2019-09-17 深圳华麟电路技术有限公司 Rigid Flex and its manufacture craft for telescopic camera
JP2020017589A (en) * 2018-07-24 2020-01-30 株式会社フジクラ Rigid flex multilayer wiring board
CN112601369A (en) * 2021-02-24 2021-04-02 福莱盈电子股份有限公司 Processing method of flexible circuit board for improving reliability of blind hole

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105453A1 (en) * 1999-07-09 2004-12-02 Kenichi Hirahara Through hole electrical connection structure for flexible multilayer circuit board and method for forming the same
JP4522282B2 (en) * 2005-02-14 2010-08-11 日本メクトロン株式会社 Manufacturing method of multilayer flexible circuit wiring board
JP2006222330A (en) * 2005-02-14 2006-08-24 Nippon Mektron Ltd Multilayer flexible wiring circuit board and its manufacturing method
KR100661297B1 (en) * 2005-09-14 2006-12-26 삼성전기주식회사 Rigid-flexible printed circuit board for package on package, and manufacturing method
US7802358B2 (en) 2005-09-14 2010-09-28 Samsung Electro-Mechanics Co., Ltd. Rigid-flexible printed circuit board manufacturing method for package on package
KR100674304B1 (en) * 2005-10-11 2007-01-24 삼성전기주식회사 Method for manufacturing of rigid-flexible printed circuit board
JP2007129153A (en) * 2005-11-07 2007-05-24 Cmk Corp Rigid-flex multilayer printed wiring board
JP2010040934A (en) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd Rigid flex circuit board
JP2012169523A (en) * 2011-02-16 2012-09-06 Nec Toppan Circuit Solutions Inc Manufacturing method of rigid flexible printed wiring board
JP2015005717A (en) * 2013-06-21 2015-01-08 サムソン エレクトロ−メカニックス カンパニーリミテッド． Rigid-flexible printed circuit board and method of manufacturing the same
JP2020017589A (en) * 2018-07-24 2020-01-30 株式会社フジクラ Rigid flex multilayer wiring board
CN110248500A (en) * 2019-06-24 2019-09-17 深圳华麟电路技术有限公司 Rigid Flex and its manufacture craft for telescopic camera
CN110248500B (en) * 2019-06-24 2021-05-04 深圳华麟电路技术有限公司 Rigid-flex board for telescopic camera and manufacturing process thereof
CN112601369A (en) * 2021-02-24 2021-04-02 福莱盈电子股份有限公司 Processing method of flexible circuit board for improving reliability of blind hole

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