JPH063684A - Tape carrier package for liquid crystal driver ic - Google Patents
Tape carrier package for liquid crystal driver icInfo
- Publication number
- JPH063684A JPH063684A JP4157944A JP15794492A JPH063684A JP H063684 A JPH063684 A JP H063684A JP 4157944 A JP4157944 A JP 4157944A JP 15794492 A JP15794492 A JP 15794492A JP H063684 A JPH063684 A JP H063684A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- tcp
- driver
- input
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、液晶表示装置のドライ
バIC用のテープキャリアパッケージに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package for a driver IC of a liquid crystal display device.
【0002】[0002]
【従来の技術】従来液晶表示装置におけるドライバIC
間の入出力信号の接続の関係を図5、図6、図7で示
す。一般的にドライバIC間の接続は基板(Printed Wir
ed Board) を介して例えば図7のように行われる。図5
は、従来のドライバICのTCP形状である。複数個の
ドライバICに共通な入出力信号用外部接続端子部51
を、TCP(Tape Carrier Package)の下側(液晶駆動出
力用外部接続端子部55の反対側)に配置し、この端子
部51とPWB71、72、75の接続用リード端子を
ハンダにて接続することにより、ドライバIC間の入出
力信号の接続を行っていた。例えば従来のPWBの縦寸
法H5 は15mm以上であった。2. Description of the Related Art A driver IC in a conventional liquid crystal display device
The relationship of connection of input / output signals between them is shown in FIGS. 5, 6 and 7. Generally, the connection between driver ICs is printed circuit board (Printed Wir
For example, as shown in FIG. Figure 5
Is a TCP shape of a conventional driver IC. External connection terminal portion 51 for input / output signals common to a plurality of driver ICs
Is arranged on the lower side of the TCP (Tape Carrier Package) (on the side opposite to the liquid crystal drive output external connection terminal portion 55), and this terminal portion 51 and the connection lead terminals of the PWBs 71, 72, and 75 are connected by soldering. Therefore, the input / output signals are connected between the driver ICs. For example, the vertical dimension H5 of the conventional PWB is 15 mm or more.
【0003】TCPのほぼ中央にドライバチップ57を
配置し、上側に液晶駆動出力用外部接続端子部55、下
側に入出力信号用外部接続端子部51(複数個のドライ
バICに共通)を有し端子S1 〜S7 を引き出してい
る。チップ部分は、樹脂によりカバーされ電気的・物理
的に保護されている。また、液晶駆動出力用外部接続端
子部分55は、一般的には異方性導電シートを介して、
直接液晶パネルに接続される。入出力用外部接続端子部
分51には、TCP機材を抜き取ったスリットを設けて
あり、PWBにハンダ接続することにより、複数個のド
ライバICに共通な信号を供給する事が可能である。A driver chip 57 is arranged substantially in the center of the TCP, a liquid crystal drive output external connection terminal portion 55 is provided on the upper side, and an input / output signal external connection terminal portion 51 (common to a plurality of driver ICs) is provided on the lower side. The terminals S 1 to S 7 are drawn out. The chip portion is covered with resin to be protected electrically and physically. In addition, the liquid crystal drive output external connection terminal portion 55 is generally provided with an anisotropic conductive sheet,
It is directly connected to the liquid crystal panel. The input / output external connection terminal portion 51 is provided with a slit from which the TCP material is extracted, and by soldering to the PWB, it is possible to supply a common signal to a plurality of driver ICs.
【0004】図6は、チップ57とTCPとの接続部分
の拡大図である。チップ上に設けられたパッド67とT
CPの中央部分に設けられたインナーリード64を熱的
に圧着することにより、電気的・物理的に接続される。
この場合、入出力信号用端子部51の端子S1 〜S
7 は、各信号に対して1本ずつであり、当然パッドも1
個ずつである。FIG. 6 is an enlarged view of a connecting portion between the chip 57 and TCP. Pad 67 and T provided on the chip
The inner leads 64 provided in the central portion of the CP are thermally pressure-bonded to electrically and physically connect them.
In this case, the terminals S 1 to S of the input / output signal terminal portion 51
7 is one for each signal, and naturally one pad
One by one.
【0005】図7は、従来の液晶モジュールの形態図で
ある。640(横方向)×400(縦方向)ドットのパ
ネルをイメージすると、上下に配されたセグメント・ド
ライバ8個は、それぞれ液晶駆動出力数が160本、左
側に配されたコモンドライバ4個は、それぞれ液晶駆動
出力数が100本である。FIG. 7 is a diagram of a conventional liquid crystal module. If you imagine a panel of 640 (horizontal direction) × 400 (vertical direction) dots, the eight segment drivers arranged above and below each have 160 LCD drive outputs, and the four common drivers arranged on the left side are: The number of liquid crystal drive outputs is 100 in each case.
【0006】[0006]
【発明が解決しようとする問題点】図5、図6、図7か
ら明らかなように、複数個のドライバICを共通接続す
る為に、パネルの上下と左側にPWBを配する必要が有
り、このことは必然的にパネルサイズの増大を招く。パ
ネルサイズの増大化は、ノート型パソコン等の小形化を
要求される機器においては、致命的マイナス要因とな
る。また、PWBの材料費及び設計開発費が別途必要と
なるため液晶モジュールの価格上昇を招く、等の問題点
を有していた。As is apparent from FIGS. 5, 6, and 7, it is necessary to arrange PWBs on the upper and lower sides and the left side of the panel in order to commonly connect a plurality of driver ICs. This inevitably leads to an increase in panel size. The increase in panel size is a fatal negative factor in devices such as notebook computers that require miniaturization. In addition, there is a problem in that the cost of the material for the PWB and the design and development costs are separately required, which causes an increase in the price of the liquid crystal module.
【0007】本発明の目的は、これらの問題点を廃した
液晶ドライバIC用のTCPを提供することにある。An object of the present invention is to provide a TCP for a liquid crystal driver IC which eliminates these problems.
【0008】[0008]
【問題を解決するための手段】本発明の液晶ドライバI
C用のテープキャリアパッケージは、左端および右端に
設けられた入出力信号用の外部接続端子と、この接続端
子に対応して中央部に設けられた一対の接続パッドとを
有し、一対の接続パッド間は液晶ドライバICの内部回
路を介して接続されていることを特徴とする。The liquid crystal driver I of the present invention
The tape carrier package for C has an external connection terminal for input / output signals provided at the left end and the right end, and a pair of connection pads provided in the central portion corresponding to the connection terminal, and has a pair of connection pads. The pads are connected to each other through an internal circuit of the liquid crystal driver IC.
【0009】[0009]
【作用】TCPの左右の両端部に有する二つの入出力信
号用外部接続端子は、入出力信号が対称であり同一信号
端子は各々導電材で接続されており、そのうちの一の端
子はTCP機材を部分的に抜き取ったスリット部を有し
ている。このTCPを液晶モジュールに用いた場合、連
続する両隣のTCP間において、第1のTCPと第2の
TCPの入出力信号用外部接続端子間を他の接続線・基
板等を用いること無く接続することができる。The two external input / output signal connection terminals at the left and right ends of the TCP have symmetrical input / output signals, and the same signal terminals are connected by a conductive material, one of which is a TCP device. It has a slit part that is partially removed. When this TCP is used in a liquid crystal module, the input / output signal external connection terminals of the first TCP and the second TCP are connected between the adjacent TCPs on both sides without using any other connection line or substrate. be able to.
【0010】[0010]
【実施例】本発明の一実施例を図に基づいて以下に説明
する。An embodiment of the present invention will be described below with reference to the drawings.
【0011】図1は、本発明の液晶表示装置におけるド
ライバICのTCP形状を表している。TCPの左右に
同一入出力信号(S1 〜S7 )用外部接続端子部11お
よび12を配置し、片側(本実施例では左側11)の該
部接続端子部にはTCP機材を抜き取ったスリット13
を設け、反対側(本実施例では右側12)の外部接続端
子にはハンダ接続可能なリード14を形成する。これに
より隣接IC間をPWBを介することなく直接接続する
ことが可能となる。FIG. 1 shows a TCP shape of a driver IC in the liquid crystal display device of the present invention. The external connection terminal portions 11 and 12 for the same input / output signals (S 1 to S 7 ) are arranged on the left and right sides of the TCP, and the slit for removing the TCP material is formed on the connection terminal portion on one side (the left side 11 in this embodiment). Thirteen
And a lead 14 capable of solder connection is formed on the external connection terminal on the opposite side (the right side 12 in this embodiment). As a result, it becomes possible to directly connect the adjacent ICs without passing through the PWB.
【0012】図2は、本発明のドライバICにおけるチ
ップ17とTCPとの接続部分の拡大図である。このチ
ップ17が図1のホール部20に取り付けられる。従来
技術と大きく異なる点は、チップ内部の左右に同一信号
(S1 〜S7 )用のパッド27が配されており、チップ
17の左右に有る同一信号用パッド27間が、チップ内
部の配線材料21にて、比較的低インピーダンスで接続
される。配線材料21は例えば、チップ上の2層目メ
タル、チップ上の金バンプ(TCP品のパッド部に形
成)などの導体で形成される。チップ17の上部には液
晶駆動用出力信号用23のパッド28が形成される。チ
ップ17の下部には基本的にパッドを配さない。ただ
し、チップとTCPの接続強度を確保する目的で、ダミ
ーパッドを配する場合も有る。FIG. 2 is an enlarged view of the connecting portion between the chip 17 and the TCP in the driver IC of the present invention. This chip 17 is attached to the hole 20 of FIG. A big difference from the prior art is that the pads 27 for the same signal (S 1 to S 7 ) are arranged on the left and right inside the chip, and the wiring between the pads 27 for the same signal on the left and right of the chip 17 is inside the chip. The material 21 is connected with a relatively low impedance. The wiring material 21 is formed of a conductor such as a second-layer metal on the chip and a gold bump (formed on the pad portion of the TCP product) on the chip. A pad 28 for a liquid crystal driving output signal 23 is formed on the chip 17. Basically, no pad is arranged below the chip 17. However, a dummy pad may be provided in order to secure the connection strength between the chip and the TCP.
【0013】図4は、本発明のドライバICにおけるI
C間の具体的接続手順を示したものである。TCPのス
リット13bの側の外部接続端子を上に配し、隣接IC
の接続リード14aの側を下に配し、位置合せをし双方
のリードを重ねてハンダ接続を行う。FIG. 4 shows the I in the driver IC of the present invention.
The concrete connection procedure between C is shown. The external connection terminal on the side of the TCP slit 13b is arranged on the upper
The side of the connection lead 14a is placed downwards, the positions are aligned, and both leads are overlapped for solder connection.
【0014】図3は、液晶モジュール形成例であって、
液晶パネルとTCPの接続例を示す。従来技術例の図7
と、全く同一のドット構成(640×400)をイメー
ジしており、パネル上下に本発明によるPWBを採用し
たセグメント・ドライバ8個(上下各4個)と、パネル
左側にコモン・ドライバ4個が使用されている。この場
合も、セグメントドライバは160出力、コモンドライ
バは100出力である。FIG. 3 shows an example of forming a liquid crystal module,
An example of connection between the liquid crystal panel and TCP is shown. FIG. 7 of a conventional technology example
The same dot configuration (640 × 400) is imaged, and there are 8 segment drivers (4 each on the upper and lower sides) adopting the PWB according to the present invention on the upper and lower sides of the panel and 4 common drivers on the left side of the panel. It is used. Also in this case, the segment driver has 160 outputs and the common driver has 100 outputs.
【0015】セグメントドライバ8個とコモンドライバ
4個の隣接デバイス間は重なり合ったTCP部分に形成
された接続リードにより、相互にハンダ接続される。す
なわち、セグメント側で6カ所(上下各3カ所)、コモ
ン側で3カ所である。また、コモンドライバとセグメン
トドライバ間も、同一方式で接続することが可能である
(この場合は、2カ所)。Adjacent devices of eight segment drivers and four common drivers are solder-connected to each other by connecting leads formed in the overlapping TCP portions. That is, there are 6 locations on the segment side (3 locations on the upper and lower sides) and 3 locations on the common side. Also, the common driver and the segment driver can be connected in the same manner (in this case, two places).
【0016】上述のように本発明によるドライバICの
TCPは形状を小さくすることが可能である。具体的な
比較として、図5に示す従来技術のTCPの縦寸法H5
が15mm以上でり、実施例の図1の同寸法H1 が6m
m以下である。As described above, the TCP of the driver IC according to the present invention can be reduced in shape. As a concrete comparison, the vertical dimension H5 of the conventional TCP shown in FIG.
Is 15 mm or more, and the same dimension H1 in FIG. 1 of the embodiment is 6 m.
m or less.
【0017】[0017]
【発明の効果】本発明の液晶ドライバIC用TCPは、
並列接続用の基板が不要となる。本発明のTCPを用い
た液晶モジュールは小型化・軽量化およびコストダウン
が図れる。The TCP for the liquid crystal driver IC of the present invention is
The board for parallel connection is unnecessary. The liquid crystal module using the TCP of the present invention can be reduced in size, weight and cost.
【図1】本発明の液晶ドライバIC用TCPの実施例を
示す図である。FIG. 1 is a diagram showing an embodiment of a TCP for a liquid crystal driver IC of the present invention.
【図2】図1の液晶ドライバIC用TCPとチップとの
接続部分の拡大図である。FIG. 2 is an enlarged view of a connecting portion between a liquid crystal driver IC TCP of FIG. 1 and a chip.
【図3】図1の液晶ドライバIC用TCPを用いた液晶
モジュールの構成例を表す図である。FIG. 3 is a diagram showing a configuration example of a liquid crystal module using the liquid crystal driver IC TCP of FIG.
【図4】図1の液晶ドライバIC用TCP間の接続形態
を表す図である。FIG. 4 is a diagram showing a connection configuration between TCPs for the liquid crystal driver IC of FIG.
【図5】従来技術の液晶ドライバIC用TCPを示す図
である。FIG. 5 is a diagram showing a conventional TCP for a liquid crystal driver IC.
【図6】従来技術の液晶ドライバIC用TCPとチップ
との接続部分の拡大図である。FIG. 6 is an enlarged view of a connection portion between a TCP for a liquid crystal driver IC and a chip according to the related art.
【図7】従来技術の液晶ドライバIC用TCPを用いた
液晶モジュールの構成例を表す図である。FIG. 7 is a diagram showing a configuration example of a liquid crystal module using a conventional TCP for a liquid crystal driver IC.
11、12 入出力信号用外部接続端子部 13 スリット 14 接続用リード 15 液晶駆動用外部接続端子部 17 チップ 21 メタルまたはバンプ 23 液晶駆動出力用信号 27、28 パッド 11, 12 I / O signal external connection terminal section 13 Slit 14 Connection lead 15 Liquid crystal drive external connection terminal section 17 Chip 21 Metal or bump 23 Liquid crystal drive output signal 27, 28 pad
Claims (1)
ッケージであって、左端および右端に設けられた入出力
信号用の外部接続端子と、該接続端子に対応して中央部
に設けられた一対の接続パッドとを有し、前記一対の接
続パッド間は前記液晶ドライバICの内部回路を介して
接続されていることを特徴とする液晶ドライバIC用の
テープキャリアパッケージ。1. A tape carrier package for a liquid crystal driver IC, comprising external connection terminals for input / output signals provided at left and right ends, and a pair of connections provided at a central portion corresponding to the connection terminals. A tape carrier package for a liquid crystal driver IC, comprising a pad, and the pair of connection pads are connected via an internal circuit of the liquid crystal driver IC.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4157944A JP2837027B2 (en) | 1992-06-17 | 1992-06-17 | Tape carrier package |
TW082101042A TW232065B (en) | 1992-04-16 | 1993-02-15 | |
US08/019,907 US5402255A (en) | 1992-04-16 | 1993-02-19 | Liquid crystal panel module and tape carrier package for liquid crystal driver IC |
DE69334083T DE69334083T2 (en) | 1992-04-16 | 1993-02-23 | Liquid crystal disk module and tape carrier package |
EP93301294A EP0567209B1 (en) | 1992-04-16 | 1993-02-23 | Liquid crystal panel module and tape carrier package |
KR1019930002518A KR0140970B1 (en) | 1992-04-16 | 1993-02-23 | Liquid crystal panel module and tape carrier package for liquid crystal driver ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4157944A JP2837027B2 (en) | 1992-06-17 | 1992-06-17 | Tape carrier package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH063684A true JPH063684A (en) | 1994-01-14 |
JP2837027B2 JP2837027B2 (en) | 1998-12-14 |
Family
ID=15660887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4157944A Expired - Lifetime JP2837027B2 (en) | 1992-04-16 | 1992-06-17 | Tape carrier package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2837027B2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100240431B1 (en) * | 1995-03-20 | 2000-01-15 | 니시무로 타이죠 | Displaying device |
US6191471B1 (en) | 1998-08-27 | 2001-02-20 | Sharp Kabushiki Kaisha | Tape carrier package with two regions having leds that connect upon folding |
US6476789B1 (en) | 1998-11-20 | 2002-11-05 | Sharp Kabushiki Kaisha | System construction of semiconductor devices and liquid crystal display device module using the same |
KR100386537B1 (en) * | 1999-02-02 | 2003-06-02 | 샤프 가부시키가이샤 | Low-cost tape carrier package and liquid crystal module using the same |
US6697041B1 (en) | 1999-01-28 | 2004-02-24 | Sharp Kabushiki Kaisha | Display drive device and liquid crystal module incorporating the same |
US6771248B2 (en) | 2000-10-27 | 2004-08-03 | Sharp Kabushiki Kaisha | Display module |
US6819387B1 (en) | 1999-01-04 | 2004-11-16 | Sharp Kabushiki Kaisha | Liquid-crystal-panel driver IC package, and liquid crystal panel module |
US7002812B2 (en) | 2002-10-28 | 2006-02-21 | Sharp Kabushiki Kaisha | Electronic module and method for fabricating the same |
WO2006022371A1 (en) * | 2004-08-26 | 2006-03-02 | Sharp Kabushiki Kaisha | Display module |
KR100665184B1 (en) * | 2003-11-26 | 2007-01-04 | 삼성전자주식회사 | Semiconductor chip, Tape Carrier PackageTCP mounted on the chip and Liquid Crystal Display device including the TCP |
US7420821B2 (en) | 2002-09-03 | 2008-09-02 | Sharp Kabushiki Kaisha | Electronic module and driving circuit board therefor |
US7683471B2 (en) | 2005-07-18 | 2010-03-23 | Samsung Electronics Co., Ltd. | Display driver integrated circuit device, film, and module |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4256717B2 (en) | 2003-05-14 | 2009-04-22 | シャープ株式会社 | Liquid crystal drive device and liquid crystal display device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0420933A (en) * | 1990-05-16 | 1992-01-24 | Hitachi Ltd | Liquid crystal display device |
-
1992
- 1992-06-17 JP JP4157944A patent/JP2837027B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0420933A (en) * | 1990-05-16 | 1992-01-24 | Hitachi Ltd | Liquid crystal display device |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100240431B1 (en) * | 1995-03-20 | 2000-01-15 | 니시무로 타이죠 | Displaying device |
US6191471B1 (en) | 1998-08-27 | 2001-02-20 | Sharp Kabushiki Kaisha | Tape carrier package with two regions having leds that connect upon folding |
US6476789B1 (en) | 1998-11-20 | 2002-11-05 | Sharp Kabushiki Kaisha | System construction of semiconductor devices and liquid crystal display device module using the same |
US6819387B1 (en) | 1999-01-04 | 2004-11-16 | Sharp Kabushiki Kaisha | Liquid-crystal-panel driver IC package, and liquid crystal panel module |
US6697041B1 (en) | 1999-01-28 | 2004-02-24 | Sharp Kabushiki Kaisha | Display drive device and liquid crystal module incorporating the same |
KR100386537B1 (en) * | 1999-02-02 | 2003-06-02 | 샤프 가부시키가이샤 | Low-cost tape carrier package and liquid crystal module using the same |
US6771248B2 (en) | 2000-10-27 | 2004-08-03 | Sharp Kabushiki Kaisha | Display module |
US7420821B2 (en) | 2002-09-03 | 2008-09-02 | Sharp Kabushiki Kaisha | Electronic module and driving circuit board therefor |
US7002812B2 (en) | 2002-10-28 | 2006-02-21 | Sharp Kabushiki Kaisha | Electronic module and method for fabricating the same |
KR100665184B1 (en) * | 2003-11-26 | 2007-01-04 | 삼성전자주식회사 | Semiconductor chip, Tape Carrier PackageTCP mounted on the chip and Liquid Crystal Display device including the TCP |
WO2006022371A1 (en) * | 2004-08-26 | 2006-03-02 | Sharp Kabushiki Kaisha | Display module |
US7683471B2 (en) | 2005-07-18 | 2010-03-23 | Samsung Electronics Co., Ltd. | Display driver integrated circuit device, film, and module |
US7999341B2 (en) | 2005-07-18 | 2011-08-16 | Samsung Electronics Co., Ltd. | Display driver integrated circuit device, film, and module |
Also Published As
Publication number | Publication date |
---|---|
JP2837027B2 (en) | 1998-12-14 |
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