JPH06350370A

JPH06350370A - Manufacture of piezoelectric resonator

Info

Publication number: JPH06350370A
Application number: JP13188593A
Authority: JP
Inventors: Yasuhiro Tanaka; 康廣田中
Original assignee: Murata Manufacturing Co Ltd
Current assignee: Murata Manufacturing Co Ltd
Priority date: 1993-06-02
Filing date: 1993-06-02
Publication date: 1994-12-22

Abstract

PURPOSE:To prevent exfoliation of a damping material when a piezoelectric resonator is cut off from a mother piezoelectric resonator by providing the damping material to an upper part of a vibration electrode on both sides of the mother piezoelectric substrate and a part slightly wider than the part and providing a hard film on the material to protect the damping material. CONSTITUTION:An internal electrode 2 integrated with a vibration electrode 2a and a lead electrode 2b is provided to a front side and a rear side of a mother piezoelectric substrate 1. In this case, the electrode 2 is provided so that the electrodes 2a are opposite to each other in the middle point of the substrate 1 and the electrodes 2b are led out in the opposite direction of the ends of the substrate 1 respectively. A damping material 3 such as Si is provided to a part slightly wider than the area of the electrode 2a by screen print or the like. An epoxy resin or the like is coated onto the damping material 3 and a part slightly wider than the material 3 and cured to form a hard film 4. A recessed substrate 5 is adhered to both sides of the substrate 1 to form a mother piezoelectric resonator 6. The mother piezoelectric resonator 6 is cut off along dotted lines 7 to obtain piezoelectric resonators 6a. A side plate 8 is adhered to a space at both sides of the resonator 6a so as not to disturb the vibration of the electrode 2a. Then an external electrode in continuity with the electrode 2b is provided to a ridge of the substrates 1, 5 and the side plate 8.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、圧電共振子の製造方法
に関し、特に厚み滑り振動モードを利用する圧電共振子
の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a piezoelectric resonator, and more particularly to a method for manufacturing a piezoelectric resonator utilizing a thickness shear vibration mode.

【０００２】[0002]

【従来の技術】従来、この種の圧電共振子の製造方法と
しては、図８に示すように、マザー圧電基板１の両面
に、振動電極２ａと引出し電極２ｂとを一体にした内部
電極２を、振動電極２ａが表裏対向するように且つ引出
し電極２ｂがそれぞれ反対方向にマザー圧電基板１の端
縁まで導出されるように設ける工程と、このマザー圧電
基板１の両面に凹形保護基板５をそれぞれ張り合わせて
マザー圧電共振子６を作る工程と、このマザー圧電共振
子の空間部にダンピング材３を注入する工程と、そし
て、マザー圧電共振子６を点線７で切断して、圧電共振
子を切り出す工程と、よりなるものである。2. Description of the Related Art Conventionally, as a method of manufacturing a piezoelectric resonator of this type, as shown in FIG. 8, an internal electrode 2 in which a vibrating electrode 2a and an extraction electrode 2b are integrated is formed on both surfaces of a mother piezoelectric substrate 1. , A step of providing the vibrating electrodes 2a so as to face each other and the lead-out electrodes 2b extending in opposite directions to the edges of the mother piezoelectric substrate 1, and the concave protective substrates 5 on both surfaces of the mother piezoelectric substrate 1. The step of making the mother piezoelectric resonator 6 by bonding them together, the step of injecting the damping material 3 into the space of this mother piezoelectric resonator, and the step of cutting the mother piezoelectric resonator 6 along the dotted line 7 It consists of a cutting process.

【０００３】[0003]

【発明が解決しようとする課題】しかし、この従来製造
方法においては、ダンピング材の注入工程でダンピング
材が必要以上に充填され、且つダンピング材が弾性を持
っているので、圧電共振子の切り出し時に、ダンピング
材が剥がれるという欠点があった。また、ダンピング剤
がうまく全域にいきわたっているかどうか判らないとい
う欠点もあった。それゆえに、切り出し時に剥がれた
り、またダンピング剤がよくいきわたっていないと、圧
電共振子はダンピング不十分になるので、良好な特性が
得られないということがあった。However, in this conventional manufacturing method, the damping material is filled more than necessary in the step of injecting the damping material, and the damping material has elasticity, so that when the piezoelectric resonator is cut out. However, there was a drawback that the damping material came off. In addition, there is also a drawback that it is not known whether the damping agent has spread all over the area. Therefore, if the piezoelectric resonator is not peeled off at the time of cutting out and the damping agent is not spread well, the piezoelectric resonator may be insufficiently damped, and good characteristics may not be obtained.

【０００４】したがって、本発明の目的は、マザー圧電
共振子の切り出し時に、ダンピング材が剥がれることが
なく、ダンピング材が必要量かつ確実について、特性の
揃った圧電共振子の製造方法を提供することを目的とす
る。Therefore, it is an object of the present invention to provide a method of manufacturing a piezoelectric resonator in which the damping material is not peeled off when the mother piezoelectric resonator is cut out, and the damping material is required in quantity and surely in characteristics. With the goal.

【０００５】[0005]

【課題を解決するための手段】したがって、本発明は上
記目的を達成するために、マザー圧電基板の両面に、振
動電極と引出し電極とよりなる内部電極を、振動電極は
両面で対向するように且つ引出し電極はそれぞれ反対方
向に端辺まで導出されるように、それぞれ設ける工程
と、両面の振動電極上部およびその領域よりやや広い部
分に、ダンピング材をそれぞれ設ける工程と、このダン
ピング材の上部およびその領域よりやや広い部分に、硬
質被膜を設ける工程と、マザー圧電基板の両面に、所定
の空間を形成するように保護基板をそれぞれ接着してマ
ザー圧電共振子を作る工程と、このマザー圧電共振子を
切断して圧電共振子を作る工程と、よりなる圧電共振子
の製造方法としたものである。Therefore, in order to achieve the above object, the present invention provides an internal electrode composed of a vibrating electrode and a lead electrode on both sides of a mother piezoelectric substrate so that the vibrating electrodes face each other on both sides. In addition, the extraction electrodes are provided so as to be led out in opposite directions to the end sides, respectively, the step of providing a damping material on the vibrating electrodes on both surfaces and a portion slightly wider than the area, and the upper part of the damping material. A step of forming a hard coating on a portion slightly wider than the area, a step of adhering protective substrates to both sides of the mother piezoelectric substrate to form a predetermined space to make a mother piezoelectric resonator, and this mother piezoelectric resonance This is a method of manufacturing a piezoelectric resonator including a step of cutting a child to make a piezoelectric resonator.

【０００６】[0006]

【作用】本発明に係る圧電共振子の製造方法は、マザー
圧電基板の両面の振動電極の上部およびその領域よりや
や広い部分にダンピング材を必要量設け、且つこのダン
ピング材の上部およびその領域よりやや広い部分に硬質
被膜を設けて、弾性を有するダンピング材をこの硬質被
膜で保護するので、圧電共振子の切り出し時に、ダンピ
ング材が剥がれるようなことがなくなる。したがって、
本製造方法により製造された圧電共振子は、ダンピング
材が、必要量且つ確実に付いているので、ダンピング特
性の揃ったものとなる。In the method of manufacturing a piezoelectric resonator according to the present invention, a necessary amount of damping material is provided on a portion slightly wider than the upper portion and the area of the vibrating electrodes on both surfaces of the mother piezoelectric substrate, and the upper portion and the area of the damping material are provided. Since the hard coating is provided on a slightly wide portion and the damping material having elasticity is protected by the hard coating, the damping material does not come off when the piezoelectric resonator is cut out. Therefore,
The piezoelectric resonator manufactured by this manufacturing method has the necessary amount of the damping material and is surely attached, so that the damping characteristics are uniform.

【０００７】[0007]

【実施例】以下に、本発明の一実施例に係る２端子形デ
ィスクリミネータの製造方法について図面を参照して説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a two-terminal discriminator according to an embodiment of the present invention will be described below with reference to the drawings.

【０００８】図１は電極形成工程を示すものである。同
図において、１は厚み滑り振動モード用のマザー圧電基
板で、このマザー圧電基板１の表裏には、振動電極２ａ
と引出し電極２ｂとが一体となった内部電極２が、設け
られる。その場合、マザー圧電基板１の中央帯で振動電
極２ａが対向し、且つ引出し電極２ｂがそれぞれマザー
圧電基板１の端縁の反対方向に導出するように、設けら
れる。FIG. 1 shows an electrode forming process. In the figure, reference numeral 1 is a mother piezoelectric substrate for the thickness shear vibration mode, and a vibrating electrode 2a is provided on the front and back of the mother piezoelectric substrate 1.
An internal electrode 2 in which the extraction electrode 2b and the extraction electrode 2b are integrated is provided. In that case, the vibrating electrodes 2a are opposed to each other in the central zone of the mother piezoelectric substrate 1, and the extraction electrodes 2b are provided so as to be led out in directions opposite to the edges of the mother piezoelectric substrate 1, respectively.

【０００９】図２はダンピング材形成工程を示すもの
で、図２の工程で形成された表裏の内部電極２の振動電
極２ａ領域よりやや広い部分に、スクリーン印刷等でシ
リコン等のダンピング材３を設けるものである。FIG. 2 shows a damping material forming step. A damping material 3 such as silicon is screen-printed on a portion of the front and back internal electrodes 2 formed in the step of FIG. It is provided.

【００１０】図３は硬質被膜形成工程を示すもので、図
２の工程で形成された表裏のダンピング材３上およびそ
の領域よりやや広い部分に、スクリーン印刷等でエポキ
シ樹脂等を塗布し、硬化させて硬質被膜４を設けるもの
である。FIG. 3 shows a process of forming a hard coating. An epoxy resin or the like is applied by screen printing or the like to the damping material 3 on the front and back formed in the process of FIG. Then, the hard coating 4 is provided.

【００１１】図４の工程は、前工程で処理されたマザー
圧電基板１の両側に、凹形保護基板５をそれぞれ接着し
て、図５に示すマザー圧電共振子６を作るものである。In the process shown in FIG. 4, the concave protective substrates 5 are adhered to both sides of the mother piezoelectric substrate 1 processed in the previous process, and the mother piezoelectric resonator 6 shown in FIG. 5 is produced.

【００１２】図５の工程は、図４の工程で作られたマザ
ー圧電共振子６を、点線７で切断して図６に示す圧電共
振子６ａを作るものである。In the process of FIG. 5, the mother piezoelectric resonator 6 produced in the process of FIG. 4 is cut along a dotted line 7 to produce the piezoelectric resonator 6a shown in FIG.

【００１３】図６の工程は、圧電共振子６ａの両サイド
の空部に、振動電極２ａの振動を疎外しないように、側
板８をそれぞれ接着するものである。In the step shown in FIG. 6, the side plates 8 are bonded to the vacant portions on both sides of the piezoelectric resonator 6a so as not to isolate the vibration of the vibrating electrode 2a.

【００１４】図７の工程は、図６の工程で圧電共振子６
ａに側板８がそれぞれ接着されたものに、引出し電極２
ｂと電気的に導通する外部電極９を、圧電基板１、保護
基板５および側板８の端縁部にそれぞれ設けるものであ
る。The process of FIG. 7 is the same as the process of FIG.
a with the side plate 8 adhered to a and the lead electrode 2
The external electrodes 9 electrically connected to b are provided at the edge portions of the piezoelectric substrate 1, the protective substrate 5, and the side plate 8, respectively.

【００１５】なお、図６以降の工程については、本実施
例で示した製造方法以外にもいろいろな製造方法が考え
られるところである。Regarding the steps after FIG. 6, various manufacturing methods other than the manufacturing method shown in this embodiment can be considered.

【００１６】上記製造方法で製造された圧電共振子は、
次の通りである。すなわち、厚み滑り振動をする圧電基
板１の両面中央部に対向する振動電極２ａが設けられ、
この振動電極２ａからはそれぞれ反対方向に引出し電極
２ｂが圧電基板１の端縁まで導出され、振動電極２ａの
上部およびその領域よりやや広い部分にシリコン等のダ
ンピング材３が設けられ、このダンピング材３の上部お
よびその領域よりやや広い部分にエポキシ樹脂等の硬質
被膜４が設けられ、圧電基板１の両面に凹形保護基板５
がそれぞれ接着され、この保護基板５の両側の空部に側
板８がそれぞれ接着され、そして引出し電極２ｂと電気
的に導通する外部電極９が圧電基板１、凹形保護基板５
そして側板８の端縁部にそれぞれ設けられている圧電共
振子となる。The piezoelectric resonator manufactured by the above manufacturing method is
It is as follows. That is, the vibrating electrodes 2a facing the central portions of both surfaces of the piezoelectric substrate 1 that vibrates the thickness shear vibration are provided.
Extraction electrodes 2b are led out from the vibrating electrode 2a in opposite directions to the edge of the piezoelectric substrate 1, and a damping material 3 made of silicon or the like is provided on the upper portion of the vibrating electrode 2a and a portion slightly wider than the area. A hard coating 4 such as an epoxy resin is provided on the upper part of 3 and a portion slightly wider than the area, and a concave protective substrate 5 is formed on both surfaces of the piezoelectric substrate 1.
Are bonded together, the side plates 8 are bonded to the vacant portions on both sides of the protective substrate 5, and the external electrodes 9 electrically connected to the extraction electrodes 2b are the piezoelectric substrate 1 and the concave protective substrate 5 respectively.
Then, the piezoelectric resonators are respectively provided on the edge portions of the side plate 8.

【００１７】[0017]

【発明の効果】したがって、本発明に係る製造方法は、
マザー圧電基板の両面の振動電極上部およあびその領域
よりやや広い部分にダンピング材を必要量設け、且つこ
のダンピング材の上部およびその領域よりやや広い部分
に硬質被膜を設けて、弾性を有するダンピング材をこの
硬質被膜で保護するので、圧電共振子の切り出し時に、
ダンピング材が剥がれるようなことはなくなる。したが
って、本製造方法により製造された圧電共振子は、ダン
ピング材が、必要量且つ確実に付いているので、ダンピ
ング特性の揃ったものとなる。Therefore, the manufacturing method according to the present invention is
Damping with elasticity by providing a necessary amount of damping material on the upper part of the vibration electrode on both sides of the mother piezoelectric substrate and a part slightly wider than that area, and by providing a hard coating on the upper part of this damping material and a part wider than that area Since the material is protected by this hard coating, when cutting out the piezoelectric resonator,
The damping material will not come off. Therefore, the piezoelectric resonator manufactured by the manufacturing method according to the present invention has the necessary amount of the damping material and is surely attached, so that the damping characteristics are uniform.

【図面の簡単な説明】[Brief description of drawings]

【図１】厚み振動モード用のマザー圧電基板に電極を
形成する工程図FIG. 1 is a process diagram of forming electrodes on a mother piezoelectric substrate for a thickness vibration mode.

【図２】図１に示す振動電極の上部およびその領域よ
りやや広い部分にダンピング材を形成する工程図FIG. 2 is a process diagram of forming a damping material in the upper portion of the vibrating electrode shown in FIG. 1 and a portion slightly wider than the region.

【図３】図２に示すダンピング材の上部およびその領
域よりやや広い部分に硬質被膜を形成する工程図FIG. 3 is a process drawing of forming a hard coating on the upper portion of the damping material shown in FIG. 2 and a portion slightly wider than the area.

【図４】図３に示すマザー圧電基板の両面に凹形保護
基板を接着してマザー圧電共振子を作る工程図FIG. 4 is a process diagram of making a mother piezoelectric resonator by bonding concave protective substrates to both surfaces of the mother piezoelectric substrate shown in FIG.

【図５】マザー圧電共振子を切断して圧電共振子を作
る工程図FIG. 5: Process diagram for cutting a mother piezoelectric resonator to make a piezoelectric resonator

【図６】圧電共振子の両側空部に側板をそれぞれ接着
する工程図FIG. 6 is a process diagram of bonding side plates to the vacant spaces on both sides of the piezoelectric resonator.

【図７】引出し電極と電気的に導通する外部電極を圧
電基板、保護基板および側板の端縁部に設ける工程図FIG. 7 is a process diagram in which an external electrode electrically connected to a lead electrode is provided on an edge portion of a piezoelectric substrate, a protective substrate, and a side plate.

【図８】従来の圧電共振子の製造方法の工程説明図FIG. 8 is an explanatory process diagram of a conventional method for manufacturing a piezoelectric resonator.

【符号の説明】[Explanation of symbols]

１マザー圧電基板２内部電極２ａ振動電極２ｂ引出し電極３ダンピング材４硬質被膜５保護基板６マザー圧電共振子６ａ圧電共振子７点線８側板９外部電極 1 Mother Piezoelectric Substrate 2 Internal Electrode 2a Vibration Electrode 2b Lead-out Electrode 3 Damping Material 4 Hard Coating 5 Protective Substrate 6 Mother Piezoelectric Resonator 6a Piezoelectric Resonator 7 Dotted Line 8 Side Plate 9 External Electrode

Claims

【特許請求の範囲】[Claims]

【請求項１】マザー圧電基板の両面に、振動電極と引
出し電極とよりなる内部電極を、振動電極は両面で対向
するように且つ引出し電極はそれぞれ反対方向に端辺ま
で導出されるように、それぞれ設ける工程と、両面の振
動電極上部およびその領域よりやや広い部分に、ダンピ
ング材をそれぞれ設ける工程と、このダンピング材の上
部およびその領域よりやや広い部分に、硬質被膜を設け
る工程と、マザー圧電基板の両面に、所定の空間を形成
するように保護基板をそれぞれ接着してマザー圧電共振
子を作る工程と、このマザー圧電共振子を切断して圧電
共振子を作る工程と、よりなる圧電共振子の製造方法。1. An internal electrode composed of a vibrating electrode and a lead electrode is provided on both sides of a mother piezoelectric substrate so that the vibrating electrodes face each other on both sides and the lead electrodes are led out in opposite directions to the edges. The step of providing each, the step of providing a damping material on the upper surface of the vibrating electrode on both sides and a portion slightly wider than that area, the step of providing a hard coating on the upper portion of this damping material and a portion slightly wider than that area, and Piezoelectric resonance comprising the steps of bonding protective substrates to form a predetermined space on both sides of the substrate to form a mother piezoelectric resonator, and cutting the mother piezoelectric resonator to form a piezoelectric resonator. Child manufacturing method.