JPH06338474A - Longitudinal cover boat - Google Patents
Longitudinal cover boatInfo
- Publication number
- JPH06338474A JPH06338474A JP14865793A JP14865793A JPH06338474A JP H06338474 A JPH06338474 A JP H06338474A JP 14865793 A JP14865793 A JP 14865793A JP 14865793 A JP14865793 A JP 14865793A JP H06338474 A JPH06338474 A JP H06338474A
- Authority
- JP
- Japan
- Prior art keywords
- boat
- cover
- side wall
- furnace
- vertical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体製造装置に於いて
拡散、化学気相成長等の処理を行う場合にウェーハを水
平姿勢で多段に保持する縦型ボート特に縦型カバーボー
トに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vertical boat for holding wafers in a horizontal posture in multiple stages in the case of carrying out processes such as diffusion and chemical vapor deposition in a semiconductor manufacturing apparatus, and more particularly to a vertical cover boat. .
【０００２】[0002]
【従来の技術】図４により縦型炉を具備した縦型半導体
製造装置の概略を説明する。2. Description of the Related Art An outline of a vertical semiconductor manufacturing apparatus equipped with a vertical furnace will be described with reference to FIG.
【０００３】筐体１内部の上方に縦型炉２が設けられ、
該縦型炉２の下方にボートエレベータ３が設けられてい
る。該ボートエレベータ３の昇降スライダ４には前記縦
型炉２の一部をなす炉口下部５が設けられ、該炉口下部
５にはボートキャップ２２を介してボート６が載置され
る。該ボート６には被処理物であるウェーハ７が水平姿
勢で多段に挿入され保持されている。A vertical furnace 2 is provided above the inside of the casing 1.
A boat elevator 3 is provided below the vertical furnace 2. The elevator slider 4 of the boat elevator 3 is provided with a furnace opening lower part 5 forming a part of the vertical furnace 2, and a boat 6 is mounted on the furnace opening lower part 5 via a boat cap 22. Wafers 7, which are objects to be processed, are horizontally inserted into and held in the boat 6 in multiple stages.
【０００４】前記ボートエレベータ３の側方にウェーハ
移載機８が設けられ、該ウェーハ移載機８の更に側方に
カセット棚９が設けられている。該カセット棚９はウェ
ーハカセット１０を所要数収納し、ウェーハ７の半導体
製造装置への搬入、搬出はウェーハカセット１０に装填
した状態で行われる。A wafer transfer machine 8 is provided on the side of the boat elevator 3, and a cassette shelf 9 is provided further on the side of the wafer transfer machine 8. The cassette shelf 9 stores a required number of wafer cassettes 10, and the wafers 7 are loaded into and unloaded from the semiconductor manufacturing apparatus while the wafer cassettes 10 are loaded.
【０００５】前記ボートエレベータ３はウェーハ７が挿
入されたボート６を前記縦型炉２に装入し、又ボート６
を装入することで前記炉口下部５が高温縦型炉２の炉口
部を閉塞する。縦型炉２内に反応ガスを導入しつつウェ
ーハ７を加熱し、ウェーハ７に所要の処理をする。In the boat elevator 3, the boat 6 having the wafer 7 inserted therein is loaded into the vertical furnace 2.
The furnace lower part 5 closes the furnace opening of the high-temperature vertical furnace 2 by charging. The wafer 7 is heated while introducing the reaction gas into the vertical furnace 2, and the wafer 7 is subjected to required processing.
【０００６】処理が完了すると前記ボートエレベータ３
によりボート６が引出され、前記ウェーハ移載機８によ
り処理ウェーハ７のカセット棚９への移載、未処理ウェ
ーハのカセット棚９からボート６への移載が行われる。When the processing is completed, the boat elevator 3
Thus, the boat 6 is pulled out, and the wafer transfer machine 8 transfers the processed wafers 7 to the cassette shelf 9 and transfers the unprocessed wafers from the cassette shelf 9 to the boat 6.
【０００７】斯かる半導体製造装置に於いて、縦型炉２
内の反応ガスの流れ分布はウェーハ上の成膜品質に大き
く影響を与える。この為、縦型炉内に導入された反応ガ
スの流れの影響を少なくする為、縦型カバーボートが使
用されるものがある。In such a semiconductor manufacturing apparatus, the vertical furnace 2
The flow distribution of the reaction gas inside the chamber greatly affects the film formation quality on the wafer. Therefore, in order to reduce the influence of the flow of the reaction gas introduced into the vertical furnace, a vertical cover boat is used in some cases.
【０００８】従来の縦型カバーボートについて図５によ
り説明する。A conventional vertical cover boat will be described with reference to FIG.
【０００９】縦型カバーボートは軸心を含む平面で分割
した２分割構造であり、前記ボートエレベータ３側には
昇降カバー部１１が設けられ、縦型炉２側には固定カバ
ー部１２が設けられており、前記昇降カバー部１１にウ
ェーハ保持柱１３が設けられ、該ウェーハ保持柱１３は
所要ピッチで刻設された溝１４を具備し、該溝１４に前
記ウェーハ７が挿入保持される様になっている。又、昇
降カバー部１１、固定カバー部１２それぞれには母線方
向に沿って反応ガス導入用のスリット孔１５が穿設され
ている。The vertical cover boat has a two-divided structure in which the vertical cover boat is divided into planes including the axis. An elevating cover portion 11 is provided on the boat elevator 3 side, and a fixed cover portion 12 is provided on the vertical furnace 2 side. The elevating cover portion 11 is provided with a wafer holding column 13, and the wafer holding column 13 is provided with a groove 14 engraved at a required pitch so that the wafer 7 is inserted and held in the groove 14. It has become. Further, slit holes 15 for introducing a reaction gas are formed in each of the lift cover portion 11 and the fixed cover portion 12 along the generatrix direction.
【００１０】前記昇降カバー部１１を降下させた状態で
ウェーハ７を装填し、ボートエレベータ３により前記昇
降カバー部１１を炉内に装入する。縦型炉２内では前記
昇降カバー部１１と前記固定カバー部１２が合致し、ウ
ェーハ７を囲繞する縦型カバーボートとなる。Wafers 7 are loaded in a state where the elevating cover portion 11 is lowered, and the elevating cover portion 11 is loaded into the furnace by the boat elevator 3. In the vertical furnace 2, the elevating cover part 11 and the fixed cover part 12 are aligned with each other to form a vertical cover boat that surrounds the wafer 7.
【００１１】前記した様に、昇降カバー部１１へのウェ
ーハ７の移載はウェーハ移載機８で行われるが、組立て
時、或は保守時にウェーハ移載機８と昇降カバー部１１
との位置合わせを行わなければならない。この位置合わ
せ作業は人手作業となるが、前記昇降カバー部１１と前
記ウェーハ移載機８の位置関係から、作業者が昇降カバ
ー部１１とウェーハ移載機８の相対位置を観察するの
は、昇降カバー部１１の背面側から前記スリット孔１５
を通して行っている。As described above, the wafer 7 is transferred to the lift cover section 11 by the wafer transfer machine 8. However, the wafer transfer machine 8 and the lift cover section 11 are assembled or assembled at the time of maintenance.
Must be aligned with. This alignment work is a manual work, but the operator observes the relative positions of the lift cover unit 11 and the wafer transfer machine 8 from the positional relationship between the lift cover unit 11 and the wafer transfer machine 8. The slit hole 15 is provided from the rear side of the lifting cover portion 11.
Are going through.
【００１２】[0012]
【発明が解決しようとする課題】従来の縦型カバーボー
トでは昇降カバー部１１とウェーハ移載機８との位置合
わせ作業をスリット孔１５より監視して行っていたの
で、作業者の視界が昇降カバー部１１によって大部分遮
られ、位置合わせが非常に困難であり、多くの時間を要
していた。In the conventional vertical cover boat, the work of aligning the lift cover 11 and the wafer transfer machine 8 is monitored through the slit holes 15, so that the operator's field of view moves up and down. Most of the light was blocked by the cover portion 11, alignment was extremely difficult, and a lot of time was required.
【００１３】本発明は斯かる実情に鑑み、昇降カバー部
とウェーハ移載機との位置合わせが容易に行える様にし
たものである。In view of the above situation, the present invention has made it possible to easily align the position of the lift cover and the wafer transfer machine.
【００１４】[0014]
【課題を解決するための手段】本発明は、縦型炉内でウ
ェーハを覆った状態で保持する縦型半導体製造装置の縦
型カバーボートに於いて、該縦型カバーボートが前記炉
内に装入引出し可能な昇降カバー部と前記縦型炉内に設
けられる固定カバー部から成り、前記昇降カバー部の側
壁板の少なくとも１つを着脱可能としたことを特徴とす
るものである。The present invention provides a vertical cover boat for a vertical semiconductor manufacturing apparatus for holding a wafer in a vertical furnace in a state of covering the wafer in the furnace. It is characterized in that it comprises an elevating cover part that can be loaded and withdrawn and a fixed cover part that is provided in the vertical furnace, and that at least one of the side wall plates of the elevating cover part is removable.
【００１５】[0015]
【作用】前記昇降カバー部の側壁板の少なくとも１つを
取外すことで視界が広がり、昇降カバー部と縦型カバー
ボートへウェーハを移載するウェーハ移載機との位置合
わせが容易になる。By removing at least one of the side wall plates of the elevating cover section, the field of view is widened, and the alignment between the elevating cover section and the wafer transfer machine for transferring wafers to the vertical cover boat is facilitated.
【００１６】[0016]
【実施例】以下、図面を参照しつつ本発明の一実施例を
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１７】図１、図２中、図５中で示したものと同一
の機能を有するものには同符号を付してある。In FIGS. 1 and 2, those having the same functions as those shown in FIG. 5 are designated by the same reference numerals.
【００１８】昇降カバー部１１は下部リング１６の周辺
にウェーハ保持柱１３と短冊状の側壁板１７、側壁板１
８を適宜な間隙を明けて立設し、該ウェーハ保持柱１
３、側壁板１７、側壁板１８の上端を上部リング１９で
連結固定する。前記間隙はスリット孔１５を形成する。The elevating cover portion 11 has a wafer holding column 13, a strip-shaped side wall plate 17, and a side wall plate 1 around the lower ring 16.
8 are erected with an appropriate gap, and the wafer holding column 1
3, the upper ends of the side wall plates 17 and 18 are connected and fixed by the upper ring 19. The gap forms a slit hole 15.
【００１９】前記側壁板１７、側壁板１８の内前記ウェ
ーハ移載機８に対峙する位置の側壁板１８を着脱可能と
する。Of the side wall plates 17 and 18, the side wall plate 18 facing the wafer transfer machine 8 can be attached and detached.
【００２０】前記下部リング１６の側壁板１８取付け位
置に下端嵌合孔２０を穿設し、前記上部リング１９の前
記側壁板１８取付け位置に上端嵌合孔２１を穿設する。
前記側壁板１８の下端を前記下端嵌合孔２０に、又前記
側壁板１８の上端を前記上端嵌合孔２１にそれぞれ嵌合
可能とする。前記側壁板１８の下端近傍外面側に、突起
１８ａを形成する。A lower end fitting hole 20 is formed at a mounting position of the side wall plate 18 of the lower ring 16, and an upper end fitting hole 21 is formed at a mounting position of the side wall plate 18 of the upper ring 19.
The lower end of the side wall plate 18 can be fitted into the lower end fitting hole 20, and the upper end of the side wall plate 18 can be fitted into the upper end fitting hole 21, respectively. A protrusion 18a is formed on the outer surface of the side wall plate 18 near the lower end thereof.
【００２１】前記側壁板１８を昇降カバー部１１に取付
ける場合は、側壁板１８の上端を前記上端嵌合孔２１に
差込み、次に下端を前記下端嵌合孔２０に落込む。前記
突起１８ａが前記下部リング１６に当接して側壁板１８
の昇降カバー部１１への取付けが完了する。When attaching the side wall plate 18 to the elevating cover portion 11, the upper end of the side wall plate 18 is inserted into the upper end fitting hole 21, and then the lower end is dropped into the lower end fitting hole 20. The protrusion 18a comes into contact with the lower ring 16 so that the side wall plate 18
The attachment of the to the lift cover 11 is completed.
【００２２】側壁板１８の取外しは、上記取付けの逆の
手順で容易に行える。The side wall plate 18 can be easily removed by reversing the above procedure.
【００２３】而して、昇降カバー部１１とウェーハ移載
機８との位置合わせは前記側壁板１８を取外した状態で
行う。該側壁板１８を取外すことで視界が大きく開か
れ、位置合わせ作業は容易に短時間で行える。The position of the lift cover 11 and the wafer transfer machine 8 is aligned with the side wall plate 18 removed. By removing the side wall plate 18, the field of view is greatly opened, and the alignment work can be easily performed in a short time.
【００２４】尚、昇降カバー部１１と側壁板１８との着
脱構造は種々考えられるものであり、例えば図３で示す
様に、側壁板１８の上端に上部鉤部１８ｂ、下端に下部
鉤部１８ｃを形成し、前記上部鉤部１８ｂを前記上端嵌
合孔２１に、又前記下部鉤部１８ｃを前記下端嵌合孔２
０に嵌合可能としてもよい。There are various conceivable attachment / detachment structures for the lift cover 11 and the side wall plate 18. For example, as shown in FIG. 3, the upper side hook 18b is at the upper end of the side wall plate 18 and the lower side hook 18c is at the lower end. To form the upper hook portion 18b in the upper end fitting hole 21 and the lower hook portion 18c in the lower end fitting hole 2.
It may be possible to fit 0.
【００２５】又、側壁板１８の設ける位置は作業者の見
やすい位置に設ければよく、上記実施例に限定されるも
のではない。又側壁板１８は２以上が着脱可能であって
もよい。The side wall plate 18 may be provided at a position where it can be easily seen by the operator, and is not limited to the above embodiment. Also, two or more side wall plates 18 may be removable.
【００２６】[0026]
【発明の効果】以上述べた如く本発明によれば、縦型カ
バーボートとウェーハ移載機との位置合わせが容易に行
え、組立て作業性、保守作業性が向上し、装置製造価格
の低減、装置の可動率の向上を図ることができる。As described above, according to the present invention, the vertical cover boat and the wafer transfer machine can be easily aligned with each other, the assembling workability and the maintenance workability are improved, and the device manufacturing cost is reduced. The mobility of the device can be improved.
【図１】本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図２】図１のＡ−Ａ矢視図である。FIG. 2 is a view on arrow AA of FIG.
【図３】他の実施例を示す図１のＡ−Ａ矢視相当図であ
る。FIG. 3 is a view corresponding to the arrow AA of FIG. 1 showing another embodiment.
【図４】半導体製造装置の概略を示す斜視図である。FIG. 4 is a perspective view showing the outline of a semiconductor manufacturing apparatus.
【図５】従来の縦型カバーボートを示す斜視図である。FIG. 5 is a perspective view showing a conventional vertical cover boat.
２ 縦型炉 ６ ボート ８ ウェーハ移載機 １１ 昇降カバー部 １２ 固定カバー部 １８ 側壁板 ２０ 下端嵌合孔 ２１ 上端嵌合孔 2 Vertical furnace 6 Boat 8 Wafer transfer machine 11 Lifting cover part 12 Fixed cover part 18 Side wall plate 20 Lower end fitting hole 21 Upper end fitting hole
Claims (1)
する縦型半導体製造装置の縦型カバーボートに於いて、
該縦型カバーボートが前記炉内に装入引出し可能な昇降
カバー部と前記縦型炉内に設けられる固定カバー部から
成り、前記昇降カバー部の側壁板の少なくとも１つを着
脱可能としたことを特徴とする縦型カバーボート。1. A vertical cover boat of a vertical semiconductor manufacturing apparatus for holding a wafer in a vertical furnace while covering the wafer,
The vertical cover boat is composed of an elevating cover part that can be loaded and withdrawn into the furnace, and a fixed cover part provided in the vertical furnace, and at least one side wall plate of the elevating cover part is removable. A vertical type cover boat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14865793A JPH06338474A (en) | 1993-05-27 | 1993-05-27 | Longitudinal cover boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14865793A JPH06338474A (en) | 1993-05-27 | 1993-05-27 | Longitudinal cover boat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06338474A true JPH06338474A (en) | 1994-12-06 |
Family
ID=15457714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14865793A Pending JPH06338474A (en) | 1993-05-27 | 1993-05-27 | Longitudinal cover boat |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06338474A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100350448B1 (en) * | 1999-08-25 | 2002-08-28 | 삼성전자 주식회사 | Wafer cassette for sintering silica |
| WO2016046947A1 (en) * | 2014-09-25 | 2016-03-31 | 株式会社日立国際電気 | Substrate holder, substrate-processing apparatus, and semiconductor device manufacturing method |
-
1993
- 1993-05-27 JP JP14865793A patent/JPH06338474A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100350448B1 (en) * | 1999-08-25 | 2002-08-28 | 삼성전자 주식회사 | Wafer cassette for sintering silica |
| WO2016046947A1 (en) * | 2014-09-25 | 2016-03-31 | 株式会社日立国際電気 | Substrate holder, substrate-processing apparatus, and semiconductor device manufacturing method |
| JPWO2016046947A1 (en) * | 2014-09-25 | 2017-08-31 | 株式会社日立国際電気 | Substrate holder, substrate processing apparatus, and semiconductor device manufacturing method |
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