JPH06338416A - Electronic component such as chip inductor, its manufacture and its manufacturing apparatus - Google Patents
Electronic component such as chip inductor, its manufacture and its manufacturing apparatusInfo
- Publication number
- JPH06338416A JPH06338416A JP6067538A JP6753894A JPH06338416A JP H06338416 A JPH06338416 A JP H06338416A JP 6067538 A JP6067538 A JP 6067538A JP 6753894 A JP6753894 A JP 6753894A JP H06338416 A JPH06338416 A JP H06338416A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic material
- conductive member
- shaft
- molded body
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電子機器を用いた信
号ラインにおいて発生される電磁波障害ノイズを除去す
るために利用されるインダクタなどの電子部品と、その
製造方法ならびにその製造装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as an inductor used for removing electromagnetic interference noise generated in a signal line using an electronic device, a manufacturing method thereof, and a manufacturing apparatus thereof. is there.
【０００２】[0002]
【従来の技術】従来、この種の電子部品とその製造方法
については、以下の通り各種提案されている。2. Description of the Related Art Heretofore, various kinds of electronic parts of this kind and a method of manufacturing the same have been proposed as follows.
【０００３】（第１の従来例）Ｐｔ線で形成したコイル
を成形金型にセットし、フェライト粉末を充填し、加圧
成形し焼成してなるコイルを磁性体に内蔵して一体化構
造としたインダクタが特開昭５６−６７９１０号公報に
開示されている。(First Conventional Example) A coil formed of Pt wire is set in a molding die, filled with ferrite powder, pressure-molded and fired, and the coil is built into a magnetic material to form an integrated structure. Such an inductor is disclosed in Japanese Patent Laid-Open No. 56-67910.
【０００４】（第２の従来例）燒結磁性体バーの外周に
粗の巻回部と密の巻回部とが交互に連続的に配置される
ように導線を巻線し、粗の巻回部に導電ペーストを塗布
し、導電を埋設するように磁性体バーの周囲に磁性体を
被覆し、焼成したのち、粗の巻回部で切断し外部電極を
形成するインダクタの製造方法が特開昭５８−４８４１
０号公報に開示されている。(Second Conventional Example) A conducting wire is wound so that coarse winding portions and dense winding portions are alternately and continuously arranged around the outer periphery of the sintered magnetic bar, and the coarse winding is wound. A method for manufacturing an inductor in which an external electrode is formed by applying a conductive paste to a portion, coating a magnetic material around the magnetic bar so as to bury the conductivity, firing, and then cutting the coarse winding portion to form an external electrode 58-4841
No. 0 publication.
【０００５】[0005]
【発明が解決しようとする課題】前記の如き従来技術の
製造方法においても、所要の電子部品は得られるもので
あるが、例えば、第１の従来例に開示されたインダクタ
においては、単品単位のパッチ生産となるため効率的な
製造が期待し難く、第２の従来例に開示されたインダク
タの製造方法においては、粗の巻回部と密の巻回部とを
有するために巻線工程の高速化が困難であるだけでなく
設備の複雑化を否めず、また、得られた焼成体には残留
内部応力による磁気特性の低下や外周面の凹凸が発生し
やすかった。Although the required electronic components can be obtained even by the manufacturing method of the prior art as described above, for example, in the inductor disclosed in the first conventional example, a single product unit is used. Since it is a patch production, it is difficult to expect efficient manufacturing. In the inductor manufacturing method disclosed in the second conventional example, the winding process is performed because of the coarse winding portion and the dense winding portion. Not only was it difficult to increase the speed, but it was unavoidable that the equipment was complicated, and the resulting fired body was liable to suffer deterioration of magnetic properties and irregularities on the outer peripheral surface due to residual internal stress.
【０００６】この発明の目的とするところは、次のもの
を提供することである。An object of the present invention is to provide the following.
【０００７】(1) 磁性材料内にコイル状の導電材が整然
と、しかも緊密状に埋設された高品質の電子部品。(1) A high-quality electronic component in which a coil-shaped conductive material is embedded in a magnetic material in an orderly and tight manner.
【０００８】(2) 製造工程が単純化され、簡易に電子部
品を製造しうる製法と製造装置。(2) A manufacturing method and a manufacturing apparatus in which the manufacturing process is simplified and electronic parts can be easily manufactured.
【０００９】(3) 大量かつ低コスト状に電子部品を製造
しうる製法と製造装置。(3) Manufacturing method and manufacturing apparatus capable of manufacturing a large number of electronic parts at low cost.
【００１０】[0010]
【課題を解決するための手段】前記の目的を達成するた
めのこの発明の構成上の特徴点は次の通りである。The structural features of the present invention for achieving the above object are as follows.
【００１１】(1) フェライト磁性材料からなる軸状体と
該軸状体の外周に該軸状体の長手方向の一端側から他端
側に亘って等ピッチに配設された螺旋状の導電部材と該
導電部材並びに前記軸状体の外周を被覆するフェライト
磁性材料からなる被覆体と、前記軸状体並びに被覆体の
両端面にそれぞれ前記導電部材に導電接続するように付
設された端子電極と、を備えるとともに、前記フェライ
ト磁性材料からなる軸状体と前記フェライト磁性材料か
らなる被覆体とが燒結一体化されたチップインダクタな
どの電子部品。(1) A shaft-shaped body made of a ferrite magnetic material, and a spiral conductive material arranged on the outer periphery of the shaft-shaped body at equal pitches from one end side to the other end side in the longitudinal direction of the shaft-shaped body. A member, the conductive member, and a cover made of a ferrite magnetic material that covers the outer periphery of the shaft, and terminal electrodes provided on both end faces of the shaft and the cover so as to be conductively connected to the conductive member. And an electronic component such as a chip inductor in which a shaft-shaped body made of the ferrite magnetic material and a coating made of the ferrite magnetic material are sintered and integrated.
【００１２】(2) フェライト粉末などの磁性素材に樹脂
などの結合材を混練した混練物を軸状に成形して第１の
成形体を得る工程と、前記第１の成形体の外周に等ピッ
チの螺旋状に導電材を捲回する工程と、フェライト粉末
などの磁性素材に樹脂などの結合材を混練した混練物を
用いて前記導電部材並びに前記第１の成形体の外周に被
覆体を形成して第２の成形体を得る工程と、前記第１の
成形体を構成するフェライト磁性材料と前記被覆体を構
成するフェライト磁性材料とを焼成により燒結一体化す
る工程と、前記第２の成形体を所望の長さ寸法に切断し
て両端面にそれぞれ前記導電部材の一部が露出されたチ
ップを得る工程と、該チップの前記導電部材の一部が露
出された端面にそれぞれ前記導電部材に接するように端
子電極を付設する工程と、を有するチップインダクタな
どの電子部品の製造方法。(2) A step of molding a kneaded material obtained by kneading a magnetic material such as ferrite powder with a binder such as a resin into a shaft to obtain a first molded body, and the like on the outer periphery of the first molded body. A step of winding a conductive material in a spiral shape of a pitch, and using a kneaded product obtained by kneading a binder such as a resin with a magnetic material such as ferrite powder, a coating is provided on the outer periphery of the conductive member and the first molded body. Forming the second molded body to obtain a second molded body, sintering the ferrite magnetic material constituting the first molded body and the ferrite magnetic material constituting the covering body by firing, and integrating the sintered body into a second body. A step of cutting the molded body into a desired length dimension to obtain a chip in which a part of the conductive member is exposed at both end surfaces, and a step of conducting the conductive material in an end surface where a part of the conductive member of the chip is exposed. A process to attach a terminal electrode so as to contact the member A method of manufacturing an electronic component such as a chip inductor having a step.
【００１３】(3) フェライト粉末などの磁性素材に樹脂
などの結合材を混練した混練物を軸状に成形する第１の
成形手段と、前記第１の成形手段において成形された第
１の成形体の外周に等ピッチの螺旋状に導電部材を装着
する装着手段と、前記導電部材並びに前記第１の成形体
の外周に被覆体を形成する手段と、を具備したチップイ
ンダクタなどの電子部品の製造装置。(3) First molding means for molding a kneaded material obtained by kneading a magnetic material such as ferrite powder with a binder such as a resin into a shaft shape, and the first molding means molded by the first molding means. An electronic component such as a chip inductor including a mounting means for mounting a conductive member in a spiral shape with an equal pitch on the outer circumference of the body, and a means for forming a coating on the outer circumference of the conductive member and the first molded body. Manufacturing equipment.
【００１４】[0014]
【作 用】次に、その作用について見れば、[Operation] Next, if you look at the action,
【００１５】(1) フェライト磁性材料からなる軸状体と
前記フェライト磁性材料からなる被覆体とが燒結一体化
されるとともにその内部に長手方向の一端側から他端側
に亘って等ピッチに配設された螺旋状の導電部材を備え
るため、長手方向に亘って均一で残留内部応力が小さい
高品質のチップインダクタなどの電子部品を提供するこ
とができる。(1) A shaft-shaped body made of a ferrite magnetic material and a coating made of the ferrite magnetic material are sintered and integrated, and are arranged in the interior thereof at equal pitches from one end side to the other end side in the longitudinal direction. Since the spiral conductive member is provided, it is possible to provide a high-quality electronic component such as a chip inductor that is uniform in the longitudinal direction and has a small residual internal stress.
【００１６】(2) 切断長さ寸法に応じて所望の磁気特性
を有する高品質のチップインダクタなどの電子部品を製
造することができる。(2) It is possible to manufacture a high-quality electronic component such as a chip inductor having desired magnetic characteristics according to the cut length dimension.
【００１７】(3) チップインダクタなどの電子部品を大
量に高速かつ効率的に製造することができる。(3) Electronic parts such as chip inductors can be mass-produced at high speed and efficiently.
【００１８】[0018]
【実 施 例】次に、この発明の実施例を図面に基づい
て説明する。EXAMPLES Next, examples of the present invention will be described with reference to the drawings.
【００１９】（第１実施例）図１には、第１実施例が示
されており、この実施例における製造装置（Ｄ１）につ
いて見れば、第１の成形手段に相当する第１の押出成形
機（１）の押出金型（１２）の下方に等軸状に第２の押
出成形機（２）の押出金型（２２）を配置し、前記第１
の押出金型（１２）と前記第２の押出金型（２２）との
間に導電部材に相当する導電線（Ｌ）を巻回装着する装
着手段に相当する巻線機（３）が介装されているもので
あって、前記第１の押出金型（１２）及び前記第２の押
出金型（２２）は、供給ポート（１１），（１２）を介
して、押出スクリューを内蔵した第１の押出成形機
（１）の本体（図示省略）及び前記と同様に押出スクリ
ューを内蔵した第２の押出成形機（２）の本体（図示省
略）にそれぞれ接続されている。前記第１の押出金型
（１２）の下端及び前記第２の押出金型（２２）の下端
にはそれぞれ押出口（１３），（２３）が配置されると
ともに、前記第２の押出金型（２２）の内部にはさら
に、案内筒（２４）が配置され、その下部開口（２４
Ａ）が前記押出口（２３）の近傍に配置されている。(First Embodiment) FIG. 1 shows a first embodiment. Looking at the manufacturing apparatus (D1) in this embodiment, the first extrusion molding corresponding to the first molding means is shown. The extrusion die (22) of the second extrusion molding machine (2) is equiaxially disposed below the extrusion die (12) of the machine (1), and the first die
The winding machine (3) corresponding to the mounting means for winding and mounting the conductive wire (L) corresponding to the conductive member is interposed between the extrusion die (12) and the second extrusion die (22). The first extrusion die (12) and the second extrusion die (22) are equipped with an extrusion screw via the supply ports (11) and (12). It is connected to the main body (not shown) of the first extruder (1) and the main body (not shown) of the second extruder (2) having a built-in extrusion screw as described above. Extrusion ports (13) and (23) are arranged at the lower end of the first extrusion die (12) and the lower end of the second extrusion die (22), respectively, and the second extrusion die is also provided. A guide tube (24) is further arranged inside the (22), and a lower opening (24
A) is arranged in the vicinity of the extrusion port (23).
【００２０】前記巻線機（３）は、導電部材に相当する
導電線（Ｌ）を貯えた供給ドラム（３１）と該供給ドラ
ム（３１）から繰出された導電線（Ｌ）を案内する筒状
体又は環状体等からなる案内具（３２）と、前記供給ド
ラム（３１）及び案内具（３２）を前記等軸を中心に回
転自在に支持するベアリング等の支持手段（図示省略）
と、前記供給ドラム（３１）及び案内具（３２）を回転
駆動するモーター等の駆動手段（図示省略）とを有す
る。The winding machine (3) is a tube for guiding a supply drum (31) storing a conductive wire (L) corresponding to a conductive member and a conductive wire (L) fed from the supply drum (31). A guide tool (32) composed of a strip or an annular body, and a support means (not shown) such as a bearing for rotatably supporting the supply drum (31) and the guide tool (32) around the equiaxed axis.
And a driving means (not shown) such as a motor for rotationally driving the supply drum (31) and the guide tool (32).
【００２１】次に、前記製造装置（Ｄ1 ）を用いた製造
手順について説明する。フェライト粉末などの磁性素材
に樹脂などの結合材を混練したフェライト磁性材料
（Ｍ）が混練機（４）により得られ、これが第１の押出
成形機（１）の本体に内蔵された押出スクリューにより
加圧状態で供給ポート（１１）を介して第１の押出金型
（１２）内に送られ、軸状体材（Ｍ1 ）として押出口
（１３）から押出成形され、第１の成形体（Ｓ1 ）が得
られる。次に、前記第１の成形体（Ｓ1 ）は、その外周
に、前記巻線機（３）の供給ドラム（３１）に貯えられ
た導電線（Ｌ）が前記案内具（３１）を介して繰り出さ
れ、前記支持手段並びに回転駆動手段により所定のピッ
チで巻回された後、第２の押出金型（２２）の案内筒
（２４）に供給される。さらにその外周には、前記と同
様に第２の押出成形機（２）の本体から押出スクリュー
により加圧状態で供給ポート（２１）を介して供給され
た被覆体材（Ｍ2 ）によりその外周が被覆された状態で
押出口（２３）から押出成形され、前記と同様に必要に
より加熱・乾燥手段等により硬化されて第２の成形体
（Ｓ2）が得られる。Next, a manufacturing procedure using the manufacturing apparatus (D 1 ) will be described. A ferrite magnetic material (M) obtained by kneading a binder such as a resin with a magnetic material such as ferrite powder is obtained by a kneading machine (4), and this is obtained by an extrusion screw built in the main body of the first extrusion molding machine (1). It is fed into the first extrusion die (12) through the supply port (11) in a pressurized state and extruded as the shaft-shaped material (M 1 ) from the extrusion port (13) to form the first formed body. (S 1 ) is obtained. Next, the conductive wire (L) stored in the supply drum (31) of the winding machine (3) is provided around the outer periphery of the first molded body (S 1 ) via the guide tool (31). And is wound at a predetermined pitch by the supporting means and the rotation driving means, and then supplied to the guide cylinder (24) of the second extrusion die (22). Further, the outer periphery thereof is covered with the covering material (M 2 ) supplied from the main body of the second extrusion molding machine (2) through the supply port (21) under pressure from the main body of the second extrusion molding machine (2) in the same manner as above. Is extruded from the extrusion port (23) in a coated state, and is cured by heating / drying means or the like as necessary in the same manner as described above to obtain a second molded body (S 2 ).
【００２２】前記導電線（Ｌ）の巻回ピッチは、前記第
１の押出成形機（１）の押出しスクリューの回転速度並
びに前記巻線機（３）の回転駆動手段のいずれか一方又
は双方の回転速度をインバーター又は変速機等の調整手
段（図示省略）で調整することにより任意の値に設定す
ることができる。The winding pitch of the conductive wire (L) is determined by one or both of the rotation speed of the extrusion screw of the first extrusion molding machine (1) and the rotation driving means of the winding machine (3). The rotation speed can be set to an arbitrary value by adjusting it with an adjusting means (not shown) such as an inverter or a transmission.
【００２３】次に、その製造方法について見れば、以下
の通りである。即ち、高透磁率特性を備えたフェライト
材、好ましくはＮｉ系フェライト、Ｎｉ−Ｚｎ系フェラ
イト、Ｎｉ−Ｚｎ−Ｃｕ系フェライト、Ｍｎ−Ｚｎ系フ
ェライト等のソフトフェライトの粉末などの磁性素材
（Ｓ）と、ポリビニールアルコール、エチレンセルロー
ズあるいは、エポキシ樹脂、ＡＢＳ樹脂その他の結合材
（Ｂ）および適量の水などの溶剤とを適当な重量％比で
混練した混練物を押出成形法等の手段により軸状に成形
し、第１の成形体（Ｓ1 ）を得る。前記成形体（Ｓ1 ）
は室温放置でも硬化させることが可能であるが、必要に
より８０℃〜３００℃に加熱することにより硬化を促進
させることもできる。また、前記第１の成形体（Ｓ1 ）
の断面形状は成形金型の形状を選択することにより丸
形、角形等の任意の形状のものを得ることができる。Next, the manufacturing method is as follows. That is, a ferrite material having high magnetic permeability characteristics, preferably a magnetic material (S) such as a soft ferrite powder such as a Ni-based ferrite, a Ni-Zn-based ferrite, a Ni-Zn-Cu-based ferrite, or a Mn-Zn-based ferrite. And polyvinyl alcohol, ethylene cellulose or epoxy resin, ABS resin or other binder (B) and an appropriate amount of a solvent such as water at an appropriate weight% ratio to form a kneaded product by means of an extrusion molding method or the like. To obtain a first molded body (S 1 ). The molded body (S 1 )
Can be cured even at room temperature, but if necessary, the curing can be accelerated by heating at 80 ° C. to 300 ° C. In addition, the first molded body (S 1 )
By selecting the shape of the molding die, it is possible to obtain a cross-sectional shape of any shape such as a round shape or a square shape.
【００２４】次で、この第１の成形体（Ｓ1 ）の外周に
等ピッチで、導電部材に相当する導電線（Ｌ）を巻回す
るものであるが、この導電線（Ｌ）の素材としては、Ｐ
ｔ，Ａｇ，Ａｇ−Ｐｄ，Ｃｕなどの中から、前記フェラ
イト磁性材料（Ｍ）の焼成雰囲気並びにインダクタなど
の電子部品に要求される抵抗率等の電気的特性を考慮し
た上で任意に選択することができるが、その溶融温度が
前記フェライト磁性材料（Ｍ）の燒結温度以上のものを
選択する必要がある。Next, the conductive wire (L) corresponding to the conductive member is wound around the outer periphery of the first molded body (S 1 ) at an equal pitch. The material of this conductive wire (L) As P
It is arbitrarily selected from t, Ag, Ag-Pd, Cu, etc. in consideration of the firing atmosphere of the ferrite magnetic material (M) and electrical characteristics such as resistivity required for electronic parts such as inductors. However, it is necessary to select one whose melting temperature is higher than the sintering temperature of the ferrite magnetic material (M).
【００２５】一方、前記導電線（Ｌ）の線径、巻回ピッ
チ、巻回数等は、インダクタなどの電子部品に対して要
求される電流容量、インピーダンス値、インダクタンス
値その他の電気的特性に応じて任意の値に選択すること
ができる。前記導電線（Ｌ）の線径並びに導電線（Ｌ）
の繰出しテンションについては前記第１の成形体（Ｓ
1 ）の機械的強度を考慮して決定することが好ましく、
また、前記線径は直径数μｍ〜数百μｍの範囲で選択す
ることが好ましい。また、前記導電線（Ｌ）の巻回ピッ
チを長手方向に等しくすることにより、前記第１の成形
体（Ｓ1 ）に加わる巻線時の衝撃が著しく減少して成形
体の破断が防止されるとともに、巻回速度の高速化が可
能となり、効率的に製造することができる。On the other hand, the wire diameter, the winding pitch, the number of windings, etc. of the conductive wire (L) depend on the current capacity, impedance value, inductance value and other electrical characteristics required for electronic parts such as inductors. Can be selected to any value. Conductor wire (L) diameter and conductor wire (L)
The feeding tension of the first molded body (S
It is preferable to determine in consideration of the mechanical strength of 1 ),
Further, the wire diameter is preferably selected within a range of several μm to several hundreds μm in diameter. Further, by making the winding pitch of the conductive wire (L) equal in the longitudinal direction, the impact applied to the first molded body (S 1 ) at the time of winding is remarkably reduced, and breakage of the molded body is prevented. In addition, the winding speed can be increased and the manufacturing can be performed efficiently.
【００２６】次に、導電線（Ｌ）が長手方向に等ピッチ
で配設された第１の成形体（Ｓ1 ）の外周に前記磁性材
料（Ｍ）からなる被覆体材（Ｍ2 ）を配設し、第２の成
形体（Ｓ2 ）を得る。前記、被覆体材（Ｍ2 ）の形成方
法としては、押出成形法、スプレー法、転写法、ディッ
プ引上げ法等の種々の方法の中から選択することが可能
であるが、その寸法精度、成形密度、第１の成形体（Ｓ
1 ）との密着度、生産性等の点で押出成形法が優れてい
る。Next, a covering material (M 2 ) made of the magnetic material (M) is provided on the outer periphery of the first molded body (S 1 ) in which the conductive wires (L) are arranged at equal pitches in the longitudinal direction. Then, the second molded body (S 2 ) is obtained. The method for forming the covering material (M 2 ) can be selected from various methods such as an extrusion molding method, a spray method, a transfer method, and a dip pulling method. Density, first compact (S
The extrusion molding method is superior in terms of the degree of adhesion with 1 ) and productivity.
【００２７】次に、この第２の成形体（Ｓ2 ）を一旦長
寸に切断し、焼成用サヤ内に整列して焼成し、前記第１
の成形体（Ｓ1 ）と被覆体材（Ｍ2 ）とを燒結一体化さ
せる。前記焼成の温度は、概ね８００℃〜１２００℃の
範囲でフェライト磁性材料の種類に応じて適切な温度を
選定する。また焼成雰囲気は、Ｎｉ系，Ｎｉ−Ｚｎ系，
Ｎｉ−Ｚｎ−Ｃｕ系等のフェライト材料の場合には大気
中、Ｍｎ−Ｚｎ系の場合には窒素雰囲気中等が好まし
い。Next, this second molded body (S 2 ) is once cut into a long size, aligned in the firing sheath and fired to obtain the first
The molded body (S 1 ) and the covering material (M 2 ) are sintered and integrated. The firing temperature is generally in the range of 800 ° C. to 1200 ° C., and an appropriate temperature is selected according to the type of ferrite magnetic material. The firing atmosphere is Ni-based, Ni-Zn-based,
In the case of a ferrite material such as Ni-Zn-Cu system, the atmosphere is preferable, and in the case of Mn-Zn system, a nitrogen atmosphere is preferable.
【００２８】次に、得られた長寸の燒結体を所望の長さ
寸法に切断し、両端面にそれぞれ前記導電線（Ｌ）の一
部が露出されたチップを得る。Next, the obtained long sintered body is cut into a desired length to obtain a chip in which a part of the conductive wire (L) is exposed at both end surfaces.
【００２９】前記所望寸法への切断は、焼成前、焼成後
のいずれでもよく、その切断方法も、押し切り、ダイシ
ング、レーザー加工等の種々の手段の中から選択するこ
とができる。The cutting to the desired size may be performed before or after firing, and the cutting method can be selected from various means such as pressing, dicing, and laser processing.
【００３０】最後に、得られたチップの前記導電線
（Ｌ）の一部が露出された端面にそれぞれ前記導電線
（Ｌ）に接するように端子電極（Ｔ1 ）（Ｔ2 ）を付設
することによりチップインダクタなどの電子部品（Ｉ
Ｐ）が得られる。Finally, terminal electrodes (T 1 ) (T 2 ) are attached to the exposed end faces of the obtained conductive lines (L) of the chips so as to be in contact with the conductive lines (L). As a result, electronic components such as chip inductors (I
P) is obtained.
【００３１】前記端子電極（Ｔ1 ）（Ｔ2 ）の形成は、
焼成前のチップに形成する場合には、Ａｇペースト、Ａ
ｇ−Ｐｄペースト、Ｃｕペースト等の焼付けタイプの電
極ペーストを用いると、前記フェライト磁性材料の焼成
時に同時に焼付けることが可能である。また、焼成後の
チップに形成する場合、及び前記焼成前のチップに形成
したのち焼成同時焼付けしたチップの前記厚膜電極上に
重ねて形成する場合には、前記焼付けタイプの厚膜法に
限らず、熱硬化タイプの厚膜法、蒸着法、メッキ法等の
種々の手段の中から選択・組み合わせることができ、例
えば厚膜法を用いる場合には、Ａｇペースト、Ａｇ−Ｐ
ｄペースト、Ａｇ混合樹脂ペースト等を塗布した後、１
５０℃〜６００℃で焼付け又は硬化させることにより形
成できる。The formation of the terminal electrodes (T 1 ) (T 2 ) is as follows.
When forming chips before firing, Ag paste, A
If a baking type electrode paste such as a g-Pd paste or a Cu paste is used, it is possible to perform baking at the same time when the ferrite magnetic material is baked. Further, in the case of forming on a chip after firing, and when forming on the thick film electrode of the chip that was formed on the chip before firing and then baked at the same time, it is limited to the above-mentioned baking type thick film method. Instead, it can be selected and combined from various means such as thermosetting type thick film method, vapor deposition method, plating method, etc. For example, when the thick film method is used, Ag paste, Ag-P
After applying d paste, Ag mixed resin paste, etc., 1
It can be formed by baking or curing at 50 ° C to 600 ° C.
【００３２】さらに、チップインダクタなどの電子部品
（ＩＰ）の回路基板への半田付け性を向上させるため
に、予め形成された端子電極上にさらにＮｉ層，Ｓｎ−
Ｐｂ合金層等をメッキ法等により積層することが好まし
い。Further, in order to improve the solderability of an electronic component (IP) such as a chip inductor to a circuit board, a Ni layer and Sn- are further formed on a preformed terminal electrode.
It is preferable to stack Pb alloy layers and the like by a plating method or the like.
【００３３】（第２実施例）図４には、第２実施例が示
されているが、この実施例の製造装置（Ｄ2 ）が第１の
実施例の製造装置（Ｄ1 ）と相違する点は、第１の成形
体（Ｓ1 ）の外周に塗装装置（５）によってペースト状
の導電性材料を塗着されるようにして導電帯（Ｐ）を形
成させる点にあって、それ以外の点は第１の実施例の装
置（Ｄ1 ）と共通しているのでその説明の重複は省略す
る。(Second Embodiment) FIG. 4 shows a second embodiment, but the manufacturing apparatus (D 2 ) of this embodiment is different from the manufacturing apparatus (D 1 ) of the first embodiment. The point to do is to form a conductive band (P) by coating a paste-like conductive material on the outer periphery of the first molded body (S 1 ) by a coating device (5). Since the other points are common to the device (D 1 ) of the first embodiment, the description thereof will be omitted.
【００３４】即ち、第２実施例の装置（Ｄ2 ）において
は、第１の成形体（Ｓ1 ）の外周に旋回するペイントロ
ール（５１）を当接させ、このペイントロール（５１）
には、ホッパー（５２）から、Ａｇ−Ｐｄその他の低抵
抗材料からなる導電材料を螺旋状に塗布して導電帯
（Ｐ）を形成するようにしたものである。That is, in the apparatus (D 2 ) of the second embodiment, the rotating paint roll (51) is brought into contact with the outer periphery of the first molded body (S 1 ), and this paint roll (51)
In the above, the conductive band (P) is formed by spirally applying a conductive material made of Ag-Pd or other low resistance material from the hopper (52).
【００３５】又、前記以外にも例えばジェット噴射手段
を利用して第１の成形体（Ｓ1 ）の外周上に導電層を形
成することも出来るものであって、この発明は、前記の
各実施例に限定されるものではないことは言うまでもな
いことである。In addition to the above, a jet layer may be used to form a conductive layer on the outer periphery of the first molded body (S 1 ). It goes without saying that the present invention is not limited to the examples.
【００３６】尚、前記の各実施例によって製造されるチ
ップインダクタ（ＩＰ）の外観形状が円柱状であるが、
この形状を例えば直方体状にするには、第２の押出成形
機（２）の押出口（２３）の形状を長方形に構成すれば
足りるものであって、この点は、前記実施例のものの単
純な設計変更にすぎないものである。The external shape of the chip inductor (IP) manufactured according to each of the above-mentioned embodiments is cylindrical.
In order to make this shape into, for example, a rectangular parallelepiped, it suffices to form the shape of the extrusion port (23) of the second extrusion molding machine (2) into a rectangle. This point is simpler than that of the above-mentioned embodiment. It is just a design change.
【００３７】[0037]
【発明の効果】この発明は、以上の通りであって、磁性
材料中にコイル状の導電材が均質な関係配置で整然とし
かも緊密に埋設された高品質の電子部品を提供できるも
のであり、その製造に当っては、押出成形手段と、導電
材供給手段のみで足りるものであって、その生産工程に
おける加工処理も極めて単純化されているため、格別高
度な熟練を要することなく、前記の電子部品を極めて低
コストで大量に製造できるという顕著な効果を発揮しう
るものである。As described above, the present invention is capable of providing a high-quality electronic component in which a coil-shaped conductive material is embedded in a magnetic material in a homogenous relationship in an orderly and close manner. In the production thereof, only the extrusion molding means and the conductive material supplying means are sufficient, and the processing in the production process is also extremely simplified, so that it does not require any special skill, and It is possible to exert a remarkable effect that electronic parts can be mass-produced at an extremely low cost.
【図１】この発明の第１の実施例を示す装置説明図。FIG. 1 is an explanatory view of an apparatus showing a first embodiment of the present invention.
【図２】図１によって成形された第２の成形体の一部切
開側面図。FIG. 2 is a partially cutaway side view of the second molded body molded according to FIG.
【図３】第１の実施例によって作成されたチップインダ
クタの斜視図。FIG. 3 is a perspective view of a chip inductor manufactured according to the first embodiment.
【図４】この発明の第２の実施例の一部を示す装置説明
図。FIG. 4 is an explanatory view of an apparatus showing a part of a second embodiment of the present invention.
Ｄ1 ，Ｄ2 製造装置 １ 第１の押出成形機 ２ 第２の押出成形機 ３ 巻線機 ４ 混練機 Ｍ フェライト磁性材料 Ｍ1 軸状体材 Ｍ2 被覆体材 Ｓ1 第１の成形体（軸状体） Ｓ2 第２の成形体（被覆体を有する軸状体） Ｌ 導電線 Ｐ 導電帯 ＩＰ 電子部品 Ｔ1 ，Ｔ2 端子電極D 1 , D 2 manufacturing apparatus 1 first extrusion molding machine 2 second extrusion molding machine 3 winding machine 4 kneading machine M ferrite magnetic material M 1 axial material M 2 coating material S 1 first molding (Axial body) S 2 Second molded body (Axial body having a covering body) L Conductive wire P Conductive band IP Electronic component T 1 , T 2 Terminal electrode
Claims (3)
軸状体の外周に該軸状体の長手方向の一端側から他端側
に亘って等ピッチに配設された螺旋状の導電部材と該導
電部材並びに前記軸状体の外周を被覆するフェライト磁
性材料からなる被覆体と、前記軸状体並びに被覆体の両
端面にそれぞれ前記導電部材に導電接続するように付設
された端子電極と、を備えるとともに、前記フェライト
磁性材料からなる軸状体と前記フェライト磁性材料から
なる被覆体とが燒結一体化されたチップインダクタなど
の電子部品。1. A shaft-shaped body made of a ferrite magnetic material, and a spiral conductive member arranged on the outer periphery of the shaft-shaped body at equal pitches from one end side to the other end side in the longitudinal direction of the shaft-shaped body. A cover made of a ferrite magnetic material that covers the outer periphery of the conductive member and the shaft, and terminal electrodes attached to both end faces of the shaft and the cover so as to be conductively connected to the conductive member. , And an electronic component such as a chip inductor in which a shaft-shaped body made of the ferrite magnetic material and a cover made of the ferrite magnetic material are sintered and integrated.
どの結合材を混練した混練物を軸状に成形して第１の成
形体を得る工程と、前記第１の成形体の外周に等ピッチ
の螺旋状に導電材を捲回する工程と、フェライト粉末な
どの磁性素材に樹脂などの結合材を混練した混練物を用
いて前記導電部材並びに前記第１の成形体の外周に被覆
体を形成して第２の成形体を得る工程と、前記第１の成
形体を構成するフェライト磁性材料と前記被覆体を構成
するフェライト磁性材料とを焼成により燒結一体化する
工程と、前記第２の成形体を所望の長さ寸法に切断して
両端面にそれぞれ前記導電部材の一部が露出されたチッ
プを得る工程と、該チップの前記導電部材の一部が露出
された端面にそれぞれ前記導電部材に接するように端子
電極を付設する工程と、を有するチップインダクタなど
の電子部品の製造方法。2. A step of molding a kneaded product obtained by kneading a binder such as a resin into a magnetic material such as ferrite powder into a shaft to obtain a first molded body, and an equal pitch on the outer periphery of the first molded body. Forming a coating on the outer periphery of the conductive member and the first molded body using a step of winding the conductive material in a spiral shape and a kneaded material obtained by kneading a binder such as a resin with a magnetic material such as ferrite powder To obtain a second compact, and a step of sintering and integrating the ferrite magnetic material constituting the first compact and the ferrite magnetic material constituting the cover by firing, and the second compact A step of cutting the body into a desired length dimension to obtain a chip in which a part of the conductive member is exposed on both end surfaces, and the conductive member on each end surface of the chip in which a part of the conductive member is exposed. Attaching the terminal electrode so that it contacts the And a method of manufacturing an electronic component such as a chip inductor having.
どの結合材を混練した混練物を軸状に成形する第１の成
形手段と、前記第１の成形手段において成形された第１
の成形体の外周に等ピッチの螺旋状に導電部材を装着す
る装着手段と、前記導電部材並びに前記第１の成形体の
外周に被覆体を形成する手段と、を具備したチップイン
ダクタなどの電子部品の製造装置。3. A first molding means for molding a kneaded material obtained by kneading a magnetic material such as ferrite powder with a binder such as a resin into a shaft, and a first molding means molded by the first molding means.
An electronic device such as a chip inductor including a mounting means for mounting a conductive member in a spiral shape with an equal pitch on the outer periphery of the molded body, and a means for forming a covering body on the conductive member and the outer periphery of the first molded body. Parts manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6067538A JP2955915B2 (en) | 1993-03-31 | 1994-03-11 | Electronic components such as chip inductors, their manufacturing method and their manufacturing equipment |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5-94957 | 1993-03-31 | ||
| JP9495793 | 1993-03-31 | ||
| JP6067538A JP2955915B2 (en) | 1993-03-31 | 1994-03-11 | Electronic components such as chip inductors, their manufacturing method and their manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06338416A true JPH06338416A (en) | 1994-12-06 |
| JP2955915B2 JP2955915B2 (en) | 1999-10-04 |
Family
ID=26408760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6067538A Expired - Fee Related JP2955915B2 (en) | 1993-03-31 | 1994-03-11 | Electronic components such as chip inductors, their manufacturing method and their manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2955915B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343648A (en) * | 2001-05-14 | 2002-11-29 | Hioki Ee Corp | Winding part, transformer, and method of manufacturing the part |
| JP2013062353A (en) * | 2011-09-13 | 2013-04-04 | Taiyo Yuden Co Ltd | Chip bead and manufacturing method thereof |
| JP2018110215A (en) * | 2017-01-02 | 2018-07-12 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Coil component |
| US10692652B2 (en) * | 2009-08-04 | 2020-06-23 | The Boeing Company | Methods for manufacturing magnetic composite structures with high mechanical strength |
-
1994
- 1994-03-11 JP JP6067538A patent/JP2955915B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002343648A (en) * | 2001-05-14 | 2002-11-29 | Hioki Ee Corp | Winding part, transformer, and method of manufacturing the part |
| US10692652B2 (en) * | 2009-08-04 | 2020-06-23 | The Boeing Company | Methods for manufacturing magnetic composite structures with high mechanical strength |
| JP2013062353A (en) * | 2011-09-13 | 2013-04-04 | Taiyo Yuden Co Ltd | Chip bead and manufacturing method thereof |
| JP2018110215A (en) * | 2017-01-02 | 2018-07-12 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Coil component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2955915B2 (en) | 1999-10-04 |
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