JPH0633498B2 - Tin-lead alloy electroplating bath composition - Google Patents
Tin-lead alloy electroplating bath compositionInfo
- Publication number
- JPH0633498B2 JPH0633498B2 JP2276194A JP27619490A JPH0633498B2 JP H0633498 B2 JPH0633498 B2 JP H0633498B2 JP 2276194 A JP2276194 A JP 2276194A JP 27619490 A JP27619490 A JP 27619490A JP H0633498 B2 JPH0633498 B2 JP H0633498B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- lead alloy
- plating
- electroplating bath
- bath composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は例えば多層セラミック容量コンデンサを他の部
品にはんだ付けするため、端子に設けたニッケル等のバ
リヤー層に更にスズ−鉛合金めっきを行なうためのスズ
−鉛合金電気めっき浴組成物に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Field of Application> In the present invention, for example, in order to solder a multilayer ceramic capacitor to other parts, a barrier layer such as nickel provided on a terminal is further plated with tin-lead alloy. Tin-lead alloy electroplating bath composition for
〈従来の技術〉 セラミック部品に電導性の含銀インクを焼き付けて端子
とし、これを直接プリント配電板にはんだ付けすると、
銀が溶解して端子が無くなる。このため銀端子にバリヤ
ー層を設けてからはんだ付けする方法が行なわれてい
る。<Prior art> When a conductive silver-containing ink is printed on a ceramic part to form a terminal, and this is directly soldered to a printed power distribution board,
The silver melts and the terminals disappear. For this reason, a method of soldering after providing a barrier layer on the silver terminal is performed.
この場合、バリヤー層とはんだ層とは長期間安定に、例
えば剥離等を生ずることなく維持されることが必要であ
る。In this case, it is necessary that the barrier layer and the solder layer are maintained stable for a long period of time, for example, without peeling or the like.
このため従来よりスズめっき、スズ−鉛合金めっきが行
なわれているが、この場合のめっき浴はスズめっきが中
性浴、スズ−鉛合金めっき浴は有機スルフォン酸の酸性
浴である。For this reason, tin plating and tin-lead alloy plating have been conventionally performed. In this case, the tin plating is a neutral bath and the tin-lead alloy plating bath is an organic sulfonic acid acid bath.
〈発明が解決しようとする課題〉 この方法は次ぎのような欠点がある。<Problems to be Solved by the Invention> This method has the following drawbacks.
スズめっきは、はんだに比べ融点が高く２００℃付近の
低温では、はんだ付け性に問題があり更にめっき後の品
物の保存期間が長くなるとはんだ付け性が低下する。Tin plating has a melting point higher than that of solder and has a problem in solderability at a low temperature of about 200 ° C., and further, the solderability is deteriorated when the storage period of the product after plating is prolonged.
はんだめっきは、めっき液が酸性であるため、めっき素
材及び銀焼付け部を侵す場合があり品物によっては全く
めっきできない場合もある。In solder plating, since the plating solution is acidic, the plating material and the silver-baked portion may be attacked, and depending on the product, plating may not be possible at all.
本発明は前記の欠点のないスズ−鉛合金電気めっき浴組
成物を提供することを目的とする。The present invention aims to provide a tin-lead alloy electroplating bath composition which does not have the above-mentioned drawbacks.
〈課題を解決するための手段〉 前記目的を達するための本発明は、 (1)錯化剤として、 ヘプトン酸及びそのアルカリ塩、の少なくとも一種をヘ
プトン酸として９０ｇ／〜２２５ｇ／、 (2)スズ−鉛合金被膜形成剤として、 ＳｎＯ、ＳｎＣｌ２、 の少なくとも一種をスズとして６ｇ／〜２０ｇ／、
ＰｂＯ、Ｐｂ（ＣＨ３ＣＯ２）２の少なくとも一種を鉛
として０．６ｇ／〜４ｇ／、 (3)電導性塩を２０ｇ／〜６０ｇ／、 (4)防腐剤として、 ホウ酸を０．５ｇ〜５ｇ／ を実質的主成分として含有するスズ−鉛合金電気めっき
浴組成物に関する。<Means for Solving the Problems> The present invention for achieving the above-mentioned object includes: (1) As a complexing agent, at least one of heptonic acid and an alkali salt thereof is 90 g / to 225 g / as heptonic acid, and (2) As a tin-lead alloy film-forming agent, SnO, SnCl 2 , at least one of tin is 6 g / to 20 g /,
At least one of PbO and Pb (CH 3 CO 2 ) 2 is 0.6 g / to 4 g / as lead, (3) conductive salt is 20 g / to 60 g /, (4) preservative is 0.5 g of boric acid. The present invention relates to a tin-lead alloy electroplating bath composition containing substantially 5 g / as a main component.
次ぎに各成分について詳しく説明する。Next, each component will be described in detail.
ヘプトン酸及びその塩類として特にヘプトン酸ナトリウ
ム、ヘプトン酸カリウムが好ましい。As heptonic acid and salts thereof, sodium heptonate and potassium heptonate are particularly preferable.
ヘプトン酸又はそれらの塩があると、スズ、及び鉛と錯
化合物を形成し、中性付近で安定して溶解する。そして
含有量が前記記載の量より少ないと、スズが加水分解し
て白色の沈殿を生成し、又、多すぎると、電流効率の低
下をきたす。If heptonic acid or a salt thereof is present, it forms a complex compound with tin and lead and is stably dissolved in the vicinity of neutrality. When the content is less than the above-mentioned amount, tin is hydrolyzed to form a white precipitate, and when it is too large, the current efficiency is lowered.
合金被膜形成剤は生成せるめっき被膜が剥れることな
く、且つ安定であるためには、前記のスズ化合物、鉛化
合物であることが必要である。The alloy film forming agent needs to be the tin compound or the lead compound described above in order that the plating film that is produced does not peel off and is stable.
即ちスズ化合物としてはＳｎＯ、ＳｎＣｌ２等二価の化
合物であること、又鉛化合物として、ＰｂＯ、Ｐｂ（Ｃ
Ｈ３ＣＯＯ）２等が好ましい。That is, the tin compound is a divalent compound such as SnO and SnCl 2 , and the lead compound is PbO and Pb (C
H 3 COO) 2 and the like are preferable.
本発明の電気めっき浴組成物は導電性であることが必要
であり、公知の導電剤例えば酢酸ナトリウムや塩化ナト
リウムを添加する。その組成物の含有量は２０ｇ／〜
６０ｇ／の範囲が実用的である。The electroplating bath composition of the present invention needs to be conductive, and a known conductive agent such as sodium acetate or sodium chloride is added. The content of the composition is 20 g / ~
A range of 60 g / practical is practical.
ホウ酸の添加の目的はめっき液に発生してくるかび発生
の防止である。その添加量が、前記の範囲外の場合は多
すぎるとホウ酸自身が沈殿したり、少ないと防腐効果が
低下する。その外に必要により光沢剤を含有させてもよ
い。The purpose of adding boric acid is to prevent the generation of mold that occurs in the plating solution. If the amount added is outside the above range, boric acid itself will precipitate if the amount is too large, or the antiseptic effect will decrease if the amount is too small. In addition to that, a brightening agent may be contained if necessary.
光沢剤としては、例えばポリエチレングリコール（ＰＥ
Ｇ）、ポリエチレングリコールノニルフェニルエーテル
（ＰＥＧＮＰＥ）、２−ベンゾチアゾール等が好適に用
いられる。Examples of the brightener include polyethylene glycol (PE
G), polyethylene glycol nonylphenyl ether (PEGNPE), 2-benzothiazole and the like are preferably used.
次に本めっき浴を用いる電気めっき浴条件を示す。Next, the electroplating bath conditions using the present plating bath are shown.
陽極は、はんだ板（スズ９０％、鉛１０％）〜（スズ６
０％、鉛４０％） 陰極は、セラミックビーズの導体部、 陰極電流密度０．０５Ａ／ｄｍ２〜１Ａ／ｄｍ２陽極電
流密度０．３Ａ／ｄｍ２〜１Ａ／ｄｍ２ 又浴温は２０℃〜３０℃である。The anode is a solder plate (90% tin, 10% lead) to (tin 6%).
0%, 40% lead) The cathode is the conductor part of the ceramic beads, the cathode current density is 0.05A / dm 2 to 1A / dm 2, the anode current density is 0.3A / dm 2 to 1A / dm 2, and the bath temperature is 20 ° C. ~ 30 ° C.
本発明の電気めっき浴を用いて例えば前述せる多層セラ
ミック容量コンデンサのバリヤー層にスズ−鉛合金めっ
きを生成させる従来のめっきを用いた場合に比し、次の
様な優れた特徴を有する。Compared with the case where the conventional plating for producing the tin-lead alloy plating is used for the barrier layer of the above-mentioned multilayer ceramic capacitor using the electroplating bath of the present invention, for example, it has the following excellent characteristics.
〈発明の効果〉 はんだ付け良好なスズ−鉛合金層を形成し、めっき液は
安定で沈殿等の生成がなく、又カビ発生等の心配もな
い。<Effects of the Invention> A tin-lead alloy layer that is well-soldered is formed, the plating solution is stable, no precipitation or the like is generated, and there is no fear of mold or the like.
次に実施例、比較例を表に示す。Next, examples and comparative examples are shown in the table.
めっきすべき物質としては銀ペースト焼付セラミックビ
ーズを用い、ダミー（鋼球）φ０．８ｍｍと共にバレル
内に入れ、表に示す条件で４〜８回回転させてめっきを
行なった。Silver paste-baked ceramic beads were used as the substance to be plated, placed in a barrel together with a dummy (steel ball) φ 0.8 mm, and plated by rotating 4 to 8 times under the conditions shown in the table.
比較例Ａは本発明のめっき浴と構成成分が共通であり、
比較例Ｂは、構成成分が異なる公知成分を示す。そして
めっき膜及びめっき浴について次の様なテストを行な
い、その結果を表に示した。Comparative Example A has the same components as the plating bath of the present invention,
Comparative Example B shows known components having different constituents. Then, the following tests were conducted on the plating film and the plating bath, and the results are shown in the table.
合金組成及び膜厚測定 セイコー電子工業株式会社製けい光Ｘ線による合金膜厚
測定装置により測定した。Alloy composition and film thickness measurement It was measured by an alloy film thickness measuring device using fluorescent X-ray manufactured by Seiko Denshi Kogyo Co., Ltd.
はんだ付け性試験 ２５％ロジンアルコール液に浸漬後、２００℃のはんだ
浴に３秒間浸漬し、めっき面積の９０％以上がぬれた場
合を〇、９０％に達しないものを×とした。Solderability test After dipping in a 25% rosin alcohol solution, dipping in a solder bath at 200 ° C for 3 seconds, 90% or more of the plating area was wet, and x was 90% if it did not reach 90%.
短絡検査 めっき部分の伸びを拡大鏡で観察し、パターン間のショ
ートの有無を検査した。ショートの無いものを〇、或る
ものを×とした。Short-circuit inspection The elongation of the plated portion was observed with a magnifying glass, and the presence or absence of a short circuit between patterns was inspected. Those with no short circuit were marked with ◯ and some with x.
めっき液かび発生検査 めっき液を１０日間放置し、液の表面を観察し、かびの
発生の或るものを×、無いものを〇とした。Mold liquid mold generation test The plating liquid was left for 10 days and the surface of the liquid was observed.
本発明の電気めっき浴組成物は、実用的にチップコンデ
ンサー、セラミックビーズ等絶縁を必要とする小部分の
スズ−Ｐｂ合金めっき浴用として好的である。 INDUSTRIAL APPLICABILITY The electroplating bath composition of the present invention is practically suitable for a small portion of a tin-Pb alloy plating bath that requires insulation such as a chip capacitor and ceramic beads.
Claims (1)
５ｇ／、 スズ−鉛合金被膜形成剤として、 ＳｎＯ、ＳｎＣｌ２、 の少なくとも一種をスズとして６ｇ／〜２０ｇ／、
ＰｂＯ、Ｐｂ（ＣＨ３ＣＯ２）２の少なくとも一種を鉛
として０．６ｇ／〜４ｇ／、 電導性塩を２０ｇ／〜６０ｇ／、 防腐剤として、 ホウ酸を０．５ｇ〜５ｇ／ を実質的主成分として含有するスズ−鉛合金電気めっき
浴組成物。1. As a complexing agent, at least one of heptonic acid and its alkali salt, as heptonic acid, is 90 g / ~ 22.
5 g /, as a tin-lead alloy film forming agent, SnO, SnCl 2 , at least one kind of tin is 6 g / to 20 g /,
At least one of PbO and Pb (CH 3 CO 2 ) 2 is 0.6 g / to 4 g / as lead, the conductive salt is 20 g / to 60 g /, and the preservative is boric acid 0.5 g to 5 g / substantially. A tin-lead alloy electroplating bath composition containing as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2276194A JPH0633498B2 (en) | 1990-10-17 | 1990-10-17 | Tin-lead alloy electroplating bath composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2276194A JPH0633498B2 (en) | 1990-10-17 | 1990-10-17 | Tin-lead alloy electroplating bath composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04154983A JPH04154983A (en) | 1992-05-27 |
| JPH0633498B2 true JPH0633498B2 (en) | 1994-05-02 |
Family
ID=17566010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2276194A Expired - Fee Related JPH0633498B2 (en) | 1990-10-17 | 1990-10-17 | Tin-lead alloy electroplating bath composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0633498B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102424995A (en) * | 2011-12-17 | 2012-04-25 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | Tin-indium alloy electroplating liquid |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003272790A1 (en) | 2002-10-08 | 2004-05-04 | Honeywell International Inc. | Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials |
-
1990
- 1990-10-17 JP JP2276194A patent/JPH0633498B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102424995A (en) * | 2011-12-17 | 2012-04-25 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | Tin-indium alloy electroplating liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04154983A (en) | 1992-05-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |