JPH0633461B2 - Electroless plating method and pretreatment agent for electroless plating - Google Patents
Electroless plating method and pretreatment agent for electroless platingInfo
- Publication number
- JPH0633461B2 JPH0633461B2 JP7109990A JP7109990A JPH0633461B2 JP H0633461 B2 JPH0633461 B2 JP H0633461B2 JP 7109990 A JP7109990 A JP 7109990A JP 7109990 A JP7109990 A JP 7109990A JP H0633461 B2 JPH0633461 B2 JP H0633461B2
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- chitosan
- catalyst
- plating
- treatment liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、非導電性物質等の無電解めっき方法及び無電
解めっき用前処理剤に関し、詳細には、密着性の高いめ
っき層を効率良く形成すると共に、部分的めっきにも適
用し得るような無電解めっき方法及び無電解めっき用前
処理剤に関するものである。本発明は、非導電性物質の
導体化処理、各種部材の内面コーティングや電磁波シー
ルド機能の付与、印刷回路のめっき、Ｃｏ合金薄膜の製
造等に利用することができる。Description: TECHNICAL FIELD The present invention relates to a method for electroless plating of a non-conductive substance and a pretreatment agent for electroless plating. The present invention relates to an electroless plating method and a pretreatment agent for electroless plating which are well formed and can be applied to partial plating. INDUSTRIAL APPLICABILITY The present invention can be used for a conductor treatment of a non-conductive substance, an inner surface coating of various members, an electromagnetic wave shielding function, a printed circuit plating, a Co alloy thin film production and the like.
電流を利用して電気化学反応によって金属を析出させる
電気めっきに対し、無電解めっきは、電流を用いず、還
元剤の働きによりめっき液中のイオンを還元して被めっ
き物上に析出させるものであり、プラスチック，セラミ
ックス，紙，繊維等の非導電性物質の表面にもめっきし
得る方法として広く利用されている。In contrast to electroplating, which uses an electric current to deposit a metal by an electrochemical reaction, electroless plating reduces the ions in the plating solution by the action of a reducing agent and deposits on the object to be plated without using an electric current. Therefore, it is widely used as a method capable of plating on the surface of non-conductive substances such as plastics, ceramics, paper and fibers.
無電解めっき法の一般的な工程は、第１図に示される通
りであり、これらの工程のうち、エッチング工程は、物
質の表面を親水性にすると共に、物質表面とめっき層の
間の接着を投錨効果によって促進するものであり、主と
して、ブラストやタンブリング等の機械的手段による
か、又は、酸（クロム酸に必要により硫酸や燐酸を添加
した酸等）やアルカリ等の腐食液による化学的手段によ
って行なわれる。The general steps of the electroless plating method are as shown in FIG. 1. Among these steps, the etching step makes the surface of the material hydrophilic and makes the adhesion between the material surface and the plating layer. It is promoted by the anchoring effect, mainly by mechanical means such as blasting or tumbling, or by chemicals such as acid (chromic acid to which sulfuric acid or phosphoric acid is added if necessary) or alkali or corrosive liquid. By means.
そして、無電解めっきを施す非導電性物質の表面には、
通常、還元触媒となる金属塩を生成させる為の、触媒付
与乃至活性化の段階を必要とし、このような還元触媒と
して働く物質としては、Pd，Pt，Au，Ag，Ir，Os，Ru，
及びRhの金属塩が使用される。センシタイジング工程及
びアクチベイティング工程は、エッチングされた被めっ
き物質の表面に、上記触媒金属の活性点を供給する為に
設けられており、センシタイジング工程は、例えば塩化
第１錫の塩酸溶液を作用させることにより行われ、アク
チベイティング工程は、例えばPd塩，Au塩，Ag塩等の溶
液を作用させることにより実施される。And, on the surface of the non-conductive material to be subjected to electroless plating,
Usually, a step of catalyst addition or activation for producing a metal salt that serves as a reduction catalyst is required, and substances that act as such a reduction catalyst include Pd, Pt, Au, Ag, Ir, Os, Ru,
And Rh metal salts are used. The sensitizing step and the activating step are provided to supply the active points of the catalyst metal to the surface of the material to be etched, and the sensitizing step includes, for example, stannous chloride hydrochloric acid. The activating step is carried out by allowing a solution to act, and the activating step is carried out by allowing a solution of Pd salt, Au salt, Ag salt or the like to act.
このような無電解めっき方法において、主たる問題点の
一つは、被めっき物質とめっき層の密着性であり、上記
したような従来の無電解方法では、被めっき物質の表面
にPd等の触媒が十分に付着しないので、めっき不良が発
生することがある。そこで、めっき浴の温度を上げてめ
っき不良の発生を抑える処置がとられているが、その効
果は不十分であり、且つ被めっき物質がプラスチックで
ある場合には被めっき物質が溶融するという問題が発生
する。In such an electroless plating method, one of the main problems is the adhesion between the substance to be plated and the plating layer, and in the conventional electroless method as described above, a catalyst such as Pd is formed on the surface of the substance to be plated. Does not adhere sufficiently, which may result in defective plating. Therefore, measures have been taken to suppress the occurrence of defective plating by raising the temperature of the plating bath, but the effect is insufficient, and when the substance to be plated is plastic, the substance to be plated melts. Occurs.
被めっき物質とめっき層の密着性の改善については、か
ねてより種々の提案が為されており、例えばU.S.P.4670
306 を挙げることができる。Various proposals have been made for some time to improve the adhesion between the substance to be plated and the plating layer. For example, USP4670 has been proposed.
306 can be mentioned.
この公報には、密着性に関係する種々の公知刊行物が提
示されており、本発明の技術的背景を知る上でも有用で
あるが、上記公報の発明自体は、下地の表面を、無電解
めっき触媒に対して適度の吸収性を有する物質でコーテ
ィングし、コーティングした非導電性物質の表面に触媒
及び触媒の促進剤を接触させて触媒を十分に付与した
後、無電解めっきを施す方法であり、これによって下地
となる被めっき物質とめっき層の密着性を改善し得ると
している。そして、上記コーティング物質の好ましいも
のとして、アクリルラテックス塗料及びN-メチル- 2-ピ
ロリドンを添加したアクリルラテックス塗料を挙げてい
る。In this publication, various publicly known publications related to adhesion are presented, which is useful for knowing the technical background of the present invention. This is a method in which a plating catalyst is coated with a substance having an appropriate absorptivity, the catalyst and a catalyst accelerator are brought into contact with the surface of the coated non-conductive substance to sufficiently impart the catalyst, and then electroless plating is performed. It is said that this can improve the adhesion between the material to be plated which is the base and the plating layer. Then, as preferable examples of the coating material, acrylic latex paint and acrylic latex paint to which N-methyl-2-pyrrolidone is added are mentioned.
しかるに上記コーティング物質を使用する無電解めっき
方法は、適用対象となる被めっき物質が限定され、適用
範囲が狭いだけでなく、密着性改善効果も未だ十分では
ない。However, in the electroless plating method using the above-mentioned coating substance, the substance to be plated to be applied is limited, the application range is narrow, and the adhesion improving effect is not yet sufficient.
又、特表昭62-500344 には、不導電性囲いに電磁輻射シ
ールドやＲＦＩシールドを施す方法が開示されており、
この方法では、シールド層の第１層として、アクリルペ
イントにNi，Cu，Fe，Co，Au，Ag，Pt，Pdから選択され
る活性金属粒子を分散させた液状有機結合体を適用し、
第１層の上にさらにNi，Cu，あるいはそれらの合金の無
電解めっき層を第２層として積層している。In addition, Japanese Patent Publication No. 62-500344 discloses a method of applying an electromagnetic radiation shield or an RFI shield to a non-conductive enclosure.
In this method, a liquid organic binder in which active metal particles selected from Ni, Cu, Fe, Co, Au, Ag, Pt, and Pd are dispersed in acrylic paint is applied as the first layer of the shield layer,
An electroless plating layer of Ni, Cu, or an alloy thereof is further laminated as a second layer on the first layer.
しかるに、この方法は、アクリルペイントを活性金属粒
子のバインダーとして使用しているだけで、下地となる
被めっき物質及びめっき層との親和性及び密着性につい
ては十分ではなく、改善の余地が残されている。However, in this method, the acrylic paint is used only as a binder for the active metal particles, and the affinity and adhesion with the material to be plated and the plating layer as the base are not sufficient, leaving room for improvement. ing.
本発明は、こうした事情に着目してなされたものであっ
て、下地との密着性が高いめっき層を効率良く与え、特
に部分的めっきに適用し得るような無電解めっき方法お
よび無電解めっき用前処理剤を提供しようとするもので
ある。The present invention has been made in view of such circumstances, and efficiently provides a plating layer having high adhesion to a base, and particularly for an electroless plating method and electroless plating that can be applied to partial plating. It is intended to provide a pretreatment agent.
しかして上記目的を達成した、この発明の無電解めっき
方法は、非導電性物質の表面に無電解めっき層を形成す
るに当たり、非導電性物質上にキトサン又はキトサン誘
導体を含む処理液を塗布して乾燥させた後、触媒の付与
並びに無電解めっきを行なう点に要旨があり、また、こ
の発明の無電解めっき用前処理剤は、非導電性物質の無
電解めっきに際して使用される処理剤であって、キトサ
ン又はキトサン誘導体を含む処理液からなり、触媒の付
与に先立って行われる前処理工程に使用される点に要旨
が存在する。Thus, the above-mentioned object was achieved, in the electroless plating method of the present invention, in forming an electroless plating layer on the surface of a non-conductive substance, a treatment liquid containing chitosan or a chitosan derivative is applied onto the non-conductive substance. The point is that the catalyst is added and electroless plating is carried out after drying by electrolysis, and the pretreatment agent for electroless plating of the present invention is a treatment agent used in electroless plating of a non-conductive substance. Therefore, the gist resides in that it is composed of a treatment liquid containing chitosan or a chitosan derivative and is used in a pretreatment step performed prior to the addition of a catalyst.
本発明に適用されるキトサン（β-1,4′-ポリ-D-グルコ
サミン）は天然の高分子物質であって、カニ等の甲殻類
などから抽出されるキチン（β- 1,4′- ポリ- N-アセ
チル-D- グルコサミン）を脱アセチル化して得ることが
できる。このキトサンは、アミノ基を有するカチオン性
の電解質ポリマーであり、保水性に優れている。そし
て、本発明では、カルボキシメチルキトサン，グリコー
ルキトサン等のキトサン誘導体をキトサンと同様に使用
することができ、これらのキトサン若しくはキトサン誘
導体は、粉末状あるいは液状のものを使用することがで
きる。Chitosan (β-1,4′-poly-D-glucosamine) applied to the present invention is a natural polymer substance, and chitin (β-1,4′-extracted from crustaceans such as crab etc. Poly-N-acetyl-D-glucosamine) can be obtained by deacetylation. This chitosan is a cationic electrolyte polymer having an amino group and is excellent in water retention. In the present invention, chitosan derivatives such as carboxymethyl chitosan and glycol chitosan can be used in the same manner as chitosan, and these chitosan or chitosan derivative can be powder or liquid.
又、本発明における非導電性物質としては、合成樹脂，
紙，ガラス，陶器等の電気めっき法では直接めっきでな
いものが例示される。Further, as the non-conductive substance in the present invention, synthetic resin,
Examples of electroplating methods for paper, glass, pottery, etc. that are not directly plated.
本発明方法は、上記のような非導電性物質の表面に無電
解めっき層を形成するにあたり、触媒の付与並びに無電
解めっきの各工程に先立って非導電性物質の表面に上記
キトサン若しくはキトサン誘導体（以下単にキトサンと
いう）を含む処理液を塗布して、その表面に親水性被膜
を形成する。こうして得られる親水性被膜は、キトサン
の持つ良好な濡れ性によって下地である非導電性物質に
対して十分に密着すると共に、キトサンが重金属に対し
て強い吸着作用を示すので、親水性被膜の上に形成され
る重金属触媒等からなる触媒層を十分に捕捉する。この
結果、無電解めっき工程において、被めっき面に十分な
量の活性触媒が担持された状態を得ることができ、その
上に、密着性の良い無電解めっき層を均一な状態で効率
良く形成することができる。The method of the present invention, in forming the electroless plating layer on the surface of the non-conductive substance as described above, prior to each step of applying a catalyst and electroless plating, the above chitosan or chitosan derivative on the surface of the non-conductive substance. A treatment liquid containing (hereinafter simply referred to as chitosan) is applied to form a hydrophilic film on the surface. The hydrophilic coating thus obtained adheres sufficiently to the underlying non-conductive substance due to the good wettability of chitosan, and since chitosan exhibits a strong adsorption action for heavy metals, The catalyst layer formed of the heavy metal catalyst or the like is sufficiently captured. As a result, in the electroless plating step, it is possible to obtain a state in which a sufficient amount of active catalyst is carried on the surface to be plated, on which an electroless plating layer with good adhesion can be efficiently formed in a uniform state. can do.
キトサンを含む処理液は、キトサンを0.01乃至１％の範
囲、好ましくは0.1 ％前後含むことが望ましく、0.01％
より少なくなるに従って添加効果が小さくなって下地と
の密着性並びに触媒捕捉性に十分な効果が得られなくな
る。一方、１％を超えて添加しても添加効果が飽和する
だけで不経済となる。The treatment liquid containing chitosan preferably contains chitosan in the range of 0.01 to 1%, preferably around 0.1%, and 0.01%.
As the amount becomes smaller, the effect of addition becomes smaller, and it becomes impossible to obtain sufficient effect on the adhesion to the base and the catalyst trapping property. On the other hand, adding more than 1% is uneconomical because the effect of addition is saturated.
キトサンを含む処理液におけるキトサン以外の成分とし
ては、酢酸，ギ酸，塩酸等の希酸を含むことができ、こ
れらの希酸は、処理液中にキトサンを溶解させる為に使
用される。その濃度は、１％前後、殊に0.2 ％乃至1.5
％が適当である。そして、残部の殆どは、エタノールや
メタノール等の親水性溶媒及び水であり、親水性溶媒
は、キトサンを含む処理液の塗布後の乾燥を早める効果
を発揮する。尚、処理液には、必要により界面活性剤か
らなるレベリング剤を数％の割合で加えることができ、
これにより処理剤を下地表面に薄く広く塗布することが
できる。The components other than chitosan in the treatment liquid containing chitosan may include dilute acids such as acetic acid, formic acid and hydrochloric acid, and these dilute acids are used for dissolving chitosan in the treatment liquid. Its concentration is around 1%, especially 0.2% to 1.5
% Is appropriate. Most of the remaining part is a hydrophilic solvent such as ethanol or methanol and water, and the hydrophilic solvent has an effect of accelerating the drying after the application of the treatment liquid containing chitosan. If necessary, a leveling agent composed of a surfactant can be added to the treatment liquid at a ratio of several%,
This allows the treating agent to be applied thinly and widely on the surface of the base.
このようなキトサンを含む処理液は、下地である非導電
性物質の表面に刷毛塗り，ローラ塗り，スプレー塗り，
浸漬等の手法によって塗布することができ、下地に対し
て優れた密着性を示す親水性被膜を形成することができ
る。The treatment liquid containing such chitosan is brush-coated, roller-coated, spray-coated, or non-conductive on the surface of the non-conductive material as the base.
It can be applied by a technique such as dipping, so that a hydrophilic coating having excellent adhesion to the base can be formed.
下地表面に、このようにキトサンを含む処理液を塗布し
た後、触媒付与並びに無電解めっきの各工程を順次行う
ことにより下地となる非導電性物質の表面に密着性の良
い無電解めっき層を効率良く形成することができる。
又、本発明では、非導電性物質の表面の一部分を、キト
サンを含む処理液で前処理することにより、前処理部分
だけに選択的に触媒を担持させることができ、ひいては
部分的無電解めっきを効果的に実施することができる。
さらに、本発明では、従来無電解めっきが困難であった
スチロール樹脂やアクリル樹脂に対しても良好に無電解
めっきを施すことができる。After applying the treatment solution containing chitosan to the surface of the underlayer, an electroless plating layer with good adhesion is formed on the surface of the underlying non-conductive substance by sequentially performing the steps of catalyst application and electroless plating. It can be formed efficiently.
Further, in the present invention, by pretreating a part of the surface of the non-conductive substance with a treatment liquid containing chitosan, the catalyst can be selectively carried only on the pretreated portion, and by extension, the partial electroless plating is performed. Can be effectively implemented.
Further, in the present invention, electroless plating can be favorably applied to styrene resin or acrylic resin, which has been difficult to perform electroless plating in the past.
又、上記では、下地となる非導電性物質の表面に直接キ
トサンを含む処理液を塗布したが、キトサンを含む処理
液の塗布に先立って下塗塗料を塗装しておくことが望ま
しく、下塗塗料を形成するによって、被めっき面にミク
ロな凹凸を形成することができ、投錨効果によって無電
解めっき層の密着性を高めることができる。即ち、下塗
塗料の塗布は、エッチングの代替処理であり、物理的あ
るいは化学的なエッチングに比べてマイルドな処理であ
って、微細な凹凸面を提供できると共に、設備的にも低
コストで下地処理を実施することができる。下塗塗料に
ついては、油性系，ラッカー系，合成樹脂系等の種々の
塗料を利用することができ、その種類には特に制限を設
けないが、下地に対する密着性の優れた塗料を採用する
ことが望まれる。Further, in the above, the treatment liquid containing chitosan was directly applied to the surface of the non-conductive substance as the base, but it is desirable to apply the undercoat paint prior to the application of the treatment liquid containing chitosan. By forming it, micro unevenness can be formed on the surface to be plated, and the adhesion of the electroless plating layer can be enhanced by the anchoring effect. That is, the application of the undercoat paint is an alternative treatment to etching, which is milder than physical or chemical etching, can provide a fine uneven surface, and can be used as a base treatment at a low cost in terms of equipment. Can be carried out. As the undercoat paint, various paints such as oil-based paints, lacquer-based paints, and synthetic resin-based paints can be used. There is no particular limitation on the type of paint, but it is possible to use paints with excellent adhesion to the base. desired.
触媒付与工程については、無電解めっきにおいて従来か
ら採用されている方法を採用することができ、上記した
ように、前処理を行った後、例えば塩化第１錫の水溶液
でセンシタイジングを行い、次いで、Pd，Ni，Cu，Fe，
Co，Au，Ag，Pt等の触媒金属あるいはその化合物によっ
てアクチベイティングを行うことにより触媒付与工程を
完了することができる。そして、触媒を付与した被めっ
き面をCu，Ni，Co，Pd，Auあるいはその合金のめっき浴
に浸漬すると、活性触媒の還元作用により無電解めっき
層を効率良く形成することができ、目的とする非導電性
物質の無電解めっき材を得ることができる。For the catalyst application step, a method conventionally used in electroless plating can be adopted, and as described above, after pretreatment, for example, sensitizing with an aqueous solution of stannous chloride, Next, Pd, Ni, Cu, Fe,
The catalyst application step can be completed by activating with a catalytic metal such as Co, Au, Ag, or Pt or a compound thereof. When the surface to be plated with the catalyst is immersed in the plating bath of Cu, Ni, Co, Pd, Au or its alloy, the electroless plating layer can be efficiently formed by the reducing action of the active catalyst. It is possible to obtain an electroless plated material of a non-conductive substance which is used.
スチロール樹脂材の表面に、アクリル系下塗塗料をスプ
レー或いは刷毛を用いて塗布した後、キトサンを含む処
理液（キトサン0.5 ％、酢酸0.5 ％、残部：メタノール
及び水）を下塗塗料塗装面に塗布し、充分に乾燥させ
た。After applying an acrylic undercoat onto the surface of the styrene resin material using a spray or brush, apply a treatment solution containing chitosan (chitosan 0.5%, acetic acid 0.5%, balance: methanol and water) to the undercoat paint surface. , Dried thoroughly.
次いで第１表に示す鋭敏化剤及び活性化剤を下記の組合
わせで夫々使用して上記処理液塗布面への触媒付与を行
った後（鋭敏化処理及び活性化処理は夫々10秒）、第２
表に示す組成のめっき浴に30分間投入して無電解めっき
を施した。Then, the sensitizer and the activator shown in Table 1 were used in the following combinations, respectively, to apply the catalyst to the surface coated with the treatment liquid (sensitization treatment and activation treatment were each 10 seconds). Second
Electroless plating was performed by placing the plating bath having the composition shown in the table for 30 minutes.
（実験条件） 実験１：鋭敏化剤Ａ→活性化剤Ｃ 実験２：鋭敏化剤Ｂ→活性化剤Ｃ 実験３：鋭敏化剤Ａ→活性化剤Ｄ キトサンを含む処理液を塗布して十分に乾燥させた後、
鋭敏化剤Ａ及び活性化剤Ｃを使用した実験１では、キト
サンを含む処理液を塗布した面に触媒を十分に付与する
ことができ、密着性の良い無電解めっき層（厚さ１乃至
２μｍ）を選択的に形成することができた。(Experimental conditions) Experiment 1: Sensitizer A → Activator C Experiment 2: Sensitizer B → Activator C Experiment 3: Sensitizer A → Activator D After applying the treatment liquid containing chitosan and drying it sufficiently,
In Experiment 1 using the sensitizer A and the activator C, an electroless plating layer (thickness: 1 to 2 μm) having sufficient adhesion and good adhesion of the catalyst to the surface coated with the treatment liquid containing chitosan can be provided. ) Could be selectively formed.
ちなみに、実験１で得られたNiめっき層の外観及び密着
性に関する各種の試験結果は、第３表に示す通りであっ
た。密着性は、10mm×10mmのめっき形成面を縦横１mm毎
に100 の微小区域に区画して、該めっき層形成面にセロ
テープを貼りつけた後、引き剥がしたときの〔残留めっ
き区域の数／全区域数〕で評価した。第３表に示される
ように、実験１で得られたNiめっき層は、種々の試験で
も良好な外観及び優れた密着性を示すことが確認され
た。By the way, various test results regarding the appearance and adhesion of the Ni plating layer obtained in Experiment 1 are as shown in Table 3. Adhesion is determined by dividing the 10 mm x 10 mm plating forming surface into 100 minute areas every 1 mm in the vertical and horizontal directions, applying cellophane tape to the plating layer forming surface, and then peeling it [the number of remaining plating areas / The total number of areas] was evaluated. As shown in Table 3, it was confirmed that the Ni plating layer obtained in Experiment 1 showed good appearance and excellent adhesion even in various tests.
これに対し、実験２では鋭敏化剤Ｂが全面的に、即ちキ
トサンを含む処理液を塗装した面以外の面にもある程度
付着し、これに伴い活性化も全面的に進行して選択的に
めっきすることができず、しかも裏面側の処理液非塗布
面ではめっき層の密着不良が発生した。又、実験３で
は、活性化剤ＤのPdが鋭敏化剤のSnと置換し難い為に、
十分に触媒を付与することができず、非めっき部が発生
した。On the other hand, in Experiment 2, the sensitizer B adhered to the entire surface, that is, to the surface other than the surface coated with the treatment liquid containing chitosan to some extent, and along with this, the activation also proceeded to the entire surface and selectively. Plating could not be performed, and poor adhesion of the plating layer occurred on the back surface not coated with the treatment liquid. In Experiment 3, since Pd of the activator D is difficult to replace Sn of the sensitizer,
The catalyst could not be applied sufficiently and a non-plated portion was generated.
一方、上記実験１と同様の条件であるが、キトサンを含
む処理液を塗装した後の乾燥を、十分に行わなかった場
合には、めっき面に色むら及びふくれが発生した。On the other hand, under the same conditions as in Experiment 1 above, if the treatment liquid containing chitosan was not sufficiently dried after being applied, color unevenness and blistering occurred on the plated surface.
さらに、上記実験１において、めっき浴を第４表に示す
銅めっき浴とした以外は同様の条件で無電解めっきを行
ったところ、スチロール樹脂表面に良好なCuめっき層を
選択的に形成することができた。 Furthermore, in the above Experiment 1, when electroless plating was performed under the same conditions except that the plating bath was changed to the copper plating bath shown in Table 4, a good Cu plating layer was selectively formed on the styrene resin surface. I was able to.
〔発明の効果〕 本発明は、以上のように構成されており、下地である非
導電性物質の表面に、密着性の良い無電解めっき層を効
率良く形成することができる。又、本発明では、キトサ
ンを含む処理液を塗布した面に選択的にめっき層を形成
することができ、必要部分だけにめっきを施す部分的め
っきを自由に実施することができる。さらに、キトサン
を含む処理液を塗布することにより、エッチング工程を
省略することができ、めっき工程を簡素化して生産性を
高めることができる。しかも密着性に優れた高品質のめ
っき製品を得ることができる。 [Effects of the Invention] The present invention is configured as described above, and an electroless plating layer having good adhesion can be efficiently formed on the surface of a non-conductive substance as a base. Further, in the present invention, the plating layer can be selectively formed on the surface coated with the treatment liquid containing chitosan, and the partial plating for plating only the necessary portion can be freely performed. Further, by applying the treatment liquid containing chitosan, the etching step can be omitted, the plating step can be simplified, and the productivity can be improved. Moreover, it is possible to obtain a high-quality plated product with excellent adhesion.
かくして電磁波シールドや内面金属コーティング等の分
野に多大な利益を与えることができた。Thus, great benefits could be given to fields such as electromagnetic wave shields and inner metal coatings.
第１図は、一般的な無電解めっき工程を示すフロー説明
図である。FIG. 1 is a flow explanatory diagram showing a general electroless plating process.
Claims (3)
成するに当たり、非導電性物質上にキトサン又はキトサ
ン誘導体を含む処理液を塗布して乾燥させた後、触媒の
付与並びに無電解めっきを行なうことを特徴とする無電
解めっき方法。1. When forming an electroless plating layer on the surface of a non-conductive substance, a treatment liquid containing chitosan or a chitosan derivative is applied onto the non-conductive substance and dried, and then a catalyst is added and electroless is applied. An electroless plating method characterized by performing plating.
を塗布するに先立って、非導電性物質上に下塗塗料を塗
布する請求項１に記載の無電解めっき方法。2. The electroless plating method according to claim 1, wherein an undercoat paint is applied onto the non-conductive substance prior to applying the treatment liquid containing chitosan or a chitosan derivative.
処理剤であって、キトサン又はキトサン誘導体を含む処
理液からなり、触媒の付与に先立って行われる前処理工
程に使用されることを特徴とする無電解めっき用前処理
剤。3. A treatment agent used for electroless plating of a non-conductive substance, comprising a treatment liquid containing chitosan or a chitosan derivative, which is used in a pretreatment step performed prior to applying a catalyst. A pretreatment agent for electroless plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7109990A JPH0633461B2 (en) | 1990-03-20 | 1990-03-20 | Electroless plating method and pretreatment agent for electroless plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7109990A JPH0633461B2 (en) | 1990-03-20 | 1990-03-20 | Electroless plating method and pretreatment agent for electroless plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03271375A JPH03271375A (en) | 1991-12-03 |
| JPH0633461B2 true JPH0633461B2 (en) | 1994-05-02 |
Family
ID=13450757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7109990A Expired - Fee Related JPH0633461B2 (en) | 1990-03-20 | 1990-03-20 | Electroless plating method and pretreatment agent for electroless plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0633461B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3951137B2 (en) | 2004-02-04 | 2007-08-01 | セイコーエプソン株式会社 | Wiring board manufacturing method and electronic device manufacturing method |
| JP3894327B2 (en) * | 2004-02-04 | 2007-03-22 | セイコーエプソン株式会社 | Wiring board manufacturing method and electronic device manufacturing method |
| RU2494984C2 (en) * | 2008-03-19 | 2013-10-10 | Агратек Интернэшнл, Инк. | Chitosan-covered hydrophobic glass and of its production |
| CN103614756B (en) * | 2013-11-15 | 2015-10-21 | 武汉大学 | A kind of preparation method of hollow multilayer aquagel |
| CN116782516B (en) * | 2023-07-13 | 2024-01-23 | 南华大学 | Universal process for preparing copper printed circuit based on homogeneous ion type catalytic ink |
-
1990
- 1990-03-20 JP JP7109990A patent/JPH0633461B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03271375A (en) | 1991-12-03 |
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