JPH06334389A - Axial electronic component inserting device - Google Patents
Axial electronic component inserting deviceInfo
- Publication number
- JPH06334389A JPH06334389A JP5121281A JP12128193A JPH06334389A JP H06334389 A JPH06334389 A JP H06334389A JP 5121281 A JP5121281 A JP 5121281A JP 12128193 A JP12128193 A JP 12128193A JP H06334389 A JPH06334389 A JP H06334389A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- molding
- lead wire
- lead wires
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リード線を有する電子
部品を基板の所定穴に自動的に挿入する電子部品自動挿
入機における電子部品の挿入装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting apparatus in an automatic electronic component inserting machine for automatically inserting an electronic component having a lead wire into a predetermined hole of a substrate.
【０００２】[0002]
【従来の技術】従来のアキシャル型電子部品挿入装置で
は、図２（ａ）に示すように固定された状態の保持レバ
ー９ａ、９ｂによって保持された電子部品１のリード線
部２ａ、２ｂを、リード線部の成形方向を強制しかつ基
板所定穴までリード線部をガイドする溝を有する成形レ
バー３ａ、３ｂによって図２（ｂ）の様に成形し、プッ
シャー４ａ、４ｂによって基板１０の所定穴１１ａ、１
１ｂに電子部品１のリード線部２ａ、２ｂを挿入してい
た。2. Description of the Related Art In a conventional axial type electronic component inserting apparatus, as shown in FIG. 2A, the lead wire portions 2a, 2b of the electronic component 1 held by holding levers 9a, 9b in a fixed state are Molded as shown in FIG. 2B by the molding levers 3a and 3b having a groove for forcing the molding direction of the lead wire portion and guiding the lead wire portion to the predetermined hole of the substrate, and the pusher 4a and 4b to mold the predetermined hole of the substrate 10. 11a, 1
The lead wire portions 2a and 2b of the electronic component 1 were inserted in 1b.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上記のよ
うな方法では、リード線の線径の異なる電子部品を数種
類挿入する場合、成形後のリード線の折り曲げ角度や曲
げγ等のリード線の成形状態が線径によって左右される
為、挿入ミスにつながるという問題があった。そのため
従来の装置で線径の異なる電子部品に対して一定したリ
ード線の成形を行うためには、線径の異なる電子部品毎
に線径に応じた溝を有する成形レバーを使用する必要が
あった。However, in the above method, when several kinds of electronic parts having different lead wire diameters are inserted, the lead wire forming condition such as the bending angle and bending γ of the lead wire after forming Since it depends on the wire diameter, there was a problem that it could lead to insertion error. Therefore, in order to form a constant lead wire for electronic components having different wire diameters with the conventional device, it is necessary to use a molding lever having a groove corresponding to the wire diameter for each electronic component having a different wire diameter. It was
【０００４】本発明は、上記問題点に鑑み、挿入装置の
部品を交換すること無く、リード線の線径の異なる電子
部品に対して一定したリード線の成形が出来ることを目
的とするものである。In view of the above problems, it is an object of the present invention to form a constant lead wire for electronic parts having different wire diameters without replacing the parts of the insertion device. is there.
【０００５】[0005]
【課題を解決するための手段】上記問題点を解決するた
めに、本発明の電子部品挿入装置は、基板所定穴のピッ
チと同一ピッチにアキシャル型電子部品のリード線部を
成形する成形ガイドと、前記電子部品リード線部を成形
時に下から保持する保持レバーと、成形後に前記電子部
品リード線部を前記所定穴に押し込むプッシャーとから
なり、成形するリード線の線径に応じて前記保持レバー
が前記電子部品のリード線延出方向に揺動する事を特徴
とする。In order to solve the above-mentioned problems, an electronic component inserting apparatus of the present invention includes a molding guide for molding the lead wire portion of an axial type electronic component at the same pitch as the pitch of the predetermined holes of the substrate. A holding lever that holds the electronic component lead wire portion from below during molding, and a pusher that pushes the electronic component lead wire portion into the predetermined hole after molding, and the holding lever according to the wire diameter of the lead wire to be molded. Oscillates in the lead wire extending direction of the electronic component.
【０００６】[0006]
【作用】本発明は、上記したアキシャル型電子部品挿入
装置によって、挿入装置の部品を交換すること無く、リ
ード線の線径の異なる電子部品に対して一定したリード
線の成形を行うことが可能となる。According to the present invention, the above-mentioned axial type electronic component inserting apparatus can perform constant lead wire molding for electronic components having different lead wire diameters without replacing the components of the inserting apparatus. Becomes
【０００７】[0007]
【実施例】以下本発明のアキシャル型電子部品挿入装置
の一実施例を図面を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an axial type electronic component inserting apparatus of the present invention will be described below with reference to the drawings.
【０００８】図１（ａ）は、本発明の一実施例の電子部
品挿入装置の成形保持部の具体構成を示すもので、３
ａ、３ｂは電子部品１のリード線２ａ、２ｂを成形する
ための成形レバーである。５ａ、５ｂは、リード線２
ａ、２ｂの成形時に電子部品１のリード線２ａ、２ｂを
保持する保持レバー先端部である。６ａ、６ｂは、保持
レバー先端部を取り付けるためのブロック、７ａ、７ｂ
は保持レバー先端部５ａ、５ｂと、取り付けブロック６
ａ、６ｂを結合している支点ピンで、８ａ、８ｂは保持
レバー先端部５ａ、５ｂの揺動方向に力を加えているバ
ネである。FIG. 1 (a) shows a concrete structure of a molding holding portion of an electronic component inserting apparatus according to an embodiment of the present invention.
Reference numerals a and 3b are molding levers for molding the lead wires 2a and 2b of the electronic component 1. 5a and 5b are lead wires 2
It is a tip portion of a holding lever that holds the lead wires 2a and 2b of the electronic component 1 when forming a and 2b. 6a and 6b are blocks for attaching the holding lever tip, and 7a and 7b.
Are holding lever tips 5a and 5b and a mounting block 6
A fulcrum pin connecting a and 6b, and 8a and 8b are springs that apply a force in the swinging direction of the holding lever tip portions 5a and 5b.
【０００９】以上のように構成された電子部品挿入装置
の一実施例の動作について図面を用いて説明する。図１
（ｂ）は電子部品のリード線２ａ、２ｂを成形する前の
状態を示したものであり、成形レバー３ａ、３ｂが図の
矢印Ｂの方向に摺動する事によって電子部品１のリード
線２ａ、２ｂが図１（ｃ）に示すように成形される。そ
の際図１（ａ）において電子部品のリード線２ａ、２ｂ
の線径に応じて保持レバー先端部５ａ、５ｂが支点ピン
７ａ、７ｂを支点として図に示す矢印Ａの方向に揺動す
る事により、挿入装置の部品を交換すること無く、リー
ド線の線径の異なる電子部品に対して一定したリード線
の成形を行うことが可能となる。The operation of one embodiment of the electronic component inserting apparatus configured as described above will be described with reference to the drawings. Figure 1
(B) shows the state before molding the lead wires 2a, 2b of the electronic component. The lead wires 2a of the electronic component 1 are caused by the molding levers 3a, 3b sliding in the direction of arrow B in the figure. 2b is molded as shown in FIG. 1 (c). At that time, in FIG. 1 (a), the lead wires 2a, 2b of the electronic component are shown.
Depending on the wire diameter, the holding lever tips 5a, 5b swing in the direction of arrow A shown in the figure with the fulcrum pins 7a, 7b as fulcrums, so that the wire of the lead wire can be replaced without replacing parts of the insertion device. It is possible to form a constant lead wire for electronic components having different diameters.
【００１０】[0010]
【発明の効果】以上のように本発明は、部品本体から延
出する一対のリード線を有するアキシャル型電子部品
を、基板の所定穴に挿入する装置であって、前記所定穴
のピッチと同一ピッチに前記電子部品のリード線部を成
形する成形ガイドと、前記電子部品リード線部を成形時
に下から保持する保持レバーと、成形後に前記電子部品
リード線部を前記所定穴に押し込むプッシャーとからな
り、成形するリード線の線径に応じて前記保持レバーが
前記電子部品のリード線延出方向に揺動する事を特徴と
する。As described above, the present invention is an apparatus for inserting an axial type electronic component having a pair of lead wires extending from a component body into a predetermined hole of a substrate, and having the same pitch as the predetermined hole. From a molding guide that molds the lead wire portion of the electronic component to the pitch, a holding lever that holds the electronic component lead wire portion from below during molding, and a pusher that pushes the electronic component lead wire portion into the predetermined hole after molding. According to the diameter of the lead wire to be formed, the holding lever swings in the lead wire extending direction of the electronic component.
【００１１】以上の様な電子部品挿入装置によって、挿
入装置の部品を交換すること無く、リード線の線径の異
なる電子部品に対して一定したリード線の成形を行うこ
とが可能となる。With the electronic component inserting apparatus as described above, it is possible to form a constant lead wire on an electronic component having a different lead wire diameter without replacing the parts of the inserting apparatus.
【図１】（ａ）は本発明の一実施例におけるアキシャル
型電子部品挿入装置の成形保持部の断面図 （ｂ）はリード線を成形する前の同成形保持部の正面図 （ｃ）はリード線を成形した後の同成形保持部の正面図FIG. 1A is a cross-sectional view of a molding holding portion of an axial type electronic component inserting apparatus according to an embodiment of the present invention. FIG. 1B is a front view of the molding holding portion before molding a lead wire. Front view of the same lead holder after forming the lead wire
【図２】（ａ）は従来のアキシャル型電子部品挿入装置
のリード線を成形する前の成形保持部の正面図 （ｂ）はリード線を成形した後の同成形保持部の一部断
面正面図 （ｃ）は同上面図FIG. 2 (a) is a front view of a molding holding portion before molding a lead wire of a conventional axial type electronic component inserting device, and FIG. 2 (b) is a partial sectional front view of the molding holding portion after molding the lead wire. Figure (c) is the same top view
１ 電子部品本体 ２ａ，２ｂ リード線 ３ａ，３ｂ 成形レバー ４ａ，４ｂ プッシャー ５ａ，５ｂ 保持レバー先端部 ６ａ，６ｂ 保持レバー取り付けブロック ７ａ，７ｂ 保持レバー支点ピン ８ａ，８ｂ バネ ９ａ，９ｂ 保持レバー １０ 基板 １１ａ，１１ｂ 基板所定穴 1 electronic component body 2a, 2b lead wire 3a, 3b molding lever 4a, 4b pusher 5a, 5b holding lever tip part 6a, 6b holding lever mounting block 7a, 7b holding lever fulcrum pin 8a, 8b spring 9a, 9b holding lever 10 substrate 11a, 11b Predetermined holes on the substrate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 前 貴晴 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Takaharu Mae, 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (1)
有するアキシャル型電子部品を、基板の所定穴に挿入す
る装置であって、前記所定穴のピッチと同一ピッチに前
記電子部品のリード線部を成形する成形ガイドと、前記
電子部品リード線部を成形時に下から保持する保持レバ
ーと、成形後に前記電子部品リード線部を前記所定穴に
押し込むプッシャーとからなり、成形するリード線の線
径に応じて前記保持レバーが前記電子部品のリード線延
出方向に揺動する事を特徴としたアキシャル型電子部品
挿入装置。1. A device for inserting an axial type electronic component having a pair of lead wires extending from a component body into a predetermined hole of a substrate, wherein the lead wire of the electronic component has the same pitch as the pitch of the predetermined hole. A lead wire to be molded, which includes a molding guide for molding a portion, a holding lever for holding the electronic component lead wire portion from below during molding, and a pusher for pushing the electronic component lead wire portion into the predetermined hole after molding. An axial type electronic component insertion device, wherein the holding lever swings in a lead wire extending direction of the electronic component according to a diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5121281A JPH06334389A (en) | 1993-05-24 | 1993-05-24 | Axial electronic component inserting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5121281A JPH06334389A (en) | 1993-05-24 | 1993-05-24 | Axial electronic component inserting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06334389A true JPH06334389A (en) | 1994-12-02 |
Family
ID=14807377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5121281A Pending JPH06334389A (en) | 1993-05-24 | 1993-05-24 | Axial electronic component inserting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06334389A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541211A (en) * | 2017-03-06 | 2018-09-14 | 松下知识产权经营株式会社 | Apparatus for mounting component and component mounting method |
-
1993
- 1993-05-24 JP JP5121281A patent/JPH06334389A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541211A (en) * | 2017-03-06 | 2018-09-14 | 松下知识产权经营株式会社 | Apparatus for mounting component and component mounting method |
| CN108541211B (en) * | 2017-03-06 | 2022-05-27 | 松下知识产权经营株式会社 | Component mounting device and component mounting method |
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