JPH06321351A - Noncontact pickup device - Google Patents

Noncontact pickup device

Info

Publication number
JPH06321351A
JPH06321351A JP13655693A JP13655693A JPH06321351A JP H06321351 A JPH06321351 A JP H06321351A JP 13655693 A JP13655693 A JP 13655693A JP 13655693 A JP13655693 A JP 13655693A JP H06321351 A JPH06321351 A JP H06321351A
Authority
JP
Japan
Prior art keywords
chip
contact
pickup device
guide
holding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13655693A
Other languages
Japanese (ja)
Inventor
Hiroshi Akashi
博 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP13655693A priority Critical patent/JPH06321351A/en
Publication of JPH06321351A publication Critical patent/JPH06321351A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manipulator (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)

Abstract

PURPOSE:To move a chip to a specified position by way of regulating free movement of the chip in the horizontal direction by installing a guide on a non-contact holding tool to hold in suspense the chip in a non-contact state by way of floating the chip in the air by blowout of gas. CONSTITUTION:In case of taking out a chip 9 stored in a case, when a non- contact pickup B comes down, firstly the head end of a guide 7 makes contact with a partition upper surface of the case and stops, and only a non-contact holding tool A further goes down. When a working surface 3 formed on the lower end of this holding tool A goes down to a distance possible to suck the chip 9, the non-contact pickup device B stops descending, and by blowing out gas from the holding tool A, pressure in a cushion chamber 4 formed inside of the holding tool A and a space between the working surface 3 and the chip 9 is lowered, and the chip 9 is sucked and held in the non-contact state. When the pickup device B is drawn up in this state, the head end of the guide 7 regulates horizontal movement of the chip 9, and it is possible to move the chip 9 to an optional position by movement of the pickup device B.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ケースに収納された半
導体ウエハのチップ、ディスクヘッド等の傷や汚れの付
着を極端に嫌う微小チップを収納するケースから取り出
したりまた、ケースに収納したりする時に使用する無接
触ピックアップ装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention can be used to remove a semiconductor wafer chip housed in a case, a microchip that is extremely reluctant to attach scratches or dirt on a disk head, or to store it in a case. The present invention relates to a non-contact pickup device used when doing.

【0002】[0002]

【従来の技術】従来ケースの仕切りの上面がチップの高
さより高いケースにチップを収納あるいは取り出す場合
は、小型の真空吸着具を用いてチップを吸着していた。
2. Description of the Related Art Conventionally, when a chip is stored or taken out in a case where the upper surface of a partition of the case is higher than the height of the chip, a small vacuum suction tool is used to suck the chip.

【0003】[0003]

【発明が解決しようとする問題点】しかしながらチップ
が真空吸着具に吸着されることにより、チップが汚れた
り破損したりまた、チップが真空吸着具に固着するため
ケースに収納する時に仕切りに当たり破損するという欠
点があった。
However, when the chips are attracted to the vacuum suction tool, the chips are soiled or damaged, and the chips are fixed to the vacuum suction tool, so that the partitions may be damaged when the chips are housed in the case. There was a drawback.

【0004】[0004]

【問題を解決するための手段】上記の欠点は、本発明の
気体を噴出することにより空中に浮遊した無接触状態に
てチップを懸垂保持する無接触保持具に、移動可能なガ
イドを装着したことを特徴とする無接触ピックアップ装
置により解決できる。
The above-mentioned drawbacks are as follows. A movable guide is attached to a non-contact holder for suspending and holding a chip in a non-contact state floating in the air by ejecting gas according to the present invention. This can be solved by a non-contact pickup device characterized by the above.

【0005】[0005]

【作用】ケースに収納されているチップを取り出す場
合、無接触ピックアップ装置が下降してくると、まずガ
イドの先端がケースの仕切り上面に接触して停止し、無
接触保持具のみが更に下降する。
When the chip stored in the case is taken out, when the non-contact pickup device descends, first the tip of the guide comes into contact with the upper surface of the partition of the case and stops, and only the non-contact holder further descends. .

【0006】無接触保持具の下端に形成されている作動
面がチップの吸引可能な距離にまで下降すると、無接触
ピックアップ装置は下降を停止し、無接触保持具より気
体を噴出することにより、無接触保持具の内部に形成さ
れているクッション室及び作動面とチップとの空間の圧
力は低下し、チップを無接触状態にて吸引保持する。
When the operating surface formed at the lower end of the non-contact holder is lowered to a distance at which the tip can be sucked, the non-contact pickup device stops lowering and gas is ejected from the non-contact holder. The pressure in the space between the cushion chamber and the operating surface formed inside the non-contact holder and the chip decreases, and the chip is suction-held in a non-contact state.

【0007】この状態にて無接触ピックアップ装置を上
昇させ、無接触保持具が仕切り上面より上にくれば、ガ
イドはバネにより無接触保持具に保持されているチップ
の端面に接触する位置にまで押し下げられ、チップの水
平方向の自由移動を規制し、従って無接触ピックアップ
装置の移動にともない、所定の位置に移動することが可
能である。
When the non-contact pickup device is raised in this state and the non-contact holder is above the upper surface of the partition, the guide is brought into contact with the end face of the chip held by the non-contact holder by the spring. It is pushed down and regulates the free movement of the chip in the horizontal direction, so that it can be moved to a predetermined position as the contactless pickup device moves.

【0008】[0008]

【実施例】図1は本発明の無接触ピックアップ装置Bの
側面断面図を、図2はその下平面図を、図3は使用時の
図を示す。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a side sectional view of a contactless pickup device B of the present invention, FIG. 2 is a bottom plan view thereof, and FIG.

【0009】気体供給口1を備えたホルダー10の下端
に無接触保持具Aを装着し、無接触保持具Aの上方部2
に、バネ8により上下移動が可能なガイド7を取り付け
たガイド板11を気体噴出口5に勘合させて装着し、無
接触ピックアップ装置Bを形成する。
A non-contact holder A is attached to the lower end of a holder 10 having a gas supply port 1, and an upper portion 2 of the non-contact holder A is attached.
Then, a guide plate 11 to which a guide 7 which can be moved up and down by a spring 8 is attached is fitted into the gas ejection port 5 and attached to form a non-contact pickup device B.

【0010】無接触保持具Aは、気体噴出口5を設けた
上方部2の周囲に下方に向く周壁部6を形成し、周壁部
6の下端に広幅な作動面3を設け、周壁部6の内部をク
ッション室4となし、無接触保持具Aを形成する。
In the non-contact holder A, a peripheral wall portion 6 is formed around the upper portion 2 provided with the gas ejection port 5 and faces downward, and a wide operating surface 3 is provided at the lower end of the peripheral wall portion 6 to form the peripheral wall portion 6. The inside of is formed into a cushion chamber 4, and a non-contact holder A is formed.

【0011】気体供給口1には、気体圧縮機が管路(図
示せず)を介して接続されている。
A gas compressor is connected to the gas supply port 1 through a pipe line (not shown).

【0012】図3に示されているようにケース13に収
納されたチップ9を取り出す場合、無接触ピックアップ
装置Bがケース13に向かって下降していき、ガイド7
の先端が仕切り上面14に接触すると、ガイド7の先端
はそれ以上下降せず、無接触保持具Aは更にチップ9の
吸引可能距離まで下降する。
When the chip 9 stored in the case 13 is taken out as shown in FIG. 3, the non-contact pickup device B descends toward the case 13 and the guide 7
When the tip of the guide 7 contacts the partition upper surface 14, the tip of the guide 7 does not descend further, and the non-contact holder A further descends to the suctionable distance of the tip 9.

【0013】この時点で、気体供給口1に高圧流体C
(矢印)が供給される。
At this point, the high pressure fluid C is introduced into the gas supply port 1.
(Arrow) is supplied.

【0014】高圧流体Cは、ホルダー10内部の無接触
保持具Aの気体噴出口5に通じる管路を通り、気体噴出
口5よりクッション室4を通り、作動面3に近接したチ
ップ9に向かって噴出し、作動面3とチップ9との間隙
を通って外部に排出する。
The high-pressure fluid C passes through the pipe line leading to the gas ejection port 5 of the non-contact holder A inside the holder 10, passes through the cushion chamber 4 from the gas ejection port 5, and goes to the tip 9 close to the working surface 3. And is ejected outside through the gap between the operating surface 3 and the tip 9.

【0015】作動面3とチップ9とで形成される空間及
びクッション室4は、それぞれエゼクタのディフューザ
及び真空室の機能をなすため、無接触保持具Aはエゼク
タとして機能し、クッション室4は負圧になり、同時に
作動面3とチップ9の空間を通る気流が増速され、ベル
ヌ−イ効果により前記空間の圧力も低下し、ともにチッ
プ9の吸引力となりチップ9を吸引する。
Since the space formed by the operating surface 3 and the tip 9 and the cushion chamber 4 respectively function as a diffuser and a vacuum chamber of the ejector, the non-contact holder A functions as an ejector and the cushion chamber 4 is a negative member. The pressure is increased, and at the same time, the air flow passing through the space between the operating surface 3 and the tip 9 is accelerated, and the pressure in the space is also lowered by the Bernoulli effect, and both become suction force of the tip 9 to suck the tip 9.

【0016】チップ9が吸引され、作動面3との距離が
小になると、クッション室4は圧力室型エアクッション
効果によりクッション室4の圧力は上昇する。
When the tip 9 is sucked and the distance from the operating surface 3 becomes small, the pressure in the cushion chamber 4 rises due to the pressure chamber type air cushion effect.

【0017】同時に、前記空間を通る気流もクッション
効果を生じ、ともにチップ9に対して反発力となり、チ
ップ9が作動面3に接触するのを阻止する。
At the same time, the air flow passing through the space also produces a cushioning effect, which together acts as a repulsive force on the tip 9 and prevents the tip 9 from contacting the operating surface 3.

【0018】かようにして無接触保持具Aは、チップ9
を空中に浮遊した無接触状態にて懸垂保持する。
Thus, the non-contact holder A has the tip 9
Is suspended and held in a non-contact state floating in the air.

【0019】この状態にて無接触ピックアップ装置Bを
引き上げ、作動面3が仕切り上面14より上昇すれば、
ガイド7の先端は作動面3に懸垂されているチップ9上
面より下に押し下げられチップ9の端面に接触し、チッ
プ9の水平移動を規制し、無接触ピックアップ装置Bの
移動とともに任意の場所に移送することが可能になる。
In this state, if the non-contact pickup device B is pulled up and the operating surface 3 rises above the partition upper surface 14,
The tip of the guide 7 is pushed down below the upper surface of the tip 9 suspended from the operating surface 3 and contacts the end surface of the tip 9, restricts the horizontal movement of the tip 9, and moves the contactless pickup device B to an arbitrary position. It becomes possible to transfer.

【0020】またチップ9をケース13に収納する場合
も前述の取り出す場合の逆の操作を行なうことにより可
能である。
The chip 9 can be housed in the case 13 by performing the reverse operation of the above-mentioned taking-out.

【0021】本発明に用いている無接触保持具Aは、本
発明の発明者に係る特許第1563948号と同じもの
であるが、この他に本発明の発明者に係る特公平5−1
2113号あるいは、平板に気体噴出口を設けたもの、
気体を噴出及び吸引することによりワ−クを吸着するも
の、他にベルヌ−イチャックといわれるものでもよい。
The contactless holder A used in the present invention is the same as the patent No. 1563948 relating to the inventor of the present invention, but in addition to this, Japanese Patent Publication No. 5-1
No. 2113 or a flat plate with a gas outlet,
It may be one that adsorbs a work by ejecting and sucking a gas, or one that is called a Berne-Ichuck.

【0022】またガイドは、図4に示すごとくガイド1
2がバネあるいはアクチュエータ等により水平方向に移
動し位置決めが可能なものもよくまた、自由移動可能な
弾性体にて形成してもよい。
The guide is a guide 1 as shown in FIG.
2 may be horizontally moved by a spring, an actuator, or the like for positioning, or may be formed of an elastic body that is freely movable.

【0023】[0023]

【発明の効果】以上述べたように本発明により、仕切り
上面がチップの高さより高いケースに収納されたチップ
を、空中に浮遊した無接触状態にて懸垂保持するため汚
したり損傷することなく取り出すことができまた、収納
することが可能な無接触ピックアップ装置を提供するこ
とが可能になった。
As described above, according to the present invention, the chip housed in the case whose partition upper surface is higher than the chip height is taken out without being soiled or damaged because the chip is suspended and held in a contactless state floating in the air. It is also possible to provide a non-contact pickup device that can be stored.

【図面の簡単な説明】[Brief description of drawings]

【図1】無接触ピックアップ装置の側面断面図である。FIG. 1 is a side sectional view of a contactless pickup device.

【図2】無接触ピックアップ装置の下平面図である。FIG. 2 is a bottom plan view of a contactless pickup device.

【図3】無接触ピックアップ装置の操作時の図面であ
る。
FIG. 3 is a view of the non-contact pickup device in operation.

【図4】他の方式のガイドの図である。FIG. 4 is a diagram of another type of guide.

【符号の説明】[Explanation of symbols]

1 気体供給口 2 上方部 3 作動面 4 クッション室 5 気体噴出口 6 周壁部 7 ガイド 8 バネ 9 チップ 11 ガイド板 13 ケース 14 仕切り上面 A 無接触保持具 B 無接触ピックアップ装置 C 高圧流体 bb@@@@bウウャャフフ 1 Gas Supply Port 2 Upper Part 3 Operating Surface 4 Cushion Chamber 5 Gas Jet 6 Circumferential Wall 7 Guide 8 Spring 9 Chip 11 Guide Plate 13 Case 14 Partition Top A Non-contact Holder B Non-contact Pickup Device C High-pressure Fluid bb @@ @@ b

フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 // B65H 3/14 8712−3F Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location // B65H 3/14 8712-3F

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 気体を噴出することにより空中に浮遊し
た無接触状態にてチップを懸垂保持する無接触保持具
に、移動可能なガイドを装着したことを特徴とする無接
触ピックアップ装置。
1. A non-contact pickup device, wherein a movable guide is mounted on a non-contact holder for suspending and holding a chip in a non-contact state of floating in the air by ejecting gas.
JP13655693A 1993-05-14 1993-05-14 Noncontact pickup device Pending JPH06321351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13655693A JPH06321351A (en) 1993-05-14 1993-05-14 Noncontact pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13655693A JPH06321351A (en) 1993-05-14 1993-05-14 Noncontact pickup device

Publications (1)

Publication Number Publication Date
JPH06321351A true JPH06321351A (en) 1994-11-22

Family

ID=15177992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13655693A Pending JPH06321351A (en) 1993-05-14 1993-05-14 Noncontact pickup device

Country Status (1)

Country Link
JP (1) JPH06321351A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3920520A1 (en) * 1988-06-24 1989-12-28 Fuji Heavy Ind Ltd DEVICE AND METHOD FOR CALCULATING THE INLET AIR OF AN INTERNAL COMBUSTION ENGINE
DE10259252A1 (en) * 2002-12-17 2004-07-15 Asys Automatic Systems Gmbh & Co. Kg Transfer unit for microsystems has transfer surfaces inclined in relation to one another in roof shape fashion and commonly movable along rotational axis into respective transfer position to stations
US7138614B2 (en) 2003-12-10 2006-11-21 Samsung Electronics Co., Ltd. Non-contact feeder system
DE102007047600A1 (en) * 2007-10-05 2009-04-23 Scolomatic Gmbh Gripper system, particularly wafer gripper system, has primary gripping device and secondary gripping device, where secondary gripper device has support unit that is moved into primary moving direction
JP2010263010A (en) * 2009-04-30 2010-11-18 Fujitsu Ltd Carrier and carrying method
CN103889876A (en) * 2011-10-25 2014-06-25 谢雷克斯公司 Insert for bellows with non-linear compression / expansion in a vacuum powered tool
WO2014106870A1 (en) * 2013-01-04 2014-07-10 リンク・パワー株式会社 Holding and conveying device for small work
JPWO2020213566A1 (en) * 2019-04-15 2020-10-22

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3920520A1 (en) * 1988-06-24 1989-12-28 Fuji Heavy Ind Ltd DEVICE AND METHOD FOR CALCULATING THE INLET AIR OF AN INTERNAL COMBUSTION ENGINE
DE10259252A1 (en) * 2002-12-17 2004-07-15 Asys Automatic Systems Gmbh & Co. Kg Transfer unit for microsystems has transfer surfaces inclined in relation to one another in roof shape fashion and commonly movable along rotational axis into respective transfer position to stations
DE10259252B4 (en) * 2002-12-17 2005-06-23 Asys Automatic Systems Gmbh & Co. Kg Work unit for clean room systems
US7138614B2 (en) 2003-12-10 2006-11-21 Samsung Electronics Co., Ltd. Non-contact feeder system
DE102007047600A1 (en) * 2007-10-05 2009-04-23 Scolomatic Gmbh Gripper system, particularly wafer gripper system, has primary gripping device and secondary gripping device, where secondary gripper device has support unit that is moved into primary moving direction
JP2010263010A (en) * 2009-04-30 2010-11-18 Fujitsu Ltd Carrier and carrying method
CN103889876A (en) * 2011-10-25 2014-06-25 谢雷克斯公司 Insert for bellows with non-linear compression / expansion in a vacuum powered tool
WO2014106870A1 (en) * 2013-01-04 2014-07-10 リンク・パワー株式会社 Holding and conveying device for small work
JPWO2020213566A1 (en) * 2019-04-15 2020-10-22
WO2020213566A1 (en) * 2019-04-15 2020-10-22 株式会社新川 Conveying device

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