JPH0631827A - Method and apparatus for manufacturing laminated sheet - Google Patents

Method and apparatus for manufacturing laminated sheet

Info

Publication number
JPH0631827A
JPH0631827A JP5000027A JP2793A JPH0631827A JP H0631827 A JPH0631827 A JP H0631827A JP 5000027 A JP5000027 A JP 5000027A JP 2793 A JP2793 A JP 2793A JP H0631827 A JPH0631827 A JP H0631827A
Authority
JP
Japan
Prior art keywords
resin
resin varnish
base material
impregnated
base materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5000027A
Other languages
Japanese (ja)
Inventor
Takeyuki Tonoki
健之 外木
Yoshinori Sato
義則 佐藤
Kazuo Kobayashi
和夫 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP5000027A priority Critical patent/JPH0631827A/en
Publication of JPH0631827A publication Critical patent/JPH0631827A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To eliminate voids due to the entrapping of air by a method wherein the unevenness developing on the surface of base material is eliminated at the continuous piling-up of the resin-impregnated base material. CONSTITUTION:A plurality of band-like base materials 1 in continuous form are simultaneously carried so as to be independently or simultaneously coated and impregnated with resin varnish and, after the coating build-up of the resin varnish is controlled and then the surfaces of the base materials 1 impregnated with resin varnish is smoothed with a smoothing device 5, piled up and moved through a hot curing oven 8 so as to be cured into the cuttable state. As the smoothing device 5, a one having a sharp cutting edge such as a doctor bar or sheet is employed as long as the smoothness does not be forced by linear pressure.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、積層板の製造方法及び
製造装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated board manufacturing method and manufacturing apparatus.

【0002】[0002]

【従来の技術】工数低減、省人、省エネルギーを図るた
め、プリント配線板用金属はく張り積層板を製造する方
法についても、連続製造方法が採用されるようになって
いる。この連続製造方法は、複数枚の基材を同時に搬送
し、樹脂ワニスを含浸した後、金属はく又は離形フィル
ムと重ね合わせ、加熱硬化炉内を移動させて樹脂を硬化
し、所定の寸法に切断して製品すなわち積層板とする方
法である。
2. Description of the Related Art In order to reduce man-hours, labor and energy, a continuous manufacturing method has been adopted as a method for manufacturing a metal-clad laminate for printed wiring boards. In this continuous manufacturing method, a plurality of base materials are conveyed at the same time, impregnated with a resin varnish, superposed with a metal foil or a release film, and moved in a heating and curing furnace to cure the resin to a predetermined size. It is a method of cutting into a product, that is, a laminated plate.

【0003】連続製造方法では、使用される樹脂は、作
業性、含浸性などの点から、常温液状の樹脂が使用され
ることが多い。素材への樹脂ワニス含浸方法は、浸漬含
浸、キスコート、カーテンフローやこれらの組合せが用
いられる。
In the continuous manufacturing method, a resin which is liquid at room temperature is often used as the resin used in view of workability and impregnation property. As a method for impregnating a material with a resin varnish, dipping impregnation, kiss coating, curtain flow or a combination thereof is used.

【0004】樹脂には、不飽和ポリエステル樹脂、ジア
リルフタレート樹脂、ビニルエステル樹脂、エポキシ樹
脂などが用いられる。さらに、積層板の難燃性向上、寸
法安定性を向上させるため、水酸化アルミニウム、アル
ミナ、シリカなどの充填剤を混合している。
As the resin, unsaturated polyester resin, diallyl phthalate resin, vinyl ester resin, epoxy resin and the like are used. Further, in order to improve the flame retardancy and dimensional stability of the laminated plate, fillers such as aluminum hydroxide, alumina and silica are mixed.

【0005】加熱硬化炉は、一般に熱風循環式の加熱方
式が用いられ、場合によっては、炉内で樹脂が流動しな
い程度の荷重を加えることも行われる。
The heating and curing furnace generally uses a hot air circulation type heating system, and in some cases, a load is applied so that the resin does not flow in the furnace.

【0006】[0006]

【発明が解決しようとする課題】積層板の連続製造方法
に用いられる樹脂ワニスとしては、常温で液状であり、
硬化の際、揮発物や副生成物を生じない樹脂が一般に用
いられる。この樹脂ワニスの粘度は、用いる基材により
調節される。粘度が低いほど基材への含浸性は良好にな
るが、低すぎると含浸後下方に流出したり、混合した充
填剤が沈降したりするという欠点があり、高すぎると、
完全に含浸するのに時間がかかり、製造ラインが長くな
るという問題がある。そこで、樹脂ワニスの粘度は0.
01〜3Pa・sとされ、特に基材がガラスクロスであ
る場合は、0.1〜2Pa・sが好ましいとされてい
る。
The resin varnish used in the continuous production method of laminated plates is liquid at room temperature,
Resins that do not produce volatiles or by-products upon curing are commonly used. The viscosity of this resin varnish is adjusted depending on the substrate used. The lower the viscosity, the better the impregnating ability of the base material, but if it is too low, there is a drawback that it flows downward after impregnation, or the mixed filler settles, and if it is too high,
There is a problem that it takes a long time to completely impregnate and the manufacturing line becomes long. Therefore, the viscosity of the resin varnish is 0.
It is set to 0.13 Pa · s, and particularly when the substrate is glass cloth, 0.1 to 2 Pa · s is preferable.

【0007】しかし、樹脂ワニス粘度を良好な含浸状態
が得られるように調節しても、基材の表面が平滑でない
ことや樹脂の表面張力などにより、樹脂を含浸した基材
をラミネートするために搬送する途中に、その表面に微
少な凹凸ができる。この表面の凹凸により、各基材及び
金属はく又は離形フィルムを重ね合わせたときに空気を
巻き込み、この空気が積層板中にボイドとして残ってし
まう。本発明は、このような問題点を解決するためにな
されたものである。
However, even if the viscosity of the resin varnish is adjusted so as to obtain a good impregnation state, it is necessary to laminate the resin-impregnated base material due to the fact that the surface of the base material is not smooth and the surface tension of the resin. Minute irregularities are formed on the surface during transportation. Due to this unevenness of the surface, air is entrained when the respective substrates and the metal foil or the release film are superposed, and this air remains as a void in the laminated plate. The present invention has been made to solve such a problem.

【0008】[0008]

【課題を解決するための手段】本発明は、複数枚の長尺
な帯状の基材を同時に搬送し、各基材に樹脂ワニスを個
別に又は同時に塗布含浸し、樹脂ワニスの付着量を調整
するとともに表面をスムーズイングした後各基材を重ね
合わせさらに樹脂ワニスを透過しない被覆フィルムを重
ね合わせ、加熱硬化炉内を移動させて切断可能な状態ま
で硬化させることを特徴とする積層板の製造方法であ
る。
SUMMARY OF THE INVENTION According to the present invention, a plurality of long strip-shaped base materials are simultaneously conveyed, and resin varnishes are individually or simultaneously applied and impregnated on each base material to adjust the adhesion amount of the resin varnish. In addition, after laminating the surface smoothing, overlaying each base material, overlaying a coating film that does not pass through the resin varnish, and moving in a heating and curing oven to cure to a cuttable state. Is the way.

【0009】樹脂を含浸した基材をスムーズイングし、
この基材所定数との金属はく又は離形用フィルムとを重
ねて加熱硬化炉内に送り込む。スムーズイングには、ド
クターバー、コンマコーターなど刃先が切れるものであ
ればよく、線圧で平面性を強制しないものであればよ
い。シートで表面をならすのも効果的である。
Smooth the base material impregnated with resin,
A predetermined number of metal foils or release films of this substrate are stacked and fed into a heating and curing furnace. The smoothing may be any such as a doctor bar or comma coater as long as the cutting edge is cut off, and any one that does not force the flatness by the linear pressure may be used. It is also effective to smooth the surface with a sheet.

【0010】樹脂ワニスを透過しない被覆フィルムとし
ては、金属はくまたは離形フィルムがある。金属はくと
しては、銅はく、アルミはく、ステンレスはくなどが用
いられ、離形フィルムとしては、ポリエステルフィル
ム、ポリエチレンフィルムなどが用いられる。基材に
は、クラフト紙やリンター紙のような紙基材、合成樹脂
繊維の布又は不織布、ガラス織布やガラス不織布などが
用いられる。基材は、付着水分除去のため乾燥し、必要
であれば、樹脂含浸前にカップリング剤、下処理剤を塗
布乾燥した後に樹脂を含浸する。
As the covering film which does not penetrate the resin varnish, there is a metal foil or a release film. As the metal foil, copper foil, aluminum foil, stainless foil, etc. are used, and as the release film, polyester film, polyethylene film, etc. are used. As the base material, a paper base material such as kraft paper or linter paper, synthetic resin fiber cloth or non-woven cloth, glass woven cloth or glass non-woven cloth, and the like are used. The base material is dried to remove adhering moisture, and if necessary, a coupling agent and a pretreatment agent are applied and dried before resin impregnation and then impregnated with resin.

【0011】以下、本発明を図面に基づいて説明する。
ロール状に巻かれた複数枚の長尺帯状基材1は、含浸部
2に搬送される。含浸部2に送られた基材1は、樹脂含
浸槽3に導かれ、ここで基材1に樹脂ワニスを含浸す
る。含浸方法は、図1に示す浸漬塗工のほか、キス塗
工、スリットコーター、ナイフコーター、コンマコータ
ー、カーテンコーターなどがあり、これらが単独又は組
み合わせて用いられ、基材1に対して、個別あるいは複
数枚同時に行われる。図2には、樹脂をカーテンコータ
ー3aで含浸する例を示した。
The present invention will be described below with reference to the drawings.
The plurality of long strip base materials 1 wound in a roll are conveyed to the impregnation section 2. The base material 1 sent to the impregnation section 2 is guided to the resin impregnation tank 3, where the base material 1 is impregnated with the resin varnish. As the impregnation method, in addition to the dip coating shown in FIG. 1, there are a kiss coating, a slit coater, a knife coater, a comma coater, a curtain coater, etc., which are used alone or in combination, and are individually applied to the substrate 1. Alternatively, a plurality of sheets are simultaneously performed. FIG. 2 shows an example in which the resin is impregnated with the curtain coater 3a.

【0012】樹脂ワニスは、減圧脱気装置4で樹脂に含
まれる気泡を脱気して含浸部2に供給される。基材1へ
の樹脂付着量は、成形に必要な樹脂量よりわずかに多い
量を付着させ、続いて、スムーズイング装置5例えば、
ドクターバー、コンマコーターなどにより、表面若しく
は裏面又は両面をスムーズイングする。金属はく又は離
形フィルムとを重ね合わせるとき、各基材1の間及び基
材1と金属はく又は離形フィルム6との間にわずかの樹
脂溜りができるように樹脂の付着量を調整するのが望ま
しい。
The resin varnish is degassed from the bubbles contained in the resin by the vacuum degassing device 4 and supplied to the impregnating section 2. The amount of resin adhered to the base material 1 is a little larger than the amount of resin required for molding, and then the smoothing device 5, for example,
Smooth the front, back, or both sides with a doctor bar or comma coater. When the metal foil or the release film is overlaid, the amount of resin adhered is adjusted so that a slight amount of resin may be accumulated between the base materials 1 and between the base material 1 and the metal foil or the release film 6. It is desirable to do.

【0013】また、スムーズイングする前に樹脂ワニス
を含浸した基材を30〜80℃好ましくは30〜60℃
に加温すると樹脂の含浸が促進される。図3に、加温装
置34の後にスムーズイングシート37を用いたスムー
ズイング装置を設けた例を示す。スムーズイングシート
37は、ガイドロール33に厚さ35〜100μmの金
属又はプラスチックのシートを固定したものである。図
3(a)は積層板の製造装置全体を表す概略図、図3
(b)は要部を示す。
The base material impregnated with the resin varnish before smoothing is 30 to 80 ° C., preferably 30 to 60 ° C.
Heating to accelerates the impregnation of the resin. FIG. 3 shows an example in which a smoothing device using a smoothing sheet 37 is provided after the heating device 34. The smoothing sheet 37 is a sheet of metal or plastic having a thickness of 35 to 100 μm fixed to the guide roll 33. FIG. 3 (a) is a schematic view showing the whole laminated plate manufacturing apparatus, FIG.
(B) shows a main part.

【0014】スムーズイング工程の後、基材1と被覆フ
ィルム6を重ね合わせる。この重ね合わせ工程は、図1
に示すように所定枚の基材1をラミネートロール7で重
ね合わせ、次に被覆フィルム6をラミネートロール7で
重ね合わせるようにする。また、図2に示すように、全
体の重ね合わせとは別に、ラミネートロール7aを設
け、最外側の基材1aと被覆フィルム6とをまず重ね合
わせた後、他の基材1bと重ね合わせるようにしてもよ
い。最外側の基材1aと被覆フィルム6とをまず重ね合
わせると、重ね合わせるときにしわができにくい。
After the smoothing step, the base material 1 and the covering film 6 are laminated. This superposition process is shown in FIG.
As shown in (1), a predetermined number of the base materials 1 are superposed by the laminating roll 7, and then the covering film 6 is superposed by the laminating roll 7. Further, as shown in FIG. 2, a laminating roll 7a is provided separately from the entire superposition, and the outermost base material 1a and the covering film 6 are first superposed, and then superposed on another base material 1b. You may When the outermost base material 1a and the covering film 6 are first superposed, wrinkles are less likely to occur when they are superposed.

【0015】また、図3に示すように、樹脂ワニスを含
浸した基材を回転しないスクイーズロール36で重ね合
わせるようにし、このスクイーズロール36にもスムー
ズイングシートを取り付けるようにしてもよい。
Further, as shown in FIG. 3, the base material impregnated with the resin varnish may be superposed by a non-rotating squeeze roll 36, and a smoothing sheet may be attached to the squeeze roll 36.

【0016】金属はくを重ね合わせそのまま剥離せず金
属はく張り積層板とするときには、あらかじめ基材1に
含浸する樹脂と同一又はこの樹脂と接着性のある他の樹
脂を塗布しておくことも行われる。
When the metal foil is laminated and not peeled as it is to form a metal-clad laminate, the same resin as the resin with which the base material 1 is impregnated or another resin having adhesiveness with this resin is applied in advance. Is also done.

【0017】被覆フィルム6と基材1とには、蛇行防
止、しわ防止のため、バックテンションが与えられる。
樹脂が含浸され、被覆フィルム6が重ね合わされた基材
1は、加熱硬化炉8内を移動し、切断可能な状態まで硬
化される。加熱方式は、熱風循環式や、遠赤外ヒーター
加熱方式などが用いられる。この加熱硬化炉8は、2〜
10室に分割され、各室は所定の温度に調節されてい
る。
Back tension is applied to the coating film 6 and the base material 1 to prevent meandering and wrinkling.
The base material 1 impregnated with the resin and having the coating film 6 superposed thereon moves in the heating and curing furnace 8 and is cured to a severable state. As a heating method, a hot air circulation method, a far infrared heater heating method, or the like is used. This heating and curing furnace 8 is 2 to
It is divided into 10 chambers, and each chamber is adjusted to a predetermined temperature.

【0018】また、加熱硬化炉8内で、表面を平滑にす
るために、樹脂の動きがを生じない程度にロール9など
で加圧することも行われる。硬化した積層体は、ギロチ
ンカッター10又は自走式カッターで切断され製品(積
層板)となる。切断後さらに必要に応じてアフターキュ
アーする
Further, in the heating and curing furnace 8, in order to smooth the surface, pressure is applied by the roll 9 or the like to the extent that the resin does not move. The cured laminate is cut by the guillotine cutter 10 or a self-propelled cutter to form a product (laminate plate). After cutting and after-curing as necessary

【0019】[0019]

【作用】スムーズイングより、付着樹脂量を調節すると
共に、表面の凹凸をなくし、ラミネート時の空気の巻き
込みを防止する。
The function of the smoothing is to control the amount of the adhered resin, eliminate the surface irregularities, and prevent the entrapment of air during lamination.

【0020】[0020]

【実施例】【Example】

実施例1 ビニルエステル樹脂100重量部にベンゾイルパーオキ
サイドを1重量部、水酸アルミニウムを80重量部添加
し、ガラス不織布2枚、及びガラスクロス2枚に付着量
それぞれ98%、62%となるように含浸し、その後、
樹脂含浸基材の表面及び裏面をコンマコーターでスムー
ズイングし、付着量をそれぞれ94%、60%となるよ
うに調節し、ガラス不織布の上下にガラスクロスが配置
されるよう搬送し、その上下面に銅はくを重ね合わせ、
銅はくには、全幅で294Nのバックテンションを与
え、入口温度が50℃で出口温度が120℃で緩やかな
温度勾配を有する硬化炉内を10分間で通過させた。そ
の結果、ボイド、ふくれのない、表面平滑性の優れた積
層板を得た。
Example 1 1 part by weight of benzoyl peroxide and 80 parts by weight of aluminum hydroxide were added to 100 parts by weight of a vinyl ester resin so that the adhered amounts would be 98% and 62%, respectively, on two glass nonwoven fabrics and two glass cloths. Impregnated into
Smooth the front and back surfaces of the resin-impregnated base material with a comma coater, adjust the adhesion amounts to 94% and 60%, respectively, and convey so that the glass cloth is placed above and below the glass nonwoven fabric, and the upper and lower surfaces thereof. Overlaid with copper foil,
A back tension of 294 N was applied to the copper foil in its entire width, and the copper foil was passed through a curing furnace having an inlet temperature of 50 ° C. and an outlet temperature of 120 ° C. and a gentle temperature gradient for 10 minutes. As a result, a laminated plate having no voids and no blister and excellent surface smoothness was obtained.

【0021】実施例2 実施例1と同様な樹脂と配合を行い、同一のガラスクロ
ス8枚に付着量62%となるよう含浸し、その後、コン
マコーターで両面のスムーズィングを行い、付着量60
%となるよう含浸した。他の条件は実施例1と同一とし
て成形を行い、ボイド、ふくれのない積層板を得た。
Example 2 The same resin as in Example 1 was mixed and impregnated into 8 sheets of the same glass cloth so as to have an adhesion amount of 62%, and then smoothing was performed on both sides with a comma coater to obtain an adhesion amount of 60%.
It was impregnated so that it became%. Other conditions were the same as in Example 1 and molding was carried out to obtain a laminated plate free from voids and blisters.

【0022】実施例3 ポリエステル樹脂100重量部、水酸化アルミニウム9
0重量部及びブチルパーオキサイド1重量部を混合
し、、減圧下で脱泡した。この樹脂ワニスを連続して搬
送される厚さ0.22mm、幅1050mmのガラスク
ロス2枚及びこのガラスクロスの間になるように搬送さ
れる厚さ0.33mm、幅1050mmのガラスマット
2枚にそれぞれ個別にコンマコーターで塗布した。その
後、図3に示す装置により、加温装置34によって加温
し、間隔を1.4mmに調整されたガイドロール及びス
ムーズイングシート(厚さ70μmのポリエステルフィ
ルム)でスムーズイングした。スムーズイングした基材
は、さらに間隔を1.6mmに調整されたスクイーズロ
ール36で重ね合わせ、ラミネートロール7で厚さ18
μmの銅はくを重ね合わせた。スクイーズロール36は
回転を止め、スムーズイングシートをこのスクイーズロ
ール36にも取り付けた。次いで、100℃に保たれた
硬化炉8中を通過させた。
Example 3 100 parts by weight of polyester resin, 9 aluminum hydroxide
0 parts by weight and 1 part by weight of butyl peroxide were mixed and defoamed under reduced pressure. This resin varnish is continuously conveyed to two glass cloths having a thickness of 0.22 mm and a width of 1050 mm and two glass mats having a thickness of 0.33 mm and a width of 1050 mm which are conveyed so as to be between the glass cloths. Each was individually applied with a comma coater. After that, it was heated by the heating device 34 by the device shown in FIG. 3, and smoothed by the guide roll and the smoothing sheet (polyester film having a thickness of 70 μm) adjusted to have an interval of 1.4 mm. The smoothed base material is further laminated with a squeeze roll 36 whose gap is adjusted to 1.6 mm, and a laminating roll 7 is formed to a thickness of 18
Copper foil of μm was superposed. The squeeze roll 36 stopped rotating and the smoothing sheet was attached to this squeeze roll 36 as well. Then, it was passed through a curing furnace 8 kept at 100 ° C.

【0023】得られた積層板は、表面平滑で、うねりは
10μ、銅はくをエッチングした後の積層板本体にはか
すれもボイドも認められなかった。
The resulting laminate had a smooth surface, waviness of 10 μ, and neither scratch nor void was observed in the laminate body after etching the copper foil.

【0024】[0024]

【発明の効果】本発明により、樹脂含浸基材の重ね合わ
せ時における空気の巻き込みを防止することができ、ラ
イン速度の向上も可能となり、安定した品質を効率よく
製造することが可能となった。
EFFECTS OF THE INVENTION According to the present invention, it is possible to prevent the entrainment of air during the superposition of resin-impregnated base materials, improve the line speed, and efficiently manufacture stable quality. .

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る金属はく張り積層板の製造方法を
実施する装置の一例を示す概要図である。
FIG. 1 is a schematic view showing an example of an apparatus for carrying out a method for manufacturing a metal-clad laminate according to the present invention.

【図2】本発明に係る金属はく張り積層板の製造方法を
実施する装置の他の例を示す概要図である。
FIG. 2 is a schematic view showing another example of an apparatus for carrying out the method for manufacturing a metal-clad laminate according to the present invention.

【図3】本発明に係る金属はく張り積層板の製造方法を
実施する装置の他の例を示し、(a)装置全体を、
(b)は要部の概要図である。
FIG. 3 shows another example of an apparatus for carrying out the method for manufacturing a metal-clad laminate according to the present invention, in which (a) the entire apparatus is
(B) is a schematic diagram of a main part.

【符号の説明】[Explanation of symbols]

1……基材 2……樹脂含浸部 3……樹脂含浸槽 4……減圧脱気装置 5……スムーズイング装置 6……被覆フィルム 7……ラミネートロール 8……加熱硬化炉 9……ロール 10……切断機 11……製品(積層板) 1 ... Substrate 2 ... Resin impregnation part 3 ... Resin impregnation tank 4 ... Decompression deaerator 5 ... Smoothing device 6 ... Coating film 7 ... Laminating roll 8 ... Heating curing furnace 9 ... Roll 10 …… Cutting machine 11 …… Product (laminated board)

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 複数枚の長尺な帯状の基材を同時に搬送
し、各基材に樹脂ワニスを個別に又は同時に塗布含浸
し、樹脂ワニスの付着量を調整するとともに表面をスム
ーズイングした後各基材を重ね合わせさらに樹脂ワニス
を透過しない被覆フィルムを重ね合わせ、加熱硬化炉内
を移動させて切断可能な状態まで硬化させることを特徴
とする積層板の製造方法。
1. A plurality of long strip-shaped base materials are conveyed at the same time, and each base material is coated or impregnated with a resin varnish individually or simultaneously to adjust the adhesion amount of the resin varnish and smooth the surface. A method for producing a laminated plate, characterized in that the respective base materials are superposed on each other and a coating film which does not pass through the resin varnish is superposed on the base materials, and the coating film is moved in a heating and curing oven to be cured to a cuttable state.
【請求項2】 複数枚の長尺な帯状の基材基材に樹脂ワ
ニスを個別に又は同時に塗布含浸する装置、樹脂ワニス
を含浸した基材の表面をスムーズイングする装置、樹脂
ワニスを含浸した基材を重ね合わせさらに樹脂ワニスを
透過しない被覆フィルムを重ね合わせる装置並びに重ね
合わせた基材及びフィルムを加熱する硬化炉をこの順に
設けた積層板の製造装置。
2. A device for coating or impregnating a plurality of long strip-shaped base materials with a resin varnish individually or simultaneously, a device for smoothing the surface of a base material impregnated with a resin varnish, and a resin varnish impregnated material. An apparatus for manufacturing a laminated plate in which a base material is overlaid and a coating film that does not pass through a resin varnish is overlaid, and a curing furnace for heating the overlaid base material and film is provided in this order.
【請求項3】 スムーズイングする装置が、ロールにシ
ートを取り付けたものである請求項2記載の積層板の製
造装置。
3. The laminated plate manufacturing apparatus according to claim 2, wherein the smoothing device is a roll having a sheet attached thereto.
JP5000027A 1992-05-18 1993-01-04 Method and apparatus for manufacturing laminated sheet Pending JPH0631827A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5000027A JPH0631827A (en) 1992-05-18 1993-01-04 Method and apparatus for manufacturing laminated sheet

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP12398792 1992-05-18
JP4-123987 1992-05-18
JP5000027A JPH0631827A (en) 1992-05-18 1993-01-04 Method and apparatus for manufacturing laminated sheet

Publications (1)

Publication Number Publication Date
JPH0631827A true JPH0631827A (en) 1994-02-08

Family

ID=26332934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5000027A Pending JPH0631827A (en) 1992-05-18 1993-01-04 Method and apparatus for manufacturing laminated sheet

Country Status (1)

Country Link
JP (1) JPH0631827A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002034023A1 (en) * 2000-10-16 2002-04-25 Matsushita Electric Industrial Co., Ltd. Circuit forming board producing method, circuit forming board, and material for circuit forming board
WO2013042339A1 (en) * 2011-09-20 2013-03-28 株式会社有沢製作所 Resin sheet manufacturing method, resin sheet, copper clad laminate, and projection elimination device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002034023A1 (en) * 2000-10-16 2002-04-25 Matsushita Electric Industrial Co., Ltd. Circuit forming board producing method, circuit forming board, and material for circuit forming board
US6833042B2 (en) 2000-10-16 2004-12-21 Matsushita Electric Industrial Co., Ltd. Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board
US7754321B2 (en) 2000-10-16 2010-07-13 Panasonic Corporation Method of manufacturing clad board for forming circuitry, clad board and core board for clad board
WO2013042339A1 (en) * 2011-09-20 2013-03-28 株式会社有沢製作所 Resin sheet manufacturing method, resin sheet, copper clad laminate, and projection elimination device

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