JPH0631752Y2 - Light receiving device - Google Patents
Light receiving deviceInfo
- Publication number
- JPH0631752Y2 JPH0631752Y2 JP14625788U JP14625788U JPH0631752Y2 JP H0631752 Y2 JPH0631752 Y2 JP H0631752Y2 JP 14625788 U JP14625788 U JP 14625788U JP 14625788 U JP14625788 U JP 14625788U JP H0631752 Y2 JPH0631752 Y2 JP H0631752Y2
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- circuit board
- shield
- receiving element
- shield plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Selective Calling Equipment (AREA)
Description
【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、家電製品のリモートコントロール装置の受光
ユニツトやその他の製品等に用いられる受光装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a light receiving device used for a light receiving unit of a remote control device for home electric appliances and other products.
〈従来技術〉 従来の受光装置は、例えば第９図に示す如く、両面基板
１の半田付け面1aに抵抗等のチツプ部品２を実装し、非
半田付け面1bに耐熱性の低い受光素子３や信号処理集積
回路部品４等を実装して構成されていた。そして、前記
受光素子３は、集積回路部品４との電磁シールド、位置
決めおよび保持等のため、集積回路部品４の周囲および
上側に設けられる金属製の台座５の上に配されていた。<Prior Art> In a conventional light receiving device, for example, as shown in FIG. 9, a chip component 2 such as a resistor is mounted on a soldering surface 1a of a double-sided substrate 1, and a light receiving element 3 having low heat resistance is mounted on a non-soldering surface 1b. And the signal processing integrated circuit component 4 and the like are mounted. The light receiving element 3 is arranged on a metal pedestal 5 provided around and above the integrated circuit component 4 for electromagnetic shielding, positioning, and holding with the integrated circuit component 4.
また、前記両面基板１および受光素子３等を電磁シール
ドするシールドケース６は、互に別体に形成されるシー
ルドケース本体７と裏側のシールド板８とから成り、該
シールドケース本体７とシールド板８とは、シールドケ
ース本体７の係合爪９を折り曲げることにより固定され
ていた。The shield case 6 for electromagnetically shielding the double-sided substrate 1 and the light receiving element 3 is composed of a shield case body 7 and a shield plate 8 on the back side which are separately formed from each other. 8 is fixed by bending the engaging claw 9 of the shield case body 7.
図中、１０は両面基板１を外部と電気的に連絡するため
の端子、１１は両面基板１の保持用突出部、１２はシー
ルドケース６を外部の基板に保持させるための足、１３
は該足１２の抜止用突起である。In the figure, 10 is a terminal for electrically connecting the double-sided board 1 to the outside, 11 is a protrusion for holding the double-sided board 1, 12 is a foot for holding the shield case 6 on the external board, 13
Is a projection for retaining the foot 12.
〈考案が解決しようとする問題点〉 上記従来技術において、受光素子３は、そのパツケージ
材料の耐熱性が低いため、非半田付け面1bに実装する必
要があり、受光素子３の位置決め、保持および集積回路
部品４からの電磁シールドを行なうための台座５が必要
とされ、さらに、裏側のシールド板８が別に必要とな
る。そのため、部品点数が増加し、組立時間が長くな
り、コスト高となるといつた問題点があつた。<Problems to be Solved by the Invention> In the above-mentioned conventional technique, the light receiving element 3 needs to be mounted on the non-soldered surface 1b because the package material has low heat resistance. A pedestal 5 for electromagnetically shielding the integrated circuit component 4 is required, and a backside shield plate 8 is additionally required. Therefore, the number of parts increases, the assembly time becomes long, and the cost becomes high, which causes problems.
そこで、本考案は、部品点数を減少させることができ、
組立時間を短縮することができ、コスト的に安価となる
受光装置の提供を目的とする。Therefore, the present invention can reduce the number of parts,
It is an object of the present invention to provide a light receiving device that can reduce the assembly time and is inexpensive.
〈問題点を解決するための手段〉 本考案による問題点解決手段は、第１図〜第６図の如
く、受光素子２１を装着した回路基板２２がシールドケ
ース本体２３内に収められ、該シールドケース本体２３
の裏側に、係合瓜２４のカシメによりシールド板２５が
固着された受光装置において、前記受光素子２１はリー
ドピン２６を介して前記回路基板２２に装着されると共
に該回路基板２２に形成された孔２７に裏側から嵌入さ
れ、前記シールド板２５は前記シールド形成本体２３の
一部を延出して形成され、該シールド板２５に、前記回
路基板２２に対して裏側から当接する突起２８，２９が
設けられたものである。<Means for Solving Problems> In the means for solving problems according to the present invention, as shown in FIGS. 1 to 6, a circuit board 22 having a light receiving element 21 mounted therein is housed in a shield case body 23, and the shield is provided. Case body 23
In the light receiving device in which the shield plate 25 is fixed to the back side of the engaging melon 24 by the caulking of the engagement melon 24, the light receiving element 21 is attached to the circuit board 22 via the lead pin 26 and the hole formed in the circuit board 22. 27, the shield plate 25 is formed by extending a part of the shield forming main body 23, and the shield plate 25 is provided with projections 28 and 29 that come into contact with the circuit board 22 from the back side. It has been done.
〈作用〉 上記問題点解決手段において、受光素子２１は、回路基
板２２の非半田付け面から装着して半田付けした後、リ
ードピン２６を折曲げることにより、回路基板２２に穿
設された孔２７内に嵌入し配される。<Operation> In the problem solving means described above, the light receiving element 21 is mounted on the non-soldered surface of the circuit board 22 and soldered, and then the lead pin 26 is bent to form a hole 27 formed in the circuit board 22. It is inserted and distributed inside.
一方、受光素子２１を電磁シールドするシールドケース
は、シールドケース本体２３と、該シールドケース本体
２３の一部を延出して形成されたシールド板２５とを具
え、該シールド板２５を折曲げることによりシールドケ
ースが完成される。On the other hand, the shield case for electromagnetically shielding the light receiving element 21 includes a shield case body 23 and a shield plate 25 formed by extending a part of the shield case body 23, and by bending the shield plate 25. The shield case is completed.
そのため、部品点数を減少させることができ、組立時間
を短縮することができ、コスト的に安価なものとなる。Therefore, the number of parts can be reduced, the assembly time can be shortened, and the cost can be reduced.
また、シールド板２６は折曲げた後、係合瓜２４をカシ
メることによりシールドケース本体２３に固着される。
このときシールド板２３の突起２８，２９が回路基板２
２の裏面に当接しているため、カシメ過ぎがなくなり、
またカシメ力の調整も容易となる。Further, the shield plate 26 is fixed to the shield case main body 23 by bending and then crimping the engagement melon 24.
At this time, the protrusions 28 and 29 of the shield plate 23 are
Because it is in contact with the back side of 2, there is no excessive crimping,
Also, the crimping force can be easily adjusted.
〈実施例〉 以下、本考案の一実施例を第１図〜第６図に基づいて説
明する。第１図は本考案受光装置の一実施例を示す縦断
側面図、第２図は同じく受光素子の取付け方法を示す側
面図、第３図は同じく部品の実装状態を示す横断平面
図、第４図は同じくシールドケースの正面図、第５図は
同じくシールドケースの側面図、第６図は同じく第４図
のＢ−Ｂ線断面図である。<Embodiment> An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a vertical sectional side view showing an embodiment of a light receiving device of the present invention, FIG. 2 is a side view showing a method of mounting a light receiving element, and FIG. 3 is a cross sectional plan view showing a mounting state of components, and FIG. The figure is also a front view of the shield case, FIG. 5 is a side view of the shield case, and FIG. 6 is a sectional view taken along the line BB of FIG.
そして、図示の如く、本考案受光装置は、ストレートリ
ードピンタイプの受光素子２１を装着した回路基板２２
がシールドケース本体２３内に収められ、該シールドケ
ース本体２３の裏側に、係合瓜２４のカシメによりシー
ルド板２５が固着されている。As shown in the figure, the light receiving device of the present invention is a circuit board 22 on which a straight lead pin type light receiving element 21 is mounted.
Is housed in the shield case body 23, and the shield plate 25 is fixed to the back side of the shield case body 23 by caulking the engagement melon 24.
前記受光素子２１はリードピン２６を介して前記回路基
板２２に装着されると共に該回路基板２２に形成された
孔２７に裏側から嵌入される。The light receiving element 21 is mounted on the circuit board 22 via a lead pin 26 and is fitted into a hole 27 formed in the circuit board 22 from the back side.
前記シールド板２５は、前記シールドケース本体２３の
一部を延出して形成され、該シールド板２５に、前記回
路基板２２に対して裏側から当接する突起２８，２９が
設けられている。The shield plate 25 is formed by extending a part of the shield case main body 23, and the shield plate 25 is provided with projections 28 and 29 that come into contact with the circuit board 22 from the back side.
前記受光素子２１のリードピン２６は、第１図および第
２図の如く、前記回路基板２２に穿設される挿入用孔３
０に非半田付け面22a側から挿入され半田付けされる。
前記受光素子２１は、半田付け後にリードピン２６を折
曲げることにより、その受光レンズ21aが半田付け面22b
側に向くように、回路基板２２の孔２７内に嵌入して配
される。The lead pin 26 of the light receiving element 21 has an insertion hole 3 formed in the circuit board 22 as shown in FIGS.
0 is inserted from the non-soldered surface 22a side and soldered.
In the light receiving element 21, the lead pin 26 is bent after soldering so that the light receiving lens 21a has a soldering surface 22b.
The circuit board 22 is fitted and arranged in the hole 27 so as to face the side.
また、周辺部品３１は、第１図および第３図の如く、信
号処理用の集積回路部品（ＩＣ）３２とチツプ抵抗３３
等から成る。図中、３４は回路基板２２上の電気回路と
外部回路（図示せず）とを連絡するための端子、３５は
集積回路部品３２の保護用樹脂、３６は半田である。Further, as shown in FIGS. 1 and 3, the peripheral component 31 includes an integrated circuit component (IC) 32 for signal processing and a chip resistor 33.
Etc. In the figure, 34 is a terminal for connecting an electric circuit on the circuit board 22 to an external circuit (not shown), 35 is a protective resin for the integrated circuit component 32, and 36 is solder.
前記シールドケース本体２３は、前記回路基板２３の側
辺22cから半田付け面22b側にかけて配置される金属板に
より構成され、該シールドケース本体２３の上面23aに
は凹部３７が形成され、該凹部３７の中央に穿設される
孔３８には前記受光素子２１の受光レンズ21aが嵌入さ
れる。The shield case body 23 is composed of a metal plate arranged from the side edge 22c of the circuit board 23 to the soldering surface 22b side, and a recess 37 is formed on the upper surface 23a of the shield case body 23. The light receiving lens 21a of the light receiving element 21 is fitted into a hole 38 formed in the center of the light receiving element 21a.
前記シールド板２５は、回路基板２２の非半田付け面22
a側に配される板状のものであり、その一辺が前記シー
ルドケース本体２３と一体的に連絡されている。そし
て、該シールド板２５の別の端部25aは折曲されて受光
素子２１と端子３４とのシールド壁となり、前記端部25
aと直交する別の端部25bは第３図の如く受光素子２１と
集積回路部品３２とのシールド壁となる。また、前記シ
ールド板２５は、受光素子２１の裏面21bと当接してこ
れを保持するように、シールドケース本体２３の係合瓜
２４を折曲げてカシメることにより該シールドケース本
体２３に固着される。The shield plate 25 is a non-soldered surface 22 of the circuit board 22.
It is a plate-shaped member arranged on the a side, and one side thereof is integrally connected to the shield case body 23. The other end 25a of the shield plate 25 is bent to form a shield wall between the light receiving element 21 and the terminal 34, and the end 25a
Another end portion 25b orthogonal to a serves as a shield wall between the light receiving element 21 and the integrated circuit component 32 as shown in FIG. The shield plate 25 is fixed to the shield case main body 23 by bending and crimping the engagement melon 24 of the shield case main body 23 so as to contact and hold the back surface 21b of the light receiving element 21. It
前記突起２８は、シールド板２５の一部を切欠くと共
に、その切欠片のシールド板２５との接続部及び中間部
を折曲げてスプリング構造にしたものであって、前記回
路基板２２の非半田付け面２２ａに形成されたアースパ
ターン（図示せず）に当接されており、前記回路基板２
２の保持と電気的接続との機能を果す。The protrusion 28 is formed by cutting out a part of the shield plate 25, and bending a connection part and an intermediate part of the cutout piece with the shield plate 25 to form a spring structure. The circuit board 2 is in contact with an earth pattern (not shown) formed on the attachment surface 22a.
2 functions as a holding and electrical connection.
また前記突起２９は、前記突起２８の近傍でシールド板
２５の一部を切欠いて折曲げたものであつて、前記受光
素子２１の裏面21bとシールド板２５とのギヤツプを保
つものである。なお、該突起２９は係合瓜２４と略同位
置に設けられる。The protrusion 29 is formed by cutting out a part of the shield plate 25 in the vicinity of the protrusion 28 and bending the shield plate 25 so as to maintain the gear gap between the back surface 21b of the light receiving element 21 and the shield plate 25. The protrusion 29 is provided at substantially the same position as the engagement melon 24.
組立前のシールドケース本体２３およびシールド２５
は、第４図〜第６図に示す如く、シールドケース本体２
３の側壁の一つが下方に延出されて両者が一体となるよ
うに形成されている。Shield case body 23 and shield 25 before assembly
Is a shield case body 2 as shown in FIGS.
One of the side walls 3 is extended downward so that the two are integrated.
従つて、延出部分の基部側をＡ−Ａ線で折曲げることに
より第１図の如き形状のシールドケースＳが形成され、
該シールドケースＳにより第３図の一点鎖線内が電磁シ
ールドされる。Therefore, the shield case S having the shape as shown in FIG. 1 is formed by bending the base side of the extending portion along the line AA.
The shield case S electromagnetically shields the area inside the alternate long and short dash line in FIG.
図中、４０は回路基板２２の保持用突起、４２はシール
ドケース本体２３を別の基板（図示せず）に取付けるた
めの足、４３は該足４２の抜け防止用突起、４４はシー
ルド板２５を折曲げるときに突起４３を逃げるための切
欠、４５はシールドケース本体２３とシールド板２５と
をＡ−Ａ線で折曲げ易くするための孔である。In the figure, 40 is a projection for holding the circuit board 22, 42 is a foot for attaching the shield case body 23 to another board (not shown), 43 is a projection for preventing the foot 42 from coming off, and 44 is a shield plate 25. Is a notch for escaping the projection 43 when the is bent, and 45 is a hole for facilitating bending of the shield case body 23 and the shield plate 25 along the line AA.
上記構成において、回路基板２２上の部品の配置方法を
説明する。まず、受光素子２１のリードピン２６をイン
サートマシン等を使用して非半田付け面22aから回路基
板２２に垂直に装着する。このとき、他の有リード部品
があれば同時に装着できる。そして、デツピング等によ
り半田付けを行なう。このとき、受光素子２１のパツケ
ージ用樹脂に耐熱性の低いものが使用されていても、受
光素子２１がストレートリードピンタイプのものである
ため、問題なく半田付けを行なうことができる。A method of arranging the components on the circuit board 22 in the above configuration will be described. First, the lead pin 26 of the light receiving element 21 is vertically mounted on the circuit board 22 from the non-soldered surface 22a using an insert machine or the like. At this time, if there are other leaded parts, they can be mounted at the same time. Then, soldering is performed by depping or the like. At this time, even if the package resin of the light receiving element 21 has low heat resistance, since the light receiving element 21 is of the straight lead pin type, soldering can be performed without any problem.
その後、受光素子２１のリードピン２６を折曲げると、
回路基板２２の孔２７に非半田付け面22a側から受光素
子２１を嵌入配置することができる。そのため、受光素
子２１の厚さの一部が回路基板２２に吸収され、全体を
薄型化することができ、また、回路基板２２を片面化で
き、従来の金属台座が不要となるため、作業工程数を低
減してコストダウンを図ることができる。After that, when the lead pin 26 of the light receiving element 21 is bent,
The light receiving element 21 can be fitted and arranged in the hole 27 of the circuit board 22 from the non-soldered surface 22a side. Therefore, a part of the thickness of the light receiving element 21 is absorbed by the circuit board 22, and the entire thickness can be reduced. Further, the circuit board 22 can be single-sided, and the conventional metal pedestal is not required. The number can be reduced to reduce the cost.
次に、シールドケースＳの組立方法を説明する。Next, a method of assembling the shield case S will be described.
まず、シールドケース本体２３内に受光素子２１等が搭
載された回路基板２２を挿入し、保持用突起４０で位置
決めする。そして、第４図のＡ−Ａ線で折曲げた後、係
合爪２４を折曲げてカシメることにより、シールドケー
スＳが完成する。First, the circuit board 22 on which the light receiving element 21 and the like are mounted is inserted into the shield case body 23, and is positioned by the holding projection 40. Then, after bending along the line AA in FIG. 4, the engaging claws 24 are bent and caulked to complete the shield case S.
このとき、シールド板２５となる部分の一端部が折曲げ
られているため、同時に受光素子２１と端子３４とのシ
ールド壁25aおよび受光素子２１と集積回路部品３２と
のシールド壁25bが形成される。At this time, since one end of the portion serving as the shield plate 25 is bent, the shield wall 25a between the light receiving element 21 and the terminal 34 and the shield wall 25b between the light receiving element 21 and the integrated circuit component 32 are simultaneously formed. .
従つて、シールドケース本体２３とシールド板２５とが
一体に形成されているため、シールドケースＳの組立て
工程が短縮し、コストダウンを図ることができる。Therefore, since the shield case body 23 and the shield plate 25 are integrally formed, the assembly process of the shield case S can be shortened and the cost can be reduced.
係合瓜２４をカシメてシールド板２５を固着する際に、
シールド板２５が第１図の実線の如く受光素子と平行に
同定できれば問題ないが、係合爪２４のカシメ力が強す
ぎればシールド板２５が仮想線の如く歪み、その結果と
して受光素子２１の背面を極度に押え付け、受光素子２
１のリードピン２６の半田付け部を介して回路基板２２
に対しａ矢印方向のストレスを加えることがある。この
ような場合には、回路基板２２の反対側がｂ矢示方向に
浮上がり、端子３４の位置をずらせてしまう結果とな
る。When the shield plate 25 is fixed by crimping the engagement melon 24,
There is no problem if the shield plate 25 can be identified in parallel with the light receiving element as shown by the solid line in FIG. 1. However, if the caulking force of the engaging claw 24 is too strong, the shield plate 25 is distorted as a virtual line, and as a result, the light receiving element 21 The back surface is extremely pressed down, and the light receiving element 2
Circuit board 22 through the soldering portion of the lead pin 26 of No. 1
On the other hand, stress in the direction of arrow a may be applied. In such a case, the opposite side of the circuit board 22 floats in the direction of the arrow b, resulting in the position of the terminal 34 being displaced.
一方、係合瓜２４のカシメ時の折曲げ圧を多少弱めれ
ば、端子３４の位置ずれを或る程度は改善できるが、逆
に弱めすぎると回路基板２２のシールドケース本体２３
への固定力が弱まり、ガタツキの原因となる。更に、回
路基板２２の裏面のシールド用アースパターンとの電気
的接続が不完全となり、シールド効果が無くなる。On the other hand, if the bending pressure at the time of crimping the engagement melon 24 is slightly weakened, the positional displacement of the terminal 34 can be improved to some extent, but if it is too weak, the shield case body 23 of the circuit board 22 is conversely reduced.
The fixing force to the will weaken, causing rattling. Further, the electrical connection with the shield ground pattern on the back surface of the circuit board 22 becomes incomplete, and the shield effect is lost.
然るに、この実施例では、シールド板２５にスプリング
構造の突起２８を設け、該突起２８を回路基板２２の非
半田付け面22a側に当接させているため、回路基板２２
との接続を保ち所定のシールド効果が得られると共に、
係合瓜２４のカシメ時に回路基板２２との当たりがで
き、従来のようなカシメ過ぎがなくなり、またカシメ力
の調整も容易となる。However, in this embodiment, since the projection 28 having the spring structure is provided on the shield plate 25 and the projection 28 is brought into contact with the non-soldered surface 22a side of the circuit board 22, the circuit board 22
While maintaining the connection with the specified shield effect,
When the engagement melon 24 is crimped, it can hit the circuit board 22, eliminating excessive crimping as in the conventional case and facilitating adjustment of the crimping force.
更に、係合瓜２４のカシメ時に、突起２９が回路基板２
２に当接し、受光素子２１とシールド板２５とのギヤツ
プを確保するため、受光素子２１に無理な力が作用しな
い。Further, when the engagement gourd 24 is crimped, the protrusion 29 is formed on the circuit board 2.
The light receiving element 21 and the shield plate 25 are brought into contact with each other to secure the gear gap, so that no unreasonable force acts on the light receiving element 21.
従つて、簡略化したシールドケースＳの更に一部を利用
することにより、より部材を要することなく、従来構造
に対する問題点を解決することができ、しかも従来の生
産工程、治工具等をそのまま利用することができる利点
がある。Therefore, by using a part of the simplified shield case S, it is possible to solve the problems with the conventional structure without requiring more members, and to use the conventional production process, jigs and tools as they are. There is an advantage that can be done.
なお、本考案は、上記実施例に限定されるものではな
く、本考案の範囲内で上記実施例に多くの修正および変
更を加え得ることは勿論である。It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.
例えば、第７図および第８図の如く、回路基板２２とし
て両面回路基板を用い、その非半田付け面22aの銅箔４
６を全面アースパターンとすると、回路基板２２の孔２
７の裏面側を覆う部分を除いた部分のシールド板２５は
不要となり、回路基板２２の全体を覆う必要がなくな
る。そのため、この構造によると、回路基板２２の非半
田付け面22aに背高の部品（コンデンサ等）４７を実装
することができる。また、実施例では２個の突起２８，
２９を備えたものを例示しているが、その何れか一方の
みでも良い。従つて、突起２９のみとする場合には、こ
れをアースパターンに接触させれば良い。For example, as shown in FIGS. 7 and 8, a double-sided circuit board is used as the circuit board 22, and the copper foil 4 on the non-soldered surface 22a thereof is used.
If 6 is a ground pattern, the holes 2 of the circuit board 22
The shield plate 25 except for the portion covering the back surface side of 7 is unnecessary, and it is not necessary to cover the entire circuit board 22. Therefore, according to this structure, a tall component (capacitor or the like) 47 can be mounted on the non-soldered surface 22a of the circuit board 22. Also, in the embodiment, two protrusions 28,
However, only one of them may be provided. Therefore, when only the protrusion 29 is provided, this may be brought into contact with the ground pattern.
〈考案の効果〉 以上の説明から明らかな通り、本考案によると、受光素
子はリードピンを介して回路基板に装着されると共に該
回路基板に形成された孔に裏側から嵌入され、シールド
板はシールドケース本体の一部を延出して形成され、該
シールド板に、前記回路基板に対して裏側から当接する
突起が設けられているので、従来のように台座、別構造
のシールド板を使用する必要がなく、部品点数が減少す
ると共に、組立時間を短縮することができ、コスト的に
安価なものとなり、しかも係合瓜のカシメ過ぎがなく、
カシメ力の調整も容易になるといつた優れた効果があ
る。<Effects of the Invention> As is apparent from the above description, according to the present invention, the light receiving element is mounted on the circuit board through the lead pin and is fitted into the hole formed in the circuit board from the back side, and the shield plate is shielded. It is necessary to use a pedestal and a shield plate having a different structure as in the conventional case, because the shield plate is formed by extending a part of the case main body and the protrusion that comes into contact with the circuit board from the back side is provided. , The number of parts is reduced, the assembly time can be shortened, the cost is low, and there is no excessive caulking of the engagement gourd.
When the caulking force can be easily adjusted, it has an excellent effect.
第１図は本考案受光装置の一実施例を示す縦断側面図、
第２図は同じく受光素子の取付け方法を示す側面図、第
３図は同じく部品の実装状態を示す横断平面図、第４図
は同じくシールドケースの正面図、第５図は同じくシー
ルドケースの側面図、第６図は同じく第４図のＢ−Ｂ線
断面図、第７図は本考案受光装置の他の実施例を示す縦
断面図、第８図は同じくシールドケースの正面図、第９
図は従来の受光装置を示す縦断側面図である。 ２１：受光素子、２２：回路基板、２３：シールドケー
ス本体、２４：係合瓜、２５：シールド板、２６：リー
ドピン、２７：孔、２８，２９：突起。FIG. 1 is a vertical sectional side view showing an embodiment of the light receiving device of the present invention,
FIG. 2 is a side view showing the method of mounting the light receiving element, FIG. 3 is a cross-sectional plan view showing the mounting state of the components, FIG. 4 is a front view of the same shield case, and FIG. 5 is a side view of the same shield case. 6 and 6 are sectional views taken along the line BB of FIG. 4, FIG. 7 is a longitudinal sectional view showing another embodiment of the light receiving device of the present invention, and FIG. 8 is a front view of the same shield case, and FIG.
FIG. 1 is a vertical sectional side view showing a conventional light receiving device. 21: light receiving element, 22: circuit board, 23: shield case body, 24: engagement melon, 25: shield plate, 26: lead pin, 27: hole, 28, 29: protrusion.
Claims (1)
ース本体内に収められ、該シールドケース本体の裏側
に、係合瓜のカシメによりシールド板が固着された受光
装置において、前記受光素子はリードピンを介して前記
回路基板に装着されると共に該回路基板に形成された孔
に裏側から嵌入され、前記シールド板は前記シールドケ
ース本体の一部を延出して形成され、該シールド板に、
前記回路基板に対して裏側から当接する突起が設けられ
たことを特徴とする受光装置。1. A light receiving device in which a circuit board on which a light receiving element is mounted is housed in a shield case main body, and a shield plate is fixed to the back side of the shield case main body by caulking of an engagement melon, wherein the light receiving element is a lead pin. Is fitted to the circuit board through and is fitted into the hole formed in the circuit board from the back side, the shield plate is formed by extending a part of the shield case main body, and the shield plate,
A light receiving device, characterized in that a protrusion is provided which comes into contact with the circuit board from the back side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14625788U JPH0631752Y2 (en) | 1988-11-08 | 1988-11-08 | Light receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14625788U JPH0631752Y2 (en) | 1988-11-08 | 1988-11-08 | Light receiving device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0267697U JPH0267697U (en) | 1990-05-22 |
| JPH0631752Y2 true JPH0631752Y2 (en) | 1994-08-22 |
Family
ID=31415577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14625788U Expired - Fee Related JPH0631752Y2 (en) | 1988-11-08 | 1988-11-08 | Light receiving device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631752Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200470003Y1 (en) * | 2012-02-21 | 2013-11-19 | 동양이엔피 주식회사 | Inverter |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2565206Y2 (en) * | 1991-07-23 | 1998-03-18 | シャープ株式会社 | Light receiving device |
-
1988
- 1988-11-08 JP JP14625788U patent/JPH0631752Y2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200470003Y1 (en) * | 2012-02-21 | 2013-11-19 | 동양이엔피 주식회사 | Inverter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0267697U (en) | 1990-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |