JPH06300538A - Contour recognition technique and shape inspection method using the technique - Google Patents
Contour recognition technique and shape inspection method using the techniqueInfo
- Publication number
- JPH06300538A JPH06300538A JP5088727A JP8872793A JPH06300538A JP H06300538 A JPH06300538 A JP H06300538A JP 5088727 A JP5088727 A JP 5088727A JP 8872793 A JP8872793 A JP 8872793A JP H06300538 A JPH06300538 A JP H06300538A
- Authority
- JP
- Japan
- Prior art keywords
- slit light
- contour
- cross
- shape
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Analysis (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、認識対象物の輪郭を認
識し、その形状を良否判別する方法に関し、プリント基
板の表面に実装された電子部品の、半田付け状態を検査
する場合等に応用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for recognizing a contour of an object to be recognized and discriminating the shape of the object, such as when inspecting a soldering state of an electronic component mounted on the surface of a printed circuit board. It is applied.
【０００２】[0002]
【従来の技術】対象物を光学的手段で状態を検査する方
法は、従来より種々提案されている。その一例として掲
げる特開平４−１５５０６号公報では、プリント基板の
部品の半田付け状態を検査するのに、半田に向かってレ
ーザスポット光を掃引照射するレーザ照射手段と、半田
の横断方向に掃引照射されたレーザスポット光の反射光
を受光する受光手段を設け、半田の横断方向におけるピ
ーク位置を検出する。そして、そのピーク位置を通る縦
断方向に掃引照射されたレーザスポット光の反射光を受
光する受光手段を設け、縦断方向に沿った半田の高さ位
置を検出し、半田形状の良否を判断している。2. Description of the Related Art Various methods for inspecting the state of an object by optical means have been proposed. In JP-A-4-15506, which is given as an example, in order to inspect the soldering state of the components of the printed circuit board, a laser irradiation means for sweeping and irradiating a laser spot light toward the solder, and a sweep irradiation in the transverse direction of the solder A light receiving means for receiving the reflected light of the laser spot light thus generated is provided, and the peak position in the transverse direction of the solder is detected. Then, a light receiving means for receiving the reflected light of the laser spot light swept and irradiated in the vertical direction passing through the peak position is provided, the height position of the solder along the vertical direction is detected, and the quality of the solder shape is judged. There is.
【０００３】[0003]
【発明が解決しようとする課題】このような物体形状の
検査方法では、精度良く形状を検出するために、レーザ
スポット光を多数回掃引照射しなければならず、検査時
間が長くなる傾向を否めない。本発明では、スリット光
を認識対象物に向かって一度だけ照射してその反射光を
取り込み、精度良く、あるいは要求される精度に応じて
認識対象物の形状を検出し、比較的短時間で形状の良否
を判別する方法を提供するものである。In such a method for inspecting an object shape, in order to detect the shape with high accuracy, it is necessary to irradiate the laser spot light with a large number of sweeps, so that the inspection time tends to be long. Absent. In the present invention, the slit light is radiated toward the recognition object only once, the reflected light is taken in, the shape of the recognition object is detected with high accuracy or according to the required accuracy, and the shape is detected in a relatively short time. It is intended to provide a method for determining the quality of.
【０００４】[0004]
【課題を解決するための手段】本発明では、認識対象物
に向け所定の方向からスリット光を照射し、そこから反
射されるスリット光画像を所定の方向から撮像する。こ
のスリット光反射画像をスリット光の長さ方向へ１画素
幅づつに分割し、分割した１画素幅毎に、スリット光反
射画像の各重心位置を求め、その各重心位置データから
１画素毎に、認識対象物のスリット光照射方向断面の外
形位置を算出する。そして、あらかじめ設定された認識
対象物の断面形状データと、算出した外形データとを比
較し、許容値内にあるかどうかによって、認識対象物の
形状の良否を判定する。In the present invention, slit light is emitted from a predetermined direction toward an object to be recognized, and a slit light image reflected from the slit light is imaged from the predetermined direction. This slit light reflection image is divided into 1-pixel widths in the length direction of the slit light, and each barycentric position of the slit light reflection image is obtained for each divided 1-pixel width. , The outer shape position of the cross section of the recognition object in the slit light irradiation direction is calculated. Then, the preset cross-sectional shape data of the recognition target object is compared with the calculated outer shape data, and whether the shape of the recognition target object is good or bad is determined depending on whether or not it is within the allowable value.
【０００５】また、本発明では、撮像した前述のスリッ
ト光反射画像を、スリット光の長さ方向へ、認識対象物
の形状状態と認識精度に応じた１画素の整数倍の幅づつ
に分割し、分割幅毎に、スリット光反射画像の各重心位
置を求め、その各重心位置データから分割幅毎に、認識
対象物のスリット光照射方向断面の外形位置を算出す
る。そして、あらかじめ設定された認識対象物の断面形
状データと、算出した外形データとを比較し、許容値内
にあるかどうかによって、認識対象物の形状の良否を判
定する。Further, according to the present invention, the above-mentioned slit light reflection image that is picked up is divided in the lengthwise direction of the slit light into widths that are integer multiples of one pixel depending on the shape state of the recognition object and the recognition accuracy. Then, each barycentric position of the slit light reflection image is obtained for each division width, and the outer shape position of the cross section of the recognition object in the slit light irradiation direction is calculated from each barycentric position data for each division width. Then, the preset cross-sectional shape data of the recognition target object is compared with the calculated outer shape data, and whether the shape of the recognition target object is good or bad is determined depending on whether or not it is within the allowable value.
【０００６】[0006]
【作用】認識対象物からのスリット光反射画像が、要求
精度に応じ、スリット光の長さ方向の１画素あるいは１
画素の整数倍の幅毎に分割され、その分割幅毎にスリッ
ト光照射方向断面の輪郭位置が算出される。そして、算
出された輪郭位置が、許容値内にあるもののみが形状面
での良品と判定される。According to the required accuracy, the slit light reflection image from the object to be recognized has one pixel or one pixel in the length direction of the slit light.
It is divided into widths that are an integral multiple of the pixel, and the contour position of the cross section in the slit light irradiation direction is calculated for each divided width. Then, only the calculated contour position within the allowable value is determined as a non-defective product in terms of shape.
【０００７】[0007]
【実施例】本発明の輪郭認識方法及びそれを用いた形状
検査方法を、半田付け検査に用いる例について説明す
る。図１は本実施例における半田付け検査装置の主要な
構成を示す斜視図で、プリント基板１に表面実装された
電子部品２のリード２１が、プリント基板の銅箔パター
ン１１上に、首尾良く半田付けされているかどうかを検
査するものである。EXAMPLE An example of using the contour recognition method of the present invention and the shape inspection method using the same for soldering inspection will be described. FIG. 1 is a perspective view showing a main configuration of a soldering inspection apparatus according to this embodiment, in which leads 21 of an electronic component 2 surface-mounted on a printed circuit board 1 are successfully soldered onto a copper foil pattern 11 of the printed circuit board. It is to inspect whether it is attached.
【０００８】３はレーザスリット光を照射する光源で、
プリント基板１の真上に吊り下げられた図示しないθ回
転ヘッド部に下向きに保持されている。４はＣＣＤカメ
ラ等の撮像手段で、その光軸はレーザスリット光の光軸
と一定の傾斜角度を成し、かつレーザスリット光の水平
断面の長手方向（以降スリット光の長さ方向と云う）と
直交するよう、光源３と共に回転ヘッド部に固定されて
いる。図１において、プリント基板１は図示しないＸＹ
テーブル上に水平に載置し、光源３から照射されるレー
ザスリット光下に、検査しようとする電子部品の電極や
リードを位置させる構成とする。こうして、電子部品２
のリード２１と対応する銅箔パターン１１、リードとそ
の銅箔パターンを接着する半田部（以降半田フィレット
と云う）１２に、リードの突出方向と並行にレーザスリ
ット光３１が照射される。Reference numeral 3 is a light source for irradiating a laser slit light,
It is held downward by a θ rotary head unit (not shown) that is suspended right above the printed circuit board 1. Reference numeral 4 denotes an image pickup means such as a CCD camera, the optical axis of which forms a constant tilt angle with the optical axis of the laser slit light, and the longitudinal direction of the horizontal section of the laser slit light (hereinafter referred to as the length direction of the slit light). It is fixed to the rotary head together with the light source 3 so as to be orthogonal to. In FIG. 1, the printed circuit board 1 is an XY not shown.
It is arranged horizontally on a table, and the electrodes and leads of the electronic component to be inspected are positioned under the laser slit light emitted from the light source 3. Thus, the electronic component 2
The copper slit pattern 11 corresponding to the lead 21 and the solder portion (hereinafter referred to as a solder fillet) 12 for adhering the lead and the copper foil pattern are irradiated with the laser slit light 31 in parallel with the protruding direction of the lead.
【０００９】この時、既に別工程で、プリント基板上の
銅箔パターンの位置と実装された電子部品の装着位置が
認識されており（本発明の主旨ではないためその詳細説
明は省略する）、両者のずれ量が許容値内のプリント基
板のみが本実施例の半田付け検査に供される。そして、
それらの位置認識データにより、レーザスリット光３１
の長さ方向の中心をリード若しくは部品電極の先端部に
一致させ、かつレーザスリット光の水平断面の短手方向
（以降スリット光の幅方向と云う）中心がリード若しく
は銅箔パターンの幅方向（リード突出方向と直交する方
向）中心に一致するように、プリント基板１をＸＹ移動
させる。リードとそれに対応する銅箔パターンの幅方向
中心位置がずれている場合には、両中心間の中点にレー
ザスリット光の幅方向中心を一致させて、半田フィレッ
トの頂点位置にレーザスリット光が照射されるべく、プ
リント基板１を位置補正すればよい。At this time, the position of the copper foil pattern on the printed circuit board and the mounting position of the mounted electronic component have already been recognized in a separate process (the detailed description thereof is omitted because it is not the gist of the present invention). Only the printed circuit board whose deviation amount is within the allowable value is subjected to the soldering inspection of this embodiment. And
Based on the position recognition data, the laser slit light 31
The lengthwise center of the lead or the part electrode is aligned with the tip of the electrode, and the horizontal direction of the laser slit light (hereinafter referred to as the width direction of the slit light) is centered in the width direction of the lead or copper foil pattern. The printed board 1 is moved XY so as to coincide with the center of the lead (the direction orthogonal to the protruding direction). If the width direction center position of the lead and the corresponding copper foil pattern is misaligned, align the width direction center of the laser slit light with the midpoint between the two centers, and the laser slit light will reach the apex position of the solder fillet. The position of the printed circuit board 1 may be corrected so that it is irradiated.
【００１０】本実施例の動作について図に基づいて説明
する。図２は電子部品のリード半田付け部を拡大して示
した斜視図であり、リード２１、銅箔パターン１１、そ
れらを接着する半田フィレット１２に向かって、真上か
らレーザスリット光が照射されている。（従って、この
場合スリット光照射方向断面は、半田の高さ方向断面で
ある。）３２はレーザスリット光がリード、半田フィレ
ット、銅箔パターンの各表面を照らし出したときの帯状
の反射光画像で、その長手方向中心は、リード２１の先
端と一致している。この反射光画像３２をＣＣＤカメラ
４で撮像すると図３に示すような画像３３となり、ＣＣ
Ｄカメラ４の横方向の視野中心に、反射光画像３２の水
平方向の中心が位置することになる。The operation of this embodiment will be described with reference to the drawings. FIG. 2 is an enlarged perspective view showing a lead soldering portion of an electronic component, in which laser slit light is radiated from directly above toward the lead 21, the copper foil pattern 11 and the solder fillet 12 for bonding them. There is. (Thus, in this case, the cross section in the slit light irradiation direction is the cross section in the height direction of the solder.) 32 is a strip-shaped reflected light image when the laser slit light illuminates each surface of the lead, the solder fillet, and the copper foil pattern. The center of the longitudinal direction thereof coincides with the tip of the lead 21. When this reflected light image 32 is taken by the CCD camera 4, an image 33 as shown in FIG.
The horizontal center of the reflected light image 32 is located at the center of the horizontal field of view of the D camera 4.
【００１１】図４は半田付け状態を検査する方法を示す
説明図である。図４の左側に示すように、画像３３をＣ
ＣＤカメラ４の横方向の１画素幅づつに区切り、各１画
素幅毎に画像３３の重心ｐを求めて行く。図４の右側
に、ＣＣＤカメラの撮像視野の横方向をＸ（長さ）座標
軸、縦方向をＨ（高さ）座標軸とした、各重心位置ｐの
様子を示す。右側の図において、重心位置ｐの内、最も
高さの低い重心位置を通り、Ｘ座標軸と平行な直線Ｌを
基準線とする。そして、視野中心のＸ座標Ｃより図中左
側にある重心点のＨ座標の平均を求め、その平均値Ｕと
基準線Ｌ間の距離ｔが、リードの厚みに比較して許容量
以内に収まっているかどうかを確認する。許容量を越え
る場合には、リードが銅箔パターンより浮いていると判
断して半田フィレットの検査を行わない。FIG. 4 is an explanatory view showing a method for inspecting a soldering state. As shown on the left side of FIG.
The horizontal direction of the CD camera 4 is divided into 1-pixel widths, and the center of gravity p of the image 33 is obtained for each 1-pixel width. On the right side of FIG. 4, there is shown the state of each barycentric position p, where the horizontal direction of the field of view of the CCD camera is the X (length) coordinate axis and the vertical direction is the H (height) coordinate axis. In the figure on the right side, a straight line L that passes through the position of the center of gravity having the lowest height among the positions of center of gravity p and is parallel to the X coordinate axis is used as a reference line. Then, the average of the H-coordinates of the center of gravity on the left side of the figure from the X-coordinate C of the visual field center is calculated, and the distance t between the average value U and the reference line L falls within the allowable amount compared with the lead thickness. To see if If the allowable amount is exceeded, it is determined that the leads are floating above the copper foil pattern, and the solder fillet is not inspected.
【００１２】次に、視野中心のＸ座標Ｃから図中右方向
に所定距離ｘだけ離れた位置の重心点ｐｘを抽出し、こ
の重心点ｐｘのＨ座標値と基準線Ｌ間の距離ｈを、重心
点ｐｘの高さとして算出する。（実際の高さは、三角測
量法により、プリント基板から見たカメラ４の光軸の仰
角をθとすると、ｈ・ｃｏｓθで求められる。）この距
離ｈを半田フィレット１２の高さ形状を評価する指標と
し、あらかじめ定めた限界値以上の数値であるかどうか
を確認する。限界値以上であれば半田付けを良好と判断
し、限界値未満であれば半田付け不良と判断する。Next, a barycentric point px at a position separated from the X coordinate C of the center of the visual field in the right direction by a predetermined distance x is extracted, and a distance h between the H coordinate value of the barycentric point px and the reference line L is calculated. , As the height of the center of gravity px. (The actual height is calculated by h · cos θ, where θ is the elevation angle of the optical axis of the camera 4 as viewed from the printed circuit board by the triangulation method.) This distance h is evaluated by the height shape of the solder fillet 12. Confirm that the value is a value greater than or equal to a predetermined limit value as an index. If it is equal to or more than the limit value, it is determined that the soldering is good, and if it is less than the limit value, it is determined that the soldering is defective.
【００１３】また、図２に示したような微小なリードよ
り大きな、チップ抵抗などの部品の半田付けを検査する
とき、必ずしも図４に示すような１画素づつの分割を、
精度的に必要としないことが多い。このような場合、部
品電極の形状から予測される半田フィレットの大きさに
応じて、画像の分割幅を１画素の任意の整数倍に設定
し、その分割幅毎に重心を求め、前述と同様に半田付け
状態を検査する。これを画像３３を用いて説明したもの
が図５である。図５の左側において、画像３３をＣＣＤ
カメラ４の横方向の２画素幅づつに区切り、各２画素幅
毎に画像３３の重心ｐを求めて行く。図５の右側に、図
４の右側と同様にＸ−Ｈ座標軸における各重心位置ｐの
様子を示す。図４の場合と同様に基準線Ｌと平均値Ｕを
求め、距離ｔによって部品電極等の浮きの有無を判断す
る。そして、Ｘ座標Ｃから図中右方向に所定距離ｘだけ
離れた位置の重心点ｐｘを抽出し、重心点ｐｘの高さｈ
を算出する。この高さｈが、あらかじめ定めた限界値以
上であれば半田付けを良好と判断し、限界値未満であれ
ば半田付け不良と判断する。Further, when inspecting the soldering of components such as chip resistors, which are larger than the minute leads as shown in FIG. 2, division by pixel as shown in FIG.
Often not required for accuracy. In such a case, the division width of the image is set to an arbitrary integral multiple of one pixel according to the size of the solder fillet predicted from the shape of the component electrode, the center of gravity is obtained for each division width, and the same as above. Inspect the soldering condition. FIG. 5 illustrates this using the image 33. On the left side of FIG. 5, the image 33 is the CCD
The camera 4 is divided into two horizontal pixel widths, and the center of gravity p of the image 33 is calculated for each two pixel width. The right side of FIG. 5 shows the state of each barycentric position p on the X-H coordinate axis, similarly to the right side of FIG. Similar to the case of FIG. 4, the reference line L and the average value U are obtained, and the presence or absence of floating of the component electrode or the like is determined by the distance t. Then, the barycentric point px at a position away from the X coordinate C in the right direction in the drawing by a predetermined distance x is extracted, and the height h of the barycentric point px is extracted.
To calculate. If the height h is equal to or more than a predetermined limit value, it is determined that the soldering is good, and if it is less than the limit value, it is determined that the soldering is defective.
【００１４】本実施例では、プリント基板をＸＹテーブ
ルに保持し、光源と撮像手段をその上方にθ回転可能に
吊り下げる構成としたが、プリント基板を所定位置に保
持し、その上方を被うＸＹステージにθ回転可能に光源
と撮像手段を吊り下げる構成としてもよい。また、本実
施例では、半田部の高さ形状を判定するとき、所定の位
置の高さのみを判別基準としたが、算出した高さ位置全
てについて、あらかじめ設定した規定値と比較して判定
し、この高さ方向の輪郭良否データを判別基準としても
よい。さらに、本実施例では、電子部品の半田付け部の
高さ方向の輪郭を認識して、半田付け形状の検査に適用
する例について述べたが、本発明の輪郭認識方法及びそ
れを使用した形状検査方法は、前記実施例に限らず、検
査対象を物体と物体間の接合状態や物体そのものに適用
してもよく、スリット光の照射方向によってそれらの高
さ、幅、奥行き方向の輪郭を認識し、認識した輪郭デー
タによってその検査対象物の形状の良否を判定すること
も可能である。In this embodiment, the printed circuit board is held on the XY table, and the light source and the image pickup means are suspended above it so as to be rotatable by θ. However, the printed circuit board is held at a predetermined position and the upper side thereof is covered. The light source and the image pickup means may be suspended on the XY stage so that they can rotate by θ. Further, in the present embodiment, when the height shape of the solder portion is determined, only the height of a predetermined position is used as a determination reference, but all the calculated height positions are determined by comparing with a preset specified value. However, the contour quality data in the height direction may be used as the determination reference. Furthermore, in the present embodiment, an example in which the contour in the height direction of the soldering portion of the electronic component is recognized and applied to the inspection of the soldering shape has been described, but the contour recognition method of the present invention and the shape using the contour recognition method The inspection method is not limited to the above-mentioned embodiment, and the inspection object may be applied to the bonding state between the objects or the object itself, and the height, width, and depth contours thereof are recognized by the irradiation direction of the slit light. However, it is also possible to judge the quality of the shape of the inspection object based on the recognized contour data.
【００１５】[0015]
【発明の効果】検査対象物からのスリット光反射画像
が、スリット光の長さ方向の１画素あるいは１画素の整
数倍の幅毎に分割され、その分割幅毎に対象物のスリッ
ト光照射方向断面の外形位置が算出されるため、一回の
画像取り込みで、その断面の輪郭形状を、設定した分割
幅ピッチの折線で近似することができる。従って、分割
幅を検査対象物に応じて変化させることで、様々の精度
の近似を行い、総合検査時間を必要最小限に短縮するこ
とができる。The slit light reflection image from the object to be inspected is divided into one pixel in the length direction of the slit light or every width of an integral multiple of one pixel, and the slit light irradiation direction of the object is divided into each divided width. Since the outer shape position of the cross section is calculated, the contour shape of the cross section can be approximated by the polygonal line of the set division width pitch by one image capture. Therefore, by changing the division width according to the inspection object, it is possible to perform approximation with various accuracy and reduce the total inspection time to the necessary minimum.
【図１】本発明の一実施例における半田付け検査方法の
構成を示す斜視図である。FIG. 1 is a perspective view showing a configuration of a soldering inspection method according to an embodiment of the present invention.
【図２】スリット光の照射状態を説明する斜視図であ
る。FIG. 2 is a perspective view illustrating an irradiation state of slit light.
【図３】撮像手段が撮像するスリット光の反射光画像を
示す図である。FIG. 3 is a diagram illustrating a reflected light image of slit light captured by an image capturing unit.
【図４】半田付け状態を検査する方法を示す説明図であ
る。FIG. 4 is an explanatory diagram showing a method for inspecting a soldering state.
【図５】半田付け状態を検査する他の方法を示す説明図
である。FIG. 5 is an explanatory diagram showing another method for inspecting a soldering state.
１ プリント基板 １１ 銅箔パターン １２ 半田フィレット ２ 電子部品 ２１ 電子部品のリード ３ 光源 ４ 撮像手段 DESCRIPTION OF SYMBOLS 1 Printed circuit board 11 Copper foil pattern 12 Solder fillet 2 Electronic component 21 Electronic component lead 3 Light source 4 Imaging means
Claims (4)
対象物のスリット光照射部分を画像認識して、その対象
物の輪郭を認識する方法であって、 前記対象物に所定の方向からスリット光を照射し、 前記対象物から反射されるスリット光画像を所定の方向
から撮像し、 前記スリット光反射画像をスリット光の長さ方向へ１画
素幅づつに分割し、 前記分割した１画素幅毎に、スリット光反射画像の各重
心位置を求め、 前記各重心位置データから、１画素毎に対象物のスリッ
ト光照射方向断面の外形位置を算出し、その断面の輪郭
を認識することを特徴とする輪郭認識方法。1. An object to be recognized is irradiated with slit light,
A method for recognizing a slit light irradiation portion of an object to recognize an outline of the object, irradiating the object with slit light from a predetermined direction, and a slit light image reflected from the object. Is imaged from a predetermined direction, the slit light reflection image is divided into 1-pixel widths in the length direction of the slit light, and each barycentric position of the slit light reflection image is obtained for each divided 1-pixel width, A contour recognition method characterized in that the contour position of a cross section of an object in the slit light irradiation direction is calculated for each pixel from each centroid position data, and the contour of the cross section is recognized.
し、 あらかじめ設定された認識対象物の断面形状情報と、算
出した前記断面の輪郭データとを比較し、許容公差内に
あるかどうかによって、その対象物の形状の良否を判定
することを特徴とする形状検査方法。2. Using the contour recognition method according to claim 1, the preset cross-sectional shape information of the recognition target is compared with the calculated contour data of the cross-section, and it is determined whether or not it is within the allowable tolerance. A shape inspecting method for determining whether the shape of the object is good or bad.
対象物のスリット光照射部分を画像認識して、その対象
物の輪郭を認識する方法であって、 前記対象物に所定の方向からスリット光を照射し、 前記対象物から反射されるスリット光画像を所定の方向
から撮像し、 前記スリット光反射画像を、スリット光の長さ方向へ、
対象物の形状と認識精度に応じた１画素の整数倍の幅づ
つに分割し、 前記分割幅毎に、スリット光反射画像の各重心位置を求
め、 前記各重心位置データから、分割幅毎に対象物のスリッ
ト光照射方向断面の外形位置を算出し、その断面の輪郭
を認識することを特徴とする輪郭認識方法。3. An object to be recognized is irradiated with slit light,
A method for recognizing a slit light irradiation portion of an object to recognize an outline of the object, irradiating the object with slit light from a predetermined direction, and a slit light image reflected from the object. Is imaged from a predetermined direction, the slit light reflection image, in the length direction of the slit light,
Divide into widths of integer multiples of 1 pixel according to the shape and recognition accuracy of the object, determine each barycentric position of the slit light reflection image for each of the divided widths, and from each of the barycentric position data, for each divided width A contour recognition method characterized in that the contour position of a cross section of an object in the slit light irradiation direction is calculated and the contour of the cross section is recognized.
し、 あらかじめ設定された認識対象物の断面形状情報と、算
出した前記断面の輪郭データとを比較し、許容公差内に
あるかどうかによって、その対象物の形状の良否を判定
することを特徴とする形状検査方法。4. Using the contour recognition method according to claim 3, the preset cross-sectional shape information of the recognition object is compared with the calculated contour data of the cross-section, and whether or not it is within the allowable tolerance. A shape inspecting method for determining whether the shape of the object is good or bad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5088727A JP3054513B2 (en) | 1993-04-15 | 1993-04-15 | Method for detecting lead lift of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5088727A JP3054513B2 (en) | 1993-04-15 | 1993-04-15 | Method for detecting lead lift of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06300538A true JPH06300538A (en) | 1994-10-28 |
| JP3054513B2 JP3054513B2 (en) | 2000-06-19 |
Family
ID=13950954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5088727A Expired - Fee Related JP3054513B2 (en) | 1993-04-15 | 1993-04-15 | Method for detecting lead lift of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3054513B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0991441A (en) * | 1995-09-26 | 1997-04-04 | Matsushita Electric Works Ltd | Method for detecting interference of objects |
| JPH09289373A (en) * | 1996-04-22 | 1997-11-04 | Shimu:Kk | Device for inspecting external appearance of soldering |
-
1993
- 1993-04-15 JP JP5088727A patent/JP3054513B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0991441A (en) * | 1995-09-26 | 1997-04-04 | Matsushita Electric Works Ltd | Method for detecting interference of objects |
| JPH09289373A (en) * | 1996-04-22 | 1997-11-04 | Shimu:Kk | Device for inspecting external appearance of soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3054513B2 (en) | 2000-06-19 |
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