JPH06294562A - Electronic heating/cooling apparatus - Google Patents
Electronic heating/cooling apparatusInfo
- Publication number
- JPH06294562A JPH06294562A JP5228913A JP22891393A JPH06294562A JP H06294562 A JPH06294562 A JP H06294562A JP 5228913 A JP5228913 A JP 5228913A JP 22891393 A JP22891393 A JP 22891393A JP H06294562 A JPH06294562 A JP H06294562A
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric element
- heat
- film
- cooling device
- electronic heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱電素子（半導体素
子）を応用した電子加熱冷却装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic heating / cooling device to which a thermoelectric element (semiconductor element) is applied.
【０００２】[0002]
【従来の技術】電子加熱冷却装置に用いられる熱電素子
１の基本的構造は、図１７に示すようにＰ型，Ｎ型半導
体素子２，３を金属板電極５にて直列に接続し、その端
部にて電源や回路等に接続されるリード線４が金属板電
極５に半田溶接されている。さらに金属板電極５の上下
面にセラミック基板６が取り付けられている。そして電
熱素子１の両面に吸熱（加熱または冷却）部や放熱部を
取り付けることにより電子加熱冷却装置が組み立てられ
ている。2. Description of the Related Art The basic structure of a thermoelectric element 1 used in an electronic heating and cooling apparatus is as shown in FIG. 17, in which P-type and N-type semiconductor elements 2 and 3 are connected in series with a metal plate electrode 5 and A lead wire 4 connected to a power source, a circuit, or the like at the end is solder-welded to the metal plate electrode 5. Further, ceramic substrates 6 are attached to the upper and lower surfaces of the metal plate electrode 5. Then, an electronic heating / cooling device is assembled by attaching a heat absorbing (heating or cooling) portion or a heat radiating portion to both surfaces of the electrothermal element 1.
【０００３】[0003]
【発明が解決しようとする課題】ところで加熱冷却装置
を、冷却装置として使用する場合、吸熱部が周囲温度よ
りも低い状態で使用されることが多いため、吸熱部の表
面に空気中の水分が結露する。また熱電素子１の冷却側
の金属板電極５も同様に周囲温度よりも低い状態になる
ことが多いため、金属板電極５の表面に周辺空気中の水
分が結露する。また熱電素子１内部への外部からの水分
浸入を抑制するために、両セラミック基板６の外周をシ
リコン等の封止材で封止しているが、熱電素子１は広い
温度範囲で使用されるため、シリコン等の封止材は界面
剥離を起こし、時間と共に外部から水分が浸入する。By the way, when the heating / cooling device is used as a cooling device, since the endothermic part is often used at a temperature lower than the ambient temperature, moisture in the air is absorbed on the surface of the endothermic part. Condensate. In addition, since the metal plate electrode 5 on the cooling side of the thermoelectric element 1 is also often in a state lower than the ambient temperature, moisture in the ambient air is condensed on the surface of the metal plate electrode 5. In addition, in order to prevent moisture from entering the thermoelectric element 1 from the outside, the outer circumferences of both ceramic substrates 6 are sealed with a sealing material such as silicon, but the thermoelectric element 1 is used in a wide temperature range. Therefore, the sealing material such as silicon causes interfacial peeling, and moisture permeates from the outside with time.
【０００４】熱電素子１は一般にビスマス／テルル等の
主材料の両端面にニッケルメッキ処理を施し、ニッケル
メッキ処理された銅製の金属板電極５に半田（錫、鉛）
結合されている。従って銅、ニッケル、半田（錫、鉛）
等の異種金属が直列に結合されて構成されており、これ
らの金属に通電して使用されるとき、熱電素子１近傍に
不純物を含む水分が存在すると、イオン化傾向の順位に
従って電気分解（腐食）が始まる。その結果ニッケル、
半田等の結合材料が溶出し、所定の電流が熱電素子１に
流れなくなり、ついには冷却不能になる。The thermoelectric element 1 is generally made by plating nickel on both end faces of a main material such as bismuth / tellurium, and soldering (tin, lead) to a nickel-plated metal plate electrode 5 made of copper.
Are combined. Therefore, copper, nickel, solder (tin, lead)
When dissimilar metals such as etc. are connected in series and used by energizing these metals, if moisture containing impurities is present in the vicinity of the thermoelectric element 1, electrolysis (corrosion) occurs according to the order of ionization tendency. Begins. As a result nickel,
The binding material such as solder elutes, a predetermined current no longer flows in the thermoelectric element 1, and finally cooling becomes impossible.
【０００５】本発明は上記問題点に鑑みてなされたもの
であって、本発明の目的とするところは熱電素子の金属
板電極の表面に結露する空気中の水分による電気分解
（腐食）を防ぎ、冷却性能の低下を防ぐことを可能にし
た電子加熱冷却装置を提供するにある。The present invention has been made in view of the above problems, and an object of the present invention is to prevent electrolysis (corrosion) due to moisture in the air that condenses on the surface of a metal plate electrode of a thermoelectric element. An object of the present invention is to provide an electronic heating / cooling device capable of preventing deterioration of cooling performance.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
本発明電子加熱冷却装置は、熱電素子と、熱電素子の一
端に設けられたリード線と、熱電素子の両面に取り付け
られた吸熱部及び放熱部を備えた電子加熱冷却装置にお
いて、熱電素子部を難透湿性薄膜材料からなる封止袋で
包んで成ることを特徴とする。In order to achieve the above object, the electronic heating and cooling apparatus of the present invention comprises a thermoelectric element, a lead wire provided at one end of the thermoelectric element, a heat absorbing portion attached to both surfaces of the thermoelectric element, and An electronic heating / cooling device having a heat radiating portion is characterized in that the thermoelectric element portion is wrapped with a sealing bag made of a moisture-impermeable thin film material.
【０００７】また、耐腐食性を向上するため、封止袋の
内部に不活性ガスを充填して成ることを特徴とすること
も好ましく、封止袋の内部が真空であることも好まし
い。またリード線は薄板状にし、封止袋の末端部を圧着
シールすることも好ましい。さらに封止袋は、難透湿性
であり更に熱伝導性のよい薄膜材料であることを特徴と
することも好ましい。In order to improve the corrosion resistance, it is also preferable that the inside of the sealing bag is filled with an inert gas, and it is also preferable that the inside of the sealing bag is vacuum. It is also preferable that the lead wire is in the shape of a thin plate and the end portion of the sealing bag is pressure-bonded and sealed. Further, it is also preferable that the sealing bag is made of a thin film material having a low moisture permeability and a high thermal conductivity.
【０００８】さらに封止袋は、静電気により吸熱部及び
放熱部に密着させていることを特徴とすることも好まし
い。さらにまた前記封止袋は、熱電素子を加熱すること
により吸熱部及び放熱部に密着させていることを特徴と
することも好ましい。また熱電素子と、熱電素子の一端
に設けられたリード線と、熱電素子の両面に取り付けら
れた吸熱部及び放熱部を備えた電子加熱冷却装置におい
て、吸熱部の外周面と放熱部の外周面とに亙り且つ全周
に亙るように難透湿性薄膜材料からなるフィルムを巻回
し、フィルムの両端同士を熱融着等で固着すると共にフ
ィルムを吸熱部の外周面と放熱部の外周面に熱融着等で
固着してフィルムにて熱電素子部を封止して成ることを
特徴とすることも好ましい。It is also preferable that the sealing bag is closely attached to the heat absorbing portion and the heat radiating portion by static electricity. Furthermore, it is also preferable that the sealing bag is brought into close contact with the heat absorbing portion and the heat radiating portion by heating the thermoelectric element. Further, in an electronic heating and cooling device including a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element, the outer peripheral surface of the heat absorbing portion and the outer peripheral surface of the heat radiating portion. A film made of a moisture-impermeable thin film material is wound so as to cover the entire circumference and around the entire circumference, and both ends of the film are fixed by heat fusion or the like, and the film is heated on the outer peripheral surface of the heat absorbing part and the outer peripheral surface of the heat radiating part. It is also preferable that the thermoelectric element portion is sealed with a film by being fixed by fusion or the like.
【０００９】また熱電素子と、熱電素子の一端に設けら
れたリード線と、熱電素子の両面に取り付けられた吸熱
部及び放熱部を備えた電子加熱冷却装置において、吸熱
部及び放熱部の熱電素子の挟持面の近傍部分を分割体と
して分割し、吸熱部の分割体の外周面と放熱部の分割体
の外周面とに亙り且つ全周に亙るように難透湿性薄膜材
料からなるフィルムを巻回し、フィルムの両端同士を熱
融着等で固着すると共にフィルムを吸熱部の分割体の外
周面と放熱部の分割体の外周面に熱融着等で固着してフ
ィルムにて熱電素子部を封止して成ることを特徴とする
ことも好ましい。Further, in an electronic heating and cooling device including a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element, the thermoelectric element of the heat absorbing portion and the heat radiating portion is provided. Of the heat-absorbing part and the heat-dissipating part are wound on the outer surface of the heat-dissipating part and the heat-dissipating part. Rotate and fix both ends of the film by heat fusion etc. and fix the film to the outer peripheral surface of the divided body of the heat absorption part and the outer peripheral surface of the divided body of the heat dissipation part by heat fusion etc. It is also preferable to be characterized by being sealed.
【００１０】また熱電素子と、熱電素子の一端に設けら
れたリード線と、熱電素子の両面に取り付けられた吸熱
部及び放熱部を備えた電子加熱冷却装置において、難透
湿性薄膜材料にて形成された筒状のフィルムを熱電素子
を囲むように配置し、筒状のフィルムの内周の固着縁を
吸熱部の挟持面に熱融着等で固着すると共に筒状のフィ
ルムの外周の固着縁を放熱部の平面部に熱融着等で固着
してフィルムにて熱電素子部を封止して成ることを特徴
とすることも好ましい。Further, in an electronic heating and cooling device provided with a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element, formed of a moisture impermeable thin film material. The tubular film is placed so as to surround the thermoelectric element, and the fixing edge on the inner circumference of the tubular film is fixed to the sandwiching surface of the heat absorbing portion by heat fusion and the fixing edge on the outer circumference of the tubular film. It is also preferable that the thermoelectric element portion is fixed to the flat surface portion of the heat radiation portion by heat fusion or the like and the thermoelectric element portion is sealed with a film.
【００１１】また熱電素子と、熱電素子の一端に設けら
れたリード線と、熱電素子の両面に取り付けられた吸熱
部及び放熱部を備えた電子加熱冷却装置において、難透
湿性薄膜材料に形成された筒状のフィルムを熱電素子を
囲むように上下に一対配置し、吸熱部側のフィルムの内
周の固着縁を吸熱部の挟持面に熱融着等で固着すると共
に放熱部側のフィルムの内周の固着縁を放熱部の挟持面
に熱融着等で固着し、両方のフィルムの外周の固着縁同
士を熱融着等で固着してフィルムにて熱電素子部を封止
して成ることを特徴とすることも好ましい。Further, in an electronic heating / cooling device having a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element, the moisture impermeable thin film material is used. A pair of upper and lower cylindrical films are arranged so as to surround the thermoelectric element, and the fixing edge of the inner circumference of the film on the heat absorbing portion side is fixed to the holding surface of the heat absorbing portion by heat fusion or the like and the film on the heat radiating portion side is fixed. The inner peripheral fixing edge is fixed to the sandwiching surface of the heat radiating portion by heat fusion or the like, and the outer peripheral fixing edges of both films are fixed by heat fusion or the like to seal the thermoelectric element portion with the film. It is also preferable to be characterized.
【００１２】[0012]
【作用】上記構成によれば、熱電素子部を難透湿性薄膜
材料からなる封止袋で包んでいるので、外部から湿気が
浸入しにくくなり、その結果熱電素子の電気的腐食を防
止できる。また封止袋の内部を不活性ガス雰囲気または
真空雰囲気にすることにより、熱電素子の耐腐食性を更
に向上することができる。リード線を薄板状に構成し、
封止袋の末端部を圧着シールすることにより、リード線
取り出し部の気密不良を防止することができる。According to the above construction, since the thermoelectric element portion is wrapped with the sealing bag made of the moisture-impermeable thin film material, it is difficult for moisture to enter from the outside, and as a result, the electrical corrosion of the thermoelectric element can be prevented. Further, by making the inside of the sealing bag an inert gas atmosphere or a vacuum atmosphere, the corrosion resistance of the thermoelectric element can be further improved. Configure the lead wire into a thin plate,
By air-tightly sealing the end portion of the sealing bag, it is possible to prevent the airtightness of the lead wire extraction portion.
【００１３】さらに封止袋は、難透湿性でありさらに熱
伝導性のよい薄膜材料にすることにより、熱電素子に吸
熱部及び放熱部を組み付けて電子加熱冷却装置にした場
合、熱電素子からの吸熱及び放熱が効率よく行われる。
その結果、冷却、加熱特性の優れた電子加熱冷却装置を
提供することができる。さらに封止袋は、静電気や熱電
素子の加熱により吸熱部及び放熱部に密着させることよ
り、熱電素子と吸熱部及び放熱部との間に空気層が存在
することがなく、熱電素子からの吸熱及び放熱が効率よ
く行われる。その結果、冷却、加熱特性の優れた電子加
熱冷却装置を提供することができる。Further, when the sealing bag is made of a thin film material having a low moisture permeability and a high thermal conductivity, when the heat absorbing part and the heat radiating part are assembled to the thermoelectric element to form an electronic heating / cooling device, Heat absorption and heat dissipation are efficiently performed.
As a result, an electronic heating / cooling device having excellent cooling and heating characteristics can be provided. Further, the sealing bag is closely attached to the heat absorbing part and the heat radiating part by static electricity or heating of the thermoelectric device, so that there is no air layer between the thermoelectric device and the heat absorbing part and the heat radiating part, And heat dissipation is performed efficiently. As a result, an electronic heating / cooling device having excellent cooling and heating characteristics can be provided.
【００１４】また吸熱部の外周面と放熱部の外周面とに
亙り且つ全周に亙るように難透湿性薄膜材料からなるフ
ィルムを巻回し、フィルムの両端同士を熱融着等で固着
すると共にフィルムを吸熱部の外周面と放熱部の外周面
に熱融着等で固着してフィルムにて熱電素子部を封止す
るようにすると、熱電素子部のみならず、吸熱部と放熱
部との間に支持部材も封止でき、支持部材に吸湿性のあ
る材料を使用しても吸湿による支持部材の強度低下を防
止でき、またフィルムを簡単に固定して十分な耐湿性が
得られる。Further, a film made of a moisture-impermeable thin film material is wound around the outer peripheral surface of the heat absorbing portion and the outer peripheral surface of the heat radiating portion, and both ends of the film are fixed by heat fusion or the like. When the film is fixed to the outer peripheral surface of the heat absorbing portion and the outer peripheral surface of the heat radiating portion by heat fusion or the like to seal the thermoelectric element portion with the film, not only the thermoelectric element portion but also the heat absorbing portion and the heat radiating portion The supporting member can also be sealed in between, and even if a material having a hygroscopic property is used for the supporting member, the strength of the supporting member can be prevented from lowering due to moisture absorption, and the film can be easily fixed to obtain sufficient moisture resistance.
【００１５】また吸熱部及び放熱部の熱電素子の挟持面
の近傍部分を分割体として分割し、吸熱部の分割体の外
周面と放熱部の分割体の外周面とに亙り且つ全周に亙る
ように難透湿性薄膜材料からなるフィルムを巻回し、フ
ィルムの両端同士を熱融着等で固着すると共にフィルム
を吸熱部の分割体の外周面と放熱部の分割体の外周面に
熱融着等で固着してフィルムにて熱電素子部を封止する
ようにすると、熱電素子と分割体とを組み立てた小さな
部品の状態でフィルムによる封止ができて封止が簡単に
できると共にフィルム材料の削減を図ることができる。Further, the heat absorbing portion and the heat radiating portion are divided into portions near the sandwiching surface of the thermoelectric element as a divided body, and extend over the entire outer circumference of the divided body of the heat absorbing portion and the outer peripheral surface of the divided body of the heat radiating portion. Wrap a film made of a moisture-impermeable thin film material as described above, and fix both ends of the film by heat-sealing, etc., and heat-bond the film to the outer peripheral surface of the heat-absorbing part and the heat-dissipating part. If the thermoelectric element part is sealed with a film by fixing the thermoelectric element and the divided body, the thermoelectric element and the divided body can be sealed with the film in a small component state and the sealing can be easily performed, and the film material It is possible to reduce.
【００１６】[0016]
【実施例】まず、本発明の第１実施例を図１、図２によ
り説明する。熱電素子１の基本的な構造は図１のように
なっており、Ｐ型，Ｎ型半導体素子２，３を金属板電極
５にて直列に接続し、その端部の金属板電極５ａに、電
源や回路等に接続される薄板状のリード線４が半田接続
されている。この金属板電極５の上下面には必要に応じ
てセラミック基板６が取り付けられている。７はポリ塩
化ビニリデンなどの難透湿性フィルムからなる封止袋で
あり、この封止袋７で熱電素子１部の全外周を包囲し、
末端７ａ，７ｂを熱圧着などの方法により封止してい
る。こうすることにより、外部から湿気が浸入しにくく
なり、その結果、熱電素子１の電気的腐食を防止でき
る。図２は電子加熱冷却装置を組み立てた全体図を示
し、図１の熱電素子１の両面がアルミニウム等の熱良導
体からなる吸熱部９及び放熱部１０で挟まれ、ネジ８の
締結にて挟持することにより組み立てられている。また
本実施例の場合、封止袋７の内部に不活性ガスを封入し
て、組み立て時から封止袋７内部に存在する微量水分に
よる熱電素子１の電気的腐食の防止効果を更に向上して
いる。またリード線４は薄板状に構成してあり、封止袋
７の末端部を圧着シールする際にリード線４の取り出し
部の気密性を確保しやすいようにしている。DESCRIPTION OF THE PREFERRED EMBODIMENTS First, a first embodiment of the present invention will be described with reference to FIGS. The basic structure of the thermoelectric element 1 is as shown in FIG. 1, in which P-type and N-type semiconductor elements 2 and 3 are connected in series by a metal plate electrode 5, and the metal plate electrode 5a at the end thereof is connected to A thin plate-shaped lead wire 4 connected to a power source, a circuit, or the like is soldered. Ceramic substrates 6 are attached to the upper and lower surfaces of the metal plate electrodes 5 as required. 7 is a sealing bag made of a moisture-impermeable film such as polyvinylidene chloride. The sealing bag 7 encloses the entire outer periphery of one part of the thermoelectric element,
The ends 7a and 7b are sealed by a method such as thermocompression bonding. This makes it difficult for moisture to enter from the outside, and as a result, electrical corrosion of the thermoelectric element 1 can be prevented. FIG. 2 shows an overall view of the assembled electronic heating / cooling device. Both sides of the thermoelectric element 1 of FIG. 1 are sandwiched by a heat absorbing portion 9 and a heat radiating portion 10 made of a good heat conductor such as aluminum, and are sandwiched by fastening screws 8. It is assembled by things. In addition, in the case of the present embodiment, the effect of preventing the electrical corrosion of the thermoelectric element 1 due to a small amount of water present inside the sealing bag 7 from the time of assembly is further improved by enclosing an inert gas inside the sealing bag 7. ing. Further, the lead wire 4 is formed in a thin plate shape so that it is easy to ensure the airtightness of the take-out portion of the lead wire 4 when the end portion of the sealing bag 7 is pressure-bonded and sealed.
【００１７】次に、本発明の第２実施例を図３により説
明する。この実施例も上記実施例と基本的に同じである
が、封止袋７内を真空雰囲気にしてある。この場合も、
上記と同様に熱電素子１の電気的腐食の防止効果を更に
向上できる。次に、本発明の第３実施例を図４により説
明する。本実施例の場合、熱電素子１の加熱部を利用し
て封止袋７を密着させてある。熱電素子１に通電して封
止袋７の一側を加熱部となる面に密着させ、その後、熱
電素子１の極性を変えて封止袋７の他側を密着させる。
このようにすることにより、熱電素子１と吸熱部９及び
放熱部１０との間に空気層が存在することがなく、熱電
素子１からの吸熱及び放熱が効率よく行われる。その結
果、冷却、加熱特性の優れた電子加熱冷却装置を提供す
ることができる。Next, a second embodiment of the present invention will be described with reference to FIG. This embodiment is basically the same as the above embodiment, but the inside of the sealing bag 7 is in a vacuum atmosphere. Also in this case,
Similar to the above, the effect of preventing electrical corrosion of the thermoelectric element 1 can be further improved. Next, a third embodiment of the present invention will be described with reference to FIG. In the case of this embodiment, the sealing bag 7 is brought into close contact with the heating portion of the thermoelectric element 1. The thermoelectric element 1 is energized to bring one side of the sealing bag 7 into close contact with the surface to be the heating portion, and then the polarity of the thermoelectric element 1 is changed to bring the other side of the sealing bag 7 into close contact.
By doing so, an air layer does not exist between the thermoelectric element 1 and the heat absorbing portion 9 and the heat radiating portion 10, and heat absorption and heat radiation from the thermoelectric element 1 are efficiently performed. As a result, an electronic heating / cooling device having excellent cooling and heating characteristics can be provided.
【００１８】また他の実施例として、アルミニウム等の
金属フィルムをポリ塩化ビニリデン等の有機系難透湿性
フィルムで挟み込んだ構造の封止袋７を用いる場合があ
る。この場合、封止袋７の不透湿性は更に向上し、また
熱伝導性のよい薄膜材料にすることにより、熱電素子１
に吸熱部９及び放熱部１０を組み付けて電子加熱冷却装
置とした場合、熱電素子１からの吸熱及び放熱が効率よ
く行われる。その結果、冷却、加熱特性の優れた電子加
熱冷却装置を提供することができる。As another embodiment, there may be used a sealing bag 7 having a structure in which a metal film such as aluminum is sandwiched between organic moisture-impermeable films such as polyvinylidene chloride. In this case, the moisture impermeability of the sealing bag 7 is further improved, and by using a thin film material having good thermal conductivity, the thermoelectric element 1
When the heat absorption part 9 and the heat dissipation part 10 are assembled into the electronic heating and cooling device, heat absorption and heat dissipation from the thermoelectric element 1 are efficiently performed. As a result, an electronic heating / cooling device having excellent cooling and heating characteristics can be provided.
【００１９】また、第３実施例に代え、熱電素子１に静
電気を帯電させ、この静電気により封止袋７を密着させ
ることもできる。次に本発明の第４実施例を図５乃至図
７により詳述する。吸熱部９は水平板９ａと水平板９ａ
に対して上方に突出させた突出部９ｂとで構成され、突
出部９ｂの上面に挟持面１２を設けてある。放熱部１０
は水平板１０ａと水平板１０ａから下方に突出させた突
出部１０ｂと放熱フィン部１０ｃとで構成され、突出部
１０ｂの下面に挟持面１３を設けてある。本実施例の場
合、放熱部１０が水平板１０ａと放熱フィン部１０ｃと
に分割してあるが、必ずしも分割が必要な訳でない。吸
熱部９の挟持面１２と放熱部１０の挟持面１３との間に
は熱電素子１が挟持され、水平板９ａと水平板１０ａと
の間にはスペーサとなる支持部材１４が介装され、吸熱
部９側から水平板１０ａを介して放熱フィン部１０ｃに
ネジ８が螺入されて吸熱部９、放熱部１０、熱電素子１
及び支持部材１４が一体化される。上記支持部材１４は
紙等で形成せるハニカム構造のものである。この吸熱部
９と放熱部１０の外周に巻き付ける難透湿性薄膜材料か
らなるフィルム７′は塩化ビニリデンや塩化ビニリデン
とアルミニウムフィルムとの複合材等で形成されてい
る。このフィルム７′は水平板９ａの外周面２５と水平
板１０ａの外周面１５とに亙るように全周に巻き付けら
れ、フィルム７′を外周面２５及び外周面１５に熱融着
等で固着してある。熱融着する場合、加熱融着性のある
難透湿性材料が予め外周面２５，１５に塗布され、フィ
ルム７′が熱融着される。フィルム７′の巻き付ける始
端と終端の両端１６同士は重ね合わせて熱融着等で固着
される。フィルム７′を巻き付けたとき透孔１７からリ
ード線４が突出され、フィルム７′の固着後に難透湿性
材料からなる接着剤等で封止される。このようにして熱
電素子１及び支持部材１４はフィルム７′で囲まれた空
間に密封される。上記実施例の場合、熱電素子１のみな
らず、支持部材１４も耐湿シールされるので、支持部材
１４に吸湿性のある材料を使用した場合でも吸湿による
支持部材１４の強度低下を防止できる。また上記のよう
にフィルム７′を巻き付けて固着するだけのため簡単に
シール作業ができると共に従来のシリコン等の封止材の
ように界面剥離をおこさなく十分な耐湿性が得られる。Further, instead of the third embodiment, the thermoelectric element 1 may be charged with static electricity and the sealing bag 7 may be brought into close contact with the static electricity. Next, a fourth embodiment of the present invention will be described in detail with reference to FIGS. The heat absorbing portion 9 includes a horizontal plate 9a and a horizontal plate 9a.
And a sandwiching surface 12 is provided on the upper surface of the protrusion 9b. Heat sink 10
Is composed of a horizontal plate 10a, a protruding portion 10b protruding downward from the horizontal plate 10a, and a heat radiation fin portion 10c, and a sandwiching surface 13 is provided on the lower surface of the protruding portion 10b. In the case of this embodiment, the heat radiating portion 10 is divided into the horizontal plate 10a and the heat radiating fin portion 10c, but the division is not always necessary. The thermoelectric element 1 is sandwiched between the sandwiching surface 12 of the heat absorbing portion 9 and the sandwiching surface 13 of the heat radiating portion 10, and a supporting member 14 serving as a spacer is interposed between the horizontal plates 9a and 10a. The screw 8 is screwed into the heat radiation fin portion 10c from the heat absorbing portion 9 side through the horizontal plate 10a, so that the heat absorbing portion 9, the heat radiating portion 10 and the thermoelectric element 1 are provided.
And the support member 14 is integrated. The support member 14 has a honeycomb structure formed of paper or the like. The film 7'comprising a moisture-impermeable thin film material wound around the outer circumferences of the heat absorbing portion 9 and the heat radiating portion 10 is made of vinylidene chloride or a composite material of vinylidene chloride and an aluminum film. The film 7'is wrapped around the entire circumference so as to cover the outer peripheral surface 25 of the horizontal plate 9a and the outer peripheral surface 15 of the horizontal plate 10a, and the film 7'is fixed to the outer peripheral surface 25 and the outer peripheral surface 15 by heat fusion or the like. There is. In the case of heat-sealing, a hardly moisture-permeable material having heat-welding property is previously applied to the outer peripheral surfaces 25 and 15, and the film 7'is heat-sealed. Both ends 16 of the starting end and the terminating end of the film 7'are overlapped and fixed by heat fusion or the like. When the film 7'is wound, the lead wire 4 is projected from the through hole 17, and after the film 7'is fixed, the lead wire 4 is sealed with an adhesive or the like made of a hardly moisture permeable material. In this way, the thermoelectric element 1 and the supporting member 14 are sealed in the space surrounded by the film 7 '. In the case of the above-described embodiment, not only the thermoelectric element 1 but also the supporting member 14 is moisture-proof sealed, so that even if a material having a hygroscopic property is used for the supporting member 14, a decrease in strength of the supporting member 14 due to moisture absorption can be prevented. Further, since the film 7'is simply wound and fixed as described above, the sealing work can be easily performed and sufficient moisture resistance can be obtained without causing interface separation unlike the conventional sealing material such as silicon.
【００２０】次に本発明の第５実施例を図８乃至図１０
により詳述する。本実施例の場合、吸熱部９の突出部９
ｂの上部を分割体１８として分割してあり、放熱部１０
の突出部１０ｂを分割体１９としてある。分割体１８の
挟持面１２と分割体１９の挟持面１３との間には熱電素
子１が挟持され、分割体１８から分割体１９にネジ８′
を螺入して一体化してある。分割体１８の外周面２０と
分割体１９の外周面２１とに亙るように難透湿性薄膜材
料からなるフィルム７′が巻き付けられ、フィルム７′
が外周面２０，２１に熱融着等で固着してある。熱融着
する場合、加熱融着性のある難透湿性材料が予め外周面
２０，２１に塗布され、フィルム７′が熱融着される。
フィルム７′の巻き付ける始端と終端の両端１６同士は
重ね合わせて熱融着等で固着される。フィルム７′を巻
き付けたとき透孔１７からリード線４が突出され、フィ
ルム７′の固着後に難透湿性材料からなる接着剤等で封
止される。このようにして熱電素子１部がフィルム７′
で囲まれた空間に密封される。上記のように分割体１
８，１９間に熱電素子１を挟持した状態でフィルム７′
で封止すると、小さな部品の状態で封止できてシール作
業が簡単になると共に製造上の取り扱いもしやすくな
り、またフィルム７′の使用量も少なくできる。また上
記のようにフィルム７′を巻き付けて固着するだけのた
め簡単にシール作業ができると共に従来のシリコン等の
封止材のように界面剥離をおこさなく十分な耐湿性が得
られる。また分割体１８，１９はシリコングリスのよう
に熱伝導性を向上する材料を介して吸熱部９や放熱部１
０に嵌合して取り付けられる。吸熱部９と放熱部１０と
の間には筒状の支持部材１４が介装され、吸熱部９から
支持部材１４内を介して放熱部１０にネジ８′を螺入し
て組み立てられる。Next, a fifth embodiment of the present invention will be described with reference to FIGS.
Will be described in detail. In the case of the present embodiment, the protruding portion 9 of the heat absorbing portion 9
The upper part of b is divided as a divided body 18,
The projecting portion 10b of is as a divided body 19. The thermoelectric element 1 is sandwiched between the sandwiching surface 12 of the split body 18 and the sandwiching surface 13 of the split body 19, and the screw 8 ′ is inserted from the split body 18 to the split body 19.
Is screwed in and integrated. A film 7 ′ made of a moisture-impermeable thin film material is wound around the outer peripheral surface 20 of the divided body 18 and the outer peripheral surface 21 of the divided body 19 to form a film 7 ′.
Are fixed to the outer peripheral surfaces 20 and 21 by heat fusion or the like. In the case of heat-sealing, the moisture-impermeable material having heat-welding property is previously applied to the outer peripheral surfaces 20 and 21, and the film 7'is heat-sealed.
Both ends 16 of the starting end and the terminating end of the film 7'are overlapped and fixed by heat fusion or the like. When the film 7'is wound, the lead wire 4 is projected from the through hole 17, and after the film 7'is fixed, the lead wire 4 is sealed with an adhesive or the like made of a hardly moisture permeable material. In this way, one part of the thermoelectric element is replaced with the film 7 '.
It is sealed in the space surrounded by. Split body 1 as above
Film 7'with thermoelectric element 1 sandwiched between 8 and 19
If it is sealed with, it is possible to seal in the state of small parts, which simplifies the sealing work, facilitates the handling in manufacturing, and reduces the amount of the film 7'used. Further, since the film 7'is simply wound and fixed as described above, the sealing work can be easily performed and sufficient moisture resistance can be obtained without causing interface separation unlike the conventional sealing material such as silicon. The split bodies 18, 19 are made of a material such as silicon grease that improves thermal conductivity, and the heat absorbing portion 9 and the heat radiating portion 1 are provided.
It is fitted and attached to 0. A tubular support member 14 is interposed between the heat absorbing portion 9 and the heat radiating portion 10, and the heat radiating portion 10 is assembled from the heat absorbing portion 9 through the inside of the support member 14 by screwing a screw 8 ′.
【００２１】次に本発明の第６実施例を図１１乃至図１
３により詳述する。本実施例の場合、難透湿性薄膜材料
のフィルム７′が矩形でテーパを有する筒状に形成され
ており、内周に全周に亙るように固着縁２２を設けてあ
り、フィルム７′の外周に全周に亙るように固着縁２３
を設けてある。この筒状のフィルム７′が吸熱部９の挟
持面１２の上に載置され、固着縁２２が挟持面１２に熱
融着等で固着される。そして挟持面１２に熱電素子１を
載せると共に放熱部１０を載せて挟持面１２，１３に熱
電素子１を挟持し、ネジ８の締結に組み立て後、フィル
ム７′の外周の固着縁２３を放熱部３の水平板１０ａの
下面の平坦面に熱融着等で固着する。リード線４は偏平
になっており、固着縁２２と挟持面１２との間から気密
的に導出される。このようにすると、組み立て工程で簡
単にフィルム７′で封止できる。Next, a sixth embodiment of the present invention will be described with reference to FIGS.
This will be described in detail in Section 3. In the case of this embodiment, a film 7'of a moisture-impermeable thin film material is formed in a rectangular and tapered cylindrical shape, and a fixing edge 22 is provided on the inner circumference so as to cover the entire circumference. A fixed edge 23 that covers the entire circumference
Is provided. The tubular film 7'is placed on the sandwiching surface 12 of the heat absorbing section 9, and the fixing edge 22 is fixed to the sandwiching surface 12 by heat fusion or the like. Then, the thermoelectric element 1 is placed on the sandwiching surface 12, and the heat radiating portion 10 is placed to sandwich the thermoelectric element 1 on the sandwiching surfaces 12 and 13. After the screws 8 are assembled and fastened, the fixing edge 23 on the outer periphery of the film 7'is radiated. It is fixed to the flat surface of the lower surface of the horizontal plate 10a of No. 3 by heat fusion or the like. The lead wire 4 is flat and is led out in an airtight manner between the fixed edge 22 and the holding surface 12. In this way, the film 7'can be easily sealed in the assembly process.
【００２２】次に本発明の第７実施例を図１４乃至図１
６により詳述する。本実施例の場合も、難透湿性薄膜材
料のフィルム７′が矩形でテーパを有する筒状に形成さ
れており、内周に全周に亙るように固着縁２２を設けて
あり、フィルム７′の外周に全周に亙るように固着縁２
３を設けてある。本実施例の場合、一対のフィルム７′
を一組として密封するようになっている。下に配置した
フィルム７′の内周の固着縁２２は吸熱部９の挟持面１
２に熱融着等で固着してあり、上に配置したフィルム
７′の内周の固着縁２２が放熱部１０の挟持面１３に熱
融着等で固着してあり、吸熱部９の挟持面１２と放熱部
１０の挟持面１３との間に熱電素子１を挟持して組み立
てた後、上下のフィルム７′の外周の固着縁２３同士を
熱融着等で固着してある。このようにすると、組み立て
工程で簡単に一対のフィルム７′にて封止できる。Next, a seventh embodiment of the present invention will be described with reference to FIGS.
6 will be described in detail. Also in the case of this embodiment, a film 7'of a moisture-impermeable thin film material is formed in a rectangular and tapered cylindrical shape, and a fixing edge 22 is provided on the inner circumference so as to cover the entire circumference. Secured edge 2 around the entire circumference of the
3 is provided. In the case of this embodiment, a pair of films 7 '
Are sealed as a set. The fixed edge 22 on the inner periphery of the film 7'located below is the holding surface 1 of the heat absorbing portion 9.
2 is fixed by heat fusion or the like, and the fixing edge 22 on the inner periphery of the film 7'disposed above is fixed to the sandwiching surface 13 of the heat radiating portion 10 by heat fusion or the like, and the heat absorbing portion 9 is sandwiched. After assembling the thermoelectric element 1 by sandwiching it between the surface 12 and the sandwiching surface 13 of the heat radiating portion 10, the fixing edges 23 on the outer periphery of the upper and lower films 7'are fixed by heat fusion or the like. By doing so, the pair of films 7'can be easily sealed in the assembly process.
【００２３】[0023]
【発明の効果】本発明は叙述のように熱電素子部を難透
湿性薄膜材料からなる封止袋で包んでいるので、外部か
ら湿気が浸入しにくくなり、その結果、熱電素子の電気
的腐食を防止できるものである。また、請求項２や３の
ように封止袋の内部を不活性ガス雰囲気または真空雰囲
気にすることにより、熱電素子の耐蝕性を更に向上する
ことができる。As described above, according to the present invention, since the thermoelectric element portion is wrapped with the sealing bag made of the moisture-impermeable thin film material, it is difficult for moisture to enter from the outside, and as a result, the electric corrosion of the thermoelectric element is caused. Can be prevented. Further, by setting the inside of the sealing bag in an inert gas atmosphere or a vacuum atmosphere as in claims 2 and 3, the corrosion resistance of the thermoelectric element can be further improved.
【００２４】また請求項４のようにリード線を薄板状に
構成し、封止袋の末端部を圧着シールすることにより、
リード線取り出し部の気密不良を防止をすることができ
るものである。また請求項５のように封止袋を、難透湿
性であり更に熱伝導性のよい薄膜材料にすると、熱電素
子に吸熱部や放熱部を組み付けて電子加熱冷却装置にし
た場合、熱電素子からの吸熱及び放熱が効率よく行わ
れ、その結果冷却、加熱特性の優れた電子加熱冷却装置
を提供することができるものである。According to a fourth aspect of the present invention, the lead wire is formed in a thin plate shape and the end portion of the sealing bag is pressure-bonded and sealed,
The airtightness of the lead wire takeout portion can be prevented. Further, when the sealing bag is made of a thin film material having low moisture permeability and good thermal conductivity as in claim 5, when a heat absorbing part or a heat radiating part is assembled to the thermoelectric element to form an electronic heating / cooling device, It is possible to provide an electronic heating / cooling device excellent in cooling and heating characteristics by efficiently absorbing and radiating heat.
【００２５】さらに請求項６や請求項７のように静電気
や電熱素子の加熱により封止袋を吸熱部及び加熱部に密
着させると、熱電素子と、吸熱部や放熱部との間に空気
層が存在することなく、熱電素子からの吸熱及び放熱が
効率よく行われ、その結果、冷却、加熱特性の優れた電
子加熱冷却装置を提供することができるものである。ま
た請求項８記載の発明にあっては、吸熱部の外周面と放
熱部の外周面とに亙り且つ全周に亙るように難透湿性薄
膜材料からなるフィルムを巻回し、フィルムの両端同士
を熱融着等で固着すると共にフィルムを吸熱部の外周面
と放熱部の外周面に熱融着等で固着してフィルムにて熱
電素子部を封止しているので、熱電素子部のみならず、
吸熱部と放熱部との間に支持部材も封止でき、支持部材
に吸湿性のある材料を使用しても吸湿による支持部材の
強度低下を防止できるものであり、またフィルムを簡単
に固定して十分な耐湿性が得られるものであり、さらに
熱電素子を直接吸熱部や放熱部に接触させることができ
て熱伝導性が向上するものである。When the sealing bag is brought into close contact with the heat absorbing portion and the heating portion by static electricity or heating of the electric heating element as in the sixth and seventh aspects, an air layer is formed between the thermoelectric element and the heat absorbing portion or the heat radiating portion. It is possible to provide an electronic heating / cooling device which is excellent in cooling and heating characteristics as a result of efficiently absorbing and radiating heat from the thermoelectric element without the presence of the above. Further, in the invention of claim 8, a film made of a moisture-impermeable thin film material is wound around the outer peripheral surface of the heat absorbing portion and the outer peripheral surface of the heat radiating portion and over the entire circumference, and both ends of the film are wound. Since the film is sealed by heat fusion and the like and the film is sealed by heat fusion and the like on the outer peripheral surface of the heat absorbing portion and the outer peripheral surface of the heat radiating portion, not only the thermoelectric element portion is sealed. ,
The supporting member can be sealed between the heat absorbing portion and the heat radiating portion, and even if a material having a hygroscopic property is used for the supporting member, the strength of the supporting member can be prevented from lowering due to moisture absorption, and the film can be easily fixed. Therefore, sufficient moisture resistance can be obtained, and the thermoelectric element can be brought into direct contact with the heat absorbing portion or the heat radiating portion to improve the thermal conductivity.
【００２６】また請求項９記載の発明にあっては、吸熱
部及び放熱部の熱電素子の挟持面の近傍部分を分割体と
して分割し、吸熱部の分割体の外周面と放熱部の分割体
の外周面とに亙り且つ全周に亙るように難透湿性薄膜材
料からなるフィルムを巻回し、フィルムの両端同士を熱
融着等で固着すると共にフィルムを吸熱部の分割体の外
周面と放熱部の分割体の外周面に熱融着等で固着してフ
ィルムにて熱電素子部を封止しているので、熱電素子と
分割体とを組み立てた小さな部品の状態でフィルムによ
る封止ができて封止が簡単にできると共にフィルム材料
の削減を図ることができるものである。In the invention according to claim 9, the heat absorbing portion and the heat radiating portion are divided into portions in the vicinity of the holding surface of the thermoelectric element as a divided body, and the outer peripheral surface of the divided body of the heat absorbing portion and the divided body of the heat radiating portion. A film made of a moisture-impermeable thin film material is wound so as to cover the outer peripheral surface of the film and the entire circumference, and both ends of the film are fixed by heat fusion or the like, and the film dissipates heat to the outer surface of the divided body of the heat absorbing part. Since the thermoelectric element part is sealed with a film by fixing it to the outer peripheral surface of the divided body of the part by a film, the thermoelectric element and the divided body can be sealed with a film in the state of a small part assembled. Thus, the sealing can be easily performed and the film material can be reduced.
【００２７】また請求項１０記載の発明にあっては、難
透湿性薄膜材料にて形成された筒状のフィルムを熱電素
子を囲むように配置し、筒状のフィルムの内周の固着縁
を吸熱部の挟持面に熱融着等で固着すると共に筒状のフ
ィルムの外周の固着縁を放熱部の平面部に熱融着等で固
着してフィルムにて熱電素子部を封止しているので、組
み立て途中に簡単にフィルムを組み込んで封止できるも
のである。According to the tenth aspect of the present invention, a tubular film formed of a moisture-impermeable thin film material is arranged so as to surround the thermoelectric element, and the fixing edge on the inner circumference of the tubular film is fixed. The thermoelectric element part is sealed with the film by fixing it to the sandwiching surface of the heat absorbing part by heat fusion or the like and fixing the outer peripheral fixing edge of the tubular film to the flat part of the heat radiating part by heat fusion or the like. Therefore, the film can be easily incorporated and sealed during assembly.
【００２８】また請求項１１記載の発明にあっても、難
透湿性薄膜材料に形成された筒状のフィルムを熱電素子
を囲むように上下に一対配置し、吸熱部側のフィルムの
内周の固着縁を吸熱部の挟持面に熱融着等で固着すると
共に放熱部側のフィルムの内周の固着縁を放熱部の挟持
面に熱融着等で固着し、両方のフィルムの外周の固着縁
同士を熱融着等で固着してフィルムにて熱電素子部を封
止しているので、組み立て途中に簡単に一対のフィルム
を組み込んで封止できるものである。According to the eleventh aspect of the present invention, a pair of cylindrical films formed of the moisture-impermeable thin film material are vertically arranged so as to surround the thermoelectric element, and the inner periphery of the film on the heat absorbing portion side is disposed. The fixing edge is fixed to the sandwiching surface of the heat absorbing section by heat fusion, and the fixing edge of the inner circumference of the film on the heat dissipation section side is fixed to the sandwiching surface of the heat dissipation section by heat fusion, etc., and the outer circumference of both films is fixed. Since the thermoelectric element portion is sealed with the film by fixing the edges together by heat fusion or the like, the pair of films can be easily incorporated and sealed during assembly.
【図１】本発明の第１実施例の熱電素子部分の断面図で
ある。FIG. 1 is a sectional view of a thermoelectric element portion of a first embodiment of the present invention.
【図２】同上の吸熱部や放熱部を設けた状態の断面図で
ある。FIG. 2 is a cross-sectional view showing a state in which a heat absorbing portion and a heat radiating portion are provided in the same.
【図３】同上の第２実施例の断面図である。FIG. 3 is a sectional view of a second embodiment of the above.
【図４】同上の第３実施例の断面図である。FIG. 4 is a sectional view of a third embodiment of the above.
【図５】同上の第４実施例の正面断面図である。FIG. 5 is a front sectional view of a fourth embodiment of the above.
【図６】図５の側面断面図である。FIG. 6 is a side sectional view of FIG.
【図７】図５の分解斜視図である。FIG. 7 is an exploded perspective view of FIG.
【図８】同上の第５実施例の正面断面図である。FIG. 8 is a front sectional view of a fifth embodiment of the above.
【図９】図８の側面断面図である。9 is a side sectional view of FIG.
【図１０】図８の分解斜視図である。FIG. 10 is an exploded perspective view of FIG.
【図１１】同上の第６実施例の正面断面図である。FIG. 11 is a front sectional view of a sixth embodiment of the above.
【図１２】図１１の側面断面図である。FIG. 12 is a side sectional view of FIG. 11.
【図１３】図１１の分解斜視図である。FIG. 13 is an exploded perspective view of FIG. 11.
【図１４】同上の第７実施例の正面断面図である。FIG. 14 is a front sectional view of a seventh embodiment of the above.
【図１５】図１４の側面断面図である。FIG. 15 is a side sectional view of FIG.
【図１６】図１４の分解斜視図である。FIG. 16 is an exploded perspective view of FIG.
【図１７】従来例を説明する断面図である。FIG. 17 is a sectional view illustrating a conventional example.
１ 熱電素子 ２ Ｐ型半導体素子 ３ Ｎ型半導体素子 ４ リード線 ５ 金属板電極 ６ セラミック基板 ７ 封止袋 ７′フィルム ９ 吸熱部 １０ 放熱部 1 Thermoelectric Element 2 P-Type Semiconductor Element 3 N-Type Semiconductor Element 4 Lead Wire 5 Metal Plate Electrode 6 Ceramic Substrate 7 Sealing Bag 7'Film 9 Heat Absorbing Section 10 Heat Dissipating Section
Claims (11)
たリード線と、熱電素子の両面に取り付けられた吸熱部
及び放熱部を備えた電子加熱冷却装置において、熱電素
子部を難透湿性薄膜材料からなる封止袋で包んで成るこ
とを特徴とする電子加熱冷却装置。1. An electronic heating / cooling device comprising a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element. An electronic heating and cooling device characterized by being wrapped in a sealing bag made of a thin film material.
内部に不活性ガスを充填して成ることを特徴とする請求
項１記載の電子加熱冷却装置。2. The electronic heating / cooling device according to claim 1, wherein an inert gas is filled in the inside of the sealing bag made of the moisture-impermeable thin film material.
内部が真空であることを特徴とする請求項１記載の電子
加熱冷却装置。3. The electronic heating / cooling device according to claim 1, wherein the inside of the sealing bag made of the moisture-impermeable thin film material is vacuum.
とする請求項１記載の電子加熱冷却装置。4. The electronic heating / cooling device according to claim 1, wherein the lead wire has a thin plate shape.
導性のよい薄膜材料であることを特徴とする請求項１記
載の電子加熱冷却装置。5. The electronic heating / cooling device according to claim 1, wherein the sealing bag is made of a thin film material having a low moisture permeability and a high thermal conductivity.
放熱部に密着させていることを特徴とする請求項１記載
の電子加熱冷却装置。6. The electronic heating / cooling device according to claim 1, wherein the sealing bag is brought into close contact with the heat absorbing portion and the heat radiating portion due to static electricity.
により吸熱部及び放熱部に密着させていることを特徴と
する請求項１記載の電子加熱冷却装置。7. The electronic heating / cooling device according to claim 1, wherein the sealing bag is brought into close contact with the heat absorbing portion and the heat radiating portion by heating the thermoelectric element.
たリード線と、熱電素子の両面に取り付けられた吸熱部
及び放熱部を備えた電子加熱冷却装置において、吸熱部
の外周面と放熱部の外周面とに亙り且つ全周に亙るよう
に難透湿性薄膜材料からなるフィルムを巻回し、フィル
ムの両端同士を熱融着等にて固着すると共にフィルムを
吸熱部の外周面と放熱部の外周面に熱融着等に固着して
フィルムにて熱電素子部を封止して成ることを特徴とす
る電子加熱冷却装置。8. An electronic heating / cooling device comprising a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element. A film made of a moisture-impermeable thin film material is wound around the outer peripheral surface of the part and around the entire circumference, and both ends of the film are fixed by heat fusion or the like, and the film is attached to the outer peripheral surface of the heat absorbing part and the heat radiating part. An electronic heating / cooling device, characterized in that the thermoelectric element part is sealed with a film by being fixed to the outer peripheral surface by heat fusion or the like.
たリード線と、熱電素子の両面に取り付けられた吸熱部
及び放熱部を備えた電子加熱冷却装置において、吸熱部
及び放熱部の熱電素子の挟持面の近傍部分を分割体とし
て分割し、吸熱部の分割体の外周面と放熱部の分割体の
外周面とに亙り且つ全周に亙るように難透湿性薄膜材料
からなるフィルムを巻回し、フィルムの両端同士を熱融
着等で固着すると共にフィルムを吸熱部の分割体の外周
面と放熱部の分割体の外周面に熱融着等で固着してフィ
ルムにて熱電素子部を封止して成ることを特徴とする電
子加熱冷却装置。9. An electronic heating / cooling device comprising a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element. Dividing the part in the vicinity of the sandwiching surface of the element as a divided body, a film made of a moisture-impermeable thin film material so as to cover the outer peripheral surface of the divided body of the heat absorbing portion and the outer peripheral surface of the divided body of the heat radiating portion and to cover the entire circumference. By winding and fixing both ends of the film by heat fusion etc., the film is fixed to the outer peripheral surface of the divided body of the heat absorbing part and the outer peripheral surface of the divided body of the heat dissipation part by heat fusion etc. An electronic heating and cooling device, characterized in that
れたリード線と、熱電素子の両面に取り付けられた吸熱
部及び放熱部を備えた電子加熱冷却装置において、難透
湿性薄膜材料にて形成された筒状のフィルムを熱電素子
を囲むように配置し、筒状のフィルムの内周の固着縁を
吸熱部の挟持面に熱融着等で固着すると共に筒状のフィ
ルムの外周の固着縁を放熱部の平面部に熱融着等で固着
してフィルムにて熱電素子部を封止して成ることを特徴
とする電子加熱冷却装置。10. An electronic heating / cooling device comprising a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element. The formed tubular film is arranged so as to surround the thermoelectric element, and the fixing edge of the inner periphery of the cylindrical film is fixed to the sandwiching surface of the heat absorbing portion by heat fusion and the outer periphery of the cylindrical film is fixed. An electronic heating and cooling device characterized in that a thermoelectric element part is sealed with a film by fixing an edge to a flat surface part of a heat radiating part by heat fusion or the like.
れたリード線と、熱電素子の両面に取り付けられた吸熱
部及び放熱部を備えた電子加熱冷却装置において、難透
湿性薄膜材料に形成された筒状のフィルムを熱電素子を
囲むように上下に一対配置し、吸熱部側のフィルムの内
周の固着縁を吸熱部の挟持面に熱融着等で固着すると共
に放熱部側のフィルムの内周の固着縁を放熱部の挟持面
に熱融着等で固着し、両方のフィルムの外周の固着縁同
士を熱融着等で固着してフィルムにて熱電素子部を封止
して成ることを特徴とする電子加熱冷却装置。11. An electronic heating / cooling device comprising a thermoelectric element, a lead wire provided at one end of the thermoelectric element, and a heat absorbing portion and a heat radiating portion attached to both surfaces of the thermoelectric element. A pair of vertically arranged tubular films surrounding the thermoelectric element are arranged, and the fixing edge of the inner circumference of the film on the heat absorbing portion side is fixed to the sandwiching surface of the heat absorbing portion by heat fusion or the like and the film on the heat radiating portion side. The fixing edge of the inner circumference of the film is fixed to the sandwiching surface of the heat radiating portion by heat fusion or the like, and the fixing edges of the outer circumferences of both films are fixed by heat fusion or the like to seal the thermoelectric element portion with the film. An electronic heating and cooling device characterized by being formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5228913A JPH06294562A (en) | 1993-02-10 | 1993-09-14 | Electronic heating/cooling apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2286793 | 1993-02-10 | ||
| JP5-22867 | 1993-02-10 | ||
| JP5228913A JPH06294562A (en) | 1993-02-10 | 1993-09-14 | Electronic heating/cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06294562A true JPH06294562A (en) | 1994-10-21 |
Family
ID=26360155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5228913A Withdrawn JPH06294562A (en) | 1993-02-10 | 1993-09-14 | Electronic heating/cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06294562A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5841064A (en) * | 1995-05-26 | 1998-11-24 | Matsushita Electric Works, Ltd. | Peltier module |
| US6530231B1 (en) * | 2000-09-22 | 2003-03-11 | Te Technology, Inc. | Thermoelectric assembly sealing member and thermoelectric assembly incorporating same |
| JP2007294864A (en) * | 2006-03-31 | 2007-11-08 | Kyocera Corp | Thermoelectric module |
| JP2012060156A (en) * | 2006-03-31 | 2012-03-22 | Kyocera Corp | Thermoelectric module |
| KR20200085568A (en) * | 2019-01-07 | 2020-07-15 | 엘지이노텍 주식회사 | Thermoelectric module |
| CN114637082A (en) * | 2020-12-16 | 2022-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
1993
- 1993-09-14 JP JP5228913A patent/JPH06294562A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5841064A (en) * | 1995-05-26 | 1998-11-24 | Matsushita Electric Works, Ltd. | Peltier module |
| DE19680505C2 (en) * | 1995-05-26 | 2001-10-31 | Matsushita Electric Works Ltd | Peltier effect module and method for its production |
| US6530231B1 (en) * | 2000-09-22 | 2003-03-11 | Te Technology, Inc. | Thermoelectric assembly sealing member and thermoelectric assembly incorporating same |
| US6662571B1 (en) | 2000-09-22 | 2003-12-16 | Te Technology, Inc. | Thermoelectric assembly sealing member and thermoelectric assembly incorporating same |
| JP2007294864A (en) * | 2006-03-31 | 2007-11-08 | Kyocera Corp | Thermoelectric module |
| JP2012060156A (en) * | 2006-03-31 | 2012-03-22 | Kyocera Corp | Thermoelectric module |
| KR20200085568A (en) * | 2019-01-07 | 2020-07-15 | 엘지이노텍 주식회사 | Thermoelectric module |
| CN114637082A (en) * | 2020-12-16 | 2022-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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