JPH06256947A - Continuous vacuum deposition device - Google Patents
Continuous vacuum deposition deviceInfo
- Publication number
- JPH06256947A JPH06256947A JP4421093A JP4421093A JPH06256947A JP H06256947 A JPH06256947 A JP H06256947A JP 4421093 A JP4421093 A JP 4421093A JP 4421093 A JP4421093 A JP 4421093A JP H06256947 A JPH06256947 A JP H06256947A
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- crucible
- vacuum
- ineffective
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、真空中で連続的に供給
される鋼板などの表面に蒸着膜を形成する連続真空蒸着
装置に係り、詳しくは、膜形成に使用されず装置自体に
付着する無効蒸着物を回収する連続真空蒸着装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous vacuum vapor deposition apparatus for forming a vapor deposition film on the surface of a steel sheet or the like which is continuously supplied in a vacuum, and more specifically, it is not used for film formation and is attached to the apparatus itself. The present invention relates to a continuous vacuum vapor deposition device for recovering ineffective vapor deposits.
【０００２】[0002]
【従来の技術】従来鋼板などに蒸着を行う連続真空蒸着
装置を図９を用いて説明する。真空チャンバー１内に蒸
発材料６を充填したルツボ３を設け、電子銃４により電
子ビーム５を照射して加熱する。電子ビーム５はルツボ
３近傍に設けられた偏向磁石７によって発生した磁場に
より曲げられ、ルツボ３を照射する。この照射によりル
ツボ３内の蒸発材料６は溶解して蒸発し、連続的にガイ
ドロール８を介して供給される鋼板などの蒸着基板２に
蒸着する。この時の真空チャンバー１内の圧力は１０-3
〜１０ -5 ｔｏｒｒに真空排気されている。かかる連続
真空蒸着装置により単一層、または多層膜の形成、また
蒸着材料の種類により、Ｔｉなどの単一材または合金材
の膜を蒸着基板２に形成する。2. Description of the Related Art A conventional continuous vacuum deposition apparatus for depositing a steel sheet or the like will be described with reference to FIG. A crucible 3 filled with evaporation material 6 is provided in the vacuum chamber 1, and an electron beam 5 is irradiated by an electron gun 4 to heat it. The electron beam 5 is bent by the magnetic field generated by the deflection magnet 7 provided near the crucible 3 and irradiates the crucible 3. By this irradiation, the evaporation material 6 in the crucible 3 is melted and evaporated, and is continuously vapor-deposited on the vapor deposition substrate 2 such as a steel plate supplied through the guide roll 8. At this time, the pressure in the vacuum chamber 1 is 10 −3
It is evacuated to -10 -5 torr. A single layer or a multilayer film is formed by such a continuous vacuum vapor deposition apparatus, and a film of a single material such as Ti or an alloy material is formed on the vapor deposition substrate 2 depending on the type of vapor deposition material.
【０００３】[0003]
【発明が解決しようとする課題】真空チャンバー１内で
電子銃４から電子ビーム５を照射し、ルツボ３の蒸発材
料６を溶解、蒸発させて蒸発流を発生させて蒸着基板２
に蒸着させる。その際に蒸発流の一部はルツボ３から蒸
着基板２へ至る径路となる真空チャンバー１の内壁に蒸
着する。このような位置には防着板９を設け、真空チャ
ンバー１自体への蒸着を防止するようにしている。しか
し、防着板９上には蒸着物３０が蓄積してゆき、これを
除去する装置がない場合、蒸着物３０は蓄積されてゆく
ので、斜線部で示すように蒸着基板２への所定の蒸着ゾ
ーンを狭くしたり、防着板９に蓄積した蒸着物３０が蒸
着基板２と接触するようになり、蒸着基板２を傷つけた
りするようになる。The electron beam 5 is emitted from the electron gun 4 in the vacuum chamber 1 to melt and evaporate the evaporation material 6 of the crucible 3 to generate an evaporation flow and to generate the evaporation substrate 2.
Vapor deposition. At that time, a part of the evaporation flow is vapor-deposited on the inner wall of the vacuum chamber 1 which serves as a path from the crucible 3 to the vapor deposition substrate 2. A deposition preventive plate 9 is provided at such a position to prevent vapor deposition on the vacuum chamber 1 itself. However, the vapor deposition material 30 accumulates on the deposition-inhibitory plate 9, and if there is no device for removing the vapor deposition material 30, the vapor deposition material 30 will accumulate, and as shown by the shaded area, a predetermined amount of the vapor deposition substrate 2 is deposited on the vapor deposition substrate 2. The vapor deposition zone is narrowed, and the vapor deposition material 30 accumulated on the deposition preventive plate 9 comes into contact with the vapor deposition substrate 2 to damage the vapor deposition substrate 2.
【０００４】また、このように防着板９に蓄積された蒸
着物の厚さが、数ｃｍとなると重くなるため、防着板９
を強固な構造としなければならず、また操業途中に蒸着
物３０の一部が剥がれ落ち、周囲に設置されている機器
類を損傷する場合が生じる。Further, the thickness of the deposited material accumulated on the deposition-inhibiting plate 9 becomes heavy when it reaches several cm.
Must be made to have a strong structure, and a part of the vapor deposition material 30 may peel off during the operation to damage the equipment installed in the surroundings.
【０００５】このため、連続真空蒸着装置を長時間運転
することができなくなり、頻繁に真空チャンバー１内を
清掃しなければならず、生産性が良くない。また清掃作
業も、蓄積物３０が数ｃｍと厚く、重いため、防着板９
から剥がすのに手間がかかり、操作性が悪かった。For this reason, the continuous vacuum deposition apparatus cannot be operated for a long time, and the interior of the vacuum chamber 1 must be frequently cleaned, resulting in poor productivity. In addition, the cleaning work is also carried out because the deposit 30 is as thick as several cm and is heavy, so
It took a lot of time to peel it off, and the operability was poor.
【０００６】このような問題点を解決するため、蒸着基
板２の裏側に密接して蒸着基板２より幅の広いエンドレ
スベルトを設け、このエンドレスベルトに付着した蒸着
物をスクレーパではぎとるように構成した蒸着物付着防
止装置が特開昭６３−２４０６３号公報により提案され
ているが、かかる装置においても次のような問題点があ
った。In order to solve such a problem, an endless belt having a width wider than that of the vapor deposition substrate 2 is provided in close contact with the back side of the vapor deposition substrate 2, and the vapor deposition material attached to the endless belt is peeled off by a scraper. An apparatus for preventing deposition of deposits has been proposed by Japanese Patent Laid-Open No. 63-24063, but such an apparatus also had the following problems.
【０００７】蒸着基板２の裏側へ回り込む蒸着物のみ
回収することを目的としており、これ以外のところに付
着する蒸着物は回収できない。 スクレーパの刃の消耗が激しく、スクレーパが真空中
にあるため、刃を交換するときには真空を破って大気圧
に戻す必要があり、操業を中止しなければならない。 スクレーパで掻き取り、回収箱に回収された蒸着物を
外部に除去する際も、一旦真空を破るので、操業を中止
しなければならず、生産性が悪くなる。[0007] The purpose is to collect only the deposits that go around to the back side of the vapor deposition substrate 2, and the deposits that adhere to other places cannot be collected. Since the blade of the scraper is heavily consumed and the scraper is in a vacuum, it is necessary to break the vacuum and return to atmospheric pressure when replacing the blade, and the operation must be stopped. Even when the vapor deposits scraped by the scraper and collected in the collection box are removed to the outside, the vacuum is once broken, and the operation must be stopped, resulting in poor productivity.
【０００８】本発明は上述の問題点に鑑みてなされたも
ので、蒸着基板以外に付着する無効蒸着物を回収できる
ようにし、さらに回収した無効蒸着物を操業を中止する
ことなく外部へ搬出することが可能な連続真空蒸着装置
を提供することを目的とする。The present invention has been made in view of the above-mentioned problems, and makes it possible to recover the ineffective vapor deposition material that adheres to other than the vapor deposition substrate, and further to carry out the recovered ineffective vapor deposition material without stopping the operation. It is an object of the present invention to provide a continuous vacuum deposition apparatus capable of performing the above.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するた
め、本発明は真空チャンバ内で蒸発用ルツボと連続的に
供給される蒸着基板を対向させ、蒸発用ルツボ内の蒸発
材料を加熱して蒸着基板に蒸着膜を形成する連続真空蒸
着装置において、前記蒸発用ルツボより前記蒸着基板に
至る蒸発物の移動径路の周囲に、付着した蒸着物を溶融
して回収するヒータを備えた回収パネルを設けたもので
ある。In order to achieve the above object, the present invention heats the evaporation material in the evaporation crucible by facing an evaporation crucible and a vapor deposition substrate continuously supplied in the vacuum chamber. In a continuous vacuum vapor deposition apparatus for forming a vapor deposition film on a vapor deposition substrate, a recovery panel equipped with a heater for melting and recovering the deposited vapor deposition around the path of movement of the vaporized material from the evaporation crucible to the vapor deposition substrate. It is provided.
【００１０】また、前記回収パネルの下部にヒータを内
蔵し、溶融した蒸着物を流すことのできる流路により構
成した収集手段を設けたものである。Further, a collector is provided in the lower part of the recovery panel, and a collecting means is constituted by a flow path capable of flowing the melted deposit.
【００１１】また、前記収集手段より流出する蒸着物を
収納し、真空チャンバ外へ移動可能な搬出手段と、前記
真空チャンバに隣接し、真空保持弁を介して設けた蒸着
物除去室とを備え、前記蒸着物除去室に真空排気装置を
設けて前記真空チャンバと同等の真空圧とし、前記真空
保持弁を解放して前記搬出手段が前記真空チャンバと前
記蒸着物除去室間を移動できるようにしたものである。Further, the apparatus is provided with a carrying-out means for accommodating the deposits flowing out from the collecting means and being movable to the outside of the vacuum chamber, and a deposit removing chamber adjacent to the vacuum chamber and provided via a vacuum holding valve. A vacuum evacuation device is provided in the deposit removal chamber so that the vacuum pressure is equivalent to that of the vacuum chamber, and the vacuum holding valve is opened so that the carry-out means can move between the vacuum chamber and the deposit removal chamber. It was done.
【００１２】[0012]
【作用】かかる構成により、蒸発用ルツボから蒸着基板
へ至る蒸発材料が蒸発流となって移動する径路の周囲に
は、回収パネルが設けられているので、蒸着基板へ付着
する蒸着物以外の蒸着物はほとんどこの回収パネルに付
着する。回収パネルには付着した蒸着物を溶融して回収
するヒータが設けられているので、このヒーターを加熱
することにより回収パネルに付着した蒸着物は溶融して
回収パネルの下方に落下してゆく。なお、蒸発用ルツボ
からの輻射熱だけで回収パネルが蒸着物を溶融するのに
必要な温度に加熱されている時は、ヒータによる加熱は
不要となる。With this structure, since the recovery panel is provided around the path along which the evaporation material from the evaporation crucible to the evaporation substrate moves as an evaporation flow, the evaporation materials other than the evaporation material attached to the evaporation substrate are deposited. Most of the material adheres to this collection panel. Since the recovery panel is provided with a heater that melts and collects the deposited vapor deposition material, by heating the heater, the vapor deposition material deposited on the collection panel melts and falls below the collection panel. It should be noted that when the recovery panel is heated to the temperature necessary for melting the deposit by only the radiant heat from the evaporation crucible, heating by the heater is unnecessary.
【００１３】この回収パネルの下部には、溶融して落下
してくる蒸着物を収集する収集手段が設けられており、
この収集手段は、ヒーターを内蔵し、溶融した蒸着物を
流す流路を構成しているので、各回収パネルから回収し
た蒸着物を流路によって所定位置へ移送することが可能
となる。At the lower part of the recovery panel, there is provided a collecting means for collecting the vaporized material which is melted and falls,
Since the collecting means has a heater built therein and constitutes a flow path for flowing the melted vapor deposition material, the vapor deposition material collected from each recovery panel can be transferred to a predetermined position by the flow path.
【００１４】この所定位置に、真空チャンバ外へ移動可
能な搬送手段を置くことにより、収集手段によって、回
収パネルから回収した蒸着物を搬送手段に移すことがで
き、真空チャンバに隣接し、真空保持弁を介して蒸着物
除去室を設け、蒸着物除去室内の真空排気装置により、
蒸着物除去室内を真空チャンバと同等の真空圧とした状
態で、真空保持弁を開閉することにより、真空チャンバ
の真空を破ることなく搬送手段を真空チャンバに出し入
れすることが可能となる。これにより操業を中止するこ
となく、回収パネルに付着した蒸着物を蒸着物除去室へ
搬出することが可能となる。By disposing the transfer means movable to the outside of the vacuum chamber at this predetermined position, the vapor deposition material recovered from the recovery panel can be transferred to the transfer means by the collection means and is adjacent to the vacuum chamber and is kept in vacuum. A deposit removal chamber is provided through the valve, and a vacuum exhaust device inside the deposition removal chamber
By opening and closing the vacuum holding valve in a state where the vapor deposition removal chamber has a vacuum pressure equivalent to that of the vacuum chamber, the transfer means can be taken in and out of the vacuum chamber without breaking the vacuum of the vacuum chamber. As a result, it is possible to carry out the deposits attached to the recovery panel to the deposit removal chamber without stopping the operation.
【００１５】[0015]
【実施例】以下、本発明の実施例を図面を参照して説明
する。図１〜図３は本発明の第１実施例の構成図を表
し、図１は正面図、図２は側面図、図３は平面図を表
す。真空チャンバ１には２組の蒸発用ルツボ３と電子銃
４が対向して設けられ、この蒸発用ルツボ３の上部を蒸
着基板２が連続走行する。蒸発用ルツボ３には蒸発材料
６が充填され、電子ビーム５で照射される。２つの蒸発
用ルツボ３と蒸着基板２の間の蒸発した材料が蒸発流１
０となって蒸発する径路の４周には、無効蒸着物の回収
パネル１１を四角錐台形状に設け、この裏面に回収パネ
ル１１の内面に付着した無効蒸着物を溶融して回収パネ
ル１１内面に添って滴下させるヒーター１２が設けられ
ている。なお、回収パネル１１の傾斜角θは１８０度以
内とする。Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a configuration diagram of a first embodiment of the present invention, FIG. 1 is a front view, FIG. 2 is a side view, and FIG. 3 is a plan view. The vacuum chamber 1 is provided with two sets of evaporation crucibles 3 and an electron gun 4 facing each other, and the vapor deposition substrate 2 continuously runs on the evaporation crucible 3 above. The evaporation crucible 3 is filled with the evaporation material 6 and is irradiated with the electron beam 5. The vaporized material between the two vaporizing crucibles 3 and the vapor deposition substrate 2 becomes the vaporized stream 1
The recovery panel 11 for the invalid deposition material is provided in the shape of a quadrangular pyramid on the four circumferences of the path where 0 is evaporated, and the invalid deposition material attached to the inner surface of the recovery panel 11 is melted on the back surface of the recovery panel 11 to melt the invalid deposition material. A heater 12 is provided for dropping along with. The inclination angle θ of the recovery panel 11 is within 180 degrees.
【００１６】回収パネル１１の下部には、断面形状がＵ
字形をした無効蒸着物の移送用ルツボ１３が水平に対
し、傾斜を付けた状態で配置される。移送用ルツボ１３
は回収パネル１１から滴下する無効蒸着物を収集する
「樋」の役割をし、各移送用ルツボ１３からの無効蒸着
物は図２に示すように搬送用ルツボ１４に収集される。
なお、図２に示すように回収パネル１１の１つからは、
溶融した無効蒸着物を直接搬送用ルツボ１４に滴下す
る。搬送用ルツボ１４は断面形状がＵ字形をし、下部に
移動用の車輪を有し、内部に収集した回収物１５を収納
するよう構成されている。The lower part of the recovery panel 11 has a U-shaped cross section.
The crucible 13 for transferring the invalid deposition having a character shape is arranged in an inclined state with respect to the horizontal. Transfer crucible 13
Plays the role of a "gutter" for collecting the ineffective vapor deposits dropped from the recovery panel 11, and the ineffective vapor deposits from the respective transfer crucibles 13 are collected in the transport crucible 14 as shown in FIG.
As shown in FIG. 2, from one of the recovery panels 11,
The molten ineffective vapor deposition material is dropped directly onto the crucible 14 for transportation. The transport crucible 14 has a U-shaped cross section, has wheels for movement at the bottom, and is configured to store the collected material 15 therein.
【００１７】真空チャンバ１には排気装置１６が設けら
れ、真空チャンバー１内を圧力１０ -3〜１０ -5 ｔｏｒ
ｒに保持する。また搬送用ルツボ１４の設定位置に近傍
に無効蒸着物除去室１７が設けられ、真空を保持するゲ
ート弁１８によって真空チャンバ１と仕切られている。
無効蒸着物除去室１７にも排気装置１９が設けられ、真
空チャンバ１と同じ真空圧とすることができるように構
成されている。An exhaust device 16 is provided in the vacuum chamber 1.
The pressure in the vacuum chamber 1 is 10 -3-10-Fivetor
Hold at r. Also, in the vicinity of the setting position of the crucible 14 for transportation.
An ineffective deposit removing chamber 17 is provided in the
It is separated from the vacuum chamber 1 by a gate valve 18.
An exhaust device 19 is also provided in the ineffective deposit removing chamber 17,
The vacuum pressure is the same as that of the empty chamber 1.
Is made.
【００１８】図４は移送用ルツボ１３の構成図を示す。
断面形状はＵ字型をした成形体２０で構成され、内部に
はヒーター２２を内蔵し、側面と底部は断熱材２１で覆
われている。これにより、回収パネル１１から回収され
た無効蒸着物を固化することなく、流動させ、「樋」の
役割をはたすことができる。FIG. 4 is a block diagram of the transfer crucible 13.
The cross-sectional shape is formed by a U-shaped molded body 20, a heater 22 is built in the inside, and the side surface and the bottom are covered with a heat insulating material 21. As a result, the ineffective vapor deposition material recovered from the recovery panel 11 can be made to flow without solidifying, and can serve as a “gutter”.
【００１９】図５は搬送用ルツボ１４の構成図を示す。
移送用ルツボ１３と同様に、断面形状はＵ字型をした成
形体２３で構成され、内部にはヒーター２５を内蔵し、
側面と底部は断熱材２４で覆われている。これにより回
収物１５を固化しない状態で無効蒸着物除去室１７へ搬
出することができる。なお、搬送用ルツボ１４は回収物
１５を固化した状態で無効蒸着物除去室１７へ搬送して
もよい場合があり、このときは、ヒーター２５や断熱材
２４は不要となる。FIG. 5 is a block diagram of the crucible 14 for transportation.
Similar to the transfer crucible 13, the molded body 23 has a U-shaped cross section, and has a heater 25 built therein.
The side surface and the bottom are covered with a heat insulating material 24. As a result, the collected material 15 can be carried out to the ineffective vapor deposition material removing chamber 17 without being solidified. In some cases, the transfer crucible 14 may transfer the collected material 15 to the ineffective vapor deposition material removing chamber 17 in a solidified state. At this time, the heater 25 and the heat insulating material 24 are not necessary.
【００２０】次に動作について説明する。真空チャンバ
１内に設けられた２つの蒸発用ルツボ３内の蒸発材料６
に、それぞれの電子銃４から電子ビーム５が照射され
る。なお、電子ビーム５は図示しない偏向磁石により出
射方向からほぼ９０度曲げられて蒸発材料６を照射する
よう構成されている。この照射により蒸発材料６は溶解
して蒸発し、蒸発流となって、連続的に供給される蒸着
基板２に蒸着し、蒸着膜を形成する。一方、蒸発流の一
部は蒸発流の径路の周囲に設けられた回収パネル１１の
内表面に付着し無効蒸着物を形成する。回収パネル１１
の裏面に設けられたヒーター１２は無効蒸着物の融点以
上に回収パネル１１の表面を加熱できるよう温度制御さ
れており、回収パネル１１に付着した無効蒸着物は溶融
され、回収パネル１１の表面に添って流れ、下側に設置
されている移送用ルツボ１３に滴下してゆく。Next, the operation will be described. Evaporation material 6 in two evaporation crucibles 3 provided in the vacuum chamber 1.
The electron beam 5 is emitted from each electron gun 4. The electron beam 5 is configured to be bent by approximately 90 degrees from the emitting direction by a deflection magnet (not shown) to irradiate the evaporation material 6. By this irradiation, the evaporation material 6 is melted and evaporated to form an evaporation flow, which is vapor-deposited on the vapor deposition substrate 2 which is continuously supplied to form a vapor deposition film. On the other hand, a part of the evaporation flow adheres to the inner surface of the recovery panel 11 provided around the path of the evaporation flow to form an ineffective vapor deposit. Collection panel 11
The temperature of the heater 12 provided on the back surface of the recovery panel 11 is controlled so that the surface of the recovery panel 11 can be heated to a temperature higher than the melting point of the ineffective deposition material. Along with it, it drops in the transfer crucible 13 installed on the lower side.
【００２１】移送用ルツボ１３もヒーター２２によって
蒸着物を融点以上に加熱するよう温度制御され、かつ水
平に対し、傾斜角α度傾斜して設置されているので、回
収パネル１１から滴下した無効蒸着物を「樋」の働きに
よって移送し、搬送用ルツボ１４に移送する。なお、移
送用ルツボ１３の水平に対する傾斜角αは０°＜α＜９
０°の範囲とするが、好ましくは５°≦α≦２０°の範
囲とする。このようにして回収パネル１１から滴下した
無効蒸着物は、１つまたは２つの移送用ルツボ１３を介
して、または直接に、一番低いレベルにある搬送用ルツ
ボ１４に全て集められ、回収物１５として格納される。
搬送用ルツボ１４も内蔵するヒーター２５によって集め
られた回収物１５が固化しないよう温度制御されてい
る。The transfer crucible 13 is also temperature-controlled by the heater 22 so as to heat the deposit to a temperature higher than the melting point, and is installed at an inclination angle α degrees with respect to the horizontal, so that the ineffective deposition dropped from the recovery panel 11 is performed. The object is transferred by the action of the "gutter" and transferred to the crucible 14 for transfer. The inclination angle α of the transfer crucible 13 with respect to the horizontal is 0 ° <α <9.
The range is 0 °, preferably 5 ° ≦ α ≦ 20 °. In this way, the ineffective vapor deposits dropped from the recovery panel 11 are all collected in the transfer crucible 14 at the lowest level through one or two transfer crucibles 13 or directly, and the recovered deposits 15 are collected. Is stored as
The temperature is controlled so that the collected material 15 collected by the heater 25, which also contains the crucible 14 for transportation, does not solidify.
【００２２】このようにして搬送用ルツボ１４に回収物
１５が一杯になると、真空チャンバ１に接続する無効蒸
着物除去室１７に搬出される。この時、無効蒸着物除去
室１７では排気装置１９を作動して真空チャンバ１内の
圧力と等圧となるよう調整した後、真空チャンバ１と無
効蒸着物除去室１７を仕切るゲート弁１８を開いて搬出
する。搬送用ルツボ１４が無効蒸着物除去室１７へ搬出
された後、ゲート弁１８を閉じ、無効蒸着物除去室１７
のみ常圧として、搬送用ルツボ１４内の回収物１５を除
去する。When the recovery crucible 14 is filled with the recovered crucible 14 in this way, it is carried out to the ineffective vapor deposition removal chamber 17 connected to the vacuum chamber 1. At this time, in the ineffective deposit removing chamber 17, the exhaust device 19 is operated to adjust the pressure to be equal to the pressure in the vacuum chamber 1, and then the gate valve 18 for partitioning the vacuum chamber 1 and the ineffective deposit removing chamber 17 is opened. And carry it out. After the transfer crucible 14 is carried out to the ineffective deposit removing chamber 17, the gate valve 18 is closed to remove the ineffective deposit removing chamber 17
Only the normal pressure is applied to remove the recovered material 15 in the crucible 14 for transportation.
【００２３】回収物１５を除去した後、搬送用ルツボ１
４を真空チャンバー１に搬入するようセットする。セッ
ト後再び排気装置１９を作動し、無効蒸着物除去室１７
を真空排気し、真空チャンバ１と同圧力にした後、ゲー
ト弁１８を開き、搬送用ルツボ１４を真空チャンバ１内
に搬入し、移送用ルツボ１３の下の所定位置に設置す
る。これで一連の無効蒸着物回収および除去作業が終了
する。After removing the collected material 15, the crucible 1 for transportation
4 is set so as to be loaded into the vacuum chamber 1. After setting, the exhaust device 19 is activated again to remove the ineffective deposit removing chamber 17
Is evacuated to the same pressure as the vacuum chamber 1, the gate valve 18 is opened, the transfer crucible 14 is loaded into the vacuum chamber 1, and is installed at a predetermined position below the transfer crucible 13. This completes a series of ineffective deposit collection and removal operations.
【００２４】本実施例により、真空チャンバ１内の真空
を破ることがないため、蒸着基板２への蒸着操業を停止
することなく連続的な操作が可能となる。なお、搬送用
ルツボ１４が搬出され、移送用ルツボ１３の下の所定位
置にない間は、回収用パネル１１のヒーター１２、移送
用ルツボ１３のヒーター２２を停止または低温にして搬
送用ルツボ１４が設定される位置に回収物１５が滴下す
るのを防止する。According to the present embodiment, since the vacuum in the vacuum chamber 1 is not broken, continuous operation can be performed without stopping the vapor deposition operation on the vapor deposition substrate 2. While the transfer crucible 14 is unloaded and is not in the predetermined position below the transfer crucible 13, the heater 12 of the recovery panel 11 and the heater 22 of the transfer crucible 13 are stopped or cooled to a low temperature. The collected material 15 is prevented from dripping at the set position.
【００２５】次に第２実施例を説明する。図６は第２実
施例の構成を示し、図３と同一符号は同一のものを表
す。本実施例は第１実施例に対して無効蒸着物除去室２
６とゲート弁２７を大きくし、無効蒸着物除去室２６に
２台の搬送用ルツボ１４を設置することができるように
したものである。Next, a second embodiment will be described. FIG. 6 shows the configuration of the second embodiment, and the same symbols as those in FIG. 3 represent the same components. This embodiment is different from the first embodiment in the ineffective deposit removing chamber 2
6 and the gate valve 27 are enlarged so that the two transport crucibles 14 can be installed in the ineffective deposit removing chamber 26.
【００２６】次に本実施例の動作について説明する。回
収パネル１１に付着した蒸着物が搬送用ルツボ１４に回
収物１５として収集されるまでは第１実施例と同じであ
る。搬送用ルツボ１４の回収物１５が一杯になるときま
でに、無効蒸着物除去室２６は排気装置１９によって真
空チャンバー１と同圧となるよう排気される。ゲート弁
２７を開き、搬送用ルツボ１４をＡに示す設定位置より
Ｂに示す位置に搬出する。無効蒸着物除去室２６には前
もって空の搬送用ルツボ１４をＣに示す位置にセットし
ておき、回収物１５が一杯の搬送ルツボ１４をＢの位置
に搬出した後、Ｄで示す位置に搬入し、Ａに示す設定位
置にセットする。その後、ゲート弁２７を閉じ、無効蒸
着物除去室２６を大気圧にし、搬送用ルツボ１４から回
収物１５を除去して、次の搬入に備える。Next, the operation of this embodiment will be described. It is the same as in the first embodiment until the vapor deposition material attached to the recovery panel 11 is collected as the recovery material 15 in the transport crucible 14. By the time the collected material 15 in the crucible 14 for transportation is full, the ineffective deposit removal chamber 26 is evacuated by the evacuation device 19 to the same pressure as the vacuum chamber 1. The gate valve 27 is opened, and the crucible 14 for transportation is carried out from the set position shown in A to the position shown in B. An empty transport crucible 14 is set in advance in the position shown in C in the ineffective deposit removal chamber 26, and the transport crucible 14 full of the recovered material 15 is carried out to the position B and then carried into the position D. And set it to the set position shown in A. After that, the gate valve 27 is closed, the ineffective deposition material removal chamber 26 is brought to atmospheric pressure, and the recovered material 15 is removed from the transport crucible 14 to prepare for the next loading.
【００２７】本実施例によれば、搬送用ルツボ１４の交
換時間が短縮され、回収用パネル１１のヒーター１２や
移送用ルツボ１３のヒーター２２を停止、または低温に
しておく期間も短縮され、かつ連続的に無効蒸着物の回
収作業を行うことが可能となる。According to this embodiment, the time required for exchanging the crucible 14 for transportation is shortened, and the period during which the heater 12 of the recovery panel 11 or the heater 22 of the transfer crucible 13 is stopped or kept at a low temperature is shortened, and It is possible to continuously carry out the work of recovering the ineffective vapor deposits.
【００２８】次に第３実施例を説明する。図７は本実施
例の正面図を示し、図８は平面図を示しており、図１，
図３と同一符号は同一のものを表す。本実施例は第１実
施例の無効蒸着物除去室１７を真空チャンバ１を中心に
して対称位置に、もう１つ設けたものである。図７は図
１に対応し、図８は図３に対応する。第３実施例は第２
実施例に対して搬送用ルツボ１４の交換作業がさらに容
易になり、かつ短時間で行うことができる。Next, a third embodiment will be described. FIG. 7 shows a front view of this embodiment, and FIG. 8 shows a plan view thereof.
The same symbols as those in FIG. 3 represent the same components. In this embodiment, another ineffective deposit removing chamber 17 of the first embodiment is provided at a symmetrical position with respect to the vacuum chamber 1. FIG. 7 corresponds to FIG. 1, and FIG. 8 corresponds to FIG. The third embodiment is the second
The work of exchanging the crucible 14 for transportation becomes easier than that of the embodiment, and can be performed in a short time.
【００２９】本実施例の場合、いずれか一方の無効蒸着
物除去室１７に空の搬送用ルツボ１４を搬入しておき、
真空チャンバ１内の搬送用ルツボ１４の回収物１５が一
杯になるときまでに、両無効蒸着物除去室１７を排気装
置１９を動作させて真空チャンバ１と同じ真空圧にして
おく。真空チャンバ１内の搬入用ルツボ１４の回収物１
５が一杯になると、空の搬送用ルツボ１４の入っていな
い方の無効蒸着物除去室１７のゲート弁１８を開き、真
空チャンバ１内の搬送用ルツボ１４を搬出し、次に空の
搬送用ルツボ１４の入っている無効蒸着物除去室１７の
ゲート弁１８を開いて、この空の搬送ルツボ１４を真空
チャンバ１内の移送用ルツボ１３の下の所定位置に設定
する。その後、両ゲート弁１８を閉じ、真空チャンバ１
より搬送用ルツボ１４を搬出した無効蒸着物除去室１７
を大気圧とし、回収物１５を除去して、次の搬入に備え
る。このように２つの無効蒸着物除去室１７を交互に回
収物１５の除去作業に使用することにより、搬送用ルツ
ボ１４の回収物１５の除去作業をスムーズに行うことが
でき、かつ連続的に回収作業を行うことができる。In the case of the present embodiment, the empty crucible 14 for transportation is loaded into one of the invalid vapor deposition removal chambers 17,
By the time the collected material 15 of the crucible 14 for transportation in the vacuum chamber 1 becomes full, both of the ineffective deposit removal chambers 17 are operated with the exhaust device 19 and kept at the same vacuum pressure as the vacuum chamber 1. Collected material 1 in the crucible 14 for loading in the vacuum chamber 1
When 5 is full, the gate valve 18 of the ineffective deposit removal chamber 17 which does not contain the empty transfer crucible 14 is opened, the transfer crucible 14 in the vacuum chamber 1 is taken out, and then the empty transfer crucible 14 is transferred. The gate valve 18 of the ineffective deposit removing chamber 17 containing the crucible 14 is opened to set the empty transfer crucible 14 at a predetermined position below the transfer crucible 13 in the vacuum chamber 1. After that, both gate valves 18 are closed and the vacuum chamber 1
From the crucible 14 for transportation, and the ineffective deposit removal chamber 17
Is set to atmospheric pressure, the recovered material 15 is removed, and the material is prepared for the next loading. By alternately using the two ineffective deposit removal chambers 17 for the removal operation of the recovery material 15 as described above, the removal operation of the recovery material 15 of the crucible 14 for transportation can be smoothly performed and the recovery operation can be continuously performed. You can do the work.
【００３０】上述した各実施例の効果を述べると次のよ
うになる。 蒸着基板２に付着しないで無効となる無効蒸着物が真
空チャンバ１内に蓄積しないため、蒸着基板２への蒸発
流の径路が、図９に示したように蓄積物で狭くなり、蒸
着基板２への蒸着量が少なくなるということがなくな
る。また蓄積した無効蒸着物が走行する蒸着基板２に接
触することがなくなるため、蒸着基板２を損傷すること
がなくなる。 無効蒸着物が蓄積しなくなるため、蒸発用ルツボ３か
らの蒸発量を増やし、蒸着基板２の走行スピードを上げ
ることが可能となる。 上述した、により高速成膜が可能となり、さらに
長時間連続運転が可能となるため、生産性の向上、装置
のランニングコストの低減が可能となる。 無効蒸着物を搬送用ルツボ１４に回収して無効蒸着物
除去室１７、２６へ搬出し、空の搬送用ルツボ１４を搬
入する際、真空チャンバ１の真空を破る必要がないの
で、蒸着操作を停止することなく長時間連続運転するこ
とが可能となる。これにより連続運転時間は電子銃４の
寿命によって決定されるようになり、連続運転時間が飛
躍的に増大する。The effects of the above-described embodiments will be described below. Since the ineffective vapor deposition material that does not adhere to the vapor deposition substrate 2 and becomes ineffective does not accumulate in the vacuum chamber 1, the path of the evaporation flow to the vapor deposition substrate 2 becomes narrow with the accumulation material as shown in FIG. The amount of vapor deposition on the substrate does not decrease. Further, since the accumulated ineffective vapor deposition material does not come into contact with the traveling vapor deposition substrate 2, the vapor deposition substrate 2 is not damaged. Since the ineffective vapor deposition material does not accumulate, the evaporation amount from the evaporation crucible 3 can be increased and the traveling speed of the vapor deposition substrate 2 can be increased. Due to the above, high-speed film formation is possible, and continuous operation for a long time is possible, so that it is possible to improve productivity and reduce the running cost of the apparatus. It is not necessary to break the vacuum of the vacuum chamber 1 when the ineffective vapor deposition product is collected in the transport crucible 14 and carried out to the ineffective vapor deposition removal chambers 17 and 26, and the empty transport crucible 14 is loaded. It is possible to continuously operate for a long time without stopping. As a result, the continuous operation time is determined by the life of the electron gun 4, and the continuous operation time increases dramatically.
【００３１】蓄積した無効蒸着物を取り除く作業は重
労働であるが、このような作業から解放されることにな
る。これにより作業員の削減が可能となり、コストが低
減する。 運転中に無効蒸着物が剥がれ落ち、落下することがな
くなるので、周辺の機器の損傷がなくなる。 回収して真空チャンバ外に搬出された無効蒸着物を再
度蒸発材料として利用することができるため、蒸発材料
の使用効率が飛躍的に向上する。 回収パネルを設けることにより、防着板は不要とな
る。Although the work of removing the accumulated ineffective deposits is a heavy labor, it is freed from such work. As a result, the number of workers can be reduced and the cost can be reduced. Since the ineffective vapor deposition material does not peel off and fall during operation, damage to surrounding equipment is eliminated. Since the ineffective vapor deposition material that has been collected and carried out of the vacuum chamber can be reused as the evaporation material, the use efficiency of the evaporation material is dramatically improved. By providing the recovery panel, the anti-adhesion plate becomes unnecessary.
【００３２】[0032]
【発明の効果】以上の説明から明らかなように本発明
は、回収パネルを蒸発物の径路の周囲に設け、蒸着基板
に付着しない無効蒸着物を回収できるので、無効蒸着物
の蓄積により発生する不都合な事態を回避することがで
きる。さらに無効蒸着物除去室を設け、真空チャンバと
等圧とすることのできる排気装置を設けることにより、
蒸着操作を実施中も回収した無効蒸着物の無効蒸着物除
去室への搬出が可能となり、連続運転時間を大幅に増大
することが可能となる。As is apparent from the above description, in the present invention, since the recovery panel is provided around the path of the evaporation material and the ineffective evaporation material that does not adhere to the vapor deposition substrate can be recovered, it is caused by the accumulation of the ineffective evaporation material. Inconvenient situations can be avoided. Furthermore, by providing an ineffective deposit removal chamber and an exhaust device that can be made to have the same pressure as the vacuum chamber,
Even during the vapor deposition operation, the invalid vapor collected can be carried out to the invalid vapor deposit removing chamber, and the continuous operation time can be significantly increased.
【図１】本発明の第１実施例の正面図である。FIG. 1 is a front view of a first embodiment of the present invention.
【図２】本発明の第１実施例の側面図である。FIG. 2 is a side view of the first embodiment of the present invention.
【図３】本発明の第１実施例の平面図である。FIG. 3 is a plan view of the first embodiment of the present invention.
【図４】移送用ルツボの構成図である。FIG. 4 is a configuration diagram of a transfer crucible.
【図５】搬送用ルツボの構成図である。FIG. 5 is a configuration diagram of a crucible for transportation.
【図６】第２実施例の構成を示す平面図である。FIG. 6 is a plan view showing the configuration of the second embodiment.
【図７】第３実施例の構成を示す正面図である。FIG. 7 is a front view showing the configuration of a third embodiment.
【図８】第３実施例の構成を示す平面図である。FIG. 8 is a plan view showing the configuration of the third embodiment.
【図９】従来の真空蒸着装置の構成を示す図である。FIG. 9 is a diagram showing a configuration of a conventional vacuum vapor deposition device.
１ 真空チャンバ ２ 蒸着基板 ３ 蒸発用ルツボ ４ 電子銃 ５ 電子ビーム ６ 蒸発材料 １１ 回収パネル １２，２２，２５ ヒーター １３ 移送用ルツボ １４ 搬送用ルツボ １５ 回収物 １６，１９ 排気装置 １７，２６ 無効蒸着物除去室 １８，２７ ゲート弁 ２０，２３ 成形体 ２１，２４ 断熱材 DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Evaporation substrate 3 Evaporating crucible 4 Electron gun 5 Electron beam 6 Evaporating material 11 Recovery panel 12, 22, 25 Heater 13 Transfer crucible 14 Transfer crucible 15 Collected material 16,19 Exhaust device 17,26 Invalid evaporated material Removal chamber 18,27 Gate valve 20,23 Molded body 21,24 Insulation material
Claims (3)
に供給される蒸着基板を対向させ、蒸発用ルツボ内の蒸
発材料を加熱して蒸着基板に蒸着膜を形成する連続真空
蒸着装置において、前記蒸発用ルツボより前記蒸着基板
に至る蒸発物の移動径路の周囲に、付着した蒸着物を溶
融して回収するヒータを備えた回収パネルを設けたこと
を特徴とする連続真空蒸着装置。1. A continuous vacuum vapor deposition apparatus for forming a vapor deposition film on a vapor deposition substrate by heating a vaporization material in the vaporization crucible so as to face a vapor deposition substrate continuously supplied to the vaporization crucible in a vacuum chamber, A continuous vacuum vapor deposition apparatus comprising a recovery panel provided with a heater for melting and recovering the deposited vapor deposition material around the path of movement of the vapor deposition material from the evaporation crucible to the vapor deposition substrate.
し、溶融した蒸着物を流すことのできる流路により構成
した収集手段を設けたことを特徴とする請求項１記載の
連続真空蒸着装置。2. The continuous vacuum vapor deposition apparatus according to claim 1, wherein a heater is built in the lower part of the recovery panel, and a collecting means constituted by a flow path capable of flowing a melted vapor deposit is provided.
し、真空チャンバ外へ移動可能な搬出手段と、前記真空
チャンバに隣接し、真空保持弁を介して設けた蒸着物除
去室とを備え、前記蒸着物除去室に真空排気装置を設け
て前記真空チャンバと同等の真空圧とし、前記真空保持
弁を解放して前記搬出手段が前記真空チャンバと前記蒸
着物除去室間を移動できるようにしたことを特徴とする
請求項２記載の連続真空蒸着装置。3. A carrying-out means for accommodating the deposits flowing out from said collecting means and movable to the outside of the vacuum chamber, and a deposit removing chamber adjacent to said vacuum chamber and provided via a vacuum holding valve. A vacuum evacuation device is provided in the deposit removal chamber so that the vacuum pressure is equivalent to that of the vacuum chamber, and the vacuum holding valve is opened so that the carry-out means can move between the vacuum chamber and the deposit removal chamber. The continuous vacuum vapor deposition apparatus according to claim 2, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04421093A JP3428057B2 (en) | 1993-03-05 | 1993-03-05 | Continuous vacuum deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04421093A JP3428057B2 (en) | 1993-03-05 | 1993-03-05 | Continuous vacuum deposition equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06256947A true JPH06256947A (en) | 1994-09-13 |
| JP3428057B2 JP3428057B2 (en) | 2003-07-22 |
Family
ID=12685196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04421093A Expired - Fee Related JP3428057B2 (en) | 1993-03-05 | 1993-03-05 | Continuous vacuum deposition equipment |
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| Country | Link |
|---|---|
| JP (1) | JP3428057B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016014174A (en) * | 2014-07-02 | 2016-01-28 | 株式会社アルバック | Film deposition apparatus, and maintenance method of film deposition apparatus |
| WO2018088823A1 (en) * | 2016-11-09 | 2018-05-17 | 주식회사 엘지화학 | Method for laminating battery cell using solvent, and chamber apparatus for lamination |
| WO2018212466A1 (en) * | 2017-05-18 | 2018-11-22 | 주식회사 엘지화학 | Electrode assembly manufacturing apparatus and electrode assembly manufacturing method |
-
1993
- 1993-03-05 JP JP04421093A patent/JP3428057B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016014174A (en) * | 2014-07-02 | 2016-01-28 | 株式会社アルバック | Film deposition apparatus, and maintenance method of film deposition apparatus |
| WO2018088823A1 (en) * | 2016-11-09 | 2018-05-17 | 주식회사 엘지화학 | Method for laminating battery cell using solvent, and chamber apparatus for lamination |
| CN109328414A (en) * | 2016-11-09 | 2019-02-12 | 株式会社Lg化学 | Use the method for solvent laminated cell unit and the chamber device for executing lamination |
| EP3460898A4 (en) * | 2016-11-09 | 2019-08-28 | LG Chem, Ltd. | Method for laminating battery cell using solvent, and chamber apparatus for lamination |
| US10992010B2 (en) | 2016-11-09 | 2021-04-27 | Lg Chem, Ltd. | Method for lamination of battery cell using solvent and chamber device for carrying out lamination |
| WO2018212466A1 (en) * | 2017-05-18 | 2018-11-22 | 주식회사 엘지화학 | Electrode assembly manufacturing apparatus and electrode assembly manufacturing method |
| KR20180126880A (en) * | 2017-05-18 | 2018-11-28 | 주식회사 엘지화학 | Electrode assembly manufacturing device and electrode assembly manufacturing method |
| CN110168792A (en) * | 2017-05-18 | 2019-08-23 | 株式会社Lg化学 | Device and method for manufacturing electrode assembly |
| JP2020505740A (en) * | 2017-05-18 | 2020-02-20 | エルジー・ケム・リミテッド | Electrode assembly manufacturing apparatus and electrode assembly manufacturing method |
| CN110168792B (en) * | 2017-05-18 | 2022-05-03 | 株式会社Lg化学 | Apparatus and method for manufacturing electrode assembly |
| US11355818B2 (en) | 2017-05-18 | 2022-06-07 | Lg Energy Solution, Ltd. | Apparatus and method for manufacturing electrode assembly |
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| JP3428057B2 (en) | 2003-07-22 |
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