JPH06256863A - Method for recovering metal from circuit board and device therefor - Google Patents
Method for recovering metal from circuit board and device thereforInfo
- Publication number
- JPH06256863A JPH06256863A JP5045095A JP4509593A JPH06256863A JP H06256863 A JPH06256863 A JP H06256863A JP 5045095 A JP5045095 A JP 5045095A JP 4509593 A JP4509593 A JP 4509593A JP H06256863 A JPH06256863 A JP H06256863A
- Authority
- JP
- Japan
- Prior art keywords
- dry distillation
- circuit board
- metal
- gas
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本願発明は、回路基板から銅など
を回収する金属回収方法、及びこれに用いる装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal recovery method for recovering copper or the like from a circuit board and an apparatus used for the same.
【０００２】[0002]
【発明の背景】技術革新が急進展した昨今、多くの民生
用機器や産業用機器では、種々の機能が電子回路によっ
て制御されるようになってきており、そのハードの部分
としての回路基板は、益々増える方向にある。一方、こ
れに呼応して使用済となる回路基板も急激に増えつつあ
る。BACKGROUND OF THE INVENTION With the recent rapid progress of technological innovation, various functions have been controlled by electronic circuits in many consumer devices and industrial devices, and circuit boards as hardware parts thereof have been controlled. , There is an increasing trend. On the other hand, in response to this, the number of used circuit boards is rapidly increasing.
【０００３】また、この回路基板にはプリント配線板用
基板が用いられ、これには銅張積層板が最も多く使用さ
れている。かかる銅張積層板は、通常、紙、合成繊維
布、ガラス布およびガラス不織布などの基材に、フェノ
ール樹脂、ポリエステル樹脂、エポキシ樹脂、などの熱
硬化性樹脂を塗布含浸・乾燥させたものを積み重ね、こ
れに銅箔（通常１８μｍ〜３５μｍ厚さのもの）を片面
あるいは両面にプレスで加工・加熱して作られている。
そしてこの原板を所定形状に切断、又は打ち抜き切断を
して、所定規格の回路基板の原板となる銅張積層板が形
成されている。A printed wiring board substrate is used for this circuit board, and a copper clad laminate is most often used for this. Such a copper-clad laminate is usually prepared by impregnating a base material such as paper, synthetic fiber cloth, glass cloth and glass non-woven cloth with a thermosetting resin such as a phenol resin, a polyester resin, an epoxy resin, and drying. It is made by stacking and then processing and heating a copper foil (usually having a thickness of 18 μm to 35 μm) on one or both sides with a press.
Then, the original plate is cut into a predetermined shape or punched to form a copper-clad laminated plate which is an original plate of a circuit board of a predetermined standard.
【０００４】このように銅張積層板の製造工程において
も、端材として大量の銅張積層板が、発生していた。従
来は、このように使用済になった回路基板や端材として
の銅張積層板は、そのまま廃棄されたり、また一部は、
金属の回収処理に回されていた。通常、この回収処理
は、焼却させて金属と基材とを分離して回収する方法が
行われていた。As described above, also in the manufacturing process of the copper-clad laminate, a large amount of copper-clad laminate is generated as a scrap material. Conventionally, such a used circuit board and copper clad laminate as end material are either discarded as they are, or partly
It was used for metal recovery. Usually, this recovery process has been carried out by incineration to separate the metal and the base material for recovery.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上記のよう
に、銅などの有価物質を含む回路基板をそのまま廃棄す
ることは、経済的な面ばかりか、近年高まりつつある資
源のリサイクル活用の機運にも逆行するものであり、好
ましいものではなかった。一方、従来の焼却させての金
属を回収方法は、燃焼過程で金属材料が酸化されてしま
うため、金属の回収率が低下するとともに、高品位の金
属を回収することができないという問題点があった。However, as described above, discarding a circuit board containing a valuable substance such as copper as it is is not only economical, but is also an opportunity to recycle resources, which is increasing in recent years. Was also a reverse procedure, which was not preferable. On the other hand, the conventional method of recovering incinerated metal has a problem that the metal recovery rate is lowered because the metal material is oxidized in the combustion process, and high-grade metal cannot be recovered. It was
【０００６】そこで、本願発明は、上記問題点に着目
し、ここに回路基板から金属材料を高品位、高回収率で
回収することができる、回路基板からの金属回収方法及
びそれに用いる回収装置を提供するものである。In view of the above problems, the present invention provides a method of recovering a metal from a circuit board and a recovery device used therefor capable of recovering a metal material from a circuit board with high quality and high recovery rate. It is provided.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成する本願
の回路基板からの金属材料回収方法は、次の各工程順を
踏むことにより行われる。 （イ）回路基板を還元性雰囲気下で、かつ５００°Ｃ〜
１０００°Ｃの温度雰囲気下で乾留する第１工程、
(ロ) 該残留物を大気に接触しても急激に酸化されない
程度の温度にまで冷却する第２工程、 (ハ) 該冷却物を
粉砕する第３工程、(ニ) 該粉砕物から銅などの金属
と、ガラス等の基材構成物と、を分別する第４工程。A method of recovering a metal material from a circuit board according to the present invention which achieves the above object is carried out by following the steps below. (A) The circuit board in a reducing atmosphere and at 500 ° C
The first step of dry distillation under a temperature atmosphere of 1000 ° C,
(B) A second step of cooling the residue to a temperature at which it is not rapidly oxidized even when contacted with the atmosphere, (c) a third step of crushing the cooled material, (d) copper, etc. from the crushed material A fourth step of separating the metal of (1) and the base material constituent such as glass.
【０００８】上記方法には、さらに前記第１工程で発生
した乾留ガスを燃焼させ、その燃焼ガスの一部を乾留の
熱源とするようにしても良く。また、その燃焼ガスの一
部を熱回収した後、乾留時のイナートガスとして供給す
るようにしてもよい。次に、かかる回収方法に用いられ
る装置としては、以下のように構成される。In the above method, the carbonization gas generated in the first step may be burned, and a part of the combustion gas may be used as a heat source for carbonization. Alternatively, a part of the combustion gas may be heat-recovered and then supplied as an inert gas during carbonization. Next, the device used for such a recovery method is configured as follows.
【０００９】前記回路基板の投入口を有し、所定の温度
条件で乾留する乾留炉と、該乾留炉に接続され、排出さ
れる残留物を冷却する冷却手段と、該冷却手段によって
冷却された冷却物を粉砕する粉砕機と、該粉砕機から排
出された粉砕物から銅などの金属とガラス等の基材構成
物とを分別する分別手段と、から成ることを特徴とす
る。A dry distillation furnace having an inlet for the circuit board and performing dry distillation under a predetermined temperature condition, cooling means connected to the dry distillation furnace for cooling the discharged residue, and cooled by the cooling means. It is characterized by comprising a crusher for crushing the cooled product, and a separating means for separating a metal such as copper and a base material constituent such as glass from the crushed product discharged from the crusher.
【００１０】さらに、前記乾留炉に接続され、発生した
乾留ガスを燃焼させる燃焼炉の排気側と、前記乾留炉の
加熱手段に接続された通気管を設けても良く。また、該
燃焼炉の排気側に接続された廃熱ボイラと、該廃熱ボイ
ラから前記乾留炉内に連通されたガス供給管と、を設け
るようにしても良い。Further, an exhaust pipe of the combustion furnace which is connected to the dry distillation furnace and burns the generated dry distillation gas, and a ventilation pipe which is connected to the heating means of the dry distillation furnace may be provided. Further, a waste heat boiler connected to the exhaust side of the combustion furnace and a gas supply pipe communicating from the waste heat boiler into the dry distillation furnace may be provided.
【００１１】[0011]
【実施例】次に、上記本願発明の具体的実施の一例を、
詳細に説明する。図１は、本願発明の一実施例にかかる
回路基板からの金属材料回収方法を示すフロー図であ
る。先ず、第１工程として、被処理対象物の回路基板１
は、投入口２を介して、乾留炉３に投入される。該乾留
炉３は、当然に酸素の流入が制限され、内部が銅等の金
属が酸化されないような雰囲気（還元性雰囲気）に保た
れ、加熱時の回路基板に含まれる金属（主に銅。）など
が酸化されないようにされている。そのため乾留炉３の
内部には、一般公知の窒素ガスなどのキャリアーガスが
流入される。EXAMPLES Next, an example of the concrete implementation of the present invention will be described.
The details will be described. FIG. 1 is a flowchart showing a method for recovering a metal material from a circuit board according to an embodiment of the present invention. First, as the first step, the circuit board 1 of the processing target object
Is charged into the carbonization furnace 3 through the charging port 2. The dry distillation furnace 3 is naturally kept in an atmosphere (reducing atmosphere) such that the inflow of oxygen is restricted and the metal such as copper is not oxidized, and the metal (mainly copper. ) Etc. are prevented from being oxidized. Therefore, a generally known carrier gas such as nitrogen gas flows into the dry distillation furnace 3.
【００１２】ここで、乾留温度は、５００°Ｃ〜１００
０°Ｃの範囲で、適宜の温度条件が設定される。このよ
うな範囲としたのは、乾留温度が５００°Ｃ未満におい
ては、エポキシ樹脂などの樹脂が十分に分解し、炭化す
ることが困難であり、また１０００°Ｃを越える温度に
おいては、銅などの金属とガラス繊維やカーボンなどと
が溶融混合してしまい、後述の分別が困難になるからで
ある。したがって本実施例においては、好ましい温度と
しては、６００°Ｃ〜８００°Ｃの温度範囲が推奨され
る。Here, the carbonization temperature is 500 ° C to 100 ° C.
Appropriate temperature conditions are set in the range of 0 ° C. Such a range is set because it is difficult for the resin such as epoxy resin to be sufficiently decomposed and carbonized when the carbonization temperature is lower than 500 ° C, and when the temperature is higher than 1000 ° C, copper, etc. This is because the metal of (3) and glass fiber, carbon, etc. are melt-mixed with each other, which makes it difficult to separate them as described later. Therefore, in this embodiment, the preferable temperature range is 600 ° C to 800 ° C.
【００１３】かかる工程により、投入された回路基板１
は、加熱溶融又は炭化され、樹脂などは気化して乾留ガ
ス４となり、銅などの構成金属やガラス繊維は、残留物
５として排出されることになる。また、乾留炉３の装置
としては、一般的に公知であるロータリーキルン等が用
いられ、その内部には、樹脂やガラス繊維が溶融して生
じる溶融状物によって、乾留炉３が閉塞されることを防
止するため融着防止チェーン（図示省略。）が配設され
ている。さらに、該乾留炉３は、樹脂に含まれる塩素
（Ｃｌ）や臭素（Ｂｒ）に起因する腐食性ガスを考慮し
て、耐蝕性材料で形成されている。The circuit board 1 put in by the above process
Is heated and melted or carbonized, and the resin or the like is vaporized into a dry distillation gas 4, and constituent metals such as copper and glass fibers are discharged as a residue 5. As a device of the carbonization furnace 3, a generally known rotary kiln or the like is used, and inside the carbonization furnace 3, it is possible to prevent the carbonization furnace 3 from being blocked by a molten material produced by melting resin or glass fiber. An anti-fusion chain (not shown) is provided to prevent this. Further, the dry distillation furnace 3 is formed of a corrosion resistant material in consideration of a corrosive gas caused by chlorine (Cl) or bromine (Br) contained in the resin.
【００１４】次に第２工程として、前記残留物５は、大
気に接触しても急激に酸化されない温度にまで冷却され
る。このようにしたのは、残留物５は上記のように６０
０°Ｃ〜８００°Ｃの高温になっており、これをそのま
ま大気に接触させた場合は、急激に酸化（場合によって
は燃焼。）してしまうからである。したがって、本実施
例では、約１８０°Ｃ程度まで残留物５の温度を降下さ
せている。Next, as a second step, the residue 5 is cooled to a temperature at which it is not rapidly oxidized even if it contacts the atmosphere. This was done because the residue 5 was 60% as described above.
This is because the temperature is as high as 0 ° C to 800 ° C, and if it is directly contacted with the atmosphere, it will be rapidly oxidized (or burned in some cases). Therefore, in this embodiment, the temperature of the residue 5 is lowered to about 180 ° C.
【００１５】かかる実施例装置は、前記構成の乾留炉３
と連続するように、冷却手段６が設けられ、乾留炉３の
排出側と冷却手段６とは、残留物５の大気接触を防止す
るためシーリングが施されている。この冷却手段６とし
ては、空冷式、又は水冷式の一般的構造の冷却装置が用
いられている。次に温度降下された冷却物７は、冷却手
段６から排出され、粉砕機８により粉砕される。このと
き粉砕物９の主な構成物は、銅箔などの金属粉と、ガラ
ス繊維粉、および少量のカーボンである。ここで用いら
れる粉砕機８として、本実施例では、振動式粉砕機を用
いている。The apparatus of this embodiment has a dry distillation furnace 3 of the above construction.
The cooling means 6 is provided so as to be continuous with the cooling means 6, and the discharge side of the dry distillation furnace 3 and the cooling means 6 are sealed so as to prevent the residue 5 from contacting the atmosphere. As the cooling means 6, a cooling device having a general structure of air cooling type or water cooling type is used. Next, the cooled product 7 whose temperature has been lowered is discharged from the cooling means 6 and crushed by the crusher 8. At this time, the main constituents of the crushed material 9 are metal powder such as copper foil, glass fiber powder, and a small amount of carbon. As the crusher 8 used here, a vibration type crusher is used in this embodiment.
【００１６】最後に、上記のように粉砕された粉砕物９
を、振動式ふるいなどの分別機１０により、銅箔などの
金属粉１１と、ガラス繊維粉１２や少量のカーボンと
に、分別される。次に前記乾留炉３で発生した乾留ガス
４は、燃焼炉１３に送られ、該燃焼炉１３内で燃焼（自
燃）させられる。ここで燃焼した燃焼ガス１４は、その
一部が通気管１５によって乾留炉３の加熱手段１６に送
られ、熱源として用いられる。残りの燃焼ガス１４は、
廃熱ボイラ１７へ送られて、熱回収が行われ、その一部
は、ガス供給管１８によってイナートガス（置換不活性
錯体）１９として乾留炉３内に供給される。これにより
乾留炉３内部を還元性雰囲気に保持することができる。Finally, crushed product 9 crushed as described above
Is separated into metal powder 11 such as copper foil, glass fiber powder 12 and a small amount of carbon by a sorting machine 10 such as a vibrating screen. Next, the dry distillation gas 4 generated in the dry distillation furnace 3 is sent to the combustion furnace 13 and burned (self-combusted) in the combustion furnace 13. A part of the combustion gas 14 burned here is sent to the heating means 16 of the carbonization furnace 3 through the ventilation pipe 15 and used as a heat source. The remaining combustion gas 14 is
It is sent to the waste heat boiler 17 to perform heat recovery, and a part of the heat is supplied to the dry distillation furnace 3 as an inert gas (substitution inert complex) 19 by the gas supply pipe 18. As a result, the inside of the dry distillation furnace 3 can be maintained in a reducing atmosphere.
【００１７】なお、本実施例では、熱回収された燃焼ガ
スをイナートガスとして用いているが、これに限定する
ものではなく、これとは別に外部から窒素ガスなどの不
活性ガスをイナートガスとして用いるようにしても良
い。In this embodiment, the heat-recovered combustion gas is used as the inert gas. However, the present invention is not limited to this, and an inert gas such as nitrogen gas may be used as the inert gas from the outside. You can
【００１８】[0018]
【発明の効果】本願発明は上述のように構成されている
ため、次のような効果を奏する。すなわち、回路基板を
乾留炉に入れ、還元性雰囲気下において５００°Ｃ〜１
０００°Ｃの温度条件で乾留するため、銅等の含有金属
が酸化（酸化銅）されずに回収することができる。か
つ、乾留炉と冷却炉とを接続しているため残留物を大気
に接触することなく冷却されるため、その冷却物は大気
に接しても急激な酸化を防止ることができ、良質の金属
を回収することができる。因みに本実施例では、純度約
９９．８％の銅を回収することができた。このことは、
再利用する場合の原材料としての価値が高く、非常に有
用性、かつ経済性のあることを示す。Since the present invention is configured as described above, it has the following effects. That is, the circuit board is put in a dry distillation furnace and is placed in a reducing atmosphere at 500 ° C to 1 ° C.
Since the carbon is distilled under the temperature condition of 000 ° C, the contained metal such as copper can be recovered without being oxidized (copper oxide). Moreover, since the dry distillation furnace and the cooling furnace are connected, the residue can be cooled without contacting the atmosphere, so that the cooled material can prevent rapid oxidation even if it contacts the atmosphere, and it is possible to obtain high-quality metal. Can be recovered. Incidentally, in this example, copper having a purity of about 99.8% could be recovered. This is
It is highly valuable as a raw material for reuse and is extremely useful and economical.
【００１９】また、分別したガラスにおいても、回路基
板に用いられるガラス繊維もガラスとしての品位が高い
ものであるため、再利用が可能であり、同様に有用性か
つ経済性があるものである。さらに、乾留ガスを燃焼炉
で燃焼させて、一部は乾留炉の熱源として、また一部は
熱回収してイナートガスとして用いるようにしているた
め、外部からの熱補給やキャリヤーガスの補給が少なく
てすみ、経済的な装置の運転を行うことができる利点が
ある。Also in the separated glass, since the glass fiber used for the circuit board has a high quality as glass, it can be reused and is similarly useful and economical. Furthermore, since the dry distillation gas is burned in the combustion furnace, part of it is used as the heat source of the dry distillation furnace, and part of it is recovered and used as inert gas, so there is less heat supply from the outside and supply of carrier gas. Therefore, there is an advantage that the device can be operated economically.
【図１】本願発明の一実施例にかかる回路基板からの金
属回収方法を示すフロー図である。FIG. 1 is a flow chart showing a metal recovery method from a circuit board according to an embodiment of the present invention.
１・・・回路基板 ２・・・投入口
３・・・乾留炉 ４・・・乾ガス ５・・・残留物
６・・・冷却手段 ７・・・冷却物 ８・・・粉砕機
９・・・粉砕物 10・・・分別機 11・・・金属粉
12・・・ガラス繊維粉 13・・・燃焼炉 14・・・燃焼ガス
15・・・通気管 16・・・加熱手段 17・・・廃熱ボイラ
18・・・ガス供給管 19・・・イナートガス1 ... Circuit board 2 ... Input port
3 ... Dry distillation furnace 4 ... Dry gas 5 ... Residue
6 ... Cooling means 7 ... Cooled material 8 ... Crusher
9 ... Crushed material 10 ... Separator 11 ... Metal powder
12 ・ ・ ・ glass fiber powder 13 ・ ・ ・ combustion furnace 14 ・ ・ ・ combustion gas
15 ... Ventilation pipe 16 ... Heating means 17 ... Waste heat boiler
18 ・ ・ ・ Gas supply pipe 19 ・ ・ ・ Inert gas
───────────────────────────────────────────────────── フロントページの続き (72)発明者 馬場 英敏 福島県郡山市田村町金屋字マセ口47番地 アサカ理研工業株式会社内 (72)発明者 猪巻 徹 福島県郡山市田村町金屋字マセ口47番地 アサカ理研工業株式会社内 (72)発明者 佐久間 幸雄 福島県郡山市田村町金屋字マセ口47番地 アサカ理研工業株式会社内 (72)発明者 芦野 幸弘 兵庫県尼崎市杭瀬寺島２丁目１番２号 木 村化工機株式会社内 (72)発明者 谷口 勝弘 兵庫県尼崎市杭瀬寺島２丁目１番２号 木 村化工機株式会社内 (72)発明者 奥村 和男 兵庫県尼崎市杭瀬寺島２丁目１番２号 木 村化工機株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Hidetoshi Baba Inventor Hidetoshi Baba Maseguchi, Kanayama-cho, Koriyama-shi, Fukushima 47 Asaka Riken Industry Co., Ltd. 47 Asaka RIKEN INDUSTRY CO., LTD. (72) Inventor Yukio Sakuma Maseguchi, Kanayama, Tamura-machi, Koriyama City, Fukushima Prefecture 47 Asaka RIKEN INDUSTRY CO., LTD. No. Kimura Kakoki Co., Ltd. (72) Inventor Katsuhiro Taniguchi 2 1-2 Kashisejijima, Amagasaki City, Hyogo Prefecture Kimura Koki Co., Ltd. (72) Inventor Kazuo Okumura 2 1-2 Kusejijima, Amagasaki City, Hyogo Prefecture No. Kimura Kakoki Co., Ltd.
Claims (6)
ス等を基材とする回路基板からの金属回収方法。 （イ）回路基板（１）を還元性雰囲気下で、かつ５００
°Ｃ〜１０００°Ｃの温度雰囲気下で乾留する第１工
程、(ロ) 該残留物（５）を大気に接触しても急激に酸
化されない程度の温度にまで冷却する第２工程、(ハ)
該冷却物（７）を粉砕する第３工程、(ニ) 該粉砕物
（９）から銅などの金属（１１）とガラス等（１２）の
基材構成物とを分別する第４工程。1. A method for recovering a metal from a circuit board comprising paper, resin, glass or the like as a base material, which comprises the following steps. (A) The circuit board (1) is placed under a reducing atmosphere and at a temperature of 500
The first step of dry distillation under an atmosphere of temperature of ° C to 1000 ° C, (b) the second step of cooling the residue (5) to a temperature at which the residue (5) is not rapidly oxidized even when contacted with the atmosphere, )
A third step of crushing the cooled material (7), and (4) a fourth step of separating the metal (11) such as copper and the base material constituent such as glass (12) from the crushed material (9).
を燃焼させ、その燃焼ガスの一部を乾留の熱源とするこ
とを特徴とする請求項１記載の回路基板からの金属回収
方法。2. The dry distillation gas (4) generated in the first step.
The method for recovering metal from a circuit board according to claim 1, wherein the metal is burned, and a part of the combustion gas is used as a heat source for carbonization.
を燃焼させ、その燃焼ガスの一部を熱回収した後、乾留
時のイナートガスとして供給することを特徴とする請求
項１、又は２記載の回路基板からの金属回収方法。3. The dry distillation gas (4) generated in the first step.
3. The method for recovering a metal from a circuit board according to claim 1, wherein the metal is burned, a part of the combustion gas is recovered by heat, and then is supplied as an inert gas during carbonization.
し、所定の温度条件で乾留する乾留炉（３）と、 該乾留炉（３）に接続され、排出される残留物（５）を
冷却する冷却手段（６）と、 該冷却手段（６）によって冷却された冷却物（７）を粉
砕する粉砕機（８）と、 該粉砕機（８）から排出された粉砕物（９）から銅など
の金属とガラス等の基材構成物とを分別する分別手段
（１０）と、から成ることを特徴とする回路基板からの
金属回収装置。4. A dry distillation furnace (3) having an inlet (2) for the circuit board (1) and performing dry distillation under a predetermined temperature condition, and a residue discharged by being connected to the dry distillation furnace (3). Cooling means (6) for cooling (5), crusher (8) for crushing the cooled material (7) cooled by the cooling means (6), and crushed material discharged from the crusher (8) A metal recovery device from a circuit board, comprising: a separating means (10) for separating a metal such as copper and a base material constituent such as glass from (9).
乾留ガス（４）を燃焼させる燃焼炉（１３）と、その燃
焼ガス（１４）を前記乾留炉（３）の加熱手段（１６）
に送る通気管（１５）と、が設けられていることを特徴
とする請求項４記載の回路基板からの金属材料回収装
置。5. A combustion furnace (13) which is connected to the dry distillation furnace (3) and burns the generated dry distillation gas (4), and the combustion gas (14) for heating the dry distillation furnace (3). )
The metal material recovery device from a circuit board according to claim 4, further comprising: a ventilation pipe (15) for feeding the metal material to the circuit board.
乾留ガス（４）を燃焼させる燃焼炉（１３）と、該燃焼
炉（１３）の排気側に接続された廃熱ボイラ（１７）
と、 該廃熱ボイラ（１７）から前記乾留炉（３）内に連通さ
れたガス供給管（１８）と、からなることを特徴とする
請求項４、又は５記載の回路基板からの金属材料回収装
置。6. A combustion furnace (13) connected to the dry distillation furnace (3) for burning the generated dry distillation gas (4), and a waste heat boiler (17) connected to the exhaust side of the combustion furnace (13). )
And a gas supply pipe (18) communicating from the waste heat boiler (17) into the dry distillation furnace (3), the metal material from the circuit board according to claim 4 or 5, Recovery device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5045095A JPH06256863A (en) | 1993-03-05 | 1993-03-05 | Method for recovering metal from circuit board and device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5045095A JPH06256863A (en) | 1993-03-05 | 1993-03-05 | Method for recovering metal from circuit board and device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06256863A true JPH06256863A (en) | 1994-09-13 |
Family
ID=12709752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5045095A Pending JPH06256863A (en) | 1993-03-05 | 1993-03-05 | Method for recovering metal from circuit board and device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06256863A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100528506B1 (en) * | 2002-11-06 | 2005-11-15 | 한국지질자원연구원 | A Method for Concentrating and Recovering Precious Metals from Spent PCBs and Spent Auto-Catalysts Simultaneously |
| JP2009293055A (en) * | 2008-06-02 | 2009-12-17 | Tetsuyuki Koizumi | Method for recovering valuable metal from waste material |
| JP2011174175A (en) * | 2010-01-26 | 2011-09-08 | Furukawa Electric Co Ltd:The | Method and apparatus for removing coating layer |
| CN102350429A (en) * | 2011-07-13 | 2012-02-15 | 大连理工大学 | Method for separation and recovery of metal and nonmetal in waste printed circuit board |
| CN104096704A (en) * | 2013-04-03 | 2014-10-15 | 中国科学院生态环境研究中心 | Enrichment method for palladium in waste circuit board |
| WO2020175350A1 (en) | 2019-02-28 | 2020-09-03 | 三菱マテリアル株式会社 | Method for treating waste electronic substrate |
| CN115287465A (en) * | 2022-09-08 | 2022-11-04 | 赤峰金通铜业有限公司 | Process for deeply recovering copper metal resources in copper smelting furnace slag and slow cooling device |
-
1993
- 1993-03-05 JP JP5045095A patent/JPH06256863A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100528506B1 (en) * | 2002-11-06 | 2005-11-15 | 한국지질자원연구원 | A Method for Concentrating and Recovering Precious Metals from Spent PCBs and Spent Auto-Catalysts Simultaneously |
| JP2009293055A (en) * | 2008-06-02 | 2009-12-17 | Tetsuyuki Koizumi | Method for recovering valuable metal from waste material |
| JP2011174175A (en) * | 2010-01-26 | 2011-09-08 | Furukawa Electric Co Ltd:The | Method and apparatus for removing coating layer |
| CN102350429A (en) * | 2011-07-13 | 2012-02-15 | 大连理工大学 | Method for separation and recovery of metal and nonmetal in waste printed circuit board |
| CN104096704A (en) * | 2013-04-03 | 2014-10-15 | 中国科学院生态环境研究中心 | Enrichment method for palladium in waste circuit board |
| WO2020175350A1 (en) | 2019-02-28 | 2020-09-03 | 三菱マテリアル株式会社 | Method for treating waste electronic substrate |
| KR20210132049A (en) | 2019-02-28 | 2021-11-03 | 미쓰비시 마테리알 가부시키가이샤 | How to dispose of waste electronic boards |
| CN115287465A (en) * | 2022-09-08 | 2022-11-04 | 赤峰金通铜业有限公司 | Process for deeply recovering copper metal resources in copper smelting furnace slag and slow cooling device |
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