JPH06252339A - Integrated circuit device - Google Patents
Integrated circuit deviceInfo
- Publication number
- JPH06252339A JPH06252339A JP5040839A JP4083993A JPH06252339A JP H06252339 A JPH06252339 A JP H06252339A JP 5040839 A JP5040839 A JP 5040839A JP 4083993 A JP4083993 A JP 4083993A JP H06252339 A JPH06252339 A JP H06252339A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- modules
- heat
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体モノリシック集
積回路（以下、ＳＣＩＣという）及びＳＣＩＣを実装し
た集積回路装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor monolithic integrated circuit (hereinafter referred to as SCIC) and an integrated circuit device mounted with SCIC.
【０００２】[0002]
【従来の技術】近年、高集積化、高周波化されたＳＣＩ
Ｃ、あるいはＳＣＩＣが高密度実装された集積回路装置
が要望されている。2. Description of the Related Art In recent years, highly integrated and high frequency SCI
There is a demand for an integrated circuit device in which C or SCIC is mounted at high density.
【０００３】従来、この種の集積回路装置には実装密度
を高める方法として、薄膜導体を蒸着したまたは厚膜導
体を印刷焼成したセラミック基板上あるいはガラス基板
上にＳＣＩＣのベアチップをダイスボンディングまたは
ワイヤーボンディングまたはフェースダウンボンディン
グすることによって、ＳＣＩＣの電極と薄膜導体または
厚膜導体とを接続したモジュールを多階層に積層すると
いう方法が用いられていた。Conventionally, as a method of increasing the packaging density in this kind of integrated circuit device, a bare chip of SCIC is die-bonded or wire-bonded on a ceramic substrate or a glass substrate on which a thin film conductor is vapor-deposited or a thick film conductor is printed and fired. Alternatively, a method has been used in which modules in which SCIC electrodes are connected to thin film conductors or thick film conductors are stacked in multiple layers by face-down bonding.
【０００４】以下、従来の集積回路装置について図面を
参照しながら説明する。図８は従来の集積回路装置を示
す斜視図である。図８に示すように、集積回路装置は封
止樹脂１２で外装を形成し、その内部は基板１３に半導
体素子１４がダイスボンディングされ、また半導体素子
１４とアウターリード１５とがワイヤーボンディングで
接続されている。さらに、アウターリード１５は基板１
３から基板１３の外側へＬ字状に折曲されて引き出され
ている。A conventional integrated circuit device will be described below with reference to the drawings. FIG. 8 is a perspective view showing a conventional integrated circuit device. As shown in FIG. 8, the integrated circuit device has an outer package formed of a sealing resin 12, inside of which a semiconductor element 14 is die-bonded to a substrate 13, and the semiconductor element 14 and an outer lead 15 are connected by wire bonding. ing. Further, the outer leads 15 are the substrate 1
It is bent in an L-shape from 3 to the outside of the substrate 13 and is drawn out.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記従来
の構成では、高集積化、高周波化されたＳＣＩＣあるい
はＳＣＩＣが高密度実装された集積回路装置を用いた場
合に、ＳＣＩＣの発熱量が大きくなるので、ＳＣＩＣに
悪影響を及ぼしＳＣＩＣの信頼性が低下するという問題
点を有していた。However, in the above-mentioned conventional configuration, when a highly integrated and high frequency SCIC or an integrated circuit device in which SCICs are densely mounted is used, the heat generation amount of the SCIC becomes large. , The SCIC is adversely affected and the reliability of the SCIC is lowered.
【０００６】本発明は上記従来の問題点を解決するもの
で、高集積化、高周波化されたＳＣＩＣあるいはＳＣＩ
Ｃが高密度実装された集積回路装置を用いても、ＳＣＩ
Ｃの発熱によってＳＣＩＣの信頼性を低下させることの
ない集積回路装置を提供することを目的としている。The present invention solves the above-mentioned problems of the prior art, and is a highly integrated and high frequency SCIC or SCI.
Even if an integrated circuit device in which C is mounted at high density is used, SCI
An object of the present invention is to provide an integrated circuit device in which reliability of SCIC is not deteriorated by heat generation of C.
【０００７】[0007]
【課題を解決するための手段】本発明は上記課題を解決
するために、基板の片面にＳＣＩＣを実装した２枚のモ
ジュールと、ＳＣＩＣから発生する熱を放熱する放熱板
とを有し、前記２枚のモジュールのＳＣＩＣを実装して
いない基板面を放熱板を挟んで対向させた構成である。In order to solve the above problems, the present invention has two modules in which SCICs are mounted on one surface of a substrate, and a heat dissipation plate for radiating heat generated from the SCICs. This is a configuration in which the board surfaces of the two modules on which the SCICs are not mounted are opposed to each other with a heat sink interposed therebetween.
【０００８】[0008]
【作用】この構成によって、２枚のモジュールによって
挟まれた放熱板はＳＣＩＣから発生する熱をモジュール
の外部に効率的に発散させることができる。With this structure, the heat sink sandwiched between the two modules can efficiently dissipate the heat generated from the SCIC to the outside of the module.
【０００９】[0009]
【実施例】（実施例１）以下、本発明の一実施例につい
て図面を参照しながら説明する。図１は本発明の第１の
実施例における集積回路装置を示す斜視図、図２は前記
集積回路装置を分解した状態を示す斜視図である。(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. 1 is a perspective view showing an integrated circuit device according to a first embodiment of the present invention, and FIG. 2 is a perspective view showing a state in which the integrated circuit device is disassembled.
【００１０】図１、図２に示すように、集積回路装置は
ＳＣＩＣ２とチップコンデンサ３が基板１に実装接続さ
れたモジュール６ａ、６ｂと、接合部５ａと放熱部５ｂ
を有した熱伝導性の良い金属からなる放熱板５と、開口
部４ａと接続部４ｂを有した金属からなるＣ字状の端子
４とからなり、ＳＣＩＣ２とチップコンデンサ３が実装
接続されていないモジュール６ａ、６ｂの面が互いに放
熱板５の接合部５ａを挟んで対向密着させられるととも
に、接合部５ａの４角に接合部５ａの４角の一部を上側
に折曲して設けられた４つの固定片８ａによってモジュ
ール６ａを位置決めし、また、接合部５ａに対して下側
に折曲した放熱部５ｂと放熱板５の放熱部５ｂと対向し
た２角に接合部５ａの２角の一部を下側に折曲して設け
られた２つの固定片８ｂによってモジュール６ｂを位置
決めしており、さらに、接合部５ａを挟んで対向密着さ
せられたモジュール６ａ、６ｂの端子パッド７にＣ字状
の端子４の両開口部４ａが半田付けされることによっ
て、電気的な接続が行われるとともに、モジュール６
ａ、６ｂと放熱板５が支持され、接続部４ｂによって支
持された集積回路装置をプリント基板に実装するように
した構成である。As shown in FIGS. 1 and 2, the integrated circuit device includes modules 6a and 6b in which an SCIC 2 and a chip capacitor 3 are mounted and connected to a substrate 1, a joint portion 5a and a heat radiating portion 5b.
And a C-shaped terminal 4 made of metal having an opening 4a and a connecting portion 4b, and the SCIC 2 and the chip capacitor 3 are not mounted and connected. The surfaces of the modules 6a and 6b are closely adhered to each other with the joint portion 5a of the heat dissipation plate 5 sandwiched therebetween, and the four corners of the joint portion 5a are partially bent upward. The module 6a is positioned by the four fixing pieces 8a, and the heat dissipation portion 5b bent downward with respect to the joint portion 5a and the heat dissipation portion 5b of the heat sink 5 are opposite to each other at two corners of the joint portion 5a. The module 6b is positioned by two fixing pieces 8b that are partially bent downward, and further, C is attached to the terminal pads 7 of the modules 6a and 6b that are opposed and closely contacted with each other with the joint 5a interposed therebetween. Both openings of the letter-shaped terminal 4 By 4a is soldered, with electrical connection is made, the module 6
In this configuration, the integrated circuit device supported by the connecting parts 4b is mounted on a printed circuit board.
【００１１】以上のように構成された集積回路装置につ
いて、以下その動作について説明する。The operation of the integrated circuit device configured as described above will be described below.
【００１２】ＳＣＩＣ２の高集積化、高周波化にともな
ってＳＣＩＣ２に発生した熱は、モジュール６ａ、６ｂ
の基板１を通して放熱板５の接合部５ａに伝導し、さら
に接合部５ａに伝導した熱は放熱部５ｂに伝導して外部
に発散させられる。The heat generated in the SCIC 2 due to the higher integration and higher frequency of the SCIC 2 is generated by the modules 6a and 6b.
The heat conducted to the joint portion 5a of the heat dissipation plate 5 through the substrate 1 and further conducted to the joint portion 5a is conducted to the heat dissipation portion 5b and radiated to the outside.
【００１３】この結果、ＳＣＩＣ２に発生した熱はモジ
ュール６ａ、６ｂ内に蓄積されず、放熱板５を介してモ
ジュール６ａ、６ｂの外部に発散されるので、熱による
ＳＣＩＣ２の信頼性低下を防止することができる。As a result, the heat generated in the SCIC 2 is not stored in the modules 6a and 6b but is radiated to the outside of the modules 6a and 6b through the heat dissipation plate 5, so that the reliability of the SCIC 2 is prevented from being deteriorated by the heat. be able to.
【００１４】なお、集積回路装置をプリント基板に実装
する際に、放熱部５ｂをプリント基板の導体パターンに
接触するように取り付ければ、ＳＣＩＣ２から発生した
熱をプリント基板の導体パターンに放熱することができ
る。When mounting the integrated circuit device on a printed circuit board, if the heat radiating portion 5b is attached so as to contact the conductive pattern of the printed circuit board, the heat generated from the SCIC 2 can be radiated to the conductive pattern of the printed circuit board. it can.
【００１５】また、放熱板５の接合部５ａとモジュール
６ａ、６ｂとの間に、熱伝導性グリースまたは熱伝導性
接着剤などの熱伝導性のある粘性物質を塗布すれば、互
いの接合表面の凹凸によって生じる隙間を充填するの
で、放熱板５の接合部５ａとモジュール６ａ、６ｂとの
密着性が高まり、放熱板５の放熱部５ｂによる放熱作用
の効果がより向上する。この結果、熱によるＳＣＩＣ２
の信頼性低下の防止効果をより一層増すことができる。If a heat conductive viscous substance such as a heat conductive grease or a heat conductive adhesive is applied between the joint portion 5a of the heat radiating plate 5 and the modules 6a and 6b, the mutual joint surfaces will be Since the gaps caused by the unevenness are filled, the adhesiveness between the joint portion 5a of the heat dissipation plate 5 and the modules 6a and 6b is enhanced, and the effect of the heat dissipation effect of the heat dissipation portion 5b of the heat dissipation plate 5 is further improved. As a result, SCIC2 due to heat
It is possible to further increase the effect of preventing the deterioration of reliability.
【００１６】さらに、Ｃ字状の端子４はモジュール６
ａ、６ｂの端子パッド７と接続を行う開口部４ａと集積
回路装置をプリント基板に実装するための接続部４ｂが
一体となった構成であるので、プリント基板と集積回路
装置の間隔を一定にすることができる。Further, the C-shaped terminal 4 is a module 6
Since the opening 4a for connecting to the terminal pads 7 of a and 6b and the connecting portion 4b for mounting the integrated circuit device on the printed circuit board are integrated, the distance between the printed circuit board and the integrated circuit device is kept constant. can do.
【００１７】この結果、集積回路装置をプリント基板に
実装する際、集積回路装置で使われる端子の数が多くて
も、従来の集積回路装置で使われるＬ字状の端子のよう
に、端子が曲がったり折れたりするなどの端子の変形に
よるプリント基板への接続不良がなく、また、ＳＣＩＣ
２のチップサイズが機能の違いで異なっても、モジュー
ル化する機能によって最小の形状に合う端子を用意する
ことができる。As a result, when the integrated circuit device is mounted on the printed circuit board, even if the number of terminals used in the integrated circuit device is large, the terminals can be formed like the L-shaped terminals used in the conventional integrated circuit device. There is no defective connection to the printed circuit board due to terminal deformation such as bending or bending, and SCIC
Even if the two chip sizes are different due to different functions, it is possible to prepare a terminal that fits the smallest shape by the modularization function.
【００１８】（実施例２）図３は本発明の第２の実施例
における集積回路装置を示す斜視図である。(Embodiment 2) FIG. 3 is a perspective view showing an integrated circuit device according to a second embodiment of the present invention.
【００１９】図３に示すように集積回路装置は、図１、
図２に示した集積回路装置における放熱板５を改良した
ものであり、放熱板５の接合部５ａに穴９を２つ設けた
構成である。The integrated circuit device shown in FIG.
This is a modification of the heat sink 5 in the integrated circuit device shown in FIG. 2, and has a configuration in which two holes 9 are provided in the joint portion 5a of the heat sink 5.
【００２０】以上のように構成された集積回路装置につ
いて、以下その動作について説明する。モジュール６
ａ、６ｂと放熱板５の接合部５ａとの密着性を高めるた
めに、熱伝導性のある粘性物質を塗布した場合、塗布さ
れた熱伝導性のある粘性物質の量が過剰であっても、モ
ジュール６ａ、６ｂに対向密着させた放熱板５の接合部
５ａに穴９が設けられていることにより、過剰分は穴９
に吸収される。The operation of the integrated circuit device configured as described above will be described below. Module 6
When a viscous substance having thermal conductivity is applied in order to improve the adhesion between the a and 6b and the joint portion 5a of the heat dissipation plate 5, even if the amount of the applied viscous substance having thermal conductivity is excessive. Since the holes 9 are provided in the joint portion 5a of the heat dissipation plate 5 that is closely adhered to the modules 6a and 6b so as to face each other, the excess portion is left in the holes 9
Is absorbed by.
【００２１】この結果、塗布された熱伝導性のある粘性
物質の量が過剰であっても、対向密着させた放熱板５の
接合部５ａとモジュール６ａ、６ｂとの間から過剰分が
はみ出し、集積回路装置に影響を及ぼすことがなく、過
剰分が放熱板５の接合部５ａに設けた穴９に吸収され、
集積回路装置の信頼性を損なわないものである。As a result, even if the amount of the applied viscous substance having thermal conductivity is excessive, the excessive amount protrudes from between the joint portion 5a of the heat dissipation plate 5 and the modules 6a and 6b which are in close contact with each other, Excessive amount is absorbed in the hole 9 provided in the joint portion 5a of the heat dissipation plate 5 without affecting the integrated circuit device,
The reliability of the integrated circuit device is not impaired.
【００２２】（実施例３）図４（ａ）、（ｂ）は本発明
の第３の実施例における集積回路装置を示す斜視図であ
る。(Embodiment 3) FIGS. 4A and 4B are perspective views showing an integrated circuit device according to a third embodiment of the present invention.
【００２３】図４（ａ）、（ｂ）に示すように集積回路
装置は、図１、図２に示した集積回路装置における放熱
板５の放熱部５ｂを改良したものである。As shown in FIGS. 4A and 4B, the integrated circuit device is obtained by improving the heat radiation portion 5b of the heat radiation plate 5 in the integrated circuit device shown in FIGS.
【００２４】図４（ａ）では、放熱部５ｂが直方体の突
起部分１０ａと長方形の通風孔１０ｂを有した放熱フィ
ン１０となった構成である。In FIG. 4A, the heat radiation portion 5b is a heat radiation fin 10 having a rectangular parallelepiped projection portion 10a and a rectangular ventilation hole 10b.
【００２５】この構成により、モジュール６ａ、６ｂに
実装されたＳＣＩＣ２から発生した熱は放熱板５の接合
部５ａに伝導した後、放熱部５ｂに設けられた放熱フィ
ン１０の突起部分１０ａより輻射され、通風孔１０ｂよ
り対流させられる。この結果、放熱効果はより一層増
す。With this structure, the heat generated from the SCIC 2 mounted on the modules 6a and 6b is conducted to the joint portion 5a of the heat radiating plate 5 and then radiated from the protruding portion 10a of the heat radiating fin 10 provided on the heat radiating portion 5b. , And is convected from the ventilation hole 10b. As a result, the heat dissipation effect is further enhanced.
【００２６】また、図４（ｂ）では、放熱部５ｂが延長
されており、延長された放熱部５ｂがモジュール６ａを
覆うようにモジュール６ａ側に折曲し、モジュール６ａ
の上面部分の放熱部５ｂに直方体の突起部分１１ａと長
方形の通風孔１１ｂを有した放熱フィン１１となった構
成である。Further, in FIG. 4B, the heat radiating portion 5b is extended, and the extended heat radiating portion 5b is bent toward the module 6a so as to cover the module 6a.
In this configuration, the heat radiating portion 11 has a rectangular parallelepiped projection portion 11a and a rectangular ventilation hole 11b on the heat radiating portion 5b on the upper surface of the heat radiating fin 11.
【００２７】この構成により、図４（ａ）のような放熱
効果に加え、放熱部５ｂがモジュール６ａ、６ｂを保護
し、モジュール６ａ、６ｂに実装されたＳＣＩＣ２を誤
って手で触ったりして、傷つけるということがなくな
る。この結果、放熱効果とともに保護効果が生じる。With this structure, in addition to the heat radiation effect as shown in FIG. 4A, the heat radiation portion 5b protects the modules 6a and 6b, and the SCIC 2 mounted on the modules 6a and 6b may be touched by mistake. , It won't hurt you. As a result, a heat dissipation effect and a protection effect are produced.
【００２８】（実施例４）図５は本発明の実施例におけ
る集積回路装置の端子を改良した端子を示す斜視図であ
る。(Embodiment 4) FIG. 5 is a perspective view showing a terminal obtained by improving the terminal of the integrated circuit device according to the embodiment of the present invention.
【００２９】図５に示すように端子４は、図１、図２に
示した集積回路装置における端子４を改良したものであ
り、端子４の中程に放熱板を挟んで対向した２枚のモジ
ュールの側面に圧接させる突片４Ｃを設けた構成であ
る。As shown in FIG. 5, the terminal 4 is an improvement of the terminal 4 in the integrated circuit device shown in FIGS. 1 and 2. This is a configuration in which a projecting piece 4C that is brought into pressure contact with the side surface of the module is provided.
【００３０】この構成により、端子４を放熱板５を挟ん
で対向密着させたモジュール６ａ、６ｂに取り付ける際
に、端子４をモジュール６ａ、６ｂの側面に圧接させれ
ば、端子４が端子パッド７と接続する開口部４ａを支点
として回転するのを防ぐ回転止め具としての効果が生じ
る。With this structure, when the terminal 4 is attached to the modules 6a and 6b which are closely adhered to each other with the heat sink 5 sandwiched therebetween, the terminals 4 are brought into pressure contact with the side surfaces of the modules 6a and 6b. There is an effect as a rotation stopper that prevents rotation around the opening 4a connected to the fulcrum.
【００３１】さらに、端子４の材質が適度な弾力性を有
するものであれば、端子４の開口部４ａによって放熱板
５を挟んで対向密着させたモジュール６ａ、６ｂの端子
パッド７を挟み込む際、Ｃ字状の開口部４ａを押し広げ
るようにして取り付けることができる。この結果、端子
４に弾性力が生じ、この弾性力によって放熱板５の接合
部５ａとモジュール６ａ、６ｂとの密着性が高まり、モ
ジュール６ａ、６ｂと放熱板５の接合部５ａとの間の熱
抵抗を下げることができる。このとき、実施例１に述べ
た熱伝導性のある粘性物質を放熱板５の接合部５ａとモ
ジュール６ａ、６ｂとの間に塗布すれば、この端子４の
弾性力によって、塗布された熱伝導性のある粘性物質の
層の厚みを経時的に薄くさせることができ、より一層密
着性を高め、熱抵抗を下げることができる。Further, when the material of the terminal 4 has an appropriate elasticity, when the terminal pads 7 of the modules 6a and 6b which are closely adhered to each other with the heat sink 5 sandwiched by the opening 4a of the terminal 4 are sandwiched, The C-shaped opening 4a can be attached so as to be widened. As a result, an elastic force is generated in the terminal 4, and the elastic force enhances the adhesion between the joint portion 5a of the heat dissipation plate 5 and the modules 6a and 6b, and the adhesive force between the modules 6a and 6b and the joint portion 5a of the heat dissipation plate 5 is increased. The thermal resistance can be reduced. At this time, if the viscous substance having thermal conductivity described in the first embodiment is applied between the joint portion 5a of the heat dissipation plate 5 and the modules 6a and 6b, the applied heat conduction is caused by the elastic force of the terminal 4. The layer of the viscous substance having the property can be made thinner over time, the adhesion can be further enhanced, and the thermal resistance can be lowered.
【００３２】（実施例５）図６は本発明の実施例におけ
る集積回路装置の端子を改良し、複数連結した端子を示
す斜視図である。(Embodiment 5) FIG. 6 is a perspective view showing an improved terminal of an integrated circuit device according to an embodiment of the present invention, showing a plurality of connected terminals.
【００３３】図６に示すように端子４は樹脂からなるフ
レーム１１に端子４の中間部がモジュール６ａ、６ｂの
端子パッド７の間隔と等間隔に嵌入され、フレーム１１
によって支持された構成である。As shown in FIG. 6, in the terminal 4, the frame 11 made of resin is fitted with the intermediate portion of the terminal 4 at an equal interval to the interval between the terminal pads 7 of the modules 6a and 6b.
It is a structure supported by.
【００３４】この構成により、ＳＣＩＣ２のチップサイ
ズが機能の違いで異なっても、モジュール化する機能に
よって、Ｃ字状の端子４を支持したフレーム１１を最小
の形状に合う長さに切断して用いることができるととも
に端子４の開口部４ａで一括して端子パッド７を挟みこ
むことができる。With this configuration, even if the chip size of the SCIC 2 differs depending on the function, the frame 11 supporting the C-shaped terminal 4 is cut to a length suitable for the minimum shape and used depending on the function of modularization. In addition, the terminal pads 7 can be sandwiched by the openings 4a of the terminals 4 all together.
【００３５】また、図７は本発明の実施例における集積
回路装置の複数連結した端子を改良した端子を示す斜視
図である。図７に示すように端子４は、図６に示した複
数連結した端子を改良したものであり、端子４の中間部
に切り欠き４ｄを有した構成である。FIG. 7 is a perspective view showing a terminal obtained by improving a plurality of connected terminals of the integrated circuit device according to the embodiment of the present invention. As shown in FIG. 7, the terminal 4 is an improvement of the plurality of connected terminals shown in FIG. 6, and has a configuration in which a notch 4d is provided in the intermediate portion of the terminal 4.
【００３６】この構成により、フレーム１１で端子４を
支持する際、切り欠き４ｄはその支持を強固にするの
で、フレーム１１の幅ｗを小さくしても、その支持力を
保持できるとともに、図１に示す集積回路装置において
放熱板５を介してモジュール６ａ、６ｂを対向密着さ
せ、Ｃ字状の端子４の開口部４ａで端子パッド７を挟み
込む際に、さらに柔軟な弾性が生じ、密着性がより一層
増す。With this structure, when the terminal 4 is supported by the frame 11, the notch 4d strengthens the support, so that even if the width w of the frame 11 is made small, the supporting force can be maintained and, as shown in FIG. In the integrated circuit device shown in FIG. 3, when the modules 6a and 6b are closely adhered to each other via the heat dissipation plate 5 and the terminal pad 7 is sandwiched between the openings 4a of the C-shaped terminal 4, more flexible elasticity is generated and adhesion is improved. Increase more.
【００３７】[0037]
【発明の効果】以上のように本発明によれば、高集積
化、高周波化されたＳＣＩＣ、あるいはＳＣＩＣが高密
度実装された集積回路装置を用いても、ＳＣＩＣから発
生する熱によってＳＣＩＣの信頼性を低下させることが
ない集積回路装置の提供を実現できるものである。As described above, according to the present invention, even if a highly integrated and high frequency SCIC or an integrated circuit device in which the SCIC is mounted at a high density is used, the reliability of the SCIC is ensured by the heat generated from the SCIC. Therefore, it is possible to realize the provision of an integrated circuit device which does not deteriorate the property.
【図１】本発明の第１の実施例における集積回路装置を
示す斜視図FIG. 1 is a perspective view showing an integrated circuit device according to a first embodiment of the present invention.
【図２】本発明の第１の実施例における集積回路装置を
分解した状態を示す斜視図FIG. 2 is a perspective view showing an exploded state of the integrated circuit device according to the first embodiment of the present invention.
【図３】本発明の第２の実施例における集積回路装置を
分解した状態を示す斜視図FIG. 3 is a perspective view showing a state in which an integrated circuit device according to a second embodiment of the present invention is disassembled.
【図４】（ａ）本発明の第３の実施例における集積回路
装置を示す斜視図 （ｂ）本発明の第３の実施例における集積回路装置を示
す斜視図FIG. 4A is a perspective view showing an integrated circuit device according to a third embodiment of the present invention. FIG. 4B is a perspective view showing an integrated circuit device according to the third embodiment of the present invention.
【図５】本発明の実施例における集積回路装置の端子を
改良した端子を示す斜視図FIG. 5 is a perspective view showing a terminal obtained by improving the terminal of the integrated circuit device according to the embodiment of the present invention.
【図６】本発明の実施例における集積回路装置の端子を
改良し、複数連結した端子を示す斜視図FIG. 6 is a perspective view showing a terminal in which a plurality of terminals are improved by improving the terminals of the integrated circuit device according to the embodiment of the present invention.
【図７】本発明の実施例における集積回路装置の複数連
結した端子を改良した端子を示す斜視図FIG. 7 is a perspective view showing a terminal improved from a plurality of connected terminals of an integrated circuit device according to an embodiment of the present invention.
【図８】従来の集積回路装置を示す斜視図FIG. 8 is a perspective view showing a conventional integrated circuit device.
１ 基板 ２ 半導体モノリシック集積回路 ３ チップコンデンサ ４ 端子 ４ａ 開口部 ４ｂ 接続部 ５ 放熱板 ５ａ 接合部 ５ｂ 放熱部 ６ａ モジュール ６ｂ モジュール ７ 端子パッド ８ａ 固定片 ８ｂ 固定片 1 Substrate 2 Semiconductor Monolithic Integrated Circuit 3 Chip Capacitor 4 Terminal 4a Opening 4b Connection 5 Heatsink 5a Joint 5b Heatsink 6a Module 6b Module 7 Terminal Pad 8a Fixing 8b Fixing
Claims (7)
路を実装した２枚のモジュールと、半導体モノリシック
集積回路から発生する熱を放熱する放熱板とを有し、前
記２枚のモジュールの半導体モノリシック集積回路を実
装していない基板面を放熱板を挟んで対向させたことを
特徴とする集積回路装置。1. A semiconductor monolithic integrated circuit of the two modules, comprising two modules each having a semiconductor monolithic integrated circuit mounted on one surface of a substrate and a heat dissipation plate for radiating heat generated from the semiconductor monolithic integrated circuit. An integrated circuit device, characterized in that the surfaces of the substrates not mounted with are opposed to each other with a heat sink interposed therebetween.
ルの半導体モノリシック集積回路を実装した基板面をＣ
字状の形状をした端子が前記端子の両開口部で支持した
ことを特徴とする請求項１記載の集積回路装置。2. The substrate surface on which the semiconductor monolithic integrated circuits of two modules, which are opposed to each other with a heat sink interposed, is mounted on a substrate surface.
2. The integrated circuit device according to claim 1, wherein the terminal having a letter shape is supported by both openings of the terminal.
とする請求項１または請求項２記載の集積回路装置。3. The integrated circuit device according to claim 1, wherein the heat dissipation plate is provided with heat dissipation fins.
る請求項１または請求項２記載の集積回路装置。4. The integrated circuit device according to claim 1, wherein the heat dissipation plate is provided with an opening.
定片を設けたことを特徴とする請求項１または請求項２
記載の集積回路装置。5. The heat dissipating plate is provided with a fixing piece for positioning the module.
The integrated circuit device described.
を挟んで対向した２枚のモジュールの側面に圧接させる
突片を設けたことを特徴とする請求項２記載の集積回路
装置。6. The integrated circuit according to claim 2, wherein a projecting piece is provided in the middle of the C-shaped terminal, the projecting piece being in pressure contact with the side surfaces of the two modules facing each other with the heat sink interposed therebetween. apparatus.
間隔をもってフレームに支持させたことを特徴とする請
求項２記載の集積回路装置。7. The integrated circuit device according to claim 2, wherein a plurality of C-shaped terminals are supported by the frame at a constant interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5040839A JPH06252339A (en) | 1993-03-02 | 1993-03-02 | Integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5040839A JPH06252339A (en) | 1993-03-02 | 1993-03-02 | Integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06252339A true JPH06252339A (en) | 1994-09-09 |
Family
ID=12591783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5040839A Pending JPH06252339A (en) | 1993-03-02 | 1993-03-02 | Integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06252339A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006094398A (en) * | 2004-09-27 | 2006-04-06 | Matsushita Electric Works Ltd | Pressure wave generator |
| WO2006126252A1 (en) * | 2005-05-24 | 2006-11-30 | Fujitsu Limited | Mounting structure for ic tag and ic chip for mounting purpose |
| JP2011119582A (en) * | 2009-12-07 | 2011-06-16 | Shindengen Electric Mfg Co Ltd | Lamination-and-fixing structure and lamination-and-fixing method for substrates |
-
1993
- 1993-03-02 JP JP5040839A patent/JPH06252339A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006094398A (en) * | 2004-09-27 | 2006-04-06 | Matsushita Electric Works Ltd | Pressure wave generator |
| JP4525273B2 (en) * | 2004-09-27 | 2010-08-18 | パナソニック電工株式会社 | Pressure wave generator |
| WO2006126252A1 (en) * | 2005-05-24 | 2006-11-30 | Fujitsu Limited | Mounting structure for ic tag and ic chip for mounting purpose |
| JPWO2006126252A1 (en) * | 2005-05-24 | 2008-12-25 | 富士通株式会社 | IC tag mounting structure and IC chip for mounting |
| US7868437B2 (en) | 2005-05-24 | 2011-01-11 | Fujitsu Limited | Mounting structure for IC tag and IC chip for mounting |
| JP4610613B2 (en) * | 2005-05-24 | 2011-01-12 | 富士通株式会社 | IC tag mounting structure and IC chip for mounting |
| JP2011119582A (en) * | 2009-12-07 | 2011-06-16 | Shindengen Electric Mfg Co Ltd | Lamination-and-fixing structure and lamination-and-fixing method for substrates |
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