JPH06251619A - Metallized paste for concurrent baking - Google Patents
Metallized paste for concurrent bakingInfo
- Publication number
- JPH06251619A JPH06251619A JP3344893A JP3344893A JPH06251619A JP H06251619 A JPH06251619 A JP H06251619A JP 3344893 A JP3344893 A JP 3344893A JP 3344893 A JP3344893 A JP 3344893A JP H06251619 A JPH06251619 A JP H06251619A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- firing
- baking
- concurrent
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、グリーンシートに塗布
して当該グリーンシートと同時に焼成される同時焼成用
メタライズペーストに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a co-firing metallizing paste which is applied to a green sheet and fired simultaneously with the green sheet.
【0002】[0002]
【従来の技術】従来、セラミックグリーンシート上に導
電性のメタライズペーストをスクリーン印刷した後同時
焼成して得られた基板が、高密度配線化、多層による小
型化、高信頼化等が要求されるデバイス用基板に利用さ
れている。そして、これら同時焼成用のメタライズペー
ストの一例として、本出願人は特開平2−228375
号公報において、タングステンおよび/またはモリブデ
ンを主成分とする金属成分と、少なくともアクリル樹脂
を含有する結合剤と、溶剤と、可塑剤とからなり、比較
的低いシート抵抗を達成するとともに焼成後の反り等も
防止し得る厚膜ペーストを開示している。2. Description of the Related Art Conventionally, a substrate obtained by screen-printing a conductive metallizing paste on a ceramic green sheet and simultaneously firing the same is required to have high-density wiring, downsizing due to multiple layers, and high reliability. It is used as a substrate for devices. Then, as an example of these metallizing pastes for co-firing, the applicant of the present invention has disclosed in JP-A-2-228375.
Japanese Patent Laid-Open Publication No. 2003-242242, which comprises a metal component containing tungsten and / or molybdenum as a main component, a binder containing at least an acrylic resin, a solvent, and a plasticizer, and achieves a relatively low sheet resistance and warpage after firing. A thick film paste that can prevent such problems is disclosed.
【0003】[0003]
【発明が解決しようとする課題】上述した特開平2−2
28375号公報で開示された厚膜ペーストでは、結合
剤として所定のアクリル樹脂を使用することにより、同
時焼成においても良好なシート抵抗を達成することがで
きるが、同時焼成後の反りについては未だ十分に満足で
きるものを得ることはできない問題があった。また、一
般的には、導電性粉末の平均粒子径を調整することによ
り同時焼成時に基板に反りが発生しないようにすること
が考えられるが、やはり反りのない基板を得ることは難
しい問題があった。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the thick film paste disclosed in Japanese Patent No. 28375, by using a predetermined acrylic resin as a binder, a good sheet resistance can be achieved even in co-firing, but warpage after co-firing is still insufficient. There was a problem that you can't get what you are happy with. Further, in general, it is possible to prevent the warpage of the substrate during co-firing by adjusting the average particle size of the conductive powder, but it is still difficult to obtain a substrate without warpage. It was
【0004】本発明の目的は上述した課題を解消して、
同時焼成後の反りが小さく、しかも比較的低いシート抵
抗を得ることができる同時焼成用メタライズペーストを
提供しようとするものである。The object of the present invention is to solve the above problems,
An object of the present invention is to provide a metallizing paste for co-firing that has a small warpage after co-firing and can obtain a relatively low sheet resistance.
【0005】[0005]
【課題を解決するための手段】本発明の同時焼成用メタ
ライズペーストは、導電性粉末:90〜50vol%
と、有機物粉末:10〜50vol%とからなる混合物
と、結合剤と、溶剤とからなることを特徴とするもので
ある。[MEANS FOR SOLVING THE PROBLEMS] The metallizing paste for co-firing of the present invention is a conductive powder: 90 to 50% by volume.
And a mixture of organic powder: 10 to 50 vol%, a binder, and a solvent.
【0006】[0006]
【作用】上述した構成において、従来からメタライズペ
ーストの組成である導電性粉末、結合剤、溶剤のうち、
導電性粉末の一部を置き換えた有機物粉末、好ましくは
平均粒子径が5μm 以下のポリスチレン粉末は、ペース
ト中では溶剤に溶けずそのまま存在し、スクリーン印刷
後の同時焼成時に消失し、消失して生じた孔の部分が縮
む。そのため、焼成後の寸法をグリーンシートと同じに
することができ、基板としての反りをなくすことができ
る。ここで、有機物粉末の量を10〜50vol%と限
定したのは、後述する実施例から明かなように、10v
ol%未満であると反りが大きくなりすぎるとともに、
50vol%を超えると導通抵抗が大きくなりすぎるた
めである。In the above-mentioned structure, among the conductive powder, the binder, and the solvent, which are the compositions of the metallizing paste,
Organic powder obtained by replacing a part of the conductive powder, preferably polystyrene powder having an average particle size of 5 μm or less, does not dissolve in the solvent in the paste and remains as it is. The hole part shrinks. Therefore, the size after firing can be made the same as that of the green sheet, and the warp as a substrate can be eliminated. Here, the reason why the amount of the organic powder is limited to 10 to 50 vol% is that the amount of the organic powder is 10 v, as will be apparent from the examples described later.
If it is less than ol%, the warp becomes too large, and
This is because if it exceeds 50 vol%, the conduction resistance becomes too large.
【0007】[0007]
【実施例】本発明の同時焼成用メタライズペーストは、
W、Mo等の1600℃程度の高い焼成温度では溶融し
ない導電性粉末と、有機物粉末、好ましくは平均粒子径
が5μm 以下のポリスチレン粉末とを準備し、導電性粉
末が90〜50vol%で有機物粉末が10〜50vo
l%となるような混合物を調整した後、従来から知られ
ている量の結合剤と溶剤、例えば前記混合物100vo
l部に対して、結合剤として50vol部のエチルセル
ロースと溶剤として200vol部のブチルカルビトー
ルとを、前記混合物と例えばトリロールミルで混合する
ことにより得ることができる。EXAMPLE A metallizing paste for co-firing of the present invention is
Prepare conductive powder such as W and Mo that does not melt at a high firing temperature of about 1600 ° C., and organic powder, preferably polystyrene powder having an average particle size of 5 μm or less, and the conductive powder is 90 to 50 vol% and organic powder. Is 10 to 50 vo
After adjusting the mixture to give 1%, the binder and solvent in known amounts, for example 100 vo of said mixture.
It can be obtained by mixing 50 vol parts of ethyl cellulose as a binder and 200 vol parts of butyl carbitol as a solvent with respect to 1 part by mixing the above mixture with, for example, a triroll mill.
【0008】図1は本発明の同時焼成メタライズペース
トを使用して基板を製造する工程を説明するためのフロ
ーチャートである。図1に従って説明すると、まず基板
の主要部分となる例えばアルミナ、窒化アルミニウムな
どの粉末と結合剤とをドクターブレード法等の方法によ
り混合成形したセラミックグリーンシートを準備する。
同時に上述した方法に従って、導電性粉末等の原料を例
えばトリロールミル等により混合することにより本発明
のメタライズペーストを準備する。その後、グリーンシ
ート上の所定位置にメタライズペーストをスクリーン印
刷して配線パターンを形成し、例えば還元雰囲気中、1
600℃でグリーンシートとメタライズペーストとを同
時に焼成することにより、基板を得ることができる。な
お、この焼成時に生の状態の寸法は約20%収縮する。FIG. 1 is a flow chart for explaining a process of manufacturing a substrate using the co-firing metallizing paste of the present invention. Explaining with reference to FIG. 1, first, a ceramic green sheet is prepared by mixing and molding powder such as alumina and aluminum nitride, which is a main part of a substrate, and a binder by a method such as a doctor blade method.
At the same time, according to the method described above, the metallizing paste of the present invention is prepared by mixing the raw materials such as the conductive powder with a triroll mill or the like. After that, a metallizing paste is screen-printed at a predetermined position on the green sheet to form a wiring pattern.
A substrate can be obtained by simultaneously firing the green sheet and the metallizing paste at 600 ° C. The size of the raw material shrinks by about 20% during this firing.
【0009】以下、実際の例について説明する。実施例 実際に、図1に示した方法に従って、以下の表1に示す
ようにアルミナまたは窒化アルミニウムからなる50×
50mmのグリーンシート上に、表1に示すように組成
を変化させた本発明のメタライズペーストを線幅200
μm で配線パターンをスクリーン印刷し、同時焼成し
て、反りと導通抵抗とを調べた。反りは、図2に示すよ
う基板の上端と下端との間隔dを反りとして求め、図2
(a)に示すようにメタライズペースト1側が伸びた場
合を(−)、図2(b)に示すようにテープ2側が伸び
た場合を(+)と表示した。そして、±50μm 以下を
反りが本発明を満足する範囲とした。また、導通抵抗と
しては、線幅200μm の配線パターンのシート抵抗を
測定し、15mΩ/□以下のものが本発明を満たす範囲
とした。結果を表1に示す。なお、表1中、PSはポリ
スチレン粉末を示している。また、ポリスチレン粉末の
平均粒子径は0.5μm であった。An actual example will be described below. EXAMPLES In practice, according to the method shown in FIG. 1, 50 × made of alumina or aluminum nitride as shown in Table 1 below.
On a 50 mm green sheet, the metallizing paste of the present invention whose composition is changed as shown in Table 1 has a line width of 200.
The wiring pattern was screen-printed with μm and simultaneously fired, and the warpage and the conduction resistance were examined. As for the warp, the distance d between the upper end and the lower end of the substrate is calculated as the warp as shown in FIG.
The case where the metallizing paste 1 side is extended as shown in (a) is indicated as (-), and the case where the tape 2 side is extended as shown in FIG. 2 (b) is indicated as (+). And, the range of ± 50 μm or less is defined as the range where the warpage satisfies the present invention. As the conduction resistance, a sheet resistance of a wiring pattern having a line width of 200 μm was measured, and a resistance of 15 mΩ / □ or less was set as a range satisfying the present invention. The results are shown in Table 1. In Table 1, PS represents polystyrene powder. The average particle diameter of the polystyrene powder was 0.5 μm.
【0010】[0010]
【表1】 [Table 1]
【0011】表1の結果から、WまたはMoからなる導
電性粉末90〜50vol%とポリスチレン(PS)か
らなる有機物粉末10〜50vol%とを主成分とする
メタライズペーストを使用した本発明例試料No. 1〜8
は、これら以外の組成からなるメタライズペーストを使
用した比較例試料No. 1〜5と比べて、反りまたは導通
抵抗のいずれかの点で上記範囲を満たさないことがわか
った。From the results shown in Table 1, the sample No. of the present invention using a metallizing paste containing 90 to 50 vol% of a conductive powder of W or Mo and 10 to 50 vol% of an organic powder of polystyrene (PS) was used. . 1-8
It was found that, in comparison with Comparative sample Nos. 1 to 5 using the metallizing paste having a composition other than these, the above range was not satisfied in terms of either warpage or conduction resistance.
【0012】なお、上述した実施例では、有機物粉末と
してポリスチレン粉末を使用したが、好ましくは5μm
以下でペースト作製中に溶け出さない粉末であれば、ポ
リスチレン以外の有機物粉末でも使用できることはいう
までもない。例えば、ポリエステル、ポリオレフィン等
の熱可塑性樹脂、フェノール、エポキシ等の熱硬化性樹
脂を適宜使用することができる。In the above-mentioned embodiment, polystyrene powder was used as the organic powder, but it is preferably 5 μm.
It goes without saying that organic powders other than polystyrene can be used as long as they are powders that do not melt during the paste preparation. For example, thermoplastic resins such as polyester and polyolefin, and thermosetting resins such as phenol and epoxy can be appropriately used.
【0013】[0013]
【発明の効果】以上の説明から明かなように、本発明に
よれば、導電性粉末の一部を有機物粉末、好ましくは平
均粒子径が5μm 以下のポリスチレン粉末で置き換えた
ため、メタライズペースト中では溶剤に溶けずそのまま
存在し、スクリーン印刷後の同時焼成時に消失し、消失
して生じた孔の部分が縮む。そのため、本発明の同時焼
成用メタライズペーストを印刷して形成した配線パター
ンの焼成後の寸法をグリーンシートと同じにすることが
でき、基板としての反りをなくすことができる。As is apparent from the above description, according to the present invention, a part of the conductive powder is replaced with an organic powder, preferably polystyrene powder having an average particle size of 5 μm or less. It does not dissolve in, but remains as it is, disappears at the time of simultaneous firing after screen printing, and the part of the disappeared pores shrinks. Therefore, the dimension of the wiring pattern formed by printing the co-firing metallizing paste of the present invention after firing can be made the same as that of the green sheet, and warpage as a substrate can be eliminated.
【図1】本発明の同時焼成メタライズペーストを使用し
て基板を製造する工程を説明するためのフローチャート
である。FIG. 1 is a flow chart for explaining a process of manufacturing a substrate using the co-firing metallizing paste of the present invention.
【図2】基板の反りを説明するための図である。FIG. 2 is a diagram for explaining warpage of a substrate.
1 メタライズ 2 磁器 1 Metallized 2 Porcelain
Claims (3)
機物粉末:10〜50vol%とからなる混合物と、結
合剤と、溶剤とからなることを特徴とする同時焼成用メ
タライズペースト。1. A co-firing metallizing paste comprising a mixture of conductive powder: 90 to 50 vol% and organic powder: 10 to 50 vol%, a binder, and a solvent.
る請求項1記載の同時焼成用メタライズペースト。2. The co-firing metallizing paste according to claim 1, wherein the organic powder is polystyrene powder.
下である請求項1または2記載の同時焼成用メタライズ
ペースト。3. The metallizing paste for co-firing according to claim 1, wherein the average particle size of the organic powder is 5 μm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3344893A JPH06251619A (en) | 1993-02-23 | 1993-02-23 | Metallized paste for concurrent baking |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3344893A JPH06251619A (en) | 1993-02-23 | 1993-02-23 | Metallized paste for concurrent baking |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06251619A true JPH06251619A (en) | 1994-09-09 |
Family
ID=12386822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3344893A Withdrawn JPH06251619A (en) | 1993-02-23 | 1993-02-23 | Metallized paste for concurrent baking |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06251619A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6855222B2 (en) * | 2002-06-19 | 2005-02-15 | Murata Manufacturing Co., Ltd. | Method for manufacturing laminated multilayer electronic components |
EP2230561A1 (en) * | 2009-03-20 | 2010-09-22 | Wazana Brothers International, Inc., d/b/a Micro Solutions Enterprises | Method and composition for recoating toner cartridge developing member |
US8926869B2 (en) | 2007-10-28 | 2015-01-06 | Clover Technologies Group, Llc | Method and composition for recoating toner cartridge developing member |
-
1993
- 1993-02-23 JP JP3344893A patent/JPH06251619A/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6855222B2 (en) * | 2002-06-19 | 2005-02-15 | Murata Manufacturing Co., Ltd. | Method for manufacturing laminated multilayer electronic components |
US8926869B2 (en) | 2007-10-28 | 2015-01-06 | Clover Technologies Group, Llc | Method and composition for recoating toner cartridge developing member |
EP2230561A1 (en) * | 2009-03-20 | 2010-09-22 | Wazana Brothers International, Inc., d/b/a Micro Solutions Enterprises | Method and composition for recoating toner cartridge developing member |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000509 |