JPH06244054A - Metallized film capacitor - Google Patents
Metallized film capacitorInfo
- Publication number
- JPH06244054A JPH06244054A JP3096293A JP3096293A JPH06244054A JP H06244054 A JPH06244054 A JP H06244054A JP 3096293 A JP3096293 A JP 3096293A JP 3096293 A JP3096293 A JP 3096293A JP H06244054 A JPH06244054 A JP H06244054A
- Authority
- JP
- Japan
- Prior art keywords
- film
- oxide
- electrode
- zinc
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ヒューズ機能を有する
金属化フィルムコンデンサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metallized film capacitor having a fuse function.
【０００２】[0002]
【従来の技術】図８は、ヒューズ機能を有する従来の金
属化フィルムコンデンサの断面拡大図、図９はその製造
用フィルムを示す平面図である。この金属化フィルムコ
ンデンサは、同幅かつ同長の第１フィルム１および第２
フィルム２を重ねて円柱状に巻回し、この巻回体の両端
部に電極１８，２６をそれぞれ接続したうえ、全体を絶
縁材製の外装（図示略）により被覆したものである。電
極１８，２６は、一般に亜鉛やハンダ等を前記巻回体の
端面に熔射して形成され、各電極１８，２６にはリード
線（図示略）がそれぞれ接続されている。2. Description of the Related Art FIG. 8 is an enlarged cross-sectional view of a conventional metallized film capacitor having a fuse function, and FIG. 9 is a plan view showing its manufacturing film. This metallized film capacitor includes a first film 1 and a second film 1 having the same width and the same length.
The film 2 is overlapped and wound in a cylindrical shape, and the electrodes 18 and 26 are connected to both ends of the wound body, respectively, and the whole is covered with an insulating exterior (not shown). The electrodes 18 and 26 are generally formed by melting zinc or solder on the end faces of the wound body, and lead wires (not shown) are connected to the electrodes 18 and 26, respectively.
【０００３】第１フィルム１は、図８および図９に示す
ように、一定幅で長尺の誘電体フィルム基材６上に、フ
ィルム基材６の一方の側縁に沿って金属を帯状に蒸着し
た接続部１６と、この接続部１６から一定距離離間し、
かつフィルム基材６の長手方向に一定間隔毎に並ぶ矩形
状に金属を蒸着した電極部４と、各電極部４と前記接続
部１６とをそれぞれ導通させる細いヒューズ部１４とを
形成したものであり、接続部１６はその全長に亙って電
極１８と導通している。なお、蒸着金属としては現在で
はＡｌが主流である。As shown in FIGS. 8 and 9, the first film 1 is a strip of metal on one side edge of the film base 6 on a dielectric film base 6 which is long and has a constant width. With the vapor-deposited connecting portion 16 and a predetermined distance from the connecting portion 16,
In addition, the electrode portion 4 formed by vapor-depositing metal in a rectangular shape and arranged at regular intervals in the longitudinal direction of the film base material 6 and the thin fuse portion 14 for electrically connecting each electrode portion 4 and the connection portion 16 are formed. The connection portion 16 is electrically connected to the electrode 18 over its entire length. Note that Al is currently the mainstream as a metal for vapor deposition.
【０００４】第１フィルム１の反対側の側縁には、電極
２６と電極部４との短絡を防ぐために全長に亙って非蒸
着部８（縦マージン部と称する）が形成されている。ま
た、電極部４同士を仕切る非蒸着部１０を横マージン
部、各ヒューズ部１４の間の非蒸着部１２をヒューズ間
マージン部とそれぞれ称する。On the opposite side edge of the first film 1, a non-deposited portion 8 (referred to as a vertical margin portion) is formed over the entire length in order to prevent a short circuit between the electrode 26 and the electrode portion 4. Further, the non-evaporated portion 10 partitioning the electrode portions 4 from each other is referred to as a lateral margin portion, and the non-evaporated portion 12 between the fuse portions 14 is referred to as an inter-fuse margin portion.
【０００５】一方、第２フィルム２は、第１フィルム１
と同寸の誘電体フィルム基材２０上に、一方の側縁に沿
って延びる一定幅の非蒸着部（縦マージン部）２４を残
して金属蒸着膜２２を形成したものである。そして第２
フィルム２は、縦マージン部２４が第１フィルム１のヒ
ューズ間マージン部１２と対応するように重ねられてお
り、金属蒸着膜２２は全長に亙って電極２６と導通して
いる。On the other hand, the second film 2 is the first film 1
The metal vapor deposition film 22 is formed on the dielectric film base material 20 of the same size as the above, leaving a non-vapor deposition portion (vertical margin portion) 24 of a constant width extending along one side edge. And the second
The film 2 is laminated so that the vertical margin portion 24 corresponds to the inter-fuse margin portion 12 of the first film 1, and the metal vapor deposition film 22 is electrically connected to the electrode 26 over the entire length.
【０００６】上記のような金属化フィルムコンデンサに
よれば、金属蒸着膜４，２２の自己回復性、および第１
フィルム１のヒューズ部１４のヒューズ作用により、コ
ンデンサの短絡に起因する機器の損傷および火災事故を
２段階に防ぐ効果が得られる。すなわち、高電圧等によ
り電極部４と金属蒸着膜２２の短絡が生じると、まず第
１段階の保安機能として、短絡箇所の周囲の金属蒸着膜
（４または２２）が発熱して蒸発し、金属蒸着膜４，２
２間の絶縁が回復する。According to the metallized film capacitor as described above, the self-healing property of the metal vapor deposition films 4 and 22 and the first
Due to the fuse action of the fuse portion 14 of the film 1, it is possible to obtain an effect of preventing damage to the device and a fire accident due to a short circuit of the capacitor in two stages. That is, when a short circuit occurs between the electrode portion 4 and the metal vapor deposition film 22 due to a high voltage or the like, first, as a first-step security function, the metal vapor deposition film (4 or 22) around the short circuit portion generates heat and evaporates, and Evaporated film 4, 2
The insulation between the two is restored.
【０００７】さらに万一、第１段階の保安機能によって
絶縁が回復しなかった場合には、第２段階の保安機能と
して、その短絡箇所を含む電極部４と接続部１６をつな
ぐヒューズ部１４が発熱して切れ、短絡箇所を含む電極
部４への通電が停止される。ただし、ヒューズ部１４が
断線した場合は、コンデンサ容量の減少が大きいため、
ヒューズ部１４の断線は極力減らし、電極部４の自己回
復性を促進することが好ましい。自己回復性を促進すれ
ば、耐電圧を向上することが可能である。If the insulation is not restored by the safety function of the first step, the fuse section 14 connecting the electrode section 4 including the short-circuited portion and the connecting section 16 is used as the second step security function. The heat is generated, the power is cut off, and the power supply to the electrode portion 4 including the short-circuited portion is stopped. However, when the fuse portion 14 is broken, the decrease in the capacitor capacity is large, so
It is preferable to reduce the disconnection of the fuse portion 14 as much as possible and promote the self-healing property of the electrode portion 4. If the self-healing property is promoted, the withstand voltage can be improved.
【０００８】[0008]
【発明が解決しようとする課題】自己回復性を向上する
には、蒸着膜を薄くして抵抗値を高めることが必要であ
る。しかしながら、膜厚を薄くすると、蒸着膜が酸化し
やすくなり、膜が部分的に消失することがあるととも
に、電極との接合性が悪くなるため、電極−蒸着膜間の
導電性が悪化し、これらの接合部位でジュール熱が発生
して、接合部位の蒸着膜が消失しやすいという問題があ
った。In order to improve the self-healing property, it is necessary to reduce the thickness of the deposited film to increase the resistance value. However, when the film thickness is thin, the vapor deposition film is likely to be oxidized, and the film may be partially lost, and since the bonding property with the electrode is deteriorated, the conductivity between the electrode and the vapor deposition film is deteriorated, There has been a problem that Joule heat is generated at these joints, and the vapor deposition film at the joints tends to disappear.
【０００９】現在一般に使用されている金属化フィルム
コンデンサでは、蒸着膜としてＡｌ，Ｚｎ，Ａｌ−Ｚｎ
合金などが使用されているが、上記問題を改善する観点
からＡｌ蒸着膜が主流になっている。他の金属からなる
蒸着膜は、Ａｌ蒸着膜に比して薄膜時の耐食性が悪いた
めである。In metallized film capacitors that are commonly used at present, Al, Zn, and Al-Zn are used as vapor deposition films.
Although alloys and the like are used, the Al vapor deposition film is predominant from the viewpoint of improving the above problems. This is because the vapor deposition film made of another metal has poorer corrosion resistance as a thin film than the Al vapor deposition film.
【００１０】しかし、Ａｌ蒸着膜を使用した金属化フィ
ルムコンデンサでは、蒸着膜４，２２間で微弱なコロナ
放電が生じ易く、このコロナ放電によりコロージョンと
呼ばれる斑点状の腐食（Ａｌ2Ｏ3を主組成物とする）が
発生し、蒸着膜４，２２の有効面積が自己回復性によっ
て失われる以上の速度で減少してコンデンサ容量の経時
減少率が大きいという欠点があり、したがって、膜厚を
薄くするには限界（表面抵抗５Ω／ｓｑ程度）があっ
て、自己回復性が十分とは言えなかった。However, in the metallized film capacitor using the Al vapor deposition film, a weak corona discharge is likely to occur between the vapor deposition films 4 and 22, and this corona discharge causes a spot-like corrosion (corresponding mainly to Al 2 O 3) . (Composition) occurs and the effective area of the vapor-deposited films 4 and 22 decreases at a rate faster than the loss due to self-recovery, and the rate of decrease in capacitor capacitance over time is large. There is a limit (surface resistance of about 5 Ω / sq) to satisfy this requirement, and the self-healing property cannot be said to be sufficient.
【００１１】また、いずれの金属で蒸着膜を形成した場
合にも、前記接合部位のジュール熱発生の問題を改善す
るには蒸着膜を厚くせざるを得ず、この問題も自己回復
性を向上する妨げとなっている。In addition, whichever metal is used to form the vapor-deposited film, the vapor-deposited film must be made thicker in order to improve the problem of Joule heat generation at the joint, and this problem also improves the self-healing property. It is an obstacle to
【００１２】本発明は上記事情に鑑みてなされたもの
で、金属蒸着膜の自己回復性が良好で、蒸着膜の酸化に
よる容量減少が少なく、しかも電極−蒸着膜間の導電性
が良好でこれらの接合部位における蒸着膜消失を防ぐこ
とが可能な金属化フィルムコンデンサを提供することを
課題としている。The present invention has been made in view of the above circumstances, and the self-recovery property of a metal vapor deposition film is good, the capacity reduction due to the oxidation of the vapor deposition film is small, and the conductivity between the electrode and the vapor deposition film is good. It is an object of the present invention to provide a metallized film capacitor capable of preventing the vapor deposition film from disappearing at the joint portion of.
【００１３】[0013]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る第１の金属化フィルムコンデンサは、
一定幅で長尺のプラスチック製のフィルム基材と、前記
フィルム基材の上面に、前記フィルム基材の一方の側縁
に沿って抵抗値１．５〜１０Ω／ｓｑとなる厚さで帯状
に亜鉛を蒸着した接続部と、前記フィルム基材の上面
に、前記接続部から離間して、前記フィルム基材の長手
方向に一定間隔毎に並ぶ矩形状に６〜３０Ω／ｓｑかつ
前記接続部の抵抗値の２〜７倍以上の抵抗値となる厚さ
で亜鉛を蒸着した電極部と、前記各電極部と前記接続部
とをそれぞれ導通させる亜鉛蒸着膜製のヒューズ部とを
具備し、前記接続部、前記電極部および前記ヒューズ部
上には、Ｓｉ酸化物，Ｔｉ酸化物，Ｚｒ酸化物，Ｓｎ酸
化物，Ｙ酸化物，またはインジウム錫酸化物から選択さ
れる１種または２種以上の物質が０．１〜１０ｍｇ／ｍ
2 蒸着された保護層が設けられているフィルムコンデン
サ製造用フィルムを第１フィルムとする一方、プラスチ
ック製フィルム基材の上面に亜鉛蒸着膜を形成したもの
を第２フィルムとし、前記第１および第２フィルムを重
ねて巻回し、この巻回体の両端にそれぞれ電極を配置す
ることにより、一方の電極を第１フィルムの接続部と導
通させ、他方の電極を前記第２フィルムの亜鉛蒸着膜と
導通させたことを特徴とする。In order to solve the above-mentioned problems, the first metallized film capacitor according to the present invention comprises:
A long plastic film base with a constant width, and a strip shape on the upper surface of the film base with a thickness of 1.5 to 10 Ω / sq along one side edge of the film base. On the upper surface of the film base material and the connection part where zinc is vapor-deposited, spaced apart from the connection part, 6 to 30 Ω / sq and a rectangular shape of the connection part are arranged in the longitudinal direction of the film base material at regular intervals. An electrode part in which zinc is vapor-deposited to have a resistance value that is 2 to 7 times the resistance value or more; and a fuse part made of a zinc vapor-deposited film that electrically connects each electrode part and the connection part, One or more selected from Si oxide, Ti oxide, Zr oxide, Sn oxide, Y oxide, or indium tin oxide is formed on the connection portion, the electrode portion, and the fuse portion. Substance is 0.1-10mg / m
2 The first film is a film for producing a film capacitor provided with a vapor-deposited protective layer, while the second film is a plastic film substrate on which a zinc vapor-deposited film is formed. Two films are overlapped and wound, and by disposing electrodes on both ends of this wound body, one electrode is electrically connected to the connecting portion of the first film, and the other electrode is the zinc vapor deposition film of the second film. It is characterized by being conducted.
【００１４】また、本発明に係る第２の金属化フィルム
コンデンサは、一定幅で長尺のプラスチック製のフィル
ム基材と、前記フィルム基材の上面に、前記フィルム基
材の一方の側縁に沿って抵抗値１．５〜１０Ω／ｓｑと
なる厚さで帯状に亜鉛を蒸着した接続部と、前記フィル
ム基材の上面に、前記接続部から離間して、前記フィル
ム基材の長手方向に一定間隔毎に並ぶ矩形状に６〜３０
Ω／ｓｑかつ前記接続部の抵抗値の２〜７倍以上の抵抗
値となる厚さで亜鉛を蒸着した電極部と、前記各電極部
と前記接続部とをそれぞれ導通させる亜鉛蒸着膜製のヒ
ューズ部とを具備し、前記接続部、前記電極部および前
記ヒューズ部上には、Ｓｉ酸化物，Ｔｉ酸化物，Ｚｒ酸
化物，Ｓｎ酸化物，Ｙ酸化物，またはインジウム錫酸化
物から選択される１種または２種以上の物質が０．１〜
１０ｍｇ／ｍ2 蒸着された保護層が設けられているコン
デンサ製造用フィルムを、前記接続部が互いに反対側の
端縁に位置するように２枚重ねて巻回し、この巻回体の
両端にそれぞれ電極を配置することにより、一方の電極
を一方のコンデンサ製造用フィルムの接続部と導通さ
せ、他方の電極を他方のコンデンサ製造用フィルムの接
続部と導通させたことを特徴とする。The second metallized film capacitor according to the present invention comprises a plastic film base having a constant width and a long length, an upper surface of the film base, and one side edge of the film base. Along the longitudinal direction of the film base material, on the upper surface of the film base material, apart from the connection part, on the connection part where zinc is vapor-deposited in a thickness of 1.5 to 10 Ω / sq. 6 to 30 in a rectangular shape lined up at regular intervals
Ω / sq and electrode made of zinc vapor-deposited with a thickness that is 2 to 7 times or more the resistance of the connecting portion, and a zinc vapor-deposited film for electrically connecting the electrode portion and the connecting portion, respectively. A fuse portion, and on the connection portion, the electrode portion, and the fuse portion, selected from Si oxide, Ti oxide, Zr oxide, Sn oxide, Y oxide, or indium tin oxide. 0.1 or more of one or more substances
10 mg / m 2 A capacitor-producing film provided with a vapor-deposited protective layer was wound in two layers so that the connection portions were located on opposite edges, and the windings were respectively wound on both ends. By arranging the electrodes, one of the electrodes is brought into conduction with the connection portion of one of the capacitor manufacturing films, and the other electrode is brought into conduction with the connection portion of the other capacitor manufacturing film.
【００１５】[0015]
【作用】本発明に係る金属化フィルムコンデンサによれ
ば、電極に接合される接続部が抵抗値１．５〜１０Ω／
ｓｑとなる厚さの亜鉛蒸着膜で形成される一方、電極部
は６〜３０Ω／ｓｑかつ前記接続部の抵抗値の２〜７倍
以上の抵抗値となる厚さの亜鉛蒸着膜で形成されている
ので、電極部の自己回復性を十分に高めることができる
うえ、電極と接続部との接合界面でジュール熱が発生し
て接続部が消失する現象を防ぐことが可能である。した
がって、保安性能の信頼性を高めるとともに、コンデン
サ容量の減少を抑制することができる。According to the metallized film capacitor of the present invention, the connection portion joined to the electrode has a resistance value of 1.5 to 10 Ω /
The electrode portion is formed of a zinc vapor deposition film having a thickness of 6 to 30 Ω / sq and a resistance value of 2 to 7 times or more the resistance value of the connection portion. Therefore, it is possible to sufficiently enhance the self-healing property of the electrode portion, and it is possible to prevent the phenomenon that Joule heat is generated at the bonding interface between the electrode and the connection portion and the connection portion disappears. Therefore, it is possible to improve the reliability of the security performance and suppress the decrease of the capacitor capacity.
【００１６】また、前記接続部、前記電極部および前記
ヒューズ部上には、Ｓｉ酸化物，Ｔｉ酸化物，Ｚｒ酸化
物，Ｓｎ酸化物，Ｙ酸化物，またはインジウム錫酸化物
から選択される１種または２種以上の物質が０．１〜１
０ｍｇ／ｍ2 蒸着された保護層が設けられている保護層
が設けられているので、電極部が６〜３０Ω／ｓｑと極
めて薄く形成されているにも拘らず、水分の侵入による
亜鉛蒸着膜の酸化を防ぐことが可能である。On the connecting portion, the electrode portion and the fuse portion, 1 selected from Si oxide, Ti oxide, Zr oxide, Sn oxide, Y oxide, or indium tin oxide. 0.1 to 1 species or two or more substances
Since the protective layer provided with the protective layer vapor-deposited by 0 mg / m 2 is provided, the zinc vapor-deposited film due to the intrusion of moisture despite the electrode portion being formed to be extremely thin at 6 to 30 Ω / sq. It is possible to prevent the oxidation of.
【００１７】[0017]
【実施例】図１は本発明に係る金属化フィルムコンデン
サの一実施例の要部の断面拡大図、図２はその製造用フ
ィルムの平面図である。これらの図において、図８およ
び図９と同一部分には同一符号を付して説明を簡略化す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an enlarged cross-sectional view of an essential part of an embodiment of a metallized film capacitor according to the present invention, and FIG. 2 is a plan view of a manufacturing film thereof. In these figures, the same parts as those in FIGS. 8 and 9 are designated by the same reference numerals to simplify the description.
【００１８】この実施例の主たる特徴は、第１フィルム
３０上の接続部３２が抵抗値１．５〜１０Ω／ｓｑにな
る厚さで形成され、電極部４が６〜３０Ω／ｓｑかつ前
記接続部の抵抗値の２〜７倍以上の抵抗値となる厚さと
され、接続部３２が電極部４よりも厚肉化されているこ
とにある。The main feature of this embodiment is that the connecting portion 32 on the first film 30 is formed to have a resistance value of 1.5 to 10 Ω / sq, and the electrode portion 4 has a thickness of 6 to 30 Ω / sq. The thickness of the connecting portion 32 is larger than that of the electrode portion 4, and the connecting portion 32 is thicker than the electrode portion 4.
【００１９】接続部３２が１０Ω／ｓｑ以上であると、
電極１８と接続部３２との界面でジュール熱が発生して
接続部３２が消失する現象が生じやすくなる。逆に、接
続部３２が１．５Ω／ｓｑ未満ではフィルムが硬質化し
てコンデンサの組立が困難になる。When the connecting portion 32 has a resistance of 10 Ω / sq or more,
A phenomenon in which Joule heat is generated at the interface between the electrode 18 and the connecting portion 32 and the connecting portion 32 disappears easily occurs. On the contrary, if the connecting portion 32 is less than 1.5Ω / sq, the film becomes hard and it becomes difficult to assemble the capacitor.
【００２０】電極部４が６Ω／ｓｑ未満であると、電極
部４が蒸発しにくくなり自己回復性が低下する。一方、
３０Ω／ｓｑより高いと蒸着により均質な膜が形成困難
であるうえ、耐電圧もそれ程向上しない。又、電極部４
が酸化しやすくなり、信頼性が不足する。If the electrode portion 4 is less than 6 Ω / sq, the electrode portion 4 is less likely to evaporate and the self-recovery property is deteriorated. on the other hand,
When it is higher than 30 Ω / sq, it is difficult to form a uniform film by vapor deposition, and the withstand voltage is not improved so much. Also, the electrode part 4
Is easily oxidized, resulting in lack of reliability.
【００２１】接続部３２の上面からヒューズ部１４に至
る傾斜面３２Ａは、図３に示すようにヒューズ部１４に
進入していなくてもよいし、図４に示すようにヒューズ
部１４に進入していてもよい。接続部３２の幅は従来品
と同様でよく、限定はされないが、一般的には１．５〜
３ｍｍ程度が好ましい。また、ヒューズ部１４の幅は
０．２〜２．０ｍｍであることが好ましい。The inclined surface 32A extending from the upper surface of the connecting portion 32 to the fuse portion 14 does not have to enter the fuse portion 14 as shown in FIG. 3, but may enter the fuse portion 14 as shown in FIG. May be. The width of the connecting portion 32 may be the same as that of the conventional product and is not limited, but is generally 1.5 to
It is preferably about 3 mm. In addition, the width of the fuse portion 14 is preferably 0.2 to 2.0 mm.
【００２２】フィルム基材６，２０の材質となるプラス
チックは限定されないが、好ましくは、ポリエチレンテ
レフタレート，ポリプロピレン，ポリスチレン，ポリカ
ーボネイト，ポリフィニレンサルファイド，ポリ４フッ
化エチレン，ポリエチレンから選択される１種、または
２種以上を積層して形成されたものが選択され、その厚
さは用途に必要に応じて適宜設定される。The plastic used as the material of the film substrates 6 and 20 is not limited, but preferably one selected from polyethylene terephthalate, polypropylene, polystyrene, polycarbonate, polyphenylene sulfide, polytetrafluoroethylene, polyethylene. Alternatively, a layer formed by laminating two or more kinds is selected, and the thickness thereof is appropriately set depending on the application and need.
【００２３】蒸着膜４，２２は、いずれも亜鉛（亜鉛を
主組成物とする亜鉛合金を含む）で形成されている。亜
鉛蒸着膜は、耐食性がアルミニウム蒸着膜に比して劣
り、薄膜化すると酸化による容量減少が無視できなくな
る。そこで、亜鉛蒸着膜の耐食性向上を図るため、前記
各蒸着膜４，１４，３２上には、Ｓｉ酸化物，Ｔｉ酸化
物，Ｚｒ酸化物，Ｓｎ酸化物，Ｙ酸化物またはインジウ
ム錫酸化物から選択される１種または２種以上の物質を
０．１〜１０ｍｇ／ｍ2 蒸着した保護層３４が形成され
ている。保護層３４の厚さが０．１ｍｇ／ｍ2 未満では
効果が得られず、１０ｍｇ／ｍ2 より厚くてもそれ以上
の改善は見られない。Each of the vapor deposition films 4 and 22 is made of zinc (including a zinc alloy containing zinc as a main composition). The zinc vapor deposition film is inferior in corrosion resistance to the aluminum vapor deposition film, and when the zinc vapor deposition film is thinned, the capacity decrease due to oxidation cannot be ignored. Therefore, in order to improve the corrosion resistance of the zinc vapor deposition film, Si oxide, Ti oxide, Zr oxide, Sn oxide, Y oxide or indium tin oxide is formed on each of the vapor deposition films 4, 14 and 32. A protective layer 34 is formed by vapor-depositing one or more selected substances in an amount of 0.1 to 10 mg / m 2 . If the thickness of the protective layer 34 is less than 0.1 mg / m 2 , no effect is obtained, and if it is more than 10 mg / m 2 , no further improvement is observed.
【００２４】保護層３４の厚さが０．３ｍｇ／ｍ2 にま
で薄いと、保護層３４は緻密な膜ではなく多孔膜になる
と考えられる。このような多孔膜であっても耐電圧性お
よび耐食性向上効果が得られる理由は、亜鉛蒸着膜の表
面の結合エネルギーの大きな箇所（キンク，ステップ
等）に前記物質が選択的に結合し、酸化物の生成・生長
を防止するためであると推定される。When the thickness of the protective layer 34 is as thin as 0.3 mg / m 2 , the protective layer 34 is considered to be a porous film rather than a dense film. The reason why the withstanding voltage and corrosion resistance can be improved even with such a porous film is that the substance is selectively bonded to a portion (kink, step, etc.) having a large binding energy on the surface of the zinc vapor-deposited film and is oxidized. It is presumed that this is to prevent the production / growth of objects.
【００２５】一方、第２フィルム２の金属蒸着膜２２の
厚さは従来と同様でも良いし、あるいは電極２６との接
続部のみを第１フィルム３０と同様に相対的に厚肉とし
た構成としてもよい。第２フィルム２の金属蒸着膜２２
上にも上記同様の保護層３４を形成することが望まし
い。また、電極１８，２６は、金属蒸着膜と同じ亜鉛を
溶射して形成することが望ましい。On the other hand, the thickness of the metal vapor deposition film 22 of the second film 2 may be the same as the conventional one, or only the connecting portion with the electrode 26 is relatively thick like the first film 30. Good. Metal evaporated film 22 of second film 2
It is desirable to form a protective layer 34 similar to the above also on the above. The electrodes 18 and 26 are preferably formed by spraying the same zinc as the metal vapor deposition film.
【００２６】上記構成からなる金属化フィルムコンデン
サによれば、第１フィルム３０の接続部３２が抵抗値
１．５〜１０Ω／ｓｑになる厚さで形成され、電極部４
が６〜３０Ω／ｓｑかつ前記接続部の抵抗値の２〜７倍
以上の抵抗値となる厚さとされているので、電極１８と
接続部３２との界面でジュール熱が発生して接続部３２
が消失する現象を防ぎつつ、電極部４の膜厚を薄くして
その自己回復性を十分に高めることができる。したがっ
て、従来は両立しがたかった、保安性能の信頼性向上お
よび単位厚さ当たりの耐電圧の向上を同時に達成するこ
とが可能である。According to the metallized film capacitor having the above-mentioned structure, the connecting portion 32 of the first film 30 is formed to have a resistance value of 1.5 to 10 Ω / sq.
Has a resistance value of 6 to 30 Ω / sq and a resistance value of 2 to 7 times or more the resistance value of the connection portion, so that Joule heat is generated at the interface between the electrode 18 and the connection portion 32 to cause the connection portion 32.
It is possible to reduce the film thickness of the electrode portion 4 and sufficiently improve its self-healing property while preventing the phenomenon of disappearance. Therefore, it is possible to simultaneously achieve improvement in reliability of safety performance and improvement in withstand voltage per unit thickness, which were difficult to achieve in the past.
【００２７】また、電極部４を構成する亜鉛蒸着膜上に
保護層３４を設けているので、電極部４が酸化しやすい
亜鉛により６〜３０Ω／ｓｑと極めて薄く形成されてい
るにも拘らず、水分の侵入による亜鉛蒸着膜の酸化を防
ぐことが可能で、この点からもコンデンサの信頼性を向
上することが可能である。Further, since the protective layer 34 is provided on the zinc vapor deposition film constituting the electrode portion 4, the electrode portion 4 is formed to be extremely thin at 6 to 30 Ω / sq by zinc which is easily oxidized. It is possible to prevent the zinc vapor deposition film from being oxidized due to the intrusion of moisture, and it is possible to improve the reliability of the capacitor also from this point.
【００２８】さらに、この実施例では、各フィルム３
０，２の金属蒸着膜と電極１８，２６が共に亜鉛で形成
されているので、電極１８，２６と金属蒸着膜との接合
性および導通性が良好であり、これらの接合界面で抵抗
値が上昇することを防止できる。したがって、この点か
らも、接合界面におけるジュール熱発生に起因する接合
部の消失を防ぐことが可能である。Further, in this embodiment, each film 3
Since the metal vapor deposition films of 0 and 2 and the electrodes 18 and 26 are both formed of zinc, the bondability and conductivity between the electrodes 18 and 26 and the metal vapor deposition film are good, and the resistance value is high at the bonding interface between them. It can prevent rising. Therefore, also from this point, it is possible to prevent the disappearance of the joint portion due to the generation of Joule heat at the joint interface.
【００２９】さらにまた、この実施例では金属蒸着膜が
亜鉛で形成されているので、金属蒸着膜を合金で形成し
た場合に比して蒸着作業が容易であり、生産性が高いと
いう利点も有する。Furthermore, in this embodiment, since the metal vapor deposition film is made of zinc, the vapor deposition work is easier and the productivity is higher than when the metal vapor deposition film is made of an alloy. .
【００３０】なお、上記実施例では、ヒューズ部１４を
有する第１フィルム３０とヒューズ部を持たない第２フ
ィルムを重ねてコンデンサを形成したが、その代わり
に、２枚の第１フィルム３０を、それらの接続部３２が
互いに反対側に位置するように重ねて巻回し、コンデン
サを形成してもよいことは勿論である。In the above embodiment, the capacitor is formed by stacking the first film 30 having the fuse portion 14 and the second film not having the fuse portion, but instead, two first films 30 are formed. Of course, the capacitors may be formed by overlapping and winding such that the connecting portions 32 are located on the opposite sides.
【００３１】[0031]
【実験例】次に、実験例を挙げて本発明の効果を実証す
る。 （実験１）表１に示す試料１〜１２のコンデンサを製造
した。試料１〜６は図８および図９に示した接続部が厚
肉化されていない従来品であり、試料７〜１２は図１お
よび図２に示した、接続部が相対的に厚肉化されかつ保
護層を有するものである。ただし、試料１１および１２
は、金属蒸着膜の膜厚が本発明の範囲から外れている。[Experimental Example] Next, the effect of the present invention will be demonstrated with reference to an experimental example. (Experiment 1) Capacitors of Samples 1 to 12 shown in Table 1 were manufactured. Samples 1 to 6 are conventional products in which the connecting portions shown in FIGS. 8 and 9 are not thickened, and Samples 7 to 12 are comparatively thickened in the connecting portions shown in FIGS. 1 and 2. And has a protective layer. However, samples 11 and 12
In, the film thickness of the metal vapor deposition film is out of the range of the present invention.
【００３２】試料１〜１２の共通値は以下の通りであ
る。 フィルム基材６，２０の材質：ＰＥＴ フィルム基材６，２０の厚さ：５．５μｍ フィルム基材６，２０の幅：５０ｍｍ ヒューズ用非蒸着部１２の幅：０．５ｍｍ ヒューズ部１４の幅：０．５ｍｍ 電極部４のピッチ：１７ｍｍ 接続部３２，１６の幅：２ｍｍ コンデンサ容量：５０μＦ 試料７〜１２で形成した保護層３４の材質はＳｉＯｘ
（ｘ＝１〜２）であり、保護層３４の厚さは１．０ｍｇ
／ｍ2とした。Common values of Samples 1 to 12 are as follows. Material of the film bases 6 and 20: PET Thickness of the film bases 6 and 20: 5.5 μm Width of the film bases 6 and 20: 50 mm Width of the fuse non-deposition part 12: 0.5 mm Width of the fuse part 14 : 0.5 mm Pitch of electrode part 4: 17 mm Width of connection parts 32 and 16: 2 mm Capacitance: 50 μF Material of protective layer 34 formed of samples 7 to 12 is SiOx
(X = 1 to 2), and the thickness of the protective layer 34 is 1.0 mg.
/ M 2 .
【００３３】得られたコンデンサのそれぞれに対し、Ｊ
ＩＳ−Ｃ４９０８で規定される保安性試験を行った。こ
の保安性試験は、コンデンサを±３℃に強制冷却できる
恒温槽内に入れて恒温に保ちつつ、図５に示す回路を各
コンデンサＣｘに接続し、次の手順で行った。For each of the capacitors obtained, J
The security test defined by IS-C4908 was performed. This safety test was carried out by the following procedure with the circuit shown in FIG. 5 being connected to each capacitor Cx while the capacitors were placed in a constant temperature bath capable of forcibly cooling to ± 3 ° C. and kept at a constant temperature.
【００３４】開閉器Ｓを開放の位置にし、コンデンサ
Ｃｘに５０Ｈｚの正弦波に近い波形をもつ定格電圧（２
３０Ｖ）の１．３倍の電圧を印加する。 開閉器Ｓを端子ｂに切り替え、放電用コンデンサＣｏ
にコンデンサＣｘの定格電圧の４倍の直流電圧を印加す
る。Ｃｏの容量はＣｘの容量の２倍とする。 放電用コンデンサＣｏが充電されたら、開閉器Ｓを端
子ａに切り替え、Ｃｏの電荷を定格電圧の１．３倍の交
流電圧が印加されているＣｘに放電する。 放電後、再び開閉器Ｓを端子ｂに戻し、以下、同じ操
作を繰り返す。このときの放電頻度は、１５秒に１回と
する。 交流電流計で電流値を記録し、Ｃｘに流れる交流電流
がほぼ０になったとき、この試験を終了し、そのサイク
ル回数を記録する。サイクル回数が１００〜５００のも
のを合格品として、母数１０個中の合格品数で評価し
た。 上記保安性試験の結果を表１に示す。With the switch S in the open position, the capacitor Cx has a rated voltage (2
A voltage of 1.3 times 30 V) is applied. Switching the switch S to the terminal b, the discharge capacitor Co
A DC voltage four times the rated voltage of the capacitor Cx is applied to. The capacity of Co is twice that of Cx. When the discharging capacitor Co is charged, the switch S is switched to the terminal a, and the electric charge of Co is discharged to Cx to which an AC voltage 1.3 times the rated voltage is applied. After discharging, the switch S is returned to the terminal b again, and the same operation is repeated thereafter. The discharge frequency at this time is once every 15 seconds. The current value is recorded by an alternating current ammeter, and when the alternating current flowing through Cx becomes almost 0, this test is terminated and the number of cycles is recorded. A product having a cycle number of 100 to 500 was regarded as a passing product, and evaluated by the number of passing products in a population of 10. The results of the above-mentioned security test are shown in Table 1.
【００３５】また、試料２および５について耐湿性試験
を行ない、保護層３４の効果を検証した。耐湿性試験の
方法は、温度７０℃、湿度８０％ＲＨの環境下に、金属
蒸着フィルムを巻回しただけの状態（外装なし）で１８
時間放置し、放置前後の電極部４の抵抗値（Ω／ｓｑ）
を計測して、次式で示される変化率を求めた。この変化
率が高いほど亜鉛蒸着膜が酸化しやすいことを示す。 変化率＝（試験後の抵抗値−試験前の抵抗値）／試験前
の抵抗値×１００ 得られた変化率が３０未満のものを◎、３１〜２００を
○、２０１〜５００を△、５０１以上を×として表１に
併せて示す。A moisture resistance test was conducted on Samples 2 and 5 to verify the effect of the protective layer 34. The method of the moisture resistance test is 18 in a state where the metal vapor deposition film is just wound (without an exterior) in an environment of a temperature of 70 ° C. and a humidity of 80% RH.
After being left for a period of time, the resistance value of the electrode part 4 before and after being left (Ω / sq)
Was measured and the rate of change represented by the following equation was determined. It is indicated that the higher the rate of change, the more easily the zinc vapor deposition film is oxidized. Change rate = (resistance value after test−resistance value before test) / resistance value before test × 100 ◎ for which the obtained change rate is less than 30 ◎, 31 to 200, ○, 201 to 500, Δ, 501 The above is shown as x in Table 1 together.
【００３６】また、試験後のコンデンサを分解し、コロ
ージョンの有無と接続部消失の有無を肉眼で判定した。
その結果も表１に示す。Further, the capacitors after the test were disassembled, and the presence or absence of corrosion and the presence or absence of disappearance of the connection portion were visually judged.
The results are also shown in Table 1.
【００３７】[0037]
【表１】 [Table 1]
【００３８】表１から明らかなように、本発明の範囲に
入る試料７〜１０は保安性試験の結果がいずれも１０／
１０で、また耐湿性、コロージョンや接続部膜消失の発
生率も低く、従来品である試料１〜６、および比較品で
ある試料１１および１２に比して、総合評価で高い信頼
性を示した。As is clear from Table 1, Samples 7 to 10 which fall within the scope of the present invention have the results of the security test of 10 /.
10, the moisture resistance, the occurrence rate of corrosion and the disappearance of the film at the connection portion are low, and shows higher reliability in the comprehensive evaluation as compared with the conventional samples 1 to 6 and the comparative samples 11 and 12. It was
【００３９】（実験２）実験１と同じフィルム基材を使
用し、種々の膜厚でアルミニウムまたは亜鉛を蒸着した
蒸着フィルムを形成し、同種同厚の蒸着フィルム同士を
２枚互い違いに重ねてコンデンサ容量が５０μＦとなる
ように円柱体を形成し、その両端に亜鉛を溶射して電極
を形成した。(Experiment 2) Using the same film substrate as in Experiment 1, vapor-deposited films were formed by vapor-depositing aluminum or zinc in various thicknesses, and two vapor-deposited films of the same kind and the same thickness were alternately stacked to form a capacitor. A columnar body was formed to have a capacity of 50 μF, and zinc was sprayed on both ends thereof to form electrodes.
【００４０】こうして形成した各種のコンデンサを図６
に示すような耐電圧試験装置にかけて耐電圧を測定し
た。図中Ｒ１は保護抵抗、Ｒ２は放電抵抗、Ｓは切り替
えスイッチ、Ｃｘは試料となるコンデンサである。測定
は以下のように行った。The various capacitors thus formed are shown in FIG.
The withstand voltage was measured by applying the withstand voltage test device as shown in FIG. In the figure, R1 is a protection resistance, R2 is a discharge resistance, S is a changeover switch, and Cx is a sample capacitor. The measurement was performed as follows.
【００４１】電圧計の表示電圧が５０Ｖ／μｍとなる
ように直流電源電圧を調整する。 スイッチＳを端子２側に切り替え、ターミナルａ，ｂ
にコンデンサＣｘを接続する。 スイッチＳを端子１側に切り替え、コンデンサＣｘに
１分間電圧を印加する。 スイッチＳを端子２側に切
り替え、コンデンサＣｘを放電させる。 ターミナルａ，ｂからコンデンサＣｘを外し、コンデ
ンサＣｘの両極を短絡させたまま１時間放置する。 電圧を１００Ｖ上昇させる。 〜を繰り返し、コンデンサＣｘが破壊した電圧を
計測する。破壊しない最大電圧をフィルムの厚さで除し
た値を耐電圧とした。The DC power supply voltage is adjusted so that the display voltage of the voltmeter becomes 50 V / μm. Switch the switch S to the terminal 2 side, and
The capacitor Cx is connected to. The switch S is switched to the terminal 1 side, and a voltage is applied to the capacitor Cx for 1 minute. The switch S is switched to the terminal 2 side to discharge the capacitor Cx. The capacitor Cx is removed from the terminals a and b, and left for 1 hour with both electrodes of the capacitor Cx short-circuited. Increase the voltage by 100V. By repeating ~, the voltage at which the capacitor Cx is broken is measured. The value obtained by dividing the maximum voltage that does not break by the film thickness was defined as the withstand voltage.
【００４２】結果を図７に示す。この図から明らかなよ
うに、亜鉛蒸着膜の方が、その膜厚を調整すればアルミ
蒸着膜に比して耐電圧を高めることが可能である。した
がって、本発明のコンデンサも従来品より耐電圧を向上
できることがわかる。The results are shown in FIG. As is clear from this figure, the zinc vapor deposition film can have a higher withstand voltage than the aluminum vapor deposition film by adjusting the film thickness. Therefore, it can be seen that the capacitor of the present invention can also have higher withstand voltage than conventional products.
【００４３】[0043]
【発明の効果】以上説明したように、本発明に係る金属
化フィルムコンデンサでは、第１フィルムの接続部が抵
抗値１．５〜１０Ω／ｓｑになる厚さで形成され、電極
部が６〜３０Ω／ｓｑかつ前記接続部の抵抗値の２〜７
倍以上の抵抗値となる厚さとされているので、電極と接
続部との界面でジュール熱が発生して接続部が消失する
現象を防ぎつつ、電極部の膜厚を薄くしてその自己回復
性を十分に高めることができる。したがって、従来は両
立しがたかった、保安性能の信頼性向上および単位厚さ
当たりの耐電圧の向上を同時に達成することが可能であ
る。As described above, in the metallized film capacitor according to the present invention, the connecting portion of the first film is formed to have a resistance value of 1.5 to 10 Ω / sq, and the electrode portion has a thickness of 6 to 6. 30Ω / sq and 2 to 7 of the resistance value of the connection part
Since the thickness is more than double the resistance value, the phenomenon that Joule heat is generated at the interface between the electrode and the connection part and the connection part disappears is prevented, and the electrode part is thinned to recover itself. The sex can be sufficiently enhanced. Therefore, it is possible to simultaneously achieve improvement in reliability of safety performance and improvement of withstand voltage per unit thickness, which are difficult to achieve in the past.
【００４４】また、電極部を構成する亜鉛蒸着膜上に保
護層を設けているので、電極部が酸化しやすい亜鉛によ
り６〜３０Ω／ｓｑと薄く形成されているにも拘らず、
水分の侵入による亜鉛蒸着膜の酸化を防ぐことが可能
で、この点からもコンデンサの信頼性を向上することが
可能である。Further, since the protective layer is provided on the zinc vapor deposition film forming the electrode portion, the electrode portion is formed as thin as 6 to 30 Ω / sq by zinc which is easily oxidized,
It is possible to prevent oxidation of the zinc vapor deposition film due to invasion of water, and also from this point, it is possible to improve the reliability of the capacitor.
【図１】本発明に係る金属化フィルムコンデンサの一実
施例の断面拡大図である。FIG. 1 is an enlarged cross-sectional view of an embodiment of a metallized film capacitor according to the present invention.
【図２】同金属化フィルムコンデンサを製造するための
フィルムの一実施例を示す平面図である。FIG. 2 is a plan view showing an example of a film for producing the same metallized film capacitor.
【図３】同コンデンサ製造用フィルムの接続部の断面拡
大図である。FIG. 3 is an enlarged cross-sectional view of a connection portion of the capacitor manufacturing film.
【図４】同コンデンサ製造用フィルムの接続部の変形例
を示す断面拡大図である。FIG. 4 is an enlarged cross-sectional view showing a modified example of the connection portion of the film for manufacturing a capacitor.
【図５】コンデンサの性能試験装置を示す回路図であ
る。FIG. 5 is a circuit diagram showing a capacitor performance test device.
【図６】耐電圧測定方法を示す回路図である。FIG. 6 is a circuit diagram showing a withstand voltage measuring method.
【図７】電極部の抵抗値とコンデンサの耐電圧の関係を
示すグラフである。FIG. 7 is a graph showing a relationship between a resistance value of an electrode portion and a withstand voltage of a capacitor.
【図８】従来の金属化フィルムコンデンサの断面拡大図
である。FIG. 8 is an enlarged cross-sectional view of a conventional metalized film capacitor.
【図９】従来の金属化フィルムコンデンサ製造用フィル
ムの平面図である。FIG. 9 is a plan view of a conventional metallized film capacitor manufacturing film.
２ 第２フィルム ４ 電極部 ６，２０ フィルム基材 ８，１０，１２，２４ 非蒸着部 １４ ヒューズ部 １８，２６ コンデンサの電極 ２２ 第２フィルムの金属蒸着部 ３０ フィルムコンデンサ製造用フィルム（第１フィル
ム） ３２ 接続部 ３４ 保護層2 Second film 4 Electrode part 6,20 Film base material 8, 10, 12, 24 Non-evaporated part 14 Fuse part 18, 26 Capacitor electrode 22 Metal evaporated part of second film 30 Film for film capacitor production (first film ) 32 connection part 34 protective layer
Claims (2)
基材と、前記フィルム基材の上面に、前記フィルム基材
の一方の側縁に沿って抵抗値１．５〜１０Ω／ｓｑとな
る厚さで帯状に亜鉛を蒸着した接続部と、前記フィルム
基材の上面に、前記接続部から離間して、前記フィルム
基材の長手方向に一定間隔毎に並ぶ矩形状に６〜３０Ω
／ｓｑかつ前記接続部の抵抗値の２〜７倍以上の抵抗値
となる厚さで亜鉛を蒸着した電極部と、前記各電極部と
前記接続部とをそれぞれ導通させる亜鉛蒸着膜製のヒュ
ーズ部とを具備し、前記接続部、前記電極部および前記
ヒューズ部上には、Ｓｉ酸化物，Ｔｉ酸化物，Ｚｒ酸化
物，Ｓｎ酸化物，Ｙ酸化物，またはインジウム錫酸化物
から選択される１種または２種以上の物質が０．１〜１
０ｍｇ／ｍ2 蒸着された保護層が設けられているフィル
ムコンデンサ製造用フィルムを第１フィルムとする一
方、 プラスチック製フィルム基材の上面に亜鉛蒸着膜を形成
したものを第２フィルムとし、 前記第１および第２フィルムを重ねて巻回し、この巻回
体の両端にそれぞれ電極を配置することにより、一方の
電極を第１フィルムの接続部と導通させ、他方の電極を
前記第２フィルムの亜鉛蒸着膜と導通させたことを特徴
とする金属化フィルムコンデンサ。1. A plastic film base having a constant width and a long length, and a resistance value of 1.5 to 10 Ω / sq on one side edge of the film base on the upper surface of the film base. 6 to 30 Ω in a rectangular shape spaced apart from the connection portion on the upper surface of the film base material and the connection portion formed by vapor-depositing zinc in the thickness of a strip, and arranged at regular intervals in the longitudinal direction of the film base material.
/ Sq and an electrode part in which zinc is vapor-deposited with a thickness that is 2 to 7 times or more the resistance value of the connection part, and a fuse made of a zinc-deposited film for electrically connecting the electrode part and the connection part, respectively. And a Si oxide, a Ti oxide, a Zr oxide, a Sn oxide, a Y oxide, or an indium tin oxide on the connection portion, the electrode portion, and the fuse portion. 0.1 to 1 of 1 or 2 or more substances
The film for producing a film capacitor provided with a 0 mg / m 2 vapor-deposited protective layer is used as a first film, while a film on which a zinc vapor-deposited film is formed on a top surface of a plastic film substrate is used as a second film. By winding the first and second films in an overlapping manner and disposing electrodes on both ends of the wound body, one electrode is electrically connected to the connecting portion of the first film, and the other electrode is made of zinc of the second film. A metallized film capacitor characterized by being electrically connected to a vapor deposition film.
基材と、前記フィルム基材の上面に、前記フィルム基材
の一方の側縁に沿って抵抗値１．５〜１０Ω／ｓｑとな
る厚さで帯状に亜鉛を蒸着した接続部と、前記フィルム
基材の上面に、前記接続部から離間して、前記フィルム
基材の長手方向に一定間隔毎に並ぶ矩形状に６〜３０Ω
／ｓｑかつ前記接続部の抵抗値の２〜７倍以上の抵抗値
となる厚さで亜鉛を蒸着した電極部と、前記各電極部と
前記接続部とをそれぞれ導通させる亜鉛蒸着膜製のヒュ
ーズ部とを具備し、前記接続部、前記電極部および前記
ヒューズ部上には、Ｓｉ酸化物，Ｔｉ酸化物，Ｚｒ酸化
物，Ｓｎ酸化物，Ｙ酸化物，またはインジウム錫酸化物
から選択される１種または２種以上の物質が０．１〜１
０ｍｇ／ｍ2 蒸着された保護層が設けられているコンデ
ンサ製造用フィルムを、前記接続部が互いに反対側の端
縁に位置するように２枚重ねて巻回し、この巻回体の両
端にそれぞれ電極を配置することにより、一方の電極を
一方のコンデンサ製造用フィルムの接続部と導通させ、
他方の電極を他方のコンデンサ製造用フィルムの接続部
と導通させたことを特徴とする金属化フィルムコンデン
サ。2. A plastic film base having a constant width and a long length, and a resistance value of 1.5 to 10 Ω / sq on the upper surface of the film base along one side edge of the film base. 6 to 30 Ω in a rectangular shape spaced apart from the connection portion on the upper surface of the film base material and the connection portion formed by vapor-depositing zinc in the thickness of a strip, and arranged at regular intervals in the longitudinal direction of the film base material.
/ Sq and an electrode part in which zinc is vapor-deposited with a thickness that is 2 to 7 times or more the resistance value of the connection part, and a fuse made of a zinc-deposited film for electrically connecting the electrode part and the connection part, respectively. And a Si oxide, a Ti oxide, a Zr oxide, a Sn oxide, a Y oxide, or an indium tin oxide on the connection portion, the electrode portion, and the fuse portion. 0.1 to 1 of 1 or 2 or more substances
0 mg / m 2 A film for capacitor production, which is provided with a vapor-deposited protective layer, is wound in two layers so that the connecting portions are located at the edges on the opposite side to each other. By arranging the electrodes, one of the electrodes is brought into conduction with the connection portion of one of the capacitor manufacturing films,
A metallized film capacitor characterized in that the other electrode is electrically connected to the connection portion of the other film for manufacturing a capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3096293A JPH06244054A (en) | 1993-02-19 | 1993-02-19 | Metallized film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3096293A JPH06244054A (en) | 1993-02-19 | 1993-02-19 | Metallized film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06244054A true JPH06244054A (en) | 1994-09-02 |
Family
ID=12318303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3096293A Pending JPH06244054A (en) | 1993-02-19 | 1993-02-19 | Metallized film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06244054A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996011485A1 (en) * | 1994-10-07 | 1996-04-18 | Honshu Paper Co., Ltd. | Zinc-deposited base material for metallized capacitor and its manufacture |
| JP2009049139A (en) * | 2007-08-17 | 2009-03-05 | Nichicon Corp | Metallized film capacitor |
| JP2010062410A (en) * | 2008-09-05 | 2010-03-18 | Panasonic Corp | Metalized film capacitor |
| JP2017037956A (en) * | 2015-08-10 | 2017-02-16 | トヨタ自動車株式会社 | Metalized film capacitor |
| KR20190071975A (en) * | 2017-12-15 | 2019-06-25 | 성문전자주식회사 | A deposition film for a film capacitor in which a single zinc layer is deposited |
-
1993
- 1993-02-19 JP JP3096293A patent/JPH06244054A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996011485A1 (en) * | 1994-10-07 | 1996-04-18 | Honshu Paper Co., Ltd. | Zinc-deposited base material for metallized capacitor and its manufacture |
| US5719741A (en) * | 1994-10-07 | 1998-02-17 | Oji Paper Co., Ltd. | Zinc-deposited base material for metallized capacitors and method of manufacture thereof |
| JP2009049139A (en) * | 2007-08-17 | 2009-03-05 | Nichicon Corp | Metallized film capacitor |
| JP2010062410A (en) * | 2008-09-05 | 2010-03-18 | Panasonic Corp | Metalized film capacitor |
| JP2017037956A (en) * | 2015-08-10 | 2017-02-16 | トヨタ自動車株式会社 | Metalized film capacitor |
| KR20190071975A (en) * | 2017-12-15 | 2019-06-25 | 성문전자주식회사 | A deposition film for a film capacitor in which a single zinc layer is deposited |
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