JPH0623329B2 - Insulating paint composition - Google Patents
Insulating paint compositionInfo
- Publication number
- JPH0623329B2 JPH0623329B2 JP59236635A JP23663584A JPH0623329B2 JP H0623329 B2 JPH0623329 B2 JP H0623329B2 JP 59236635 A JP59236635 A JP 59236635A JP 23663584 A JP23663584 A JP 23663584A JP H0623329 B2 JPH0623329 B2 JP H0623329B2
- Authority
- JP
- Japan
- Prior art keywords
- varnish
- soldering
- coating film
- unsaturated polyester
- plasticizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、小形電気機器用含浸ワニスとして使用する絶
縁塗料組成物に関するものである。The present invention relates to an insulating coating composition used as an impregnating varnish for small electric devices.
小形電気機器用含浸ワニスとして、従来から溶剤型及び
無溶剤型ワニスが使用されている。しかるに、小形電気
機器は、このワニス処理のあとで半田付け作業を行なう
ことが多い。このような場合には通常次の前準備のため
の作業が行われる。Solvent-type and solvent-free varnishes have been conventionally used as impregnating varnishes for small electric devices. However, small electric appliances are often soldered after this varnish treatment. In such a case, the following preparatory work is usually performed.
(i)ワニス処理前に、半田付け部分にマスキングし、半
田付け部分へワニスが塗られないようにする。(i) Before the varnish treatment, mask the soldered part so that the varnish is not applied to the soldered part.
(ii)ワニス処理後の半田付け部分の塗膜を次の２法のい
ずれかで除去する。(ii) The coating film on the soldered portion after the varnish treatment is removed by one of the following two methods.
(イ)機械的除法：焼成、引つ掻き、サンドペーパー処
理、 (ロ)化学的除法：強酸・強アルカリによる溶解、膨潤処
理、 〔発明が解決しようとする問題点〕 しかるに、上記(i)の方法にはマスキングのための手間
がかかり、またこのマスキングは塗膜の空白部分をつく
るわけであるから、位置がずれたり必要以上にマスキン
グが施こされたりした場合は、その補修にも手間がかか
る。又、上記(ii)の方法も（イ）（ロ）いずれも手間が
かかり、量産に支障を来たすという問題があつた。(A) Mechanical removal method: baking, scratching, sandpaper treatment, (b) Chemical removal method: dissolution with strong acid / strong alkali, swelling treatment, [problems to be solved by the invention] However, the above (i) This method requires masking work, and since this masking creates a blank part of the coating film, if the position is misaligned or masking is applied more than necessary, it is also troublesome to repair it. Takes. Further, both the method (ii) and the methods (a) and (b) are troublesome, which causes a problem in mass production.
上記の問題が起こるのは、従来の含浸ワニスとしての溶
剤型及び無溶剤型ワニスの硬化乾燥塗膜が、半田付け温
度（240〜320℃）で焦げたり、軟化して糜爛状を呈する
からである。The above problem occurs because the cured dry coating film of the solvent-type and solvent-free type varnishes as the conventional impregnating varnish is burnt at the soldering temperature (240 to 320 ° C.), or softens and exhibits a vermicular shape. is there.
そこで、本発明では、従来半田付け作業の前準備のため
の作業として行われていた上記(i)及び(ii)のいずれを
も行なうことなく、半田付け部分の塗膜を半田ごての熱
で容易に除去できるようにするための手段として、無溶
剤型ワニスなかんずく不飽和ポリエステルワニスに可塑
剤を適当量即ち１０〜２０（重量）％の割合で添加する
ことを要旨とするものである。Therefore, in the present invention, without performing any of the above (i) and (ii), which was conventionally performed as a work for preparatory work for soldering, the coating film of the soldering portion is heated by the soldering iron. As a means for facilitating the removal with a solvent, a gist is to add a plasticizer to a solventless varnish, especially an unsaturated polyester varnish in an appropriate amount, that is, a ratio of 10 to 20% by weight.
しかして、本発明で用いる不飽和ポリエステルワニス
は、小型電気機器用含浸ワニスとして適用されているも
ので、例えばユニコート＃７５４（ユニオン化成（株）
製品）が挙げられる。Therefore, the unsaturated polyester varnish used in the present invention is applied as an impregnating varnish for small electric devices, and for example, Unicoat # 754 (Union Kasei Co., Ltd.).
Products).
このものは、不飽和ポリエステル樹脂、分子量２００〜
２０，０００程度、好ましくは３，０００〜２０，００
０程度のもので、下記の成分からなる。This is an unsaturated polyester resin with a molecular weight of 200-
About 20,000, preferably 3,000 to 20,000
It is about 0 and consists of the following components.
なお、上記の例は一例を示したもので必ずしもこの例に
限定するものではなく、他の成分からなる不飽和ポリエ
ステル樹脂であつてもよい。 It should be noted that the above example is an example and is not necessarily limited to this example, and may be an unsaturated polyester resin composed of other components.
次に、本発明で用いることのできる可塑剤としては、Ｄ
ＢＰ（フタル酸ジブチル）、ＤＯＡ（アジピン酸ジオク
チル）、ＴＣＰ（燐酸トリクレジル）、ポリエチレング
リコール、キシレン樹脂、アジピン酸−１，３ブチレン
グリコール、ＤＯＳ（セバチン酸ジオクチル）、ＴＰＰ
（燐酸トリフエニール）等が適用される。Next, as the plasticizer that can be used in the present invention, D
BP (dibutyl phthalate), DOA (dioctyl adipate), TCP (tricresyl phosphate), polyethylene glycol, xylene resin, adipic acid-1,3 butylene glycol, DOS (dioctyl sebacate), TPP
(Triphenyl phosphate) or the like is applied.
次に、本発明において可塑剤の添加配合比率を１０〜２
０重量％としたのは、１０重量％以下では本発明の目的
とする半田付けの熱で塗膜が溶解除去できないからであ
り、また２０重量％を超えると塗膜が軟化し過ぎて強
度、絶縁性等が低下するからである。Next, in the present invention, the addition ratio of the plasticizer is 10 to 2
The reason why the content is 0% by weight is that if the content is 10% by weight or less, the coating film cannot be dissolved and removed by the heat of soldering, which is the object of the present invention. This is because the insulating property and the like are reduced.
以上説明したように、本発明においては不飽和ポリエス
テルからなる含浸ワニス中に、可塑剤を１０〜２０重量
％の割合で添加するので、塗膜のガラス転移点が変化
し、耐熱性が若干低下して半田付けの際の熱によつて塗
膜が容易に溶解し、半田付けに必要な部分だけ除去でき
る。尚、この耐熱性低下と共に塗膜の柔軟性が向上し、
含浸ワニスに求められている本来の作用効果に支障は起
らない。As described above, in the present invention, since the plasticizer is added to the impregnated varnish made of unsaturated polyester in a proportion of 10 to 20% by weight, the glass transition point of the coating film changes and the heat resistance is slightly lowered. Then, the coating film is easily melted by the heat at the time of soldering, and only the portion necessary for soldering can be removed. In addition, the flexibility of the coating film is improved along with this decrease in heat resistance,
The original function and effect required for the impregnated varnish will not be affected.
本発明の実施例を次の第１表に示す。 Examples of the present invention are shown in Table 1 below.
上記第１表の配合表にもとづいて配合、混合して得た不
飽和ポリエステルワニスで浸漬処理したコイルの端子部
分と裸銅線（φ0.35mm）を一定温度に調整した半田浴槽
に５秒間浸し、半田付け可能な温度を、導通及び引張り
試験によつて調べた結果を次の第２表に示した。 The terminal part of the coil and the bare copper wire (φ0.35mm), which was dipped with the unsaturated polyester varnish obtained by blending and mixing according to the blending table in Table 1 above, were dipped in a solder bath adjusted to a constant temperature for 5 seconds. The following Table 2 shows the results of examining the solderable temperature by conducting and pulling tests.
又、上記のワニス浸漬処理コイルの電気特性に体積抵抗
率は次の第３表の如くであつた。 The volume resistivity of the varnish-immersed coil was as shown in Table 3 below.
次の第４表は可塑剤の添加量を変化させた場合の乾燥性
と柔軟性を示す。 The following Table 4 shows the drying property and flexibility when the amount of the plasticizer added was changed.
〔発明の効果〕 本発明の絶縁塗料組成物は、含浸ワニスとして不飽和ポ
リエステルに特定された可塑剤を規定量添加することに
より、半田作業が低温短時間で可能となり、従来行われ
ていた半田付け前準備作業としての半田付け部分へのマ
スキングや塗膜除去が不要となつた。これにより、その
ための手間がかからなくなつたばかりでなく、塗膜の柔
軟性向上などの効果も奏することができた。 [Effects of the Invention] The insulating coating composition of the present invention, by adding a specified amount of the specified plasticizer to the unsaturated polyester as the impregnating varnish, the soldering work can be performed at a low temperature for a short time, and the conventional soldering can be performed. As a preparatory work before soldering, masking of the soldered part and removal of the coating film are not required. This not only saves time and effort, but also has the effect of improving the flexibility of the coating film.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐久間 城治 東京都品川区西五反田３―７―７ ユニオ ン化成株式会社内 (56)参考文献 特開 昭56−50913（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Joji Sakuma 3-7-7 Nishigotanda, Shinagawa-ku, Tokyo Unionion Kasei Co., Ltd. (56) References JP-A-56-50913 (JP, A)
Claims (1)
としてフタル酸ジブチル（ＤＢＰ）、アジピン酸ジオク
チル（ＤＯＡ）、燐酸トリクレジル（ＴＣＰ）、ポリエ
チレングリコール、キシレン樹脂、アジピン酸−１，３
ブチレングリコール、セバチン酸ジオクチル（ＤＯ
Ｓ）、燐酸トリフェニール（ＴＰＰ）より選ばれた少な
くとも１種を１０〜２０重量％添加してなることを特徴
とする絶縁塗料組成物。1. An unsaturated polyester for impregnating varnish, as a plasticizer, dibutyl phthalate (DBP), dioctyl adipate (DOA), tricresyl phosphate (TCP), polyethylene glycol, xylene resin, adipic acid-1,3.
Butylene glycol, dioctyl sebacate (DO
S), 10 to 20% by weight of at least one selected from triphenyl phosphate (TPP), and an insulating coating composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59236635A JPH0623329B2 (en) | 1984-11-12 | 1984-11-12 | Insulating paint composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59236635A JPH0623329B2 (en) | 1984-11-12 | 1984-11-12 | Insulating paint composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61115973A JPS61115973A (en) | 1986-06-03 |
| JPH0623329B2 true JPH0623329B2 (en) | 1994-03-30 |
Family
ID=17003543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59236635A Expired - Fee Related JPH0623329B2 (en) | 1984-11-12 | 1984-11-12 | Insulating paint composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623329B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2536252B2 (en) * | 1990-07-30 | 1996-09-18 | 日本精機株式会社 | Movable magnet type instrument |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650913A (en) * | 1979-10-03 | 1981-05-08 | Asahi Chem Ind Co Ltd | Modified unsaturted polyester resin composition |
| DE3325943C1 (en) * | 1983-07-19 | 1985-02-21 | Herberts Gmbh, 5600 Wuppertal | Resin compounds and their use for the insulation of electrical windings |
-
1984
- 1984-11-12 JP JP59236635A patent/JPH0623329B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61115973A (en) | 1986-06-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |