JPH06224594A - Mounting method for component - Google Patents
Mounting method for componentInfo
- Publication number
- JPH06224594A JPH06224594A JP50A JP1130193A JPH06224594A JP H06224594 A JPH06224594 A JP H06224594A JP 50 A JP50 A JP 50A JP 1130193 A JP1130193 A JP 1130193A JP H06224594 A JPH06224594 A JP H06224594A
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- component
- mounting
- electronic
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品実装機におい
て、プリント基板上の複数装着点に幾通りかの電子部品
の組み合わせが可能な際の部品実装方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method in an electronic component mounting machine when a plurality of electronic components can be combined at a plurality of mounting points on a printed circuit board.
【０００２】[0002]
【従来の技術】近年のＦＭＳ化にともない、自動生産シ
ステムが進んでいる。その結果、電子部品実装の分野に
おいても、高効率な実装が望まれている。2. Description of the Related Art With the recent introduction of FMS, automatic production systems are advancing. As a result, highly efficient mounting is also desired in the field of electronic component mounting.
【０００３】以下、従来の部品実装方法について、図
２，図３，図４を参照しながら説明する。図２は、電子
部品実装機の概略構成図である。４は部品供給部で、複
数の部品供給装置５が取り付けられている。部品供給装
置５には、多数の部品がテープ状に梱包された状態で装
着されている。６はデータ通信部である。部品供給装置
に設けられたメモリ１４から、電子部品の情報を読みと
る。図３は、部品供給装置５と、電子部品実装機のデー
タ通信部６の関連図である。部品供給装置５には、多数
の部品をテープ状に梱包して巻き回した部品リール１５
が装着されており、固定レバー１６にて部品供給テーブ
ルに固定される。また、部品供給装置５には部品リール
１５の電子部品の情報を記憶するメモリ１４が設けられ
ており、データ通信部６は、このメモリから電子部品の
情報を読みとる。以上のように構成された電子部品実装
機において、従来の部品実装の工程を、図４を参照して
説明する。A conventional component mounting method will be described below with reference to FIGS. 2, 3 and 4. FIG. 2 is a schematic configuration diagram of the electronic component mounter. Reference numeral 4 denotes a component supply unit, to which a plurality of component supply devices 5 are attached. A large number of components are mounted on the component supply device 5 in a tape-shaped package. 6 is a data communication unit. Information on electronic components is read from the memory 14 provided in the component supply device. FIG. 3 is a related diagram of the component supply device 5 and the data communication unit 6 of the electronic component mounter. The component supply device 5 includes a component reel 15 in which a large number of components are packed in a tape shape and wound.
Is mounted and fixed to the component supply table by the fixing lever 16. Further, the component supply device 5 is provided with a memory 14 for storing information on electronic components on the component reel 15, and the data communication unit 6 reads information on electronic components from this memory. A conventional component mounting process in the electronic component mounting machine configured as described above will be described with reference to FIG.
【０００４】まず、部品供給装置５の部品リール１５の
交換または、新たな部品リール１５を装着する際、電子
部品の情報として、電子部品の部品形状及び部品名称
を、部品供給装置５のメモリ１４に書き込む（ステップ
＃１１，＃１２）。次に、電子部品実装機においてプリ
ント基板の生産を開始すると、部品供給部４に固定され
た各部品供給装置５をデータ通信部６に順次位置決め
し、部品供給装置５のメモリ１４から各電子部品の情報
を読みとる（ステップ＃１３，＃１４）。次に、電子部
品実装機に予め入力されている、各部品供給装置５に装
着される各電子部品の情報と、ステップ＃１４で部品供
給装置５のメモリ１４から読み取った各電子部品の情報
とを比較し（部品の掛け違いチェック）、一致すれば電
子部品実装機の実装動作を継続する（ステップ＃１５，
＃１６）。また、ステップ＃１５での結果、電子部品の
情報が一致しない場合は、部品供給装置５に所定の部品
リール１５が装着されていないと判断し、電子部品実装
機は、エラーメッセージを表示して停止する（ステップ
＃１７）。ステップ＃１６の次に、プリント基板生産中
に部品供給装置５の部品リール１５が部品切れと判断さ
れた場合（ステップ＃１８）、再度ステップ＃１１に戻
る。次に、ステップ＃１９で生産終了か判断し、終了で
ない場合は再度ステップ＃１６に戻り、繰り返しプリン
ト基板の生産を継続する。First, when the component reel 15 of the component supply device 5 is replaced or a new component reel 15 is mounted, the component shape and the component name of the electronic component are stored in the memory 14 of the component supply device 5 as the information of the electronic component. (Steps # 11, # 12). Next, when the production of the printed circuit board is started in the electronic component mounting machine, each component supply device 5 fixed to the component supply unit 4 is sequentially positioned in the data communication unit 6, and each electronic component is read from the memory 14 of the component supply device 5. Information is read (steps # 13, # 14). Next, information on each electronic component to be mounted on each component supply device 5, which has been input in advance to the electronic component mounter, and information on each electronic component read from the memory 14 of the component supply device 5 in step # 14. Are compared (check the crossing of parts), and if they match, the mounting operation of the electronic component mounter is continued (step # 15,
# 16). If the electronic component information does not match as a result of step # 15, it is determined that the predetermined component reel 15 is not mounted on the component supply device 5, and the electronic component mounter displays an error message. Stop (step # 17). After step # 16, when it is determined that the component reel 15 of the component supply device 5 is out of components during production of the printed circuit board (step # 18), the process returns to step # 11 again. Next, in step # 19, it is determined whether the production is finished. If it is not finished, the process returns to step # 16, and the production of the printed circuit board is repeated.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
ような部品実装方法では、例えば、ブリッジ回路の基板
を生産する際、それぞれの装着点に抵抗値の異なる電子
部品の組み合わせが、可能な場合などのプリント基板上
の複数装着点に幾通りかの電子部品の組み合わせが可能
な際や、ある一ヵ所の装着点に電気特性は同様なら、精
度が異なる電子部品も使用可能な場合や、電気特性及び
精度が同様なら他メーカの電子部品も使用可能な場合な
ど、プリント基板上の特定装着点一ヵ所に対して、幾通
りかの電子部品の組み合わせが可能な際には、電子部品
の組み合わせを変更する度に、部品の掛け違いチェック
で所定の部品でないと判断されるため、電子部品実装機
を停止させて、電子部品実装機に予め入力されている各
部品供給装置５に装着される各電子部品の情報を、再度
入力し直さなければならないという問題があった。However, in the component mounting method as described above, for example, when a board of a bridge circuit is produced, it is possible to combine electronic components having different resistance values at respective mounting points. When several electronic parts can be combined at multiple mounting points on the printed circuit board, or if the electrical characteristics are the same at one mounting point, electronic components with different accuracy can also be used, If the electronic components of other manufacturers can be used as long as the accuracy is the same, and several combinations of electronic components are possible for one specific mounting point on the printed circuit board, the electronic components must be combined. Each time it is changed, it is determined that the component is not the predetermined component by checking the crossing of the components, so the electronic component mounter is stopped and each component supply device 5 previously input to the electronic component mounter is stopped. The information of each electronic component to be deposited, there is a problem that must be re-entered again.
【０００６】本発明は、上記問題点を解決するもので、
電子部品の組み合わせを変更しても電子部品実装機を停
止さすことなく実装動作を継続し、高効率な実装を実現
する部品実装方法を提供することを目的とする。The present invention solves the above problems.
An object of the present invention is to provide a component mounting method that realizes highly efficient mounting by continuing the mounting operation without stopping the electronic component mounting machine even when the combination of electronic components is changed.
【０００７】[0007]
【課題を解決するための手段】上記問題点を解決するた
めに本発明は、実装作業開始前にプリント基板の複数の
装着点に実装可能な、電子部品の組み合わせを、予め電
子部品実装機に教示する工程と、部品供給装置に取り付
けられる電子部品の情報を、各部品供給装置に設けられ
たメモリに書き込む工程と、実装時に各電子部品の情報
をメモリから読みとる工程と、読み取った各電子部品の
情報と予め電子部品実装機に教示しているプリント基板
の複数の装着点に実装可能な、電子部品の組み合わせの
情報と比較する工程とを備えたものである。In order to solve the above-mentioned problems, the present invention provides a combination of electronic components which can be mounted at a plurality of mounting points of a printed circuit board before starting mounting work, to an electronic component mounting machine in advance. Teaching process, writing information of electronic components attached to the component supplying device in a memory provided in each component supplying device, reading information of each electronic component from the memory during mounting, and reading each electronic component And a step of comparing with information of a combination of electronic components which can be mounted at a plurality of mounting points of a printed circuit board which is taught to the electronic component mounting machine in advance.
【０００８】[0008]
【作用】本発明は、上記した工程によって、プリント基
板の複数の装着点に実装可能な、電子部品の組み合わせ
を、予め電子部品実装機に教示するため、電子部品の組
み合わせを変更する際、電子部品実装機を停止させて、
電子部品の情報を再度入力することがなくなり、高効率
な実装を実現することができる。According to the present invention, since the electronic component mounting machine is taught in advance the combination of electronic components that can be mounted at a plurality of mounting points on the printed circuit board by the above-mentioned steps, when changing the combination of electronic components, Stop the component mounter,
It is possible to realize highly efficient mounting without inputting information of electronic components again.
【０００９】[0009]
【実施例】以下、本発明の一実施例の部品実装方法につ
いて、図１，図２，図３を参照しながら説明する。図
２，図３についての説明は、上記従来例における説明を
引用し、ここでは省略する。図２，図３のように構成さ
れた電子部品実装機において、プリント基板上の複数装
着点に幾通りかの電子部品の組み合わせが可能な際の部
品実装方法について、図１のフローチャートを参照して
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting method according to an embodiment of the present invention will be described below with reference to FIGS. The description of FIGS. 2 and 3 is based on the description of the conventional example described above, and is omitted here. The electronic component mounter configured as shown in FIGS. 2 and 3 is referred to the flowchart of FIG. 1 for the component mounting method when it is possible to combine several electronic components at a plurality of mounting points on the printed circuit board. Explain.
【００１０】まず、電子部品実装機に予め、プリント基
板の複数装着点に実装可能な電子部品の組み合わせを複
数通り教示する（ステップ＃１）。次に、部品供給装置
５の部品リール１５の交換または、新たな部品リール１
５を装着する際、電子部品の情報として、電子部品の部
品形状及び部品名称を、部品供給装置５のメモリ１４に
書き込む（ステップ＃２，＃３）。次に、電子部品実装
機においてプリント基板の生産を開始すると、部品供給
部４に固定された各部品供給装置５をデータ通信部６に
順次位置決めし、部品供給装置５のメモリ１４から各電
子部品の情報を読みとる（ステップ＃４，＃５）。次
に、電子部品実装機に予め入力されている、プリント基
板の複数装着点に実装可能な、複数通りの電子部品の組
み合わせの情報と、ステップ＃５で部品供給装置５のメ
モリ１４から読み取った各電子部品の情報とを複数通り
分比較し、一致した時点で、電子部品実装機の実装動作
を継続させる（ステップ＃６，＃７）。一致しない場合
は、電子部品実装機をエラー停止させる（ステップ＃
８）。次に、プリント基板生産中に部品供給装置５の部
品リール１５が部品切れと判断された場合（ステップ＃
９）、再度ステップ＃２に戻る。次に、ステップ＃１０
で生産終了か判断し、終了でない場合は再度ステップ＃
７に戻り、繰り返しプリント基板の生産を継続する。First, a plurality of combinations of electronic components that can be mounted at a plurality of mounting points on a printed circuit board are taught to the electronic component mounting machine in advance (step # 1). Next, the component reel 15 of the component supply device 5 is replaced or a new component reel 1
When mounting the component 5, the component shape and the component name of the electronic component are written in the memory 14 of the component supply device 5 as the information of the electronic component (steps # 2, # 3). Next, when the production of the printed circuit board is started in the electronic component mounting machine, each component supply device 5 fixed to the component supply unit 4 is sequentially positioned in the data communication unit 6, and each electronic component is read from the memory 14 of the component supply device 5. Information is read (steps # 4, # 5). Next, information of a combination of a plurality of electronic components that can be mounted at a plurality of mounting points on the printed circuit board, which is input in advance in the electronic component mounting machine, and read from the memory 14 of the component supply device 5 in step # 5. The information of each electronic component is compared in a plurality of ways, and when they match, the mounting operation of the electronic component mounting machine is continued (steps # 6 and # 7). If they do not match, stop the electronic component mounter with an error (step #
8). Next, when it is determined that the component reel 15 of the component supply device 5 is out of components during the production of the printed circuit board (step #
9) and returns to step # 2 again. Next, Step # 10
To determine if production is finished, and if not, step again #
Return to 7 and continue production of printed circuit boards repeatedly.
【００１１】以上のように本実施例によれば、プリント
基板上の複数装着点に幾通りかの電子部品の組み合わせ
が可能な際や、プリント基板上の特定装着点一ヵ所に対
して、幾通りかの電子部品の組み合わせが可能な際に
は、予め電子部品実装機に実装可能な電子部品の組み合
わせを教示するため、部品の掛け違いチェックで、メモ
リ１４から読みとった電子部品の情報と必ず一致する。
また、電子部品の組み合わせを変更する際、電子部品実
装機を停止させて、電子部品の情報を再度入力すること
がなくなり、高効率な実装が実現できる。As described above, according to this embodiment, when several kinds of electronic parts can be combined at a plurality of mounting points on the printed circuit board, or at a specific mounting point on the printed circuit board, the number of electronic parts can be changed. When it is possible to combine several electronic components, the electronic component mounter is instructed in advance about the combinations of electronic components that can be mounted. Therefore, it is necessary to check the information on the electronic components read from the memory 14 by checking the crossing of the components. Match.
Further, when changing the combination of electronic components, it is not necessary to stop the electronic component mounting machine and input the information of the electronic components again, so that highly efficient mounting can be realized.
【００１２】[0012]
【発明の効果】以上のように本発明は、実装作業開始前
にプリント基板の複数の装着点に実装可能な、電子部品
の組み合わせを、予め電子部品実装機に教示する工程
と、部品供給装置に取り付けられる電子部品の情報を、
各部品供給装置に設けられたメモリに書き込む工程と、
実装時に各電子部品の情報をメモリから読みとる工程
と、読み取った各電子部品の情報と予め電子部品実装機
に教示しているプリント基板の複数の装着点に実装可能
な、電子部品の組み合わせの情報と比較する工程とを備
えているので、プリント基板上の複数装着点に幾通りか
の電子部品の組み合わせが可能な際や、プリント基板上
の特定装着点一ヵ所に対して、幾通りかの電子部品の組
み合わせが可能な際において、電子部品の組み合わせを
変更する際、電子部品実装機を停止させて、電子部品の
情報を再度入力することがなくなり、高効率で高稼働な
部品実装が実現できる生産性の向上が図れる。As described above, according to the present invention, the step of teaching the electronic component mounting machine in advance a combination of electronic components which can be mounted at a plurality of mounting points on the printed circuit board before the mounting work is started, and the component supply device. Information about the electronic components attached to
Writing to a memory provided in each component supply device,
The process of reading the information of each electronic component from the memory at the time of mounting, the information of each electronic component read, and the information of the combination of electronic components that can be mounted at a plurality of mounting points of the printed circuit board that is taught to the electronic component mounting machine in advance. Since it is equipped with a process for comparison with, it is possible to combine several electronic components at multiple mounting points on the printed circuit board, or at several specific mounting points on the printed circuit board. When it is possible to combine electronic components, when changing the combination of electronic components, it is not necessary to stop the electronic component mounting machine and input the information of the electronic components again, realizing highly efficient and highly efficient component mounting. The productivity can be improved.
【図１】本発明の一実施例における部品実装方法のフロ
ーチャートFIG. 1 is a flowchart of a component mounting method according to an embodiment of the present invention.
【図２】同実施例における電子部品実装機の斜視図FIG. 2 is a perspective view of an electronic component mounting machine according to the embodiment.
【図３】同実施例における部品供給装置の正面図FIG. 3 is a front view of the component supply device according to the embodiment.
【図４】従来の部品実装方法のフローチャートFIG. 4 is a flowchart of a conventional component mounting method.
４ 部品供給部 ５ 部品供給装置 ６ データ通信部 １４ メモリ １５ 部品リール １６ 固定レバー 4 parts supply part 5 parts supply device 6 data communication part 14 memory 15 parts reel 16 fixed lever
Claims (1)
装着点に実装可能な電子部品の組み合わせを予め電子部
品実装機に教示する工程と、部品供給装置に取り付けら
れる電子部品の情報を、各部品供給装置に設けられたメ
モリに書き込む工程と、実装時に各電子部品の情報をメ
モリから読みとる工程と、読み取った各電子部品の情報
と予め電子部品実装機に教示しているプリント基板の複
数の装着点に実装可能な電子部品の組み合わせの情報と
比較する工程を有する部品実装方法。1. A process of teaching a combination of electronic components mountable at a plurality of mounting points of a printed circuit board to an electronic component mounter in advance before starting mounting work, and information of electronic components attached to a component supply device, A step of writing in a memory provided in the component supply device, a step of reading information of each electronic component from the memory at the time of mounting, a plurality of information of each electronic component read and a plurality of printed circuit boards taught to the electronic component mounting machine in advance. A component mounting method including a step of comparing with information of a combination of electronic components mountable at a mounting point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01130193A JP3326840B2 (en) | 1993-01-27 | 1993-01-27 | Component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01130193A JP3326840B2 (en) | 1993-01-27 | 1993-01-27 | Component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06224594A true JPH06224594A (en) | 1994-08-12 |
| JP3326840B2 JP3326840B2 (en) | 2002-09-24 |
Family
ID=11774178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01130193A Expired - Lifetime JP3326840B2 (en) | 1993-01-27 | 1993-01-27 | Component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3326840B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7181307B2 (en) | 2002-03-18 | 2007-02-20 | Fuji Machine Mfg. Co., Ltd. | Electronic circuit component mounting system, mounting control program, and system to prevent erroneous setting of electronic circuit components |
-
1993
- 1993-01-27 JP JP01130193A patent/JP3326840B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7181307B2 (en) | 2002-03-18 | 2007-02-20 | Fuji Machine Mfg. Co., Ltd. | Electronic circuit component mounting system, mounting control program, and system to prevent erroneous setting of electronic circuit components |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3326840B2 (en) | 2002-09-24 |
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