JPH0621163A - Ultrasonic horn for wire bonder - Google Patents
Ultrasonic horn for wire bonderInfo
- Publication number
- JPH0621163A JPH0621163A JP4178216A JP17821692A JPH0621163A JP H0621163 A JPH0621163 A JP H0621163A JP 4178216 A JP4178216 A JP 4178216A JP 17821692 A JP17821692 A JP 17821692A JP H0621163 A JPH0621163 A JP H0621163A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- flange
- horn
- guide surface
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体製造装置に関し、
特にワイヤボンディングに用いられる超音波ホ−ンに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus,
Particularly, it relates to an ultrasonic horn used for wire bonding.
【０００２】[0002]
【従来の技術】ウェハプロセスの微細加工技術の進歩に
より、小面積のチップで大規模に集積されたＬＳＩチッ
プが開発されており、高集積化に伴い多ピンの入出力端
子が必要となる。小面積のチップに入出力端子、即ちパ
ッド電極を多数配置するには、微細パッド電極を微細ピ
ッチに形成しなければならない。従って、微細なパッド
電極にワイヤをボンディングするには精密なボンディン
グ技術が要求される。ワイヤボンディング技術の一つ
に、超音波を利用してワイヤとパッド電極との接続を行
う超音波ボンディング方法があり、超音波ホ−ンを用い
てワイヤボンディングが行われる。2. Description of the Related Art Due to advances in fine processing technology of wafer processes, large-scale integrated LSI chips with small area chips have been developed, and multi-pin input / output terminals are required as the integration becomes higher. To arrange a large number of input / output terminals, that is, pad electrodes on a chip having a small area, it is necessary to form fine pad electrodes at a fine pitch. Therefore, a precise bonding technique is required to bond the wire to the fine pad electrode. One of the wire bonding techniques is an ultrasonic bonding method of connecting a wire and a pad electrode by using ultrasonic waves, and the wire bonding is performed by using an ultrasonic horn.
【０００３】図２より超音波ホ−ンの詳細について説明
する。同図（ａ）は超音波ホ−ンの構成を示す概略図で
あり、特に取付け部分のみ断面を表している。超音波ホ
−ンは、電歪現象を利用した円板状の振動子部２１と、
超音波振動によって発生された振幅を機械的に増幅する
ホ−ン部２２とからなる。ホ−ン部２２にはそれを支持
固定するためのフランジ２３が形成され、ホ−ン部２２
とフランジ２３とは振動板２４を介して連結されてお
り、ホ−ン部２２の先端にはボンディングツ−ル２５が
取り付けボルト（図示せず）により取り付けられてい
る。また、フランジ２３は割スリ−ブ２６を介して固定
ネジ２７を用いて締付けることにより、図示しない駆動
源により支軸２８を中心に揺動するホルダ２９に固定さ
れる。The details of the ultrasonic horn will be described with reference to FIG. FIG. 3A is a schematic view showing the configuration of the ultrasonic horn, and particularly shows only the mounting portion in cross section. The ultrasonic horn includes a disk-shaped vibrator portion 21 utilizing an electrostriction phenomenon,
The horn portion 22 mechanically amplifies the amplitude generated by the ultrasonic vibration. The horn portion 22 is formed with a flange 23 for supporting and fixing the horn portion 22.
The flange 23 and the flange 23 are connected to each other via a vibration plate 24, and a bonding tool 25 is attached to the tip of the horn portion 22 with an attachment bolt (not shown). Further, the flange 23 is fixed to a holder 29 that swings around a support shaft 28 by a drive source (not shown) by tightening with a fixing screw 27 via a split sleeve 26.
【０００４】ここで、同図（ｂ）の振動分布図に示すよ
うに、振動子部２１で発生した振幅は節３０において振
幅が０となりボンディングツ−ル２５の位置においてほ
ぼ最大となる。そのため、ホ−ン部２２の形状（断面、
長さ等）は最適値に設計されており、振幅が０となる節
３０の位置に振動板２４が設けられている。Here, as shown in the vibration distribution diagram of FIG. 2B, the amplitude generated in the vibrator portion 21 becomes zero at the node 30, and becomes maximum at the position of the bonding tool 25. Therefore, the shape of the horn portion 22 (cross section,
The length 24) is designed to be an optimum value, and the diaphragm 24 is provided at the position of the node 30 where the amplitude becomes 0.
【０００５】次に、同図（ｃ）よりホ−ン部２２のホル
ダ２９への固定を詳細に示す。同図（ｃ）はボンディン
グツ−ル２５側からみた側面図である。ホ−ン部２２つ
まりフランジ２３は固定ネジ２７により割スリ−ブ２６
を介して直径方向に力を加えることによりホルダ２９に
固定される。割スリ−ブ２６の形状は開口部３１を有す
る円形であり、２本の固定ネジ２７により割スリ−ブ２
６を締付けている。ところで、ホルダ２９に固定する際
に重要なことは、ホ−ン部２２つまりフランジ２３がホ
ルダ２９の一部に偏ることなく均一に固定することであ
る。従って、固定ネジ２７により割スリ−ブ２６を締付
ける際に、節３０を中心とすれば割スリ−ブ２６の開口
部３１の位置が固定ネジ２７と垂直になるようにしなけ
ればならない。例えば開口部３１の位置が固定ネジ２７
の延長線方向にあった場合、割スリ−ブ２６を締付ける
効果はほとんどないことからも、割スリ−ブ２６の方向
に相当の注意を必要とする。Next, the fixing of the horn portion 22 to the holder 29 will be described in detail with reference to FIG. FIG. 3C is a side view seen from the bonding tool 25 side. The horn portion 22, that is, the flange 23, is divided by the fixing screw 27 into the split sleeve 26.
It is fixed to the holder 29 by applying a force in the diametrical direction via. The split sleeve 26 has a circular shape having an opening 31, and the two split screws 27 are used to divide the split sleeve 2.
6 is tightened. By the way, what is important when fixing to the holder 29 is that the horn portion 22, that is, the flange 23 is uniformly fixed without being biased to a part of the holder 29. Therefore, when tightening the split sleeve 26 with the fixing screw 27, the position of the opening 31 of the split sleeve 26 must be perpendicular to the fixing screw 27 with the node 30 as the center. For example, the position of the opening 31 may be the fixing screw 27.
In the direction of the extension line, the effect of tightening the split sleeve 26 is almost negligible, so that great care must be taken in the direction of the split sleeve 26.
【０００６】また同図（ｃ）の変形例として、同図
（ｄ）に示されるような割ホルダ３２により固定するこ
ともできる。しかし、割スリ−ブ２６の開口部３１を割
ホルダ３２の開口部３３の延長線上に位置させることが
必要であり、いずれにしても割スリ−ブ２６の方向が問
題となる。Further, as a modified example of FIG. 6C, it is also possible to fix the split holder 32 as shown in FIG. However, it is necessary to position the opening 31 of the split sleeve 26 on the extension line of the opening 33 of the split holder 32, and in any case, the direction of the split sleeve 26 becomes a problem.
【０００７】その上、同図（ｃ）及び（ｄ）のいずれに
おいても超音波振動特性、例えばインピ−ダンス、位相
及び振幅等は、固定ねじの本数及び締付トルク等による
フランジ２３への応力により著しく変化する。そのた
め、締付トルク等を管理しなければならない。In addition, in both of the figures (c) and (d), ultrasonic vibration characteristics such as impedance, phase and amplitude are stresses to the flange 23 due to the number of fixing screws and tightening torque. Change significantly. Therefore, tightening torque etc. must be managed.
【０００８】これまでホ−ン部２２つまりフランジ２３
をホルダ２９に固定する際の直径方向の調整に関し説明
したが、更に軸方向及び回転方向に関しても各々固定す
る位置を調整する必要がある。軸方向の位置とはホ−ン
部２２つまりフランジ２３とホルダ２９との噛み合う位
置であり、回転方向の位置とはホ−ン部２２が円筒状で
あるがゆえボンディングツ−ル２５を真下方向にするよ
うにする位置である。しかしながら、軸方向及び回転方
向に関する位置規制がないため固定は容易でない。従っ
て、ホ−ン部２２つまりフランジ２３をホルダ２９に固
定するには、直径方向、軸方向及び回転方向すべてに調
整が必要であるため、取付精度の保証が困難であり調整
に熟練した技術と多大な時間を必要とする。Up to now, the horn portion 22, that is, the flange 23
Although the adjustment in the diametrical direction when fixing the holder to the holder 29 has been described, it is necessary to further adjust the fixing positions in the axial direction and the rotating direction. The axial position is the position where the horn portion 22, that is, the flange 23 and the holder 29 mesh with each other, and the rotational position is the position where the horn portion 22 is cylindrical because the horn portion 22 is directly downward. This is the position where However, fixing is not easy because there is no position restriction in the axial direction and the rotation direction. Therefore, in order to fix the horn portion 22, that is, the flange 23 to the holder 29, it is necessary to make adjustments in all of the diametrical direction, the axial direction, and the rotational direction. It takes a lot of time.
【０００９】また、ワイヤボンディングの接合信頼性は
超音波振動特性に影響され、しかもパッド電極が微細に
なるほど上記接合信頼性の重要度は増している。しか
し、取付精度により超音波振動特性が著しく変化するた
め、上記接合信頼性を保証することは困難である。Also, the bonding reliability of wire bonding is influenced by the ultrasonic vibration characteristics, and the bonding reliability becomes more important as the pad electrode becomes finer. However, it is difficult to guarantee the above-mentioned joining reliability because the ultrasonic vibration characteristics significantly change depending on the mounting accuracy.
【００１０】[0010]
【発明が解決しようとする課題】上述のような超音波ホ
−ンは、ホ−ン部を固定ネジにより割スリ−ブを介して
直径方向に力をくわえることによりホルダに固定され
る。固定の際に、直径方向に関しては割スリ−ブの方向
及び固定ネジの締付トルク等を、軸方向及び回転方向に
関しては取付け位置を調整する必要がある。しかしなが
ら、それらの調整は熟練した技術と多大な時間を必要と
するため、常に一定した取付精度の保証は困難であり、
超音波振動特性ひいてはボンディングの接合信頼性にバ
ラツキが生じる。つまり、ワイヤボンディングの接合信
頼性を向上するためにも超音波ホ−ンの取付精度を向上
することが重要である。The ultrasonic horn as described above is fixed to the holder by holding the horn portion in the diametrical direction through the split sleeve with the fixing screw. At the time of fixing, it is necessary to adjust the direction of the split sleeve and the tightening torque of the fixing screw in the diametrical direction, and the mounting position in the axial direction and the rotating direction. However, since those adjustments require skillful skill and a great deal of time, it is difficult to guarantee a constant mounting accuracy.
Variations in ultrasonic vibration characteristics and thus in bonding reliability of bonding occur. That is, it is important to improve the mounting accuracy of the ultrasonic horn in order to improve the bonding reliability of wire bonding.
【００１１】それ故に、本発明は、複雑な調整を要する
ことなく容易に取付けることができると共に、安定した
超音波振動特性を有するワイヤボンダ用超音波ホ−ンを
提供することを目的とする。Therefore, an object of the present invention is to provide an ultrasonic horn for a wire bonder which can be easily installed without requiring complicated adjustment and has stable ultrasonic vibration characteristics.
【００１２】[0012]
【課題を解決するための手段】本発明によるワイヤボン
ダ用超音波ホ−ンは、少なくともフランジ構造の取付け
部を有するホ−ン部と該ホ−ン部を固定するホルダとか
らなる。上記取付け部はホ−ン部をホルダに固定する際
に直径方向、軸方向及び回転方向それぞれの位置決めを
するガイド面を有するフランジ構造である。An ultrasonic horn for a wire bonder according to the present invention comprises at least a horn portion having a mounting portion having a flange structure and a holder for fixing the horn portion. The mounting part has a flange structure having guide surfaces for positioning in the diametrical direction, the axial direction and the rotational direction when the horn part is fixed to the holder.
【００１３】[0013]
【作用】上述のように直径方向、軸方向及び回転方向そ
れぞれにガイド面を有するフランジ構造のため、ホ−ン
部とホルダとは三方向毎に位置決めがなされて取付けら
れる。従って、三方向のバランスを複雑に調整すること
なく容易に取付けることが可能である。また、常に安定
した取付精度となるため、安定した超音波振動によりワ
イヤボンディングすることでき、ワイヤボンディングの
接合信頼性を向上することが可能である。As described above, because of the flange structure having the guide surfaces in the diametrical direction, the axial direction and the rotational direction, the horn portion and the holder are positioned and mounted in every three directions. Therefore, it is possible to easily mount the device without complicated adjustment of the balance in the three directions. Further, since the mounting accuracy is always stable, the wire bonding can be performed by the stable ultrasonic vibration, and the bonding reliability of the wire bonding can be improved.
【００１４】[0014]
【実施例】以下、本発明による一実施例を図１を参照し
て説明する。同図（ａ）は超音波ホ−ンの構成を示し特
に取付け部分のみ断面を表す概略図であり、同図（ｂ）
はボンディングツ−ル側からみた側面図である。超音波
ホ−ンは円板状の振動子部１とホ−ン部２とから構成さ
れる。ホ−ン部２にはホ−ン部２を支持固定するための
フランジ３が形成され、ホ−ン部２とフランジ３とは超
音波振動の振幅が０となる節４の位置において振動板５
により連結されており、ホ−ン部２の先端にはボンディ
ングツ−ル６が取り付けボルト（図示しない）により取
り付けられている。ホ−ン部２つまりフランジ３は図示
しない駆動源により支軸７を中心に揺動するホルダ８に
固定される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to FIG. FIG. 2A is a schematic view showing the structure of the ultrasonic horn, and particularly showing a cross section of only the mounting portion, and FIG.
FIG. 6 is a side view seen from the bonding tool side. The ultrasonic horn comprises a disc-shaped vibrator portion 1 and a horn portion 2. The horn portion 2 is formed with a flange 3 for supporting and fixing the horn portion 2, and the horn portion 2 and the flange 3 have a diaphragm at a position of a node 4 where the amplitude of ultrasonic vibration is zero. 5
The bonding tool 6 is attached to the tip of the horn portion 2 by an attachment bolt (not shown). The horn portion 2, that is, the flange 3 is fixed to a holder 8 which swings around a support shaft 7 by a drive source (not shown).
【００１５】ここで、フランジ３の形状を以下に示す。
フランジ３は直径方向にガイドする直径方向ガイド面９
と、軸方向にガイドする軸方向ガイド面１０及び回転方
向にガイドする回転方向ガイド面１１（同図（ｂ））を
有している。但し、直径方向ガイド面９はホルダ８の内
面と接する面であり、軸方向ガイド面１０はホルダ８の
外壁と接する面であり、回転方向ガイド面１１は軸方向
ガイド面に設けられ長穴となっている。そして、直径方
向ガイド面９はホルダ８の内側の直径寸法Ｄ、軸方向ガ
イド面１０はボンディングツ−ル６からの長さ寸法Ｌ、
回転方向ガイド面１１はボンディングツ−ル６方向との
角度寸法θで各々公差面で制約関係にある。また、フラ
ンジ３及びホルダ８には軸方向に複数個、例えば３個の
取付け穴１２が設けられている。The shape of the flange 3 is shown below.
The flange 3 is a diametrical guide surface 9 that guides diametrically.
And an axial guide surface 10 that guides in the axial direction and a rotational guide surface 11 (the same figure (b)) that guides in the rotational direction. However, the diametrical guide surface 9 is a surface in contact with the inner surface of the holder 8, the axial guide surface 10 is a surface in contact with the outer wall of the holder 8, and the rotation direction guide surface 11 is a slot provided in the axial guide surface. Has become. The diametrical guide surface 9 is the diameter dimension D inside the holder 8, the axial guide surface 10 is the length dimension L from the bonding tool 6,
The rotation direction guide surface 11 has an angular dimension θ with respect to the bonding tool 6 direction, and each tolerance surface has a restriction relationship. Further, the flange 3 and the holder 8 are provided with a plurality of, for example, three mounting holes 12 in the axial direction.
【００１６】次に、このような形状のフランジ３を有す
るホ−ン部２のホルダ８への固定方法を示す。ホルダ８
に設けられたピン１３に回転方向ガイド面１１を合わせ
るようにフランジ３をホルダ８にはめ込み、複数個の取
付け穴１２にボルト１４等で固定する。ボルト１４等は
軸方向に設けられているため、直径方向からの締付けに
よる過大な応力はかかることなくホルダ８に固定され
る。Next, a method of fixing the horn portion 2 having the flange 3 having such a shape to the holder 8 will be described. Holder 8
The flange 3 is fitted into the holder 8 so that the rotation direction guide surface 11 is aligned with the pin 13 provided on the holder 8, and is fixed to the plurality of mounting holes 12 with bolts 14 or the like. Since the bolts 14 and the like are provided in the axial direction, the bolts 14 and the like are fixed to the holder 8 without being subjected to excessive stress due to tightening in the diametrical direction.
【００１７】以上のような直径、軸及び回転方向に各々
ガイド面（９、１０、１１）を有する形状のフランジ３
とすることにより、各方向毎に取付精度が保証される。
従って、固定時にそれら三方向のバランスがとれるよう
に取付状態の調整をする必要はないため、容易に一定の
取付精度を保つことができ、常に安定した超音波振動特
性を示すことができる。よって、図１に示す構造の超音
波ホ−ンによれば、ワイヤボンディングの接合信頼性を
保証することが可能である。The flange 3 having the shape having the guide surfaces (9, 10, 11) in the diameter, the axis and the rotation direction as described above.
As a result, the mounting accuracy is guaranteed for each direction.
Therefore, since it is not necessary to adjust the mounting state so as to balance the three directions when fixing, it is possible to easily maintain a certain mounting precision and always show stable ultrasonic vibration characteristics. Therefore, according to the ultrasonic horn having the structure shown in FIG. 1, it is possible to guarantee the bonding reliability of wire bonding.
【００１８】なお、本実施例では回転方向ガイド面１１
を円周方向の長穴としているが丸穴とすることも可能で
あり、つまりフランジ３の回転方向を位置制御するため
にホルダ８に設けられたピン１３等に適応した形状であ
れば長穴または丸穴いずれの形状でも問わない。In this embodiment, the rotation direction guide surface 11 is used.
Is a circular long hole, but it may be a round hole, that is, a long hole having a shape adapted to the pin 13 or the like provided on the holder 8 for positionally controlling the rotational direction of the flange 3. Alternatively, any shape of a round hole does not matter.
【００１９】[0019]
【発明の効果】本発明による超音波ホ−ンによれば、フ
ランジが直径、軸及び回転方向に対しホルダに対する位
置規制となるガイド面を有する構造であるため、容易に
ホルダに取り付けることができる。また、軸方向にフラ
ンジをホルダにボルト等により固定することにより、割
スリ−ブは必要でない。割スリ−ブを用いることにより
要求される特有の調整作業を省くことができ、熟練した
技術を要せずかつ高精度な超音波ホ−ンを提供すること
ができる。従って、上記機構の超音波ホ−ンによれば安
定した超音波振動によるワイヤボンディングが可能であ
るため、ワイヤボンディングの接合信頼性を大幅に向上
させることができ、微細パッドのワイヤボンディングに
おいて十分に対応できる。According to the ultrasonic horn of the present invention, since the flange has the structure that has the guide surface for restricting the position with respect to the holder with respect to the diameter, the axis, and the rotation direction, it can be easily attached to the holder. . Further, by fixing the flange to the holder in the axial direction with bolts or the like, the split sleeve is not necessary. By using the split sleeve, it is possible to omit the peculiar adjustment work required, and it is possible to provide a highly accurate ultrasonic horn that does not require skilled techniques. Therefore, according to the ultrasonic horn of the above mechanism, wire bonding can be performed by stable ultrasonic vibration, so that the bonding reliability of the wire bonding can be significantly improved and the wire bonding of the fine pad can be sufficiently performed. Can handle.
【図１】本発明による超音波ホ−ンの概略図（ａ），同
図（ａ）においてボンディングツ−ル側からみた側面図
（ｂ）である。FIG. 1 is a schematic view (a) of an ultrasonic horn according to the present invention, and a side view (b) viewed from the bonding tool side in FIG. 1 (a).
【図２】従来例の超音波ホ−ンの概略図（ａ），同図
（ａ）での振動分布図（ｂ），同図（ａ）においてボン
ディングツ−ル側からみた側面図（ｃ），同図（ｃ）の
変形例を示す図（ｄ）である。FIG. 2 is a schematic view (a) of an ultrasonic horn of a conventional example, a vibration distribution view (b) in FIG. 2 (a), and a side view (c) seen from the bonding tool side in FIG. 2 (a). 8D is a diagram (d) showing a modified example of FIG.
１…振動子部、２…ホ−ン部、３…フランジ、４…節、
５…振動板、６…ボンディングツ−ル、７…支軸、８…
ホルダ、９…直径方向ガイド面、１０…軸方向ガイド
面、１１…回転方向ガイド面、１２…取付け穴、１３…
ピン、１４…ボルト。1 ... vibrator part, 2 ... horn part, 3 ... flange, 4 ... node,
5 ... Vibration plate, 6 ... Bonding tool, 7 ... Spindle, 8 ...
Holder, 9 ... Diameter guide surface, 10 ... Axial guide surface, 11 ... Rotation direction guide surface, 12 ... Mounting hole, 13 ...
Pins, 14 ... bolts.
Claims (1)
と、ホルダに取付けられ振動板を介して上記ホ−ン部を
支持するフランジ構造とを有するホ−ン部とを具備する
ワイヤボンダ用超音波ホ−ンにおいて、 上記フランジは、上記ホ−ン部を上記ホルダに取り付け
る際の直径方向、軸方向及び回転方向における位置決め
となるガイド面それぞれ有することを特徴とするワイヤ
ボンダ用超音波ホ−ン。1. A super bonder for a wire bonder, comprising: a horn portion having a bonding tool; and a horn portion having a flange structure which is attached to a holder and supports the horn portion via a vibration plate. An ultrasonic horn for a wire bonder, characterized in that each of the flanges has a guide surface for positioning in the diametrical direction, the axial direction and the rotational direction when the horn portion is attached to the holder. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04178216A JP3080781B2 (en) | 1992-07-06 | 1992-07-06 | Ultrasonic horn for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04178216A JP3080781B2 (en) | 1992-07-06 | 1992-07-06 | Ultrasonic horn for wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0621163A true JPH0621163A (en) | 1994-01-28 |
| JP3080781B2 JP3080781B2 (en) | 2000-08-28 |
Family
ID=16044617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04178216A Expired - Fee Related JP3080781B2 (en) | 1992-07-06 | 1992-07-06 | Ultrasonic horn for wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3080781B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0338682A2 (en) * | 1988-03-23 | 1989-10-25 | Kabushiki Kaisha O.C.C. | Method of strengthening metal material and apparatus therefor |
| JPH0652146U (en) * | 1992-12-22 | 1994-07-15 | 株式会社カイジョー | Ultrasonic horn and bonding device equipped with the same |
-
1992
- 1992-07-06 JP JP04178216A patent/JP3080781B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0338682A2 (en) * | 1988-03-23 | 1989-10-25 | Kabushiki Kaisha O.C.C. | Method of strengthening metal material and apparatus therefor |
| EP0338682A3 (en) * | 1988-03-23 | 1991-09-18 | Kabushiki Kaisha O.C.C. | Method of strengthening metal material and apparatus therefor |
| JPH0652146U (en) * | 1992-12-22 | 1994-07-15 | 株式会社カイジョー | Ultrasonic horn and bonding device equipped with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3080781B2 (en) | 2000-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5486733A (en) | Bonding apparatus | |
| JP2004363612A (en) | Ultrasonic transducer assembly | |
| JPH0160361B2 (en) | ||
| EP1273380B1 (en) | Resonator for ultrasonic wire bonding | |
| JPH0621163A (en) | Ultrasonic horn for wire bonder | |
| JPH04273133A (en) | Wire bonding apparatus | |
| JP2001024025A (en) | Wire bonding apparatus | |
| JP2002264067A (en) | Robot | |
| JP2587481Y2 (en) | Ultrasonic horn and bonding apparatus having the same | |
| JPH1133907A (en) | Flange mechanism | |
| JPS62145830A (en) | Chucking device | |
| US6155908A (en) | Work-loading method and surface-grinding apparatus with work position deviation-adjusting mechanism | |
| JP5208630B2 (en) | Grinding wheel | |
| JP2000127037A (en) | Grinding wheel holder | |
| JPS6130367A (en) | Connection mechanism for supersonic-wave working tool | |
| JP2987427B2 (en) | Drilling method for zirconium dioxide ceramics | |
| JP2024070353A (en) | Grinding wheel adapter and grinding wheel installation method | |
| JPH0213280A (en) | Ultrasonic motor | |
| JP3276460B2 (en) | Wire bonding equipment | |
| JPH0639044B2 (en) | Ultrasonic processing equipment | |
| JP2990296B2 (en) | Equipment with motor | |
| JPH0533304Y2 (en) | ||
| JP2003303846A (en) | Method of mounting ultrasonic horn for wire bonder | |
| JP2677586B2 (en) | Positioning device | |
| JPS63131121A (en) | Polygon mirror assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |