JPH06210794A - Polyimide film having metal film - Google Patents
Polyimide film having metal filmInfo
- Publication number
- JPH06210794A JPH06210794A JP795193A JP795193A JPH06210794A JP H06210794 A JPH06210794 A JP H06210794A JP 795193 A JP795193 A JP 795193A JP 795193 A JP795193 A JP 795193A JP H06210794 A JPH06210794 A JP H06210794A
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal
- layer
- polyimide
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＴＡＢ（Tape Automat
ed Bonding）やＦＰＣ（Flexible PrintCircuit）など
の二層フィルムキャリアとして使用される金属膜付きポ
リイミドフィルムに関する。BACKGROUND OF THE INVENTION The present invention relates to a TAB (Tape Automat).
The present invention relates to a polyimide film with a metal film, which is used as a two-layer film carrier for ed bonding, FPC (Flexible Print Circuit) and the like.
【０００２】[0002]
【従来の技術】前記ＴＡＢは、テープ状のフィルムキャ
リア上に間隔を空けて形成された金属のリードと、半導
体チップの電極の対応部分とを適当な手段により接合
し、多数の配線を同時に完了するボンディング方式の総
称である。2. Description of the Related Art In the TAB, metal leads formed at intervals on a tape-shaped film carrier and corresponding portions of electrodes of a semiconductor chip are joined by an appropriate means to complete a large number of wirings at the same time. Is a general term for bonding methods.
【０００３】前記フィルムキャリアとしては、デバイス
ホールの形成されたポリイミド製のフィルム基材上に銅
箔を接着剤で貼り合わせ、さらに銅箔を湿式エッチング
してリードを形成したものが現在主流であり、これらは
三層フィルムキャリアと称される。As the film carrier, a film carrier in which a copper foil is adhered onto a polyimide film substrate having a device hole formed therein by an adhesive and the copper foil is wet-etched to form leads is presently the mainstream. , These are called tri-layer film carriers.
【０００４】しかし、前記三層フィルムキャリアでは、
銅箔を接着剤でポリイミドフィルムに貼り合わせるため
に、取扱い上の問題から銅箔はあまり薄くできず、１８
μｍ以上とせざるを得ないため、加工精度を高めにくい
欠点がある。また、銅箔を薄くすると、テープの製造過
程で接着剤層にエッチング液が染み込み、高温高圧の試
験下でバイアスを加えると銅イオンが移動してパターン
間を短絡させるおそれもある。さらに、高温環境では接
着剤層が特性劣化するため、将来的には高温安定性が不
足するおそれもあるため、ＬＳＩの多ピン化に伴うリー
ドパターンの微細化に対応しきれないという問題があっ
た。However, in the above three-layer film carrier,
Since the copper foil is attached to the polyimide film with an adhesive, the copper foil cannot be made so thin due to handling problems.
Since there is no choice but to make the thickness more than μm, there is a drawback that it is difficult to improve the processing accuracy. Further, if the copper foil is made thin, the etching solution may soak into the adhesive layer during the tape manufacturing process, and if a bias is applied under a high temperature and high pressure test, copper ions may move and short-circuit the patterns. Furthermore, since the characteristics of the adhesive layer deteriorate in a high temperature environment, there is a possibility that the high temperature stability will be insufficient in the future, and there is a problem that the miniaturization of the lead pattern due to the increase in the number of pins of the LSI cannot be dealt with. It was
【０００５】そこで、多ピン化への対応を可能とするた
め、接着剤を使用せず、ポリイミドフィルムの表面に無
電解めっきまたは蒸着により銅層を直接形成した二層フ
ィルムキャリアが一部で実用化されている。In order to cope with the increase in the number of pins, a two-layer film carrier in which a copper layer is directly formed on the surface of a polyimide film by electroless plating or vapor deposition without using an adhesive is practically used in part. Has been converted.
【０００６】現在工業的に実用化されているポリイミド
フィルムとしては２種類のタイプがある。第１は、原料
の酸二無水物としてビフェニルテトラカルボン酸二無水
物（ＢＰＤＡ）を使用するＢＰＤＡ系ポリイミドフィル
ムであり、第２は、ピロメリット酸二無水物（ＰＭＤ
Ａ）を使用するＰＭＤＡ系ポリイミドフィルムである。There are two types of polyimide films currently industrially put to practical use. The first is a BPDA-based polyimide film that uses biphenyltetracarboxylic dianhydride (BPDA) as the raw acid dianhydride, and the second is pyromellitic dianhydride (PMD).
It is a PMDA type polyimide film which uses A).
【０００７】第１のＢＰＤＡ系ポリイミドフィルムは、
剛性が高く、熱収縮および吸湿に対する寸法安定性に優
れており、フィルムキャリアの薄型化に有利であるう
え、扱いやすく、信頼性も高いなど、金属膜付きポリイ
ミドフィルムのフィルム基材として適している。The first BPDA polyimide film is
High rigidity, excellent dimensional stability against heat shrinkage and moisture absorption, advantageous for thinning film carrier, easy to handle and highly reliable, suitable as a film base material for polyimide film with metal film .
【０００８】[0008]
【発明が解決しようとする課題】しかし、ＢＰＤＡ系ポ
リイミドフィルムは、その特長である強固な分子結合の
ため、真空蒸着法等によって形成される金属層との接合
性が悪く、以下のような問題を有していた。However, since the BPDA-based polyimide film has a strong molecular bond, which is a characteristic of the BPDA-based polyimide film, its bondability to a metal layer formed by a vacuum deposition method or the like is poor and the following problems occur. Had.
【０００９】（１） ＴＡＢのリード形成時のアディテ
ィブめっき工程や、半導体の実装工程におけるエッチン
グ等で、高温、高湿などの環境にさらされると、金属膜
が剥離することがある。 （２） フィルム基材を連続走行させつつ金属膜を蒸着
形成する過程で、金属膜の表面とフィルム送りロールの
表面が接触するが、この時、金属膜の局部的剥離により
金属膜に微細な傷が発生しやすい。この種の傷を持つ金
属膜付きポリイミドフィルムを用いてＴＡＢの製造を行
うと、回路の断線が生じることがあり、歩留まりが低下
する。(1) The metal film may peel off when exposed to an environment such as high temperature and high humidity due to an additive plating process at the time of forming a TAB lead or etching in a semiconductor mounting process. (2) The surface of the metal film and the surface of the film feed roll come into contact with each other in the process of vapor-depositing and forming the metal film while the film base material is continuously running. It is easily scratched. When a TAB is manufactured using a polyimide film with a metal film having a scratch of this kind, circuit breakage may occur, resulting in a low yield.
【００１０】上記（１），（２）の理由から、二層ＴＡ
Ｂ用の金属膜付きポリイミドフィルムとしては、比較的
金属膜との接合性が良いＰＭＤＡ系ポリイミドをフィル
ム基材とした製品しか製造されていないのが現状であ
る。For the reasons (1) and (2) above, the two-layer TA
At present, as the polyimide film with a metal film for B, only a product using PMDA-based polyimide, which has a relatively good bonding property with the metal film, as a film substrate is manufactured.
【００１１】なお、この種の金属膜付きポリイミドフィ
ルムはＴＡＢ用のみに使用されるものではなく、ＦＰＣ
にも使用され、ＦＰＣ用金属膜付きポリイミドフィルム
にも前記同様の問題が生じている。Incidentally, this kind of polyimide film with a metal film is not used only for TAB, but for FPC.
Also, the polyimide film with a metal film for FPC has the same problem as described above.
【００１２】本発明は上記事情に鑑みてなされたもの
で、ＢＰＤＡ系ポリイミドフィルム基材と金属膜の接合
性の改善を図ることにより、キャリアフィルムの薄型化
が図れ、寸法安定性も高められる金属膜付きポリイミド
フィルムを提供することを課題としている。The present invention has been made in view of the above circumstances, and by improving the bondability between a BPDA-based polyimide film base material and a metal film, it is possible to reduce the thickness of the carrier film and improve the dimensional stability of the metal. An object is to provide a polyimide film with a film.
【００１３】[0013]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る金属膜付きポリイミドフィルムは、原
料としてビフェニルテトラカルボン酸二無水物を使用し
たＢＰＤＡ系ポリイミド製のフィルム基材と、このフィ
ルム基材の少なくとも片面に形成されたピロメリット酸
二無水物を原料とするＰＭＤＡ系ポリイミドからなる中
間層と、この中間層上に順次形成された金属蒸着層およ
び金属めっき層とを有し、前記フィルム基材の前記中間
層との接合面は、表面粗さがＲａ値０．０２〜０．２μ
ｍの粗面とされていることを特徴とする。In order to solve the above-mentioned problems, a polyimide film with a metal film according to the present invention comprises a BPDA-based polyimide film substrate using biphenyltetracarboxylic dianhydride as a raw material, An intermediate layer made of PMDA-based polyimide using pyromellitic dianhydride as a raw material formed on at least one surface of the film substrate, and a metal vapor deposition layer and a metal plating layer sequentially formed on the intermediate layer, The joint surface of the film base material with the intermediate layer has a surface roughness Ra value of 0.02 to 0.2 μ.
It is characterized by having a rough surface of m.
【００１４】前記接合面の表面粗さがＲａ値０．０２μ
ｍ未満であると、フィルム基材と中間層との接合強度が
不十分となる。また、Ｒａ値が０．２μｍより大きい
と、均一な表面粗化処理が困難であり、金属膜の平坦度
を阻害するおそれが生じる。The surface roughness of the joint surface has an Ra value of 0.02 μ.
When it is less than m, the bonding strength between the film substrate and the intermediate layer becomes insufficient. Further, if the Ra value is larger than 0.2 μm, it is difficult to perform a uniform surface roughening treatment, and there is a possibility that the flatness of the metal film may be hindered.
【００１５】中間層の厚さは０．０５〜５μｍが好まし
く、特に０．２〜０．５μｍが好適である。０．０５μ
ｍより薄いと、均一な薄膜を形成しにくいため接着性向
上の効果が不十分になる。一方、５μより厚いと製品フ
ィルムの薄肉化が困難になるとともに、フィルム基材本
来の機械的性質が損なわれる。The thickness of the intermediate layer is preferably 0.05 to 5 μm, particularly 0.2 to 0.5 μm. 0.05μ
If it is thinner than m, it is difficult to form a uniform thin film, and the effect of improving the adhesiveness becomes insufficient. On the other hand, if it is thicker than 5 μ, it becomes difficult to reduce the thickness of the product film and the original mechanical properties of the film substrate are impaired.
【００１６】フィルム基材の厚さは限定されないが、一
般的には１２〜１２５μｍ程度とされる。フィルム基材
自体を複数の層で構成してもよいし、必要に応じては、
フィルム基材の金属蒸着層を形成しない面に、他の樹脂
からなる着色層や保護層を設けてもよい。さらに、フィ
ルム基材の両面に金属蒸着層および金属めっき層を設け
ることも可能である。Although the thickness of the film substrate is not limited, it is generally about 12 to 125 μm. The film substrate itself may be composed of a plurality of layers, and if necessary,
A colored layer or a protective layer made of another resin may be provided on the surface of the film base on which the metal vapor deposition layer is not formed. Furthermore, it is also possible to provide a metal vapor deposition layer and a metal plating layer on both sides of the film substrate.
【００１７】金属蒸着層の材質は限定されないが、一般
的には銅または銅合金，アルミニウム，錫，錫合金など
が好適である。金属蒸着層を下地層と表面層を有する２
層以上の多層構造としてもよい。特に、下地層をクロ
ム、表面層を銅で形成した場合などには、高い電気伝導
度を確保しつつ、フィルム基材と金属層の接合性をさら
に改善することが可能である。同様の組み合わせとして
は、チタンと銅、パラジウムと銅等も例示できる。The material of the metal vapor deposition layer is not limited, but generally copper or copper alloy, aluminum, tin, tin alloy and the like are suitable. A metal vapor deposition layer having a base layer and a surface layer 2
A multi-layer structure of more than one layer may be used. In particular, when the underlayer is made of chromium and the surface layer is made of copper, it is possible to further improve the bondability between the film base material and the metal layer while ensuring high electrical conductivity. Examples of similar combinations include titanium and copper, palladium and copper, and the like.
【００１８】金属めっき層の材質および厚さは限定され
ないが、材質としては一般的に銅，錫合金，銀などが好
適で、厚さは５〜２５μｍ程度が一般的である。金属め
っき層の形成方法は、無電解めっき法および電解めっき
法のいずれでもよい。The material and thickness of the metal plating layer are not limited, but copper, tin alloy, silver, etc. are generally suitable as the material, and the thickness is generally about 5 to 25 μm. The metal plating layer may be formed by either an electroless plating method or an electrolytic plating method.
【００１９】上記金属膜付きポリイミドフィルムの製造
方法の一例を説明する。まず、原料としてビフェニルテ
トラカルボン酸二無水物を使用したＢＰＤＡ系ポリイミ
ド製のフィルム基材の少なくとも片面を、アルカリ溶液
で処理することにより、上記Ｒａ値になるように粗面化
および活性化する。なお、アルカリ処理以外の表面粗化
法を適用することも可能である。An example of the method for producing the above polyimide film with a metal film will be described. First, at least one surface of a BPDA-based polyimide film substrate using biphenyltetracarboxylic dianhydride as a raw material is treated with an alkaline solution to roughen and activate it to the Ra value. It is also possible to apply a surface roughening method other than the alkali treatment.
【００２０】アルカリ溶液としては、水酸化ナトリウ
ム、水酸化カリウム、ヒドラジンヒドラート、過塩素酸
カリウム等から選択される物質を１種または２種以上含
有する溶液、またはその溶液にさらにエチレンジアミ
ン、ジメチルアミン等を混合した溶液を用い、例えば、
液温１０〜８０℃、処理時間１〜９０分間で浸漬処理し
て、表面粗度を前記Ｒａ値にする。As the alkaline solution, a solution containing one or more substances selected from sodium hydroxide, potassium hydroxide, hydrazine hydrate, potassium perchlorate, or the like, or ethylenediamine or dimethylamine is added to the solution. Using a mixed solution of, for example,
Immersion treatment is performed at a liquid temperature of 10 to 80 ° C. for a treatment time of 1 to 90 minutes to bring the surface roughness to the Ra value.
【００２１】次に、フィルム基材に形成された粗面上に
中間層を形成する。具体的な方法としては、例えば、イ
ミド化前のＰＭＤＡ系ポリイミド原料（ピロメリット酸
二無水物を主組成物とする）をフィルム基材の粗面に塗
布し、これを加熱して重合させる方法が好適である。こ
の方法によれば、粗面上に形成しても中間層の表面が高
い精度で平滑になる。ただし本発明はこの形成方法に限
定されることはない。Next, an intermediate layer is formed on the rough surface formed on the film substrate. As a specific method, for example, a method in which a PMDA-based polyimide raw material (having pyromellitic dianhydride as a main composition) before imidization is applied to a rough surface of a film base material and heated to be polymerized Is preferred. According to this method, even if it is formed on a rough surface, the surface of the intermediate layer becomes smooth with high accuracy. However, the present invention is not limited to this forming method.
【００２２】続いて、中間層上に従来公知の蒸着方法を
用いて金属蒸着層を形成した後、金属蒸着膜上に無電解
めっき法または電解めっき法を用いて金属めっき層を形
成することにより、本発明に係る金属膜付きポリイミド
フィルムが得られる。Subsequently, a metal vapor deposition layer is formed on the intermediate layer by a conventionally known vapor deposition method, and then a metal plating layer is formed on the metal vapor deposition film by an electroless plating method or an electrolytic plating method. A polyimide film with a metal film according to the present invention can be obtained.
【００２３】なお、前記各工程をフィルム基材の両面に
対してそれぞれ行い、フィルム基材の両面に中間層およ
び金属蒸着層を設けてもよい。また、本発明の金属膜付
きポリイミドフィルムは、ＴＡＢのみならずＦＰＣにも
有効に使用可能である。The above steps may be carried out on both sides of the film substrate, and an intermediate layer and a metal vapor deposition layer may be provided on both sides of the film substrate. Further, the polyimide film with a metal film of the present invention can be effectively used not only for TAB but also for FPC.
【００２４】[0024]
【実施例】次に実施例を挙げて本発明の効果を実証す
る。 （実施例）ＢＰＤＡ系ポリイミドフィルム基材として、
宇部興産株式会社製の「ユーピレックス−Ｓ」（商品
名）：７５μｍ厚を使用し、このフィルム基材を以下の
組成からなるアルカリ溶液に室温で９０分間浸漬し、そ
の後、水洗して乾燥した。フィルム基材の両面の表面粗
さはＲａ値で０．０４μｍとなった。EXAMPLES Next, the effects of the present invention will be demonstrated with reference to examples. (Example) As a BPDA-based polyimide film substrate,
"Upilex-S" (trade name) manufactured by Ube Industries, Ltd .: a thickness of 75 μm was used, and this film substrate was immersed in an alkaline solution having the following composition for 90 minutes at room temperature, then washed with water and dried. The surface roughness of both surfaces of the film substrate was Ra value of 0.04 μm.
【００２５】アルカリ溶液の組成 水酸化ナトリウム： ４０ｗｔ％ ヒドラジンヒドラート： １８ｗｔ％ エチレンジアミン： ７ｗｔ％Composition of alkaline solution Sodium hydroxide: 40 wt% Hydrazine hydrate: 18 wt% Ethylenediamine: 7 wt%
【００２６】次に、表面を粗面化したフィルム基材の片
面に、ＰＭＤＡ系ポリイミドとして東レ株式会社製「セ
ミコファインＳＰ−８１１」（商品名）を、イミド化後
の層厚が０．３μｍになる塗布厚さで、バーコーターを
用いて塗布したうえ、上記フィルム基材を、熱風高温槽
内で４０℃×１時間、７５℃×０．５時間、１４０℃×
０．５時間、２００℃×０．５時間、３００℃×１時間
の順に５段階で加熱し、イミド化反応を行わせた。Next, "Semicofine SP-811" (trade name) manufactured by Toray Industries, Inc. as PMDA-based polyimide was applied to one side of the roughened film substrate, and the layer thickness after imidization was 0.3 μm. After coating with a bar coater at a coating thickness of, the above film substrate is heated in a hot air high temperature tank at 40 ° C. × 1 hour, 75 ° C. × 0.5 hour, 140 ° C. ×
The imidization reaction was carried out by heating in 5 stages in the order of 0.5 hour, 200 ° C. × 0.5 hour, and 300 ° C. × 1 hour.
【００２７】得られた複合フィルムを蒸着機内にセット
し、ポリイミド塗布面に下記の条件でクロムおよび銅の
蒸着層を順次形成した。 第１層：クロム蒸着層 蒸着層厚：１００オングスト
ローム 第２層：銅蒸着層 蒸着層厚：５０００オングス
トローム そして、得られた蒸着フィルムの金属蒸着層上に、通常
の硫酸銅浴により銅電解めっき層を２０μｍの厚さに形
成し、実施例の金属膜付きポリイミドフィルムを得た。The obtained composite film was set in a vapor deposition machine, and chromium and copper vapor deposition layers were sequentially formed on the polyimide coated surface under the following conditions. 1st layer: Chromium vapor deposition layer Vapor deposition layer thickness: 100 angstrom 2nd layer: Copper vapor deposition layer Vapor deposition layer thickness: 5000 angstrom And, on the metal vapor deposition layer of the obtained vapor deposition film, a copper electrolytic plating layer is formed by a normal copper sulfate bath. Was formed to a thickness of 20 μm to obtain a polyimide film with a metal film of Example.
【００２８】（比較例１）上記実施例と同じＢＰＤＡ系
ポリイミドフィルム基材を用い、表面粗化処理を行わな
い点を除いて上記実施例と全く同じ処理を施し、比較例
１の金属膜付きポリイミドフィルムを作成した。(Comparative Example 1) Using the same BPDA-based polyimide film substrate as in the above Example, the same treatment as in the above Example was carried out except that the surface roughening treatment was not carried out, and the metal film of Comparative Example 1 was attached. A polyimide film was created.
【００２９】（比較例２）上記実施例と同じＢＰＤＡ系
ポリイミドフィルム基材を真空蒸着機内にセットし、こ
のフィルム基材上に直接、実施例と同じ条件で第１層と
してクロム蒸着層、第２層として銅蒸着層を順次形成
し、さらに前記同様に銅無電解めっき層を２０μｍの厚
さに形成し、比較例２の金属膜付きポリイミドフィルム
を作成した。(Comparative Example 2) The same BPDA-based polyimide film substrate as in the above example was set in a vacuum vapor deposition machine, and a chromium vapor deposition layer, a first layer and a chromium vapor deposition layer were directly formed on the film substrate under the same conditions as in the example. Copper vapor-deposited layers were sequentially formed as two layers, and a copper electroless plated layer was formed to a thickness of 20 μm in the same manner as described above to prepare a polyimide film with a metal film of Comparative Example 2.
【００３０】（比較実験）上記実施例および比較例１，
２の金属膜付きポリイミドフィルムから幅１０ｍｍ×長
さ１５０ｍｍの短冊状試験片を切り出した。そしてＩＰ
Ｃ−ＴＭ−６５０（米国プリント回路工業会規格試験
法）による方法で、フィルム基材と金属膜間の剥離強度
を測定した。この試験法は、前記短冊状試験片のポリイ
ミドフィルム側を６インチの直径のドラムの外周に周方
向へ向けて接着固定したうえ、金属膜の一端を治具で５
ｃｍ／分でポリイミドフィルムから剥離させながら引っ
張り、それに要する荷重を測定する方法である。結果は
以下の通りであった。(Comparative Experiment) The above-mentioned Examples and Comparative Examples 1,
A strip-shaped test piece having a width of 10 mm and a length of 150 mm was cut out from the polyimide film 2 with a metal film. And IP
The peel strength between the film substrate and the metal film was measured by a method according to C-TM-650 (American Printed Circuit Industry Association standard test method). In this test method, the polyimide film side of the strip-shaped test piece was bonded and fixed to the outer periphery of a drum having a diameter of 6 inches in the circumferential direction, and one end of the metal film was fixed with a jig.
It is a method of pulling while peeling from the polyimide film at cm / min, and measuring the load required therefor. The results were as follows.
【００３１】実施例 剥離強度：１２００ｇ／ｃｍ 剥離箇所：金属膜と中間層の界面 比較例１ 剥離強度：６５０ｇ／ｃｍ 剥離箇所：フィルム基材と中間層の界面 比較例２ 剥離強度：３７０ｇ／ｃｍ 剥離箇所：フィルム基材と金属膜の界面Example Peeling strength: 1200 g / cm Peeling point: Interface between metal film and intermediate layer Comparative example 1 Peeling strength: 650 g / cm Peeling point: Interface between film substrate and intermediate layer Comparative example 2 Peeling strength: 370 g / cm Peeling point: Interface between film substrate and metal film
【００３２】上記のように、フィルム基材を粗面化し中
間層を設けたうえ金属膜を形成した実施例では、粗面化
処理を行わなかった比較例１に比して約２倍、粗面も中
間層も設けなかった比較例２に比して３倍以上の剥離強
度が得られた。As described above, in the example in which the film base material was roughened and the intermediate layer was provided and the metal film was formed, the roughness was about twice as large as that in Comparative example 1 in which the roughening treatment was not performed. The peel strength was three times or more that of Comparative Example 2 in which neither the surface nor the intermediate layer was provided.
【００３３】[0033]
【発明の効果】以上説明したように、本発明に係る金属
膜付きポリイミドフィルムは、ＢＰＤＡ系ポリイミド製
のフィルム基材の表面をＲａ値０．０２〜０．２μｍの
粗面としたうえ、この粗面上にＰＭＤＡ系ポリイミドか
らなる中間層、金属蒸着層および金属めっき層を順に形
成したものであるから、フィルム基材の剛性および寸法
安定性を高く保持したまま、金属膜の剥離強度を著しく
高めることができる。As described above, in the polyimide film with metal film according to the present invention, the surface of the film base material made of BPDA polyimide is roughened to have an Ra value of 0.02 to 0.2 μm. Since the intermediate layer made of PMDA type polyimide, the metal vapor deposition layer and the metal plating layer are sequentially formed on the rough surface, the peel strength of the metal film is remarkably maintained while keeping the rigidity and dimensional stability of the film base material high. Can be increased.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大竹 重成 福島県会津若松市扇町128の７ 三菱伸銅 株式会社若松製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigenari Otake 128-7 Ogimachi, Aizuwakamatsu, Fukushima Prefecture 7 Wakamatsu Works, Mitsubishi Shindoh Co., Ltd.
Claims (1)
無水物を使用したＢＰＤＡ系ポリイミド製のフィルム基
材と、このフィルム基材の少なくとも片面に形成された
ピロメリット酸二無水物を原料とするＰＭＤＡ系ポリイ
ミドからなる中間層と、この中間層上に順次形成された
金属蒸着層および金属めっき層とを有し、前記フィルム
基材の前記中間層との接合面は、表面粗さがＲａ値０．
０２〜０．２μｍの粗面とされていることを特徴とする
金属膜付きポリイミドフィルム。1. A film base made of BPDA polyimide using biphenyltetracarboxylic dianhydride as a raw material, and a PMDA base made of pyromellitic dianhydride formed on at least one side of the film base. It has an intermediate layer made of polyimide, and a metal vapor deposition layer and a metal plating layer sequentially formed on this intermediate layer, and the joint surface of the film base material with the intermediate layer has a surface roughness Ra value of 0.
A polyimide film with a metal film, which has a rough surface of 02 to 0.2 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP795193A JP3265027B2 (en) | 1993-01-20 | 1993-01-20 | Polyimide film with metal film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP795193A JP3265027B2 (en) | 1993-01-20 | 1993-01-20 | Polyimide film with metal film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06210794A true JPH06210794A (en) | 1994-08-02 |
| JP3265027B2 JP3265027B2 (en) | 2002-03-11 |
Family
ID=11679805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP795193A Expired - Fee Related JP3265027B2 (en) | 1993-01-20 | 1993-01-20 | Polyimide film with metal film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3265027B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002094558A1 (en) | 2001-05-24 | 2002-11-28 | Toray Industries, Inc. | Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them |
| JP2003034883A (en) * | 2001-07-26 | 2003-02-07 | Matsushita Electric Works Ltd | Method for forming metal film |
| WO2007123161A1 (en) * | 2006-04-18 | 2007-11-01 | Ube Industries, Ltd. | Polyimide film for metallizing and metal laminated polyimide film |
| US8053082B2 (en) | 2004-03-23 | 2011-11-08 | Ube Industries, Ltd. | Adhesion-enhanced polyimide film, process for its production, and laminated body |
| US8568899B2 (en) | 2007-10-18 | 2013-10-29 | Jx Nippon Mining & Metals Corporation | Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board |
| US8721864B2 (en) | 2007-10-18 | 2014-05-13 | Jx Nippon Mining & Metals Corporation | Process and apparatus for producing a metal covered polyimide composite |
| US20210268781A1 (en) * | 2019-01-11 | 2021-09-02 | Lg Chem, Ltd. | Film, metal-clad laminate, flexible substrate, manufacturing method for film, manufacturing method for metal-clad laminate, and manufacturing method for flexible substrate |
| WO2021199811A1 (en) * | 2020-04-03 | 2021-10-07 | 信越ポリマー株式会社 | Metal-clad laminated plate |
-
1993
- 1993-01-20 JP JP795193A patent/JP3265027B2/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002094558A1 (en) | 2001-05-24 | 2002-11-28 | Toray Industries, Inc. | Heat-resistant resin film with metal layer and wiring board, and method for manufacturing them |
| JP2003034883A (en) * | 2001-07-26 | 2003-02-07 | Matsushita Electric Works Ltd | Method for forming metal film |
| US8053082B2 (en) | 2004-03-23 | 2011-11-08 | Ube Industries, Ltd. | Adhesion-enhanced polyimide film, process for its production, and laminated body |
| WO2007123161A1 (en) * | 2006-04-18 | 2007-11-01 | Ube Industries, Ltd. | Polyimide film for metallizing and metal laminated polyimide film |
| JP5168141B2 (en) * | 2006-04-18 | 2013-03-21 | 宇部興産株式会社 | Metallizing polyimide film and metal laminated polyimide film |
| TWI392588B (en) * | 2006-04-18 | 2013-04-11 | Ube Industries | Polyimide film for metallization and polyimide film laminated with metal |
| US8568899B2 (en) | 2007-10-18 | 2013-10-29 | Jx Nippon Mining & Metals Corporation | Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board |
| US8721864B2 (en) | 2007-10-18 | 2014-05-13 | Jx Nippon Mining & Metals Corporation | Process and apparatus for producing a metal covered polyimide composite |
| US20210268781A1 (en) * | 2019-01-11 | 2021-09-02 | Lg Chem, Ltd. | Film, metal-clad laminate, flexible substrate, manufacturing method for film, manufacturing method for metal-clad laminate, and manufacturing method for flexible substrate |
| US11845246B2 (en) * | 2019-01-11 | 2023-12-19 | Lg Chem, Ltd. | Film, metal-clad laminate, flexible substrate, manufacturing method for film, manufacturing method for metal-clad laminate, and manufacturing method for flexible substrate |
| WO2021199811A1 (en) * | 2020-04-03 | 2021-10-07 | 信越ポリマー株式会社 | Metal-clad laminated plate |
| CN115348921A (en) * | 2020-04-03 | 2022-11-15 | 信越聚合物株式会社 | Metal-clad laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3265027B2 (en) | 2002-03-11 |
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