JPH06210570A - Three layer structure electrocast blade - Google Patents
Three layer structure electrocast bladeInfo
- Publication number
- JPH06210570A JPH06210570A JP2082793A JP2082793A JPH06210570A JP H06210570 A JPH06210570 A JP H06210570A JP 2082793 A JP2082793 A JP 2082793A JP 2082793 A JP2082793 A JP 2082793A JP H06210570 A JPH06210570 A JP H06210570A
- Authority
- JP
- Japan
- Prior art keywords
- electrocast
- layer
- copper
- electroformed
- blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 27
- 239000006061 abrasive grain Substances 0.000 claims description 7
- 238000004070 electrodeposition Methods 0.000 claims description 7
- 239000008151 electrolyte solution Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 abstract description 6
- 229910003460 diamond Inorganic materials 0.000 abstract description 4
- 239000010432 diamond Substances 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 abstract description 2
- 229940005657 pyrophosphoric acid Drugs 0.000 abstract description 2
- 229910000838 Al alloy Inorganic materials 0.000 abstract 2
- 239000003792 electrolyte Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 239000010953 base metal Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000005323 electroforming Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 150000001879 copper Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ダイシング装置等の精
密切削装置に用いられる電鋳ブレードであって、特に三
層構造電鋳ブレードに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroformed blade used in a precision cutting device such as a dicing device, and more particularly to a three-layer structure electroformed blade.
【０００２】[0002]
【従来の技術】従来、ダイシング装置等の精密切削装置
に用いられる電鋳ブレードは、ニッケルを母体金属とす
る電鋳ブレードが主流をなしているが、チッピングを小
さくする目的で銅を母体金属とする電鋳ブレードも存在
する。この銅電鋳ブレードは通常アルミ台金に超砥粒を
含む銅メッキを施した後に、アルミ台金の周縁部をエッ
チング等の方法により溶解除去して形成した、無歪で極
薄のブレードである。2. Description of the Related Art Conventionally, electroforming blades used in precision cutting machines such as dicing machines are mainly made of nickel as a base metal, but copper is used as a base metal for the purpose of reducing chipping. There are also electroformed blades. This copper electroformed blade is usually formed by performing copper plating containing superabrasive grains on an aluminum base metal, and then dissolving and removing the peripheral portion of the aluminum base metal by a method such as etching. is there.
【０００３】[0003]
【発明が解決しようとする課題】前記従来の銅電鋳ブレ
ードによると、被加工物への当たりが軟らかいためチッ
ピングは小さいが、強度が余り強くないため切削中に破
損したり或は変形したり等の不具合が生じ易く、長期間
使用できない欠点があった。一方ニッケル電鋳ブレード
は、強度は強いがチッピングが大きい難点がある。本発
明は、このような従来の電鋳ブレードの欠点を除去する
ためになされ、チッピングが小さくて強度の強い電鋳ブ
レードを提供することを課題としたものである。According to the above-mentioned conventional copper electroforming blade, chipping is small because the contact with the work piece is soft, but the strength is not so strong that it breaks or deforms during cutting. However, there is a drawback that such a problem is likely to occur and the product cannot be used for a long time. On the other hand, the nickel electroformed blade has high strength, but has a drawback of large chipping. The present invention has been made in order to eliminate such drawbacks of the conventional electroformed blade, and an object thereof is to provide an electroformed blade having small chipping and high strength.
【０００４】[0004]
【課題を解決するための手段】このような課題を技術的
に解決するための手段として、本発明は、ハブ型電鋳ブ
レード等の電鋳ブレードにおいて、ニッケル電鋳層を挟
んで銅電鋳層が形成されている三層構造電鋳ブレードを
要旨とするものである。更に、銅の電解液中で砥粒を電
着する工程と、ニッケルの電解液中で銅電着層上に砥粒
を電着する工程と、銅の電解液中でニッケル電着層上に
砥粒を電着する工程とにより形成されたことを要旨とす
るものである。As a means for technically solving such a problem, the present invention provides an electroformed blade such as a hub-type electroformed blade in which copper electroforming is performed with a nickel electroformed layer interposed therebetween. The gist is a three-layer structure electroformed blade in which layers are formed. Further, a step of electrodepositing abrasive grains in a copper electrolyte solution, a step of electrodepositing abrasive grains on the copper electrodeposition layer in a nickel electrolyte solution, and a step of electrodepositing the nickel electrodeposition layer in a copper electrolyte solution The gist is that it is formed by the step of electrodepositing the abrasive grains.
【０００５】[0005]
【作 用】チッピング発生率の低い銅電鋳層と、強度の
強いニッケル電鋳層との組み合わせにより、チッピング
の発生率が低くて強度が強くしかも長寿命の電鋳ブレー
ドを形成することができる。[Operation] By combining a copper electroformed layer with a low chipping occurrence rate and a strong nickel electroformed layer, it is possible to form an electroformed blade with a low chipping occurrence rate, high strength, and long life. .
【０００６】[0006]
【実施例】以下、本発明の実施例を添付図面に基づいて
詳説する。図１において、１は円盤型のアルミ台金であ
り、(イ) のように傾斜フランジ部１ａの底面外周部に沿
って所定の厚さ、幅でダイヤモンド等の超砥粒３を含む
リング状の銅電鋳層２を形成する。この銅電着工程は、
例えばピロリン酸メッキ液を使用し、アルミ台金１に超
砥粒を含む銅メッキを施すことにより行う。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a disk-shaped aluminum base metal, which has a ring shape including a superabrasive grain 3 such as diamond having a predetermined thickness and width along the outer periphery of the bottom surface of the inclined flange portion 1a as shown in (a). The copper electroformed layer 2 is formed. This copper electrodeposition process is
For example, using a pyrophosphoric acid plating solution, the aluminum base metal 1 is plated with copper containing superabrasive grains.
【０００７】前記銅電着工程後に、水洗し、今度はニッ
ケル電解液中でメッキを施すことにより図１(ロ) のよう
に前記銅電鋳層２の表面にダイヤモンド等の超砥粒３を
含むニッケル電鋳層４を形成する。After the copper electrodeposition step, it is washed with water and then plated in a nickel electrolytic solution to deposit superabrasive grains 3 such as diamond on the surface of the copper electroformed layer 2 as shown in FIG. An electroformed nickel layer 4 containing nickel is formed.
【０００８】このニッケル電着工程の後、水洗し、再度
銅メッキを施すことにより図１(ハ)のようにニッケル電
鋳層４の表面にダイヤモンド等の超砥粒３を含む銅電鋳
層２を形成する。この結果、前記アルミ台金１の傾斜フ
ランジ部１ａの底面外周部にニッケル電鋳層４を挟んで
両側に銅電鋳層２を設けた三層構造の電鋳層５が形成さ
れる。After this nickel electrodeposition step, the nickel electroplated layer 4 is washed with water and again plated with copper to form a copper electroformed layer containing superabrasive grains 3 such as diamond on the surface of the nickel electroformed layer 4 as shown in FIG. Form 2. As a result, an electroformed layer 5 of a three-layer structure is formed in which the copper electroformed layer 2 is provided on both sides of the nickel electroformed layer 4 on the outer periphery of the bottom surface of the inclined flange portion 1a of the aluminum base metal 1.
【０００９】この後、図１(ニ) のように前記アルミ台金
１の傾斜フランジ部１ａの外周縁部をエッチング等によ
り溶解除去し、三層構造の電鋳層５の外周部を所定量突
出させることにより極薄の電鋳ブレード６が形成され
る。After that, as shown in FIG. 1D, the outer peripheral edge of the inclined flange portion 1a of the aluminum base metal 1 is dissolved and removed by etching or the like, and the outer peripheral portion of the electroformed layer 5 having a three-layer structure is removed by a predetermined amount. By making it protrude, the ultrathin electroformed blade 6 is formed.
【００１０】このようにして形成された本発明に係るハ
ブ型電鋳ブレード７は、例えば図２に示すようにダイシ
ング装置等の精密切削装置におけるスピンドル８の先端
部に装着して使用される。この場合、スピンドル８の先
端部にはフランジ部８ａとねじ部８ｂとが形成されてお
り、そのねじ部８ｂにハブ型電鋳ブレード７の取付孔７
ａを嵌入してフランジ部８ａに当接させ、締付用ナット
９をねじ部８ｂに螺合して締め付けることにより図３の
ようにハブ型電鋳ブレード７をスピンドル８に装着す
る。The hub type electroformed blade 7 according to the present invention thus formed is used by being attached to the tip of the spindle 8 in a precision cutting device such as a dicing device as shown in FIG. In this case, a flange portion 8a and a threaded portion 8b are formed at the tip of the spindle 8, and the mounting portion 7 of the hub-type electroformed blade 7 is attached to the threaded portion 8b.
The hub type electroformed blade 7 is mounted on the spindle 8 as shown in FIG. 3 by inserting a into contact with the flange portion 8a and screwing the tightening nut 9 into the screw portion 8b.
【００１１】このハブ型電鋳ブレード７で被加工物を切
削すると、銅電鋳層２が軟質であるため極めて少ないチ
ッピングで綺麗に切削できると共に、その銅電鋳層２は
硬質のニッケル電鋳層４にて補強されているので切削中
の破損又は変形等が極力防止される。即ち、銅電鋳層の
良い面とニッケル電鋳層の良い面とを合わせ持った理想
的な電鋳ブレードとなっている。When the work piece is cut with the hub-type electroformed blade 7, the copper electroformed layer 2 is soft and can be cut neatly with very little chipping, and the copper electroformed layer 2 is hard nickel electroformed. Since it is reinforced by the layer 4, damage or deformation during cutting is prevented as much as possible. That is, it is an ideal electroforming blade having both the good surface of the copper electroformed layer and the good surface of the nickel electroformed layer.
【００１２】尚、本発明の発明者による実験によると、
銅電鋳層の厚さは５μｍ以上で、ニッケル電鋳層の厚さ
は１μｍ以上である場合に本発明の効果をより発揮でき
た。従って、銅電鋳層の厚さは５μｍ以上、ニッケル電
鋳層の厚さは１μｍ以上にすることが好ましい。According to an experiment conducted by the inventor of the present invention,
The effect of the present invention can be further exhibited when the thickness of the copper electroformed layer is 5 μm or more and the thickness of the nickel electroformed layer is 1 μm or more. Therefore, it is preferable that the thickness of the copper electroformed layer is 5 μm or more and the thickness of the nickel electroformed layer is 1 μm or more.
【００１３】[0013]
【発明の効果】以上説明したように、本発明によれば、
ダイシング装置等の精密切削装置に用いられる電鋳ブレ
ードを、ニッケル電鋳層を挟んでその両側に銅電鋳層を
設けた三層構造としたので、極めて小さいチッピングで
切削できると共に切削中の破損又は変形等を未然に防止
することができ、つまり銅電鋳層の利点とニッケル電鋳
層の利点とを合わせ持った高性能で長寿命の電鋳ブレー
ドを提供できる効果を奏する。As described above, according to the present invention,
Since the electroforming blade used in precision cutting equipment such as dicing equipment has a three-layer structure with a nickel electroformed layer sandwiched between them and a copper electroformed layer provided on both sides, it is possible to cut with extremely small chipping and damage during cutting. Alternatively, it is possible to prevent deformation and the like in advance, that is, it is possible to provide a high-performance and long-life electroformed blade which has the advantages of the copper electroformed layer and the advantages of the nickel electroformed layer.
【図１】 (イ) 〜(ニ) は本発明に係る電鋳ブレードの形
成要領を工程順に示す説明図である。1 (a) to 1 (d) are explanatory views showing the procedure for forming an electroformed blade according to the present invention in the order of steps.
【図２】 スピンドルへの取付要領を示す分解斜視図で
ある。FIG. 2 is an exploded perspective view showing a mounting procedure on a spindle.
【図３】 同、取付状態図である。FIG. 3 is a mounting state diagram of the same.
１…アルミ台金 １ａ…傾斜フランジ部 ２…銅電
鋳層 ３…超砥粒 ４…ニッケル電鋳層 ５…三層構造電鋳層 ６…電
鋳ブレード ７…ハブ型電鋳ブレード ８…スピン
ドル ８ａ…フランジ部 ８ｂ…ねじ部 ９…締付用ナットDESCRIPTION OF SYMBOLS 1 ... Aluminum base metal 1a ... Inclined flange part 2 ... Copper electroformed layer 3 ... Super abrasive grain 4 ... Nickel electroformed layer 5 ... Three-layer structure electroformed layer 6 ... Electroformed blade 7 ... Hub type electroformed blade 8 ... Spindle 8a ... Flange portion 8b ... Screw portion 9 ... Tightening nut
Claims (2)
おいて、ニッケル電鋳層を挟んで銅電鋳層が形成されて
いる三層構造電鋳ブレード。1. An electroformed blade, such as a hub-type electroformed blade, in which a copper electroformed layer is formed with a nickel electroformed layer sandwiched therebetween.
ニッケルの電解液中で銅電着層上に砥粒を電着する工程
と、銅の電解液中でニッケル電着層上に砥粒を電着する
工程とにより形成された三層構造電鋳ブレード。2. A step of electrodepositing abrasive grains in a copper electrolytic solution,
A three-layer structure electroformed formed by a step of electrodepositing abrasive grains on a copper electrodeposition layer in a nickel electrolyte solution and a step of electrodepositing abrasive grains on a nickel electrodeposition layer in a copper electrolyte solution blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082793A JPH06210570A (en) | 1993-01-14 | 1993-01-14 | Three layer structure electrocast blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082793A JPH06210570A (en) | 1993-01-14 | 1993-01-14 | Three layer structure electrocast blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06210570A true JPH06210570A (en) | 1994-08-02 |
Family
ID=12037881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2082793A Pending JPH06210570A (en) | 1993-01-14 | 1993-01-14 | Three layer structure electrocast blade |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06210570A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003049903A1 (en) * | 2001-12-13 | 2003-06-19 | Nikon Corporation | Grind stone and production method for optical element |
| WO2009107274A1 (en) * | 2008-02-25 | 2009-09-03 | 株式会社村田製作所 | Sharp-edge grinding wheel and process for producing the sharp-edge grinding wheel |
| WO2009107272A1 (en) * | 2008-02-25 | 2009-09-03 | 株式会社村田製作所 | Sharp-edge grinding wheel |
| JP2019130649A (en) * | 2018-02-02 | 2019-08-08 | 株式会社ディスコ | Annular grindstone, and method for manufacture of annular grindstone |
| CN113500502A (en) * | 2021-09-13 | 2021-10-15 | 盛吉盛(宁波)半导体科技有限公司 | Grinding wheel, grinding device and grinding machine for processing semiconductor epitaxial quartz component |
-
1993
- 1993-01-14 JP JP2082793A patent/JPH06210570A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003049903A1 (en) * | 2001-12-13 | 2003-06-19 | Nikon Corporation | Grind stone and production method for optical element |
| WO2009107274A1 (en) * | 2008-02-25 | 2009-09-03 | 株式会社村田製作所 | Sharp-edge grinding wheel and process for producing the sharp-edge grinding wheel |
| WO2009107272A1 (en) * | 2008-02-25 | 2009-09-03 | 株式会社村田製作所 | Sharp-edge grinding wheel |
| JP2019130649A (en) * | 2018-02-02 | 2019-08-08 | 株式会社ディスコ | Annular grindstone, and method for manufacture of annular grindstone |
| CN113500502A (en) * | 2021-09-13 | 2021-10-15 | 盛吉盛(宁波)半导体科技有限公司 | Grinding wheel, grinding device and grinding machine for processing semiconductor epitaxial quartz component |
| CN113500502B (en) * | 2021-09-13 | 2021-11-30 | 盛吉盛(宁波)半导体科技有限公司 | Grinding wheel, grinding device and grinding machine for processing semiconductor epitaxial quartz component |
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