JPH06196857A - Working method of half-divided through hole in printed-wiring board - Google Patents
Working method of half-divided through hole in printed-wiring boardInfo
- Publication number
- JPH06196857A JPH06196857A JP35821792A JP35821792A JPH06196857A JP H06196857 A JPH06196857 A JP H06196857A JP 35821792 A JP35821792 A JP 35821792A JP 35821792 A JP35821792 A JP 35821792A JP H06196857 A JPH06196857 A JP H06196857A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- cut
- metal
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Milling Processes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、プリント配線板の外形
加工に於ける半割スルホールの加工方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a half through hole in the outer shape processing of a printed wiring board.
【0002】[0002]
【従来の技術】従来よりプリント配線板の外形加工に於
いては、図6に示すようにプリント配線板1の外周部の
スルホール2をルーティングにより半割りカットしてい
る。このスルホール2の半割りカットにより図7、8に
示すように半割りスルホール3の両端部に金属ばり4や
金属のめくれ5が発生する。図7に示す場合、ルーター
は時計方向に回転しながら矢印のように左方から右方へ
切削するので、半割りスルホール3の左端に平板状の金
属ばり4が発生し、右端に針状の金属ばり4が発生す
る。図8に示す場合、ルーターは時計方向に回転しなが
ら矢印のように右方から左方へ切削するので、半割りス
ルホール3の右端に金属のめくれ5が発生し、左端に平
板状の金属ばり4が発生する。このように半割りスルホ
ール3の両端部に発生した金属ばり4や金属のめくれ5
は、その後除去しなければならないので、プリント配線
板1の外形加工を能率良く行なうことができない。2. Description of the Related Art Conventionally, in external processing of a printed wiring board, as shown in FIG. 6, a through hole 2 on the outer peripheral portion of the printed wiring board 1 is cut in half by routing. Due to the half cut of the through hole 2, metal burrs 4 and metal curls 5 are generated at both ends of the half through hole 3 as shown in FIGS. In the case shown in FIG. 7, the router cuts from left to right as shown by the arrow while rotating clockwise, so that a flat metal beam 4 is generated at the left end of the half-thru hole 3 and a needle-like beam is formed at the right end. A metal flash 4 is generated. In the case shown in FIG. 8, the router cuts from the right to the left as shown by the arrow while rotating in the clockwise direction, so metal swelling 5 is generated at the right end of the half-through hole 3, and a flat metal burr is formed at the left end. 4 occurs. In this way, metal burrs 4 and metal curl 5 generated at both ends of the half-thru hole 3
Must be removed thereafter, so that the outer shape of the printed wiring board 1 cannot be efficiently processed.
【0003】[0003]
【発明が解決しようとする課題】そこで本発明は、半割
りスルホールの加工で金属ばりや金属のめくれを無くし
て、プリント配線板の外形加工の能率化を図ることので
きるプリント配線板半割りスルホールの加工方法を提供
しようとするものである。SUMMARY OF THE INVENTION Therefore, according to the present invention, a half-divided through hole of a printed wiring board can be obtained by processing a half-divided through-hole so as to eliminate metal burrs and curling of the metal so as to improve the efficiency of external processing of the printed wiring board. It is intended to provide a processing method of.
【0004】[0004]
【課題を解決するための手段】上記課題を解決するため
の本発明のプリント配線板半割りスルホールの加工方法
は、プリント配線板の半割りするスルホールの片側金属
部をドリリングにより除去し、次にルーティングにより
スルホールの半割りカットを行ない、次いでプリント配
線板を裏返しにセットし直して半割りスルホールの他の
片側に発生した金属ばりをドリリングにより付け根より
除去することを特徴とするものである。In order to solve the above-mentioned problems, a method of processing a through-hole for a printed wiring board according to the present invention is to remove one side metal part of the through-hole into a half of the printed wiring board by drilling, and then It is characterized in that the through hole is cut in half by routing, and then the printed wiring board is set upside down to remove the metal burr generated on the other side of the half through hole by drilling.
【0005】[0005]
【作用】上記のように本発明のプリント配線板半割りス
ルホールの加工方法は、プリント配線板のスルホールを
ルーティングにより半割りカットを行なう前に、半割り
するスルホールの片側金属部をドリリングにより除去す
るので、ルーティングによりスルホールを半割りカット
した際、ドリリングした片側には金属ばりが発生しな
い。また本発明のプリント配線板半割りスルホールの加
工方法は、スルホールの半割りカット後プリント配線板
を裏返しにセットし直して半割りスルホールの他の片側
に発生した金属ばりをドリリングにより付け根より除去
するので、金属ばりや金属のめくれの無い半割りスルホ
ールが得られる。As described above, according to the method for processing a through hole of a printed wiring board of the present invention, the metal portion on one side of the through hole to be divided is removed by drilling before the through hole of the printed wiring board is cut by routing. Therefore, when the through hole is cut in half by routing, metal burrs do not occur on the drilled side. Further, in the method for processing a half cut through hole of a printed wiring board of the present invention, after the half cut of the through hole, the printed wiring board is set upside down and the metal burr generated on the other side of the half cut through hole is removed from the root by drilling. As a result, you can get a half-divided through hole without metal flash or metal turning.
【0006】[0006]
【実施例】本発明のプリント配線板半割りスルホールの
加工方法の一実施例を図によって説明すると、図1に示
すプリント配線板1の外周部のスルホール2を、プリン
ト配線板1の外形加工線Cに沿って半割りカットするに
先立って、図2に示すようにその半割りするスルホール
2の片側金属部を切り落とし材6側から点線の円形に示
す部分aをドリリングして切除した。次にプリント配線
板1の外形加工線Cに沿ってルータを時計方向に回転さ
せながら左方から右方へ移動してルーティングを行なっ
て図3に示すように切り落とし材6を切削除去し、スル
ホール2の半割りカットを行なった。この半割りカット
により得られた半割りスルホール3の他の片側には金属
ばり4が生じた。次いでプリント配線板1を図4に示す
ように裏返しにセットし直して、半割りスルホール3の
他の片側に生じた金属ばり4を点線の円形に示す部分b
でドリリングして付け根より切除した。かくして半割り
スルホール3は、図5に示すように金属ばりや金属のめ
くれの無い形状の一定した精度の良いものが得られた。
尚、上記実施例ではランドなしのスルホールの例につい
て述べたが、本発明はこれに限るものではなく、ランド
付きスルホールについてもよいものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for processing a through hole of a printed wiring board according to the present invention will be described with reference to the drawings. The through hole 2 on the outer peripheral portion of the printed wiring board 1 shown in FIG. Prior to half-cutting along C, the metal part on one side of the through-hole 2 to be half-cut was cut off from the cut-off material 6 side by drilling a portion a indicated by a dotted circle as shown in FIG. Next, while rotating the router clockwise along the outer shape processing line C of the printed wiring board 1, the router is moved from left to right for routing and the cut-off material 6 is cut and removed as shown in FIG. A half cut was made. A metal beam 4 was formed on the other side of the half through hole 3 obtained by this half cut. Next, the printed wiring board 1 is set upside down as shown in FIG. 4, and the metal burr 4 formed on the other side of the half-divided through-hole 3 is indicated by a dotted circle b.
It was drilled and cut from the base. Thus, as shown in FIG. 5, the half-divided through-hole 3 has a shape with no metal burr and no metal swelling and a constant precision.
In addition, although the example of the through hole having no land has been described in the above embodiment, the present invention is not limited to this, and a through hole having a land may be used.
【0007】[0007]
【発明の効果】以上の通り本発明のプリント配線板半割
りスルホールの加工方法によれば、金属ばりや金属のめ
くれの無い形状の一定した精度の良い半割りスルホール
が得られるので、従来のように半割りスルホールの加工
後金属ばりや金属のめくれを除去する作業が不要とな
り、プリント配線板の外形加工の能率化に寄与できる。As described above, according to the method for processing a half-through hole of a printed wiring board of the present invention, a half-through hole having a constant shape and a good shape without a metal burr or a metal curl can be obtained. In addition, it is not necessary to remove the metal burr and the metal curl after processing the half-divided through-hole, which can contribute to the efficiency of the external processing of the printed wiring board.
【図1】本発明のプリント配線板半割りスルホールの加
工方法の一実施例の工程を示す図である。FIG. 1 is a diagram showing steps of an embodiment of a method for processing a half-through hole of a printed wiring board according to the present invention.
【図2】本発明のプリント配線板半割りスルホールの加
工方法の一実施例の工程を示す図である。FIG. 2 is a diagram showing steps of an embodiment of a method for processing a half-through hole of a printed wiring board according to the present invention.
【図3】本発明のプリント配線板半割りスルホールの加
工方法の一実施例の工程を示す図である。FIG. 3 is a diagram showing steps of an embodiment of a method for processing a half-through hole of a printed wiring board according to the present invention.
【図4】本発明のプリント配線板半割りスルホールの加
工方法の一実施例の工程を示す図である。FIG. 4 is a diagram showing steps of an embodiment of a method for processing a printed wiring board half-divided through hole of the present invention.
【図5】本発明のプリント配線板半割りスルホールの加
工方法の一実施例の工程を示す図である。FIG. 5 is a diagram showing steps of an embodiment of a method of processing a through-hole for a printed wiring board according to the present invention.
【図6】プリント配線板外周部のスルホールを示す図で
ある。FIG. 6 is a diagram showing a through hole on the outer peripheral portion of the printed wiring board.
【図7】図6のスルホールを左方から右方へルーティン
グして半割りカットした状態を示す図である。FIG. 7 is a diagram showing a state in which the through hole of FIG. 6 is routed from left to right and cut in half.
【図8】図6のスルホールを右方から左方へルーティン
グして半割りカットした状態を示す図である。8 is a diagram showing a state in which the through hole in FIG. 6 is routed from right to left and cut in half.
【符号の説明】 1 プリント配線板 2 スルホール 3 半割りスルホール 4 金属ばり[Explanation of symbols] 1 printed wiring board 2 through hole 3 half through hole 4 metal beam
Claims (1)
の片側金属部をドリリングにより除去し、次にルーティ
ングによりスルホールの半割りカットを行ない、次いで
プリント配線板を裏返しにセットし直して半割りスルホ
ールの他の片側に発生した金属ばりをドリリングにより
付け根より除去することを特徴とするプリント配線板半
割りスルホールの加工方法。1. A metal part on one side of a through hole to be halved of a printed wiring board is removed by drilling, then the through hole is halved by routing, and then the printed wiring board is set upside down to reset the halved through hole. A method for processing a half-through hole of a printed wiring board, characterized in that metal burrs generated on the other side are removed from the root by drilling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4358217A JP2931731B2 (en) | 1992-12-25 | 1992-12-25 | Processing method of half-hole through hole for printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4358217A JP2931731B2 (en) | 1992-12-25 | 1992-12-25 | Processing method of half-hole through hole for printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06196857A true JPH06196857A (en) | 1994-07-15 |
JP2931731B2 JP2931731B2 (en) | 1999-08-09 |
Family
ID=18458145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4358217A Expired - Lifetime JP2931731B2 (en) | 1992-12-25 | 1992-12-25 | Processing method of half-hole through hole for printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2931731B2 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0888038A1 (en) * | 1997-06-24 | 1998-12-30 | TDK Corporation | Surface mounted electronic parts and manufacturing method therefor |
KR20020085635A (en) * | 2001-05-09 | 2002-11-16 | 주식회사 심텍 | Routing method of the outside of a castle type printed circuit board |
WO2011148491A1 (en) * | 2010-05-27 | 2011-12-01 | 三菱電機株式会社 | Process for production of semiconductor device |
TWI401126B (en) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
CN104289737A (en) * | 2013-07-18 | 2015-01-21 | 深圳市大族激光科技股份有限公司 | Stacked slotted hole drilling machining method |
CN108237253A (en) * | 2018-02-05 | 2018-07-03 | 惠州联创宏科技有限公司 | A kind of high non-metallic half bore CNC processing methods of TG planks PCB |
CN109152224A (en) * | 2018-10-17 | 2019-01-04 | 同健(惠阳)电子有限公司 | A kind of manufacture craft of metallized semi-pore wiring board |
CN113473711A (en) * | 2021-05-06 | 2021-10-01 | 江门崇达电路技术有限公司 | Method for removing copper wires in hole of L-shaped groove of PCB |
CN113784521A (en) * | 2021-09-06 | 2021-12-10 | 大连崇达电路有限公司 | Manufacturing method for improving copper pulling during routing of counter bore or platform on PTH through hole |
-
1992
- 1992-12-25 JP JP4358217A patent/JP2931731B2/en not_active Expired - Lifetime
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0888038A1 (en) * | 1997-06-24 | 1998-12-30 | TDK Corporation | Surface mounted electronic parts and manufacturing method therefor |
KR20020085635A (en) * | 2001-05-09 | 2002-11-16 | 주식회사 심텍 | Routing method of the outside of a castle type printed circuit board |
TWI401126B (en) * | 2006-09-28 | 2013-07-11 | Hitachi Via Mechanics Ltd | Shape processing method |
KR101400247B1 (en) * | 2006-09-28 | 2014-05-26 | 비아 메카닉스 가부시키가이샤 | Profile machining method |
WO2011148491A1 (en) * | 2010-05-27 | 2011-12-01 | 三菱電機株式会社 | Process for production of semiconductor device |
CN104289737A (en) * | 2013-07-18 | 2015-01-21 | 深圳市大族激光科技股份有限公司 | Stacked slotted hole drilling machining method |
CN108237253A (en) * | 2018-02-05 | 2018-07-03 | 惠州联创宏科技有限公司 | A kind of high non-metallic half bore CNC processing methods of TG planks PCB |
CN108237253B (en) * | 2018-02-05 | 2019-08-23 | 惠州联创宏科技有限公司 | A kind of high non-metallic half bore CNC processing method of TG plate PCB |
CN109152224A (en) * | 2018-10-17 | 2019-01-04 | 同健(惠阳)电子有限公司 | A kind of manufacture craft of metallized semi-pore wiring board |
CN113473711A (en) * | 2021-05-06 | 2021-10-01 | 江门崇达电路技术有限公司 | Method for removing copper wires in hole of L-shaped groove of PCB |
CN113784521A (en) * | 2021-09-06 | 2021-12-10 | 大连崇达电路有限公司 | Manufacturing method for improving copper pulling during routing of counter bore or platform on PTH through hole |
Also Published As
Publication number | Publication date |
---|---|
JP2931731B2 (en) | 1999-08-09 |
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