JPH06192471A - Semiconductive resin composition - Google Patents
Semiconductive resin compositionInfo
- Publication number
- JPH06192471A JPH06192471A JP34691692A JP34691692A JPH06192471A JP H06192471 A JPH06192471 A JP H06192471A JP 34691692 A JP34691692 A JP 34691692A JP 34691692 A JP34691692 A JP 34691692A JP H06192471 A JPH06192471 A JP H06192471A
- Authority
- JP
- Japan
- Prior art keywords
- plasticizer
- volume resistivity
- parts
- resin composition
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011342 resin composition Substances 0.000 title claims description 17
- 239000004014 plasticizer Substances 0.000 claims abstract description 25
- YKPUWZUDDOIDPM-SOFGYWHQSA-N capsaicin Chemical compound COC1=CC(CNC(=O)CCCC\C=C\C(C)C)=CC=C1O YKPUWZUDDOIDPM-SOFGYWHQSA-N 0.000 claims abstract description 24
- 229960002504 capsaicin Drugs 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 13
- 235000017663 capsaicin Nutrition 0.000 claims description 11
- 239000000463 material Substances 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 abstract description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 abstract description 4
- 229920005601 base polymer Polymers 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 4
- 230000001681 protective effect Effects 0.000 abstract description 4
- 230000000740 bleeding effect Effects 0.000 abstract description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 2
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229920000867 polyelectrolyte Polymers 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000007784 solid electrolyte Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 229910003480 inorganic solid Inorganic materials 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UAYWVJHJZHQCIE-UHFFFAOYSA-L zinc iodide Chemical compound I[Zn]I UAYWVJHJZHQCIE-UHFFFAOYSA-L 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- 235000002566 Capsicum Nutrition 0.000 description 1
- 240000008574 Capsicum frutescens Species 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001390 capsicum minimum Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- XWVQUJDBOICHGH-UHFFFAOYSA-N dioctyl nonanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCC(=O)OCCCCCCCC XWVQUJDBOICHGH-UHFFFAOYSA-N 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- XQHAGELNRSUUGU-UHFFFAOYSA-M lithium chlorate Chemical compound [Li+].[O-]Cl(=O)=O XQHAGELNRSUUGU-UHFFFAOYSA-M 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000013599 spices Nutrition 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導電性樹脂組成物に
係り、さらに詳しくは、体積抵抗率が105 〜107 Ωcm程
度でかつ透明性を備えた半導電性樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductive resin composition, and more particularly to a semiconductive resin composition having a volume resistivity of about 10 5 to 10 7 Ωcm and transparency.
【０００２】[0002]
【従来の技術】半導体などの電子部品の保護カバーや、
帯電防止フィルムなどに用いる材料として、体積抵抗率
が105 〜107 Ωcm程度で、かつ透明性を有する半導電材
料の要求がある。2. Description of the Related Art A protective cover for electronic parts such as semiconductors,
As a material used for an antistatic film or the like, there is a demand for a semiconductive material having a volume resistivity of about 10 5 to 10 7 Ωcm and having transparency.
【０００３】従来、105 〜107 Ωcm程度の体積抵抗率が
要求される用途には、ポリ塩化ビニルやポリエチレンな
どのベースポリマーに、導電性付与材として導電性カー
ボンや導電性金属粉末などを配合した半導電性樹脂組成
物が一般に使用されている。しかしながら、導電性カー
ボンや導電性金属粉末は、その添加によって透明性が損
なわれてしまうため、上記のような透明性が要求される
用途に用いることはできない。しかも、導電性カーボン
や導電性金属粉末には添加の際に環境を汚染するという
問題があった。さらに、その導電性付与効果に対する添
加量の調節が困難で、添加量のわずかな増減で体積抵抗
率が101 Ωcm程度に低下したり、逆に、体積抵抗率が10
10Ωcm程度とほとんど導電性を示さなくなるなど、その
中間の105 〜107 Ωcm程度の体積抵抗率を得ることが非
常に困難であるという問題もあった。Conventionally, in applications where a volume resistivity of about 10 5 to 10 7 Ωcm is required, a base polymer such as polyvinyl chloride or polyethylene is added with conductive carbon or conductive metal powder as a conductivity imparting material. The compounded semiconductive resin composition is generally used. However, since the conductive carbon and the conductive metal powder impair the transparency due to the addition thereof, they cannot be used for the above-mentioned applications requiring transparency. Moreover, the conductive carbon and the conductive metal powder have a problem of polluting the environment when added. Furthermore, it is difficult to control the amount added to the conductivity-imparting effect, and a slight increase or decrease in the amount decreases the volume resistivity to about 10 1 Ωcm, or conversely
There is also a problem that it is very difficult to obtain a volume resistivity of about 10 5 to 10 7 Ωcm, which is in the middle, such as showing almost no conductivity of about 10 Ωcm.
【０００４】一方、可塑剤を大量に配合した塩化ビニル
樹脂が導電性を示すことから、これを用いたフィルムを
帯電防止用フィルムとして用いることがあったが、その
導電性は低く、可塑剤に加え固体電解質を添加してもな
お、体積抵抗率107 Ωcmが限度であった。しかも、可塑
剤を大量に配合しているため、十分な強度が得られず、
また、可塑剤が表面にブリードしてくるなどの問題があ
った。On the other hand, since a vinyl chloride resin containing a large amount of a plasticizer exhibits conductivity, a film using this has been used as an antistatic film. Even if the solid electrolyte was added, the volume resistivity was still limited to 10 7 Ωcm. Moreover, since a large amount of plasticizer is blended, sufficient strength cannot be obtained,
In addition, there is a problem that the plasticizer bleeds to the surface.
【０００５】[0005]
【発明が解決しようとする課題】このように、体積抵抗
率が105 〜107 Ωcm程度で、かつ透明性を有する半導電
材料の要求があるが、導電性カーボンや導電性金属粉末
を用いると黒色などに着色されてしまって透明性がなく
なり、また、可塑剤を用いたものは、透明性は得られる
ものの、導電性が不十分で、しかも、強度の低下や、可
塑剤がブリードするなどの問題があった。As described above, there is a demand for a semiconductive material having a volume resistivity of about 10 5 to 10 7 Ωcm and transparency, but conductive carbon or conductive metal powder is used. When the plasticizer is used, transparency is obtained, but the conductivity is insufficient, and the strength decreases and the plasticizer bleeds. There was such a problem.
【０００６】本発明はこのような点に対処してなされた
もので、透明で、体積抵抗率が105〜107 Ωcm程度の導
電性を有し、しかも、強度が低下したり、添加剤がブリ
ードしてくるなどの不都合のない半導電性樹脂組成物を
提供することを目的とする。The present invention has been made in consideration of such a point, and is transparent, has a volume resistivity of about 10 5 to 10 7 Ωcm, and has a reduced strength or an additive. It is an object of the present invention to provide a semiconductive resin composition which does not cause inconvenience such as bleeding.
【０００７】[0007]
【課題を解決するための手段】本発明の半導電性樹脂組
成物は、ポリマー成分 100重量部あたり、可塑剤10〜10
0重量部と、カプサイシン 0.5〜20重量部を配合してな
ることを特徴としている。The semiconductive resin composition of the present invention comprises a plasticizer of 10 to 10 parts by weight per 100 parts by weight of a polymer component.
It is characterized in that 0 part by weight and 0.5 to 20 parts by weight of capsaicin are mixed.
【０００８】ここで、ベースとなるポリマーとしては、
塩化ビニル樹脂、塩化ビニリデン樹脂、ポリ酢酸ビニ
ル、ポリビニルブチラール、ポリビニルホルマール、ポ
リアクリル酸エステル、ニトロセルロース、天然ゴム、
合成ゴムなどがあげられる。Here, as the base polymer,
Vinyl chloride resin, vinylidene chloride resin, polyvinyl acetate, polyvinyl butyral, polyvinyl formal, polyacrylic acid ester, nitrocellulose, natural rubber,
Examples include synthetic rubber.
【０００９】また、可塑剤としては、ジ-n- オクチルフ
タレート（n-ＤＯＰ）、ジブチルフタレート（ＤＢＴ）
などのフタル酸系や、ジオクチルアジピン酸エステル
（ＤＯＡ）、ジオクチルアゼライン酸エステル（ＤＯ
Ｚ）などの脂肪酸系など、従来より可塑剤として一般に
知られるものの中から、使用するベースポリマーに適し
たものを 1種以上、適宜選択して使用すればよい。この
可塑剤は、本来の可塑剤としての作用のほかに、次述す
るカプサイシンとともに、本発明の半導電性樹脂組成物
に透明性を損なうことなく導電性を付与する作用を有す
るものである。この可塑剤の配合量は、ポリマー成分 1
00重量部あたり10〜 100重量部であるが、このように限
定した理由は、可塑剤の配合量がポリマー成分 100重量
部あたり10重量部未満では、導電性が不十分となり、逆
に 100重量部を越えると、効果は変わらないばかりか、
表面にブリードしてくるようになるからである。As the plasticizer, di-n-octyl phthalate (n-DOP), dibutyl phthalate (DBT)
Such as phthalate, dioctyl adipate (DOA), dioctyl azelate (DO
Among fatty acid-based compounds such as Z), which are generally known as plasticizers, one or more compounds suitable for the base polymer to be used may be appropriately selected and used. This plasticizer has, in addition to its original function as a plasticizer, a function of imparting conductivity to the semiconductive resin composition of the present invention without impairing transparency, together with capsaicin described below. The blending amount of this plasticizer is the polymer component 1
The amount is 10 to 100 parts by weight per 00 parts by weight, but the reason for this limitation is that if the amount of the plasticizer compounded is less than 10 parts by weight per 100 parts by weight of the polymer component, the conductivity will be insufficient, and conversely 100 parts by weight. The effect does not change when the number of divisions is exceeded,
This is because the surface will come to bleed.
【００１０】さらに、このような可塑剤と共に配合され
るカプサイシンは、トウガラシの果皮などに存在する無
色結晶性の物質で、本来、香辛料として使用されている
ものである。このカプサイシンの配合量は、ポリマー成
分 100重量部あたり 0.5〜20重量部であるが、このよう
に限定した理由は、カプサイシンの配合量がポリマー成
分 100重量部あたり 0.5重量部未満では、導電性が不十
分となり、逆に20重量部を越えると、効果は変わらない
ばかりか、低温特性、加工性が低下するからである。Further, capsaicin blended with such a plasticizer is a colorless and crystalline substance existing in the peel of capsicum and the like, and is originally used as a spice. The amount of capsaicin blended is 0.5 to 20 parts by weight per 100 parts by weight of the polymer component.The reason for limiting in this way is that if the amount of capsaicin blended is less than 0.5 parts by weight per 100 parts by weight of the polymer component, the conductivity will be low. This is because when the amount becomes insufficient, and conversely, when it exceeds 20 parts by weight, not only the effect does not change, but also the low temperature characteristics and workability deteriorate.
【００１１】本発明の半導電性樹脂組成物には、導電性
をさらに高めるために、有機系または無機系の各種固体
電解質を配合することができる。有機系の固体電解質と
しては、ポリエチレンオキサイドやポリメタクリル酸オ
リゴオキシエチレン（Na塩添加系）などがあげられ、ま
た、無機系の固体電解質としては、過塩素酸リチウムや
ヨウ化亜鉛などがあげられる。この固体電解質の配合量
としては、ポリマー成分 100重量部あたり 1〜50重量部
の範囲が適当である。なお、有機系の固体電解質を用い
る場合は、そのまま他の成分とともに混合すればよい
が、無機系の固体電解質を添加する場合は、エタノール
などの溶剤で溶解したものを予め可塑剤と均一に混合し
ておくことが望ましい。また、この他、本発明の半導電
性樹脂組成物には、必要に応じて、着色剤を配合するこ
とができ、さらに、安定剤、滑剤、充填剤その他の添加
剤を、本発明の効果を阻害しない範囲で配合することが
できる。The semiconductive resin composition of the present invention may be blended with various organic or inorganic solid electrolytes in order to further enhance the conductivity. Examples of organic solid electrolytes include polyethylene oxide and polymethacrylic acid oligooxyethylene (Na salt addition system), and examples of inorganic solid electrolytes include lithium perchlorate and zinc iodide. . A suitable amount of the solid electrolyte to be blended is 1 to 50 parts by weight per 100 parts by weight of the polymer component. When an organic solid electrolyte is used, it may be mixed as it is with other components.However, when an inorganic solid electrolyte is added, a substance dissolved in a solvent such as ethanol is mixed beforehand with a plasticizer. It is desirable to keep it. Further, in addition to this, the semiconductive resin composition of the present invention may be mixed with a colorant, if necessary, and further, a stabilizer, a lubricant, a filler and other additives may be added to the effect of the present invention. Can be blended within a range that does not inhibit
【００１２】[0012]
【作用】本発明においては、適当量の可塑剤とカプサイ
シンを併用したことによって、導電性カーボンや導電性
金属粉末を用いることなく、また、強度の低下や可塑剤
の表面へのブリードなどの不都合を招くことなく、組成
物に導電性を付与することができ、体積抵抗率が105 〜
107 Ωcm程度の導電性と、透明性を兼備した半導電性樹
脂組成物を得ることができる。したがって、このような
導電性と透明性が要求される用途、たとえば、電子部品
の保護カバーや、帯電防止フィルムもしくはシート、さ
らには、高分子固体電解質材料や、ポリマーバッテリー
電極材料などとして有用である。In the present invention, by using an appropriate amount of the plasticizer and capsaicin in combination, the conductive carbon and the conductive metal powder are not used, and the strength is lowered and the plasticizer bleeds to the surface. without causing, it is possible to impart conductivity to the composition, a volume resistivity of 10 5 to
It is possible to obtain a semiconductive resin composition having both conductivity of about 10 7 Ωcm and transparency. Therefore, it is useful as an application requiring such conductivity and transparency, for example, a protective cover for electronic parts, an antistatic film or sheet, a polymer solid electrolyte material, a polymer battery electrode material, and the like. .
【００１３】[0013]
【実施例】次に、本発明の実施例を記載する。 実施例１ 乳化重合して得られた平均重合度が1750のポリ塩化ビニ
ル（塩化ビニル樹脂Ａ） 100重量部と、ジオクチルアジ
ピン酸エステル（ＤＯＡ）50重量部と、カプサイシン10
重量部と、安定剤としてエポキシ化大豆油およびジブチ
ル錫ジラウレート（ＤＢＴＤＬ）をそれぞれ 5重量部と
を均一に混合した後、 160℃に加熱した2本混練ロール
で混練して半導電性樹脂組成物を得た。次に、得られた
半導電性樹脂組成物を、シート状にプレス成形（プレス
温度120℃）して約 1mm厚のシートを作成し、このシー
トについて体積抵抗率を測定するとともに透明性を評価
した。なお、体積抵抗率は500Vの直流電圧を印加したと
きの漏れ電流から求めた。また、透明性は、紙の上にシ
ートを重ね、紙に印刷された10ポイント文字の判読の可
否で評価した。結果を表１の下欄に示す。EXAMPLES Next, examples of the present invention will be described. Example 1 100 parts by weight of polyvinyl chloride (vinyl chloride resin A) having an average degree of polymerization of 1750 obtained by emulsion polymerization, 50 parts by weight of dioctyl adipate (DOA), and capsaicin 10
1 part by weight and 5 parts by weight of epoxidized soybean oil and dibutyltin dilaurate (DBTDL) each as a stabilizer are uniformly mixed, and then kneaded by a two-kneading roll heated to 160 ° C to obtain a semiconductive resin composition. Got Next, the obtained semiconductive resin composition is press-formed into a sheet shape (pressing temperature 120 ° C) to form a sheet with a thickness of about 1 mm, and the volume resistivity of this sheet is measured and the transparency is evaluated. did. The volume resistivity was obtained from the leakage current when a DC voltage of 500V was applied. The transparency was evaluated by the legibility of the 10-point character printed on the paper by stacking the sheet on the paper. The results are shown in the lower column of Table 1.
【００１４】実施例２〜６ 組成を表１に示すように変えた以外は、上記実施例１の
場合と同様にして半導電性樹脂組成物を得た（但し、実
施例４においては、過塩素酸リチウムをエタノールに溶
解したものを予め可塑剤ＤＯＡと混合しておき、これを
他の成分と混合させた。）。Examples 2 to 6 Semiconductive resin compositions were obtained in the same manner as in Example 1 except that the composition was changed as shown in Table 1. (However, in Example 4, A solution of lithium chlorate dissolved in ethanol was mixed with the plasticizer DOA in advance, and this was mixed with other components.).
【００１５】得られた半導電性樹脂組成物について、実
施例１と同様にして、体積抵抗率および透明性を評価し
た。結果を表１の下欄に示す。なお、表中、比較例と示
したのは、比較例１が、実施例１の場合において、カプ
サイシンを配合せず、ポリ塩化ビニルに可塑剤と安定剤
のみを添加した例、比較例２が、実施例１の場合におい
て、カプサイシンに代えて固体電解質を配合した例、比
較例３が、比較例２の配合成分にさらに導電性のカーボ
ンブラックを配合した例で、いずれも本発明との比較の
ために示したものである。With respect to the obtained semiconductive resin composition, volume resistivity and transparency were evaluated in the same manner as in Example 1. The results are shown in the lower column of Table 1. In the table, Comparative Example shows that in Comparative Example 1, in the case of Example 1, Capsaicin was not blended, but only a plasticizer and a stabilizer were added to polyvinyl chloride, and Comparative Example 2 was In the case of Example 1, an example in which a solid electrolyte is blended in place of capsaicin, and Comparative Example 3 is an example in which conductive carbon black is further blended in the blending component of Comparative Example 2, and both are compared with the present invention. Is shown for.
【００１６】[0016]
【表１】 表１からも明らかなように、本発明にかかる半導電性樹
脂組成物が、いずれも体積抵抗率が105 〜107 Ωcmの導
電性と、良好な透明性を有していたのに対し、比較例の
ものでは、導電性、もしくは導電性と透明性に欠けてお
り、これによって、本発明の効果を確認することができ
た。[Table 1] As is clear from Table 1, the semiconductive resin compositions according to the present invention had a volume resistivity of 10 5 to 10 7 Ωcm and good transparency. The comparative examples lacked conductivity or conductivity and transparency, and the effect of the present invention could be confirmed.
【００１７】[0017]
【発明の効果】以上の実施例からも明らかなように、本
発明の半導電性樹脂組成物は、体積抵抗率が105 〜107
Ωcm程度の導電性と、良好な透明性を兼備し、しかも、
可塑剤の配合量は可塑剤として通常使用する範囲内の量
であるため、強度が低下したり可塑剤が表面にブリード
することもない。したがって、電子部品の保護カバー材
料や、帯電防止フィルムもしくはシート材料、さらに
は、高分子固体電解質材料や、ポリマーバッテリー電極
材料などとして好適している。As is apparent from the above examples, the semiconductive resin composition of the present invention has a volume resistivity of 10 5 to 10 7
Combines conductivity of about Ωcm and good transparency, and
Since the compounding amount of the plasticizer is within the range usually used as the plasticizer, the strength does not decrease and the plasticizer does not bleed on the surface. Therefore, it is suitable as a protective cover material for electronic parts, an antistatic film or sheet material, a polymer solid electrolyte material, a polymer battery electrode material, and the like.
【００１８】[0018]
Claims (1)
10〜 100重量部と、カプサイシン 0.5〜20重量部を配合
してなることを特徴とする半導電性樹脂組成物。1. A plasticizer per 100 parts by weight of a polymer component.
A semiconductive resin composition comprising 10 to 100 parts by weight of capsaicin and 0.5 to 20 parts by weight of capsaicin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34691692A JPH06192471A (en) | 1992-12-25 | 1992-12-25 | Semiconductive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34691692A JPH06192471A (en) | 1992-12-25 | 1992-12-25 | Semiconductive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06192471A true JPH06192471A (en) | 1994-07-12 |
Family
ID=18386682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34691692A Withdrawn JPH06192471A (en) | 1992-12-25 | 1992-12-25 | Semiconductive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06192471A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7233479B2 (en) * | 2003-04-04 | 2007-06-19 | Daimlerchrysler Ag | Device for protecting a battery from electrostatic charging |
| US9753008B2 (en) | 2015-11-10 | 2017-09-05 | Woodham Biotechnology Holdings, LLC | Gel electrophoresis and transfer combination using conductive polymers and method of use |
-
1992
- 1992-12-25 JP JP34691692A patent/JPH06192471A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7233479B2 (en) * | 2003-04-04 | 2007-06-19 | Daimlerchrysler Ag | Device for protecting a battery from electrostatic charging |
| US9753008B2 (en) | 2015-11-10 | 2017-09-05 | Woodham Biotechnology Holdings, LLC | Gel electrophoresis and transfer combination using conductive polymers and method of use |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000307 |