JPH06190725A - Alumina type grinding wheel - Google Patents

Alumina type grinding wheel

Info

Publication number
JPH06190725A
JPH06190725A JP34824792A JP34824792A JPH06190725A JP H06190725 A JPH06190725 A JP H06190725A JP 34824792 A JP34824792 A JP 34824792A JP 34824792 A JP34824792 A JP 34824792A JP H06190725 A JPH06190725 A JP H06190725A
Authority
JP
Japan
Prior art keywords
grindstone
plate
grinding
alumina
binder resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34824792A
Other languages
Japanese (ja)
Other versions
JP3232323B2 (en
Inventor
Yasuo Shibazaki
靖雄 芝崎
Yoshitaka Nagai
嘉隆 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
YKK Corp
Original Assignee
Agency of Industrial Science and Technology
YKK Corp
Yoshida Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, YKK Corp, Yoshida Kogyo KK filed Critical Agency of Industrial Science and Technology
Priority to JP34824792A priority Critical patent/JP3232323B2/en
Publication of JPH06190725A publication Critical patent/JPH06190725A/en
Application granted granted Critical
Publication of JP3232323B2 publication Critical patent/JP3232323B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To enhance the grinding efficiency, generate a finish surface of high quality, and provide easy manufacturability for an ultra-thin grinding wheel by forming a grinding layer in which plate-form alumina grains are uniformly dispersed and oriented in a binder resin. CONSTITUTION:Fine powder of plate-form alumina particles is generated in which the crystal form with similar particle sizes is hexagonal and a specific crystal surface is grown in the form of flat plate, and is used as abrasive grains, whereto a thermohardening resin as a binder is added so as to be equal amount, followed by mixing together. The inside of a nozzle is filled with this mixture, followed by heating till a temp. at which the binder resin is turned in semi- molten state. Right under the nozzle, the film substrate of polyethylene terephthalate is arranged, and thereover a grinding layer is formed to a thickness of approx. 200mum. The resultant is dried and press shaped to fabricate a grindstone. The grinding layer of the resultant grindstone is so formed that plate-form alumina particles as grindstone are uniformly dispersed and oriented in the binder resin.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はアルミナ質砥石に関す
る。更に詳細には磁気ディスク基板、SiやGaAs等
の半導体基板、薄膜磁気ハード基板、単結晶材料、セラ
ミックスガラス等の研削加工、切断加工、溝加工等及び
鏡面加工に用いられるアルミナ質砥石に関する。
FIELD OF THE INVENTION The present invention relates to an alumina grindstone. More specifically, the present invention relates to an alumina grindstone used for a magnetic disk substrate, a semiconductor substrate such as Si or GaAs, a thin film magnetic hard substrate, a single crystal material, ceramic glass, etc. for grinding, cutting, grooving, and mirror finishing.

【0002】[0002]

【従来の技術】従来、光学、エレクトロニクス、オプト
エレクトロニクス等の産業の進展に伴い、半導体基板、
酸化物単結晶、ガラス、金属等の加工に対する要求も厳
しくなり、切削加工や切断加工、溝加工に対しては、ダ
イヤモンド砥石を主とした平面研削盤又は円筒研削盤、
ダイヤモンド研削盤等での加工が主である。
2. Description of the Related Art Conventionally, with the progress of industries such as optics, electronics, and optoelectronics, semiconductor substrates,
The requirements for processing oxide single crystals, glass, metals, etc. are becoming stricter, and for cutting, cutting, and grooving, a surface grinder or a cylindrical grinder mainly using a diamond grindstone,
Mainly processing with a diamond grinder.

【0003】一般にダイヤモンドの砥粒を結合材で固定
した砥石を用いてセラミック等の硬脆材料を加工してい
る。ダイヤモンド砥粒は、硬脆材料を破砕することで研
削するためその加工メカニズムからさほど高品位な仕上
げ面が得られない。そのため微細な砥粒でもって加工面
を高品位にする必要があり、研削加工後ラッピングやポ
リッシングをしている。砥粒を細かくしていくと加工面
は滑らかになるが、砥粒の脱落が早くなったり、研削屑
が詰ったりで連続的に効率的に高品位の研削加工ができ
なくなる。
Generally, hard and brittle materials such as ceramics are processed by using a grindstone in which diamond abrasive grains are fixed by a binder. Since diamond abrasive grains are ground by crushing a hard and brittle material, a very high quality finished surface cannot be obtained due to the processing mechanism. Therefore, it is necessary to improve the quality of the processed surface with fine abrasive grains, and lapping or polishing is performed after grinding. The finer the abrasive grains become, the smoother the machined surface becomes, but the abrasive grains fall off more quickly and the grinding debris becomes clogged, making it impossible to continuously and efficiently perform high-quality grinding.

【0004】又、切断用にダイヤモンド砥粒を使用した
ものは高価であり、砥石幅を薄くできないため、切断
幅、溝加工幅が大きくなり、高級材料の加工屑が多くで
る上、作業効率の悪い問題があった。
Further, the one using diamond abrasive grains for cutting is expensive and the width of the grindstone cannot be made thin, so that the cutting width and the groove processing width become large, and a lot of processing waste of high-grade material is produced, and the working efficiency is high. I had a bad problem.

【0005】砥粒としてダイヤモンドの他、アルミナ、
シリカ、酸化セリウム、酸化ジルコニウム、酸化クロ
ム、酸化鉄、炭化珪素等が知られている。なかでもアル
ミナは硬度が高く優れた研削性能を有し、入手もしやす
い材料であり、研削用砥粒として広く使用されてきた。
しかしこれらの砥粒は、塊状の粒子を使用するものであ
り、研削時の発熱量も大きく研削中、容易に1000℃
を越え、被加工材の焼き付き・変形を生じ、アルミナの
研削能力を充分生かしたものでなかった。
As abrasive grains, in addition to diamond, alumina,
Silica, cerium oxide, zirconium oxide, chromium oxide, iron oxide, silicon carbide and the like are known. Among them, alumina is a material that has high hardness and excellent grinding performance and is easily available, and has been widely used as an abrasive grain for grinding.
However, these abrasive grains use agglomerated particles, and the amount of heat generated during grinding is large, so that the temperature of 1000 ° C. is easily maintained during grinding.
And the seizure and deformation of the work material occurred, and the grinding ability of alumina was not fully utilized.

【0006】[0006]

【発明が解決しようとする課題】かかる事情に鑑み、本
発明は研削能率が高く、かつ高品位の仕上げ面を得るこ
とができるアルミナ質砥石を提供することを目的とする
ものである。
SUMMARY OF THE INVENTION In view of such circumstances, an object of the present invention is to provide an alumina grindstone having a high grinding efficiency and capable of obtaining a high quality finished surface.

【0007】[0007]

【課題を解決するための手段】本発明者は、鋭意検討し
た結果、特定の形状をしたアルミナ粉末を使用した場合
に前記目的を全て満足する砥石が得られ、かつ今まで製
造が困難であった超薄型の砥石を提供できることを見出
し、本発明を完成するに至った。
Means for Solving the Problems As a result of diligent studies, the present inventor has found that when an alumina powder having a specific shape is used, a grindstone satisfying all the above objects can be obtained, and it has been difficult to manufacture until now. The inventors have found that an ultra-thin whetstone can be provided and have completed the present invention.

【0008】すなわち、本発明は板状アルミナ粒子をバ
インダー樹脂中に配向させてなる研削層を形成したアル
ミナ質砥石を要旨とするものである。
That is, the gist of the present invention is an alumina grindstone having a grinding layer formed by orienting plate-like alumina particles in a binder resin.

【0009】本発明は板状のアルミナ粒子をドクターブ
レード法や湿式又は乾式のプレス又はロール成形の方法
でプレスして成形被加工物に対し直角になるよう配向さ
せたり、又は砥粒と結合剤などの混合物を高速で回転さ
せ、遠心力で板状アルミナ粒子を配向して砥石を成形・
焼成し砥石をつくり、板状アルミナのエッジ部で被加工
物を研削することによりアルミナの優れた研削能力を引
き出すものである。平面の研削加工に対しては、板状ア
ルミナ粒子のエッジ部で研削するため加工速度が早いの
みならず、高品位の仕上げ面を得ることができる。又、
切断加工や溝加工などの砥石に対しては、板状アルミナ
粒子を配向させるため砥石幅を超薄型に製造でき、S
i,GaAs等の高級材料の切断加工や溝加工において
も0.1mm以下の加工幅を小さくした微細切断加工や
微細溝加工が高精度で可能となり、かつ高速で高品位の
仕上げ面をもつ加工ができ、加工時の発熱も抑えること
のできる砥石を提供することができる。
In the present invention, plate-like alumina particles are pressed by a doctor blade method or a wet or dry press or roll forming method so as to be oriented at right angles to an object to be formed, or abrasive grains and a binder. The mixture is rotated at high speed, and the plate-shaped alumina particles are oriented by centrifugal force to form a grindstone.
By firing to make a grindstone and grinding the work piece at the edge of the plate-shaped alumina, the excellent grinding ability of alumina is brought out. In the case of flat surface grinding, since the edges of the plate-like alumina particles are ground, not only the processing speed is high, but also a high-quality finished surface can be obtained. or,
For grindstones such as cutting and grooving, since the plate-shaped alumina particles are oriented, the grindstone width can be made ultra-thin.
Even in the cutting and grooving of high-grade materials such as i and GaAs, fine cutting and fine grooving with a small working width of 0.1 mm or less are possible with high precision, and processing with a high-quality finished surface at high speed. Therefore, it is possible to provide a grindstone capable of suppressing heat generation during processing.

【0010】本発明は板状のアルミナ粒子をドクターブ
レード法や湿式又は乾式のプレス又はロール成形の方法
でプレスして成形被加工物に対し板状粒子面が平行にな
るよう配向させたり、又は砥粒と結合剤などの混合物を
高速で回転させ、遠心力で板状アルミナ粒子を配向して
砥石を成形・焼成し砥石をつくり、板状アルミナのエッ
ジ部又は/及び平面部で被加工物を研磨することにより
アルミナの優れた研磨能力を引き出すものである。平面
の研磨加工に対しては、板状アルミナ粒子のエッジ部と
平面部で研磨するため加工速度が早いのみならず、高品
位の仕上げ面を得ることができる。又、精密部品等の加
工に際し、通常の平面研削盤でダイヤモンド又はアルミ
ナ質砥石等で荒仕上げの研削をした後砥石を本発明の研
磨砥石に変えるだけで鏡面仕上げ面を得れ、高速で高品
位の仕上げ面をもつ加工ができ、加工時の発熱も抑える
ことのできる研磨砥石を提供することにある。
In the present invention, the plate-like alumina particles are pressed by a doctor blade method or a wet or dry press or roll forming method to orient the plate-like particle surfaces parallel to the work to be formed, or A mixture of abrasive grains and a binder is rotated at high speed, and centrifugal force is applied to orient the plate-shaped alumina particles to form a grindstone and fire it to form a grindstone, and the work piece is processed at the edge portion and / or flat surface portion of the plate-shaped alumina It is intended to bring out the excellent polishing ability of alumina by polishing. With respect to the flat surface polishing processing, since polishing is performed at the edge portion and the flat surface portion of the plate-like alumina particles, not only the processing speed is high, but also a high-quality finished surface can be obtained. Also, when processing precision parts, etc., you can obtain a mirror-finished surface simply by changing the grindstone to the polishing grindstone of the present invention after rough grinding with a diamond or alumina grindstone etc. with a normal surface grinder, and high speed at high speed. An object of the present invention is to provide a polishing whetstone that can be machined with a finished surface of quality and that can suppress heat generation during machining.

【0011】本発明に使用するアルミナ粒子は、粒子径
0.1〜100μm、アスペクト比5〜20の板状αア
ルミナ粒子で、好ましくは粒子径0.5〜50μm、ア
スペクト比5〜20であるが、被加工物の材質及び仕上
げ面の要求に合わせ選択する必要がある。
The alumina particles used in the present invention are plate-like α-alumina particles having a particle diameter of 0.1 to 100 μm and an aspect ratio of 5 to 20, preferably 0.5 to 50 μm and an aspect ratio of 5 to 20. However, it is necessary to select it according to the requirements of the material and finished surface of the work piece.

【0012】本発明に使用するバインダー材としては、
2液硬化性ウレタン樹脂、1液硬化性ウレタン樹脂、エ
ポキシ樹脂、ポリアミド樹脂、不飽和ポリエステル樹脂
等が好ましく、又用途によっては熱可塑性樹脂も使用す
ることができる。
As the binder material used in the present invention,
A two-component curable urethane resin, a one-component curable urethane resin, an epoxy resin, a polyamide resin, an unsaturated polyester resin and the like are preferable, and a thermoplastic resin can also be used depending on the application.

【0013】アルミナ粒子研削層を担持するフィルム基
体はテープ、シート、ディスクなどの形態で使用するこ
とができ、またこれらはポリエチレンテレフタレート、
ポリイミド、ポリカーボネート等及びそれらを表面処理
したもの、その他合成紙、不織布などの材質で構成する
ことができる。
The film substrate carrying the alumina particle grinding layer can be used in the form of tapes, sheets, disks and the like, and these are polyethylene terephthalate,
It may be made of polyimide, polycarbonate or the like, a surface-treated product thereof, or other material such as synthetic paper or non-woven fabric.

【0014】又、実験によれば使用する板状アルミナ砥
粒の研削層中における砥粒濃度は、30%未満であると
研削能率が悪いものとなり、90%を越えるとバインダ
ー樹脂の割合が少なくなり、研削中に砥粒の脱落が早く
なるので、砥粒濃度としては、30〜90%の範囲が適
当である。
Further, according to experiments, if the abrasive grain concentration of the plate-like alumina abrasive grains used in the abrasive layer is less than 30%, the grinding efficiency becomes poor, and if it exceeds 90%, the proportion of the binder resin is small. Since the abrasive grains fall off quickly during grinding, the abrasive grain concentration is preferably in the range of 30 to 90%.

【0015】本発明のアルミナ砥石の形状は特に制限さ
れるものではないが、図1〜7にその例を挙げる。
The shape of the alumina grindstone of the present invention is not particularly limited, but examples thereof are shown in FIGS.

【0016】図1,3,5,6及び図7は後記する実施
例1と同様に板状アルミナを配向させた種々の形態の砥
石の説明図である。図2は図1の拡大図であり、これら
の図中に示されるAは、各研削層を示し、この研削層中
で板状アルミナ粉末が配向している。図中Aの線は板状
アルミナ粉末が配向している方向を模式的に表わしてい
る。図1はレジノイド切断用砥石、図3はホイール砥
石、図7はレジノイド補強材入り砥石を示す。
1, 3, 5, 6 and 7 are explanatory views of various types of grindstones in which plate-like alumina is oriented similarly to Example 1 described later. FIG. 2 is an enlarged view of FIG. 1, and A shown in these figures indicates each grinding layer, and the plate-like alumina powder is oriented in this grinding layer. The line A in the figure schematically represents the direction in which the plate-like alumina powder is oriented. FIG. 1 shows a grindstone for cutting resinoid, FIG. 3 shows a wheel grindstone, and FIG. 7 shows a grindstone containing a resinoid reinforcing material.

【0017】なお本発明において被加工物に対し板状粒
子面が垂直となるような(被加工物に対し板状粒子のア
スペクト比の小さな面が接触するような)砥石とするこ
とにより、研削加工に適したものとなる。また被加工物
に対し板状粒子面が平行となるような(被加工物に対し
アスペクト比の大きな面が接触するような)砥石とする
ことにより、研磨加工に適したものとなる。また研磨加
工については前者のように配向させたものにより、荒削
りを後者のように配向させたものにより仕上げ加工をす
るのが好ましい。
In the present invention, grinding is performed by using a grindstone in which the plate-like particle surface is perpendicular to the work piece (the surface of the plate-like particle having a small aspect ratio is in contact with the work piece). It is suitable for processing. Further, by using a grindstone in which the plate-like grain surface is parallel to the work piece (that is, the surface having a large aspect ratio contacts the work piece), it becomes suitable for polishing. As for the polishing process, it is preferable that the former is used for the orientation, and the rough cutting is performed for the latter, and the finishing is preferably performed.

【0018】[0018]

【実施例】以下、実施例に基づいて本発明を具体的に説
明する。
EXAMPLES The present invention will be specifically described below based on examples.

【0019】実施例1 バイヤー法による水酸化アルミニウムをボールミルにて
中心径0.7μmに粒度調整を行ったものを所定量のア
ルカリ水溶液でスラリーを作成し、これをオートクレー
ブに充填し、温度600℃、圧力200atmにて2時
間水熱処理を行った。処理後の生成物を、水洗、濾過、
乾燥して得られたアルミナ粉末は、粒径のそろった大き
さ1.0μm、厚さ0.1μmで結晶形が六方晶形で特
定の結晶面が平板状に成長した微細な板状アルミナ(α
−Al23)粒子の粉末を得た。得られた粉末を砥粒と
し、これにバインダー樹脂(結合剤)として、熱硬化性
樹脂(2液硬化性ウレタン樹脂)を同量となるように添
加し、これらを混合した。これを図12及び図13に示
されるノズル内に充填し、前記バインダー樹脂が半溶融
状態となる温度まで加熱し、半溶融物とした。一方、ノ
ズル(スリット状の孔径:0.2mm×30mm)の直
下には0.2mmの距離をおいて、ポリエチレンテレフ
タレートからなるフィルム基体(ディスク)を配し、こ
のフィルム基体上に研削層を厚さ200μで形成した。
Example 1 A slurry of aluminum hydroxide prepared by the Bayer method, the particle size of which was adjusted to a central diameter of 0.7 μm by a ball mill, was prepared with an alkaline aqueous solution in a predetermined amount, and the slurry was filled in an autoclave at a temperature of 600 ° C. Hydrothermal treatment was performed at a pressure of 200 atm for 2 hours. The product after treatment is washed with water, filtered,
Alumina powder obtained by drying is a fine plate-like alumina (α having a uniform particle size of 1.0 μm, a thickness of 0.1 μm, a hexagonal crystal form and a specific crystal face grown in a flat plate shape (α
To obtain a powder -Al 2 O 3) particles. The obtained powder was used as abrasive grains, and a thermosetting resin (two-component curable urethane resin) was added thereto as a binder resin (binding agent) in the same amount, and these were mixed. This was filled in the nozzle shown in FIG. 12 and FIG. 13, and heated to a temperature at which the binder resin was in a semi-molten state to obtain a semi-molten material. On the other hand, a film substrate (disk) made of polyethylene terephthalate is arranged at a distance of 0.2 mm directly below the nozzle (slit-shaped hole diameter: 0.2 mm x 30 mm), and a grinding layer is thickly formed on this film substrate. Formed with a thickness of 200 μ.

【0020】この際の半溶融物の押出条件は剪断速度2
0s-1以上となるように押出圧力を60kgf/cm2
とした。
The extrusion conditions for the semi-molten material at this time are as follows: shear rate 2
Extrusion pressure is 60 kgf / cm 2 so that it becomes 0 s −1 or more.
And

【0021】次にこれを乾燥させ、プレス成形し、砥石
を作製した。得られた砥石の研削層は、図10及び図1
1に示されるように、バインダー樹脂中に板状アルミナ
粒子が均一に分散し、配向したものであった。
Next, this was dried and press-molded to prepare a grindstone. The grinding layer of the obtained grindstone is shown in FIG. 10 and FIG.
As shown in 1, the plate-like alumina particles were uniformly dispersed and oriented in the binder resin.

【0022】また、比較のため上記製造方法により得ら
れた粒径のそろった大きさ1.0μm、厚さ0.1μm
の板状アルミナ粒子を粉砕し、平均粒径0.1μmに粒
度調整を行ったアルミナ粉末を砕粒とし、以下上記と同
様にし、砥石を作製した。得られた砥石の研削層は図8
及び図9に示されるようなものであった。
For comparison, the size obtained by the above manufacturing method is 1.0 μm with a uniform particle size and the thickness is 0.1 μm.
The plate-like alumina particles of were crushed, and the alumina powder whose average particle size was adjusted to 0.1 μm was crushed into particles. The grinding layer of the obtained grindstone is shown in FIG.
And as shown in FIG.

【0023】それぞれ得られた砥石について、厚さ0.
5mmのガラス板の切断加工を行った。但し、被加工物
に対して板状粒子面が直角となる面を使用した。その結
果、本発明の砥石の切断速度は比較の砥石の切断速度よ
り120%大きなものであった。また砥石の減耗量も比
較の砥石に比べ少なく、本発明の砥石の減耗はほとんど
見られなかった。
The thickness of each grindstone obtained was 0.
A 5 mm glass plate was cut. However, a plane in which the plate-like grain surface is perpendicular to the workpiece was used. As a result, the cutting speed of the grindstone of the present invention was 120% higher than the cutting speed of the comparative grindstone. Further, the amount of wear of the grindstone was smaller than that of the comparative grindstone, and the wear of the grindstone of the present invention was hardly seen.

【0024】以上により本発明の砥石は切断速度が速く
行えるとともに、砥粒にかかる研削抵抗が少なく耐摩耗
性に優れていることが分かる。
From the above, it can be seen that the grindstone of the present invention can perform a high cutting speed, has a small grinding resistance applied to the abrasive grains, and is excellent in wear resistance.

【0025】また、上記においてフィルム基体をポリエ
チレンテレフタレート、ポリイミド等のテープ、シー
ト、ディスクとし、これに研削層を形成した場合、プレ
ス成形後、加熱し、テープ、シート、ディスクを焼き切
り、研削層のみからなる砥石を作製することができる。
Further, in the above, when the film substrate is a tape, sheet or disk of polyethylene terephthalate, polyimide or the like and a grinding layer is formed on this, after press molding, heating is performed to burn out the tape, sheet or disk and only the grinding layer. It is possible to produce a grindstone made of.

【0026】また上記実施例及び比較例の砥石(但し研
削層の厚さは5mmである)を用い、その表面(被加工
物に対し板状粒子面が平行となる面)で研磨加工を行っ
た。この際、相手材としてSi半導体基板を用いた。本
実施例の砥石は比較例の砥石に比べ面粗度が小さく表面
欠陥の極めて少ない高品位の鏡面が短時間で得られた。
Further, using the grindstones of the above-mentioned Examples and Comparative Examples (however, the thickness of the grinding layer is 5 mm), the surface (the surface where the plate-like grain surface is parallel to the work piece) is ground. It was At this time, a Si semiconductor substrate was used as a mating material. The grindstone of this example had a smaller surface roughness than the grindstone of the comparative example, and a high-quality mirror surface with extremely few surface defects was obtained in a short time.

【0027】実施例2 図4に示されるのは上記実施例1とは異なる方向に板状
アルミナ粉末を配向させたカップ砥石を示すが、被加工
物に対しての配向方向は実施例1と同様である。
Example 2 FIG. 4 shows a cup grindstone in which plate-like alumina powder is oriented in a direction different from that of Example 1, but the orientation direction with respect to the workpiece is the same as that of Example 1. It is the same.

【0028】このような基体への板状アルミナ粉末の配
向は、図14及び図15の遠心装置により行うことがで
きる。
Orientation of the plate-like alumina powder on such a substrate can be performed by the centrifuge shown in FIGS. 14 and 15.

【0029】図14の遠心装置を用いた場合、上記と実
施例1と同様に水熱処理を行い微細な板状アルミナ(α
−Al23)粒子の粉末を得て、これとバインダー樹脂
(結合剤)とを混合し、これらの混合物を前記バインダ
ー樹脂が溶融状態となるように加熱し、この溶融物を供
給部から供給する。供給に際し、下型は、上型に対し、
回転しているものである。なお、上型と下型との間には
図14によれば、基体が配されているが、基体は必ずし
も図のように配する必要がない。固定された上型の供給
部より供給された溶融物は、基体と上型との間に形成さ
れた隙間に供給され、下型の回転により、下型の内周面
側に遠心力により、強制的に衝突する。この衝突によ
り、溶融物中のアルミナ粉末が図面の上下方向へ配向さ
せられる。なお、下型に設けられた冷却部には冷却水が
供給され、前記下型の内周面に衝突し、配向させられた
アルミナ粉末を溶融物であるバインダー樹脂により順次
固化するものである。この後の乾燥及びプレス成形は実
施例1と同様である。このようにして実施例1と略同様
な形状を有し、アルミナ粉末の配向方向のみが異なる砥
石を製造することができる。次に図15の遠心装置を用
いた場合について説明する。
When the centrifuge shown in FIG. 14 was used, hydrothermal treatment was carried out in the same manner as in the above and Example 1 to obtain fine plate-like alumina (α
-Al 2 O 3 ) particles of powder are obtained, and this is mixed with a binder resin (binder), and the mixture is heated so that the binder resin is in a molten state, and the melt is supplied from a supply section. Supply. When supplying, the lower mold is
It is rotating. Although the base body is arranged between the upper mold and the lower mold according to FIG. 14, the base does not necessarily have to be arranged as shown in the drawing. The melt supplied from the fixed upper mold supply unit is supplied to the gap formed between the base and the upper mold, and by the rotation of the lower mold, due to the centrifugal force on the inner peripheral surface side of the lower mold, Forced collision. Due to this collision, the alumina powder in the melt is oriented vertically in the drawing. Cooling water is supplied to a cooling unit provided in the lower mold, and collides with the inner peripheral surface of the lower mold to sequentially solidify the oriented alumina powder with a binder resin which is a melt. The subsequent drying and press molding are the same as in Example 1. In this way, it is possible to manufacture a grindstone having a shape substantially similar to that of Example 1 and having different orientation directions of the alumina powder. Next, the case where the centrifugal device of FIG. 15 is used will be described.

【0030】基本的には図14に示される遠心装置と同
様であるが、図15に示す装置を用いることにより、ノ
ズルからの供給量により自由に砥石の研削面の厚さを変
えることができる。
Basically, it is the same as the centrifugal device shown in FIG. 14, but by using the device shown in FIG. 15, the thickness of the grinding surface of the grindstone can be freely changed by the supply amount from the nozzle. .

【0031】なお実施例2の図14及び図15の遠心装
置を用いることにより、図中、上下方向の幅をもその型
形状を変えることにより自由に変更できる。
By using the centrifugal apparatus of FIGS. 14 and 15 of the second embodiment, the vertical width in the figures can be freely changed by changing the shape of the mold.

【0032】例えば円柱状の砥石を作製し、この表面
(曲面)により研磨加工を行うことができる。また、円
柱状の砥石を作製し、これを焼成する前にスライスする
ことにより上記実施例1と類似の形状の砥石を作製し、
これを用いて研削及び研磨加工を行うことができる。こ
の場合、その形状は使用目的等により決定されるもので
ある。但しこの場合肉薄部分(厚み方向)にはアルミナ
の板状表面が並んでおり、肉厚部分(幅方向)にはアル
ミナの厚さ面が並んでいる。またスライスした砥石は適
位個数研磨機の研磨面に取付けて使用することもでき
る。
For example, a cylindrical grindstone can be produced and the surface (curved surface) can be used for polishing. In addition, a cylindrical grindstone was manufactured, and a grindstone having a shape similar to that of Example 1 was manufactured by slicing the grindstone before firing.
Grinding and polishing can be performed using this. In this case, the shape is determined by the purpose of use and the like. However, in this case, the plate-like surfaces of alumina are arranged in the thin portion (thickness direction), and the thickness surfaces of alumina are arranged in the thick portion (width direction). The sliced grindstone can also be used by attaching it to the polishing surface of an appropriate number of grinders.

【0033】[0033]

【発明の効果】以上説明したように、本発明においては
板状アルミナ粒子を配向して砥石をつくるため、砥粒間
隔が非常に小さくでき、砥石の切れ味が良く、かつ表面
粗さの良好な研削となる。又板状の砥粒であるため、砥
粒の保持力が高く、砥石の形状を高精度に保ちながら
も、砥粒にかかる研削抵抗が少なく小さな動力で研削で
き、研削加工で一番問題となる発熱量も小さい。
As described above, in the present invention, since the plate-shaped alumina particles are oriented to form a grindstone, the interval between the abrasive grains can be made very small, the grindstone has good sharpness, and the surface roughness is good. It becomes grinding. In addition, since it is a plate-shaped abrasive grain, it has a high holding force for the abrasive grain, and while maintaining the shape of the grindstone with high accuracy, it can grind with a small power with little grinding resistance applied to the abrasive grain, which is the most problematic in grinding processing. The calorific value is also small.

【0034】また本発明により従来製作が非常に困難で
あった超薄型の砥石を容易に製作することができる。
Further, according to the present invention, it is possible to easily manufacture an ultra-thin grindstone which has been very difficult to manufacture in the past.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のレジノイド切断用砥石の説明図。FIG. 1 is an explanatory view of a resinoid cutting grindstone of the present invention.

【図2】図1A部の拡大説明図。FIG. 2 is an enlarged explanatory view of a part A in FIG. 1;

【図3】本発明のホイール砥石の説明図。FIG. 3 is an explanatory view of a wheel grindstone of the present invention.

【図4】本発明のカップ砥石の説明図。FIG. 4 is an explanatory view of a cup grindstone of the present invention.

【図5】本発明の別のホイール砥石の説明図。FIG. 5 is an explanatory view of another wheel grindstone of the present invention.

【図6】本発明の砥石の説明図。FIG. 6 is an explanatory view of a grindstone of the present invention.

【図7】本発明のレジノイド補強材入り砥石の説明図。FIG. 7 is an explanatory view of a grindstone containing a resinoid reinforcing material of the present invention.

【図8】比較例のアルミナ粉末の砕粒(球状粒子)を使
用した場合のホイール砥石研削層の平面方向に平行な模
式的断面説明図。
FIG. 8 is a schematic cross-sectional explanatory view parallel to the plane direction of the wheel grindstone grinding layer when the crushed particles (spherical particles) of the alumina powder of the comparative example are used.

【図9】同上研削層の外周面に垂直な模式的断面説明
図。
FIG. 9 is a schematic cross-sectional explanatory view perpendicular to the outer peripheral surface of the grinding layer.

【図10】本発明の板状アルミナ粒子を使用したホイー
ル砥石研削層の平面方向に平行な模式的断面説明図。
FIG. 10 is a schematic cross-sectional explanatory view parallel to the plane direction of a wheel grindstone grinding layer using the plate-like alumina particles of the present invention.

【図11】同上研削層の外周面に垂直な模式的断面説明
図。
FIG. 11 is a schematic cross-sectional explanatory view perpendicular to the outer peripheral surface of the grinding layer.

【図12】本発明砥石の製造法の説明する斜視図。FIG. 12 is a perspective view illustrating a method of manufacturing the grindstone of the present invention.

【図13】同上断面説明図。FIG. 13 is an explanatory sectional view of the same.

【図14】本発明砥石を製造するための遠心装置の説明
図。
FIG. 14 is an explanatory view of a centrifugal device for producing the grindstone of the present invention.

【図15】同上別の遠心装置の説明図。FIG. 15 is an explanatory view of another centrifugal device according to the above.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 板状アルミナ粒子をバインダー樹脂中に
配向させてなる研削層を形成したことを特徴とするアル
ミナ質砥石。
1. An alumina grindstone in which a grinding layer formed by orienting plate-like alumina particles in a binder resin is formed.
JP34824792A 1992-12-28 1992-12-28 Alumina whetstone Expired - Lifetime JP3232323B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34824792A JP3232323B2 (en) 1992-12-28 1992-12-28 Alumina whetstone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34824792A JP3232323B2 (en) 1992-12-28 1992-12-28 Alumina whetstone

Publications (2)

Publication Number Publication Date
JPH06190725A true JPH06190725A (en) 1994-07-12
JP3232323B2 JP3232323B2 (en) 2001-11-26

Family

ID=18395743

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3232323B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071731A (en) * 2001-09-03 2003-03-12 Three M Innovative Properties Co Dimple structure abrasive material
US10350642B2 (en) 2015-11-13 2019-07-16 3M Innovative Properties Company Method of shape sorting crushed abrasive particles

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167375A (en) * 1987-11-23 1989-07-03 Minnesota Mining & Mfg Co <3M> Polishing particle

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167375A (en) * 1987-11-23 1989-07-03 Minnesota Mining & Mfg Co <3M> Polishing particle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071731A (en) * 2001-09-03 2003-03-12 Three M Innovative Properties Co Dimple structure abrasive material
US10350642B2 (en) 2015-11-13 2019-07-16 3M Innovative Properties Company Method of shape sorting crushed abrasive particles

Also Published As

Publication number Publication date
JP3232323B2 (en) 2001-11-26

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