JPH06188559A - Printed board jumper wiring method and injection-molded printed board for jumper wiring - Google Patents
Printed board jumper wiring method and injection-molded printed board for jumper wiringInfo
- Publication number
- JPH06188559A JPH06188559A JP34013092A JP34013092A JPH06188559A JP H06188559 A JPH06188559 A JP H06188559A JP 34013092 A JP34013092 A JP 34013092A JP 34013092 A JP34013092 A JP 34013092A JP H06188559 A JPH06188559 A JP H06188559A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- jumper
- printed board
- jumper wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板上に形成
するジャンパー（飛び越し導通線）の配線方法及びその
方法に用いる射出成形プリント基板の構造に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jumper (interlaced conducting wire) wiring method formed on a printed circuit board and a structure of an injection-molded printed circuit board used in the method.
【０００２】[0002]
【従来の技術】射出成形プリント基板は射出成形樹脂表
面に導体パターンを形成した基板で、その基板はケース
等の部品を兼ねるため機器の小型化、部品点数及び組立
工程の削減が図れるという特徴を有するものである。以
下、プリント基板は射出成形プリント基板であるとして
説明する。2. Description of the Related Art An injection-molded printed circuit board is a board on which a conductor pattern is formed on the surface of an injection-molded resin. The board also serves as parts such as a case. I have. Hereinafter, the printed circuit board will be described as an injection molded printed circuit board.
【０００３】図３は、従来の配線方法により射出成形プ
リント基板１上にジャンパーを設けた一例を示すもの
で、図のようにスズメッキ線等の導線２を予めフォーミ
ングして、その両端をそれぞれ接続すべき導体パターン
３上の接続点３ａ，３ｂの２箇所に半田４により接合し
て、接続する導体パターン３と交差する導体パターン５
を飛び越す導通線（ジャンパー）を形成したものであ
る。このように射出成形プリント基板の場合は、それ自
体がケース等の部品を兼ねるため貫通穴を設けることが
できずジャンパーの配線方法は表面実装に限定される場
合が多い。FIG. 3 shows an example in which a jumper is provided on an injection-molded printed circuit board 1 by a conventional wiring method. As shown in the figure, a conductor 2 such as a tin-plated wire is formed in advance and both ends thereof are connected to each other. A conductor pattern 5 that is joined to the connection points 3a and 3b on the conductor pattern 3 to be soldered with solder 4 and intersects with the conductor pattern 3 to be connected.
It is a conductive wire (jumper) that jumps over. As described above, in the case of an injection-molded printed circuit board, since it also serves as a part such as a case, a through hole cannot be provided and the wiring method of the jumper is often limited to surface mounting.
【０００４】又、図４はジャンパーの異なる従来例を示
すもので０Ωのチップ抵抗６を接続点３ａ，３ｂ間に半
田を介して配置しリフロー加熱により接合することによ
って接続点間の電気的接続を行うものである。FIG. 4 shows a conventional example having different jumpers. A chip resistor 6 of 0Ω is arranged between the connection points 3a and 3b via solder and is joined by reflow heating to electrically connect the connection points. Is to do.
【０００５】なお、上記従来例におけるプリント基板は
射出成形プリント基板で説明したが、上述のことは貫通
穴を設けないでジャンパーを表面実装する通常のプリン
ト基板にも当てはまるものである。Although the printed circuit board in the above conventional example has been described as an injection molded printed circuit board, the above description also applies to a normal printed circuit board on which jumpers are surface-mounted without providing through holes.
【０００６】[0006]
【発明が解決しようとする課題】上記のように従来のジ
ャンパー配線方法では、スズメッキ線等の導線をジャン
パーとする場合、導線のフォーミング及び手半田による
導体パターンとの接合が必要なため生産性の低下をもた
らしていた。又、チップ抵抗を用いる場合はコスト高と
なるという問題点があった。As described above, in the conventional jumper wiring method, when a conductor such as a tin-plated wire is used as a jumper, it is necessary to form the conductor and to join it with a conductor pattern by hand soldering, so that productivity is improved. Was causing a decline. Further, there is a problem that the cost becomes high when using the chip resistor.
【０００７】本発明は、上記問題点に鑑みなされたもの
で、その目的とするところは、低コストで生産性の向上
が図れるジャンパー配線方法及びその方法に用いるジャ
ンパー配線用射出成形プリント基板の構造を提供するこ
とにある。The present invention has been made in view of the above problems, and an object of the present invention is to provide a jumper wiring method capable of improving productivity at low cost and a structure of an injection molded printed circuit board for jumper wiring used in the method. To provide.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
本発明は、プリント基板に表面実装するジャンパーの配
線方法において、導体パターン上の接続する２点（接続
点）間にボンディングワイヤーが弧状に形成されるよう
に、前記ボンディングワイヤーの両端部を前記接続点そ
れぞれに固着してジャンパーを設けた後、前記ボンディ
ングワイヤー及び接続点を封止材料により封止したこと
を特徴とするものであり、また、プリント基板が射出成
形プリント基板の場合は電気的に接続する導体パターン
上の２つの接続点をその底面に有する凹部を基板表面に
設け、前記凹部内にて前記ボンディングワイヤーによる
ジャンパーを形成し封止を行ったことを特徴とするもの
である。In order to solve the above problems, the present invention relates to a jumper wiring method for surface mounting on a printed circuit board, wherein a bonding wire is formed in an arc shape between two connecting points (connection points) on a conductor pattern. As formed, after providing a jumper by fixing both ends of the bonding wire to each of the connection points, the bonding wire and the connection point are sealed with a sealing material, When the printed circuit board is an injection-molded printed circuit board, a recess having two connection points on the conductor pattern for electrically connecting the bottom surface is provided on the surface of the board, and a jumper is formed by the bonding wire in the recess. It is characterized by being sealed.
【０００９】[0009]
【作用】プリント基板の導体パターン上の２つの接続点
間に弧状に形成されたボンディングワイヤーはプリント
基板表面において前記接続点以外の箇所には接触しない
ので前記接続点間を電気的に接続するジャンパー（飛び
越し導通線）として機能する。The bonding wire formed in an arc shape between the two connection points on the conductor pattern of the printed circuit board does not come into contact with a portion other than the connection points on the surface of the printed circuit board, so that a jumper for electrically connecting the connection points is provided. It functions as (jumping conductor).
【００１０】[0010]
【実施例】本発明の一実施例を図１に基づいて説明す
る。図は封止前の配線状態を示す斜視図であり、図にお
いて射出成形プリント基板１上にはジャンパーにより接
続される導体パターン３が形成されると共に、それらと
交差する導体パターン５が形成されている。接続点３
ａ，３ｂは弧状に形成されたボンディングワイヤー７に
より電気的に接続されている。その後、エポキシ樹脂等
の封止材料によりボンディングワイヤー７及び接続点３
ａ，３ｂを封止する。ボンディングワイヤー７は基板上
において接続点３ａ，３ｂ以外の箇所には接触していな
いためジャンパー（飛び越し導通線）としての機能を有
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to FIG. The figure is a perspective view showing a wiring state before sealing. In the figure, a conductor pattern 3 connected by a jumper is formed on an injection molded printed circuit board 1, and a conductor pattern 5 intersecting with the conductor pattern 3 is formed. There is. Connection point 3
A and 3b are electrically connected by an arc-shaped bonding wire 7. After that, a bonding wire 7 and a connection point 3 are formed with a sealing material such as epoxy resin.
Seal a and 3b. The bonding wire 7 has a function as a jumper (interlaced conducting wire) because it does not contact with the portions other than the connection points 3a and 3b on the substrate.
【００１１】ワイヤーボンディングは半導体装置実装用
のワイヤーボンディング装置を流用して行うので、プリ
ント基板上に半導体装置を実装してワイヤーボンディン
グする際、同時にジャンパー配線を行うことができるた
め組立コストダウン及び生産性の向上が図れる。Since wire bonding is performed by using a wire bonding device for mounting a semiconductor device, jumper wiring can be performed at the same time when the semiconductor device is mounted on a printed circuit board and wire bonding is performed, thereby reducing assembly cost and production. It is possible to improve the sex.
【００１２】ボンディングワイヤーの固着方式は流用す
る装置によるが熱圧着や超音波溶接又はそれらの組合せ
によるものとなる。また、ボンディングワイヤーの材料
としては通常、金、アルミニウム、銅等の線材が用いら
れ、その径は金線の場合２５μｍが一般的である。The method of fixing the bonding wire depends on the diverting device, but may be thermocompression bonding, ultrasonic welding, or a combination thereof. In addition, a wire material such as gold, aluminum or copper is usually used as a material for the bonding wire, and the diameter thereof is generally 25 μm in the case of a gold wire.
【００１３】図２に異なる実施例を示す。図は封止前の
状態を示す斜視図で図において１は射出成形プリント基
板、３はジャンパーにより接続される導体パターン、３
ａ，３ｂは接続すべき導体パターン３上の２つの接続
点、５は交差する導体パターン、７はボンディングワイ
ヤー、８は凹部である。図において接続すべき導体パタ
ーン上の接続点３ａ，３ｂは凹部８の底面に設けられ、
ボンディングワイヤー７のジャンパーにより接続されて
いる。ワイヤーボンディングの後、凹部８に封止材料が
注入され配線が完了する。この実施例の場合、凹部８内
でジャンパー配線し封止するので封止材料が基板表面に
突出せず基板の薄型化が図れる。FIG. 2 shows a different embodiment. The figure is a perspective view showing a state before sealing. In the figure, 1 is an injection-molded printed circuit board, 3 is a conductor pattern connected by a jumper, 3
a and 3b are two connection points on the conductor pattern 3 to be connected, 5 is a crossing conductor pattern, 7 is a bonding wire, and 8 is a recess. In the figure, the connection points 3a and 3b on the conductor pattern to be connected are provided on the bottom surface of the recess 8,
It is connected by a jumper of the bonding wire 7. After wire bonding, the sealing material is injected into the recesses 8 to complete the wiring. In the case of this embodiment, jumper wiring and sealing are performed in the concave portion 8, so that the sealing material does not protrude to the surface of the substrate, and the thickness of the substrate can be reduced.
【００１４】なお、上記図１に示す実施例は射出成形プ
リント基板に限らず、貫通穴を設けないでジャンパーを
表面実装する通常のプリント基板についても適用できる
例である。The embodiment shown in FIG. 1 is not limited to the injection-molded printed circuit board, but can be applied to a normal printed circuit board on which a jumper is surface-mounted without providing through holes.
【００１５】[0015]
【発明の効果】本発明によれば、ジャンパー配線に半導
体装置実装用のワイヤーボンディング装置が流用できる
のでプリント基板上に半導体装置を実装しワイヤーボン
ディングする際、同時にジャンパー配線を行うことがで
きるため組立コストダウン及び生産性の向上が図れる。
さらに射出成形プリント基板にあっては、基板上の凹部
内でジャンパー配線でき封止材料が基板表面から突出し
ないため基板の薄型化が図れる。According to the present invention, since a wire bonding device for mounting a semiconductor device can be used for the jumper wiring, jumper wiring can be performed at the same time when the semiconductor device is mounted on the printed circuit board and wire bonding is performed. Cost reduction and productivity improvement can be achieved.
Furthermore, in the case of an injection-molded printed circuit board, jumper wiring can be performed in the concave portion on the substrate, and the sealing material does not protrude from the substrate surface, so that the substrate can be made thinner.
【図１】本発明に係る配線方法により配線された一実施
例を示す斜視図である。FIG. 1 is a perspective view showing an example in which wiring is performed by a wiring method according to the present invention.
【図２】本発明に係る配線方法により配線された異なる
実施例を示す斜視図である。FIG. 2 is a perspective view showing another embodiment in which wiring is performed by the wiring method according to the present invention.
【図３】従来方法により配線された一実施例を示す斜視
図である。FIG. 3 is a perspective view showing an example in which wiring is performed by a conventional method.
【図４】従来方法により配線された異なる実施例を示す
斜視図である。FIG. 4 is a perspective view showing another embodiment in which wiring is performed by a conventional method.
１ 射出成形プリント基板 ２ 導線 ３ 導体パターン ３ａ，３ｂ 接続点 ４ 半田 ５ 交差する導体パターン ６ チップ抵抗 ７ ボンディングワイヤー ８ 凹部 1 Injection Molded Printed Circuit Board 2 Conductor 3 Conductor Patterns 3a, 3b Connection Point 4 Solder 5 Crossing Conductor Pattern 6 Chip Resistor 7 Bonding Wire 8 Recess
Claims (3)
上の２つの接続点をジャンパーで電気的に接続する方法
において、前記両接続点間にボンディングワイヤーが弧
状に形成されるように、前記ボンディングワイヤーの両
端部を前記接続点それぞれに固着してジャンパーを設け
た後、前記ボンディングワイヤー及び接続点を封止材料
にて封止したことを特徴とするプリント基板ジャンパー
配線方法。1. A method of electrically connecting two connection points on a conductor pattern formed on a printed circuit board by a jumper, wherein the bonding wire is formed in an arc shape between the both connection points. A jumper wiring method for a printed circuit board, characterized in that both ends of the are bonded to the respective connection points to provide jumpers, and then the bonding wires and the connection points are sealed with a sealing material.
あって、電気的に接続すべき導体パターン上の２つの接
続点をその底面に有する凹部を基板表面に設け、前記凹
部内にてボンディングワイヤーによるジャンパーを形成
し封止を行ったことを特徴とする請求項１記載のプリン
ト基板ジャンパー配線方法。2. The printed circuit board is an injection molded printed circuit board, wherein a recess having two connection points on a conductor pattern to be electrically connected is provided on the bottom surface of the printed circuit board, and a bonding wire is formed in the recess. 2. The printed circuit board jumper wiring method according to claim 1, wherein a jumper is formed and sealed.
すべき導体パターン上の２つの接続点をその底面に有し
た凹部を基板表面に設けたことを特徴とする請求項２記
載のプリント基板ジャンパー配線方法に用いるジャンパ
ー配線用射出成形プリント基板。3. The printed circuit board according to claim 2, wherein a recess having two connection points on the conductor pattern to be electrically connected on the injection molded printed circuit board on its bottom surface is provided on the board surface. Injection molded printed circuit board for jumper wiring used for jumper wiring method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4340130A JP2953893B2 (en) | 1992-12-21 | 1992-12-21 | Printed circuit board jumper wiring method and injection molded printed circuit board for jumper wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4340130A JP2953893B2 (en) | 1992-12-21 | 1992-12-21 | Printed circuit board jumper wiring method and injection molded printed circuit board for jumper wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06188559A true JPH06188559A (en) | 1994-07-08 |
| JP2953893B2 JP2953893B2 (en) | 1999-09-27 |
Family
ID=18334015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4340130A Expired - Fee Related JP2953893B2 (en) | 1992-12-21 | 1992-12-21 | Printed circuit board jumper wiring method and injection molded printed circuit board for jumper wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2953893B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006095805A1 (en) * | 2005-03-09 | 2006-09-14 | Hitachi Kyowa Engineering Co., Ltd. | Electronic circuit and method for manufacturing same |
-
1992
- 1992-12-21 JP JP4340130A patent/JP2953893B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006095805A1 (en) * | 2005-03-09 | 2006-09-14 | Hitachi Kyowa Engineering Co., Ltd. | Electronic circuit and method for manufacturing same |
| JP2006253289A (en) * | 2005-03-09 | 2006-09-21 | Hitachi Kyowa Engineering Co Ltd | Electronic circuit and manufacturing method thereof |
| JP4558539B2 (en) * | 2005-03-09 | 2010-10-06 | 日立協和エンジニアリング株式会社 | Electronic circuit board, electronic circuit, method for manufacturing electronic circuit board, and method for manufacturing electronic circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2953893B2 (en) | 1999-09-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |