JPH06172618A - Epoxy resin composition and printed board - Google Patents
Epoxy resin composition and printed boardInfo
- Publication number
- JPH06172618A JPH06172618A JP33042292A JP33042292A JPH06172618A JP H06172618 A JPH06172618 A JP H06172618A JP 33042292 A JP33042292 A JP 33042292A JP 33042292 A JP33042292 A JP 33042292A JP H06172618 A JPH06172618 A JP H06172618A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- coupling agent
- barium titanate
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器に用いられる
プリント基板を作製する際の絶縁材として好適なエポキ
シ樹脂組成物及びそれを用いたプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition suitable as an insulating material for producing a printed circuit board used in electronic equipment and a printed circuit board using the same.
【０００２】[0002]
【従来の技術】従来、プリント基板の絶縁材としては、
紙フェノールやガラス布エポキシ等が使用されており、
特に高周波用基板の絶縁材には、電気的特性に優れるガ
ラス布テフロンやアルミナ等が用いられている。高周波
用基板でマイクロストリップラインを使用する場合、基
板上の波長は実効誘電率の平方根に反比例し、絶縁材の
比誘電率が大きくなる程波長は短くなるので、１／４波
長や１／８波長などを利用した回路の小型化に有利とな
る。しかし、一般的な有機基板は比誘電率が５以下と小
さく、また比誘電率の高いアルミナ基板であっても１０
程度であるため、回路の小型化にはそれほど効果的では
ない。2. Description of the Related Art Conventionally, as an insulating material for a printed circuit board,
Paper phenol, glass cloth epoxy, etc. are used,
In particular, glass cloth Teflon, alumina, or the like, which has excellent electrical characteristics, is used as the insulating material of the high frequency substrate. When a microstrip line is used on a high frequency substrate, the wavelength on the substrate is inversely proportional to the square root of the effective permittivity, and as the relative permittivity of the insulating material increases, the wavelength becomes shorter. This is advantageous for downsizing a circuit using wavelengths and the like. However, a general organic substrate has a small relative permittivity of 5 or less, and even an alumina substrate having a high relative permittivity is 10 or less.
Since it is a degree, it is not so effective in miniaturizing the circuit.
【０００３】高周波回路を小型化するには絶縁材の比誘
電率を大きくすればよいが、アルミナよりも高い比誘電
率をもったセラミック基板は、高価であることの他に、
非常に硬くて脆く大型のものが得られ難い、穴あけ等の
加工が難しい、比誘電率が一定であるので用途に応じた
調整が難しい等の欠点があった。To reduce the size of a high-frequency circuit, it is sufficient to increase the relative permittivity of the insulating material, but a ceramic substrate having a higher relative permittivity than alumina is expensive and
There were drawbacks such as very hard and brittle and difficult to obtain large size, difficult to machine such as drilling, and difficult to adjust according to the application because the relative dielectric constant is constant.
【０００４】これらの欠点を解決するため、酸化チタン
系セラミック等の高誘電率フィラーと絶縁性高分子材料
の粉末を混合しプレス成型により基板を作製したり（特
開昭５８ー１６６６０９号公報参照）、高誘電率フィラ
ーの充填された樹脂ワニスを高誘電率セラミック繊維布
基材に含浸させて基板を作製したり（特開平２−５０８
３３号公報参照）することが提案されている。しかしな
がら、このような方法では、高価な金型や含浸設備が必
要である上に比誘電率も２０程度の基板しか得られな
い。In order to solve these drawbacks, a high dielectric constant filler such as titanium oxide ceramics and powder of an insulating polymer material are mixed to form a substrate by press molding (see JP-A-58-166609). ), A resin varnish filled with a high dielectric constant filler is impregnated into a high dielectric constant ceramic fiber cloth base material to prepare a substrate (JP-A-2-508).
33). However, such a method requires an expensive mold and impregnation equipment, and can only obtain a substrate having a relative dielectric constant of about 20.
【０００５】一方、コスト的に高価である上記プレス成
型法や含浸法を使用せず、樹脂と無機フィラーの複合に
よって高誘電率基板を製造する試みとして、液状樹脂と
高誘電率無機フィラーとを混合する方法があるが、一般
に高誘電率フィラーは粒径が細かく表面積が大きいので
樹脂との濡れ性が悪く、高充填して比誘電率を大きくす
るには自ずと限界があった。On the other hand, a liquid resin and a high-dielectric-constant inorganic filler are used as an attempt to produce a high-dielectric-constant substrate by a composite of a resin and an inorganic filler, without using the above-mentioned press molding method or impregnation method, which is costly. Although there is a method of mixing, in general, a high-dielectric-constant filler has a small particle size and a large surface area, so that it has poor wettability with a resin, and there is a limit naturally to increase the relative permittivity by high-filling.
【０００６】[0006]
【発明が解決しようとする課題】本発明者らは、以上の
状況に鑑み、安価で比誘電率が高く、しかも加工性に優
れ大型化が可能な高誘電率絶縁材を開発することを目的
として種々検討した結果、チタン酸バリウム系の高誘電
率フィラーの充填されたエポキシ樹脂組成物において、
シラン系カップリング剤とチタネート系カップリング剤
との特定量を併用すると、驚くべきことに、チタネート
系カップリング剤を単独で用いた場合よりも著しく樹脂
粘度が低下してフィラーの充填量を増加でき、もって接
着強度と耐湿性等を高めた高比誘電率のプリント基板を
作製することができることを見いだし、本発明を完成さ
せたものである。In view of the above situation, the present inventors have aimed to develop a high dielectric constant insulating material which is inexpensive, has a high relative dielectric constant, is excellent in workability, and can be increased in size. As a result of various studies as above, in an epoxy resin composition filled with a barium titanate-based high dielectric constant filler,
Surprisingly, when a specific amount of a silane coupling agent and a titanate coupling agent are used together, surprisingly, the resin viscosity is significantly reduced and the filler loading is increased compared to the case where the titanate coupling agent is used alone. The inventors have found that it is possible to fabricate a printed circuit board having a high relative dielectric constant with improved adhesive strength and moisture resistance, and thus completed the present invention.
【０００７】[0007]
【課題を解決するための手段】すなわち、本発明は、エ
ポキシ樹脂、エポキシ樹脂の硬化剤、チタン酸バリウム
系フィラー及びカップリング剤を含有してなるエポキシ
樹脂組成物において、上記カップリング剤として、シラ
ン系カップリング剤とチタネート系カップリング剤とを
重量比率６：４〜９：１とし、それをエポキシ樹脂とチ
タン酸バリウム系フィラーの合計１００重量部に対し
０．５〜２重量部を含有させてなることを特徴とするエ
ポキシ樹脂組成物、及び金属板の少なくとも片面に上記
エポキシ樹脂組成物の硬化物を介して銅箔が積層されて
なることを特徴とするプリント基板である。Means for Solving the Problems That is, the present invention provides an epoxy resin composition containing an epoxy resin, a curing agent for the epoxy resin, a barium titanate filler and a coupling agent, wherein the coupling agent is: The weight ratio of the silane coupling agent and the titanate coupling agent is 6: 4 to 9: 1 and 0.5 to 2 parts by weight of the epoxy resin and the barium titanate filler are contained in an amount of 0.5 to 2 parts by weight. And a copper foil laminated on at least one surface of a metal plate with a cured product of the above-mentioned epoxy resin composition interposed between the epoxy resin composition and the copper foil.
【０００８】以下、さらに詳しく本発明について説明す
る。The present invention will be described in more detail below.
【０００９】本発明に用いられるエポキシ樹脂は、分子
内に１個又は２個以上のエポキシ基を有するものであれ
ば特に制限はなく、ビスフェノールＡ型エポキシ樹脂、
ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ
型エポキシ樹脂、フェノールノボラック型エポキシ樹
脂、グリシジルエステル型エポキシ樹脂、脂環式エポキ
シ樹脂等の１種又は２種以上が使用される。中でも、常
温で液状のものが好ましく、特に常温で低粘度のビスフ
ェノールＦ型エポキシ樹脂が最適である。The epoxy resin used in the present invention is not particularly limited as long as it has one or two or more epoxy groups in the molecule, and a bisphenol A type epoxy resin,
Bisphenol F type epoxy resin, Bisphenol AD
Type epoxy resin, phenol novolac type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin and the like are used alone or in combination. Among them, a liquid at room temperature is preferable, and a bisphenol F type epoxy resin having a low viscosity at room temperature is particularly suitable.
【００１０】本発明に用いられるエポキシ樹脂の硬化剤
としては、酸無水物硬化剤、アミン系硬化剤、ポリアミ
ノアミド系硬化剤等通常のもので十分であるが、耐熱
性、耐湿性及び電気特性等を考慮すると、アミン系硬化
剤が望ましい。As the curing agent for the epoxy resin used in the present invention, ordinary ones such as acid anhydride curing agent, amine curing agent and polyaminoamide curing agent are sufficient, but heat resistance, moisture resistance and electric characteristics are sufficient. Considering the above, an amine curing agent is desirable.
【００１１】本発明に用いられるチタン酸バリウム系フ
ィラーは、比誘電率が１００以上のものであり、それを
例示すれば、チタン酸バリウム、ニオブ添加チタン酸バ
リウム、ジルコン酸添加チタン酸バリウム等である。そ
の平均粒径としては、０．１〜１００μｍ特に０．３〜
５０μｍが好ましい。なお、比誘電率は、チタン酸バリ
ウム系フィラーの焼結体を製造して測定される。The barium titanate-based filler used in the present invention has a relative dielectric constant of 100 or more. Examples thereof include barium titanate, niobium-added barium titanate, and zirconate-added barium titanate. is there. The average particle size is 0.1 to 100 μm, especially 0.3 to
50 μm is preferable. The relative dielectric constant is measured by manufacturing a sintered body of barium titanate-based filler.
【００１２】本発明において、熱伝導性をさらに向上さ
せるために、アルミナ等の酸化物、窒化アルミニウム、
窒化ほう素等の窒化物などの熱伝導性向上剤を、また熱
膨張係数を小さくするために溶融シリカ、コージェライ
ト等の熱膨張低減剤を配合することができる。さらに
は、ガラスクロス、セラミック繊維、紙等通常のプリン
ト基板に使用されている補強材を使用することもでき
る。In the present invention, in order to further improve the thermal conductivity, oxides such as alumina, aluminum nitride,
A thermal conductivity improver such as a nitride such as boron nitride, and a thermal expansion reducer such as fused silica or cordierite can be blended in order to reduce the coefficient of thermal expansion. Further, it is also possible to use a reinforcing material such as glass cloth, ceramic fiber, paper or the like which is used for a usual printed circuit board.
【００１３】本発明に用いられるシラン系カップリング
剤としては、ビニルシラン系、メタクリロキシシラン
系、エポキシシラン系、アミノシラン系、メルカプトシ
ラン系、クロロプロピルシラン系等をあげることができ
るが、中でもエポキシシラン系、アミノシラン系、メル
カプトシラン系、クロロプロピルシラン系が好ましく、
特にエポキシシラン系カップリング剤が最適である。Examples of the silane-based coupling agent used in the present invention include vinylsilane-based, methacryloxysilane-based, epoxysilane-based, aminosilane-based, mercaptosilane-based, chloropropylsilane-based and the like. Type, aminosilane type, mercaptosilane type, chloropropylsilane type,
Particularly, the epoxysilane coupling agent is most suitable.
【００１４】一方、本発明に用いられるチタネート系カ
ップリング剤としては、アシレート型、ホスフェート
型、アルコラート型、コーディネート型、モノアルコキ
シ型、テトラアルコキシ型、亜リン酸エステル付加コー
ディネート型等をあげることができるが、中でもコーデ
ィネート型、亜リン酸エステル付加コーディネート型が
好ましく、特に粘度低下のためには亜リン酸エステル付
加コーディネート型が最適である。On the other hand, examples of the titanate coupling agent used in the present invention include acylate type, phosphate type, alcoholate type, coordinate type, monoalkoxy type, tetraalkoxy type, phosphite addition coordinate type and the like. Of these, a coordinated type and a phosphite-added coordinated type are preferable, and a phosphite-esterified coordinated type is most suitable for decreasing the viscosity.
【００１５】上記成分の配合割合としては、エポキシ樹
脂３０〜７０容積％、チタン酸バリウム系フィラー７０
〜３０容積％であることが好ましく、エポキシ樹脂の硬
化剤は適切量が使用される。また、熱伝導性向上剤と熱
膨張性低減剤を使用する場合は、エポキシ樹脂とチタン
酸バリウム系フィラーの合計に対しそれぞれ１０容積％
以下の含有量が望ましい。The mixing ratio of the above components is 30 to 70% by volume of epoxy resin and 70 barium titanate filler.
-30% by volume is preferable, and an appropriate amount of the epoxy resin curing agent is used. When a thermal conductivity improver and a thermal expansion reducer are used, each is 10% by volume with respect to the total of the epoxy resin and the barium titanate filler.
The following contents are desirable.
【００１６】一方、カップリング剤については、シラン
系カップリング剤とチタネート系カップリング剤とをそ
れらの合計量で、エポキシ樹脂とチタン酸バリウム系フ
ィラーの合計１００重量部に対し０．５〜２重量部とす
る。０．５重量部未満では高充填化の改善効果は少な
く、また２重量部をこえてもその効果は増大せず、返っ
て耐熱性と耐湿性が低下する。On the other hand, regarding the coupling agent, the total amount of the silane coupling agent and the titanate coupling agent is 0.5 to 2 with respect to 100 parts by weight of the total of the epoxy resin and the barium titanate filler. Parts by weight. If it is less than 0.5 part by weight, the effect of improving the high filling is small, and if it exceeds 2 parts by weight, the effect is not increased, and heat resistance and moisture resistance are deteriorated.
【００１７】シラン系カップリング剤：チタネート系カ
ップリング剤の重量比率は、６：４〜９：１の範囲であ
ることが必要である。シラン系カップリング剤の割合が
これよりも少ないと耐湿性が低下し、一方、これよりも
多いと低粘度化ができず、チタン酸バリウム系フィラー
の高充填化が困難となる。The weight ratio of silane coupling agent to titanate coupling agent must be in the range of 6: 4 to 9: 1. If the proportion of the silane-based coupling agent is less than this, the moisture resistance is lowered, while if it is more than this, the viscosity cannot be lowered and it becomes difficult to increase the filling of the barium titanate-based filler.
【００１８】本発明で使用されるプリント基板のベース
材としては、紙フェノール、紙エポキシ、ガラス布エポ
キシ、アルミナ、窒化アルミニウム、チタン酸バリウム
系等を使用することができる。しかし、本発明のよう
に、搭載部品からの発熱を効率良く放熱させるには、ア
ルミニウム、アルミニウム合金、銅、銅合金、ニッケ
ル、ニッケル合金、鉄、鉄合金、インバー等の金属板、
又はそれらのクラッド板が好適である。As the base material of the printed circuit board used in the present invention, paper phenol, paper epoxy, glass cloth epoxy, alumina, aluminum nitride, barium titanate and the like can be used. However, like the present invention, in order to efficiently dissipate the heat generated from the mounted components, aluminum, aluminum alloy, copper, copper alloy, nickel, nickel alloy, iron, iron alloy, metal plate such as Invar,
Alternatively, those clad plates are suitable.
【００１９】[0019]
【実施例】以下、実施例と比較例をあげてさらに具体的
に本発明を説明する。EXAMPLES The present invention will be described in more detail with reference to Examples and Comparative Examples.
【００２０】実施例１ 比誘電率が２００００（焼結体での値）で平均粒径が
１．５μｍであるチタン酸バリウム粉末（富士チタン社
製「ＢＴ−２０６」）５０容量部、エポキシ樹脂（油化
シェル社製「エピコート８０７」）５０容量部、及びチ
タン酸バリウム粉末とエポキシ樹脂との合計１００重量
部に対し、エポキシシラン系カップリング剤（信越化学
工業社製「ＫＢＭ−４０２」）０．７重量部と亜リン酸
エステル付加コーディネート型チタネート系カップリン
グ剤（味の素社製「ＫＲ−４６Ｂ」）０．３重量部とを
混合し、Ｂ型粘度計で温度５０℃における粘度及び熱伝
導率を測定した。その結果を表１と表２に示す。Example 1 50 parts by volume of barium titanate powder (“BT-206” manufactured by Fuji Titanium Co., Ltd.) having a relative dielectric constant of 20,000 (value in a sintered body) and an average particle size of 1.5 μm, an epoxy resin Epoxy silane coupling agent ("KBM-402" manufactured by Shin-Etsu Chemical Co., Ltd.) with respect to 50 parts by volume of Yuka Shell Co., Ltd. "Epicoat 807" and 100 parts by weight of barium titanate powder and epoxy resin in total. 0.7 parts by weight and 0.3 parts by weight of a phosphite-added coordinated titanate coupling agent (“KR-46B” manufactured by Ajinomoto Co., Inc.) were mixed, and the viscosity and heat at a temperature of 50 ° C. were measured with a B type viscometer. The conductivity was measured. The results are shown in Tables 1 and 2.
【００２１】この混合物１００重量部とエポキシ樹脂の
硬化剤（油化シェル社製「エピキュアＺ」）３．６重量
部を混合して本発明のエポキシ樹脂組成物を調整し、そ
れをアルミニウム基板（５００ｍｍ角、１．５ｍｍ厚）
に８０μｍの厚みで塗布してから銅箔（３５μｍ厚）を
ラミネーターで張り合わせ、温度８０℃で５時間、その
後温度１５０℃で１０時間の熱処理をしてプリント基板
を作製した。100 parts by weight of this mixture and 3.6 parts by weight of a curing agent for epoxy resin ("Epicure Z" manufactured by Yuka Shell Co., Ltd.) were mixed to prepare an epoxy resin composition of the present invention, which was prepared on an aluminum substrate ( (500 mm square, 1.5 mm thick)
Then, a copper foil (thickness: 35 μm) was applied on the substrate with a laminator and heat-treated at a temperature of 80 ° C. for 5 hours and then at a temperature of 150 ° C. for 10 hours to prepare a printed circuit board.
【００２２】実施例２ エポキシ樹脂５４容量部、チタン酸バリウム粉末４６容
量部、エポキシ樹脂の硬化剤４．０重量部としたこと以
外は、実施例１と同様にしてエポキシ樹脂組成物を調整
し、プリント基板を作製した。Example 2 An epoxy resin composition was prepared in the same manner as in Example 1 except that 54 parts by volume of the epoxy resin, 46 parts by volume of the barium titanate powder, and 4.0 parts by weight of the curing agent for the epoxy resin were used. A printed circuit board was produced.
【００２３】実施例３〜６ チタネート系カップリング剤とシラン系カップリング剤
の配合量を表１に示す割合としたこと以外は、実施例２
と同様にしてエポキシ樹脂組成物を調整し、プリント基
板を作製した。Examples 3 to 6 Example 2 except that the proportions of the titanate coupling agent and the silane coupling agent were set to the ratios shown in Table 1.
An epoxy resin composition was prepared in the same manner as in 1. to prepare a printed circuit board.
【００２４】実施例７ エポキシ樹脂５４容量部、チタン酸バリウム粉末４６容
量部、平均粒径３０μｍのアルミナ粉末（旭化成工業社
製「Ｐ−３０」）６容量部及びエポキシ樹脂の硬化剤
４．１重量部としたこと以外は、実施例１と同様にして
エポキシ樹脂組成物を調整した。これを銅板（３６０ｍ
ｍ幅、１．５ｍｍ厚）に８０μｍの厚みで塗布してから
銅箔（３５μｍ厚）を張り合わせ、実施例１と同じ条件
で熱処理をしてプリント基板を作製した。Example 7 54 parts by volume of epoxy resin, 46 parts by volume of barium titanate powder, 6 parts by volume of alumina powder having an average particle size of 30 μm (“P-30” manufactured by Asahi Chemical Industry Co., Ltd.) and a curing agent for epoxy resin 4.1. An epoxy resin composition was prepared in the same manner as in Example 1 except that the weight part was used. This is a copper plate (360m
m width, 1.5 mm thickness) with a thickness of 80 μm, copper foil (35 μm thickness) was laminated and heat-treated under the same conditions as in Example 1 to produce a printed circuit board.
【００２５】比較例１〜３ チタネート系カップリング剤とシラン系カップリング剤
の配合量を表１に示した割合としたこと以外は、実施例
２と同様にしてエポキシ樹脂組成物を調整し、プリント
基板を作製した。Comparative Examples 1 to 3 An epoxy resin composition was prepared in the same manner as in Example 2 except that the compounding amounts of the titanate coupling agent and the silane coupling agent were set to the ratios shown in Table 1. A printed circuit board was produced.
【００２６】実施例及び比較例で得られたプリント基板
の比誘電率をインピーダンスアナライザー（ＹＨＰ社
製）で測定した。また、プリント基板の初期とプレッシ
ャークッカーテストＰＣＴ（１２０℃、２気圧、２４時
間及び１００時間）後における銅箔引っ張り強度を測定
した。引っ張り強度は、１０ｍｍ幅の銅箔で９０゜剥離
試験をテンシロン引っ張り試験機（オリエンテック社
製）で測定した。それらの結果を表２に示す。The relative permittivity of the printed circuit boards obtained in the examples and comparative examples was measured with an impedance analyzer (manufactured by YHP). Further, the copper foil tensile strength was measured at the initial stage of the printed circuit board and after the pressure cooker test PCT (120 ° C., 2 atmospheric pressure, 24 hours and 100 hours). Tensile strength was measured by a Tensilon tensile tester (manufactured by Orientec Co., Ltd.) in a 90 ° peel test with a 10 mm wide copper foil. The results are shown in Table 2.
【００２７】[0027]
【表１】 [Table 1]
【００２８】[0028]
【表２】 [Table 2]
【００２９】表１及び表２から次のことがわかる。実施
例１では、チタン酸バリウム粉末の高充填が可能とな
り、プリント基板の比誘電率が３５に達しピール強度も
十分に高い。実施例２〜７では、チタン酸バリウム粉末
の配合量を少なくした分だけ比誘電率が実施例１よりも
小さいが、エポキシ樹脂組成物の粘度からみて、チタン
酸バリウム粉末の配合量をさらに高めることができる。
実施例７のようにアルミナを配合すると熱伝導率が大き
くなる。一方、比較例１〜３では、実施例２よりもエポ
キシ樹脂組成物の粘度が大きいので、チタン酸バリウム
粉末を高充填することができず、比誘電率２８が限界で
ある。なお、比較例２と３ではピール強度が小さい。The following can be seen from Tables 1 and 2. In Example 1, the barium titanate powder can be highly filled, the relative dielectric constant of the printed circuit board reaches 35, and the peel strength is sufficiently high. In Examples 2 to 7, the relative dielectric constant is smaller than that in Example 1 by the amount of the barium titanate powder blended, but the blending amount of the barium titanate powder is further increased in view of the viscosity of the epoxy resin composition. be able to.
When alumina is blended as in Example 7, the thermal conductivity increases. On the other hand, in Comparative Examples 1 to 3, since the epoxy resin composition has a higher viscosity than that of Example 2, the barium titanate powder cannot be highly filled, and the relative dielectric constant is 28. The peel strengths of Comparative Examples 2 and 3 are small.
【００３０】[0030]
【発明の効果】本発明によれば、比誘電率の調整が可能
で高誘電率の絶縁材となるエポキシ樹脂組成物を提供す
ることができる。また、これを使用したメタルベースの
プリント基板は、高誘電率、耐水性、耐熱性に優れたも
のとなる。According to the present invention, it is possible to provide an epoxy resin composition which can be adjusted in relative permittivity and serves as an insulating material having a high permittivity. In addition, a metal-based printed circuit board using the same is excellent in high dielectric constant, water resistance and heat resistance.
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｋ 5/54 ＮＬＣ 7242−4Ｊ 5/56 7242−4Ｊ Ｈ０５Ｋ 1/03 Ｄ 7011−4Ｅ Continuation of front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display area C08K 5/54 NLC 7242-4J 5/56 7242-4J H05K 1/03 D 7011-4E
Claims (2)
チタン酸バリウム系フィラー及びカップリング剤を含有
してなるエポキシ樹脂組成物において、上記カップリン
グ剤として、シラン系カップリング剤とチタネート系カ
ップリング剤とを重量比率６：４〜９：１とし、それを
エポキシ樹脂とチタン酸バリウム系フィラーの合計１０
０重量部に対し０．５〜２重量部を含有させてなること
を特徴とするエポキシ樹脂組成物。1. An epoxy resin, a curing agent for an epoxy resin,
In an epoxy resin composition containing a barium titanate-based filler and a coupling agent, the coupling agent is a silane-based coupling agent and a titanate-based coupling agent in a weight ratio of 6: 4 to 9: 1. Total 10 of epoxy resin and barium titanate filler
An epoxy resin composition comprising 0.5 to 2 parts by weight with respect to 0 parts by weight.
載のエポキシ樹脂組成物の硬化物を介して銅箔が積層さ
れてなることを特徴とするプリント基板。2. A printed board comprising a metal plate and a copper foil laminated on at least one surface of the metal plate with the cured product of the epoxy resin composition according to claim 1 interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33042292A JPH06172618A (en) | 1992-12-10 | 1992-12-10 | Epoxy resin composition and printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33042292A JPH06172618A (en) | 1992-12-10 | 1992-12-10 | Epoxy resin composition and printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06172618A true JPH06172618A (en) | 1994-06-21 |
Family
ID=18232434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33042292A Pending JPH06172618A (en) | 1992-12-10 | 1992-12-10 | Epoxy resin composition and printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06172618A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001131309A (en) * | 1999-11-04 | 2001-05-15 | Mitsubishi Gas Chem Co Inc | High-dielectric constant b-stage sheet and printed wiring board using the same |
| JP2002317119A (en) * | 2001-04-19 | 2002-10-31 | Nippon Shokubai Co Ltd | Curable resin composition |
| JP2003049092A (en) * | 2001-08-03 | 2003-02-21 | Hitachi Chem Co Ltd | Filler, resin composition, and application thereof |
| JP2003064240A (en) * | 2001-08-24 | 2003-03-05 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| WO2003027020A1 (en) * | 2001-09-21 | 2003-04-03 | Cabot Corporation | Dispersible barium titanate-based particles and methods of forming the same |
| JP2004339260A (en) * | 2003-05-13 | 2004-12-02 | Toppan Printing Co Ltd | Photosensitive resin composition with high dielectric constant, and laminate or substrate with built-in element using the same |
| US6924971B2 (en) | 2001-02-08 | 2005-08-02 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
| JP2006089530A (en) * | 2004-09-21 | 2006-04-06 | Murata Mfg Co Ltd | Resin composition, cured resin, and laminated electronic component |
| CN100365048C (en) * | 2003-05-15 | 2008-01-30 | 长兴化学工业股份有限公司 | Resin composition with high dielectric constant and its usage |
| JP2009113465A (en) * | 2007-10-17 | 2009-05-28 | Hitachi Chem Co Ltd | Thin film composite material, material for wiring board using it, wiring board, and electronic component |
| WO2013147086A1 (en) * | 2012-03-30 | 2013-10-03 | 株式会社トクヤマ | Curable resin composition, method for producing same, highly thermally conductive resin composition, and highly thermally conductive multilayer substrate |
| JP2015207630A (en) * | 2014-04-18 | 2015-11-19 | キヤノン株式会社 | printed circuit board |
-
1992
- 1992-12-10 JP JP33042292A patent/JPH06172618A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001131309A (en) * | 1999-11-04 | 2001-05-15 | Mitsubishi Gas Chem Co Inc | High-dielectric constant b-stage sheet and printed wiring board using the same |
| US7220481B2 (en) | 2001-02-08 | 2007-05-22 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
| US6924971B2 (en) | 2001-02-08 | 2005-08-02 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
| JP2002317119A (en) * | 2001-04-19 | 2002-10-31 | Nippon Shokubai Co Ltd | Curable resin composition |
| JP2003049092A (en) * | 2001-08-03 | 2003-02-21 | Hitachi Chem Co Ltd | Filler, resin composition, and application thereof |
| JP2003064240A (en) * | 2001-08-24 | 2003-03-05 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| JP4742467B2 (en) * | 2001-08-24 | 2011-08-10 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
| WO2003027020A1 (en) * | 2001-09-21 | 2003-04-03 | Cabot Corporation | Dispersible barium titanate-based particles and methods of forming the same |
| JP4561045B2 (en) * | 2003-05-13 | 2010-10-13 | 凸版印刷株式会社 | Photosensitive high dielectric constant resin composition and laminate or element built-in substrate using the same |
| JP2004339260A (en) * | 2003-05-13 | 2004-12-02 | Toppan Printing Co Ltd | Photosensitive resin composition with high dielectric constant, and laminate or substrate with built-in element using the same |
| CN100365048C (en) * | 2003-05-15 | 2008-01-30 | 长兴化学工业股份有限公司 | Resin composition with high dielectric constant and its usage |
| JP2006089530A (en) * | 2004-09-21 | 2006-04-06 | Murata Mfg Co Ltd | Resin composition, cured resin, and laminated electronic component |
| JP4622413B2 (en) * | 2004-09-21 | 2011-02-02 | 株式会社村田製作所 | Resin composition, cured resin, and multilayer electronic component |
| JP2009113465A (en) * | 2007-10-17 | 2009-05-28 | Hitachi Chem Co Ltd | Thin film composite material, material for wiring board using it, wiring board, and electronic component |
| WO2013147086A1 (en) * | 2012-03-30 | 2013-10-03 | 株式会社トクヤマ | Curable resin composition, method for producing same, highly thermally conductive resin composition, and highly thermally conductive multilayer substrate |
| JPWO2013147086A1 (en) * | 2012-03-30 | 2015-12-14 | 株式会社トクヤマ | CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME, HIGHLY HEAT CONDUCTIVE RESIN COMPOSITION, AND HIGHLY HEAT CONDUCTIVE LAMINATED SUBSTRATE |
| JP2015207630A (en) * | 2014-04-18 | 2015-11-19 | キヤノン株式会社 | printed circuit board |
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