JPH06169109A - Thermoelectric element - Google Patents
Thermoelectric elementInfo
- Publication number
- JPH06169109A JPH06169109A JP4069615A JP6961592A JPH06169109A JP H06169109 A JPH06169109 A JP H06169109A JP 4069615 A JP4069615 A JP 4069615A JP 6961592 A JP6961592 A JP 6961592A JP H06169109 A JPH06169109 A JP H06169109A
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric element
- conductive material
- solder
- heat
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、Ｐ型及びＮ型からなる
多数の導電エレメントを集合させて構成した熱電素子に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric element constructed by assembling a large number of P-type and N-type conductive elements.
【０００２】[0002]
【従来の技術】周知にように、熱電素子はＰ型及びＮ型
の多数の導電エレメントを一対の対向配置の絶縁基板間
に配置し、所定の導体配線パターンを介して電気的に直
列接続して構成されている。そして、上記導電エレメン
トに接続された直流電源を介して直流を通電することに
より吸熱あるいは放熱作用が行なわれるものである。上
記のような熱電素子の概略を図３に示す。図において、
絶縁基板１，１間にＢｉ−Ｔｅ系の材料を主成分として
構成されたＰ型及びＮ型導電エレメント２が交互に銅片
等の導電材３により直列に接続されている。また、上記
の絶縁基板１としては、主としてアルミナセラミックが
使用され、一方の面に、上記導電材３を半田固着させる
ためのＷ−Ｎｉ等からなる導体配線パターンが形成され
ている。この導体配線パターン上に、上記導電材３を半
田固着させた後、該導電材３上にＰ型及びＮ型導電エレ
メント２が交互に並べられ、それらを半田固着させた
後、他方の絶縁基板１を、自らの導電材３と先の導電エ
レメント２との正確な位置合わせをして半田固着させ
る。また、一方の絶縁基板１の端部には、直列に接続し
た導電エレメント２に直流電流を供給するためにリード
線４が半田付けされる。2. Description of the Related Art As is well known, in thermoelectric elements, a large number of P-type and N-type conductive elements are arranged between a pair of opposing insulating substrates and electrically connected in series through a predetermined conductor wiring pattern. Is configured. Then, heat is absorbed or radiated by passing a direct current through a direct current power source connected to the conductive element. An outline of the thermoelectric element as described above is shown in FIG. In the figure,
Between the insulating substrates 1 and 1, P-type and N-type conductive elements 2 composed mainly of a Bi-Te based material are alternately connected in series by a conductive material 3 such as a copper piece. Alumina ceramic is mainly used as the insulating substrate 1, and a conductor wiring pattern made of W-Ni or the like for solder-fixing the conductive material 3 is formed on one surface thereof. After the conductive material 3 is fixed to the conductor wiring pattern by soldering, the P-type and N-type conductive elements 2 are alternately arranged on the conductive material 3 and soldered to the other insulating substrate. The conductive material 3 of its own is accurately aligned with the conductive element 2 and soldered. Further, a lead wire 4 is soldered to the end portion of one insulating substrate 1 in order to supply a direct current to the conductive elements 2 connected in series.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記のよう
な熱電素子の構造では絶縁基板１の導体配線パターン上
に導電材３を並べ、それらを半田固着すため、組立工数
が掛かること、及び導電エレメント２自体が冷却や加熱
源として作用するため、アルミナセラミック製の絶縁基
板１と導電材３との膨張係数の差により熱による膨張、
収縮が生じ、半田固着部で剥離する場合があり、素子と
しての信頼性を低下させていたことなどの解決すべき課
題があった。By the way, in the structure of the thermoelectric element as described above, the conductive material 3 is arranged on the conductive wiring pattern of the insulating substrate 1 and they are fixed by soldering. Since the element 2 itself acts as a cooling or heating source, thermal expansion due to the difference in expansion coefficient between the insulating substrate 1 made of alumina ceramic and the conductive material 3,
There is a problem to be solved, such as shrinkage, which may cause peeling at the solder-fixed portion, which lowers the reliability as an element.
【０００４】[0004]
【発明の目的】本発明は、上記のような課題を解決する
ためになされたもので、組立工数が減少し、かつ、加熱
・冷却のヒートサイクルにより影響を受けず、剥離現象
がなく素子の信頼性を向上させた安価な熱電素子を提供
することを目的とするものである。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. The number of assembling steps is reduced, the heat cycle of heating / cooling does not affect the element, and no peeling phenomenon occurs. It is an object of the present invention to provide an inexpensive thermoelectric element with improved reliability.
【０００５】[0005]
【問題点を解決するための手段】本発明の熱電素子は、
Ｐ型及びＮ型からなる導電エレメントを、導電材により
交互に直列に半田固着し、これを２枚の絶縁板により挟
み込むようにして固定した熱電素子において、前記絶縁
板を耐熱樹脂製絶縁板とし、該絶縁板の所定の位置に凹
部を設け、該凹部に前記導電材を嵌合させたことを特徴
とするものである。The thermoelectric element of the present invention comprises:
In a thermoelectric element in which P-type and N-type conductive elements are alternately soldered and fixed in series by a conductive material and fixed by sandwiching them between two insulating plates, the insulating plate is a heat-resistant resin insulating plate. A recess is provided at a predetermined position of the insulating plate, and the conductive material is fitted into the recess.
【０００６】[0006]
【作用】本発明の熱電素子は、耐熱樹脂製絶縁板の所定
の位置に導電材を嵌合させるようにしたので、導電材の
絶縁板への半田固着の手間が省けると共に、該半田固着
部がないために、それらの境界面に熱的ストレスを受け
ず、剥離現象がないために素子の信頼性が著しく向上す
る。また、半田固着箇所は熱電エレメントと導電材との
間のみであるので、組立工数が減少し、この種の熱電素
子を安価に製作することができる。In the thermoelectric element of the present invention, the conductive material is fitted at a predetermined position of the heat-resistant resin insulating plate, so that the labor of fixing the conductive material to the insulating plate can be saved and the solder fixing portion can be omitted. Since there is no crack, there is no thermal stress on the boundary surface, and there is no peeling phenomenon, so the reliability of the device is significantly improved. Further, since the solder fixing point is only between the thermoelectric element and the conductive material, the number of assembling steps is reduced, and this type of thermoelectric element can be manufactured at low cost.
【０００７】[0007]
【実施例】以下に、本発明の実施例を図を参照して詳細
に説明する。図１は、本発明の第１の実施例を示す熱電
素子の組立図である。図において、１０，１０は耐熱樹
脂製絶縁板である。この耐熱樹脂製絶縁板１０，１０と
して、例えば、ポリフェニレンサルファイド樹脂（ＰＰ
Ｓ樹脂と略記する。）を用いる。この樹脂の特徴は、耐
熱性の他に、不燃性、寸法安定性、耐薬品性、成形性等
に優れた性質を有している。上記のＰＰＳ樹脂を使用し
て所定の耐熱樹脂製絶縁板１０，１０を製作するが、そ
の対向面に所定のパターンで凹部１１を形成する。この
凹部１１に対して銅片からなる導電材１３を嵌合させ
る。この導電材１３は１枚づつ嵌合させても良いが、プ
レス機械等の金型から個々の導電材１３に切り出す際に
位置合わせを行ない、すべてを一度に嵌合させても良
い。これにより従来行なっていた絶縁基板１，１への導
電材１３の半田固着作業がなくなり、組立時間が大幅に
短縮され熱電素子の製造原価を低減することができる。
まず、下側の耐熱樹脂製絶縁板１０の凹部１１内に導電
材１３を遊嵌させる。次いで、ディスペンサ若しくはプ
リント法で導電材１３の表面に半田ペーストを塗布した
後、Ｐ型及びＮ型の熱電エレメント２を導電材１３上に
交互に搭載する。一方、上側の導電材１３は、図示を省
略した吸着治具上に熱電エレメント２の間隔に対応させ
た所定の間隔で並べられ上記と同様に、その表面に半田
ペーストが塗布される。また、吸着治具に吸着したまま
上記の熱電エレメント２上に重ねられたところで吸着が
解除され、下側の導電材１３上に固定された熱電エレメ
ント２上に搭載される。次に、これらの組立体を炉内で
加熱してすべての熱電エレメント２と導電材１３とを半
田固着する。半田付工程終了後は、耐熱樹脂製絶縁板１
０と導電材１３とは半田付けされていないので、互いに
分離しないように対向する耐熱樹脂製絶縁板１０，１０
の外側から適当な治具で押さえて仮止めしておく。実際
の使用時においては、上記耐熱樹脂製絶縁板１０，１０
の外側に吸熱、放熱フィンを配置し加圧接触させる。ま
た、導電材１３は耐熱樹脂製絶縁板１０の凹部１１に、
単に嵌合しているだけで相互に半田固着されていないた
め、熱による膨張、収縮の応力がそれらの境界面に作用
せず、半田の剥離現象がないので、この種の熱電素子の
信頼性を大幅に向上させることができる。なお、耐熱樹
脂製絶縁板１０側に設ける凹部１１の形状は、特に限定
されないが、例えば、断面形状をアリ溝、即ち、凹部１
１の開口部が底面部に比較して若干すぼまった形状とす
ることにより導電材１３の脱落防止を効果的に行なうこ
とができる。Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is an assembly diagram of a thermoelectric element showing a first embodiment of the present invention. In the figure, 10 and 10 are heat-resistant resin insulating plates. As the heat-resistant resin insulating plates 10 and 10, for example, polyphenylene sulfide resin (PP
Abbreviated as S resin. ) Is used. The characteristics of this resin are not only heat resistance but also excellent properties such as nonflammability, dimensional stability, chemical resistance, and moldability. The heat-resistant resin insulating plates 10 and 10 are manufactured using the PPS resin described above, and the recesses 11 are formed in a predetermined pattern on the opposing surfaces thereof. A conductive material 13 made of a copper piece is fitted into the recess 11. The conductive materials 13 may be fitted one by one, but they may be aligned at the time of cutting out from the mold of a press machine or the like into individual conductive materials 13 and all may be fitted at once. As a result, the soldering work of the conductive material 13 to the insulating substrates 1 and 1 which has been conventionally performed is eliminated, and the assembly time is greatly shortened, and the manufacturing cost of the thermoelectric element can be reduced.
First, the conductive material 13 is loosely fitted in the recess 11 of the lower heat-resistant resin insulating plate 10. Then, a solder paste is applied to the surface of the conductive material 13 by a dispenser or a printing method, and then P-type and N-type thermoelectric elements 2 are alternately mounted on the conductive material 13. On the other hand, the upper conductive material 13 is arranged on a suction jig (not shown) at a predetermined interval corresponding to the interval of the thermoelectric elements 2, and solder paste is applied to the surface thereof in the same manner as above. Further, when it is superposed on the thermoelectric element 2 while being adsorbed by the adsorption jig, the adsorption is released, and it is mounted on the thermoelectric element 2 fixed on the lower conductive material 13. Next, these assemblies are heated in a furnace to solder-bond all the thermoelectric elements 2 and the conductive material 13. After the soldering process, the heat-resistant resin insulation plate 1
0 and the conductive material 13 are not soldered, so that the heat-resistant resin insulating plates 10 and 10 facing each other so as not to be separated from each other.
Temporarily fix it by pressing it from the outside with a suitable jig. In actual use, the heat-resistant resin insulating plates 10 and 10 are used.
Heat absorbing and radiating fins are arranged on the outer side of and are brought into pressure contact. Further, the conductive material 13 is provided in the concave portion 11 of the heat-resistant resin insulating plate 10,
Since they are simply fitted but not soldered to each other, thermal expansion and contraction stresses do not act on their boundary surfaces, and there is no solder peeling phenomenon, so the reliability of this type of thermoelectric element Can be significantly improved. The shape of the concave portion 11 provided on the heat-resistant resin insulating plate 10 side is not particularly limited, but for example, the cross-sectional shape is a dovetail groove, that is, the concave portion 1.
By making the opening of No. 1 slightly recessed as compared with the bottom, it is possible to effectively prevent the conductive material 13 from falling off.
【０００８】次に、本発明の第２の実施例を図２を参照
して説明する。この実施例では、ＰＰＳ樹脂からなる耐
熱樹脂製絶縁板１０を金型でモールド成形する際に、導
電材１３を所定位置にインサートモールドしておくもの
である。この場合、導電材１３は、耐熱性の高いＰＰＳ
樹脂内にインサートモールドされているので、導電材１
３の表面に半田ペーストを塗布後、熱電エレメント２を
一対の耐熱樹脂性絶縁板１０で挟んで、全体を導電材１
３と熱電エレメント２を半田固着させる。さらに、好都
合なことには、ＰＰＳ樹脂と銅片からなる導電材１３と
の線膨張係数が略等しいため、動作中の熱的ストレスに
も十分耐えることができることである。Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, the conductive material 13 is insert-molded at a predetermined position when the heat-resistant resin insulating plate 10 made of PPS resin is molded by a mold. In this case, the conductive material 13 is PPS having high heat resistance.
Since it is insert-molded in resin, conductive material 1
After the solder paste is applied to the surface of No. 3, the thermoelectric element 2 is sandwiched by a pair of heat-resistant resin insulating plates 10 and the whole is made of the conductive material 1.
3 and the thermoelectric element 2 are fixed by soldering. Further, it is advantageous that the PPS resin and the conductive material 13 made of copper pieces have substantially the same linear expansion coefficient, and thus can sufficiently withstand the thermal stress during operation.
【０００９】[0009]
【発明の効果】以上のように、本発明によれば、熱電エ
レメントを直列に接続する導電材を耐熱樹脂製絶縁板に
半田固着させることなく、該絶縁板に設けられた凹部に
単に嵌合させるようにしたので、実際の使用時に加わる
熱的ストレスに耐え、半田固着部の剥離がなくなり、素
子の信頼性が大幅に向上する。また、半田固着箇所は熱
電エレメントと導電材との間のみであるため、半田固着
箇所の減少により組立工数が著しく減少し、この種の熱
電素子を安価に製作することができるなどの効果があ
る。As described above, according to the present invention, the conductive material for connecting the thermoelectric elements in series is simply fitted into the concave portion provided in the heat insulating resin insulating plate without soldering. By doing so, the thermal stress applied during actual use can be withstood, the peeling of the solder-fixed portion is eliminated, and the reliability of the element is greatly improved. Further, since the solder fixing point is only between the thermoelectric element and the conductive material, there is an effect that the number of assembling steps is remarkably reduced due to the reduction of the solder fixing point, and this type of thermoelectric element can be manufactured at low cost. .
【図１】本発明の第１の実施例を示す熱電素子の組立断
面図である。FIG. 1 is an assembled sectional view of a thermoelectric element showing a first embodiment of the present invention.
【図２】本発明の第２の実施例を示す熱電素子の組立断
面図である。FIG. 2 is an assembled sectional view of a thermoelectric element showing a second embodiment of the present invention.
【図３】従来の熱電素子の構造を示す断面図である。FIG. 3 is a cross-sectional view showing a structure of a conventional thermoelectric element.
２ 導電エレメント １０ 耐熱樹脂製絶縁板 １１ 凹部 １３ 導電材 2 Conductive element 10 Heat-resistant resin insulating plate 11 Recessed portion 13 Conductive material
Claims (2)
を、導電材により交互に直列に半田固着し、これを２枚
の絶縁板により挟み込むようにして固定した熱電素子に
おいて、前記絶縁板を耐熱樹脂製絶縁板とし、該絶縁板
の所定の位置に凹部を設け、該凹部に前記導電材を嵌合
させたことを特徴とする熱電素子。1. A thermoelectric element in which conductive elements of P type and N type are alternately soldered and fixed in series by a conductive material and sandwiched between two insulating plates to fix the insulating plates. A thermoelectric element comprising a resin insulating plate, a concave portion provided at a predetermined position of the insulating plate, and the conductive material fitted in the concave portion.
記導電材をあらかじめインサートモードルしたことを特
徴とする請求項１に記載の熱電素子。2. The thermoelectric element according to claim 1, wherein the conductive material is previously insert-molded at a predetermined position of the heat-resistant resin insulating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4069615A JPH06169109A (en) | 1992-02-19 | 1992-02-19 | Thermoelectric element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4069615A JPH06169109A (en) | 1992-02-19 | 1992-02-19 | Thermoelectric element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06169109A true JPH06169109A (en) | 1994-06-14 |
Family
ID=13407950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4069615A Pending JPH06169109A (en) | 1992-02-19 | 1992-02-19 | Thermoelectric element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06169109A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997045882A1 (en) * | 1996-05-28 | 1997-12-04 | Matsushita Electric Works, Ltd. | Method for manufacturing thermoelectric module |
| WO1999034452A1 (en) * | 1997-12-25 | 1999-07-08 | Seiko Instruments Inc. | Thermoelectric generation unit and portable electronic device using the unit |
| JP2007184416A (en) * | 2006-01-06 | 2007-07-19 | Tohoku Okano Electronics:Kk | Thermoelectric conversion module |
| JP2016040811A (en) * | 2014-08-13 | 2016-03-24 | 富士通株式会社 | Thermoelectric conversion module and manufacturing method for the same, sensor module, and information processing system |
| US9601678B2 (en) | 2010-11-09 | 2017-03-21 | Samsung Electronics Co., Ltd. | Thermoelectric device and method of manufacturing the same |
-
1992
- 1992-02-19 JP JP4069615A patent/JPH06169109A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997045882A1 (en) * | 1996-05-28 | 1997-12-04 | Matsushita Electric Works, Ltd. | Method for manufacturing thermoelectric module |
| WO1999034452A1 (en) * | 1997-12-25 | 1999-07-08 | Seiko Instruments Inc. | Thermoelectric generation unit and portable electronic device using the unit |
| JP2007184416A (en) * | 2006-01-06 | 2007-07-19 | Tohoku Okano Electronics:Kk | Thermoelectric conversion module |
| US9601678B2 (en) | 2010-11-09 | 2017-03-21 | Samsung Electronics Co., Ltd. | Thermoelectric device and method of manufacturing the same |
| JP2016040811A (en) * | 2014-08-13 | 2016-03-24 | 富士通株式会社 | Thermoelectric conversion module and manufacturing method for the same, sensor module, and information processing system |
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