JPH06165570A - Hybrid integrated circuit for dc motor - Google Patents
Hybrid integrated circuit for dc motorInfo
- Publication number
- JPH06165570A JPH06165570A JP4310471A JP31047192A JPH06165570A JP H06165570 A JPH06165570 A JP H06165570A JP 4310471 A JP4310471 A JP 4310471A JP 31047192 A JP31047192 A JP 31047192A JP H06165570 A JPH06165570 A JP H06165570A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- motor
- hybrid integrated
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、混成集積回路に関し、
特に、直流モータの駆動制御用に用いられる混成集積回
路に関するものである。FIELD OF THE INVENTION This invention relates to hybrid integrated circuits,
In particular, it relates to a hybrid integrated circuit used for drive control of a DC motor.
【０００２】[0002]
【従来の技術】個別に製造された半導体集積回路や固定
抵抗，コンデンサなどの電子部品を絶縁基板上に搭載し
て、外周を合成樹脂で封止した構造の混成集積回路が知
られている。この種の混成集積回路においては、通常、
合成樹脂やセラミックなどで形成された絶縁基板上に、
蒸着やエッチングなどにより所定形状の導電パターンを
形成し、この導電パターンに半導体集積回路や電子部品
が、半田付けやボンディングなどにより電気的に接続さ
れている。2. Description of the Related Art A hybrid integrated circuit having a structure in which individually manufactured semiconductor integrated circuits and electronic components such as fixed resistors and capacitors are mounted on an insulating substrate and the outer periphery is sealed with a synthetic resin is known. In this kind of hybrid integrated circuit,
On an insulating substrate made of synthetic resin or ceramic,
A conductive pattern having a predetermined shape is formed by vapor deposition, etching, or the like, and a semiconductor integrated circuit or an electronic component is electrically connected to this conductive pattern by soldering, bonding, or the like.
【０００３】そして、近時のこの種の混成集積回路で
は、その薄型，小型化のために、例えば、半導体集積回
路においては、リード端子や外装パッケージを省略した
構造のベアチップが採用され、また、固定抵抗などの電
子部品においても、小型のチップ部品が採用されてい
る。ところで、直流モータの分野において、磁気ディス
ク装置などの回転駆動用としてブラシレス多相直流モー
タが知られている。この種のモータでは、ステータ側の
磁界発生タイミングを制御する必要があって、従来は、
このために、ロータマグネットの回転位置を検出するセ
ンサを設けていたが、近時、モータの小型化やセンサの
特性劣化を回避するためにセンサを使用せず、休止中の
コイルに発生する誘起電流を利用している。In recent years, in this kind of hybrid integrated circuit, in order to make it thin and compact, for example, in a semiconductor integrated circuit, a bare chip having a structure in which lead terminals and an outer package are omitted is adopted. Small chip components are also used in electronic components such as fixed resistors. By the way, in the field of DC motors, brushless multiphase DC motors are known for driving rotation of magnetic disk devices and the like. In this type of motor, it is necessary to control the magnetic field generation timing on the stator side, and conventionally,
For this reason, a sensor that detects the rotational position of the rotor magnet was provided, but recently, in order to avoid downsizing of the motor and deterioration of the sensor characteristics, the sensor is not used, and an induction that occurs in the coil during rest is generated. Utilizes electric current.
【０００４】このようなセンサレス多相直流モータで
は、また、コイルに供給される電流値を制御するための
電流制御回路が設けられ、この電流制御回路は、コイル
に流れる電流値を検出する電流検出抵抗を含んでいる。
しかしながら、このような形式のセンサレス多相直流モ
ータでは、以下に説明する技術的課題があった。In such a sensorless multi-phase DC motor, a current control circuit for controlling the current value supplied to the coil is also provided, and this current control circuit detects the current value flowing in the coil. Including resistance.
However, such a sensorless polyphase DC motor of this type has the technical problems described below.
【０００５】[0005]
【発明が解決しようとする課題】すなわち、上述した直
流モータ用駆動制御回路を混成集積回路化するとすれ
ば、現状の混成集積回路技術では、半導体集積回路をベ
アチップ型式のものとし、電流検出用抵抗をチップ内に
配置することは可能である。しかしながら、この構成で
は、特に、チップ内に設けた抵抗は、抵抗値の公差が大
きく、また、温度変化により、その誤差が一層大きくな
るため、コイルに流れる電流を正確に検出することがで
きない。さらに、このことに加えて、コスト面でも高価
になるという問題があった。That is, if the drive control circuit for the DC motor described above is to be formed as a hybrid integrated circuit, in the current hybrid integrated circuit technology, the semiconductor integrated circuit is a bare chip type and the current detection resistor is used. Can be placed in the chip. However, in this configuration, in particular, the resistance provided in the chip has a large tolerance of the resistance value, and the error is further increased due to the temperature change, so that the current flowing through the coil cannot be accurately detected. Further, in addition to this, there is a problem that the cost becomes high.
【０００６】本発明は、このような従来の問題点に鑑み
てなされたものであり、その目的とするところは、より
一層の小型化且つ低コスト化が可能になるに直流モータ
用混成集積回路を提供することにある。The present invention has been made in view of such conventional problems, and an object of the present invention is to realize a hybrid integrated circuit for a DC motor, which enables further miniaturization and cost reduction. To provide.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、絶縁基板上に形成された導電パターン
と、この導電パターンと電気的に接続されるベアチップ
型の半導体集積回路と、前記半導体集積回路およびまた
は導電パターンに電気的に接続される比較的低抵抗値の
固定抵抗とを備えた直流モータ用混成集積回路におい
て、前記固定抵抗は、前記絶縁基板上に所定の間隔をお
いて形成された複数の中継導電部と、これらの中継導電
部間に端部が電気的に接続される複数の金属製抵抗線材
とからなることを特徴とする。To achieve the above object, the present invention provides a conductive pattern formed on an insulating substrate, and a bare chip type semiconductor integrated circuit electrically connected to the conductive pattern. In a hybrid integrated circuit for a DC motor, which comprises a fixed resistor having a relatively low resistance value that is electrically connected to the semiconductor integrated circuit and / or the conductive pattern, the fixed resistor has a predetermined interval on the insulating substrate. It is characterized in that it is composed of a plurality of relay conductive parts formed in this way and a plurality of metal resistance wire rods whose ends are electrically connected between these relay conductive parts.
【０００８】[0008]
【作用】上記構成の直流モータ用混成集積回路によれ
ば、特に、固定抵抗が、絶縁基板上に所定の間隔をおい
て形成された複数の中継導電部と、これらの中継導電部
間に端部が電気的に接続される複数の金属製抵抗線材と
から構成されているので、回路全体が安価かつ小型にな
る。さらに、温度変化によっても抵抗値が大きく変化す
ることがない。According to the hybrid integrated circuit for a DC motor having the above-mentioned structure, in particular, the fixed resistor is provided with a plurality of relay conductive portions formed on the insulating substrate at predetermined intervals, and an end between the relay conductive portions. Since the part is composed of a plurality of metal resistance wire members electrically connected to each other, the entire circuit is inexpensive and small. Furthermore, the resistance value does not change significantly even when the temperature changes.
【０００９】[0009]
【実施例】以下、本発明の好適な実施例について添付図
面を参照にして詳細に説明する。図１は、本発明にかか
る直流モータ用混成集積回路の一実施例を示している。
同図に示す混成集積回路は、合成樹脂、例えば、ポリア
ミド樹脂で形成された可撓性を有する絶縁基板１と、こ
の絶縁基板１上に形成された所定形状の導電パターン２
と、この導電パターン２と電気的に接続されたベアチッ
プ型の半導体集積回路３と、この半導体集積回路３およ
び導電パターン２と電気的に接続された固定抵抗４とを
有している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows an embodiment of a hybrid integrated circuit for a DC motor according to the present invention.
The hybrid integrated circuit shown in the figure has a flexible insulating substrate 1 made of synthetic resin, for example, polyamide resin, and a conductive pattern 2 having a predetermined shape formed on the insulating substrate 1.
And a bare chip type semiconductor integrated circuit 3 electrically connected to the conductive pattern 2 and a fixed resistor 4 electrically connected to the semiconductor integrated circuit 3 and the conductive pattern 2.
【００１０】導電パターン２は、この実施例では、絶縁
基板１上に貼着された銅箔をエッチングにより除去する
ことにより所定の形状に形成されている。また、半導体
集積回路３は、リード端子や外装パッケージが省略され
た構造のベアチップ型のものであり、その裏面側に接着
剤を介在させて、絶縁基板１の所定位置に固着されてい
る。In this embodiment, the conductive pattern 2 is formed in a predetermined shape by removing the copper foil stuck on the insulating substrate 1 by etching. The semiconductor integrated circuit 3 is of a bare chip type in which lead terminals and an outer package are omitted, and is fixed to a predetermined position of the insulating substrate 1 with an adhesive agent interposed on the back surface side.
【００１１】この半導体集積回路３は、その表面に設け
られた電極部３ａが、接続用線材５（金線でよい）によ
り導電パターン２と接続されている。また、固定抵抗４
は、導電パターン２間に所定の間隔をおいて複数の中継
導電部６（実施例では４個）を形成し、この中継導電部
６間、および、一端側の中継導電部６と導電パターン２
との間、他端側の中継導電部６と半導体集積回路４との
間にそれぞれ端部が固着された抵抗線材７（例えば、金
線でよい）とから構成されている。In this semiconductor integrated circuit 3, the electrode portion 3a provided on the surface thereof is connected to the conductive pattern 2 by a connecting wire 5 (which may be a gold wire). In addition, fixed resistance 4
Form a plurality of relay conductive portions 6 (four in the embodiment) at predetermined intervals between the conductive patterns 2, and between the relay conductive portions 6 and between the relay conductive portions 6 on one end side and the conductive pattern 2.
And a resistance wire 7 (for example, a gold wire) whose ends are fixed between the relay conductive part 6 on the other end side and the semiconductor integrated circuit 4.
【００１２】抵抗線材７の接続に関しては、図に示すよ
うに、中継導電部６の一端側から片方の抵抗線材７が延
び、その他端部から他方の抵抗線材７が延びるように接
続するのが、接続作業の点から好ましい。接続用線材５
および抵抗線材７と導電パターン２および半導体集積回
路３の電極部３ａとの電気的な接続手段は、例えば、ボ
ンディング接続が採用される。また、接続用線材５は、
抵抗値が非常に小さい金属製線材が用いられ、抵抗線材
７は、例えば、直径が２５μφの金線が使用される（こ
の直径の金線では、長さが７〜８ｍｍでその抵抗値は
０．３４〜０．３８Ωとなり、直流モータのコイルに供
給される電流値を検出する電流検出用抵抗として実用化
することは、十分に可能である）。Regarding the connection of the resistance wire rod 7, as shown in the figure, one resistance wire rod 7 extends from one end side of the relay conductive portion 6, and the other resistance wire rod 7 extends from the other end portion. It is preferable in terms of connection work. Connection wire 5
As a means for electrically connecting the resistance wire 7 to the conductive pattern 2 and the electrode portion 3a of the semiconductor integrated circuit 3, for example, bonding connection is adopted. Also, the connecting wire 5
A metal wire having a very small resistance value is used, and a gold wire having a diameter of 25 μφ is used as the resistance wire 7 (the gold wire having this diameter has a length of 7 to 8 mm and a resistance value of 0). It becomes 0.34 to 0.38Ω, and can be sufficiently put into practical use as a current detection resistor for detecting the value of the current supplied to the coil of the DC motor).
【００１３】固定抵抗４の抵抗値は、図１においては、
Ａ，Ｂ間の抵抗値、すなわち、中継導電部６間および中
継導電部６と導電パターン２および電極部３ａとの間に
固着されている複数の抵抗線材７自体の抵抗値と、抵抗
線材７と中継導電部６および導電パターン２，電極部と
の接続部の抵抗値と、中継導電部６の抵抗値との合計に
なる。The resistance value of the fixed resistor 4 is as shown in FIG.
The resistance value between A and B, that is, the resistance values of the resistance wire members 7 themselves fixed between the relay conductive parts 6 and between the relay conductive part 6 and the conductive pattern 2 and the electrode part 3a, and the resistance wire member 7. Is the sum of the resistance value of the connection between the relay conductive portion 6 and the conductive pattern 2 and the electrode portion, and the resistance value of the relay conductive portion 6.
【００１４】固定抵抗４の抵抗値は、例えば、抵抗線材
７を固着した状態で、Ａ，Ｂ間の抵抗値を実測し、線材
７の径や長さが異なったもの複数準備し、これを直並列
することにより、所定の抵抗値が得られるようにする。
そして、固定抵抗４に所定の抵抗値が得られると、図１
に仮想線で示すように、合成樹脂製の封止部８を形成す
れば、混成集積回路が完成する。As for the resistance value of the fixed resistor 4, for example, the resistance value between A and B is measured with the resistance wire 7 fixed, and a plurality of wires 7 having different diameters and lengths are prepared. By connecting in series, a predetermined resistance value can be obtained.
Then, when a predetermined resistance value is obtained for the fixed resistor 4, the
A synthetic integrated circuit is completed by forming a synthetic resin sealing portion 8 as indicated by a virtual line.
【００１５】さて、以上のような構成の直流モータ用混
成集積回路によれば、特に、固定抵抗４が、絶縁基板１
上に所定の間隔をおいて形成された複数の中継導電部６
と、これらの中継導電部６間に端部が電気的に接続され
る複数の金属製抵抗線材７とから構成されているので、
回路全体が小型になるとともに、固定抵抗４を非常に安
価に構成することができる。また、抵抗線材７は、中継
導電部６や導電パターン２と電気的に接続されていれ
ば、その接続位置は殆ど問題にならないので、厳密な位
置合わせを必要とせず、接続作業も簡単になる。さら
に、温度が変化しても抵抗値が大きく変化することはな
い。Now, according to the hybrid integrated circuit for a DC motor having the above-mentioned structure, in particular, the fixed resistor 4 includes the insulating substrate 1.
A plurality of relay conductive parts 6 which are formed on the upper part at predetermined intervals
And a plurality of metal resistance wire rods 7 whose ends are electrically connected between the relay conductive portions 6,
The fixed circuit 4 can be constructed at a very low cost while the entire circuit is downsized. In addition, if the resistance wire 7 is electrically connected to the relay conductive portion 6 and the conductive pattern 2, the connection position thereof does not pose any problem, so strict alignment is not required and the connection work is simplified. . Further, even if the temperature changes, the resistance value does not change significantly.
【００１６】なお、上記実施例では、絶縁基板１として
可撓性基板を用いたものを例示したが、この基板１は、
通常の絶縁性基板やセラミックス基板であってもよい。In the above embodiment, the flexible substrate is used as the insulating substrate 1, but the substrate 1 is
It may be an ordinary insulating substrate or a ceramic substrate.
【００１７】[0017]
【発明の効果】以上、実施例で詳細に説明したように、
本発明にかかる直流モータ用混成集積回路によれば、特
に、固定抵抗が、絶縁基板上に所定の間隔をおいて形成
された複数の中継導電部と、これらの中継導電部間に端
部が電気的に接続される複数の金属製抵抗線材とから構
成されているので、回路全体が小型になるとともに、固
定抵抗を非常に安価に構成することができる。As described above in detail in the embodiments,
According to the hybrid integrated circuit for a DC motor of the present invention, in particular, the fixed resistor has a plurality of relay conductive portions formed on the insulating substrate at predetermined intervals, and an end portion between the relay conductive portions. Since it is composed of a plurality of metal resistance wires that are electrically connected to each other, the entire circuit can be downsized and the fixed resistance can be formed at a very low cost.
【図１】本発明にかかる直流モータ用混成集積回路の一
実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of a hybrid integrated circuit for a DC motor according to the present invention.
１ 絶縁基板 ２ 導電パターン ３ 半導体集積回路 ４ 固定抵抗 ６ 中継導電部 ７ 抵抗線材 1 Insulating Substrate 2 Conductive Pattern 3 Semiconductor Integrated Circuit 4 Fixed Resistor 6 Relay Conductive Part 7 Resistance Wire
Claims (1)
と、この導電パターンと電気的に接続されるベアチップ
型の半導体集積回路と、前記半導体集積回路およびまた
は導電パターンに電気的に接続される比較的低抵抗値の
固定抵抗とを備えた直流モータ用混成集積回路におい
て、 前記固定抵抗は、前記絶縁基板上に所定の間隔をおいて
形成された複数の中継導電部と、これらの中継導電部間
に端部が電気的に接続される複数の金属製抵抗線材とか
らなることを特徴とする直流モータ用混成集積回路。1. A comparison between a conductive pattern formed on an insulating substrate, a bare chip type semiconductor integrated circuit electrically connected to the conductive pattern, and a semiconductor integrated circuit electrically connected to the semiconductor integrated circuit and / or the conductive pattern. In a hybrid integrated circuit for a DC motor having a fixed resistance having a relatively low resistance value, the fixed resistance includes a plurality of relay conductive parts formed at predetermined intervals on the insulating substrate, and these relay conductive parts. A hybrid integrated circuit for a DC motor, comprising: a plurality of metal resistance wire rods whose ends are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4310471A JPH06165570A (en) | 1992-11-19 | 1992-11-19 | Hybrid integrated circuit for dc motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4310471A JPH06165570A (en) | 1992-11-19 | 1992-11-19 | Hybrid integrated circuit for dc motor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06165570A true JPH06165570A (en) | 1994-06-10 |
Family
ID=18005648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4310471A Pending JPH06165570A (en) | 1992-11-19 | 1992-11-19 | Hybrid integrated circuit for dc motor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06165570A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5767579A (en) * | 1995-12-21 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having an electrical connection between a control electrode and a resistive layer |
| JP2012507748A (en) * | 2008-10-31 | 2012-03-29 | ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッド | Method and apparatus for forming an ophthalmic lens with an embedded microcontroller |
| US9375885B2 (en) | 2008-10-31 | 2016-06-28 | Johnson & Johnson Vision Care, Inc. | Processor controlled ophthalmic device |
-
1992
- 1992-11-19 JP JP4310471A patent/JPH06165570A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5767579A (en) * | 1995-12-21 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having an electrical connection between a control electrode and a resistive layer |
| EP0780899A3 (en) * | 1995-12-21 | 1998-11-11 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor assembly |
| JP2012507748A (en) * | 2008-10-31 | 2012-03-29 | ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッド | Method and apparatus for forming an ophthalmic lens with an embedded microcontroller |
| US9375885B2 (en) | 2008-10-31 | 2016-06-28 | Johnson & Johnson Vision Care, Inc. | Processor controlled ophthalmic device |
| US9375886B2 (en) | 2008-10-31 | 2016-06-28 | Johnson & Johnson Vision Care Inc. | Ophthalmic device with embedded microcontroller |
| JP2016191949A (en) * | 2008-10-31 | 2016-11-10 | ジョンソン・アンド・ジョンソン・ビジョン・ケア・インコーポレイテッドＪｏｈｎｓｏｎ ＆ Ｊｏｈｎｓｏｎ Ｖｉｓｉｏｎ Ｃａｒｅ， Ｉｎｃ． | Method for forming ophthalmological lenses equipped with embedded microcontroller |
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