JPH06158383A - Nickel-iron plating method - Google Patents
Nickel-iron plating methodInfo
- Publication number
- JPH06158383A JPH06158383A JP30840292A JP30840292A JPH06158383A JP H06158383 A JPH06158383 A JP H06158383A JP 30840292 A JP30840292 A JP 30840292A JP 30840292 A JP30840292 A JP 30840292A JP H06158383 A JPH06158383 A JP H06158383A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cathode
- nickel
- plated
- stirring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気めっき法によって
ニッケル−鉄合金を被めっき材料にめっきするためのニ
ッケル−鉄めっき方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nickel-iron plating method for plating a nickel-iron alloy on a material to be plated by an electroplating method.
【０００２】[0002]
【従来の技術】図５は従来のニッケル−鉄めっき方法を
実施するためのめっき装置の一例を示す断面図で、
（ａ）は装置全体の断面図、（ｂ）はＣ−Ｃ線断面図、
図６は図５の例において、攪拌へらの往復速度を２５回
／分とし、電流密度６０ｍＡ／ｃｍ2 で２インチ角の薄
膜磁気ヘッド用ウエハ上にめっきを行った場合のウエハ
上のＦｅ組成の分布状態の一例を示す分布図である。2. Description of the Related Art FIG. 5 is a sectional view showing an example of a plating apparatus for carrying out a conventional nickel-iron plating method.
(A) is a sectional view of the entire apparatus, (b) is a sectional view taken along the line C-C,
FIG. 6 shows the Fe composition on the wafer when a 2-inch square wafer for thin film magnetic head is plated at a current density of 60 mA / cm 2 at a reciprocating speed of the stirring spatula of 25 times / min in the example of FIG. It is a distribution diagram showing an example of the distribution state of.
【０００３】電気めっき法によってニッケル−鉄合金を
被めっき材料にめっきするための従来のニッケル−鉄め
っき方法は、図５に示すように、めっき槽１５の中にア
ノード１３とカソード１４とを設け、カソード１４の表
面の近傍に被めっき材料１７を配置し、被めっき材料１
７の近傍に断面が三角形の１対の攪拌へら１２を頂点を
向い合わせて配設し、めっき槽１５の中にめっき液１６
を充満させ、攪拌へら１２を左右方向に往復運動させる
ことによってめっき液１６を攪拌しながらめっきを行っ
ている。In a conventional nickel-iron plating method for plating a nickel-iron alloy on a material to be plated by electroplating, an anode 13 and a cathode 14 are provided in a plating tank 15 as shown in FIG. The plated material 17 is arranged in the vicinity of the surface of the cathode 14, and the plated material 1
A pair of stirring spatulas 12 each having a triangular cross section are arranged in the vicinity of 7 with their vertices facing each other.
And the stirring spatula 12 is reciprocated in the left-right direction to stir the plating solution 16 to perform plating.
【０００４】上述の方法によって、攪拌へら１２の往復
運動の速度を２５回／分とし、電流密度６０ｍＡ／ｃｍ
2 で２インチ角の薄膜磁気ヘッド用ウエハ（ウエハ）上
にニッケル−鉄（Ｎｉ−Ｆｅ）めっきを行った場合、図
６に示すように、ウエハ１０ｃ上のＦｅ組成（％）の分
布は、１７．２１％〜１９．５５％であり、その差は
２．３４％程度ある。According to the above-mentioned method, the reciprocating speed of the stirring spatula 12 was set to 25 times / minute, and the current density was 60 mA / cm.
When nickel-iron (Ni-Fe) plating was performed on a 2 inch square thin film magnetic head wafer (wafer) at 2, the distribution of the Fe composition (%) on the wafer 10c was as shown in FIG. It is 17.21% to 19.55%, and the difference is about 2.34%.
【０００５】[0005]
【発明が解決しようとする課題】上述したように、従来
のニッケル−鉄めっき方法においては、２インチ角の薄
膜磁気ヘッド用ウエハ（ウエハ）上にめっきを行った場
合、Ｆｅ組成について２．３％程度の差が発生し、この
分だけ薄膜磁気ヘッドの電磁変換特性のばらつきが生ず
るという欠点を有している。As described above, in the conventional nickel-iron plating method, when a 2-inch square thin film magnetic head wafer (wafer) is plated, the Fe composition is 2.3. There is a drawback that a difference of about 10% occurs, and the electromagnetic conversion characteristics of the thin film magnetic head vary by that much.
【０００６】[0006]
【課題を解決するための手段】本発明のニッケル−鉄め
っき方法は、めっき液中に設けたアノードとカソードと
の間に電流を流して前記カソードの近傍に配置した被め
っき材料に対してニッケル−鉄合金を電気的にめっきす
るニッケル−鉄めっき方法において、被めっき材料をそ
の表面が前記カソードの表面と一致するように前記カソ
ード上に配置し、前記被めっき材料の近傍に断面がほゞ
三角形で厚さが２０ｍｍ以下でその頂点を半径１０ｍｍ
以上の球状とした１対の攪拌へらを頂点を向い合わせた
状態に設け、前記攪拌へらに２５回／分以上の速度の左
右方向の往復運動を与えることを含むものであり、更
に、１対の攪拌へらの間隔を３０ｍｍ以下としたもので
ある。According to the nickel-iron plating method of the present invention, an electric current is passed between an anode and a cathode provided in a plating solution so that nickel is applied to a material to be plated arranged in the vicinity of the cathode. In a nickel-iron plating method for electroplating an iron alloy, a material to be plated is placed on the cathode so that its surface is coincident with the surface of the cathode, and a cross section is approximately in the vicinity of the material to be plated. Triangular with a thickness of 20 mm or less and a radius of 10 mm at its apex
The above-mentioned pair of spherical stirring spatulas are provided with their vertices facing each other, and the stirring spatula is provided with a reciprocating motion in the left-right direction at a speed of 25 times / min or more. The interval between the stirring spatulaes is 30 mm or less.
【０００７】[0007]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００８】図１は本発明の一実施例を実施するための
めっき装置の一例を示す断面図で、（ａ）は装置全体の
断面図、（ｂ）はＢ部の拡大断面図、（ｃ）は攪拌へら
の拡大断面図である。図２は図１の例において、攪拌へ
らの往復速度を２５回／分とし、電流密度６０ｍＡ／ｃ
ｍ2 で２インチ角の薄膜磁気ヘッド用ウエハ上にめっき
を行った場合のウエハ上のＦｅ組成の分布状態の一例を
示す分布図である。図３は、図１の例において、攪拌へ
らの往復速度を２５回／分から５９回／分とし、電流密
度６０ｍＡ／ｃｍ2 で２インチ角の薄膜磁気ヘッド用ウ
エハ上にめっきを行った場合のウエハ上のＦｅ組成分布
の特性値の一例を示す特性図である。図４は図１の例に
おいて、攪拌へらの往復速度を５９回／分とし、電流密
度６０ｍＡ／ｃｍ2 で２インチ角の薄膜磁気ヘッド用ウ
エハ上にめっきを行った場合のウエハ上のＦｅ組成の分
布状態の一例を示す分布図である。FIG. 1 is a sectional view showing an example of a plating apparatus for carrying out an embodiment of the present invention. (A) is a sectional view of the entire apparatus, (b) is an enlarged sectional view of a portion B, (c) 8A is an enlarged sectional view of a stirring spatula. 2 shows an example of FIG. 1 in which the reciprocating speed of the stirring spatula is 25 times / min and the current density is 60 mA / c.
FIG. 3 is a distribution diagram showing an example of a distribution state of Fe composition on a wafer when plating is performed on a 2 inch square thin film magnetic head wafer with m 2 . 3, in the example of FIG. 1, the reciprocating speed of agitation paddle 25 times / min 59 times / min and, in the case where the plating was performed on the wafer for a thin film magnetic head of the two-inch square at a current density of 60 mA / cm 2 It is a characteristic view which shows an example of the characteristic value of Fe composition distribution on a wafer. 4 in the example of FIG. 1, to the reciprocating speed of the stirring paddle 59 times / min, Fe composition on the wafer in the case of performing plating on the wafer for a thin film magnetic head of the two-inch square at a current density of 60 mA / cm 2 It is a distribution diagram showing an example of the distribution state of.
【０００９】本実施例は、図１に示すように、めっき槽
５の中にアノード３とカソード４とを設け、被めっき材
料７を、その表面がカソード４の表面の一致するように
配置し、被めっき材料７に近接した位置に、断面がほゞ
三角形で厚さが２０ｍｍ以下であり、頂点を半径１０ｍ
ｍ以上の球状とした１対の攪拌へら２をそれらの頂点を
向い合わせた状態に配設し、めっき槽５の中にめっき液
６を充満させ、攪拌へら２を左右方向に往復運動させる
ことによってめっき液６を攪拌しながらアノード３とカ
ソード４との間に電流を流してめっきを行う。In this embodiment, as shown in FIG. 1, an anode 3 and a cathode 4 are provided in a plating tank 5, and a material 7 to be plated is arranged so that the surface of the material 7 is the same as the surface of the cathode 4. , The cross section is approximately triangular, the thickness is 20 mm or less, and the apex is 10 m in radius in the vicinity of the material 7 to be plated.
Arranging a pair of stirring spatulas 2 in the form of spheres of m or more with their vertices facing each other, filling the plating bath 5 with the plating solution 6, and reciprocating the stirring spatulas 2 in the left-right direction. While the plating solution 6 is being stirred, a current is passed between the anode 3 and the cathode 4 to perform plating.
【００１０】上述の方法によって、攪拌へら２の往復運
動の速度を２５回／分とし、電流密度６０ｍＡ／ｃｍ2
で２インチ角のウエハ上にＮｉ−Ｆｅめっきを行った場
合、図２に示すように、ウエハ１０ａ上のＦｅ組成
（％）の分布は、１７．５６％〜１８．５２％であり、
その差は１％以下となる。According to the above method, the reciprocating speed of the stirring spatula 2 was set to 25 times / minute, and the current density was 60 mA / cm 2.
When Ni-Fe plating is performed on a 2-inch square wafer, the distribution of the Fe composition (%) on the wafer 10a is 17.56% to 18.52%, as shown in FIG.
The difference is 1% or less.
【００１１】この本実施例の図２の場合と、従来の方法
による図６の場合とのＦｅ組成の分布の特性値の一つで
ある（σ／ｘの平均値）を比較すると表１のようにな
り、本実施例の場合は、従来の方法に比してＦｅ組成分
布が著しく改善される。A comparison of one of the characteristic values (average value of σ / x) of the Fe composition distribution between the case of FIG. 2 of this embodiment and the case of FIG. 6 according to the conventional method is shown in Table 1. Thus, in the case of this embodiment, the Fe composition distribution is remarkably improved as compared with the conventional method.
【００１２】[0012]
【表１】 [Table 1]
【００１３】図１のめっき槽５を用い、攪拌へら２の往
復速度を２５回／分から５９回／分まで変化させて、電
流密度６０ｍＡ／ｃｍ2 で２インチ角の薄膜磁気ヘッド
用ウエハ上にＮｉ−Ｆｅめっきを行った場合のウエハ上
のＦｅ組成分布の特性値の一つである（σ／ｘの平均
値）特性は、図３に示すように、攪拌へら２の往復速度
が速くなる程特性値が低くなり、５９回／分のときは、
０．７％以下まで改善される。Using the plating tank 5 of FIG. 1, the reciprocating speed of the stirring spatula 2 was changed from 25 times / minute to 59 times / minute, and a current density of 60 mA / cm 2 was applied to a thin film magnetic head wafer of 2 inch square. One of the characteristic values of the Fe composition distribution (average value of σ / x) on the wafer when Ni—Fe plating is performed is that the reciprocating speed of the stirring spatula 2 becomes faster as shown in FIG. The lower the characteristic value, the more 59 times / minute,
It is improved to 0.7% or less.
【００１４】攪拌へら２の往復速度を５９回／分とした
場合は、図４に示すように、ウエハ１０ｂ上のＦｅ組成
分布は、１７．８７％〜１８．２０％であり、その差は
０．４％以下となる。When the reciprocating speed of the stirring spatula 2 is 59 times / minute, the Fe composition distribution on the wafer 10b is 17.87% -18.20% as shown in FIG. It will be 0.4% or less.
【００１５】図１のめっき槽５を用い、４枚のカソード
４上に薄膜磁気ヘッド用ウエハを左右および前後に等間
隔に配設し、攪拌へら２の往復速度を５９回／分とし、
２個の攪拌へら２の間隔を３０ｍｍおよび７０ｍｍとし
てＮｉ−Ｆｅめっきを行った場合の４枚のウエハ間の平
均Ｆｅ組成の差は、表２のようになる。このことから、
攪拌へらの間隔を３０ｍｍ以下とすることによって、均
一なＦｅ組成分布を有する複数のウエハを、同時に製作
することが可能であることが分る。Using the plating tank 5 of FIG. 1, wafers for thin film magnetic heads are arranged on the four cathodes 4 at equal intervals in the left and right and front and back, and the reciprocating speed of the stirring spatula 2 is 59 times / minute.
Table 2 shows the difference in the average Fe composition between the four wafers when Ni-Fe plating was performed with the intervals between the two stirring spatulas 2 being 30 mm and 70 mm. From this,
It can be seen that it is possible to simultaneously manufacture a plurality of wafers having a uniform Fe composition distribution by setting the interval between the stirring spatulaes to 30 mm or less.
【００１６】[0016]
【表２】 [Table 2]
【００１７】[0017]
【発明の効果】以上説明したように、本発明のニッケル
−鉄めっき方法は、１対の攪拌へらを、断面がほゞ三角
形で厚さが２０ｍｍ以下であり、頂点を半径１０ｍｍ以
上の球状とし、それらの頂点を向い合わせた状態として
カソードの近傍にに配設し、２５回／分以上の速度で左
右方向に往復運動させることにより、被めっき材料上の
Ｆｅ組成の分布を均一にすることが可能になるという効
果があり、従って被めっき材料から製作する部品の特性
のばらつきを小さくすることが可能になるという効果が
ある。As described above, according to the nickel-iron plating method of the present invention, the pair of stirring spatulas are formed into a spherical shape having a substantially triangular cross section and a thickness of 20 mm or less and a vertex of 10 mm or more in radius. The distribution of the Fe composition on the material to be plated is made uniform by arranging them in the vicinity of the cathode with their vertices facing each other and reciprocating in the left-right direction at a speed of 25 times / min or more. Therefore, there is an effect that it is possible to reduce variations in the characteristics of parts manufactured from the material to be plated.
【図１】本発明の一実施例を実施するためのめっき装置
の一例を示す断面図で、（ａ）は装置全体の断面図、
（ｂ）はＢ部の拡大断面図、（ｃ）は攪拌へらの拡大断
面図である。FIG. 1 is a sectional view showing an example of a plating apparatus for carrying out an embodiment of the present invention, in which (a) is a sectional view of the entire apparatus,
(B) is an enlarged sectional view of a B part, and (c) is an enlarged sectional view of a stirring spatula.
【図２】図１の例において、攪拌へらの往復速度を２５
回／分とし、電流密度６０ｍＡ／ｃｍ2 で２インチ角の
薄膜磁気ヘッド用ウエハ上にめっきを行った場合のウエ
ハ上のＦｅ組成の分布状態の一例を示す分布図である。[Fig. 2] In the example of Fig. 1, the reciprocating speed of the stirring spatula is set to 25
FIG. 3 is a distribution diagram showing an example of a distribution state of Fe composition on a wafer when plating is performed on a 2-inch square thin film magnetic head wafer at a current density of 60 mA / cm 2 at a rate of rotations / minute.
【図３】図１の例において、攪拌へらの往復速度を２５
回／分から５９回／分とし、電流密度６０ｍＡ／ｃｍ2
で２インチ角の薄膜磁気ヘッド用ウエハ上にめっきを行
った場合のウエハ上のＦｅ組成分布の特性値の一例を示
す特性図である。[Fig. 3] In the example of Fig. 1, the reciprocating speed of the stirring spatula is set to 25
From 60 times / minute to 59 times / minute, current density 60 mA / cm 2
FIG. 3 is a characteristic diagram showing an example of characteristic values of Fe composition distribution on a wafer when plating is performed on a 2-inch square thin film magnetic head wafer.
【図４】図１の例において、攪拌へらの往復速度を５９
回／分とし、電流密度６０ｍＡ／ｃｍ2 で２インチ角の
薄膜磁気ヘッド用ウエハ上にめっきを行った場合のウエ
ハ上のＦｅ組成の分布状態の一例を示す分布図である。FIG. 4 shows a reciprocating speed of a stirring spatula of 59 in the example of FIG.
FIG. 3 is a distribution diagram showing an example of a distribution state of Fe composition on a wafer when plating is performed on a 2-inch square thin film magnetic head wafer at a current density of 60 mA / cm 2 at a rate of rotations / minute.
【図５】従来のニッケル−鉄めっき方法を実施するため
のめっき装置の一例を示す断面図で、（ａ）は装置全体
の断面図、（ｂ）はＣ−Ｃ線断面図である。FIG. 5 is a sectional view showing an example of a plating apparatus for carrying out a conventional nickel-iron plating method, (a) is a sectional view of the entire apparatus, and (b) is a sectional view taken along line C-C.
【図６】図５の例において、攪拌へらの往復速度を２５
回／分とし、電流密度６０ｍＡ／ｃｍ2 で２インチ角の
薄膜磁気ヘッド用ウエハ上にめっきを行った場合のウエ
ハ上のＦｅ組成の分布状態の一例を示す分布図である。6] In the example of FIG. 5, the reciprocating speed of the stirring spatula is set to 25.
FIG. 3 is a distribution diagram showing an example of a distribution state of Fe composition on a wafer when plating is performed on a 2-inch square thin film magnetic head wafer at a current density of 60 mA / cm 2 at a rate of rotations / minute.
２・１２ 攪拌へら ３・１３ アノード ４・１４ カソード ５・１５ めっき槽 ６・１６ めっき液 ７・１７ 被めっき材料 １０ａ・１０ｂ・１０ｃ ウエハ 2 ・ 12 Stirred spatula 3 ・ 13 Anode 4 ・ 14 Cathode 5 ・ 15 Plating tank 6 ・ 16 Plating solution 7 ・ 17 Plated material 10a ・ 10b ・ 10c Wafer
Claims (2)
との間に電流を流して前記カソードの近傍に配置した被
めっき材料に対してニッケル−鉄合金を電気的にめっき
するニッケル−鉄めっき方法において、被めっき材料を
その表面が前記カソードの表面と一致するように前記カ
ソード上に配置し、前記被めっき材料の近傍に断面がほ
ゞ三角形で厚さが２０ｍｍ以下でその頂点を半径１０ｍ
ｍ以上の球状とした１対の攪拌へらを頂点を向い合わせ
た状態に設け、前記攪拌へらに２５回／分以上の速度の
左右方向の往復運動を与えることを含むことを特徴とす
るニッケル−鉄めっき方法。1. A nickel-iron plating method in which a current is passed between an anode and a cathode provided in a plating solution to electrically plate a material to be plated arranged near the cathode with a nickel-iron alloy. In, the material to be plated is arranged on the cathode so that the surface thereof coincides with the surface of the cathode, and the section near the material to be plated has a substantially triangular shape and the thickness is 20 mm or less and the apex thereof has a radius of 10 m.
Nickel characterized in that a pair of spherical stirring spatulaes having a diameter of m or more are provided with their apexes facing each other, and the stirring spatula is subjected to a reciprocating motion in the left-right direction at a speed of 25 times / min or more. Iron plating method.
したことを特徴とする請求項１記載のニッケル−鉄めっ
き方法。2. The nickel-iron plating method according to claim 1, wherein the distance between the pair of stirring spatulas is 30 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30840292A JPH06158383A (en) | 1992-11-18 | 1992-11-18 | Nickel-iron plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30840292A JPH06158383A (en) | 1992-11-18 | 1992-11-18 | Nickel-iron plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06158383A true JPH06158383A (en) | 1994-06-07 |
Family
ID=17980634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30840292A Pending JPH06158383A (en) | 1992-11-18 | 1992-11-18 | Nickel-iron plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06158383A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007270313A (en) * | 2006-03-31 | 2007-10-18 | Furukawa Electric Co Ltd:The | Electroplating apparatus |
-
1992
- 1992-11-18 JP JP30840292A patent/JPH06158383A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007270313A (en) * | 2006-03-31 | 2007-10-18 | Furukawa Electric Co Ltd:The | Electroplating apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100359485B1 (en) | THE APPARATUS and METHOD FOR MANUFACTURING Ni-Fe ALLOY THIN FOIL | |
| KR101403891B1 (en) | Permalloy, electroforming apparatus and method of the permalloy, manufacturing apparatus and method of the permalloy | |
| JPS59100283A (en) | Metal products and manufacture | |
| JP5342976B2 (en) | Granules and method for producing the same | |
| TWI299509B (en) | Method and apparatus for avoilding particle accumulation in electrodeposition | |
| US4120758A (en) | Production of powder metallurgy alloys | |
| JPH06158383A (en) | Nickel-iron plating method | |
| US4046643A (en) | Production of multi-metal particles for powder metallurgy alloys | |
| Vasuoevan et al. | Effect of ultrasonic agitation during electroplating of nickel and copper at room temperature | |
| JP2003510465A (en) | Electrodeposition method of metal multilayer | |
| JPH0754189A (en) | Electroplating device | |
| EP0012326B1 (en) | A method of electroplating nickel-iron alloys | |
| JP3767850B2 (en) | Method for producing metal powder | |
| JPS6333988B2 (en) | ||
| JP2003268599A (en) | Method and equipment for electroplating | |
| JPH0441698A (en) | Method and device for electroplating and jig utilize therefor | |
| JPS61265276A (en) | Diamond sheet for cutting and polishing and its manufacturin method | |
| JP2002302787A (en) | Method of producing special-shaped electric nickel for plating | |
| Colner et al. | Electroplating on titanium | |
| JPH11100698A (en) | Plating apparatus | |
| JP3275502B2 (en) | Method for manufacturing small objects by plating | |
| JP2736690B2 (en) | Manufacturing method of electrodeposited whetstone | |
| CN110424034A (en) | A kind of irregular ceramic grain surface method for metallising | |
| JP3745748B2 (en) | Manufacturing method of mold by electroforming | |
| JP3797425B2 (en) | Plating method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20010327 |