JPH0615405A - Molding method - Google Patents
Molding methodInfo
- Publication number
- JPH0615405A JPH0615405A JP20034492A JP20034492A JPH0615405A JP H0615405 A JPH0615405 A JP H0615405A JP 20034492 A JP20034492 A JP 20034492A JP 20034492 A JP20034492 A JP 20034492A JP H0615405 A JPH0615405 A JP H0615405A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- electrolyte
- added
- molding method
- solidifying agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mold Materials And Core Materials (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、精密鋳造法などに用い
られる鋳型、湯口、および湯道等の鋳型造型法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of molding a mold, a sprue, a runner, etc. used for precision casting.
【0002】[0002]
【従来の技術】従来、精密鋳造法などに用いられる鋳
型、湯口、および湯道等は、シリカゾルなどの水性系、
またはエチルシリケートなどの揮発性有機系のバインダ
と、ジルコン、溶融シリカ、珪砂等の耐火物からなるフ
ィラーを配合したスラリとスタッコを交互にコーティン
グする方法、または型に流し込むか、或いは詰め込んで
固める方法などにより造型される。本発明が対象とす
る、流し込みによる方法は、予めアンモニアガス、ポリ
イソシアネートなどの固化剤をエチルシリケートをバイ
ンダとするスラリ中に添加して型に流し込み、固化した
後に抜型し、その後乾燥させ鋳型を得るか、或いは乾燥
後焼成して造型している。2. Description of the Related Art Conventionally, molds, sprues, runners and the like used in precision casting methods are based on an aqueous system such as silica sol,
Or a method of alternately coating a slurry and stucco containing a volatile organic binder such as ethyl silicate and a filler made of a refractory such as zircon, fused silica, and silica sand, or a method of pouring or packing into a mold and hardening. It is modeled by. The method by pouring, which is the object of the present invention, is a method in which a solidifying agent such as ammonia gas or polyisocyanate is added to a slurry having ethyl silicate as a binder in advance and poured into a mold, and after solidification, the mold is removed and then the mold is dried to form a mold. It is obtained or dried and then fired to form a model.
【0003】[0003]
【発明が解決しようとする課題】上記の造型法のうち、
エチルシリケートをバインダとする流し込み造型方法
は、鋳型の強度が弱く取り扱いの際注意を要する欠点が
あった。その上、粘結剤および固化剤はおもに引火性或
いは毒性を有する物質であり、材料管理、作業環境等に
問題があった。本発明は、取り扱いに支障が無い強度を
有し、かつ有毒性の無い鋳型を製作することを目的とす
る。Of the above molding methods,
The casting molding method using ethyl silicate as a binder has a drawback that the strength of the mold is weak and caution is required during handling. In addition, the binder and the solidifying agent are mainly flammable or toxic substances, which causes problems in material management, working environment and the like. An object of the present invention is to manufacture a mold which has strength that does not hinder handling and is not toxic.
【0004】[0004]
【課題を解決するための手段】本発明のうちの第1発明
は、水性シリカゾルをバインダとした耐火物スラリに、
固化剤を添加、混練した後、型に流し込み固化させ、次
いで抜型する鋳型造型法において、前記固化剤の電離度
が0.5 以上の電解質の水溶液であることを特徴とする鋳
型造型法であり、第2発明は、電解質の水溶液にカチオ
ン系高分子物質を添加する第1発明に記載の鋳型造型法
であり、第3発明はカチオン系高分子物質がポリアクリ
ルアミド、ポリビニルアルコールのうちの1種または2
種以上が0.1 〜0.5 wt%である第2発明に記載の鋳型造
型法である。A first aspect of the present invention provides a refractory slurry containing an aqueous silica sol as a binder,
In a mold making method in which a solidifying agent is added, kneaded, poured into a mold to solidify, and then removed from the mold, a mold making method characterized in that the solidifying agent is an aqueous solution of an electrolyte having an ionization degree of 0.5 or more. 2nd invention is the mold making method as described in 1st invention which adds a cationic high molecular substance to the aqueous solution of electrolyte, 3rd invention WHEREIN: 1 type or 2 of a cationic high molecular substance is polyacrylamide and polyvinyl alcohol.
The molding method according to the second aspect of the present invention, wherein the seeds are 0.1 to 0.5 wt%.
【0005】[0005]
【作用】本発明の鋳型造型法は水性シリカゾルをバイン
ダとし、ジルコン、溶融シリカ、珪砂等の耐火物を混合
して製作した耐火物スラリに高電離度を有する電解質の
水溶液を添加する方法である。水性シリカゾルは水中に
おいてシリカ粒子がコロイド状に分散したものであり、
シリカ粒子はその周りを取り囲む水酸基とナトリウムイ
オンによる電気二重層による互いの静電的斥力によりそ
の凝集が阻害され、安定化している。そこで、電解質の
水溶液を添加すると、その電離したイオンによりシリカ
粒子の電気二重層が破壊され、シリカ粒子の凝集が起こ
る。このため、耐火物スラリはゲル化する。従って、電
解質の水溶液を添加してからそのゲル化が始まる迄に型
に流し込むことにより、成形固化した鋳型が得られる。
しかも、この結合はシラノール基によるシロキサン結合
のため、型強度はエチルシリケートなどのバインダとし
たものより強い。The mold molding method of the present invention is a method in which an aqueous solution of an electrolyte having a high ionization degree is added to a refractory slurry produced by mixing refractory materials such as zircon, fused silica and silica sand with aqueous silica sol as a binder. . Aqueous silica sol is a colloidal dispersion of silica particles in water,
The silica particles are stabilized by their cohesion being hindered by the mutual electrostatic repulsion of the electric double layer by the hydroxyl group and the sodium ion surrounding them. Then, when an aqueous solution of the electrolyte is added, the ionized ions destroy the electric double layer of the silica particles, and the silica particles aggregate. Therefore, the refractory slurry gels. Therefore, a solidified mold can be obtained by adding the aqueous solution of the electrolyte and then pouring it into the mold before the gelation thereof starts.
Moreover, since this bond is a siloxane bond due to a silanol group, the mold strength is stronger than that of a binder such as ethyl silicate.
【0006】しかしながら、電解質水溶液は即効性が高
いため大型の鋳型を造型する場合には固化速度にムラが
出易い。そこで固化速度を抑制する目的でポリアクリル
酸エステル、ポリアクリルアミド、ポリビニルアルコー
ルのカチオン系高分子物質を必要に応じて単独または複
合添加すれば即効性を緩和させることによりムラなく固
化できる。電解質水溶液は、電離したイオンがシリカ粒
子に直接作用して固化させるために最低0.5 の電離度が
必要である。また、カチオン系高分子物質は、シリカ粒
子に比較し大きいため直接シリカ粒子に作用せず、電離
イオンによりある程度凝集固化した粒子に作用するの
で、即効性を緩和させるためには最低0.1wt%必要であ
るが、0.5 wt%を越えると固化速度を著しく遅らせるだ
けでなく、型強度が低下するため上限を0.5 wt%に限定
する。なお、この他、強電解質としては、硝酸ナトリウ
ム、酢酸ナトリウム、硫酸カリウム、硫酸ナトリウム、
塩酸バリウム等、カチオン系高分子物質としては、ポリ
アミノアルキルメタアクリレート、ポリビニルイミダゾ
リン、ポリエチレンイミドに同等の作用がある。However, since the aqueous electrolyte solution has a high immediate effect, the solidification rate tends to be uneven when a large mold is formed. Therefore, if a cationic polymer substance such as polyacrylic acid ester, polyacrylamide, or polyvinyl alcohol is added individually or in combination for the purpose of suppressing the solidification rate, the immediate effect is moderated and the solidification can be performed uniformly. The electrolyte solution must have an ionization degree of at least 0.5 in order for the ionized ions to act directly on the silica particles and solidify. In addition, since the cationic polymer substance is larger than silica particles, it does not act directly on silica particles, but acts on particles that have been aggregated and solidified to some extent by ionizing ions, so a minimum of 0.1 wt% is required to mitigate immediate effects. However, if it exceeds 0.5 wt%, not only the solidification rate is significantly delayed, but also the mold strength decreases, so the upper limit is limited to 0.5 wt%. In addition, as the strong electrolyte, sodium nitrate, sodium acetate, potassium sulfate, sodium sulfate,
As a cationic polymer substance such as barium hydrochloride, polyaminoalkyl methacrylate, polyvinyl imidazoline, and polyethylene imide have the same action.
【0007】[0007]
(実施例1)本発明の鋳型として、水性シリカゾル(シ
リカ濃度30wt%)2 kgに対し、ジルコン系粉末(200 me
sh以下)5 kg、アルミナ系砂(平均粒径が1 mm程度)5
kg、4N塩化ナトリウム水溶液0.2 kgを添加し、混練し
た後、型に流し込み固化した。次いで抜型、乾燥、焼成
した鋳型を得た。なお塩化ナトリウム水溶液の電離度を
測定した結果は0.87であった。比較鋳型として、従来法
であるエチルシリケート2 kgに対し、ジルコン系粉末
(200 mesh以下)2.5 kg、アルミナ系砂(平均粒径が1
mm程度)2.5 kgからなるスラリにアンモニア系硬化剤を
12g 添加した後、型に流し込み固化した。流し込みによ
る固化型は10ヶであったが、このうち3ヶは抜型時に
ヒビが発生した。本発明鋳型および比較鋳型は、いずれ
も同一寸法でそれぞれ10ヶずつ用意した。JIS SNCM4
39相当の溶鋼を上記20ヶの鋳型に鋳造した結果、本発
明鋳型はいずれも良好であったが、従来法による鋳型に
は鋳造時に2ヶヒビ割れが発生した。(Example 1) As a template of the present invention, zircon powder (200 me) was added to 2 kg of aqueous silica sol (silica concentration 30 wt%).
sh or less) 5 kg, alumina sand (average particle size is about 1 mm) 5
After adding 0.2 kg of 4N sodium chloride aqueous solution and kneading, the mixture was poured into a mold and solidified. Then, a mold which was die-cut, dried and fired was obtained. The result of measuring the ionization degree of the sodium chloride aqueous solution was 0.87. As a comparison template, 2.5 kg of zircon-based powder (200 mesh or less) and alumina-based sand (average particle size 1
Ammonia type hardener is added to 2.5 kg slurry.
After adding 12 g, it was poured into a mold and solidified. The number of solidified molds by pouring was 10, but cracks occurred in 3 of these molds at the time of mold release. 10 molds of the present invention and 10 molds of the comparative mold were prepared. JIS SNCM4
As a result of casting molten steel corresponding to 39 into the above 20 molds, all of the molds of the present invention were good, but the conventional mold had 2 cracks during casting.
【0008】(実施例2)水性シリカゾル(シリカ濃度
30wt%)2 kgに対し、溶融シリカ系粉末(200 mesh以
下)2.4 kg、溶融シリカ系砂(平均粒径が1 mm程度)2.
4 kg、4N塩化カリウム0.16kg(電離度0.75)ポリアク
リルアミド粉末2gを添加し混練型に流し固化、抜型後、
乾燥、焼成した鋳型にS45Cの炭素鋼の溶湯を鋳造した。
なお、鋳型の欠損や鋳造時の鋳型ヒビ割れは無く良好で
あった。(Example 2) Aqueous silica sol (silica concentration
30 wt%) 2 kg, fused silica powder (200 mesh or less) 2.4 kg, fused silica sand (average particle size is about 1 mm) 2.
4 kg, 4N potassium chloride 0.16 kg (ionization degree 0.75) 2 g of polyacrylamide powder was added, poured into a kneading mold, solidified, removed from the mold,
Molten S45C carbon steel was cast into a mold that was dried and fired.
There were no defects in the mold or cracks in the mold during casting, which were good.
【0009】(実施例3)水性シリカゾル(シリカ濃度
30wt%)2 kgに対し、ジルコン系粉末(200 mesh以下)
5 kg、アルミナ系砂(平均粒径が1 mm程度)5 kgとし、
4N硝酸ナトリウム水溶液(電離度0.65)0.2 kgに表1
に示すカチオン系高分子物質を添加して混練型に流し固
化、抜型、乾燥、焼成して鋳型を得た。得られた鋳型に
S45Cの炭素鋼の溶湯を鋳造した結果いずれも鋳型の欠損
や鋳造時の鋳型ヒビ割れは発生せず良好であった。(Example 3) Aqueous silica sol (silica concentration
30 wt%) 2 kg, zircon powder (200 mesh or less)
5 kg, alumina sand (average particle size is about 1 mm) 5 kg,
4 N sodium nitrate aqueous solution (ionization degree 0.65) 0.2 kg in Table 1
The cationic polymer substance shown in (1) was added, and the mixture was poured into a kneading mold, solidified, punched, dried, and baked to obtain a mold. In the obtained mold
As a result of casting the molten S45C carbon steel, there were no defects in the mold and no cracking of the mold during casting, which was good.
【0010】[0010]
【表1】 [Table 1]
【0011】[0011]
【発明の効果】本発明は、粘結剤、固化剤等に有害な物
質を使用せず、取り扱い上問題とならない充分な強度を
有する鋳型造型が可能となり、保管、使用上問題となる
有害物質の管理が不用となった。INDUSTRIAL APPLICABILITY The present invention makes it possible to mold a mold having sufficient strength without causing a problem in handling without using a harmful substance as a binder, a solidifying agent, etc., and a harmful substance causing a problem in storage and use. Management is no longer needed.
【図1】本発明の一実施例を示す鋳型造型法の説明図で
ある。FIG. 1 is an explanatory view of a mold making method showing an embodiment of the present invention.
【図2】本発明の鋳型、および湯口カップを組み合わせ
た鋳型の完成図である。FIG. 2 is a completed drawing of a mold in which the mold of the present invention and a sprue cup are combined.
1 鋳型,2 母型(めす型),3 母型(おす型),
4 湯口カップ1 mold, 2 master (male mold), 3 master (male mold),
4 spout cups
Claims (3)
スラリに固化剤を添加、混練した後、型に流し込み固化
させ、次いで抜型する鋳型造型法において、前記固化剤
の電離度が0.5 以上の電解質の水溶液であることを特徴
とする鋳型造型法。1. A mold molding method in which a solidifying agent is added to a refractory slurry using an aqueous silica sol as a binder, kneaded, poured into a mold to solidify, and then die-cutting, in which the solidifying agent has an ionization degree of 0.5 or more. A mold making method characterized by being an aqueous solution.
を添加する請求項1に記載の鋳型造型法。2. The mold making method according to claim 1, wherein the cationic polymer substance is added to the aqueous solution of the electrolyte.
エステル、ポリアクリルアミド、ポリビニルアルコール
のうちの1種または2種以上が0.1 〜0.5 wt%である請
求項2に記載の鋳型造型法。3. The template molding method according to claim 2, wherein the cationic polymer substance is 0.1 to 0.5 wt% of one or more of polyacrylic acid ester, polyacrylamide and polyvinyl alcohol.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20034492A JPH0615405A (en) | 1992-07-03 | 1992-07-03 | Molding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20034492A JPH0615405A (en) | 1992-07-03 | 1992-07-03 | Molding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0615405A true JPH0615405A (en) | 1994-01-25 |
Family
ID=16422732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20034492A Pending JPH0615405A (en) | 1992-07-03 | 1992-07-03 | Molding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0615405A (en) |
-
1992
- 1992-07-03 JP JP20034492A patent/JPH0615405A/en active Pending
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