JPH06152100A - Liquid photoresist used for manufacture of printed wiring board - Google Patents
Liquid photoresist used for manufacture of printed wiring boardInfo
- Publication number
- JPH06152100A JPH06152100A JP3298305A JP29830591A JPH06152100A JP H06152100 A JPH06152100 A JP H06152100A JP 3298305 A JP3298305 A JP 3298305A JP 29830591 A JP29830591 A JP 29830591A JP H06152100 A JPH06152100 A JP H06152100A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- liquid photoresist
- manufacture
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント配線板の製造に
使用する液体フォトレジストに関する。FIELD OF THE INVENTION This invention relates to liquid photoresists used in the manufacture of printed wiring boards.
【０００２】[0002]
【従来の技術】一般に電子機器は小型，軽量，高密度
化，高精度化が要求されており、また半導体素子の高集
積化に伴って表面実装型パッケージまたは多ピン型へと
移行しているのが現状である。2. Description of the Related Art Generally, electronic devices are required to be small, lightweight, high-density, and highly accurate. Further, with the high integration of semiconductor elements, they are shifting to surface-mount packages or multi-pin packages. is the current situation.
【０００３】前記従来一般の電子機器を搭載し、接続す
るプリント配線板に対しても当然ながら同様に高密度
化，高性能化の要求が高まっており、前記プリント配線
板の回路線幅および線間は１００μｍ以下のファインパ
ターン化へと推移している。Needless to say, higher density and higher performance are similarly demanded for printed wiring boards on which the above-mentioned conventional general electronic equipment is mounted and connected, and the circuit line width and the line of the printed wiring board are increased. In the meantime, the trend is toward finer patterns of 100 μm or less.
【０００４】また、前記プリント配線板のファインパタ
ーン化に対応するプリント配線板の製造工程におけるレ
ジスト材料によるパターン形成は、写真法によるドライ
フィルムフォトレジストおよび液体フォトレジストによ
る方向へと展開している。Further, pattern formation by a resist material in a manufacturing process of a printed wiring board corresponding to the fine patterning of the printed wiring board is developed in the direction of a dry film photoresist and a liquid photoresist by a photographic method.
【０００５】しかして、前記液体フォトレジストの組成
は約５０％以上を占めるメチルメタアクリレートを主成
分とする各種メタアクリル酸の共重合体（アルカリ現像
型はポリマー中にカルボキシル基を含有）と、光開始剤
として３０％以上を占めるトリメチロールプロパントリ
アクリレート、ポリエチレングリコールジ（メタ）アク
リレート等の光重合性の多官能モノマーの２種類以上を
混合し、さらにその他の成分として増減剤，熱重合禁止
剤，密着付与剤，可塑剤，染料等が添加剤として混合さ
れた液体フォトレジストが使用されている。尚、プリン
ト配線板の製造方法における前記液体フォトレジストの
塗布方法としては、浸漬，ロールコート，スピンコー
ト，スプレー，カーテンコート等の方法が採用されてい
る。Therefore, the composition of the liquid photoresist is a copolymer of various methacrylic acids whose main component is methyl methacrylate (acryl developing type contains a carboxyl group in the polymer) which accounts for about 50% or more. Mixing two or more kinds of photopolymerizable polyfunctional monomers such as trimethylolpropane triacrylate and polyethylene glycol di (meth) acrylate, which account for 30% or more as a photoinitiator, and further as a further component, an increase / decrease agent and a thermal polymerization inhibition Liquid photoresists in which agents, adhesion promoters, plasticizers, dyes, etc. are mixed as additives are used. As a method for applying the liquid photoresist in the method for manufacturing a printed wiring board, methods such as dipping, roll coating, spin coating, spraying and curtain coating are adopted.
【０００６】また、前記液体フォトレジストを使用する
パターン形成工程は、プリント基板の銅箔（銅張積層板
の銅箔）上に前記液体フォトレジストを塗布した後、所
要のプリント配線回路に対応する回路パターンの露光現
像工程により形成される。The pattern forming process using the liquid photoresist corresponds to a required printed wiring circuit after applying the liquid photoresist on a copper foil (a copper foil of a copper clad laminate) of a printed circuit board. It is formed by the exposure and development process of the circuit pattern.
【０００７】[0007]
【発明が解決しようとする課題】しかるに、前記プリン
ト配線板の製造方法における画像形成の工程として実施
されるプリント基板上に液体フォトレジストによるパタ
ーン形成において、画像認識検査が人為手段および機械
的な手段によっても困難である欠点を有する。However, in pattern formation by a liquid photoresist on a printed circuit board which is carried out as an image forming step in the method for manufacturing a printed wiring board, the image recognition inspection involves an artificial means and a mechanical means. It also has the drawback of being difficult.
【０００８】すなわち、前記液体フォトレジストによる
塗膜を回路パターンにて露光現像したパターンは、前記
プリント基板上に塗布された塗膜が紫外線エネルギーに
よって露光された時点で、若干未露光部分との色差が生
じ、人為的に目視によって、どうにか識別出来るように
配慮されているが、前述したように、形成しようとする
プリント配線回路が細線化並びに高密集化されると、こ
れに伴って、前記液体フォトレジストにより形成される
パターンにおいても識別が困難となっている。That is, the pattern formed by exposing and developing the coating film of the liquid photoresist with a circuit pattern has a slight color difference from the unexposed portion when the coating film coated on the printed circuit board is exposed to ultraviolet energy. However, as described above, when the printed wiring circuit to be formed is made thin and highly dense, the liquid is accompanied by the above-mentioned liquid. It is difficult to identify even the pattern formed by the photoresist.
【０００９】また、現像後は露光部のみが残るのである
が、液体フォトレジストの感度、解像度の関係で、塗膜
自体が透明性であり、形成後のパターンを認識検査する
ことが、人為的にも機械センサーによっても困難であ
る。Although only the exposed portion remains after development, the coating film itself is transparent due to the sensitivity and resolution of the liquid photoresist, and it is artificial that the pattern after formation is visually inspected. Also difficult with mechanical sensors.
【００１０】従って、露光完了時点および現像後のパタ
ーン（画像）識別が困難で、検査工程でのロスが多く、
特に現像後の識別を適確に行なうことが出来ないと不良
品の製造を余儀なくされる問題点を有するものである。Therefore, it is difficult to identify the pattern (image) at the time of completion of exposure and after development, and there are many losses in the inspection process.
In particular, there is a problem in that defective products must be manufactured unless the identification can be performed properly after development.
【００１１】因て、本発明は、前記従来のプリント配線
板の製造方法における液体フォトレジストによる画像形
成工程上の欠点に鑑みて開発されたもので、露光完了時
および現像後のパターンを人為的並びに機械センサー等
により識別し得る液体フォトレジストの提供を目的とす
るものである。Therefore, the present invention was developed in view of the drawbacks in the image forming process using a liquid photoresist in the conventional method for manufacturing a printed wiring board described above. Another object is to provide a liquid photoresist that can be identified by a mechanical sensor or the like.
【００１２】[0012]
【課題を解決するための手段】本発明のプリント配線板
の製造に使用する液体フォトレジストは、液体フォトレ
ジストの主成分に、蛍光性物質を添加して成るものであ
る。The liquid photoresist used in the production of the printed wiring board of the present invention is obtained by adding a fluorescent substance to the main component of the liquid photoresist.
【００１３】[0013]
【作用】本発明液体フォトレジストを使用してのパター
ン形成に当たっては、蛍光物質を含有する液体フォトレ
ジストを使用することにより、露光完了時および現像後
において、パターンに光を与えることにより、これを鮮
明に浮き出すことができ、目視による人為作業並びにセ
ンサー等による機械的なパターン識別並びに検査を適確
に遂行し得るものである。In forming a pattern using the liquid photoresist of the present invention, by using a liquid photoresist containing a fluorescent substance, light is applied to the pattern at the time of completion of exposure and after development, so that this can be achieved. It is possible to clearly stand out, and it is possible to appropriately perform human-made work visually and mechanical pattern identification and inspection by a sensor or the like.
【００１４】[0014]
【実施例】以下、本発明液体フォトレジストを使用して
のプリント配線板の製造方法の実施例を具体的に説明す
る。まず、プリント基板（銅張積層板）に片面プリント
配線板あるいは両面プリント配線板の製造工程に必要な
穴あけ加工等の加工を施すとともにプリント基板の銅箔
上に光硬化タイプの液体フォトレジストを所要の方法、
例えばカーテンコート，ロールコート等の従来公知の方
法により塗布する。EXAMPLES Examples of a method for manufacturing a printed wiring board using the liquid photoresist of the present invention will be specifically described below. First, the printed circuit board (copper-clad laminate) is subjected to processing such as drilling necessary for the manufacturing process of a single-sided printed wiring board or double-sided printed wiring board, and a photocurable liquid photoresist is required on the copper foil of the printed circuit board. the method of,
For example, it is applied by a conventionally known method such as curtain coating or roll coating.
【００１５】しかる後、製造しようとするプリント配線
板のプリント配線回路のパターンに対応するパターンに
て露光現像してパターン形成工程を行なった後、エッチ
ング工程を経て、前記プリント基板に必要なプリント配
線回路を形成する。尚、前記パターン形成工程並びにエ
ッチング工程においては、前述以外の従来公知の工程に
必要な工程を施して製造することは言うまでもない。Thereafter, a pattern forming step is performed by exposing and developing with a pattern corresponding to the pattern of the printed wiring circuit of the printed wiring board to be manufactured, and then, through the etching step, the printed wiring necessary for the printed circuit board is obtained. Form a circuit. Needless to say, in the pattern forming step and the etching step, the steps necessary for the conventionally known steps other than those described above are performed for manufacturing.
【００１６】しかして、前記プリント配線板の製造方法
において画像形成に使用する液体フォトレジストの配合
例について以下に具体例を挙げる。 配合例 １ 主成分 ポリエステルアクリレート ２５〜３５重量％ アクリル系モノマー 7.５〜１０重量％ 光開始剤 トリメチロールプロパンアクリレート ５〜７重量％ 溶剤 セロソルブアセテート ３６〜４０重量％ 充填剤 ２6.５〜８重量％ 蛍光性染料 （Ｅｏｓｉｎｅ・黄） ５〜１５重量％ 配合例 ２ 主成分 ポリエステルアクリレート ２５〜３５重量％ アクリル系モノマー 7.５〜１０重量％ 光開始剤 トリメチロールプロパンアクリレート ５〜７重量％ 溶剤 セロソルブアセテート ３６〜４０重量％ 充填剤 ２6.５〜８重量％ 蛍光性染料（Ｅｏｓｉｎｅ・黄） ５〜１５重量％ 顔料 （ＬｕｍｏｇｅｎＬ．Ｙｒｌｌｏｗ） ５〜１５重量％Specific examples of the liquid photoresist used for image formation in the method for producing a printed wiring board will be described below. Formulation example 1 Main component Polyester acrylate 25-35 wt% Acrylic monomer 7.5-10 wt% Photoinitiator Trimethylolpropane acrylate 5-7 wt% Solvent Cellosolve acetate 36-40 wt% Filler 26.5-8 wt% % Fluorescent dye (Eosine / Yellow) 5 to 15% by weight Formulation example 2 Main component Polyester acrylate 25 to 35% by weight Acrylic monomer 7.5 to 10% by weight Photoinitiator Trimethylolpropane acrylate 5 to 7% by weight Solvent Cellosolve Acetate 36-40% by weight Filler 26.5-8% by weight Fluorescent dye (Eosine / yellow) 5-15% by weight Pigment (Lumogen L. Yrlow) 5-15% by weight
【００１７】尚、上記配合例１および２の蛍光性染料と
してのＥｏｓｉｎｅ・黄に換えて、ＰｙｒｏｎｉｎｅＧ
・黄，Ｆｌｕｏｒｅｓｃｅｉｎｅ・緑等の背蛍光性染料
を添加することが可能であるとともに、配合例２の顔料
としてのＬｕｍｏｇｅｎＬ．Ｙｅｌｌｏｗに換えてＬｕ
ｍｏｇｅｎ Ｂｒｉｌｌｉａｎｔ Ｙｅｌｌｏｗ等の顔
料を添加することにより配合することも可能である。It should be noted that instead of Eosine / yellow as the fluorescent dye in the above-mentioned formulation examples 1 and 2, PyroneG
-Back fluorescent dyes such as yellow, Fluorescein-green, etc. can be added, and Lumogen L. Lu instead of Yellow
It is also possible to mix by adding a pigment such as Mogen Brilliant Yellow.
【００１８】また、配合例１および２における主成分、
光開始剤、溶剤および充填剤についても従来公知のもの
に換えた配合による実施が可能であることは勿論であ
る。因て、前記配合例から成る液体フォトレジストを使
用した前記パターン形成により蛍光性を有する画像を形
成することができる。そして、液体フォトレジストによ
る画像形成工程における露光完了時点は勿論現像後のパ
ターンの認識，検査に当たっては、パターンに対して光
を照射することによりパターンを浮き出すことができる
ので、目視あるいはＣＣＤセンサー等による検査装置の
認識検査が容易かつ適確に実施できる。Further, the main components in Formulation Examples 1 and 2,
It goes without saying that the photoinitiator, the solvent and the filler can also be blended by replacing the known ones. Therefore, an image having fluorescence can be formed by the pattern formation using the liquid photoresist of the above formulation example. In addition, when recognizing and inspecting the pattern after development in the image formation process using the liquid photoresist, it is possible to raise the pattern by irradiating the pattern with light. The recognition inspection of the inspection device by can be performed easily and accurately.
【００１９】[0019]
【発明の効果】本発明液体フォトレジストを使用しての
プリント配線板の製造方法によれば、画像形成工程にお
ける中間検査工程で目視による識別が容易になり、生産
性が上がり、かつ検査ミスの削減に大きく寄与すること
ができる。また、機器検査によるＣＣＤセンサーの読み
取りの精度も上がり、誤動作による識別ミス等をなくす
ことができ、検査効率を向上することができる。According to the method for manufacturing a printed wiring board using the liquid photoresist of the present invention, the visual identification can be easily performed in the intermediate inspection step in the image forming step, the productivity is improved, and the inspection error can be prevented. It can greatly contribute to the reduction. In addition, the accuracy of reading the CCD sensor by the device inspection is improved, and identification errors due to malfunctions can be eliminated, and the inspection efficiency can be improved.
Claims (6)
物質を添加して成るプリント配線板の製造に使用する液
体フォトレジスト。1. A liquid photoresist for use in manufacturing a printed wiring board, which comprises a fluorescent substance added to the main component of the liquid photoresist.
およびアクリル系モノマーから成る請求項１記載のプリ
ント配線板の製造に使用する液体フォトレジスト。2. The liquid photoresist used in the manufacture of a printed wiring board according to claim 1, wherein the main components are polyester acrylate and an acrylic monomer.
て成る請求項１記載のプリント配線板の製造に使用する
液体フォトレジスト。3. The liquid photoresist used in the manufacture of a printed wiring board according to claim 1, wherein the fluorescent substance is added in an amount of 5 to 15% by weight.
ＰｙｒｏｎｉｎｅＧ（黄），Ｆｌｕｏｒｅｓｃｅｉｎｅ
（緑）等の蛍光性染料から成る請求項１記載のプリント
配線板の製造に使用する液体フォトレジスト。4. The fluorescent substance is Eosine (yellow),
Pyronine G (yellow), Fluoresceine
The liquid photoresist used in the manufacture of a printed wiring board according to claim 1, which is composed of a fluorescent dye such as (green).
Ｙｅｌｌｏｗ，Ｌｕｍｏｇｅｎ Ｂｒｉｌｌａｎｔ Ｙ
ｅｌｌｏｗ等の蛍光性顔料から成る請求項１記載のプリ
ント配線板の製造に使用する液体フォトレジスト。5. The fluorescent material is Lumogen L,
Yellow, Lumogen Brilliant Y
The liquid photoresist used in the manufacture of a printed wiring board according to claim 1, which comprises a fluorescent pigment such as Ellow.
以外に光開始剤、溶剤および充填剤などの添加剤を添加
して成る請求項１記載のプリント配線板の製造に使用す
る液体フォトレジスト。6. The liquid photoresist for use in manufacturing a printed wiring board according to claim 1, wherein the liquid photoresist is formed by adding additives such as a photoinitiator, a solvent and a filler in addition to the main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3298305A JPH06152100A (en) | 1991-09-04 | 1991-10-17 | Liquid photoresist used for manufacture of printed wiring board |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25297791A JP3010395B2 (en) | 1991-09-04 | 1991-09-04 | Manufacturing method of printed wiring board |
| JP3298305A JPH06152100A (en) | 1991-09-04 | 1991-10-17 | Liquid photoresist used for manufacture of printed wiring board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25297791A Division JP3010395B2 (en) | 1991-09-04 | 1991-09-04 | Manufacturing method of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06152100A true JPH06152100A (en) | 1994-05-31 |
Family
ID=26540971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3298305A Pending JPH06152100A (en) | 1991-09-04 | 1991-10-17 | Liquid photoresist used for manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06152100A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006215545A (en) * | 2005-01-07 | 2006-08-17 | E I Du Pont De Nemours & Co | Imaging element for use as recording element and process of using the imaging element |
| JP2008070861A (en) * | 2006-06-30 | 2008-03-27 | E I Du Pont De Nemours & Co | Imaging element having photoluminescent tag and method to form recording element using imaging element |
-
1991
- 1991-10-17 JP JP3298305A patent/JPH06152100A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006215545A (en) * | 2005-01-07 | 2006-08-17 | E I Du Pont De Nemours & Co | Imaging element for use as recording element and process of using the imaging element |
| US8883393B2 (en) | 2005-01-07 | 2014-11-11 | E I Du Pont De Nemours And Company | Printing form precursor for use as a recording element |
| JP2008070861A (en) * | 2006-06-30 | 2008-03-27 | E I Du Pont De Nemours & Co | Imaging element having photoluminescent tag and method to form recording element using imaging element |
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