JPH06152091A - Double-sided connection conductor for board and manufacture of paper phenol board using it - Google Patents

Double-sided connection conductor for board and manufacture of paper phenol board using it

Info

Publication number
JPH06152091A
JPH06152091A JP32249392A JP32249392A JPH06152091A JP H06152091 A JPH06152091 A JP H06152091A JP 32249392 A JP32249392 A JP 32249392A JP 32249392 A JP32249392 A JP 32249392A JP H06152091 A JPH06152091 A JP H06152091A
Authority
JP
Japan
Prior art keywords
solder
conductor
paper phenol
double
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32249392A
Other languages
Japanese (ja)
Inventor
Kazuhiko Toyama
和彦 遠山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Mita Industrial Co Ltd
Original Assignee
Mita Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mita Industrial Co Ltd filed Critical Mita Industrial Co Ltd
Priority to JP32249392A priority Critical patent/JPH06152091A/en
Publication of JPH06152091A publication Critical patent/JPH06152091A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To improve productivity by allowing a conductor part or a bundle of conductors as a wiring part for wiring patterns provided on a paper phenol wiring board by leaving due to fluxing from the conductor part or the bundle of conductors of a soldering layer or a soldering film. CONSTITUTION:In a bundle of conductors which virtually constitute a wiring part by bundling a plurality of thin wires of conductor material, for example, a bundle of conductors 11 are constituted of a plurality of conductor thin wires 12, 12... and are bundled to a specific thickness D needed for wiring. Then, if a soldering bath dipped surface of a paper phenol wiring board 31 is dipped into a soldering bath when manufacturing the paper phenol board, a soldering film 14 of the double-sided connection conductor 13 for board is melted as solder due to thermal conduction to the connection conductor 13 and is supplied to a soldering bath non-dipped surface side. Then, the bundle of conductors 11 function as a wiring part for wiring the patterns which are provided at the paper phenol wiring board 31 due to leaving caused by melting from the bundle of conductors 11 of the soldering film 14.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は基板用両面接続導体お
よびそれを用いた紙フェノール基板の製造方法に関し、
さらに詳しくは、コスト安の紙フェノール板を両面配線
板として使用する際にその配線板の表裏を接続するジャ
ンパー線等の基板用両面接続導体およびそのジャンパー
線等を用いた紙フェノール基板の製造方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided connecting conductor for a board and a method for manufacturing a paper phenol board using the same.
More specifically, when a low-cost paper phenolic board is used as a double-sided wiring board, a double-sided connecting conductor for a board such as a jumper wire that connects the front and back of the wiring board and a method for manufacturing a paper phenolic board using the jumper wire, etc. It is about.

【０００２】[0002]

【従来の技術】近年、プリント基板の小型化、配線の高
密度化が進んでいる。このため、紙フェノール基板を両
面配線板として使用するに際しては、この配線板の半田
槽非浸漬面側（以下、一方面側という）Ａに、例えば、
銅等の導体材料からなるジャンパー線を設けることでそ
の配線板の両面を接続する方法がある。2. Description of the Related Art In recent years, miniaturization of printed circuit boards and densification of wiring have been advanced. Therefore, when using a paper phenol substrate as a double-sided wiring board, for example, on the solder bath non-immersed surface side (hereinafter, referred to as one surface side) A of this wiring board,
There is a method of connecting both surfaces of the wiring board by providing a jumper wire made of a conductive material such as copper.

【０００３】従来この種接続方法では、まず、図１０に
示すように、両面に信号線であるパターン（図示せず）
を有するプリント配線板１に各電子部品（図示せず）を
組み入れて実装するとともに、このプリント配線板１に
設けたスルーホール等の接続孔２に一方面側Ａからジャ
ンパー線３を挿入し、続いて、その接続孔２に、図１１
に示すように、この配線板１の半田槽浸漬面（以下、他
方面という）１ｂを２００℃前後の高温状態の半田槽４
に浸漬することで半田５を通すことにより、その接続孔
２の他方面側Ｂと、この接続孔２の一方面側Ａとを半田
付けするようにした（図１２参照）ものが提案されてい
る。なお、図１０〜図１２において、符号６は、パター
ンと半田５とを電気的に接続するための銅等の導体材料
からなるパターン電極部である。Conventionally, in this type of connection method, first, as shown in FIG. 10, a pattern (not shown) having signal lines on both surfaces.
Each electronic component (not shown) is incorporated into and mounted on a printed wiring board 1 having, and a jumper wire 3 is inserted from one surface side A into a connection hole 2 such as a through hole provided in this printed wiring board 1, Then, in the connection hole 2, FIG.
As shown in FIG. 3, the solder bath immersion surface (hereinafter referred to as the other surface) 1b of the wiring board 1 is a solder bath 4 in a high temperature state of about 200 ° C.
There is proposed a method in which the other surface side B of the connection hole 2 and the one surface side A of the connection hole 2 are soldered by passing the solder 5 by immersing in the (see FIG. 12). There is. 10 to 12, reference numeral 6 is a pattern electrode portion made of a conductive material such as copper for electrically connecting the pattern and the solder 5.

【０００４】[0004]

【発明が解決しようとする課題】しかし、この方法で
は、プリント配線板１を半田槽４に浸漬しても、半田５
が他方面側Ｂから接続孔２を介して一方面側Ａにまで必
要量上がり難く、接続孔２の他方面側Ｂに比して接続孔
２の一方面側Ａでは充分な半田付けを行うことが難し
い。そのため、接続孔２の一方面側Ａの半田付けをプリ
ント配線板１を半田槽４に通した後作業者が半田ゴテで
行わざるを得ない。However, in this method, even if the printed wiring board 1 is dipped in the solder bath 4, the solder
Is less likely to rise from the other surface side B to the one surface side A through the connection hole 2, and sufficient soldering is performed on the one surface side A of the connection hole 2 compared to the other surface side B of the connection hole 2. Difficult to do. Therefore, the soldering of the one surface A of the connection hole 2 is inevitable for the operator after the printed wiring board 1 is passed through the solder bath 4 with a soldering iron.

【０００５】この手作業を回避するために、プリント配
線板の半田槽非浸漬面にクリーム半田で半田付けを行う
ことが特開昭６３−１７５９１号公報に提案されている
が、この方法は以下に述べるような問題点を有する。す
なわち、半田槽非浸漬面にクリーム半田を塗布すると、
ジャンパー線直下領域にはパターンを形成するのが難し
く、配線の高密度化が難しい。また、クリーム半田工程
が加わったために、新たにクリーム半田のジャンパー線
への印刷やその後に必要なクリーム半田のリフロー処理
等の工程を避けることは決してできない。In order to avoid this manual work, it is proposed in Japanese Patent Laid-Open No. 63-17591 to solder the non-immersed surface of the printed wiring board with cream solder. This method is described below. There are problems as described in. That is, when cream solder is applied to the non-immersed surface of the solder bath,
It is difficult to form a pattern in the area directly under the jumper line, and it is difficult to increase the wiring density. Further, since the cream solder process is added, it is unavoidable to additionally print the cream solder on the jumper wire and the necessary reflow process of the cream solder thereafter.

【０００６】この発明は、上記問題に鑑みてなしたもの
で、その目的は、簡単な方法で、しかもジャンパー線直
下領域もパターン形成領域として有効に利用することが
でき、ジャンパー線を接続孔の一方面側でも確実に紙フ
ェノール配線板に半田付けできる基板用両面接続導体お
よびそれを用いた紙フェノール基板の製造方法を提供す
ることにある。The present invention has been made in view of the above problems, and an object thereof is to make it possible to effectively use a region directly under a jumper wire as a pattern forming region by a simple method, and use the jumper wire as a contact hole. It is an object of the present invention to provide a double-sided connecting conductor for a substrate, which can be surely soldered to a paper phenolic wiring board even on one side, and a method for manufacturing a paper phenolic substrate using the same.

【０００７】[0007]

【課題を解決するための手段および作用】上記目的を達
成するために、この発明は、両面にそれぞれ信号線であ
るパターンと実装部品とを有する紙フェノール配線板に
設けたスルーホール等の接続孔に挿入され、その接続孔
に、前記紙フェノール配線板の一方の面である半田槽浸
漬面を半田槽に浸漬することで半田を通すことにより、
接続孔の半田槽浸漬面側と、この接続孔の、前記紙フェ
ノール配線板のもう一方の面である半田槽非浸漬面側と
を半田付けするようにした基板用両面接続導体におい
て、この基板用両面接続導体が、導体材料の細線が複数
束ねられて実質的に配線部を構成する導体束と、この導
体束に該導体束を被覆する状態で半田を含浸した半田膜
とからなる基板用両面接続導体である。In order to achieve the above object, the present invention provides a connection hole such as a through hole provided on a paper phenol wiring board having a pattern which is a signal line and a mounting component on both sides. Is inserted into the connection hole, by passing the solder by immersing the solder bath immersion surface that is one surface of the paper phenol wiring board in the solder bath,
In the double-sided connecting conductor for a board, the solder bath immersion surface side of the connection hole and the solder bath non-immersion surface side of the connection hole, which is the other surface of the paper phenol wiring board, are soldered. For a substrate, the double-sided connecting conductor comprises a conductor bundle in which a plurality of thin wires of a conductor material are bundled to substantially form a wiring portion, and a solder film in which the conductor bundle is impregnated with solder in a state of covering the conductor bundle. It is a double-sided connection conductor.

【０００８】また、この発明は、導体材料の細線が複数
束ねられて実質的に配線部を構成する導体束と、この導
体束に該導体束を被覆する状態で半田を含浸した半田膜
とからなる基板用両面接続導体を、両面にそれぞれ信号
線であるパターンと実装部品とを有する紙フェノール配
線板に設けたスルーホール等の接続孔に挿入することに
よって、接続孔の半田槽浸漬面側と、この接続孔の半田
槽非浸漬面側とを半田付けするに際して、基板用両面接
続導体を接続孔に挿入し、続いて、紙フェノール配線板
の半田槽浸漬面を半田槽に浸漬し、接続孔の半田槽非浸
漬面側に基板用両面接続導体の前記半田膜からの溶融半
田も供給することからなる基板用両面接続導体を用いた
紙フェノール基板の製造方法を提供する。Further, according to the present invention, a plurality of thin wires of a conductor material are bundled together to substantially form a wiring portion, and a solder film in which the conductor bundle is impregnated with solder in a state of covering the conductor bundle is formed. By inserting the double-sided connecting conductor for a board into a connecting hole such as a through hole provided in a paper phenol wiring board having a pattern which is a signal line and a mounting component on both sides, When soldering this connection hole to the non-immersed surface side of the solder bath, insert the double-sided connecting conductor for the board into the connection hole, and then dip the solder bath immersion surface of the paper phenol wiring board into the solder bath to connect. Provided is a method for manufacturing a paper phenol substrate using a double-sided connecting conductor for a substrate, which also comprises supplying molten solder from the solder film of the double-sided connecting conductor for a substrate to the solder bath non-immersed surface side of the hole.

【０００９】また、この発明は、別の観点から、両面に
それぞれ信号線であるパターンと実装部品とを有する紙
フェノール配線板に設けたスルーホール等の接続孔に挿
入され、その接続孔に、前記紙フェノール配線板の一方
の面である半田槽浸漬面を半田槽に浸漬することで半田
を通すことにより、接続孔の半田槽浸漬面側と、この接
続孔の、前記紙フェノール配線板のもう一方の面である
半田槽非浸漬面側とを半田付けするようにした基板用両
面接続導体において、この基板用両面接続導体が、導体
材料の太線が実質的に配線部を構成する導体部と、この
導体部を被覆する半田層とからなる基板用両面接続導体
を提供する。Further, from another point of view, the present invention is inserted into a connection hole such as a through hole provided in a paper phenol wiring board having a pattern which is a signal line and a mounting component on both sides, and the connection hole is By dipping the solder bath dipping surface, which is one surface of the paper phenol wiring board, in the solder bath, the solder bath dipping surface side of the connection hole and the connection hole of the paper phenol wiring board In a double-sided connecting conductor for a substrate, which is adapted to be soldered to the other surface which is the non-immersed side of a solder bath, the double-sided connecting conductor for a substrate is a conductor portion in which a thick wire of a conductive material substantially constitutes a wiring portion And a double-sided connecting conductor for a substrate, which comprises a solder layer covering the conductor portion.

【００１０】さらに、この発明は、導体材料の太線が実
質的に配線部を構成する導体部と、この導体部を被覆す
る半田層とからなる基板用両面接続導体を、両面にそれ
ぞれ信号線であるパターンと実装部品とを有する紙フェ
ノール配線板に設けたスルーホール等の接続孔に挿入す
ることによって、接続孔の半田槽浸漬面側と、この接続
孔の半田槽非浸漬面側とを半田付けするに際して、基板
用両面接続導体を接続孔に挿入し、続いて、紙フェノー
ル配線板の半田槽浸漬面を半田槽に浸漬し、接続孔の半
田槽非浸漬面側に基板用両面接続導体の前記半田層から
の溶融半田も供給することからなる基板用両面接続導体
を用いた紙フェノール基板の製造方法を提供する。Further, according to the present invention, a double-sided connecting conductor for a substrate, which is composed of a conductor portion in which a thick wire of a conductor material substantially constitutes a wiring portion and a solder layer covering the conductor portion, is provided with signal lines on both sides. By inserting into a connection hole such as a through hole provided in a paper phenol wiring board having a certain pattern and mounting parts, the solder bath immersion surface side of the connection hole and the solder bath non-immersion surface side of this connection hole are soldered. When attaching, insert the double-sided connection conductor for the board into the connection hole, then immerse the solder tank immersion surface of the paper phenol wiring board in the solder tank, and connect the board double-sided connection conductor to the solder tank non-immersed surface side of the connection hole. And a method for producing a paper phenol substrate using a double-sided connecting conductor for a substrate, which also comprises supplying molten solder from the solder layer.

【００１１】この発明において、導体材料の細線が複数
束ねられて実質的に配線部を構成する導体束とは、例え
ば、図２に示すように、導体束１１が、複数個の導体細
線１１２，１２，…から構成されて配線に必要な所定の
厚みＤに束ねられており、紙フェノール基板の製造方法
にあたって、紙フェノール配線板３１の半田槽浸漬面を
半田槽に浸漬した時、基板用両面接続導体１３の半田膜
１４が半田槽からの接続導体１３への熱伝導によって溶
融半田となって接続孔の半田槽非浸漬面側に供給され、
半田膜１４の導体束１１からの溶融による離脱で紙フェ
ノール配線板３１に設けたパターン同士を配線する配線
部として導体束１１が機能することを意味する。In the present invention, a conductor bundle which is a bundle of a plurality of thin wires of a conductor material and which substantially constitutes a wiring portion is, for example, as shown in FIG. , Which are bundled in a predetermined thickness D required for wiring, and when the solder tank immersion surface of the paper phenol wiring board 31 is immersed in the solder tank in the method of manufacturing the paper phenol substrate, both sides for the board The solder film 14 of the connection conductor 13 becomes molten solder by heat conduction from the solder bath to the connection conductor 13, and is supplied to the solder bath non-immersed surface side of the connection hole.
It means that the conductor bundle 11 functions as a wiring portion for wiring the patterns provided on the paper phenol wiring board 31 by detaching the solder film 14 from the conductor bundle 11 by melting.

【００１２】この発明において、導体材料の太線が実質
的に配線部を構成する導体部とは、例えば、図７に示す
ように、配線に必要な所定の厚みＥを導体部２１が有
し、紙フェノール基板の製造方法にあたって、紙フェノ
ール配線板の半田槽浸漬面を半田槽に浸漬した時、基板
用両面接続導体２２の半田層２３が半田槽からの接続導
体２２への熱伝導によって溶融半田となって接続孔の半
田槽非浸漬面側に供給され、半田層２３の導体部２１か
らの溶融による離脱で紙フェノール配線板に設けたパタ
ーン同士を配線する配線部として導体部２１が機能する
ことを意味する。In the present invention, the conductor portion in which the thick line of the conductor material substantially constitutes the wiring portion means that the conductor portion 21 has a predetermined thickness E necessary for wiring, as shown in FIG. In the method for manufacturing a paper phenol substrate, when the solder bath immersion surface of the paper phenol wiring board is immersed in the solder bath, the solder layer 23 of the board double-sided connection conductor 22 is melted by heat conduction from the solder bath to the connection conductor 22. Is supplied to the solder bath non-immersed surface side of the connection hole, and the conductor portion 21 functions as a wiring portion for wiring the patterns provided on the paper phenol wiring board by the separation of the solder layer 23 from the conductor portion 21 by melting. Means that.

【００１３】この発明は、各工程自体、公知の方法を用
いているけれども、基板用両面接続導体を上記のように
本願特有の構成とすることにより、従来、手作業で半田
付けを行っていたり、半田槽非浸漬面にクリーム半田を
塗布すると、ジャンパー線直下領域にはパターンを形成
するのが難しく、配線の高密度化が難しかったり、ま
た、クリーム半田工程が加わったために、新たにクリー
ム半田のジャンパー線への印刷やその後に必要なクリー
ム半田のリフロー処理等の工程を避けることは決してで
きないという事態を回避できる。In the present invention, although each step itself uses a known method, the double-sided connecting conductor for a substrate has a structure peculiar to the present invention as described above, so that soldering has conventionally been performed manually. However, if cream solder is applied to the non-immersed surface of the solder bath, it is difficult to form a pattern in the area directly under the jumper wire, and it is difficult to increase the density of the wiring. It is possible to avoid a situation in which it is unavoidable to avoid the steps such as the printing on the jumper wire and the reflow process of the cream solder necessary thereafter.

【００１４】また、ジャンパー線としての基板用両面接
続導体４１を、図８に示すような形状にすれば、実装ス
ペースを少なくでき、紙フェノール基板４０の小型化を
図ることができる。If the double-sided board connecting conductor 41 as a jumper wire is formed into a shape as shown in FIG. 8, the mounting space can be reduced and the paper phenol board 40 can be miniaturized.

【００１５】[0015]

【実施例】以下、この発明の第１の実施例を、図面に基
づいて説明する。なお、この発明はそれによって限定を
受けるものではない。なお、図１０〜図１２と同一符号
は同一または同一相当物である。図１〜図６において、
基板用両面接続導体（ジャンパー線）１３は、両面３１
ａ，３１ｂにそれぞれ信号線であるパターン３０，３０
…と実装部品とを有する紙フェノール配線板３１に設け
たスルーホール等の接続孔２，２に挿入され、その接続
孔に、紙フェノール配線板３１の一方の面である半田槽
浸漬面３１ｂを半田槽４に浸漬することで半田５を通す
ことにより、接続孔２の半田槽浸漬面側Ｂと、この接続
孔の、紙フェノール配線板３１のもう一方の面である半
田槽非浸漬面側Ａとを半田付けするものである。そし
て、この基板用両面接続導体１３が、銅の細線１２，１
２…が複数束ねられて実質的に配線部を構成する導体束
（より線）１１と、この導体束に該導体束１１を被覆す
る状態で半田５を含浸した半田膜１４とからなる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings. Note that the present invention is not limited thereby. The same reference numerals as those in FIGS. 10 to 12 are the same or the same. 1 to 6,
The double-sided connection conductor (jumper wire) 13 for the board is a double-sided 31
a and 31b are the patterns 30, 30 which are signal lines, respectively.
, And mounting parts are inserted into the connection holes 2 and 2 such as through holes provided in the paper phenol wiring board 31, and the solder bath immersion surface 31b, which is one surface of the paper phenol wiring board 31, is inserted into the connection holes. By dipping the solder 5 by immersing it in the solder bath 4, the solder bath dipping surface side B of the connection hole 2 and the solder bath non-immersing surface side of this connection hole which is the other surface of the paper phenol wiring board 31. A is soldered. Then, the double-sided connecting conductor 13 for the substrate is used as the thin copper wires 12, 1
.. are bundled together to form a wiring portion, and a solder film 14 in which the conductor bundle 11 is impregnated with the solder 5 is covered.

【００１６】この基板用両面接続導体１３の作成方法に
ついて説明する。図６において、まず、より線１１が供
給ローラ２３から半田槽２４に浸漬される。この際、よ
り線１１が、半田槽２４内に設けられた案内ローラ２５
で細線１２，１２…間の間隙に半田５が侵入し易いよう
にセットされ、さらに、案内ローラ２６，２７で、より
線１１が確実に半田膜１４によって被覆されるよう案内
され、乾燥室２８を通った基板用両面接続導体１３が巻
き取りローラ２９にセットされる。A method for producing the double-sided connecting conductor 13 for a substrate will be described. In FIG. 6, first, the twisted wire 11 is immersed in the solder bath 24 from the supply roller 23. At this time, the twisted wire 11 is guided by the guide roller 25 provided in the solder bath 24.
Is set so that the solder 5 can easily enter the gap between the thin wires 12, 12, ... And the guide rollers 26, 27 guide the stranded wire 11 to be surely covered with the solder film 14. The substrate double-sided connection conductor 13 that has passed through is set on the winding roller 29.

【００１７】以下基板用両面接続導体１３を用いた紙フ
ェノール基板４０の、この発明の第２の実施例である製
造方法について簡単に説明する。まず、図３、図１に示
すように、基板用両面接続導体１３を接続孔２に挿入
し、続いて、図４に示すように、紙フェノール配線板３
１の半田槽浸漬面３１ｂを半田槽４に浸漬し、接続孔２
の半田槽非浸漬面３１ａに基板用両面接続導体１３の半
田膜１４からの溶融半田５も供給する。この際、紙フェ
ノール配線板３１の半田槽浸漬面３１ｂを半田槽４に浸
漬した時、基板用両面接続導体１３の半田膜１４が２２
０〜２５０℃の半田槽４からの接続導体１３への熱伝導
によって溶融半田５となって接続孔２の半田槽非浸漬面
側Ａに供給される（図５参照）。このように、半田膜１
４の導体束１１からの溶融による離脱で紙フェノール配
線板３１に設けたパターン３０，３０同士を配線する配
線部として導体束１１が機能する。A method of manufacturing the paper phenolic board 40 using the board double-sided connecting conductor 13 according to the second embodiment of the present invention will be briefly described below. First, as shown in FIGS. 3 and 1, the board double-sided connecting conductor 13 is inserted into the connection hole 2, and subsequently, as shown in FIG.
The solder bath dipping surface 31b of No. 1 is dipped in the solder bath 4 to form the connection hole 2
The molten solder 5 from the solder film 14 of the board double-sided connecting conductor 13 is also supplied to the solder bath non-immersed surface 31a. At this time, when the solder bath immersion surface 31b of the paper phenol wiring board 31 is immersed in the solder bath 4, the solder film 14 of the board double-sided connecting conductor 13 is 22
Thermal conduction from the solder bath 4 to the connection conductor 13 at 0 to 250 ° C. forms molten solder 5 which is supplied to the solder bath non-immersed surface side A of the connection hole 2 (see FIG. 5). In this way, the solder film 1
The conductor bundle 11 functions as a wiring portion for wiring the patterns 30 and 30 provided on the paper phenol wiring board 31 by being separated from the conductor bundle 11 by melting.

【００１８】このように本実施例では、簡単な方法で、
しかもジャンパー線直下領域もパターン形成領域として
有効に利用することができ、ジャンパー線１３を接続孔
２の半田槽非浸漬面側Ａでも確実に紙フェノール配線板
３１に半田付けできる。また、コスト安の紙フェノール
配線板３１使用できるので産業上多大の利益をもたら
す。As described above, in this embodiment, a simple method is used.
Moreover, the area immediately below the jumper wire can be effectively used as a pattern forming area, and the jumper wire 13 can be reliably soldered to the paper phenol wiring board 31 even on the solder bath non-immersed surface side A of the connection hole 2. Further, since the paper phenol wiring board 31 which is low in cost can be used, it brings a great industrial advantage.

【００１９】図７は、導体材料の太線が実質的に配線部
を構成する導体部と、この導体部を被覆する半田層とか
らなるジャンパー線としての基板用両面接続導体を示す
この発明の第３の実施例である。図７に示すように、配
線に必要な所定の厚みＥを導体部２１が有し、紙フェノ
ール基板の製造方法にあたって、紙フェノール配線板の
半田槽浸漬面側Ｂを半田槽に浸漬した時、基板用両面接
続導体２２の半田層２３が半田槽からの接続導体２２へ
の熱伝導によって溶融半田となって接続孔の半田槽非浸
漬面側Ａに供給され、半田層２３の導体部２１からの溶
融による離脱で紙フェノール配線板に設けたパターン同
士を配線する配線部として導体部２１が機能する。そし
て、上記第１の実施例では、導体束１１が、複数個の導
体細線１１２，１２，…から構成されて配線に必要な所
定の厚みＤに束ねられていたが、本実施例では、配線に
必要な所定の厚みＥを有する導体部２１が設けられてい
る。FIG. 7 shows a double-sided connecting conductor for a board as a jumper wire consisting of a conductor portion in which a thick wire of a conductor material substantially constitutes a wiring portion and a solder layer covering the conductor portion. 3 is an example. As shown in FIG. 7, when the conductor portion 21 has a predetermined thickness E necessary for wiring, and the solder tank immersion surface side B of the paper phenol wiring board is immersed in the solder tank in the method of manufacturing the paper phenol substrate, The solder layer 23 of the board-side double-sided connection conductor 22 becomes molten solder due to heat conduction from the solder bath to the connection conductor 22, and is supplied to the solder bath non-immersed surface side A of the connection hole. The conductor portion 21 functions as a wiring portion for wiring the patterns provided on the paper phenol wiring board by the separation due to the melting of the. In the first embodiment, the conductor bundle 11 is composed of a plurality of conductor fine wires 112, 12, ... And bundled into a predetermined thickness D required for wiring. Is provided with a conductor portion 21 having a predetermined thickness E required for.

【００２０】この際、紙フェノール配線板３１の半田槽
浸漬面３１ｂを半田槽４に浸漬した時、基板用両面接続
導体２２の半田層２３が２２０〜２５０℃の半田槽４か
らの接続導体２２への熱伝導によって溶融半田５となっ
て接続孔２の半田槽非浸漬面側Ａに供給されることで上
記第１の実施例と同様の作用を有する。At this time, when the solder bath dipping surface 31b of the paper phenol wiring board 31 is dipped in the solder bath 4, the solder layer 23 of the double-sided connecting conductor 22 for a substrate has a connection conductor 22 from the solder bath 4 of 220 to 250 ° C. By the heat conduction to the molten solder 5, the molten solder 5 is supplied to the non-immersed surface A of the connection hole 2 in the solder bath, so that the same operation as that of the first embodiment is achieved.

【００２１】この基板用両面接続導体２２は、図９に示
すように、半田コーティング法を用いて作成できる。図
９において、半田槽３４に螺旋形状の銅線である導体部
２１が陰極として浸漬され、電源３５を介して導体部２
１の対向位置にスズ・鉛の合金からなる陽極板３６が半
田槽３４内にセットされている。電源電圧をコントロー
ルすることにより、所望の厚みの半田層２３を有するジ
ャンパー線２２を作成できる。The double-sided connecting conductor 22 for a substrate can be prepared by using a solder coating method, as shown in FIG. In FIG. 9, the conductor portion 21 which is a spiral-shaped copper wire is immersed as a cathode in the solder bath 34, and the conductor portion 2 is inserted through the power source 35.
An anode plate 36 made of an alloy of tin and lead is set in the solder bath 34 at a position facing each other. By controlling the power supply voltage, the jumper wire 22 having the solder layer 23 having a desired thickness can be created.

【００２２】以下基板用両面接続導体２２を用いた紙フ
ェノール基板４０の、この発明の第４の実施例である製
造方法について簡単に説明する。導体部２１と、この導
体部を被覆する半田層２３とからなる基板用両面接続導
体２２を、両面にそれぞれ信号線であるパターンと実装
部品とを有する紙フェノール配線板に設けたスルーホー
ル等の接続孔２，２に挿入することによって、接続孔の
半田槽浸漬面側Ｂと、この接続孔の半田槽非浸漬面側Ａ
とを半田付けするに際して、基板用両面接続導体２２を
接続孔２に挿入し、続いて、紙フェノール配線板３１の
半田槽浸漬面３１ｂを半田槽４に浸漬し、接続孔２の半
田槽非浸漬面側Ａに基板用両面接続導体２２の半田層２
３からの溶融半田５も供給することからなる。A method of manufacturing the paper phenolic board 40 using the board double-sided connecting conductor 22 according to the fourth embodiment of the present invention will be briefly described below. A double-sided board connecting conductor 22 composed of a conductor portion 21 and a solder layer 23 covering the conductor portion is provided on a paper phenol wiring board having a pattern which is a signal line and a mounting component on both sides. By inserting into the connection holes 2 and 2, the solder bath immersion surface side B of the connection hole and the solder bath non-immersion surface side A of this connection hole
When soldering and, the double-sided connecting conductor 22 for the board is inserted into the connection hole 2, and subsequently, the solder bath immersion surface 31b of the paper phenol wiring board 31 is immersed in the solder bath 4 to remove the solder bath non-contact of the connection hole 2. On the immersion surface side A, the solder layer 2 of the double-sided connecting conductor 22 for substrate
The molten solder 5 from 3 is also supplied.

【００２３】このように本実施例では、簡単な方法で、
しかもジャンパー線２２の直下領域もパターン形成領域
として有効に利用することができ、ジャンパー線２２を
接続孔２の半田槽非浸漬面側Ａでも確実に紙フェノール
配線板３１に半田付けできる。また、コスト安の紙フェ
ノール配線板３１使用できるので産業上多大の利益をも
たらす。As described above, in this embodiment, a simple method is used.
Moreover, the area directly below the jumper wire 22 can be effectively used as a pattern forming area, and the jumper wire 22 can be reliably soldered to the paper phenol wiring board 31 even on the solder bath non-immersed surface side A of the connection hole 2. Further, since the paper phenol wiring board 31 which is low in cost can be used, it brings a great industrial advantage.

【００２４】また、この発明の第５の実施例として、ジ
ャンパー線としての基板用両面接続導体４１を、図８に
示すような形状にしたものも挙げることができる。この
ような形状にすれば、実装スペースを少なくでき、紙フ
ェノール基板の小型化を図ることができる。Further, as a fifth embodiment of the present invention, a double-sided board connecting conductor 41 as a jumper wire having a shape as shown in FIG. 8 can be mentioned. With such a shape, the mounting space can be reduced and the paper phenol substrate can be downsized.

【００２５】[0025]

【発明の効果】以上説明したように、この発明では、紙
フェノール配線板の半田槽浸漬面を半田槽に浸漬した
時、基板用両面接続導体の半田層あるいは半田膜が半田
槽からの接続導体への熱伝導によって溶融半田となって
接続孔の半田槽非浸漬面側に供給され、半田層あるいは
半田膜の導体部あるいは導体束からの溶融による離脱で
紙フェノール配線板に設けたパターン同士を配線する配
線部として導体部あるいは導体束が機能するので、従
来、手作業で半田付けを行っていたり、半田槽非浸漬面
側にクリーム半田を塗布すると、ジャンパー線直下領域
にはパターンを形成するのが難しく、配線の高密度化が
難しかったり、また、クリーム半田工程が加わったため
に、新たにクリーム半田のジャンパー線への印刷やその
後に必要なクリーム半田のリフロー処理等の工程を避け
ることは決してできないという事態を回避でき、生産性
を向上できる効果がある。また、簡単な方法で、しかも
基板用両面接続導体直下領域もパターン形成領域として
有効に利用でき、高密度の配線ができるという利点をも
つ。As described above, according to the present invention, when the solder bath dipping surface of the paper phenol wiring board is dipped in the solder bath, the solder layer or the solder film of the double-sided connecting conductor for the board is the connecting conductor from the solder bath. The heat is transferred to the solder hole as a molten solder by heat conduction to the solder bath, and is supplied to the non-immersed surface of the solder bath. Since the conductor part or conductor bundle functions as a wiring part for wiring, conventionally, when soldering is performed manually or when cream solder is applied to the non-immersed surface of the solder bath, a pattern is formed in the area directly under the jumper wire. It is difficult to make the wiring high density, and because the cream solder process has been added, it is necessary to newly print the cream solder on the jumper wire Avoid the reflow process or the like of the process can be avoided such a situation that can not be never, there is an effect capable of improving the productivity. In addition, there is an advantage that the area directly under the double-sided connection conductor for a substrate can be effectively used as a pattern formation area by a simple method, and high-density wiring can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明の第１の実施例を示す全体構成説明図
である。FIG. 1 is an explanatory diagram of an overall configuration showing a first embodiment of the present invention.

【図２】上記実施例における横断面図である。FIG. 2 is a cross-sectional view of the above embodiment.

【図３】この発明の第２の実施例における製造工程の第
１のステップを示す構成説明図である。FIG. 3 is a structural explanatory view showing a first step of a manufacturing process in a second embodiment of the present invention.

【図４】この発明の第２の実施例における製造工程の第
２のステップを示す構成説明図である。FIG. 4 is a structural explanatory view showing a second step of the manufacturing process in the second embodiment of the present invention.

【図５】この発明の第２の実施例における製造工程の第
３のステップを示す構成説明図である。FIG. 5 is a structural explanatory view showing a third step of the manufacturing process in the second embodiment of the present invention.

【図６】上記第１の実施例の作成方法を示す図である。FIG. 6 is a diagram showing a creating method according to the first embodiment.

【図７】この発明の第３の実施例を示す横断面図であ
る。FIG. 7 is a transverse sectional view showing a third embodiment of the present invention.

【図８】この発明の第５の実施例を示す全体構成説明図
である。FIG. 8 is an explanatory diagram of an overall configuration showing a fifth embodiment of the present invention.

【図９】上記第３の実施例の作成方法を示す図である。FIG. 9 is a diagram showing a creating method according to the third embodiment.

【図１０】従来例における製造工程の第１のステップを
示す構成説明図である。FIG. 10 is a structural explanatory view showing a first step of a manufacturing process in a conventional example.

【図１１】従来例における製造工程の第２のステップを
示す構成説明図である。FIG. 11 is a structural explanatory view showing a second step of the manufacturing process in the conventional example.

【図１２】従来例における製造工程の第３のステップを
示す構成説明図である。FIG. 12 is a structural explanatory view showing a third step of the manufacturing process in the conventional example.

【符号の説明】[Explanation of symbols]

２…接続孔、４…半田槽、１１…導体束、１２…導体細
線、１３，２２，４１…基板用両面接続導体、１４…半
田膜、２１…導体部、２３…半田層、３１…紙フェノー
ル配線板、４０…紙フェノール基板、Ａ…半田槽非浸漬
面側、Ｂ…半田槽浸漬面側。2 ... Connection hole, 4 ... Solder tank, 11 ... Conductor bundle, 12 ... Conductor thin wire, 13, 22, 41 ... Double-sided connecting conductor for substrate, 14 ... Solder film, 21 ... Conductor part, 23 ... Solder layer, 31 ... Paper Phenol wiring board, 40 ... Paper phenol substrate, A ... Solder tank non-immersed surface side, B ... Solder tank immersed surface side.

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 両面にそれぞれ信号線であるパターンと
実装部品とを有する紙フェノール配線板に設けたスルー
ホール等の接続孔に挿入され、その接続孔に、前記紙フ
ェノール配線板の一方の面である半田槽浸漬面を半田槽
に浸漬することで半田を通すことにより、接続孔の半田
槽浸漬面側と、この接続孔の、前記紙フェノール配線板
のもう一方の面である半田槽非浸漬面側とを半田付けす
るようにした基板用両面接続導体において、この基板用
両面接続導体が、導体材料の細線が複数束ねられて実質
的に配線部を構成する導体束と、この導体束に該導体束
を被覆する状態で半田を含浸した半田膜とからなる基板
用両面接続導体。1. A paper phenol wiring board having a pattern which is a signal line and a mounting component on both sides thereof is inserted into a connection hole such as a through hole provided in the paper phenol wiring board, and the connection hole has one surface of the paper phenol wiring board. By passing the solder by immersing the solder bath dipping surface in the solder bath, the solder bath dipping surface side of the connection hole and the solder bath non-solder surface which is the other surface of the connection hole of the paper phenol wiring board. In a double-sided connecting conductor for a substrate, which is adapted to be soldered to the immersion surface side, the double-sided connecting conductor for a substrate is a bundle of conductors in which a plurality of thin wires of a conductive material are bundled to substantially form a wiring part, and the conductor bundle. A double-sided connection conductor for a substrate, comprising a solder film impregnated with solder in a state of covering the conductor bundle. 【請求項２】 両面にそれぞれ信号線であるパターンと
実装部品とを有する紙フェノール配線板に設けたスルー
ホール等の接続孔に挿入され、その接続孔に、前記紙フ
ェノール配線板の一方の面である半田槽浸漬面を半田槽
に浸漬することで半田を通すことにより、接続孔の半田
槽浸漬面側と、この接続孔の、前記紙フェノール配線板
のもう一方の面である半田槽非浸漬面側とを半田付けす
るようにした基板用両面接続導体において、この基板用
両面接続導体が、導体材料の太線が実質的に配線部を構
成する導体部と、この導体部を被覆する半田層とからな
る基板用両面接続導体。2. A paper phenol wiring board having a pattern which is a signal line and a mounting component on both sides thereof is inserted into a connection hole such as a through hole provided in the paper phenol wiring board, and the connection hole has one surface of the paper phenol wiring board. By passing the solder by immersing the solder bath dipping surface in the solder bath, the solder bath dipping surface side of the connection hole and the solder bath non-solder surface which is the other surface of the connection hole of the paper phenol wiring board. In a double-sided connecting conductor for a substrate, which is adapted to be soldered to the immersion surface side, the double-sided connecting conductor for a substrate has a conductor portion in which a thick wire of a conductive material substantially constitutes a wiring portion, and a solder for covering the conductor portion. Double-sided connection conductor for substrates consisting of layers. 【請求項３】 導体材料の細線が複数束ねられて実質的
に配線部を構成する導体束と、この導体束に該導体束を
被覆する状態で半田を含浸した半田膜とからなる基板用
両面接続導体を、両面にそれぞれ信号線であるパターン
と実装部品とを有する紙フェノール配線板に設けたスル
ーホール等の接続孔に挿入し、その接続孔に、前記紙フ
ェノール配線板の一方の面である半田槽浸漬面を半田槽
に浸漬することで半田を通すことにより、接続孔の半田
槽浸漬面側と、この接続孔の、前記紙フェノール配線板
のもう一方の面である半田槽非浸漬面側とを半田付けす
るに際して、基板用両面接続導体を接続孔に挿入し、続
いて、紙フェノール配線板の半田槽浸漬面を半田槽に浸
漬し、接続孔の半田槽非浸漬面側に基板用両面接続導体
の前記半田膜からの溶融半田も供給することからなる基
板用両面接続導体を用いた紙フェノール基板の製造方
法。3. A double-sided board for a substrate comprising a conductor bundle in which a plurality of thin wires of a conductor material are bundled to substantially form a wiring portion, and a solder film in which the conductor bundle is impregnated with solder while covering the conductor bundle. The connecting conductor is inserted into a connection hole such as a through hole provided in a paper phenol wiring board having a pattern which is a signal line and a mounting component on both sides, and the connection hole is formed on one surface of the paper phenol wiring board. By dipping one solder bath immersion surface in the solder bath to pass the solder, the solder bath immersion surface side of the connection hole and the solder hole non-immersion surface of this connection hole which is the other surface of the paper phenol wiring board When soldering the surface side, insert the double-sided connection conductor for the board into the connection hole, then immerse the solder tank immersion surface of the paper phenol wiring board in the solder tank, and place it on the solder hole non-immersion surface side of the connection hole. From the solder film of the double-sided connection conductor for the board A method for manufacturing a paper phenol substrate using a double-sided connecting conductor for a substrate, which also comprises supplying molten solder. 【請求項４】 導体材料の太線が実質的に配線部を構成
する導体部と、この導体部を被覆する半田層とからなる
基板用両面接続導体を、両面にそれぞれ信号線であるパ
ターンと実装部品とを有する紙フェノール配線板に設け
たスルーホール等の接続孔に挿入し、その接続孔に、前
記紙フェノール配線板の一方の面である半田槽浸漬面を
半田槽に浸漬することで半田を通すことにより、接続孔
の半田槽浸漬面側と、この接続孔の、前記紙フェノール
配線板のもう一方の面である半田槽非浸漬面側とを半田
付けするに際して、基板用両面接続導体を接続孔に挿入
し、続いて、紙フェノール配線板の半田槽浸漬面を半田
槽に浸漬し、接続孔の半田槽非浸漬面側に基板用両面接
続導体の前記半田層からの溶融半田も供給することから
なる基板用両面接続導体を用いた紙フェノール基板の製
造方法。4. A double-sided connecting conductor for a substrate, which is composed of a conductor portion in which a thick line of a conductor material substantially constitutes a wiring portion, and a solder layer covering the conductor portion, is mounted on both sides with a pattern which is a signal line and mounted. Insert into a connection hole such as a through hole provided in a paper phenol wiring board having parts and solder by immersing the solder tank immersion surface, which is one surface of the paper phenol wiring board, in the connection hole When the solder bath immersion surface side of the connection hole and the solder bath non-immersion surface side of the connection hole, which is the other surface of the paper phenol wiring board, are soldered by passing through Then, immerse the soldering bath dipping surface of the paper phenol wiring board in the soldering bath, and melt molten solder from the solder layer of the double-sided connecting conductor for the board on the soldering bath non-immersing surface side of the connection hole. Double-sided connection for board consisting of supplying A method for manufacturing a paper phenol substrate using a conductor.
JP32249392A 1992-11-07 1992-11-07 Double-sided connection conductor for board and manufacture of paper phenol board using it Pending JPH06152091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32249392A JPH06152091A (en) 1992-11-07 1992-11-07 Double-sided connection conductor for board and manufacture of paper phenol board using it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32249392A JPH06152091A (en) 1992-11-07 1992-11-07 Double-sided connection conductor for board and manufacture of paper phenol board using it

Publications (1)

Publication Number Publication Date
JPH06152091A true JPH06152091A (en) 1994-05-31

Family

ID=18144263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32249392A Pending JPH06152091A (en) 1992-11-07 1992-11-07 Double-sided connection conductor for board and manufacture of paper phenol board using it

Country Status (1)

Country Link
JP (1) JPH06152091A (en)

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