JPH06150253A - Thin-film magnetic head and its manufacture - Google Patents
Thin-film magnetic head and its manufactureInfo
- Publication number
- JPH06150253A JPH06150253A JP32614592A JP32614592A JPH06150253A JP H06150253 A JPH06150253 A JP H06150253A JP 32614592 A JP32614592 A JP 32614592A JP 32614592 A JP32614592 A JP 32614592A JP H06150253 A JPH06150253 A JP H06150253A
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductor coil
- substrate
- metal film
- magnetic pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、基板上に磁性膜、ギ
ャップ、絶縁層、導体コイル層などを種々の構成で積層
パターン化した磁気回路を有する、面内磁気記録再生又
は垂直磁気記録再生用の薄膜磁気ヘッドの改良に係り、
先に基板上に成膜された下部磁極と基板上にさらに導体
コイルを形成パターン化するに際し、下部磁極と基板表
面との間にできる段差を解消するため、予め導体コイル
と同じ材質の金属膜を下部磁極周囲に同等高さで形成す
ることにより、スループット、生産性の大幅な向上を可
能にした薄膜磁気ヘッドとその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an in-plane magnetic recording / reproducing or perpendicular magnetic recording / reproducing having a magnetic circuit in which a magnetic film, a gap, an insulating layer, a conductor coil layer and the like are laminated and patterned in various structures on a substrate. For improvement of thin film magnetic head for
In order to eliminate a step formed between the lower magnetic pole and the substrate surface when forming and patterning the lower magnetic pole previously formed on the substrate and the conductive coil on the substrate, a metal film of the same material as that of the conductive coil is previously prepared. The present invention relates to a thin-film magnetic head capable of significantly improving throughput and productivity by forming the same around the lower magnetic pole, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】面内磁気記録再生用薄膜磁気ヘッドの構
成例を図７に基づいて説明すると、１は基板、２は下部
磁極、３はギャップ、４は上部磁極、５は導体コイル、
６はノボラック樹脂で形成された絶縁層である。７、８
は導体コイルの引出しリード部である。2. Description of the Related Art An example of the structure of a thin-film magnetic head for in-plane magnetic recording / reproducing will be described with reference to FIG. 7. 1 is a substrate, 2 is a lower magnetic pole, 3 is a gap, 4 is an upper magnetic pole, 5 is a conductor coil,
Reference numeral 6 is an insulating layer made of novolac resin. 7, 8
Is a lead-out lead portion of the conductor coil.
【０００３】上述の導体コイル５は、フォトリソグラフ
ィーと呼ばれる方法で上述の絶縁層上にレジストパター
ンを形成し、電気めっきによりパターン内に金属膜を成
膜することに得られる。導体コイルが形成される絶縁層
の上面は下部磁極付近で段差を生じる。このため、導体
コイルを形成するフォトリソグラフィープロセスにおい
て、段差上面ではレジストパターンが細くなり導体コイ
ルの短絡が発生し、段差下面ではレジスト残りにより導
体コイルの断線が生じる。The above-mentioned conductor coil 5 is obtained by forming a resist pattern on the above-mentioned insulating layer by a method called photolithography and forming a metal film in the pattern by electroplating. A step is formed near the lower magnetic pole on the upper surface of the insulating layer on which the conductor coil is formed. For this reason, in the photolithography process for forming the conductor coil, the resist pattern becomes thin on the upper surface of the step and the conductor coil is short-circuited, and the resist coil remains on the lower surface of the step to break the conductor coil.
【０００４】このような問題点を解決するための従来技
術としては、例えば特開昭６１−１２０３１５号公報
に、基板と下部磁極との間に生じていた段差を有機絶縁
層で埋めるように成膜することにより段差を解消する技
術が開示されている。かかる絶縁層は、例えば、ノボラ
ック樹脂系ポジタイプレジスト膜を塗布した後、ソフト
ベーク化し、現像後に熱処理して硬化させることにより
形成できる。As a conventional technique for solving such a problem, for example, Japanese Patent Application Laid-Open No. 61-120315 discloses a method in which a step formed between a substrate and a lower magnetic pole is filled with an organic insulating layer. A technique for eliminating a step by forming a film is disclosed. Such an insulating layer can be formed, for example, by applying a novolac resin-based positive type resist film, soft-baking it, and performing heat treatment and curing after development.
【０００５】また、特開昭６１−１２０３１５号公報に
開示の上記技術は有機絶縁層の得られる平坦度が劣るこ
とから、平坦度の向上を目的に、基板と下部磁極との間
に生じる段差を埋めるために無機絶縁膜をスパッタリン
グ法で成膜し、その後イオンミリング等によって平坦化
する技術が提案（特開平１−１４４２０５号公報）され
ている。Further, in the above technique disclosed in Japanese Patent Laid-Open No. 61-120315, since the flatness obtained by the organic insulating layer is inferior, a step formed between the substrate and the lower magnetic pole is aimed at improving the flatness. In order to fill the gap, a technique of forming an inorganic insulating film by a sputtering method and then flattening it by ion milling or the like has been proposed (JP-A-1-144205).
【０００６】[0006]
【発明が解決しようとする課題】上述した先行技術にお
いては、前者の場合はノボラック樹脂を２００℃以上の
程度で焼き固めるため、この作業で１２時間以上必要で
あり、また後者の場合は無機絶縁膜を下部磁極薄膜厚以
上にスパッタリングで成膜し、イオンミリングでエッチ
ング平坦化するのに同様に１２時間以上の製造時間必要
であることが予想される。以上のように先行技術ではス
ループットが低く、生産に適さない問題があった。In the above-mentioned prior art, in the former case, since the novolac resin is baked and hardened at a temperature of 200 ° C. or higher, this work requires 12 hours or more. In the latter case, the inorganic insulation is used. It is expected that a manufacturing time of 12 hours or more is similarly required for forming the film by sputtering to a thickness of the lower magnetic pole thin film or more and flattening by etching by ion milling. As described above, the prior art has a problem of low throughput and is not suitable for production.
【０００７】この発明は、基板上に磁性膜、絶縁層、導
体コイル層などを種々の構成で積層パターン化した磁気
回路を有する、面内磁気記録再生又は垂直磁気記録再生
用の薄膜磁気ヘッドにおける、上述の下部磁極と基板表
面との間にできる段差を解消する新たな手段の提供を目
的とし、さらに、かかる段差解消に要する製造工程の簡
素化及び製造時間の短縮を可能にする薄膜磁気ヘッドの
製造方法の提供を目的としている。The present invention relates to a thin film magnetic head for in-plane magnetic recording / reproducing or perpendicular magnetic recording / reproducing, which has a magnetic circuit in which a magnetic film, an insulating layer, a conductor coil layer and the like are laminated and patterned in various structures on a substrate. , A thin film magnetic head for the purpose of providing a new means for eliminating the step formed between the lower magnetic pole and the surface of the substrate, and further simplifying the manufacturing process and shortening the manufacturing time required for eliminating the step. It is intended to provide a manufacturing method of.
【０００８】[0008]
【課題を解決するための手段】この発明は、基板上に磁
性膜、ギャップ、絶縁層、導体コイル層などを積層パタ
ーン化した磁気回路を有する薄膜磁気ヘッドにおいて、
基板上に形成される下部磁極以外の基板上の所要表面に
直接又はギャップを介して下部磁極と同等高さとなした
導体コイル形成用材料と同等材料で成膜した平坦化金属
膜を有することを特徴とする薄膜磁気ヘッドである。The present invention provides a thin film magnetic head having a magnetic circuit in which a magnetic film, a gap, an insulating layer, a conductor coil layer and the like are laminated and patterned on a substrate,
A flattening metal film formed of the same material as the conductor coil forming material, which has the same height as the lower magnetic pole, is formed on a required surface of the substrate other than the lower magnetic pole formed on the substrate directly or through a gap. It is a characteristic thin film magnetic head.
【０００９】この発明は、基板上に磁性膜、ギャップ、
絶縁層、導体コイル層などを積層パターン化した磁気回
路を各層を形成する薄膜磁気ヘッドの製造方法におい
て、基板上に成膜される下部磁極以外の基板上の所要表
面に下部磁極と同等高さとなるように、基板上に直接あ
るいは基板上にギャップを設けた後、導体コイル形成用
材料と同等材料を平坦化金属膜として形成し、この平坦
化金属膜と前記下部磁極上に所要パターンで所要の各層
を形成することを特徴とする薄膜磁気ヘッドの製造方法
である。According to the present invention, a magnetic film, a gap,
In a method of manufacturing a thin film magnetic head for forming each layer of a magnetic circuit in which insulating layers, conductor coil layers, etc. are laminated and patterned, a height equal to that of the lower magnetic pole is provided on a required surface of the substrate other than the lower magnetic pole formed on the substrate. As described above, after forming a gap directly on the substrate or after forming a gap on the substrate, a material equivalent to the material for forming the conductor coil is formed as a flattening metal film, and the flattening metal film and the lower magnetic pole are formed in a required pattern. Is a method for manufacturing a thin-film magnetic head.
【００１０】この発明において、平坦化金属膜には、実
施例の如く、導体コイルにＣｕ材料を用いる場合に同一
のＣｕ材料を成膜して平坦化金属膜とすることが望まし
いが、例えばＣｕ合金材料あるいはＡｌ合金を用いるな
ど、導体コイル形成用材料と同等の導通性材料であれ
ば、特に限定しない。また、形成方法も薄膜磁気ヘッド
の積層構造等に応じて、公知のスパッタリング法やフォ
トリソグラフィー法等の方法を選定、組み合せて適用す
ればよい。In the present invention, when a Cu material is used for the conductor coil as in the embodiment, it is desirable that the same Cu material is formed as the flattening metal film to form the flattening metal film. There is no particular limitation as long as it is a conductive material equivalent to the conductor coil forming material, such as an alloy material or an Al alloy. Further, as a forming method, a known method such as a sputtering method or a photolithography method may be selected and combined depending on the laminated structure of the thin film magnetic head.
【００１１】また、この発明において、実施例には面内
磁気記録再生用薄膜磁気ヘッドを示すが、単極構造で磁
束リターン部を設ける構成や、基板にフェライトなどの
軟磁性材料を用い上部磁極層を省略した構成など、公知
の種々構成のいずれの垂直磁気記録再生用の薄膜磁気ヘ
ッドであっても、例えば基板に絶縁層を介してから平坦
化金属膜を形成するなどの手法により、この発明による
平坦化金属膜の構成並びにその製造方法は容易に適用で
き、実施例の面内磁気記録再生用薄膜磁気ヘッドと同等
の作用効果を奏する。In the present invention, the thin film magnetic head for in-plane magnetic recording / reproducing is shown in the embodiment, but the structure is such that the magnetic flux return portion is provided in a single pole structure, and the upper magnetic pole is made of a soft magnetic material such as ferrite for the substrate. In any of various known thin-film magnetic heads for perpendicular magnetic recording / reproduction, such as a structure in which layers are omitted, a flattening metal film is formed on a substrate through an insulating layer, and the like. The structure of the flattened metal film and the manufacturing method thereof according to the present invention can be easily applied, and have the same effects as those of the thin-film magnetic head for in-plane magnetic recording and reproduction of the embodiment.
【００１２】[0012]
【作用】この発明は、例えば、基板上に下部磁極、ギャ
ップ、絶縁層上に形成された導体コイル、上部磁極およ
び保護膜が順次積層された薄膜磁気ヘッドにおいて、前
記下部磁極と前記基板間の段差を埋めて前記導体コイル
の形成面を平坦化する導体コイルと同じ金属膜を平坦化
金属膜として形成することを特徴とし、前記下部磁極と
前記基板間の段差を容易に解消できるだけでなく、導体
コイルと同様の方法で成膜できるため、高精度の膜厚制
御が可能であり、段差解消効果が高く、さらに、導体コ
イルと同じ金属膜を付与することにより、導体コイルの
腐食を防止できる。According to the present invention, for example, in a thin film magnetic head in which a lower magnetic pole, a gap, a conductor coil formed on an insulating layer, an upper magnetic pole and a protective film are sequentially laminated on a substrate, the magnetic pole between the lower magnetic pole and the substrate is reduced. It is characterized in that the same metal film as the conductor coil for filling the step and flattening the surface on which the conductor coil is formed is formed as a flattening metal film, and not only the step between the lower magnetic pole and the substrate can be easily eliminated, Since the film can be formed in the same manner as the conductor coil, the film thickness can be controlled with high accuracy, the effect of eliminating the step difference is high, and the corrosion of the conductor coil can be prevented by providing the same metal film as that of the conductor coil. .
【００１３】[0013]
実施例１ 以下に実施例に基づいてこの発明を説明する。図１はこ
の発明による薄膜磁気ヘッドの平坦化金属膜を示す上面
説明図であり、図２と図３は図１のＡ−Ａ位置における
積層状態を説明する縦断説明図である。図１において、
基板１上に成膜される下部磁極２以外の基板１上の所要
表面に下部磁極２と同等層高さとなるように、Ｃｕから
なる導体コイルと同材料で平坦化金属膜１０を成膜する
が、基板１上に平坦化金属膜１０を直接成膜する場合と
ギャップを介して成膜する場合がある。Example 1 The present invention will be described below based on examples. FIG. 1 is an explanatory top view showing a flattening metal film of a thin film magnetic head according to the present invention, and FIGS. 2 and 3 are longitudinal explanatory views for explaining a laminated state at a position AA in FIG. In FIG.
A flattening metal film 10 is formed of the same material as the conductor coil made of Cu so as to have the same layer height as that of the lower magnetic pole 2 on a required surface of the substrate 1 other than the lower magnetic pole 2 formed on the substrate 1. However, there are cases where the flattening metal film 10 is formed directly on the substrate 1 and cases where it is formed via a gap.
【００１４】図２に示す例は、基板１０上に平坦化金属
膜１３を直接成膜する場合であり、基板１０上に３．５
μｍ厚みに下部磁極１１を所要パターンで形成後、平坦
化金属膜の成膜予定面以外をマスキングし、Ｃｕからな
る３．５μｍ厚みの平坦化金属膜１３を設け、さらにア
ルミナからなるギャップ層１２をスパッタリング法で約
０．３μｍ厚みに成膜し、さらに、絶縁層１４を設け同
層上にレジストパターンを形成し、電気めっきにより絶
縁層１４パターン上に図示しない導体コイルを形成して
あり、この導体コイル層上にさらに絶縁層を設けて絶縁
を完了する。The example shown in FIG. 2 is a case where the planarizing metal film 13 is directly formed on the substrate 10, and 3.5 is formed on the substrate 10.
After forming the lower magnetic pole 11 in a required pattern with a thickness of μm, the flattening metal film 13 other than the planned surface of the flattening metal film is masked, a flattening metal film 13 of Cu having a thickness of 3.5 μm is provided, and a gap layer 12 of alumina is provided. Is deposited to a thickness of about 0.3 μm by a sputtering method, an insulating layer 14 is further provided, a resist pattern is formed on the insulating layer 14, and a conductor coil (not shown) is formed on the insulating layer 14 pattern by electroplating. An insulating layer is further provided on the conductor coil layer to complete the insulation.
【００１５】図３に示す例は、基板１０上に下部磁極１
１を形成後、ギャップ層１２をスパッタリング法で形成
した後、当該平坦化金属膜１３を設ける場合で、下地膜
をスパッタリング法で成膜し、その上に当該金属膜と同
じ形状のレジストパターンをフォトリソグラフィー法を
用いて形成し、そのパターンに電気めっき法で導体コイ
ルと同じ銅を成膜した。その後、上記レジストと下地膜
を除去することによって形成してある。In the example shown in FIG. 3, the lower magnetic pole 1 is formed on the substrate 10.
1 is formed and then the gap layer 12 is formed by a sputtering method, and then the planarizing metal film 13 is provided, a base film is formed by a sputtering method, and a resist pattern having the same shape as the metal film is formed thereon. It was formed using a photolithography method, and the same copper as the conductor coil was formed on the pattern by electroplating. Then, it is formed by removing the resist and the base film.
【００１６】実施例２ 図４にはこの発明による薄膜磁気ヘッドにおける導体コ
イルとリード部との関係を示すが、実施例１で得られた
薄膜磁気ヘッドにおいて、絶縁層１４上の導体コイル１
５の中心部で絶縁層１４を貫通させ平坦化金属膜１０と
接続させて、平坦化金属膜１０の外周部でリード部１６
と接続してあり、導体コイル１５の外周部も同様に成膜
されたリード部１７と接続してある。ここで導体コイル
１５と平坦化金属膜１０は同材質であるため、電気抵抗
の著しい増加、インダクタンスの増大等の薄膜磁気ヘッ
ドの電磁変換特性を悪化させることが全くない。また、
導体コイルの巻数が奇数回の場合、従来の図７に示す導
体コイル５の中心部から引出されているリード部７は、
電磁変換部の最上部の上を通る構造であるのに対して、
この発明による構成は基板１０上の平坦化金属膜１０を
利用するため、素子全体の高さを低くできる利点があ
る。Example 2 FIG. 4 shows the relationship between the conductor coil and the lead portion in the thin film magnetic head according to the present invention. In the thin film magnetic head obtained in Example 1, the conductor coil 1 on the insulating layer 14 is
5 penetrates through the insulating layer 14 at the center of the flat metal film 5 and is connected to the flattening metal film 10.
And the outer peripheral portion of the conductor coil 15 is also connected to the lead portion 17 similarly formed. Since the conductor coil 15 and the flattening metal film 10 are made of the same material, the electromagnetic conversion characteristics of the thin film magnetic head, such as a marked increase in electric resistance and an increase in inductance, are not deteriorated at all. Also,
When the number of turns of the conductor coil is an odd number, the lead portion 7 drawn from the central portion of the conductor coil 5 shown in FIG.
While it is a structure that passes over the top of the electromagnetic conversion part,
Since the structure according to the present invention uses the planarizing metal film 10 on the substrate 10, there is an advantage that the height of the entire device can be reduced.
【００１７】実施例３ 以上の実施例では、導体コイル１５が１層の場合を説明
したが、導体コイル１５が３層の場合は、当該平坦化金
属膜１０を２層の導体コイル間の電磁変換部内での接続
線として利用することができる。すなわち、ギャップ層
１２上の絶縁層１４上に設けられた１層目の導体コイル
１５1、その絶縁層２０上に設けられた２層目の導体コ
イル１５2、さらに絶縁層２１上に設けられた３層目の
導体コイル１５3と導体コイルが３層の場合は、絶縁層
１４を貫通する１層目の導体コイル１５1の接続線１
８、並びに絶縁層２０と絶縁層１４を貫通する１層目の
導体コイル１５2の接続線１９を設けることにより、実
施例２で述べた構成例と同様の作用効果を有することに
なる。さらに、２層目と３層目の接続を行うために、絶
縁層２１を貫通する接続線２２を設けてある。Embodiment 3 In the above embodiments, the case where the conductor coil 15 has one layer has been described. However, when the conductor coil 15 has three layers, the flattening metal film 10 is used as an electromagnetic wave between two layers of conductor coils. It can be used as a connecting line in the converter. That is, the first-layer conductor coil 15 1 provided on the insulating layer 14 on the gap layer 12, the second-layer conductor coil 15 2 provided on the insulating layer 20, and further provided on the insulating layer 21. When the conductor coil 15 3 of the third layer and the conductor coil 3 are three layers, the connecting wire 1 of the conductor coil 15 1 of the first layer penetrating the insulating layer 14
8 and the connection wire 19 of the first-layer conductor coil 15 2 penetrating the insulating layer 20 and the insulating layer 14 has the same effect as the configuration example described in the second embodiment. Further, a connection line 22 penetrating the insulating layer 21 is provided to connect the second and third layers.
【００１８】実施例４ 実施例１〜３には、この発明による平坦化金属膜１０を
導体コイル１５を電磁変換部を形成する基板１０上の全
面に形成した例を示したが、図６に示す如く、かかる段
差による影響が顕著な磁極近傍のみに平坦化金属膜１０
を設けることもでき、同様の段差の解消効果を奏する。Example 4 Examples 1 to 3 show examples in which the flattening metal film 10 according to the present invention is formed on the entire surface of the substrate 10 on which the conductor coil 15 is formed as an electromagnetic conversion portion. As shown, the flattening metal film 10 is formed only in the vicinity of the magnetic pole, which is significantly affected by the step.
Can be provided, and the same effect of eliminating the step can be obtained.
【００１９】[0019]
【発明の効果】この発明による薄膜磁気ヘッドは、下部
磁極と前記基板間の段差を導体コイルと同材質の金属膜
を導体コイルの成膜方法で平坦化金属膜として成膜する
ため、高精度の膜厚制御が可能で段差解消効果が高く、
導体コイルの短絡、脱線等の不良を防止できる。また、
平坦化金属膜を導体コイルのリード部として利用できる
ため、素子全体の高さを低くできる。さらに、薄膜磁気
ヘッドの記録時中は発熱作用があり、温度上昇による磁
性膜の磁気特性の劣化が懸念されるが、この発明による
下部磁極の周囲に配置する平坦化金属膜にはＣｕなどの
高熱伝導体材料の使用するため、平坦化金属膜による放
熱効果が期待でき、磁気特性の劣化を防止できる利点が
有る。この発明による薄膜磁気ヘッドの製造方法は、導
体コイルの成膜方法で平坦化金属膜を成膜でき、新たな
製造設備を必要とせず、６時間以内で当該平坦化金属膜
を形成することができ、スループット、生産性を向上さ
せることが可能である。In the thin film magnetic head according to the present invention, the step between the lower magnetic pole and the substrate is formed as the flattened metal film by the method of forming the conductor coil by using the metal film of the same material as the conductor coil. It is possible to control the film thickness of the
It is possible to prevent defects such as short circuit and derailment of the conductor coil. Also,
Since the flattened metal film can be used as the lead portion of the conductor coil, the height of the entire element can be reduced. Further, the thin film magnetic head has a heating effect during recording, which may deteriorate the magnetic characteristics of the magnetic film due to temperature rise. However, the flattening metal film arranged around the lower magnetic pole according to the present invention is made of Cu or the like. Since a high thermal conductor material is used, the heat dissipation effect of the flattened metal film can be expected, and there is an advantage that the deterioration of magnetic characteristics can be prevented. In the method of manufacturing a thin film magnetic head according to the present invention, a flattening metal film can be formed by the method of forming a conductor coil, and the flattening metal film can be formed within 6 hours without requiring new manufacturing equipment. Therefore, it is possible to improve throughput and productivity.
【図１】この発明による薄膜磁気ヘッドの平坦化金属膜
を示す上面説明図である。FIG. 1 is an explanatory top view showing a flattening metal film of a thin film magnetic head according to the present invention.
【図２】図１のＡ−Ａ位置における積層状態を説明する
縦断説明図である。FIG. 2 is a vertical cross-sectional explanatory view illustrating a stacked state at a position AA in FIG.
【図３】図１のＡ−Ａ位置における他の積層状態例を説
明する縦断説明図である。FIG. 3 is a vertical cross-sectional explanatory view for explaining another example of the stacked state at the position AA in FIG.
【図４】この発明による薄膜磁気ヘッドにおける導体コ
イルとリード部との関係を示す縦断斜視説明図である。FIG. 4 is a vertical perspective view showing a relationship between a conductor coil and a lead portion in the thin film magnetic head according to the present invention.
【図５】導体コイル層が複数層であるこの発明による薄
膜磁気ヘッドの磁極中央部での縦断説明図である。FIG. 5 is a vertical cross-sectional view of a magnetic pole center portion of a thin film magnetic head according to the present invention having a plurality of conductor coil layers.
【図６】この発明による薄膜磁気ヘッドにおける平坦化
金属膜の配置例を示す上面説明図である。FIG. 6 is an explanatory top view showing an arrangement example of a flattening metal film in the thin film magnetic head according to the present invention.
【図７】従来の面内磁気記録再生用薄膜磁気ヘッドの構
成例を示す一部破断斜視説明図である。FIG. 7 is a partially cutaway perspective explanatory view showing a configuration example of a conventional in-plane magnetic recording / reproducing thin film magnetic head.
１，１０ 基板 ２，１１ 下部磁極 ３，１２ ギャップ層 ４ 上部磁極層 ５，１５，１５1，１５2，１５3 導体コイル ６，１４，２０，２１ 絶縁層 ７，８ リード部 １３ 平坦化金属膜 １８，１９，２２ 接続線1,10 substrate 2,11 lower pole 3,12 gap layer 4 the upper magnetic pole layer 5,15,15 1, 15 2, 15 3 conductor coil 6,14,20,21 insulating layers 7 and 8 lead portion 13 flattened metal Membrane 18, 19, 22 Connection line
Claims (2)
体コイル層などを積層パターン化した磁気回路を有する
薄膜磁気ヘッドにおいて、基板上に形成される下部磁極
以外の基板上の所要表面に直接又はギャップを介して下
部磁極と同等高さとなした導体コイル形成用材料と同等
材料で成膜した平坦化金属膜を有することを特徴とする
薄膜磁気ヘッド。1. In a thin film magnetic head having a magnetic circuit in which a magnetic film, a gap, an insulating layer, a conductor coil layer, etc. are laminated and patterned on a substrate, on a required surface of the substrate other than the lower magnetic pole formed on the substrate. A thin film magnetic head having a flattening metal film formed of the same material as a material for forming a conductor coil, which has a height equal to that of a lower magnetic pole directly or through a gap.
体コイル層などを積層パターン化した磁気回路を各層を
形成する薄膜磁気ヘッドの製造方法において、基板上に
成膜される下部磁極以外の基板上の所要表面に下部磁極
と同等高さとなるように、基板上に直接あるいは基板上
にギャップを設けた後、導体コイル形成用材料と同等材
料を平坦化金属膜として形成し、この平坦化金属膜と前
記下部磁極上に所要パターンで所要の各層を形成するこ
とを特徴とする薄膜磁気ヘッドの製造方法。2. In a method of manufacturing a thin film magnetic head for forming a magnetic circuit in which a magnetic film, a gap, an insulating layer, a conductor coil layer and the like are laminated and patterned on a substrate, each layer other than a lower magnetic pole formed on the substrate. After forming a gap either directly on the substrate or on the substrate so that the required height on the substrate is equivalent to that of the lower magnetic pole, a material equivalent to the conductor coil forming material is formed as a flattening metal film, and the flattened metal film is formed. A method of manufacturing a thin film magnetic head, comprising forming desired layers in a desired pattern on a metallized film and the lower magnetic pole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32614592A JPH06150253A (en) | 1992-11-10 | 1992-11-10 | Thin-film magnetic head and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32614592A JPH06150253A (en) | 1992-11-10 | 1992-11-10 | Thin-film magnetic head and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06150253A true JPH06150253A (en) | 1994-05-31 |
Family
ID=18184558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32614592A Pending JPH06150253A (en) | 1992-11-10 | 1992-11-10 | Thin-film magnetic head and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06150253A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07182625A (en) * | 1993-11-10 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | Method and apparatus for simultaneous execution of flattening and lead routing of write head |
| JPH09320015A (en) * | 1996-05-29 | 1997-12-12 | Nec Ibaraki Ltd | Thin-film magnetic head |
| WO2002063614A1 (en) * | 2001-02-05 | 2002-08-15 | Fujitsu Limited | Thin film magnetic head, magnetic head assembly, and composite thin film magnetic head |
| GB2391104A (en) * | 2002-07-22 | 2004-01-28 | Alps Electric Co Ltd | Thin film magnetic head |
-
1992
- 1992-11-10 JP JP32614592A patent/JPH06150253A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07182625A (en) * | 1993-11-10 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | Method and apparatus for simultaneous execution of flattening and lead routing of write head |
| JPH09320015A (en) * | 1996-05-29 | 1997-12-12 | Nec Ibaraki Ltd | Thin-film magnetic head |
| WO2002063614A1 (en) * | 2001-02-05 | 2002-08-15 | Fujitsu Limited | Thin film magnetic head, magnetic head assembly, and composite thin film magnetic head |
| GB2391104A (en) * | 2002-07-22 | 2004-01-28 | Alps Electric Co Ltd | Thin film magnetic head |
| GB2391104B (en) * | 2002-07-22 | 2005-09-21 | Alps Electric Co Ltd | Thin film magnetic head |
| US6963470B2 (en) | 2002-07-22 | 2005-11-08 | Alps Electic Co., Ltd. | Thin film magnetic head having improved heat radiating property |
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