JPH0614656B2 - Image sensor - Google Patents
Image sensorInfo
- Publication number
- JPH0614656B2 JPH0614656B2 JP62051664A JP5166487A JPH0614656B2 JP H0614656 B2 JPH0614656 B2 JP H0614656B2 JP 62051664 A JP62051664 A JP 62051664A JP 5166487 A JP5166487 A JP 5166487A JP H0614656 B2 JPH0614656 B2 JP H0614656B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- receiving element
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Facsimile Heads (AREA)
- Facsimiles In General (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、例えばファクシミリ用送信原稿と同一サイ
ズに、単一または複数個のセンサを配列し、原稿上の画
情報を読み取るイメージセンサに関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor for reading image information on an original by arranging a single or a plurality of sensors in the same size as a facsimile transmission original, for example. Is.
近年ファクシミリ、光学文字読取り装置（ＯＣＲ）等の
光電変換装置の技術的進歩は著しく、その中で、ファク
シミリ，ＯＣＲ等の装置の小型化を目ざし原稿密着型の
イメージセンサが開発され、実用化されている。In recent years, the technological progress of photoelectric conversion devices such as facsimiles and optical character readers (OCR) has been remarkable, and in the midst of this, document contact-type image sensors have been developed and put into practical use aiming at downsizing of devices such as facsimiles and OCR. ing.
第２図は従来のイメージセンサをモデル的に示した断面
側面図であり、図において、１は発光素子、２は受光素
子、３は受光素子２上に位置し一対一の正立等倍結像を
行なうロッドレンズアレイ、４は発光素子１及びロッド
レンズアレイ３の上方に位置する光透過板、５は光透過
板４上を移動する原稿で、５ａが読取り位置となる。そ
して、６は原稿を送るプラテンローラ、７は発光素子基
板８、受光素子基板９、ロッドレンズアレイ３、光透過
板４等を固定するフレームである。FIG. 2 is a cross-sectional side view showing a model of a conventional image sensor. In the figure, 1 is a light emitting element, 2 is a light receiving element, 3 is a light receiving element, and one-to-one upright equal-magnification. An image forming rod lens array, 4 is a light transmitting plate located above the light emitting element 1 and the rod lens array 3, and 5 is an original moving on the light transmitting plate 4, and 5a is a reading position. Further, 6 is a platen roller for feeding the original, and 7 is a frame for fixing the light emitting element substrate 8, the light receiving element substrate 9, the rod lens array 3, the light transmitting plate 4 and the like.
次に動作について説明する。プラテンローラ６により搬
送される原稿５は光透過板４上を移動する。この時、発
光素子１の発光により原稿５の読取り位置５ａに反射光
が生じ、その像はロッドアレイレンズ３によって正立等
倍の像となり、受光素子２に受光されて電気信号に変換
される。そして、原稿５の搬送を連続して行うことによ
り、原稿５の読み取りが行なわれる。Next, the operation will be described. The document 5 conveyed by the platen roller 6 moves on the light transmitting plate 4. At this time, the light emitted from the light emitting element 1 causes reflected light at the reading position 5a of the original 5, and the image thereof becomes an image of an erecting equal size by the rod array lens 3 and is received by the light receiving element 2 and converted into an electric signal. . Then, the document 5 is read by continuously conveying the document 5.
次に、このイメージセンサの組立てにつき説明する。ま
ず、例えば、ＬＥＤからなる発光素子１を、例えば、ガ
ラスエポキシ基板からなる発光素子基板８に半田付け等
にて固定し、フレーム７に該発光素子基板８をネジ等に
て取付け固定する。一方、例えばモノリシックＩＣ技術
により受光素子２を形成したＩＣチップ等を、例えばセ
ラミック基板から成る受光素子基板９に接着剤にて固定
し、フレーム７に該受光素子基板９をネジ等にて取り付
け固定する。そして、ロッドレンズアレイ３及び光透過
板４をフレーム７にネジ等にて取り付け固定することに
なる。Next, the assembly of this image sensor will be described. First, the light emitting element 1 made of, for example, an LED is fixed to the light emitting element substrate 8 made of, for example, a glass epoxy substrate by soldering or the like, and the light emitting element substrate 8 is attached and fixed to the frame 7 with screws or the like. On the other hand, for example, an IC chip having the light receiving element 2 formed by the monolithic IC technique is fixed to the light receiving element substrate 9 made of, for example, a ceramic substrate with an adhesive, and the light receiving element substrate 9 is fixed to the frame 7 with screws or the like. To do. Then, the rod lens array 3 and the light transmitting plate 4 are attached and fixed to the frame 7 with screws or the like.
従来のイメージセンサは以上のように構成されているの
で、発光素子基板８及び受光素子基板９を別々にフレー
ム７に固定しなければならず、多くの組立て工数を要し
ていた。また、フレーム７の内部にはロッドレンズアレ
イ３が配設されているため、フレーム７の高さを一定以
下に低くすることができず、小型化の要請を充分満足さ
せることができないという問題点もあった。Since the conventional image sensor is configured as described above, the light emitting element substrate 8 and the light receiving element substrate 9 must be separately fixed to the frame 7, which requires a large number of assembling steps. In addition, since the rod lens array 3 is disposed inside the frame 7, the height of the frame 7 cannot be lowered below a certain level, and the demand for downsizing cannot be sufficiently satisfied. There was also.
この発明は上記のような問題点を解消するためになされ
たもので、組立て工数の削減、及び充分な小型化を図る
ことが可能なイメージセンサを得ることを目的とする。The present invention has been made to solve the above problems, and an object thereof is to obtain an image sensor capable of reducing the number of assembling steps and sufficiently reducing the size.
この発明に係るイメージセンサは、発光素子と受光素子
を例えばセラミックから成る同一基板上に形成あるいは
搭載し、ロッドレンズアレイを、原稿読取り位置とその
直下に位置させた発光素子とをむすぶ直線に対して傾斜
させ、受光素子の受光焦点を原稿面に合うようにしたも
のである。In the image sensor according to the present invention, the light emitting element and the light receiving element are formed or mounted on the same substrate made of, for example, ceramic, and the rod lens array is arranged on a straight line that connects the original reading position and the light emitting element located directly below the original reading position. In this case, the light receiving focus of the light receiving element is aligned with the original surface.
この発明における発光素子及び受光素子は、同一基板上
に配設されるため、組立てを簡単に行なうことができ、
また、ロッドレンズアレイは傾斜して配設されているた
め、フレームの高さを低くすることができる。Since the light emitting element and the light receiving element in the present invention are arranged on the same substrate, the assembly can be easily performed,
Moreover, since the rod lens array is arranged so as to be inclined, the height of the frame can be reduced.
以下、この発明の一実施例を図について説明する。第１
図において、１０は例えばＬＥＤチップから成る発光素
子、１１は例えばモノリシックＩＣ技術により形成され
たＩＣチップから成る受光素子、１２は発光素子１０及
び受光素子１１が配設された基板、１３は受光素子１１
が発光素子１０の発光の影響を受けるのを防止するため
の光遮蔽板、１４はフレーム１５へ斜めに取付けられた
ロッドレンズアレイである。ここで、基板１２上の発光
素子１０は、原稿５の読取り位置５ａの直下位置に配置
され、ロッドレンズアレイ１４は、この発光素子１０と
読取り位置５ａとをむすぶ直線に対し一定の傾斜角θを
有するように配設されている。そして、読取り位置５ａ
で反射し、ロッドレンズアレイ１４を通過した光が一対
一の正立等倍数結像を行うことができるように、受光素
子１１が基板１２上に配設されている。An embodiment of the present invention will be described below with reference to the drawings. First
In the figure, 10 is a light emitting element including, for example, an LED chip, 11 is a light receiving element including, for example, an IC chip formed by a monolithic IC technique, 12 is a substrate on which the light emitting element 10 and the light receiving element 11 are arranged, and 13 is a light receiving element. 11
Is a light shielding plate for preventing the light from being affected by the light emission of the light emitting element 10, and 14 is a rod lens array obliquely attached to the frame 15. Here, the light emitting element 10 on the substrate 12 is arranged immediately below the reading position 5a of the original 5, and the rod lens array 14 has a constant inclination angle θ with respect to the straight line connecting the light emitting element 10 and the reading position 5a. Are arranged to have. And the reading position 5a
The light receiving element 11 is arranged on the substrate 12 so that the light reflected by the light and transmitted through the rod lens array 14 can form one-to-one erecting equal-magnification imaging.
このようなイメージセンサにおいて、発光素子１０から
発する光が受光素子１１に至るまでの過程は第２図の場
合と略同一なので、その動作の説明は省略する。In such an image sensor, since the process of the light emitted from the light emitting element 10 reaching the light receiving element 11 is substantially the same as that in the case of FIG. 2, the description of the operation is omitted.
次に、上記イメージセンサの組立てにつき説明する。ま
ず、例えばセラミックから成る基板１２上に発光素子１
０となるＬＥＤチップ及び受光素子１１となるＩＣチッ
プを接着剤にて固定する。次いで、より小さな面積に発
光素子１０及び受光素子１１を搭載することが可能にな
った基板１２及びロッドレンズアレイ１４さらに、光透
過板４をフレーム１５に取付ける。Next, the assembly of the image sensor will be described. First, the light emitting element 1 is formed on the substrate 12 made of, for example, ceramic.
The LED chip that becomes 0 and the IC chip that becomes the light receiving element 11 are fixed with an adhesive. Next, the substrate 12 and the rod lens array 14 on which the light emitting element 10 and the light receiving element 11 can be mounted in a smaller area and the light transmitting plate 4 are attached to the frame 15.
このような組立てにおいては、第２図の如く、基板８，
９に分割して取付けを行なう必要がなく、一枚の基板１
２のみの取付けを行なうだけでよいので組立て工数を削
減することができる。In such an assembly, as shown in FIG.
There is no need to divide the board into 9 parts for mounting, and a single board 1
Since it is necessary to attach only two, the number of assembling steps can be reduced.
また、第２図の場合とは逆に、受光素子１１でなく発光
素子１０の方を読取り位置５ａの直下位置に配置し、ロ
ッドレンズアレイ１４を斜めに配設しているので、フレ
ーム１５の高さを小さくすることができる。したがっ
て、装置の小型化に関する要請を満足させることができ
る。Contrary to the case of FIG. 2, the light emitting element 10 instead of the light receiving element 11 is arranged directly below the reading position 5a, and the rod lens array 14 is obliquely arranged. The height can be reduced. Therefore, it is possible to satisfy the demand for miniaturization of the device.
なお、上記実施例では発光素子１０と受光素子１１のチ
ップをそれぞれ別個に形成した後基板１２上に搭載する
場合について示したが、アモルファスシリコンを用いて
基板１２上に受光素子１１を形成した後、発光素子１０
のチップを搭載してもよく、上記実施例と同様の効果を
奏する。In the above embodiment, the case where the chips of the light emitting element 10 and the light receiving element 11 are separately formed and then mounted on the substrate 12 is described. However, after the light receiving element 11 is formed on the substrate 12 using amorphous silicon. , Light emitting element 10
The chip may be mounted, and the same effect as that of the above-described embodiment is obtained.
また、上記実施例では発光素子１０と受光素子１１間に
光遮蔽板１３を設けた場合について説明したが、発光素
子１０の発光が直接受光素子１１に受光されなければ、
光遮蔽板１３を設けなくともよく、フレーム１５の一部
が光遮蔽板となるよう部分的に加工して、イメージセン
サに構成してもよい。Further, in the above embodiment, the case where the light shielding plate 13 is provided between the light emitting element 10 and the light receiving element 11 has been described, but if the light emission of the light emitting element 10 is not directly received by the light receiving element 11,
The light shielding plate 13 may not be provided, and a part of the frame 15 may be partially processed to serve as a light shielding plate to form an image sensor.
以上のように、この発明によれば、発光素子と受光素子
とを同一基板上に配設し、ロッドレンズアレイを傾斜さ
せる構成としたので、組立て工数の削減及び小型化を図
ることができるという効果がある。As described above, according to the present invention, since the light emitting element and the light receiving element are arranged on the same substrate and the rod lens array is tilted, the number of assembling steps can be reduced and the size can be reduced. effective.
第１図はこの発明の一実施例によるイメージセンサを示
す断面図、第２図は従来のイメージセンサを示す断面図
である。 ４は光透過板、５は原稿、５ａは読取り位置、１０は発
光素子、１１は受光素子、１２は基板、１４はロッドレ
ンズアレイである。なお、図中、同一符号は同一、又は
相当部分を示す。FIG. 1 is a sectional view showing an image sensor according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional image sensor. Reference numeral 4 is a light transmitting plate, 5 is a document, 5a is a reading position, 10 is a light emitting element, 11 is a light receiving element, 12 is a substrate, and 14 is a rod lens array. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
対して発光動作を行なう発光素子と、上記読取り位置で
反射した光をロッドレンズアレイを介して受光する受光
素子とを備えたイメージセンサにおいて、上記読取り位
置の直下位置に上記発光素子を配置すると共に、該発光
素子と上記読取り位置とをむすぶ直線に対し上記ロッド
レンズアレイを傾斜させて配設し、かつ該発光素子と上
記受光素子とを同一基板上に配設したことを特徴とする
イメージセンサ。1. An image provided with a light emitting element for emitting light to a reading position of an original moving on a light transmitting plate, and a light receiving element for receiving light reflected at the reading position via a rod lens array. In the sensor, the light emitting element is arranged immediately below the reading position, the rod lens array is inclined with respect to a straight line connecting the light emitting element and the reading position, and the light emitting element and the light receiving element are arranged. An image sensor characterized in that an element and an element are arranged on the same substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62051664A JPH0614656B2 (en) | 1987-03-06 | 1987-03-06 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62051664A JPH0614656B2 (en) | 1987-03-06 | 1987-03-06 | Image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63217870A JPS63217870A (en) | 1988-09-09 |
| JPH0614656B2 true JPH0614656B2 (en) | 1994-02-23 |
Family
ID=12893146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62051664A Expired - Fee Related JPH0614656B2 (en) | 1987-03-06 | 1987-03-06 | Image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0614656B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5214471A (en) * | 1989-05-22 | 1993-05-25 | Xerox Corporation | Background monitoring device |
| JP3118016B2 (en) * | 1990-07-06 | 2000-12-18 | 株式会社リコー | Image reading device |
| JPH04233863A (en) * | 1990-12-28 | 1992-08-21 | Rohm Co Ltd | Image sensor |
| JP3096171B2 (en) * | 1991-09-30 | 2000-10-10 | ローム株式会社 | Image sensor and electronic device incorporating the same |
| US6014231A (en) * | 1992-09-09 | 2000-01-11 | Rohm Co., Ltd. | Image sensor |
-
1987
- 1987-03-06 JP JP62051664A patent/JPH0614656B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63217870A (en) | 1988-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6472247B1 (en) | Solid-state imaging device and method of production of the same | |
| JP3507284B2 (en) | Rod lens array, contact image sensor and image reading device | |
| CN103179313B (en) | Image sensor cell, image read-out and image processing system | |
| JPS62272655A (en) | Picture reader | |
| JPH06273602A (en) | Contact image sensor | |
| JPH0614656B2 (en) | Image sensor | |
| JP2968662B2 (en) | Reading / printing head | |
| JP3114666U (en) | Contact image sensor module with motion detection function | |
| US7576895B2 (en) | Light-guide module having light shielding structure | |
| JPH0612920B2 (en) | Image sensor | |
| JPH0961239A (en) | Light-quantity detecting member and image input device mounting this member | |
| JPH04233863A (en) | Image sensor | |
| JP2537805B2 (en) | Color imaging device | |
| JP2001339574A (en) | Image reader | |
| JP2502129B2 (en) | Image sensor | |
| JP5118083B2 (en) | Dual mirror lighting system for book copier | |
| JP3085641B2 (en) | Image input device | |
| JPS6063957A (en) | Image sensor | |
| KR0145335B1 (en) | Image sensor | |
| JPH05344277A (en) | Complete contact-type image sensor | |
| JP3065649B2 (en) | Image reading illumination device and image reading device | |
| JPS62296652A (en) | Image reader | |
| JP2002010002A (en) | Image reader | |
| US20030025950A1 (en) | Contact type image sensor | |
| JPS63133757A (en) | Image sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |