JPH06142971A - Under water machining device provided with ultraviolet pulse laser beam - Google Patents
Under water machining device provided with ultraviolet pulse laser beamInfo
- Publication number
- JPH06142971A JPH06142971A JP4295537A JP29553792A JPH06142971A JP H06142971 A JPH06142971 A JP H06142971A JP 4295537 A JP4295537 A JP 4295537A JP 29553792 A JP29553792 A JP 29553792A JP H06142971 A JPH06142971 A JP H06142971A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- water
- laser beam
- laser light
- dust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、紫外パルスレーザ光を
用いた水中加工装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an underwater processing apparatus using ultraviolet pulsed laser light.
【０００２】[0002]
【従来の技術】紫外パルスレーザ光、例えばエキシマレ
ーザ光は、ＸｅＣｌ* ，ＫｒＦ* （＊印は励起状態を示
す）などの励起状態の分子（エキシマ分子）が励起状態
から基底状態に戻るときに発生する波長の短い紫外光で
あり、フォトンエネルギーが大きい特徴を有している。
よって分子鎖の直接切断による熱影響の少ない加工が可
能となり、ＦＲＰ、半導体材料などの微細加工、例えば
穴開け、切断等に適している。2. Description of the Related Art Ultraviolet pulsed laser light such as excimer laser light is used when molecules in an excited state (excimer molecule) such as XeCl * , KrF * (* indicates an excited state) return from the excited state to the ground state. It is an ultraviolet light with a short wavelength to be generated, and has a feature that the photon energy is large.
Therefore, it is possible to perform processing with less thermal influence due to direct cutting of molecular chains, and it is suitable for fine processing of FRP, semiconductor materials, etc., such as punching and cutting.
【０００３】[0003]
【発明が解決しようとする課題】しかし、かかる紫外パ
ルスレーザ光（以下、単にレーザ光という）を用いた従
来の微細加工では、例えばＦＲＰ等の被加工物に穴開け
や切断を行うと、被加工物の加工部分が瞬間的に外部に
飛散するため、飛散した被加工物の屑（ダスト）が被加
工物の表面を覆い、レーザ光がこのダストにより散乱、
吸収され、加工部分まで到達するレーザ光のエネルギー
密度が小さくなる問題点があった。また、飛散した被加
工物の屑（ダスト）はレーザ光を集光するレンズにも付
着し、レンズの透過性が損なわれる問題点があった。However, in the conventional fine processing using such ultraviolet pulsed laser light (hereinafter, simply referred to as laser light), when a workpiece such as FRP is punched or cut, Since the processed part of the work is instantaneously scattered to the outside, the scattered scraps (dust) of the work cover the surface of the work, and the laser light is scattered by this dust.
There is a problem that the energy density of the laser light that is absorbed and reaches the processed portion becomes small. Further, the scattered dust of the work piece adheres to the lens that condenses the laser light, and there is a problem that the transparency of the lens is impaired.
【０００４】更に、レーザ光を集光するレンズがレーザ
光の一部を吸収して高温になり変形したり透過率が低下
する問題点があった。また、被加工物自体もレーザ光の
照射により高温になり、変形や炭化が生じる問題点もあ
った。これらの問題点を解決するため、従来の加工で
は、不活性ガス等を被加工物とレンズの表面に吹き付け
ているが、ダストがガス中に飛散するため十分なダスト
除去はできず、また冷却効果もレンズや被加工物の表面
部のみであり、十分な冷却ができなかった。その上、ガ
スによりダストが被加工面に衝突したり、ガス自体の圧
力により被加工面の表面に傷が付く問題点があった。Further, there is a problem that the lens for condensing the laser light absorbs a part of the laser light and becomes high temperature to be deformed or the transmittance is lowered. Further, there is a problem in that the workpiece itself also becomes high temperature by the irradiation of the laser beam and is deformed or carbonized. In order to solve these problems, in the conventional processing, an inert gas or the like is sprayed on the surface of the workpiece and the lens, but since dust is scattered in the gas, sufficient dust cannot be removed and cooling is performed. The effect was only on the surface of the lens and the workpiece, and sufficient cooling was not possible. In addition, the gas causes dust to collide with the surface to be processed, and the pressure of the gas itself damages the surface of the surface to be processed.
【０００５】本発明は、かかる問題点を解決するために
創案されたものである。すなわち、本発明の第１の目的
は、被加工物の屑（ダスト）を被加工物とレンズ間の光
路上から効率よく除去することができ、ダストによるレ
ーザ光の散乱、吸収を低減し、レンズ等へのダストの付
着とダストによる傷を防止することができる紫外パルス
レーザ光を用いた水中加工装置を提供することにある。
更に、本発明の第２の目的は、レンズと被加工物の両方
を十分に冷却することができる紫外パルスレーザ光を用
いた水中加工装置を提供することにある。The present invention was devised to solve such problems. That is, the first object of the present invention is to efficiently remove dust (dust) from the workpiece from the optical path between the workpiece and the lens, and reduce scattering and absorption of laser light due to dust, An object of the present invention is to provide an underwater processing apparatus using an ultraviolet pulsed laser beam capable of preventing dust from adhering to a lens or the like and damage caused by the dust.
Further, a second object of the present invention is to provide an underwater processing apparatus using an ultraviolet pulsed laser beam capable of sufficiently cooling both the lens and the workpiece.
【０００６】[0006]
【課題を解決するための手段】本発明によれば、紫外パ
ルスレーザ光を発生するレーザ発振器と、紫外パルスレ
ーザ光を焦点に集光するレンズと、前記レーザ発振器と
前記レンズとの間の光路を気密に囲み、内部が不活性ガ
スで満たされた導入光ダクトと、前記レーザ光の焦点に
被加工物の加工部分を位置決めする移動テーブルと、前
記レンズと被加工物との間を水密に囲む加工ハウジング
と、被加工物の加工部分に沿って前記レンズと被加工物
との間に水を流通させる水流通装置と、からなることを
特徴とする紫外パルスレーザ光を用いた水中加工装置が
提供される。According to the present invention, a laser oscillator for generating an ultraviolet pulsed laser beam, a lens for focusing the ultraviolet pulsed laser beam on a focal point, and an optical path between the laser oscillator and the lens are provided. Airtightly enclosing, the introduction light duct whose interior is filled with an inert gas, the moving table for positioning the processed portion of the workpiece at the focus of the laser light, and the watertight between the lens and the workpiece. An underwater processing apparatus using an ultraviolet pulsed laser beam, comprising: a surrounding processing housing; and a water circulating device for circulating water between the lens and the workpiece along a processed portion of the workpiece. Will be provided.
【０００７】前記水の流通は、渦や泡が発生しない最大
速度である。更に、前記水流通装置は、加工ハウジング
内に水を供給するための吐出口と、被加工物の加工部分
を通過した水を加工ハウジング外に排出するための排出
口と、水を排出口から吐出口まで循環させる循環ポンプ
と、排出口と循環ポンプとの間に設けられダストを除去
するフィルタとからなるのがよい。The water flow is at a maximum speed at which vortices and bubbles are not generated. Further, the water distribution device has a discharge port for supplying water into the processing housing, a discharge port for discharging water that has passed through the processed portion of the workpiece to the outside of the processing housing, and a water discharge port. It is preferable that it includes a circulation pump that circulates to the discharge port and a filter that is provided between the discharge port and the circulation pump to remove dust.
【０００８】[0008]
【作用】本発明の発明者は、被加工物の表面に水流を発
生させ、その水流を通して紫外パルスレーザ光を照射す
ると、ガス中の通常の場合よりも効率良く加工できると
いう知見を得ている。この原因は、水滴によりダストの
飛散が少なくなり、レーザ光のダストによる散乱や吸収
が低減したためと想定される。また、紫外パルスレーザ
光は水にほとんど吸収されないため、水中で被加工物を
加工しても、レーザ光のエネルギー密度の低下はほとん
どなく、良好な加工ができることがわかった。本発明は
かかる新規の知見に基ずくものである。The inventor of the present invention has found that when a water stream is generated on the surface of a workpiece and an ultraviolet pulsed laser beam is irradiated through the water stream, the processing can be performed more efficiently than in the normal case in gas. . It is presumed that the cause of this is that the scattering of dust due to water droplets is reduced and the scattering and absorption of laser light by dust is reduced. Further, since the ultraviolet pulsed laser light is hardly absorbed by water, it was found that even if the workpiece is processed in water, the energy density of the laser light is hardly reduced and good processing can be performed. The present invention is based on this novel finding.
【０００９】すなわち、上記本発明の構成によれば、本
発明による紫外パルスレーザ光を用いた水中加工装置
は、紫外パルスレーザ光を発生するレーザ発振器と、紫
外パルスレーザ光を焦点に集光するレンズと、前記レー
ザ発振器と前記レンズとの間の光路を気密に囲み、内部
が不活性ガスで満たされた導入光ダクトと、前記レーザ
光の焦点に被加工物の加工部分を位置決めする移動テー
ブルと、前記レンズと被加工物との間を水密に囲む加工
ハウジングと、被加工物の加工部分に沿って前記レンズ
と被加工物との間に水を流通させる水流通装置とからな
るので、被加工物の加工部分は常に加工部分に沿って流
通する水で覆われている。上述のように紫外パルスレー
ザ光は水にほとんど吸収されないため、レンズで集光さ
れたレーザ光の焦点では、エネルギー密度の低下はほと
んどなく、ＦＲＰ等の被加工物の加工部分を瞬間的に飛
散させることができる。飛散した被加工物すなわちダス
トは従来と同様に被加工物の外に飛び出すが、水の密度
はガスに較べて大きいため、ダストは水中にあまり飛散
せず、被加工物の表面付近で水流により流される。従っ
て水のダストによる汚染は被加工物の表面付近に限ら
れ、レーザ光はダストによりほとんど散乱、吸収され
ず、加工部分までエネルギー密度を保持したまま到達す
ることができる。また、被加工物から間隔を隔てたレン
ズまでダストが到達することはほとんどなく、レンズに
ダストが付着してレンズの透過性が損なわれることはな
い。また、水が被加工物の加工部分に沿って前記レンズ
と被加工物との間を流れるので、レンズと被加工物の表
面が常に新しい水で洗い流され、レンズへのダストの付
着やダストによる傷を防ぐことができる。That is, according to the above configuration of the present invention, the underwater processing apparatus using the ultraviolet pulsed laser light according to the present invention focuses the ultraviolet pulsed laser light on the laser oscillator for generating the ultraviolet pulsed laser light. A lens, an introduction light duct that hermetically surrounds the optical path between the laser oscillator and the lens, and the inside of which is filled with an inert gas, and a moving table that positions a processed portion of the workpiece at the focus of the laser light. And a processing housing that surrounds the lens and the work piece in a water-tight manner, and a water circulating device that circulates water between the lens and the work piece along the processed portion of the work piece, The processed part of the work piece is always covered with water flowing along the processed part. As described above, since the ultraviolet pulsed laser light is hardly absorbed by water, there is almost no decrease in energy density at the focus of the laser light focused by the lens, and the processed portion of the workpiece such as FRP is momentarily scattered. Can be made. The scattered work pieces, that is, dust, jumps out of the work piece as in the past, but since the density of water is higher than that of gas, the dust does not scatter much in the water, and due to the water flow near the surface of the work piece. Shed Therefore, the contamination by water dust is limited to the vicinity of the surface of the workpiece, the laser light is hardly scattered and absorbed by the dust, and can reach the processed portion while maintaining the energy density. Further, the dust hardly reaches the lens at a distance from the workpiece, and the dust does not adhere to the lens to impair the transparency of the lens. In addition, since water flows between the lens and the work piece along the processed portion of the work piece, the surfaces of the lens and the work piece are always rinsed with fresh water, which may cause dust to adhere to the lens or dust. Can prevent scratches.
【００１０】更に、水は被加工物の加工部分に沿って前
記レンズと被加工物との間を流通するので、レンズと被
加工物の両方を直接水で冷却することができる。Further, since water flows between the lens and the workpiece along the processed portion of the workpiece, both the lens and the workpiece can be directly cooled with water.
【００１１】[0011]
【実施例】以下に本発明の好ましい実施例を図面を参照
して説明する。図１は本発明による紫外パルスレーザ光
を用いた水中加工装置の全体構成図である。図１におい
て、本発明による水中加工装置は、紫外パルスレーザ光
１を発生するレーザ発振器１０と、紫外パルスレーザ光
１を焦点２に集光するレンズ１２と、レーザ発振器１０
とレンズ１２との間の光路を気密に囲み、内部が不活性
ガスで満たされた導入光ダクト１４と、レーザ光１の焦
点２に被加工物３の加工部分を位置決めする移動テーブ
ル１６と、レンズ１２と被加工物３との間を水密に囲む
加工ハウジング１８と、被加工物３の加工部分に沿って
レンズ１２と被加工物３との間に水を流通させる水流通
装置２０とからなる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an overall configuration diagram of an underwater processing apparatus using an ultraviolet pulsed laser beam according to the present invention. 1, an underwater processing apparatus according to the present invention includes a laser oscillator 10 that generates an ultraviolet pulsed laser beam 1, a lens 12 that focuses the ultraviolet pulsed laser beam 1 on a focal point 2, and a laser oscillator 10.
An optical path between the lens 12 and the lens 12 in an airtight manner, the inside of which is filled with an inert gas, the introduction light duct 14, and a moving table 16 which positions the processing portion of the workpiece 3 at the focal point 2 of the laser light 1. From a processing housing 18 that surrounds the lens 12 and the work piece 3 in a watertight manner, and a water circulation device 20 that circulates water between the lens 12 and the work piece 3 along the processed portion of the work piece 3. Become.
【００１２】レーザ発振器１０は、例えばエキシマレー
ザ発振器であり、２４８ｎｍ、２８２ｎｍ、３０８ｎｍ
等の波長の紫外パルスレーザ光を発生する。かかる紫外
パルスレーザ光は、数ｃｍの厚さの水に対して９９％以
上が透過し、実質的にほとんど吸収されない。導入光ダ
クト１４は、例えば図示のように水平部と垂直部より構
成され、水平部と垂直部の交差部分には反射ミラー１５
が４５度の角度で設けられている。これにより水平に放
射されたレーザ光１を反射ミラー１５で垂直方向に変向
することができる。また、導入光ダクト１４の内部の不
活性ガスは、例えばＡｒ（アルゴン）、Ｈｅ（ヘリウ
ム）、Ｎ2 （窒素）である。これにより、エキシマレー
ザ光の減衰を最小限にすることができる。また、経済的
にはＮ2 を用いることにより、運転費用を低減すること
ができる。なお、不活性ガスは、導入光ダクト１４内に
封入（密封）してもよく、或いは流通させて流してもよ
い。The laser oscillator 10 is, for example, an excimer laser oscillator, and is 248 nm, 282 nm, 308 nm.
Generates an ultraviolet pulsed laser beam of the same wavelength. Such ultraviolet pulsed laser light transmits 99% or more of water having a thickness of several cm and is substantially not absorbed. The introduction light duct 14 is composed of, for example, a horizontal portion and a vertical portion as shown in the drawing, and a reflection mirror 15 is provided at the intersection of the horizontal portion and the vertical portion.
Are provided at an angle of 45 degrees. As a result, the laser light 1 emitted horizontally can be deflected in the vertical direction by the reflection mirror 15. The inert gas inside the introduction light duct 14 is, for example, Ar (argon), He (helium), or N 2 (nitrogen). Thereby, the attenuation of the excimer laser light can be minimized. Further, economically, the operating cost can be reduced by using N 2 . The inert gas may be enclosed (sealed) in the introduction light duct 14 or may be circulated.
【００１３】図１の実施例において、水流通装置２０
は、加工ハウジング１８内に水を供給するための吐出口
２２と、被加工物３の加工部分を通過した水を加工ハウ
ジング１８の外に排出するための排出口２４と、水を排
出口２４から吐出口２２まで循環させる循環ポンプ２６
と、排出口２４と循環ポンプ２６との間に設けられダス
トを除去するフィルタ２８とからなる。In the embodiment of FIG. 1, the water distribution device 20
Is a discharge port 22 for supplying water into the processing housing 18, a discharge port 24 for discharging water that has passed through the processed portion of the workpiece 3 to the outside of the processing housing 18, and a water discharge port 24. Circulation pump 26 that circulates from the discharge port 22 to the discharge port 22
And a filter 28 provided between the outlet 24 and the circulation pump 26 for removing dust.
【００１４】また、渦や泡が発生すると、レーザ光１が
水中で散乱、屈折し、焦点２におけるレーザ光のエネル
ギー密度が低下する。一方、水の密度はガスに比較して
大きいため、水の流速は小さくてもダストを効率よく除
去することができる。冷却効果を高めるため、水の流通
は、渦や泡が発生しない最大速度であるのがよい。ま
た、水の循環経路の途中、例えば吐出口２２の上流に適
当な整流装置２３を備えてもよい。更に、この整流装置
２３内に渦や泡を除去する装置を備えてもよい。When a vortex or a bubble is generated, the laser light 1 is scattered and refracted in water, and the energy density of the laser light at the focal point 2 is lowered. On the other hand, since the density of water is higher than that of gas, dust can be efficiently removed even if the flow velocity of water is low. In order to enhance the cooling effect, the flow of water should be at the maximum speed at which eddies and bubbles do not occur. Further, a suitable rectifying device 23 may be provided in the middle of the water circulation path, for example, upstream of the discharge port 22. Further, a device for removing vortices and bubbles may be provided in the rectifying device 23.
【００１５】なお、本発明かかかる構成に限定されず、
例えば水を循環させず、ワンスルーで用いる水流通装置
であってもよい。これにより、循環ポンプやフィルタを
簡略化或いは省略することができる。The present invention is not limited to such a configuration,
For example, it may be a water circulation device that is used in one-through without circulating water. Thereby, the circulation pump and the filter can be simplified or omitted.
【００１６】[0016]
【発明の効果】上述したように、本発明の構成によれ
ば、本発明による紫外パルスレーザ光を用いた水中加工
装置は、紫外パルスレーザ光を発生するレーザ発振器
と、紫外パルスレーザ光を焦点に集光するレンズと、前
記レーザ発振器と前記レンズとの間の光路を気密に囲
み、内部が不活性ガスで満たされた導入光ダクトと、前
記レーザ光の焦点に被加工物の加工部分を位置決めする
移動テーブルと、前記レンズと被加工物との間を水密に
囲む加工ハウジングと、被加工物の加工部分に沿って前
記レンズと被加工物との間に水を流通させる水流通装置
とからなるので、被加工物の加工部分は常に加工部分に
沿って流通する水で覆われている。上述のように紫外パ
ルスレーザ光は水にほとんど吸収されないため、レンズ
で集光されたレーザ光の焦点では、エネルギー密度の低
下はほとんどなく、ＦＲＰ等の被加工物の加工部分を瞬
間的に飛散させることができる。飛散した被加工物すな
わちダストは従来と同様に被加工物の外に飛び出すが、
水の密度はガスに較べて大きいため、ダストは水中にあ
まり飛散せず、被加工物の表面付近で水流により流され
る。従って水のダストによる汚染は被加工物の表面付近
に限られ、レーザ光はダストによりほとんど散乱、吸収
されず、加工部分までエネルギー密度を保持したままレ
ーザ光は到達することができる。また、被加工物から間
隔を隔てたレンズまでダストが到達することはほとんど
なく、レンズにダストが付着せずレンズの透過性が損な
われることはない。また、水が被加工物の加工部分に沿
って前記レンズと被加工物との間を流れるので、レンズ
と被加工物の表面が常に新しい水で洗い流され、レンズ
へのダストの付着やダストによる傷を防ぐことができ
る。As described above, according to the configuration of the present invention, the underwater processing apparatus using the ultraviolet pulsed laser light according to the present invention focuses the ultraviolet pulsed laser light on the laser oscillator for generating the ultraviolet pulsed laser light. A lens for converging on, an optical path between the laser oscillator and the lens that is hermetically enclosed, and an introduction light duct whose inside is filled with an inert gas, and a processed portion of the workpiece at the focus of the laser light. A moving table for positioning, a processing housing that watertightly surrounds the lens and the work piece, and a water circulation device that circulates water between the lens and the work piece along a processed portion of the work piece. Therefore, the processed portion of the workpiece is always covered with water flowing along the processed portion. As described above, since the ultraviolet pulsed laser light is hardly absorbed by water, there is almost no decrease in energy density at the focus of the laser light focused by the lens, and the processed portion of the workpiece such as FRP is momentarily scattered. Can be made. The scattered work piece, that is, dust, jumps out of the work piece as in the conventional case,
Since the density of water is higher than that of gas, dust does not scatter much in water and is washed away by the water flow near the surface of the work piece. Therefore, contamination by water dust is limited to the vicinity of the surface of the workpiece, the laser light is hardly scattered and absorbed by the dust, and the laser light can reach the processed portion while maintaining the energy density. Further, the dust hardly reaches the lens spaced apart from the work piece, and the dust does not adhere to the lens and the transparency of the lens is not impaired. In addition, since water flows between the lens and the work piece along the processed portion of the work piece, the surfaces of the lens and the work piece are always rinsed with fresh water, which may cause dust to adhere to the lens or dust. Can prevent scratches.
【００１７】更に、水は被加工物の加工部分に沿って前
記レンズと被加工物との間を流通するので、レンズと被
加工物の両方を直接水で冷却することができる。Furthermore, since water circulates between the lens and the workpiece along the processed portion of the workpiece, both the lens and the workpiece can be directly cooled with water.
【００１８】従って、本発明の紫外パルスレーザ光を用
いた水中加工装置によれば、被加工物の屑（ダスト）を
被加工物の表面から効率よく除去することができ、ダス
トによるレーザ光の散乱、吸収を低減し、レンズへのダ
ストの付着とダストによる傷を防止することができ、更
に、レンズと被加工物の両方を十分に冷却することがで
きる。Therefore, according to the underwater processing apparatus using the ultraviolet pulsed laser beam of the present invention, the dust (dust) of the workpiece can be efficiently removed from the surface of the workpiece, and the laser beam of the dust It is possible to reduce scattering and absorption, prevent dust from adhering to the lens and prevent scratches due to the dust, and further, it is possible to sufficiently cool both the lens and the workpiece.
【図１】本発明による紫外パルスレーザ光を用いた水中
加工装置の全体構成図である。FIG. 1 is an overall configuration diagram of an underwater processing apparatus using an ultraviolet pulsed laser beam according to the present invention.
１ 紫外パルスレーザ光 ２ 焦点 ３ 被加工物 １０ レーザ発振器 １２ レンズ １４ 導入光ダクト １５ 反射ミラー １６ 移動テーブル １８ 加工ハウジング ２０ 水流通装置 ２２ 吐出口 ２３ 整流装置 ２４ 排出口 ２６ 循環ポンプ ２８ フィルタ 1 Ultraviolet Pulsed Laser Light 2 Focus 3 Workpiece 10 Laser Oscillator 12 Lens 14 Introducing Light Duct 15 Reflecting Mirror 16 Moving Table 18 Processing Housing 20 Water Distribution Device 22 Discharge Port 23 Rectifier 24 Circulation Pump 28 Filter
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山口 滋 神奈川県横浜市磯子区新中原町１ 石川島 播磨重工業株式会社技術研究所内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Shigeru Yamaguchi 1 Shin-Nakahara-cho, Isogo-ku, Yokohama-shi, Kanagawa Ishikawajima Harima Heavy Industries Co., Ltd.
Claims (3)
振器と、 紫外パルスレーザ光を焦点に集光するレンズと、 前記レーザ発振器と前記レンズとの間の光路を気密に囲
み、内部が不活性ガスで満たされた導入光ダクトと、 前記レーザ光の焦点に被加工物の加工部分を位置決めす
る移動テーブルと、 前記レンズと被加工物との間を水密に囲む加工ハウジン
グと、 被加工物の加工部分に沿って前記レンズと被加工物との
間に水を流通させる水流通装置と、からなることを特徴
とする紫外パルスレーザ光を用いた水中加工装置。1. A laser oscillator that generates ultraviolet pulsed laser light, a lens that focuses ultraviolet pulsed laser light on a focal point, an optical path between the laser oscillator and the lens is hermetically enclosed, and an inert gas is provided inside. An introduction light duct filled with, a moving table that positions a processing portion of the workpiece at the focus of the laser light, a processing housing that watertightly surrounds between the lens and the processing object, and processing of the processing object An underwater processing device using ultraviolet pulsed laser light, comprising: a water circulating device for circulating water along the portion between the lens and the workpiece.
大速度で水流発生が可能である、ことを特徴とする請求
項１に記載の紫外パルスレーザ光を用いた水中加工装
置。2. The underwater processing apparatus using the ultraviolet pulsed laser light according to claim 1, wherein the water flow is capable of generating a water flow at a maximum speed at which vortices and bubbles are not generated.
水を供給するための吐出口と、被加工物の加工部分を通
過した水を加工ハウジング外に排出するための排出口
と、水を排出口から吐出口まで循環させる循環ポンプ
と、排出口と循環ポンプとの間に設けられダストを除去
するフィルタと、からなることを特徴とする請求項１に
記載の紫外パルスレーザ光を用いた水中加工装置。3. The water circulation device comprises a discharge port for supplying water into the processing housing, a discharge port for discharging water that has passed through the processed portion of the workpiece to the outside of the processing housing, and a water outlet. The ultraviolet pulsed laser beam according to claim 1, comprising a circulation pump that circulates from the discharge port to the discharge port, and a filter that is provided between the discharge port and the circulation pump to remove dust. Underwater processing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4295537A JPH06142971A (en) | 1992-11-05 | 1992-11-05 | Under water machining device provided with ultraviolet pulse laser beam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4295537A JPH06142971A (en) | 1992-11-05 | 1992-11-05 | Under water machining device provided with ultraviolet pulse laser beam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06142971A true JPH06142971A (en) | 1994-05-24 |
Family
ID=17821924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4295537A Pending JPH06142971A (en) | 1992-11-05 | 1992-11-05 | Under water machining device provided with ultraviolet pulse laser beam |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06142971A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003506216A (en) * | 1999-08-03 | 2003-02-18 | イクシィル・テクノロジー・リミテッド | Circuit singulation system and method |
| JP2007537881A (en) * | 2004-05-19 | 2007-12-27 | シノヴァ エスアー | Laser machining of workpieces |
| CN102166686A (en) * | 2010-02-26 | 2011-08-31 | 三菱综合材料株式会社 | Laser processing device and laser processing method |
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-
1992
- 1992-11-05 JP JP4295537A patent/JPH06142971A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003506216A (en) * | 1999-08-03 | 2003-02-18 | イクシィル・テクノロジー・リミテッド | Circuit singulation system and method |
| JP2007537881A (en) * | 2004-05-19 | 2007-12-27 | シノヴァ エスアー | Laser machining of workpieces |
| CN102166686A (en) * | 2010-02-26 | 2011-08-31 | 三菱综合材料株式会社 | Laser processing device and laser processing method |
| JP2011177738A (en) * | 2010-02-26 | 2011-09-15 | Mitsubishi Materials Corp | Laser beam machining apparatus and laser beam machining method |
| JP2012006064A (en) * | 2010-06-28 | 2012-01-12 | Mitsuboshi Diamond Industrial Co Ltd | Method for machining workpiece, method for dividing workpiece and laser machining apparatus |
| WO2012114923A1 (en) * | 2011-02-21 | 2012-08-30 | 株式会社奈良機械製作所 | Liquid phase laser ablation method and device |
| US9339891B2 (en) | 2011-02-21 | 2016-05-17 | Nara Machinery Co., Ltd. | Liquid phase laser ablation method and apparatus |
| CN103894739A (en) * | 2014-03-26 | 2014-07-02 | 华中科技大学 | Method and device for etching and processing high-quality aluminum oxide ceramics |
| CN107932084A (en) * | 2017-11-30 | 2018-04-20 | 李嘉棋 | The cutting machine of physical education equipment |
| CN109967896A (en) * | 2019-03-27 | 2019-07-05 | 上海理工大学 | The hyperfine cutter device of short-pulse laser induced ultrasonic water flow plasma and method |
| CN113649714A (en) * | 2021-08-25 | 2021-11-16 | 江苏大学 | Liquid medium auxiliary temperature controllable and monitorable device |
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