JPH06132685A - Cooling water supply structure - Google Patents
Cooling water supply structureInfo
- Publication number
- JPH06132685A JPH06132685A JP4276902A JP27690292A JPH06132685A JP H06132685 A JPH06132685 A JP H06132685A JP 4276902 A JP4276902 A JP 4276902A JP 27690292 A JP27690292 A JP 27690292A JP H06132685 A JPH06132685 A JP H06132685A
- Authority
- JP
- Japan
- Prior art keywords
- cooling water
- water supply
- reservoir tank
- cooling
- floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コンピュータ等の発熱
を伴う機器を冷却するための冷却水供給構造に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling water supply structure for cooling a heat generating device such as a computer.
【０００２】コンピュータ等の電子機器においては、熱
による動作不良が大きな問題となるため、安定した冷却
システムが必要であるが、外部に接続される冷却水供給
装置は、発熱量の増大や室温の上昇等の外乱要因の影響
を受け、供給する冷却水の温度が変動し易く、そのよう
な外乱要因を吸収して安定した冷却を行うためには、処
理能力の大きな大型の冷却水供給装置が必要である。Electronic devices such as computers require a stable cooling system because malfunctions due to heat are a serious problem. However, a cooling water supply device connected to the outside requires an increase in the amount of heat generation and room temperature. The temperature of the cooling water to be supplied is likely to fluctuate under the influence of disturbance factors such as rise. In order to absorb such disturbance factors and perform stable cooling, a large cooling water supply device with a large processing capacity is required. is necessary.
【０００３】このような状況において、小型かつ安価な
構成で安定した冷却を行うことのできる冷却水供給構造
が求められている。Under such circumstances, there is a demand for a cooling water supply structure which is small in size and inexpensive in structure and can perform stable cooling.
【０００４】[0004]
【従来の技術】従来、冷却水供給構造は、図３に示すよ
うに、コンピュータ等の発熱を伴う機器１０と、その外
部に設置された冷却水供給装置２０とを接続パイプ３０
で接続して冷却水の供給ループを形成している。そし
て、接続パイプ３０は、可撓性を有する樹脂製パイプ材
よりなり、歩行等の妨げにならないように二重床５の床
下空間６に収納されている。2. Description of the Related Art Conventionally, as shown in FIG. 3, a cooling water supply structure connects a device 10 such as a computer, which generates heat, with a cooling water supply device 20 installed outside the connection pipe 30.
To form a cooling water supply loop. The connection pipe 30 is made of a flexible resin pipe material and is housed in the underfloor space 6 of the double floor 5 so as not to hinder walking or the like.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、冷却水
の供給ループが接続パイプ３０によって外部に露出して
いるため、外部温度の上昇等の外乱の影響を受け易く、
また、機器１０の発熱量が急激に増大するような場合、
即座に対応することができない。近年、コンピュータ等
に使用される半導体装置は、集積度や処理速度の向上の
ため、上記のような一時的な温度上昇に対しても、大き
な影響を受け、安定した動作に支障が生じるという問題
がある。However, since the cooling water supply loop is exposed to the outside by the connecting pipe 30, it is easily affected by disturbance such as increase in external temperature.
In addition, when the heat generation amount of the device 10 increases rapidly,
I cannot respond immediately. 2. Description of the Related Art In recent years, semiconductor devices used for computers and the like have a problem that, due to improvement in integration degree and processing speed, even temporary temperature rises as described above are greatly affected and stable operation is hindered. There is.
【０００６】そのため、冷却水供給装置２０は、一時的
な発熱量の増大や外部温度の上昇を考慮して、通常運転
の場合に必要な処理能力よりも、より高性能なものを接
続する必要があり、装置が大型化し、コスト高になると
いう問題がある。Therefore, in consideration of the temporary increase in the amount of heat generation and the rise in the external temperature, it is necessary to connect the cooling water supply device 20 with a higher performance than the processing capacity required in the normal operation. However, there is a problem that the device becomes large and the cost becomes high.
【０００７】従って、本発明の課題は、一時的な発熱量
の増大や外部温度の上昇を吸収して、安定した冷却水の
供給を、簡易な構造で行うことができる冷却水供給構造
を提供することにある。Therefore, an object of the present invention is to provide a cooling water supply structure capable of absorbing a temporary increase in the amount of heat generation and an increase in external temperature and stably supplying cooling water with a simple structure. To do.
【０００８】[0008]
【課題を解決するための手段】上記課題は、発熱を伴う
機器１の冷却部１１に冷却水を供給する冷却水供給装置
２を接続パイプ３で接続してなる冷却水供給構造におい
て、前記接続パイプ３の中間に、リザーバタンク４を設
け、かつ、前記リザーバタンク４を二重床５の床下空間
６に配置するとともに、前記リザーバタンク４の底壁部
４１を床基部７上面に接地させてなることを特徴とする
冷却水供給構造、によって達成される。SUMMARY OF THE INVENTION The above-mentioned problem is a cooling water supply structure in which a cooling water supply device 2 for supplying cooling water to a cooling unit 11 of a device 1 that generates heat is connected by a connection pipe 3. A reservoir tank 4 is provided in the middle of the pipe 3, the reservoir tank 4 is arranged in the underfloor space 6 of the double floor 5, and the bottom wall portion 41 of the reservoir tank 4 is grounded to the upper surface of the floor base 7. It is achieved by a cooling water supply structure.
【０００９】さらに、前記リザーバタンク４の底壁部４
１を、複数の金属製放熱部４２を柔軟性を有する可撓壁
部４３で連結して形成することによって、より効果的に
課題を達成することができる。Further, the bottom wall portion 4 of the reservoir tank 4
The object can be achieved more effectively by connecting the plurality of metal heat dissipating portions 42 with the flexible wall portion 43 having flexibility to form one.
【００１０】[0010]
【作用】すなわち、接続パイプ３の中間にリザーバタン
ク４を設けることにより、外乱要因によって、温度の上
昇した冷却水が接続パイプ３から熱容量の大きなリザー
バタンク４を通過して一時的に滞留することによって、
リザーバタンク４内の冷却水に放熱して冷却水の温度を
ほぼ通常時の設定温度に保つことができる。さらに、リ
ザーバータンク４は、熱容量がはるかに大きく外乱要因
の影響を無視できる床基部７にその底壁部４１を接地さ
せ、放熱することによって、リザーバタンク４内の冷却
水温度を一定に保つことができ、安定した冷却水の供給
が可能となる。That is, by providing the reservoir tank 4 in the middle of the connecting pipe 3, the cooling water whose temperature has risen due to disturbance factors passes from the connecting pipe 3 through the reservoir tank 4 having a large heat capacity and temporarily stays there. By
It is possible to radiate heat to the cooling water in the reservoir tank 4 to maintain the temperature of the cooling water at the set temperature of the normal time. Furthermore, the reservoir tank 4 keeps the temperature of the cooling water in the reservoir tank 4 constant by grounding the bottom wall portion 41 to the floor base portion 7 which has a much larger heat capacity and in which the influence of disturbance factors can be ignored and radiates heat. Therefore, stable cooling water can be supplied.
【００１１】また、前記リザーバタンク４の底壁部４１
に金属製の放熱部４２を形成し、可撓壁部４３で接続す
ることにより、熱伝導率の高い金属製放熱部４２を床基
部７の不陸に追随させて接触させることにより、効率良
くリザーバタンク４の放熱を行うことができる。A bottom wall portion 41 of the reservoir tank 4 is also provided.
By forming a metal heat dissipation part 42 on the flexible wall part 43 and connecting the metal heat dissipation part 42 with the flexible wall part 43, the metal heat dissipation part 42 having a high thermal conductivity is made to follow the unevenness of the floor base 7 and is brought into contact with it efficiently, The heat of the reservoir tank 4 can be dissipated.
【００１２】[0012]
【実施例】以下、本発明の望ましい実施例を添付図面に
基づいて詳細に説明する。本発明の冷却水供給構造は、
図１に示すように、コンピュータ等の発熱を伴う機器１
と、冷却水を機器１に供給するとともに、加熱された冷
却排水を再度冷却して還流させる冷却水供給装置２と
を、接続パイプ３によって接続して、機器１と冷却水供
給装置２との間に冷却ループを形成し、接続パイプ３の
中間には、リザーバタンク４を設けている。そして、機
器１及び冷却水供給装置２は二重床５上に設置され、接
続パイプ３及びリザーバータンク４は二重床５下部の床
下空間６に設置され、二重床上のスペースを有効に利用
できるようにしている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. The cooling water supply structure of the present invention is
As shown in FIG. 1, a device 1 such as a computer that generates heat
And a cooling water supply device 2 that supplies cooling water to the device 1 and cools and recirculates the heated cooling wastewater again by a connection pipe 3 to connect the device 1 and the cooling water supply device 2. A cooling loop is formed therebetween, and a reservoir tank 4 is provided in the middle of the connection pipe 3. The equipment 1 and the cooling water supply device 2 are installed on the double floor 5, the connection pipe 3 and the reservoir tank 4 are installed in the underfloor space 6 below the double floor 5, and the space on the double floor is effectively used. I am able to do it.
【００１３】機器１は、ＣＰＵ等の発熱部１２に冷却部
１１を設け、接続部パイプ３を冷却部１１に接続し、冷
却水を冷却部１１に送り込むことにより、発熱部１２を
冷却するようになっており、接続パイプ３は、機器１を
載置する二重床５に形成された設備用開口５１を通り、
機器１から床下空間６へ引き出されている。In the device 1, the heat generating portion 12 such as a CPU is provided with the cooling portion 11, the connecting pipe 3 is connected to the cooling portion 11, and the cooling water is sent to the cooling portion 11 to cool the heat generating portion 12. The connection pipe 3 passes through the facility opening 51 formed in the double floor 5 on which the device 1 is placed,
It is pulled out from the device 1 to the underfloor space 6.
【００１４】接続パイプ３は、可撓性を有する樹脂パイ
プより形成され、冷却水供給装置２から機器１へ冷却水
を供給する供給パイプ３１と、機器１から冷却水供給装
置２へ冷却後の排水を還流する還流パイプ３２によっ
て、ループを形成するもので、床下空間６において、少
なくとも還流パイプ３２には、その中間にリザーバタン
ク４を介在し、還流される冷却排水を一時的に、リザー
バタンク４内に滞留させるようになっている。The connection pipe 3 is formed of a flexible resin pipe, and has a supply pipe 31 for supplying cooling water from the cooling water supply device 2 to the equipment 1 and a cooling pipe from the equipment 1 to the cooling water supply equipment 2. A loop is formed by a reflux pipe 32 that recirculates the waste water, and in the underfloor space 6, a reservoir tank 4 is interposed at least in the middle of the reflux pipe 32, and the cooling waste water to be recirculated is temporarily stored in the reservoir tank. 4 is made to stay.
【００１５】リザーバタンク４は、接続パイプ３と同様
に、可撓性を有する樹脂材よりなる可撓壁部４３でその
主体部４４を形成している。主体部４４の断面積は、接
続パイプ３の断面積よりも、きわめて大きく形成されて
おり、還流パイプ３２を通過する加熱された冷却排水の
流速は、断面積に反比例し、リザーバータンク４内では
減速されて滞留し、その間に加熱された冷却排水の温度
を室温近くまで低下させる。Like the connecting pipe 3, the reservoir tank 4 has a main body 44 formed by a flexible wall 43 made of a flexible resin material. The cross-sectional area of the main body portion 44 is formed to be much larger than the cross-sectional area of the connection pipe 3, and the flow velocity of the heated cooling wastewater passing through the reflux pipe 32 is inversely proportional to the cross-sectional area and within the reservoir tank 4. It slows down and stays, and the temperature of the cooling waste water heated during that is lowered to near room temperature.
【００１６】さらに、リザーバタンク４は、偏平状に形
成されており、その底壁部４１をコンクリートスラブの
床基部７に接地するように設けられ、また図２に示すよ
うに、その底壁部４１には、複数に分割された金属製放
熱部４２が設けられ、この金属製放熱部４２が、床基部
７表面に接触するようになっている。金属性放熱部４２
は、熱伝導率の高い金属板材よりなり、可撓壁部４３に
よって複数枚に分割され、床基部７の不均一な表面仕上
げによって生じる不陸にも可能な限り追随して、接触面
積を大きくするようになっている。Further, the reservoir tank 4 is formed in a flat shape and is provided so that the bottom wall portion 41 thereof is grounded to the floor base portion 7 of the concrete slab, and, as shown in FIG. 2, the bottom wall portion thereof. 41 is provided with a plurality of divided metal heat dissipation portions 42, and the metal heat dissipation portions 42 are configured to contact the surface of the floor base 7. Metallic heat dissipation part 42
Is made of a metal plate material having a high thermal conductivity, and is divided into a plurality of sheets by the flexible wall portion 43. The contact area is increased by following the unevenness caused by the uneven surface finish of the floor base 7 as much as possible. It is supposed to do.
【００１７】従って、機器１において、発熱部１２の負
荷の増大や、ファン（図示せず）の故障等による冷却部
１１の異常によって、冷却水が通常の設定より過熱され
た場合でも、その冷却排水が過熱状態のまま直接に冷却
水供給装置２へ還流したりせず、リザーバタンク４に滞
留し、その間に底壁部４１から床基部７へ放熱され、通
常の設定温度まで冷却排水の温度を下げた状態で、冷却
水供給装置２へ還流される。Therefore, in the device 1, even when the cooling water is overheated from the normal setting due to an increase in the load of the heat generating portion 12 or an abnormality of the cooling portion 11 due to a failure of a fan (not shown) or the like, the cooling water is cooled. The waste water does not directly flow back to the cooling water supply device 2 in an overheated state, but stays in the reservoir tank 4 and radiates heat from the bottom wall portion 41 to the floor base portion 7 during that time, and the temperature of the cooling waste water reaches a normal set temperature. Is returned to the cooling water supply device 2 in a state where the temperature is lowered.
【００１８】床基部７は、熱容量が十分大きいため、上
記のような外乱要因を十分吸収できる。また、床下空間
６を空調ダクトととして利用する二重床構造において
は、より効果的に冷却排水の熱を放熱することができ、
冷却水供給装置２の負荷を減少することができる。Since the floor base 7 has a sufficiently large heat capacity, it can sufficiently absorb the above disturbance factors. Further, in the double-floor structure that uses the underfloor space 6 as an air conditioning duct, the heat of the cooling drainage can be radiated more effectively,
The load on the cooling water supply device 2 can be reduced.
【００１９】[0019]
【発明の効果】以上の説明から明らかなように、本発明
の冷却水供給構造によれば、一時的な外乱要因によっ
て、冷却水が過熱された場合でも、冷却ループ内のリザ
ーバタンクによって効率的に吸収することができるた
め、安定した冷却水供給構造を提供することができ、し
かも、冷却水供給装置の負荷を小さくして、安価かつ小
型化することができる。As is apparent from the above description, according to the cooling water supply structure of the present invention, even if the cooling water is overheated due to a temporary disturbance factor, the reservoir tank in the cooling loop can efficiently perform the operation. Therefore, a stable cooling water supply structure can be provided, and further, the load on the cooling water supply device can be reduced, and the cost and size can be reduced.
【図１】本発明の実施例を示す概要説明図である。FIG. 1 is a schematic explanatory view showing an embodiment of the present invention.
【図２】リザーバタンクの底面図である。FIG. 2 is a bottom view of a reservoir tank.
【図３】従来例を示す説明図である。FIG. 3 is an explanatory diagram showing a conventional example.
１ 機器 １１ 冷却部 ２ 冷却水供給装置 ３ 接続パイプ ４ リザーバタンク ４１ 底壁部 ４２ 金属製放熱部 ４３ 可撓壁部 ５ 二重床 ６ 床下空間 ７ 床基部 DESCRIPTION OF SYMBOLS 1 Equipment 11 Cooling part 2 Cooling water supply device 3 Connection pipe 4 Reservoir tank 41 Bottom wall part 42 Metal heat dissipation part 43 Flexible wall part 5 Double floor 6 Underfloor space 7 Floor base part
Claims (2)
水を供給する冷却水供給装置(2) を接続パイプ(3) で接
続してなる冷却水供給構造において、前記接続パイプ
(3) の中間に、リザーバタンク(4) を設け、かつ、前記
リザーバタンク(4) を二重床(5) の床下空間(6) に配置
するとともに、前記リザーバタンクの底壁部(41)を床基
部(7) 上面に接地させてなることを特徴とする冷却水供
給構造。1. A cooling water supply structure in which a cooling water supply device (2) for supplying cooling water to a cooling part (11) of a device (1) that generates heat is connected by a connection pipe (3). pipe
A reservoir tank (4) is provided in the middle of (3), the reservoir tank (4) is arranged in the underfloor space (6) of the double floor (5), and the bottom wall portion (41) of the reservoir tank (41) is arranged. ) Is grounded on the upper surface of the floor base (7), which is a cooling water supply structure.
は、複数の金属製放熱部(42)を柔軟性を有する可撓壁部
(43)で連結してなることを特徴とする請求項１記載の冷
却水供給構造。2. A bottom wall portion (41) of the reservoir tank (4)
Is a flexible wall part having flexibility for a plurality of metal heat dissipation parts (42).
The cooling water supply structure according to claim 1, wherein the cooling water supply structures are connected by (43).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4276902A JPH06132685A (en) | 1992-10-15 | 1992-10-15 | Cooling water supply structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4276902A JPH06132685A (en) | 1992-10-15 | 1992-10-15 | Cooling water supply structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06132685A true JPH06132685A (en) | 1994-05-13 |
Family
ID=17575982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4276902A Withdrawn JPH06132685A (en) | 1992-10-15 | 1992-10-15 | Cooling water supply structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06132685A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004215741A (en) * | 2003-01-10 | 2004-08-05 | Toshiba Medical System Co Ltd | X-ray ct equippment and heat dissipation system thereof |
| JP2010088949A (en) * | 2010-01-26 | 2010-04-22 | Toshiba Medical System Co Ltd | X-ray ct apparatus and heat dissipation system of x-ray ct apparatus |
| GB2603579A (en) * | 2020-10-29 | 2022-08-10 | Nvidia Corp | Coolant thermal buffer for datacenter cooling systems |
-
1992
- 1992-10-15 JP JP4276902A patent/JPH06132685A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004215741A (en) * | 2003-01-10 | 2004-08-05 | Toshiba Medical System Co Ltd | X-ray ct equippment and heat dissipation system thereof |
| JP4551621B2 (en) * | 2003-01-10 | 2010-09-29 | 株式会社東芝 | X-ray CT system heat release system |
| JP2010088949A (en) * | 2010-01-26 | 2010-04-22 | Toshiba Medical System Co Ltd | X-ray ct apparatus and heat dissipation system of x-ray ct apparatus |
| GB2603579A (en) * | 2020-10-29 | 2022-08-10 | Nvidia Corp | Coolant thermal buffer for datacenter cooling systems |
| GB2603579B (en) * | 2020-10-29 | 2023-03-15 | Nvidia Corp | Coolant thermal buffer for datacenter cooling systems |
| GB2612493A (en) * | 2020-10-29 | 2023-05-03 | Nvidia Corp | Coolant thermal buffer for datacenter cooling systems |
| GB2612493B (en) * | 2020-10-29 | 2024-02-07 | Nvidia Corp | Coolant thermal buffer for datacenter cooling systems |
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