JPH06132623A - Three-dimensional structure electronic component and manufacture thereof - Google Patents
Three-dimensional structure electronic component and manufacture thereofInfo
- Publication number
- JPH06132623A JPH06132623A JP4277122A JP27712292A JPH06132623A JP H06132623 A JPH06132623 A JP H06132623A JP 4277122 A JP4277122 A JP 4277122A JP 27712292 A JP27712292 A JP 27712292A JP H06132623 A JPH06132623 A JP H06132623A
- Authority
- JP
- Japan
- Prior art keywords
- side plate
- electronic component
- plates
- pair
- dimensional structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は上下方向に配列した電子
部品をプリント配線板で両側から挟んでなる三次元構造
電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a three-dimensional structure electronic component in which electronic components arranged vertically are sandwiched by printed wiring boards from both sides.
【０００２】現在、電子機器を小型化することが要望さ
れており、これに対応するため、電子部品をプリント配
線板上に高密度に実装する技術の開発が要望されてい
る。しかし、電子部品を平面的に配列して実装する伝統
的な実装技術では、大きさが限られたプリント配線板上
に実装できる部品数に限界がある。At present, there is a demand for miniaturization of electronic equipment, and in order to meet this demand, development of a technique for mounting electronic parts on a printed wiring board at a high density is demanded. However, there is a limit to the number of components that can be mounted on a printed wiring board having a limited size in the conventional mounting technology for arranging and mounting electronic components in a plane.
【０００３】そこで、立体的に配列した電子部品を比較
的に小型の一対のプリント配線板で挟んで構成される三
次元構造電子部品を、マザーボードに実装して高密度化
を図ることが考えられている。Therefore, it is conceivable to mount a three-dimensional structure electronic component formed by sandwiching a three-dimensionally arranged electronic component between a pair of relatively small printed wiring boards on a mother board for higher density. ing.
【０００４】[0004]
【従来の技術】図８は、従来の三次元構造電子部品の構
造を示す図であり、（Ａ）は分解斜視図、（Ｂ）は斜視
図、（Ｃ）は断面図である。2. Description of the Related Art FIGS. 8A and 8B are views showing the structure of a conventional three-dimensional structure electronic component, wherein FIG. 8A is an exploded perspective view, FIG. 8B is a perspective view, and FIG.
【０００５】同図において、１は三次元構造電子部品で
あり、三次元構造電子部品１は、一対の側板２，２及び
複数の電子部品（Ｔ−ＳＯＰ：Thin-Small Outline Pac
kage）３を備えている。In the figure, reference numeral 1 is a three-dimensional structure electronic component. The three-dimensional structure electronic component 1 comprises a pair of side plates 2 and 2 and a plurality of electronic components (T-SOP: Thin-Small Outline Pac).
kage) 3.
【０００６】電子部品３は、矩形状の電子部品本体４の
両側部にそれぞれ配列的に延出する複数のリード５を有
している。側板２，２は、それぞれ配列的に形成された
スルーホール６及び所要の回路パターンが形成されたプ
リント配線板である。スルーホール６の内面は、回路パ
ターンに接続された導体で被覆されている。The electronic component 3 has a plurality of leads 5 extending in an array on both sides of a rectangular electronic component body 4. The side plates 2 and 2 are printed wiring boards on which through holes 6 formed in an array and required circuit patterns are formed. The inner surface of the through hole 6 is covered with a conductor connected to the circuit pattern.
【０００７】７，７はマザーボード８に対する接続用の
ピンである。マザーボード８はピン７が挿入・固定され
るスルーホール９を有している。然して、側板２，２の
下端にそれぞれ対応するピン７，７を接続・固定する。
そして、一方の側板２の所定のスルーホール６に、各電
子部品３の一側のリード５をそれぞれ挿入した後、他方
の側板２の所定のスルーホール６に、各電子部品３の他
側のリード５をそれぞれ挿入する。Reference numerals 7 and 7 are pins for connecting to the motherboard 8. The motherboard 8 has a through hole 9 into which the pin 7 is inserted and fixed. However, the pins 7 corresponding to the lower ends of the side plates 2 and 2 are connected and fixed.
Then, after inserting the lead 5 on one side of each electronic component 3 into the predetermined through hole 6 of the one side plate 2, the other side of each electronic component 3 is inserted into the predetermined through hole 6 of the other side plate 2. Insert the leads 5 respectively.
【０００８】次いで、各電子部品３の各リード５を対応
するスルーホール６の内面に半田により接続・固定する
ことにより、三次元構造電子部品１が構成される。三次
元構造電子部品１は、同図（Ｃ）に示すように、ピン７
を、マザーボード８のスルーホール９，９に挿入して半
田付けされることにより実装される。Next, each lead 5 of each electronic component 3 is connected and fixed to the inner surface of the corresponding through hole 6 by soldering, whereby the three-dimensional structure electronic component 1 is constructed. The three-dimensional structure electronic component 1 has pins 7 as shown in FIG.
Is inserted into the through holes 9 of the motherboard 8 and soldered.
【０００９】[0009]
【発明が解決しようとする課題】しかし、三次元構造電
子部品を構成するいづれかの電子部品に障害等が発生し
て交換の必要がある場合に、従来の構造では一方の側板
の全てのスルーホール内の半田を除去して該一方の側板
を取り外し、他方の側板の障害が発生した電子部品のリ
ードに対応するスルーホール内の半田を除去して、該当
する電子部品を取り外し、良好な電子部品を装着すると
いう作業を行う必要があり、交換の必要の無い電子部品
についてもリードの側板からの取り外しを必要とするの
で、作業が煩雑であるという問題があった。However, when any one of the electronic components constituting the three-dimensional structure electronic component has a failure or the like and needs to be replaced, all the through holes of the one side plate in the conventional structure. The solder inside is removed to remove the one side plate, the solder inside the through hole corresponding to the lead of the electronic component in which the other side plate has a fault is removed, and the corresponding electronic component is removed to obtain a good electronic component. There is a problem that the work is complicated because it is necessary to perform the work of mounting the lead, and it is also necessary to remove the lead from the side plate even for an electronic component that does not need to be replaced.
【００１０】また、一方の側板の所定のスルーホール
に、各電子部品の一側のリードが挿入された状態で、他
方の側板の各スルーホールに、対応する各電子部品の他
側の全てのリードを一時に挿入する必要があり、各電子
部品の他側のリードの相対位置にバラツキがある場合
に、その位置合わせが非常に難しく、組立作業あるいは
修復作業の作業性が悪く、リード等を損傷することがあ
るという問題があった。Further, in a state where a lead on one side of each electronic component is inserted into a predetermined through hole of one side plate, each through hole of the other side plate corresponds to all of the other sides of the corresponding electronic components. When it is necessary to insert the leads at a time, and the relative positions of the leads on the other side of each electronic component vary, it is very difficult to align the leads, and the workability of assembly work or repair work is poor and There was a problem that it could be damaged.
【００１１】本発明はこのような点に鑑みてなされたも
のであり、その目的とするところは、三次元構造電子部
品の組立作業や修復作業の容易化を図ることである。The present invention has been made in view of the above points, and an object thereof is to facilitate the assembling work and the repair work of a three-dimensional structure electronic component.
【００１２】[0012]
【課題を解決するための手段】上述した課題を解決する
ため、以下に示す特徴を有する構造及び製造方法を提供
する。In order to solve the above problems, a structure and a manufacturing method having the following features are provided.
【００１３】（１）本発明の第１の構造 その両縁端面のうちの少なくとも一方にスルーホールの
一部となるべき溝が形成され且つ回路パターンが形成さ
れた複数の側板構成板を、該溝を相対せしめた状態で該
縁端面を順次接合してなる、垂立して互いに対向配置さ
れた一対の側板と、電子部品本体の両側にそれぞれ延設
されたリードが該一対の側板のそれぞれの隣接する側板
構成板の相対する溝により構成されるスルーホールに挿
入された状態で、該一対の側板間に渡って位置された複
数の電子部品と、該側板のスルーホール内に充填される
ことで、隣接する側板構成板を互いに固着するととも
に、該リードを固着する半田を備えたことを特徴とす
る。(1) A first structure of the present invention, wherein a plurality of side plate constituent plates in which a groove to be a part of a through hole is formed on at least one of both end faces thereof and a circuit pattern is formed, A pair of side plates that are vertically joined to each other and that are formed by sequentially joining the edge surfaces in a state where the grooves are opposed to each other, and leads that are respectively extended on both sides of the electronic component body, respectively, of the pair of side plates. Of a plurality of electronic components positioned between the pair of side plates in a state of being inserted into the through holes formed by the opposite grooves of the adjacent side plate constituent plates and the through holes of the side plates. Thus, the adjacent side plate constituent plates are fixed to each other, and solder for fixing the leads is provided.
【００１４】（２）本発明の第１の構造についての製造
方法 その両縁端面のうちの少なくとも一方にスルーホールの
一部となるべき溝が形成され且つ回路パターンが形成さ
れた複数の側板構成板、及び電子部品本体の両側にそれ
ぞれ延設されたリードを有する電子部品を備え、一対の
側板構成板を互いに姿勢を統一して垂立させた状態で、
対向配置させる第１のステップと、一対の側板構成板の
溝に電子部品のリードを挿入して、該電子部品を該一対
の側板構成板に渡って載置する第２のステップと、一対
の側板構成板に他の一対の側板構成板を、該一対の側板
構成板の溝が形成された縁端面と他の一対の側板構成板
の対応する溝が形成された縁端面を当接させた状態で載
置する第３のステップと、隣接する側板構成板の相対す
る溝を半田により接合・固着する第４のステップとを含
むことを特徴とする。(2) Manufacturing method for the first structure of the present invention A plurality of side plate structures in which a groove to be a part of a through hole is formed in at least one of both end faces thereof and a circuit pattern is formed. A plate, and an electronic component having leads extending on both sides of the electronic component body, respectively, in a state in which a pair of side plate constituent plates are erected in a uniform posture with respect to each other,
A first step in which they are arranged to face each other; a second step in which leads of an electronic component are inserted into the grooves of the pair of side plate constituent plates, and the electronic component is placed over the pair of side plate constituent plates; Another pair of side plate constituent plates was brought into contact with the side plate constituent plates, and an edge surface of the pair of side plate constituent plates on which the groove was formed was brought into contact with an edge surface of the other pair of side plate constituent plates on which the corresponding groove was formed. It is characterized by including a third step of placing in a state and a fourth step of joining and fixing the facing grooves of the adjacent side plate constituent plates with solder.
【００１５】（３）本発明の第２の構造 スルーホールを有し、垂立して互いに対向配置された一
対の側板構成板と、電子部品本体の両側にそれぞれ延設
されたリードを該一対の側板構成板の対応するスルーホ
ールに接続させた状態で、該一対の側板構成板に渡って
支持された電子部品と、該一対の側板構成板のそれぞれ
の表面に形成された接続パッドを含む回路パターンとを
有するアセンブリを複数備え、該複数のアセンブリは、
相対するアセンブリの相対する接続パッドが接合されて
連結されていることを特徴とする。(3) Second Structure of the Present Invention A pair of side plate constituent plates having through holes and vertically arranged to face each other, and leads extending on both sides of the electronic component body, respectively. Of electronic components supported by the pair of side plate constituent plates in a state of being connected to corresponding through holes of the side plate constituent plates, and connection pads formed on respective surfaces of the pair of side plate constituent plates. A plurality of assemblies having a circuit pattern, the plurality of assemblies comprising:
It is characterized in that the opposite connection pads of the opposite assemblies are joined and connected.
【００１６】[0016]
【作用】（１）本発明の第１の構造によると、三次元構
造電子部品を構成するいづれかの電子部品に障害等が発
生して交換の必要がある場合に、交換すべき電子部品の
リードが挿入されているスルーホール内の半田を除去し
て、側板を隣接する側板構成板の交換を必要とする電子
部品のリードが位置する縁端面にて分割することによ
り、電子部品の交換を行うことができ、交換の必要の無
い電子部品について作業する必要は無いので、修復作業
が非常に容易である。(1) According to the first structure of the present invention, the lead of the electronic component to be replaced is required when any one of the electronic components forming the three-dimensional structure electronic component is damaged and needs to be replaced. Replace the electronic components by removing the solder in the inserted through-holes and dividing the side plate at the edge face where the leads of the electronic components that require replacement of the adjacent side plate constituent plates are located. Therefore, it is not necessary to work on electronic components that do not need to be replaced, so the repair work is very easy.
【００１７】（２）本発明の第１の構造についての製造
方法によると、側板構成板と電子部品を交互に積み重ね
ていくようにしたので、電子部品のリードをスルーホー
ルに挿入するという比較的に困難な作業が無くなり、組
立作業が非常に容易となる。(2) According to the manufacturing method of the first structure of the present invention, since the side plate constituting plate and the electronic component are alternately stacked, the lead of the electronic component is relatively inserted into the through hole. The complicated work is eliminated and the assembling work becomes very easy.
【００１８】（３）本発明第２の構造によると、三次元
構造電子部品を構成するいづれかの電子部品に障害等が
発生して交換の必要がある場合に、交換すべき電子部品
についてのアセンブリのみを他のアセンブリから分離し
て、該分離したアセンブリについてのみ電子部品の交換
を行えばよく、交換の必要の無い電子部品について作業
する必要は無いので、その作業が非常に容易である。(3) According to the second structure of the present invention, when any one of the electronic parts constituting the three-dimensional structure electronic part has a failure or the like and needs to be replaced, an assembly of the electronic parts to be replaced Only the separated assembly is separated from the other assembly, and the electronic component only needs to be replaced with respect to the separated assembly, and it is not necessary to work on the electronic component that does not need to be replaced, so the work is very easy.
【００１９】また、電子部品一つについて、一つのアセ
ンブリを構成しているので、電子部品のリードのスルー
ホールへの挿入作業は、他の電子部品とは独立して行え
るので、組立作業あるいは修復作業が非常に容易であ
り、リード等の損傷が少なくなる。Since one electronic component constitutes one assembly, the work of inserting the lead of the electronic component into the through hole can be performed independently of the other electronic components. The work is very easy, and the damage to the leads is reduced.
【００２０】[0020]
【実施例】（１）図１乃至図４を参照して本発明第１の
構造に対応する第１実施例を説明する。Embodiments (1) A first embodiment corresponding to the first structure of the present invention will be described with reference to FIGS. 1 to 4.
【００２１】図１は第１実施例の三次元構造電子部品を
示す図であり、（Ａ）は平面図、（Ｂ）は正面図、
（Ｃ）は側面図である。図２は図１の三次元構造電子部
品の側板構成板の一部を示す図であり、（Ａ）は平面
図、（Ｂ）は正面図である。図３は図２の側板構成板の
製造方法の説明図である。図４は図１の三次元構造電子
部品の製造に使用する治具を示す斜視図である。FIG. 1 is a view showing a three-dimensional structure electronic component of the first embodiment, (A) is a plan view, (B) is a front view,
(C) is a side view. 2A and 2B are views showing a part of a side plate constituting plate of the three-dimensional structure electronic component of FIG. 1, in which FIG. 2A is a plan view and FIG. 2B is a front view. FIG. 3 is an explanatory view of a method for manufacturing the side plate constituent plate of FIG. FIG. 4 is a perspective view showing a jig used for manufacturing the three-dimensional structure electronic component of FIG.
【００２２】同図において、１１は三次元構造電子部品
であり、三次元構造電子部品１１は、複数の側板構成板
１２により構成される一対の側板１３，１３及び複数の
電子部品（Ｔ−ＳＯＰ：Thin-Small Outline Package）
１４を備えている。In the figure, reference numeral 11 denotes a three-dimensional structural electronic component. The three-dimensional structural electronic component 11 includes a pair of side plates 13 and 13 composed of a plurality of side plate constituent plates 12 and a plurality of electronic components (T-SOP). : Thin-Small Outline Package)
14 are provided.
【００２３】電子部品１４は、矩形状の電子部品本体１
５の両側部にそれぞれ配列的に延出する複数のリード１
６を有している。側板１３，１３を構成する各側板構成
板１２は、図２に最もよく示されるように、その両縁端
面１２ａにそれぞれスルーホールの一部となるべき溝１
７及び所要の回路パターン１８が形成されたプリント配
線板である。溝１７の内面は導体で被覆されており、こ
の導体は回路パターン１８に適宜に接続されている。ま
た、溝１７の導体の表面には半田材がメッキにより形成
されている。The electronic component 14 is a rectangular electronic component body 1.
A plurality of leads 1 that extend in an array on both sides of 5
Have six. As shown best in FIG. 2, each side plate constituting plate 12 constituting the side plates 13 and 13 has a groove 1 which is to be a part of a through hole on both edge end faces 12a thereof.
7 and the required circuit pattern 18 are formed on the printed wiring board. The inner surface of the groove 17 is covered with a conductor, and the conductor is appropriately connected to the circuit pattern 18. A solder material is formed on the surface of the conductor of the groove 17 by plating.
【００２４】この側板構成板１２は、例えば、図３に示
されるように、複数のスルーホール１９が形成されたプ
リント配線板２０を、スルーホール１９の中心又は中心
近傍を通る直線に沿って切断して形成することができ
る。As shown in FIG. 3, for example, the side plate forming plate 12 cuts a printed wiring board 20 having a plurality of through holes 19 formed along a straight line passing through the center of the through holes 19 or the vicinity of the center. Can be formed.
【００２５】然して、例えば図４に示されているよう
な、側板構成板を適宜な挟持圧力で挟持できる側板挿入
部２１を有する治具２２を準備し、まず、一対の側板構
成板１２を治具２２の側板挿入部２１の奥側に互いに相
対向するように装着する。Therefore, for example, as shown in FIG. 4, a jig 22 having a side plate insertion portion 21 capable of clamping the side plate constituent plates with an appropriate clamping pressure is prepared, and first, the pair of side plate constituent plates 12 is cured. The tool 22 is attached to the inner side of the side plate insertion portion 21 so as to face each other.
【００２６】次いで、電子部品１４の両側の各リード１
６が対応する側板構成板１２の溝１７内に位置するよう
に電子部品１４を載置する。さらに、一対の側板構成板
１２をその縁端面１２ａが既に装着済の一対の側板構成
板１２の縁端面１２ａに当接するように、治具２２の側
板挿入部２１に装着する。この状態で、各リード１６は
その縁端面１２ａが当接している側板構成板１２の相対
する溝１７により構成されるスルーホール内に位置され
ることになる。Next, the leads 1 on both sides of the electronic component 14
The electronic component 14 is placed so that the 6 is located in the corresponding groove 17 of the side plate constituting plate 12. Further, the pair of side plate constituent plates 12 are attached to the side plate insertion portion 21 of the jig 22 so that the edge end faces 12a thereof come into contact with the edge end faces 12a of the pair of side plate component plates 12 already mounted. In this state, each lead 16 is positioned in the through hole formed by the opposing groove 17 of the side plate constituting plate 12 with which the edge face 12a is in contact.
【００２７】上記と同様に他の電子部品１４の載置及び
他の一対の側板構成板１２の装着を所要回数繰り返し、
この状態で治具２２及び各部材１２，１４の全体を加熱
し、相対する溝１７により構成されるスルーホール内面
の半田材を溶融せしめた後、冷却すると、固化した半田
１７ａにより、各電子部品１４のリード１６が相対する
溝１７により構成されるスルーホールに接続・固定され
るとともに、隣接する側板構成板１２が相互に固着さ
れ、三次元構造電子部品１１の組立が終了する。Similarly to the above, the placement of the other electronic component 14 and the attachment of the other pair of side plate constituent plates 12 are repeated a required number of times,
In this state, the jig 22 and the members 12 and 14 as a whole are heated to melt the solder material on the inner surface of the through hole constituted by the opposing grooves 17 and then cooled. The leads 16 of 14 are connected and fixed to the through holes formed by the grooves 17 facing each other, and the adjacent side plate constituent plates 12 are fixed to each other, and the assembly of the three-dimensional structure electronic component 11 is completed.
【００２８】組立終了後にいづれかの電子部品１４を交
換する必要が生じた場合には、交換すべき電子部品１４
に対応するスルーホール内の半田のみを溶融・除去する
と、半田を除去したスルーホールを構成する相対する溝
１７が形成された縁端面１２ａでこの三次元構造電子部
品１１が分割されるので、該当する電子部品１４を交換
し、分割を元に戻して該当するスルーホール内に半田を
充填することにより、修復作業が終了する。When it becomes necessary to replace any one of the electronic components 14 after the assembly is completed, the electronic components 14 to be replaced are required.
When only the solder in the through hole corresponding to is melted and removed, the three-dimensional structure electronic component 11 is divided by the edge surface 12a in which the opposing groove 17 forming the through hole from which the solder is removed is formed. The repair work is completed by replacing the electronic component 14 to be replaced, restoring the division, and filling the corresponding through hole with solder.
【００２９】上記第１実施例によると、三次元構造電子
部品１１を構成するいづれかの電子部品１４に障害等が
発生して交換の必要がある場合に、交換すべき電子部品
１４のリード１６が挿入されているスルーホール内の半
田を除去して、側板１３を隣接する側板構成板１２の該
電子部品１４のリード１６が位置している縁端面１２ａ
にて分割することにより、電子部品１４の交換を行うこ
とができ、交換の必要の無い電子部品１４について作業
する必要は無いので、修復作業が非常に容易である。According to the first embodiment described above, when any one of the electronic parts 14 constituting the three-dimensional structure electronic part 11 has a failure or the like and needs to be replaced, the lead 16 of the electronic part 14 to be replaced is The solder in the inserted through hole is removed, and the side plate 13 is adjacent to the edge plate 12a of the side plate constituting plate 12 where the lead 16 of the electronic component 14 is located.
Since the electronic component 14 can be replaced by dividing the electronic component 14 without needing to work on the electronic component 14 that does not need to be replaced, the repair work is very easy.
【００３０】また、側板構成板１２と電子部品１４を交
互に積み重ねていくようにしたので、電子部品１４のリ
ード１６をスルーホールに挿入するという比較的に困難
な作業が不要となり、単に、電子部品１４の両側の各リ
ード１６が対応する側板構成板１２，１２の溝１７内に
位置するように電子部品１４を載置するだけでよく、組
立作業が非常に容易となる。Further, since the side plate constituting plate 12 and the electronic component 14 are alternately stacked, the relatively difficult work of inserting the lead 16 of the electronic component 14 into the through hole becomes unnecessary, and the electronic component is simply It is sufficient to mount the electronic component 14 so that the leads 16 on both sides of the component 14 are located in the grooves 17 of the corresponding side plate constituting plates 12 and 12, and the assembling work becomes very easy.
【００３１】さらに、各側板構成板１２の溝１７内面に
半田材を予めメッキにより形成しているので、組立時に
半田を供給する作業が不要であり、半田付け作業が容易
である。Further, since the solder material is preliminarily formed on the inner surface of the groove 17 of each side plate constituting plate 12 by plating, the work of supplying the solder at the time of assembly is unnecessary and the soldering work is easy.
【００３２】なお、各側板構成板１２の溝１７内面に半
田材を予めメッキしない場合には、棒状に形成された半
田材を半田付け時にスルーホール内に挿入して加熱する
ようにしてもよい。When the solder material is not pre-plated on the inner surface of the groove 17 of each side plate constituent plate 12, the rod-shaped solder material may be inserted into the through hole and heated at the time of soldering. .
【００３３】また、上記説明においては、一対の側板１
３の各側板構成板１２は、その両縁端面１２ａに溝１７
を形成して構成しているが、側板１３の上下端に位置す
る側板構成板１２については、その一方の縁端面１２ａ
にのみ溝１７を形成して構成したものを使用できること
はいうまでもない。側板構成板１２の溝１７は半円形の
ものに限られないこともいうまでもない。Further, in the above description, the pair of side plates 1
Each side plate constituting plate 12 of No. 3 has grooves 17 on both end faces 12a.
The side plate constituting plate 12 positioned at the upper and lower ends of the side plate 13 is formed by forming one edge end surface 12a.
It goes without saying that the one formed by forming the groove 17 only in the above can be used. It goes without saying that the groove 17 of the side plate constituting plate 12 is not limited to the semicircular shape.
【００３４】（２）図５乃至図７を参照して本発明の第
２の構造に対応する第２実施例を説明する。図５は第２
実施例の三次元構造電子部品を示す図であり、（Ａ）は
平面図、（Ｂ）は正面図、（Ｃ）は側面図である。図６
は図５の三次元構造電子部品の側板構成板を示す図であ
り、（Ａ）は平面図、（Ｂ）は正面図である。図７は図
１の三次元構造電子部品の製造に使用する治具を示す斜
視図である。(2) A second embodiment corresponding to the second structure of the present invention will be described with reference to FIGS. FIG. 5 is the second
It is a figure which shows the three-dimensional structure electronic component of an Example, (A) is a top view, (B) is a front view, (C) is a side view. Figure 6
6A and 6B are views showing a side plate constituting plate of the three-dimensional structure electronic component of FIG. 5, FIG. 6A being a plan view and FIG. 6B being a front view. FIG. 7 is a perspective view showing a jig used for manufacturing the three-dimensional structure electronic component of FIG.
【００３５】同図において、３１は三次元構造電子部品
であり、三次元構造電子部品３１は、複数の側板構成板
３２により構成される一対の側板３３，３３及び複数の
電子部品（Ｔ−ＳＯＰ：Thin-Small Outline Package）
３４を備えている。In the figure, reference numeral 31 is a three-dimensional structural electronic component. The three-dimensional structural electronic component 31 includes a pair of side plates 33, 33 composed of a plurality of side plate constituent plates 32 and a plurality of electronic components (T-SOP). : Thin-Small Outline Package)
34 are provided.
【００３６】電子部品３４は、矩形状の電子部品本体３
５の両側部にそれぞれ配列的に延出する複数のリード３
６を有している。側板３３，３３を構成する各側板構成
板３２は、図６に最もよく示されるように、その中央部
に配列的に形成されたスルーホール３７及びその一方の
表面３２ａ，３２ｂの両縁部近傍に配列的に形成された
接続パッド３８を含む所要の回路パターン３９が形成さ
れたプリント配線板である。スルーホール３７内面は導
体で被覆されており、この導体は回路パターン３９に適
宜に接続されている。また、スルーホール３７の導体及
び接続パッド３８の表面には半田材がメッキにより形成
されている。The electronic component 34 is a rectangular electronic component body 3
A plurality of leads 3 extending in an array on both sides of
Have six. As best shown in FIG. 6, each side plate constituting plate 32 forming the side plates 33, 33 has through holes 37 formed in an array in the central part thereof and both edges of one surface 32a, 32b thereof. It is a printed wiring board on which a required circuit pattern 39 including connection pads 38 arranged in an array is formed. The inner surface of the through hole 37 is covered with a conductor, and this conductor is appropriately connected to the circuit pattern 39. A solder material is formed on the surfaces of the conductors of the through holes 37 and the connection pads 38 by plating.
【００３７】この側板構成板３２は、例えば、スルーホ
ール及び回路パターンが形成された大型のプリント配線
板を適宜に切断して形成することができる。然して、例
えば図７に示されているような、側板構成板３２の長手
方向両端部近傍が嵌合する段階的に形成された複数の側
板嵌合溝４０を有する一対の治具４１を準備するととも
に、一対の側板構成板３２のスルーホール３７に一つの
電子部品３４の両側のリード３６をそれぞれ挿入して、
この状態を保ちつつ、側板構成板３２の一方の端部をそ
れぞれ一方の治具４１の対応する側板嵌合溝４０の一つ
に嵌入する。The side plate constituting plate 32 can be formed, for example, by appropriately cutting a large printed wiring board having through holes and circuit patterns. Therefore, for example, as shown in FIG. 7, a pair of jigs 41 having a plurality of stepwise formed side plate fitting grooves 40 in which the vicinity of both longitudinal ends of the side plate constituting plate 32 are fitted are prepared. At the same time, the leads 36 on both sides of one electronic component 34 are respectively inserted into the through holes 37 of the pair of side plate constituent plates 32,
While maintaining this state, one end of the side plate constituting plate 32 is fitted into one of the corresponding side plate fitting grooves 40 of the one jig 41.
【００３８】この一対の側板構成板３２のスルーホール
３７への電子部品３４のリード３６の挿入作業及び一方
の治具４１の側板嵌合溝４０への嵌入作業を、適宜に繰
り返し、その後、他方の治具４１の各側板嵌合溝４０に
各側板構成板３２の他方の端部を嵌入する。これによ
り、各側板構成板３２の接続パッド３８は、隣接する側
板構成板３２の接続パッド３８に当接した状態となる。The operation of inserting the leads 36 of the electronic component 34 into the through holes 37 of the pair of side plate constituting plates 32 and the operation of inserting the jig 41 into the side plate fitting groove 40 are appropriately repeated, and then the other side. The other end of each side plate constituting plate 32 is fitted into each side plate fitting groove 40 of the jig 41. As a result, the connection pad 38 of each side plate constituent plate 32 comes into contact with the connection pad 38 of the adjacent side plate constituent plate 32.
【００３９】この状態で治具４１及び各部材３２，３４
の全体を加熱し、相対する接続パッド３８及びスルーホ
ール３７内の半田材を溶融せしめた後、冷却することに
より、各電子部品３４のリード３６が対応するスルーホ
ール３７に接続・固定されるとともに、隣接する側板構
成板３２が相互に固着され、三次元構造電子部品３１の
組立が終了する。各側板構成板３２の回路パターン３９
は、隣接する側板構成板３２の回路パターン３９と接続
パッド３８を介して電気的に接続される。In this state, the jig 41 and each member 32, 34
Of the electronic components 34 are connected and fixed to the corresponding through holes 37 by heating the whole of the above, melting the solder material in the connecting pads 38 and the through holes 37 facing each other, and then cooling. The adjacent side plate constituent plates 32 are fixed to each other, and the assembly of the three-dimensional structure electronic component 31 is completed. Circuit pattern 39 of each side plate constituent plate 32
Are electrically connected to the circuit patterns 39 of the adjacent side plate constituent plates 32 via the connection pads 38.
【００４０】なお、説明の便宜上、上記の一対の側板構
成板３２及び一つの電子部品３４で構成させるものをア
センブリを称する。組立終了後にいづれかの電子部品３
４を交換する必要が生じた場合には、交換すべき電子部
品３４を有するアセンブリの一対の側板構成板３２と隣
接する他のアセンブリの側板構成板３２とを接続してい
る接続パッド３８上の半田のみを溶融・除去すると、該
交換すべき電子部品３４を有するアセンブリのみを、こ
の三次元構造電子部品３１から取り外すことができる。For the sake of convenience of description, an assembly is composed of the pair of side plate constituent plates 32 and one electronic component 34. After the assembly is completed, either electronic component 3
When it becomes necessary to replace the four, the connection pads 38 connecting the pair of side plate forming plates 32 of the assembly having the electronic component 34 to be replaced with the side plate forming plate 32 of the other adjacent assembly. By melting and removing only the solder, only the assembly having the electronic component 34 to be replaced can be removed from the three-dimensional structure electronic component 31.
【００４１】次いで、交換すべき電子部品３４を良好な
他の電子部品３４と交換してアセンブリを元の状態に戻
し、該当する接続パッドを半田付け固定することによ
り、修復作業が終了する。Then, the electronic part 34 to be replaced is replaced with another good electronic part 34, the assembly is returned to the original state, and the corresponding connection pads are fixed by soldering, thereby completing the repair work.
【００４２】上記第２実施例によると、三次元構造電子
部品３１を構成するいづれかの電子部品３４に障害等が
発生して交換の必要がある場合に、交換すべき電子部品
３４についてのアセンブリのみを他のアセンブリから分
離して、該分離したアセンブリについてのみ電子部品３
４の交換を行えばよく、交換の必要の無い電子部品３４
について作業する必要は無いので、その作業が非常に容
易である。According to the second embodiment described above, when any one of the electronic parts 34 constituting the three-dimensional structure electronic part 31 has a failure or the like and needs to be replaced, only the assembly of the electronic part 34 to be replaced is required. Is separated from other assemblies, and the electronic component 3 is separated only for the separated assembly.
4 need only be replaced, and the electronic components 34 need not be replaced.
Since it is not necessary to work on, it is very easy to do.
【００４３】また、電子部品３４一つについて、一つの
アセンブリを構成しているから、電子部品３４のリード
３６のスルーホール３７への挿入作業は、他の電子部品
３４とは独立して行えるので、従来構造の如く複数の電
子部品の全てのリードを一時にスルーホールに挿入する
ものと比較して、組立作業あるいは修復作業が非常に容
易であり、リード等の損傷が少なくなる。Since one electronic component 34 constitutes one assembly, the work of inserting the lead 36 of the electronic component 34 into the through hole 37 can be performed independently of the other electronic components 34. As compared with the conventional structure in which all the leads of a plurality of electronic components are inserted into the through holes at one time, the assembling work or the repair work is very easy, and the damage to the leads and the like is reduced.
【００４４】さらに、各側板構成板３２の各スルーホー
ル３７内面及び接続パッド３８表面に半田材を予めメッ
キにより形成しているので、組立時に半田の供給作業が
不要であり、半田付け作業が容易である。Further, since the solder material is preliminarily plated on the inner surface of each through hole 37 of each side plate component plate 32 and the surface of the connection pad 38, the soldering work is not required at the time of assembly and the soldering work is easy. Is.
【００４５】なお、各側板構成板３２のスルーホール３
７内面に半田を予めメッキしない場合には、棒状に形成
された半田材を半田付け時にスルーホール３７に挿入し
て加熱するようにしてもよい。The through holes 3 of each side plate constituting plate 32
When the inner surface of the solder 7 is not pre-plated with solder, a rod-shaped solder material may be inserted into the through hole 37 and heated during soldering.
【００４６】また、各側板構成板３２の接続パッド３８
上の半田メッキに代えて、接続パッド３７上にペースト
状の半田クリームを予め塗布し、あるいは印刷により形
成するようにしてもよい。Further, the connection pads 38 of each side plate constituent plate 32
Instead of the above-mentioned solder plating, paste solder cream may be applied in advance on the connection pad 37 or may be formed by printing.
【００４７】さらに、上記説明においては、各側板３３
の各側板構成板３２の接続パッド３８の形成位置は、ス
ルーホール３７が形成されている面と同一の面３２ａ，
３２ｂとしているが、側板構成板３２のスルーホール３
７が形成されていない両縁端面３２ｂに接続パッドを形
成し、この縁端面３２ｃで他の側板構成板３２と接合す
るように構成することができる。Further, in the above description, each side plate 33 is provided.
The formation position of the connection pad 38 of each side plate constituent plate 32 is the same as the surface 32a on which the through hole 37 is formed,
32b, but the through hole 3 of the side plate constituting plate 32
Connection pads may be formed on both edge end surfaces 32b where 7 is not formed, and the edge pads 32c may be configured to be joined to the other side plate constituting plate 32.
【００４８】[0048]
【発明の効果】本発明は以上詳述したように構成したの
で、複数の電子部品の全てのリードを一時にスルーホー
ルに挿入する構造と比較して、リードのスルーホールへ
の挿入作業を容易化でき、組立作業を高効率的に行うこ
とができ、リードの損傷等の障害を少なくすることがで
きるという効果を奏する。Since the present invention is configured as described in detail above, the work of inserting the leads into the through holes is easier than the structure in which all the leads of a plurality of electronic components are inserted into the through holes at one time. Therefore, the assembly work can be performed efficiently, and obstacles such as damage to the leads can be reduced.
【００４９】また、三次元構造電子部品の一部の電子部
品を交換するに際し、交換すべき電子部品についてのみ
半田の除去作業を行えばよく、他の電子部品についての
半田の除去作業を必要としないので、修復作業の作業工
数を大幅に低減することができるという効果を奏する。Further, when exchanging a part of the electronic components of the three-dimensional structure electronic component, it suffices to remove the solder only from the electronic component to be exchanged, and it is necessary to remove the solder from other electronic components. Since this is not done, there is an effect that the number of repair work steps can be significantly reduced.
【図１】本発明第１実施例の構成を示す図であり、
（Ａ）は平面図、（Ｂ）は正面図、（Ｃ）は側面図であ
る。FIG. 1 is a diagram showing a configuration of a first embodiment of the present invention,
(A) is a plan view, (B) is a front view, and (C) is a side view.
【図２】本発明第１実施例の側板構成板の一部を示す図
であり、（Ａ）は平面図、（Ｂ）は正面図である。2A and 2B are views showing a part of a side plate constituting plate of the first embodiment of the present invention, FIG. 2A being a plan view and FIG. 2B being a front view.
【図３】本発明第１実施例の側板構成板の製造方法を示
す図である。FIG. 3 is a diagram showing a method for manufacturing a side plate constituting plate according to the first embodiment of the present invention.
【図４】本発明第１実施例の三次元構造電子部品の製造
に使用する治具を示す斜視図である。FIG. 4 is a perspective view showing a jig used for manufacturing a three-dimensional structure electronic component according to the first embodiment of the present invention.
【図５】本発明第２実施例の構成を示す図であり、
（Ａ）は平面図、（Ｂ）は正面図、（Ｃ）は側面図であ
る。FIG. 5 is a diagram showing a configuration of a second exemplary embodiment of the present invention,
(A) is a plan view, (B) is a front view, and (C) is a side view.
【図６】本発明第２実施例の側板構成板を示す図であ
り、（Ａ）は平面図、（Ｂ）は正面図である。6A and 6B are views showing a side plate constituting plate of a second embodiment of the present invention, FIG. 6A being a plan view and FIG. 6B being a front view.
【図７】本発明第２実施例の三次元構造電子部品の製造
に使用する治具を示す斜視図である。FIG. 7 is a perspective view showing a jig used for manufacturing a three-dimensional structure electronic component according to a second embodiment of the present invention.
【図８】従来技術を示す図であり、（Ａ）は分解斜視
図、（Ｂ）は斜視図、（Ｃ）は断面図である。FIG. 8 is a diagram showing a conventional technique, (A) is an exploded perspective view, (B) is a perspective view, and (C) is a sectional view.
１１ 三次元構造電子部品 １２ 側板構成板 １３ 側板 １４ 電子部品 １６ リード １７ 溝 １８ 回路パターン ２２ 治具 ３１ 三次元構造電子部品 ３２ 側板構成板 ３３ 側板 ３４ 電子部品 ３６ リード ３７ スルーホール ３８ 接続パッド ３９ 回路パターン ４１ 治具 11 three-dimensional structure electronic component 12 side plate component plate 13 side plate 14 electronic component 16 lead 17 groove 18 circuit pattern 22 jig 31 three-dimensional structure electronic component 32 side plate component plate 33 side plate 34 electronic component 36 lead 37 through hole 38 connection pad 39 circuit Pattern 41 jig
Claims (6)
一方にスルーホールの一部となるべき溝(17)が形成され
且つ回路パターン(18)が形成された複数の側板構成板(1
2)を、該溝(17)を相対せしめた状態で該縁端面(12a) を
順次接合してなる、垂立して互いに対向配置された一対
の側板(13)と、 電子部品本体(15)の両側にそれぞれ延設されたリード(1
6)が該一対の側板(13)を構成するそれぞれの隣接する側
板構成板(12)の相対する溝(17)により構成されるスルー
ホールに挿入された状態で、該一対の側板(13)間に渡っ
て位置された複数の電子部品(14)と、 該側板(13)のスルーホール内に充填されることで、隣接
する側板構成板(12)を互いに固着するとともに、該リー
ド(16)を固着する半田(17a) を備えたことを特徴とする
三次元構造電子部品。1. A plurality of side plate constituent plates (1) having a groove (17) which is to be a part of a through hole and a circuit pattern (18) formed on at least one of both edge surfaces (12a).
2), a pair of side plates (13) vertically arranged to face each other, which are formed by sequentially joining the edge surfaces (12a) with the grooves (17) facing each other, and an electronic component body (15). ) Leads (1
The pair of side plates (13) in a state in which 6) is inserted into the through holes formed by the facing grooves (17) of the respective adjacent side plate constituent plates (12) constituting the pair of side plates (13). By filling the through holes of the side plate (13) with a plurality of electronic components (14) located between them, the side plate constituting plates (12) adjacent to each other are fixed to each other and the leads (16) 3D structure electronic component characterized in that it is provided with a solder (17a) for fixing (3).
一方にスルーホールの一部となるべき溝(17)が形成され
且つ回路パターン(18)が形成された複数の側板構成板(1
2)、及び電子部品本体(15)の両側にそれぞれ延設された
リード(16)を有する電子部品(14)を備え、 一対の側板構成板(12)を互いに姿勢を統一して垂立させ
た状態で、対向配置させる第１のステップと、 一対の側板構成板(12)の溝(17)に電子部品(14)のリード
(16)を位置せしめて、該電子部品(14)を該一対の側板構
成板(12)間に渡って載置する第２のステップと、 一対の側板構成板(12)に他の一対の側板構成板(12)を、
該一対の側板構成板(12)の溝(17)が形成された縁端面(1
2a) と他の一対の側板構成板(12)の対応する溝(17)が形
成された縁端面(12a) を当接させた状態で載置する第３
のステップと、 隣接する側板構成板(12)の相対する溝(17)を半田により
接合・固着する第４のステップとを含むことを特徴とす
る三次元構造電子部品の製造方法。2. A plurality of side plate constituent plates (1) having a groove (17) which is to be a part of a through hole and a circuit pattern (18) formed on at least one of both edge surfaces (12a).
2) and an electronic component (14) having leads (16) extending on both sides of the electronic component body (15) respectively, and the pair of side plate constituent plates (12) are vertically erected in a uniform posture. The first step of arranging them facing each other, and the leads of the electronic component (14) in the grooves (17) of the pair of side plate constituent plates (12).
(16) is positioned and the second step of placing the electronic component (14) across the pair of side plate constituent plates (12), and a pair of side plate constituent plates (12) Side plate component plate (12),
An edge surface (1) in which the groove (17) of the pair of side plate constituting plates (12) is formed.
2a) and another pair of side plate constituent plates (12) to be placed in contact with the edge surface (12a) in which the corresponding groove (17) is formed.
And a fourth step of joining and fixing the opposing grooves (17) of the adjacent side plate constituting plates (12) by soldering, the method for producing a three-dimensional structure electronic component.
製造方法において、 前記側板構成板(12)の溝(17)の表面に半田メッキを施し
ておくことを特徴とする三次元構造電子部品の製造方
法。3. The three-dimensional structure electronic component manufacturing method according to claim 2, wherein the surface of the groove (17) of the side plate constituting plate (12) is plated with solder. Electronic component manufacturing method.
に対向配置された一対の側板構成板(32)と、 電子部品本体(35)の両側にそれぞれ延設されたリード(3
6)を該一対の側板構成板(32)の対応するスルーホール(3
7)に接続させた状態で、該一対の側板構成板(32)間に渡
って支持された電子部品(34)と、 該一対の側板構成板(32)のそれぞれの表面(32a) に形成
された接続パッド(38)を含む回路パターン(39)とを有す
るアセンブリを複数備え、 該複数のアセンブリは、相対するアセンブリの相対する
接続パッド(38)が接合されて連結されていることを特徴
とする三次元構造電子部品。4. A pair of side plate constituent plates (32) having through holes (37) and arranged upright and facing each other, and leads (3) respectively extended to both sides of the electronic component body (35).
6) through the corresponding through holes (3) of the pair of side plate constituent plates (32).
Formed on the electronic components (34) supported between the pair of side plate constituent plates (32) and the respective surfaces (32a) of the pair of side plate constituent plates (32) in a state of being connected to the pair of side plate constituent plates (32). A plurality of assemblies each having a circuit pattern (39) including a connected connection pad (38), wherein the plurality of assemblies are joined and connected to each other at opposite connection pads (38) of the opposite assembly. And three-dimensional structure electronic parts.
おいて、 前記各アセンブリの一方の側板構成板(32)の接続パッド
(38)は、他方の側板構成板(32)との対向面(32a) に形成
されており、 前記各アセンブリの該他方の側板構成板(32)の接続パッ
ド(38)は、該一方の側板構成板(32)との対向面(32a) と
反対の面(32b) に形成されていることを特徴とする三次
元構造電子部品。5. The three-dimensional structure electronic component according to claim 4, wherein the connection pad of one side plate constituting plate (32) of each assembly.
(38) is formed on the surface (32a) facing the other side plate constituting plate (32), and the connection pad (38) of the other side plate constituting plate (32) of each assembly is A three-dimensional structural electronic component characterized in that it is formed on a surface (32a) opposite to a surface (32a) facing the side plate constituting plate (32).
おいて、 前記各アセンブリの一対の側板構成板(32)のそれぞれの
接続パッド(38)は、該側板構成板(32)の縁端面(32c) に
形成されていることを特徴とする三次元構造電子部品。6. The three-dimensional structure electronic component according to claim 4, wherein each of the connection pads (38) of the pair of side plate constituting plates (32) of each assembly has an edge surface of the side plate constituting plate (32). A three-dimensional structure electronic component characterized by being formed in (32c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4277122A JPH06132623A (en) | 1992-10-15 | 1992-10-15 | Three-dimensional structure electronic component and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4277122A JPH06132623A (en) | 1992-10-15 | 1992-10-15 | Three-dimensional structure electronic component and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06132623A true JPH06132623A (en) | 1994-05-13 |
Family
ID=17579098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4277122A Withdrawn JPH06132623A (en) | 1992-10-15 | 1992-10-15 | Three-dimensional structure electronic component and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06132623A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9847275B2 (en) | 2015-12-21 | 2017-12-19 | International Business Machines Corporation | Distribution and stabilization of fluid flow for interlayer chip cooling |
| US9941189B2 (en) | 2015-12-21 | 2018-04-10 | International Business Machines Corporation | Counter-flow expanding channels for enhanced two-phase heat removal |
-
1992
- 1992-10-15 JP JP4277122A patent/JPH06132623A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9847275B2 (en) | 2015-12-21 | 2017-12-19 | International Business Machines Corporation | Distribution and stabilization of fluid flow for interlayer chip cooling |
| US9941189B2 (en) | 2015-12-21 | 2018-04-10 | International Business Machines Corporation | Counter-flow expanding channels for enhanced two-phase heat removal |
| US10083892B2 (en) | 2015-12-21 | 2018-09-25 | International Business Machines Corporation | Distribution and stabilization of fluid flow for interlayer chip cooling |
| US10090226B2 (en) | 2015-12-21 | 2018-10-02 | International Business Machines Corporation | Distribution and stabilization of fluid flow for interlayer chip cooling |
| US10199309B2 (en) | 2015-12-21 | 2019-02-05 | International Business Machines Corporation | Distribution and stabilization of fluid flow for interlayer chip cooling |
| US10529648B2 (en) | 2015-12-21 | 2020-01-07 | International Business Machines Corporation | Counter-flow expanding channels for enhanced two-phase heat removal |
| US10559518B2 (en) | 2015-12-21 | 2020-02-11 | International Business Machines Corporation | Distribution and stabilization of fluid flow for interlayer chip cooling |
| US10727158B2 (en) | 2015-12-21 | 2020-07-28 | International Business Machines Corporation | Counter-flow expanding channels for enhanced two-phase heat removal |
| US10727159B2 (en) | 2015-12-21 | 2020-07-28 | International Business Machines Corporatin | Counter-flow expanding channels for enhanced two-phase heat removal |
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