JPH06131937A - Structure for disconnecting switch opening/closing contact section - Google Patents
Structure for disconnecting switch opening/closing contact sectionInfo
- Publication number
- JPH06131937A JPH06131937A JP30438192A JP30438192A JPH06131937A JP H06131937 A JPH06131937 A JP H06131937A JP 30438192 A JP30438192 A JP 30438192A JP 30438192 A JP30438192 A JP 30438192A JP H06131937 A JPH06131937 A JP H06131937A
- Authority
- JP
- Japan
- Prior art keywords
- shape memory
- fixed
- shape
- contact piece
- memory alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 44
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000011084 recovery Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 13
- 230000007423 decrease Effects 0.000 abstract description 10
- 239000004020 conductor Substances 0.000 abstract description 7
- 238000005498 polishing Methods 0.000 abstract description 3
- 230000005284 excitation Effects 0.000 abstract 3
- 238000004140 cleaning Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 230000006870 function Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
Landscapes
- Contacts (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は断路器の開閉接触部(以
下接触部とする)に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an opening / closing contact portion (hereinafter referred to as a contact portion) of a disconnector.
【0002】[0002]
【従来の技術】従来は接触部は閉状態では、可動接触片
とフィンガーが接したままで接触面は動くことのない構
造である。2. Description of the Related Art Conventionally, when the contact portion is closed, the movable contact piece and the finger are in contact with each other and the contact surface does not move.
【0003】[0003]
【発明が解決しようとする課題】従来の接触部は長期間
の閉状態において、接触面は長期間動くことがないの
で、時間の経過により、大気中の塩素またはその化合物
あるいは硫黄またはその化合物と、接触面の金属が反応
して接触面の金属と塩素あるいは硫黄との化合物(以下
化合物とする)を生成する。化合物は電気抵抗が大きい
ため、接触部の接触面で、電気的に閉状態となる。ある
いは通電による発熱で、接触面の金属が溶解する。こう
いったことを防止するために定期的に接触面を研磨して
化合物を除く。 このために通電の停止及び研磨のため
の時間、手間がかかるという欠点がある。Since the conventional contact part does not move for a long period of time when the contact part is closed for a long period of time, the chlorine or its compound or the sulfur or its compound in the atmosphere may be changed over time. The metal on the contact surface reacts with each other to form a compound of the metal on the contact surface and chlorine or sulfur (hereinafter referred to as a compound). Since the compound has a large electric resistance, it is electrically closed at the contact surface of the contact portion. Alternatively, the metal on the contact surface is melted by heat generated by energization. In order to prevent this, the contact surface is regularly polished to remove the compound. For this reason, there is a drawback that it takes time and labor for stopping the energization and for polishing.
【0004】本発明は上記のような従来技術の欠点を解
消するために創案されたものであり、通電電流の変化、
例えば昼間と夜間のような通電電流の変化により接触面
を移動させ、摺動研磨することにより、接触面の化合物
を除去することを目的とする。The present invention was devised to solve the above-mentioned drawbacks of the prior art.
For example, the object is to remove the compound on the contact surface by moving the contact surface and slidingly polishing it by changing the energizing current in the daytime and nighttime.
【0005】[0005]
【課題を解決するための手段】上記の目的を達成するた
め、接触部の固定接触片を形状記憶合金およびバイアス
スプリングの間に介在させて固定部ベースに固定し、通
電電流は形状記憶合金を全部または一部が流れる回路と
し、昼間と夜間などによる通電電流の変化による形状記
憶合金の温度変化に伴い、記憶した形状(以下記憶形状
と記す)と非記憶状態の形状(以下非記憶形状と記す)
の交互変化により、請求項1の発明ではフインガー上を
接触面が移動する構成とし、請求項2の発明では接触面
が可動接触片縁部上を移動する構成とする。In order to achieve the above object, a fixed contact piece of a contact portion is interposed between a shape memory alloy and a bias spring to be fixed to a fixed portion base, and the energizing current is the shape memory alloy. A circuit in which all or part of the current flows, and the shape that has been memorized (hereinafter referred to as memory shape) and the shape that is in a non-memory state (hereinafter referred to as non-memory shape) are associated with changes in the temperature of the shape memory alloy due to changes in the energizing current during the day and night. Note)
In the invention of claim 1, the contact surface moves on the finger, and in the invention of claim 2, the contact surface moves on the movable contact edge.
【0006】[0006]
【作用】通電量の少い夜間では通電回路の一部をなす形
状記憶合金は形状記憶温度より低く、非記憶形状である
が、通電量の多い昼間となると、形状記憶温度以上とな
り、記憶形状である伸張状態となりバイアススプリング
の応力に勝る復元力で固定接触片を押上げ、接触面はフ
ィンガー上を摺動する。または固定接触片を一方向へ回
転させ、接触面は可動接触片縁部を摺動する。通電量の
少い夜間になると形状記憶合金は形状記憶温度以下とな
り、バイアススプリングの応力に負けて非記憶形状に縮
小し、固定接触片は下降する。この時も接触面はフィン
ガー上を摺動する。または固定接触片は逆方向に回転
し、この時も接触面は可動接触片上を摺動する。[Function] At night when the amount of electricity is small, the shape memory alloy forming a part of the energizing circuit is lower than the shape memory temperature and has a non-memory shape. Then, the fixed contact piece is pushed up by the restoring force exceeding the stress of the bias spring, and the contact surface slides on the finger. Alternatively, the fixed contact piece is rotated in one direction, and the contact surface slides on the edge of the movable contact piece. At night when the amount of electricity is small, the shape memory alloy falls below the shape memory temperature, loses the stress of the bias spring and shrinks to a non-memory shape, and the fixed contact piece descends. At this time as well, the contact surface slides on the fingers. Alternatively, the fixed contact piece rotates in the opposite direction, and the contact surface also slides on the movable contact piece at this time.
【0007】このように通電電流の変化が前記のように
昼夜であれば、昼夜一回ずつ接触面は摺動研磨し、化合
物を除去する。この繰返しにより形状記憶合金の復元力
は低下し、また非記憶形状での応力は低下する(以下復
元力および応力の低下を劣化と記す)。したがって記憶
形状ではバイアススプリングの応力に勝って伸長する長
さは劣化前(以下初期と記す)より小さくなる。またバ
イアススプリングの応力により非記憶形状も劣化により
初期より縮小する。このため接触面の摺動する範囲はは
下へ移動する、もしくは右へまわった方向へ移動する。
従って接触面はフインガーの同一部分、もしくは可動接
触片縁部の同一部分を摺動せず、その範囲を移動するこ
とにより、摺動によるフインガーの磨耗、もしくは可動
接触片縁部の磨耗は低減する。If the change in the applied current is day or night as described above, the contact surface is slid and polished once a day to remove the compound. By repeating this, the restoring force of the shape memory alloy decreases, and the stress in the non-memory shape decreases (hereinafter, the restoring force and the decrease in stress are referred to as deterioration). Therefore, in the memory shape, the length of the bias spring, which is greater than the stress of the bias spring and extends, is smaller than that before the deterioration (hereinafter referred to as the initial stage). In addition, the non-memory shape is also deteriorated due to the stress of the bias spring and contracted from the initial stage. Therefore, the sliding range of the contact surface moves downward, or moves in the direction turning to the right.
Therefore, the contact surface does not slide on the same part of the finger or on the same part of the movable contact edge, but by moving within the range, wear of the finger due to sliding or wear of the movable contact edge is reduced. .
【0008】[0008]
【実施例】図1は本発明の接触部の一例で、固定接触片
はフィンガー1aと固定接触片ベース1bより構成す
る。固定接触片1は固定接触片ベース1bを固定ボルト
7に装着した形状記憶合金コイル3とバイアススプリン
グ4の間に置いて固定部ベース6に固定する。通電路に
おける固定ベース6より固定接触片1の間は可撓導体5
と形状記憶合金コイル3が並列回路を成している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an example of a contact portion of the present invention, in which a fixed contact piece comprises a finger 1a and a fixed contact piece base 1b. The fixed contact piece 1 is fixed to the fixed portion base 6 by placing the fixed contact piece base 1b between the shape memory alloy coil 3 mounted on the fixing bolt 7 and the bias spring 4. The flexible conductor 5 is provided between the fixed base 6 and the fixed contact piece 1 in the energizing path.
And the shape memory alloy coil 3 form a parallel circuit.
【0009】図1(a)は形状記憶合金コイル3が形状
記憶温度以下で非記憶形状すなわち全圧縮には至らない
縮小した状態である。通電量が増し、形状記憶合金コイ
ル3を流れる電流も増して形状記憶合金コイル3が形状
記憶温度以上になると図1(b)に示すように形状記憶
合金コイル3は記憶形状に変形しその回復力は、バイア
ススプリング4の応力に勝って固定接触片1を上方へ押
上げる。FIG. 1 (a) shows the shape memory alloy coil 3 in a non-memory shape at a temperature below the shape memory temperature, that is, in a contracted state where full compression is not achieved. When the energization amount increases and the current flowing through the shape memory alloy coil 3 also increases and the shape memory alloy coil 3 reaches the shape memory temperature or higher, the shape memory alloy coil 3 is deformed into a memorized shape and recovered as shown in FIG. 1B. The force overcomes the stress of the bias spring 4 and pushes the fixed contact piece 1 upward.
【0010】通電量が減って形状記憶合金コイル3が形
状記憶温度以下になると形状記憶合金コイル3はバイア
ススプリング4の応力により縮小し非記憶形状となり、
固定接触片1は下へ移動する。通電量の増減に基ずく固
定接触片1の上下により接触面8はフィンガー1a上を
摺動し、可動接触片2及びフィンガー1aの接触面8を
形成する部分を研磨し化合物を取り除く。When the amount of energization decreases and the shape memory alloy coil 3 falls below the shape memory temperature, the shape memory alloy coil 3 contracts due to the stress of the bias spring 4 and becomes a non-memory shape.
The fixed contact piece 1 moves downward. The contact surface 8 slides on the finger 1a as the fixed contact piece 1 moves up and down based on the increase / decrease in the amount of energization, and the movable contact piece 2 and the portion forming the contact surface 8 of the finger 1a are polished to remove the compound.
【0011】この繰返しにより形状記憶合金コイル3は
次第に劣化する。それにつれて記憶形状ではバイアスス
プリング4の応力に勝って伸長する長さは小さくなる。
また非記憶形状での応力も次第に低下し、それにつれて
バイアススプリング4の応力により非記憶形状は初期よ
り縮小する。このため図2(b)に示すフインガー1a
上の接触面8の摺動範囲Aは次第に、図2(d)に示す
ように接触面8の摺動範囲Bへと移動する。このように
接触面8のフインガー1a上の摺動範囲Aは次第に摺動
範囲Bへと移動し、摺動によるフインガー1aの摩耗を
低減する。By repeating this, the shape memory alloy coil 3 is gradually deteriorated. Along with this, in the memory shape, the length of the bias spring 4 that extends beyond the stress of the bias spring 4 becomes smaller.
Also, the stress in the non-memory shape gradually decreases, and accordingly, the stress in the bias spring 4 causes the non-memory shape to shrink from the initial state. Therefore, the finger 1a shown in FIG.
The sliding range A of the upper contact surface 8 gradually moves to the sliding range B of the contact surface 8 as shown in FIG. In this way, the sliding range A of the contact surface 8 on the finger 1a gradually moves to the sliding range B, and wear of the finger 1a due to sliding is reduced.
【0012】図3は本発明の接触部の他の例で、固定接
触片1はフィンガー1aと固定接触片ベース21bより
成る。固定接触片ベース21bは固定ボルト27を貫通
して動かし得る大きさの固定接触片ボルト穴11があ
る。固定金具29は固定ボルト27を貫通し得る固定金
具ボルト穴10がある。固定金具299は可撓導体25
を挾んで固定部ベース6に固定してある。固定接触片べ
ース21bは形状記憶合金コイル23およびバイアスス
プリング24を介して固定ボルト27で固定金具29に
固定してある。固定ボルト27は可動接触子中心Oより
固定接触片ボルト穴11までの距離を半径Rとする円弧
をなしている。可動接触片縁部12は可動接触片中心O
を中心とする円弧をなしている。通電路における固定接
触片1と固定部ベース6の間は形状記憶合金コイル23
と可撓導体25とで並列回路をなしている。FIG. 3 shows another example of the contact portion of the present invention. The fixed contact piece 1 comprises a finger 1a and a fixed contact piece base 21b. The fixed contact piece base 21b has a fixed contact piece bolt hole 11 that is sized to move through the fixed bolt 27. The fixing fitting 29 has a fixing fitting bolt hole 10 through which the fixing bolt 27 can pass. The fixing bracket 299 is a flexible conductor 25.
And is fixed to the fixed portion base 6. The fixed contact piece base 21b is fixed to a fixing metal fitting 29 with a fixing bolt 27 via a shape memory alloy coil 23 and a bias spring 24. The fixed bolt 27 forms an arc having a radius R from the center O of the movable contactor to the fixed contact piece bolt hole 11. The edge 12 of the movable contact piece is at the center O of the movable contact piece.
It forms an arc centered at. The shape memory alloy coil 23 is provided between the fixed contact piece 1 and the fixed portion base 6 in the energization path.
And the flexible conductor 25 form a parallel circuit.
【0013】図3(a)は形状記憶合金コイル23が形
状記憶温度以下で非記憶形状すなわち全圧縮には至らな
い縮小した状態である。通電量が増し、形状記憶合金コ
イル23を流れる電流も増して形状記憶合金コイル23
は形状記憶温度以上になると図3(b)に示すように記
憶形状に変形し、その回復力はバイアススプリング24
の応力に勝って固定接触片1を左へ回転する。FIG. 3 (a) shows the shape memory alloy coil 23 in a non-memory shape below the shape memory temperature, that is, in a contracted state which does not reach full compression. The amount of energization increases, the current flowing through the shape memory alloy coil 23 also increases, and the shape memory alloy coil 23 increases.
Is deformed into a memory shape as shown in FIG. 3B when the temperature exceeds the shape memory temperature, and the restoring force is the bias spring 24.
The fixed contact piece 1 is rotated to the left overcoming the stress of.
【0014】通電量が減って形状記憶合金コイル23が
形状記憶温度以下になると形状記憶合金コイル23はバ
イアススプリング24の応力により縮小し非記憶形状と
なり、固定接触片1は右へ回転し再び図3(a)に示す
状態になる。通電量の増減に基ずく固定接触片1の左右
への回転により接触面8は可動接触片縁部12を摺動
し、フインガー1a及び可動接触片2の接触面8を形成
する部分を研磨し化合物を取り除く。この繰返しにより
形状記憶合金コイル23は劣化する。それにつれて記憶
形状ではバイアススプリングの応力に勝って伸長する長
さは小さくなる。また非記憶形状での応力も次第に低下
し、それにつれてバイアススプリング24の応力のため
初期より縮小する。このため図4(a)に示す可動接触
片1上の接触面8の摺動範囲Cは次第に図2(c)にお
いて示すように可動接触片1上の接触面8の摺動範囲D
へと右回り方向へ移動する。When the amount of energization decreases and the shape memory alloy coil 23 falls below the shape memory temperature, the shape memory alloy coil 23 contracts due to the stress of the bias spring 24 and becomes a non-memory shape, and the fixed contact piece 1 rotates to the right and is again drawn. The state shown in FIG. By rotating the fixed contact piece 1 to the left or right based on the increase or decrease in the amount of energization, the contact surface 8 slides on the movable contact edge portion 12, and the portions forming the contact surface 8 of the finger 1a and the movable contact piece 2 are polished. Remove the compound. By repeating this, the shape memory alloy coil 23 deteriorates. Accordingly, in the memory shape, the length of extension of the bias spring against the stress of the bias spring becomes smaller. Further, the stress in the non-memory shape gradually decreases, and accordingly, the stress of the bias spring 24 reduces from the initial value. Therefore, the sliding range C of the contact surface 8 on the movable contact piece 1 shown in FIG. 4A gradually increases as shown in FIG. 2C.
Move clockwise to.
【0015】[0015]
【発明の効果】本発明によって、断路器の接触面に生じ
る化合物を通電量の変化により除去し化合物を原因とす
る接触部の閉回路の発生、あるいは発熱溶損を防止する
ことができる。According to the present invention, the compound generated on the contact surface of the disconnector can be removed by changing the amount of electric current to prevent the occurrence of a closed circuit at the contact portion caused by the compound or the heat generation melting loss.
【図1】図1は本発明の接触部の一例で、(a)は通電
量が少く、形状記憶合金コイルが形状記憶温度より低
く、形状記憶合金コイルは非記憶形状で、固定接触部が
下方にある状態を示す。(b)は通電量が多く、形状記
憶合金コイルは形状記憶温度より高温となり、記憶形状
となり、その復元力がバイアススプリングの応力に勝っ
て、固定接触部が上方にある状態を示す。FIG. 1 is an example of a contact portion of the present invention, in which (a) is a small amount of electricity, the shape memory alloy coil is lower than the shape memory temperature, the shape memory alloy coil has a non-memory shape, and the fixed contact portion is Shows the state below. (B) shows a state in which the energization amount is large, the temperature of the shape memory alloy coil becomes higher than the shape memory temperature, and the shape becomes a memory shape, the restoring force thereof exceeds the stress of the bias spring, and the fixed contact portion is above.
【図2】図2はその固定接触片の左半分を示す。(a)
(b)は形状記憶合金コイルが初期の非記憶形状および
記憶形状をそれぞれ示す。Aは(a)および(b)に示
す形状記憶合金コイルの形状変化による接触面の摺動範
囲を示す。(c)(d)は劣化した形状記憶合金コイル
の非記憶形状および記憶形状をそれぞれ示す。Bは
(c)および(d)に示す形状記憶合金コイルの形状変
化による接触面の摺動範囲を示す。FIG. 2 shows the left half of the fixed contact piece. (A)
(B) shows the initial non-memory shape and the memory shape of the shape memory alloy coil, respectively. A shows the sliding range of the contact surface due to the shape change of the shape memory alloy coil shown in (a) and (b). (C) and (d) show the non-memory shape and the memory shape of the deteriorated shape memory alloy coil, respectively. B shows the sliding range of the contact surface due to the shape change of the shape memory alloy coil shown in (c) and (d).
【図3】図3は本発明の接触部の他の一例を示し、
(a)は通電量が少く、形状記憶合金コイルが形状記憶
温度より低く、形状記憶合金コイルは非記憶形状で固定
接触部が右に回転した状態を示す。(b)は通電量が多
く、形状記憶合金コイルは形状記憶温度より高温とな
り、記憶形状となり、その復元力がバイアススプリング
の応力に勝ってこれを圧縮させ、固定接触部が左に回転
した状態を示す。FIG. 3 shows another example of the contact portion of the present invention,
(A) shows a state in which the energization amount is small, the shape memory alloy coil is lower than the shape memory temperature, the shape memory alloy coil has a non-memory shape, and the fixed contact portion is rotated to the right. (B) is a state in which the energization amount is large, the shape memory alloy coil has a temperature higher than the shape memory temperature, and has a memory shape, and the restoring force overcomes the stress of the bias spring to compress it and the fixed contact portion rotates to the left. Indicates.
【図4】図4はその接触部を示し、(a)(b)は形状
記憶合金コイルが初期の非記憶形状および記憶形状をそ
れぞれ示す。(c)(d)は劣化した形状記憶合金コイ
ルの非記憶形状および記憶形状をそれぞれ示す。Cは
(a)および(b)に示す形状記憶合金コイルの形状変
化による接触面の摺動範囲を示す。Dは(c)および
(d)に示す形状記憶合金コイルの形状変化による接触
面の摺動範囲を示す。4A and 4B show the contact portion, and FIGS. 4A and 4B respectively show a non-memory shape and a memory shape in the initial state of the shape memory alloy coil. (C) and (d) show the non-memory shape and the memory shape of the deteriorated shape memory alloy coil, respectively. C shows the sliding range of the contact surface due to the shape change of the shape memory alloy coil shown in (a) and (b). D shows the sliding range of the contact surface due to the shape change of the shape memory alloy coil shown in (c) and (d).
1 固定接触片 1a フィンガー 1b 固定接触片ベース 2 可動接触片 3 形状記憶合金コイル 4 バイアススプリング 5 可撓導体 6 固定部ベース 7 固定ボルト 8 接触面 9 固定金具 10 固定金具ボルト穴 11 固定接触片ボルト穴 12 可動接触片縁部 21b 固定接触片ベース 23 形状記憶合金コイル 24 バイアススプリング 25 可撓導体 27 固定ボルト A 接触部摺動範囲 B 接触部摺動範囲 C 接触面摺動範囲 D 接触面摺動範囲 O 可動接触片中心 1 Fixed Contact Piece 1a Finger 1b Fixed Contact Piece Base 2 Movable Contact Piece 3 Shape Memory Alloy Coil 4 Bias Spring 5 Flexible Conductor 6 Fixed Part Base 7 Fixing Bolt 8 Contact Surface 9 Fixing Bracket 10 Fixing Bracket Bolt 11 Fixed Contact Piece Bolt Hole 12 Movable contact piece edge 21b Fixed contact piece base 23 Shape memory alloy coil 24 Bias spring 25 Flexible conductor 27 Fixing bolt A A contact part sliding range B contact part sliding range C contact surface sliding range D contact surface sliding Range O Center of movable contact piece
Claims (2)
状記憶合金およびバイアススプリングの間に介在させて
固定部ベースに固定し、前記形状記憶合金は記憶した形
状では、前記バイアススプリングの応力に勝る回復力で
伸長し、元の非形状記憶の形状では前記バイアススプリ
ングの応力により全圧縮の途中まで縮小することによ
り、接触部の閉状態でフィンガーと可動接触片の接触面
(以下接触面と記す)が、フィンガー上を平行に移動
し、接触面を摺動研磨する断路器開閉接触部の構造。1. A fixed contact piece is interposed between a shape memory alloy and a bias spring in a disconnecting switch opening / closing contact portion and fixed to a base of the fixed portion. The contact surface of the finger and the movable contact piece (hereinafter referred to as the contact surface) is expanded in the original non-shape memory shape by contracting due to the stress of the bias spring in the original non-shape memory, and contracted in the middle of full compression. The structure of the disconnecting switch opening / closing contact part that moves in parallel on the fingers and slides and polishes the contact surface.
合金およびバイアススプリングの間に介在させて固定部
ベースに固定し、前記形状記憶合金は記憶した形状で
は、前記バイアススプリングの応力に勝る回復力で伸長
し、元の非形状記憶の形状では前記バイアススプリング
の応力により全圧縮の途中まで縮小することにより、接
触部の閉状態でフィンガーと可動接触片の接触面が、可
動接触片縁部を往復移動することにより、接触面を摺動
研磨する断路器開閉接触部の構造。2. A fixed contact piece of a disconnecting switch opening / closing contact part is interposed between a shape memory alloy and a bias spring and fixed to a fixed part base. It expands with an excellent recovery force, and in the original non-shape memory shape, the contact surface of the finger and the movable contact piece is reduced by the stress of the bias spring to the middle of full compression so that the contact surface of the finger and the movable contact piece is The structure of the disconnecting switch opening and closing contact part that slides and polishes the contact surface by reciprocating the edge part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30438192A JPH06131937A (en) | 1992-10-19 | 1992-10-19 | Structure for disconnecting switch opening/closing contact section |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30438192A JPH06131937A (en) | 1992-10-19 | 1992-10-19 | Structure for disconnecting switch opening/closing contact section |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06131937A true JPH06131937A (en) | 1994-05-13 |
Family
ID=17932337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30438192A Pending JPH06131937A (en) | 1992-10-19 | 1992-10-19 | Structure for disconnecting switch opening/closing contact section |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06131937A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107731610A (en) * | 2017-11-27 | 2018-02-23 | 云南电网有限责任公司昭通供电局 | Non-maintaining disconnecting switch |
JP2022523288A (en) * | 2019-01-02 | 2022-04-22 | シャンハイ リーディング コネクション メカトロニクス テクノロジー カンパニー リミテッド | Electrical equipment and electrical connection assembly |
-
1992
- 1992-10-19 JP JP30438192A patent/JPH06131937A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107731610A (en) * | 2017-11-27 | 2018-02-23 | 云南电网有限责任公司昭通供电局 | Non-maintaining disconnecting switch |
JP2022523288A (en) * | 2019-01-02 | 2022-04-22 | シャンハイ リーディング コネクション メカトロニクス テクノロジー カンパニー リミテッド | Electrical equipment and electrical connection assembly |
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