JPH06122998A - Oscillated surface treatment - Google Patents
Oscillated surface treatmentInfo
- Publication number
- JPH06122998A JPH06122998A JP27067492A JP27067492A JPH06122998A JP H06122998 A JPH06122998 A JP H06122998A JP 27067492 A JP27067492 A JP 27067492A JP 27067492 A JP27067492 A JP 27067492A JP H06122998 A JPH06122998 A JP H06122998A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- plated
- treatment
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、被処理物表面のメッキ
処理や防錆処理等の各種電気化学的表面処理を揺動方式
で行う揺動式表面処理方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillating surface treatment method in which various electrochemical surface treatments such as a plating treatment and an anticorrosion treatment on a surface of an object to be treated are conducted by an oscillating system.
【０００２】[0002]
【従来の技術】従来、一般のメッキ処理は、メッキ液を
収容したメッキ槽内に被処理物を浸漬し、被処理物を陰
極にして電流を流すことによって行っているが、大量の
小物部品を一度にメッキ処理する方法としてはバレルメ
ッキ法が知られている。このバレルメッキ法は、メッキ
液を収容したメッキ槽内にメッキ液の流通を良くした有
孔バレルを配設し、この有孔バレルの中に陰極となるコ
ンタクトと被処理物を収容し、有孔バレルを回転又は揺
動させながら有孔バレル外のメッキ液中に配設した陽極
と被処理物の間に電流を流すことによりメッキ処理を行
っている。又、特開平２−１５３１００号公報には有孔
バレル内に陰極となる網状体と陽極とを配置したものも
開示されている。2. Description of the Related Art Conventionally, a general plating process is carried out by immersing an object to be processed in a plating bath containing a plating solution, and using the object as a cathode to pass an electric current. A barrel plating method is known as a method of plating at a time. In this barrel plating method, a perforated barrel in which the plating liquid is well flown is arranged in a plating tank containing the plating liquid, and a contact serving as a cathode and an object to be treated are accommodated in the perforated barrel. The plating process is performed by passing an electric current between the anode and the object to be processed, which is disposed in the plating solution outside the perforated barrel while rotating or rocking the perforated barrel. Further, Japanese Patent Application Laid-Open No. 2-153100 also discloses an arrangement in which a net-like body serving as a cathode and an anode are arranged in a perforated barrel.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記バレル
メッキ法によれば多数の被処理物の表面を一度にメッキ
することができるが、従来方法ではコンタクトから遠い
部分に電流断続による不良が発生したり、有孔バレルの
内外に陰極と陽極が配設されていることにより有孔バレ
ルの孔に対応して電流集中によるバレル焼けが生じたり
するという問題があった。さらに、特開平２−１５３１
００号公報に開示された構成によれば、陽極と陰極を有
孔バレル内に配置しているのでバレル焼けを防止できる
とともに網状体の陰極を用いているので電流断続による
不良発生も少なくできるが、メッキ槽自体は固定されて
いるためメッキ液の流動が小さく、そのためにメッキ効
率が悪く、またメッキ液の流動性の良い部分とそうでな
い部分でメッキ厚さにばらつきが生じ易い等の問題があ
った。By the way, according to the barrel plating method, the surface of a large number of objects to be processed can be plated at one time. However, in the conventional method, a defect due to current interruption occurs in a portion far from the contact. Alternatively, there is a problem in that the cathode and the anode are provided inside and outside the perforated barrel, which causes barrel burning due to current concentration corresponding to the holes of the perforated barrel. Furthermore, JP-A-2-1531
According to the configuration disclosed in Japanese Patent Publication No. 00-00, since the anode and the cathode are arranged in the perforated barrel, barrel burning can be prevented, and since the mesh cathode is used, the occurrence of defects due to the intermittent current can be reduced. However, since the plating tank itself is fixed, the flow of the plating solution is small, so the plating efficiency is poor, and there is a problem that the plating thickness is likely to vary between the areas where the plating solution has good fluidity and those that do not. there were.
【０００４】本発明は、上記従来の問題点に鑑み、被処
理物に対する処理液の流動性が高く、被処理物の処理効
率及び処理の均一性を確保でき、生産性良く高品質の表
面処理が可能な揺動式表面処理方法を提供することを目
的とする。In view of the above-mentioned conventional problems, the present invention has a high fluidity of the processing liquid with respect to the object to be processed, can ensure the processing efficiency and the uniformity of the object to be processed, and has a high productivity and a high quality surface treatment. It is an object of the present invention to provide an oscillating surface treatment method capable of
【０００５】[0005]
【課題を解決するための手段】本発明の揺動式表面処理
方法は、揺動可能でかつ電極を配設された処理槽中に処
理液と被処理物を収容し、処理槽を揺動させながら電極
間に電圧を印加して電気化学的に被処理物の表面処理を
行うことを特徴とする。According to the rocking type surface treatment method of the present invention, a treatment liquid and an object to be treated are housed in a treatment tank which can be rocked and in which electrodes are arranged, and the treatment tank is rocked. The surface treatment of the object to be treated is electrochemically performed by applying a voltage between the electrodes while performing.
【０００６】[0006]
【作用】本発明によれば、処理槽を揺動することにより
処理液が大きく流動し、処理槽内に支持され又は共に流
動する被処理物に対する流動性が高く頻繁にかつあらゆ
る方向から接触するため、効率的にかつ均一に電気化学
的表面処理が行われ、生産性良く高品質の表面処理がで
きる。According to the present invention, the treatment liquid is largely flowed by rocking the treatment tank, and the object to be treated which is supported or flows in the treatment tank has high fluidity and is frequently and contacted from all directions. Therefore, the electrochemical surface treatment can be efficiently and uniformly performed, and high-quality surface treatment can be performed with high productivity.
【０００７】[0007]
【実施例】以下本発明の揺動式表面処理方法をバレルメ
ッキに適用した第１実施例について図１〜図３を参照し
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment in which the rocking type surface treatment method of the present invention is applied to barrel plating will be described below with reference to FIGS.
【０００８】全体構成を示す図３において、１はメッキ
槽で、その上下方向中間部の両側に配設された揺動軸２
ａ、２ｂを介してフレーム３にて揺動可能に支持されて
いる。一方の揺動軸２ａはフレーム３に設けられた揺動
駆動部４にて揺動駆動可能に構成されている。In FIG. 3 showing the overall structure, 1 is a plating tank, and swinging shafts 2 arranged on both sides of an intermediate portion in the vertical direction thereof.
It is swingably supported by the frame 3 via a and 2b. One of the swing shafts 2a is configured to be swingable by a swing drive unit 4 provided on the frame 3.
【０００９】図１、図２において、メッキ槽１は上面が
開口された多角形容器にて構成され、その内面は絶縁性
ライニング５が施され、かつ適当箇所に陽極６が設けら
れている。この陽極６から陽極リード７がメッキ槽１の
上面開口を通して外部に延出されている。メッキ槽１の
両側上端に支持フランジ８が設けられ、その上面両端部
に配置されたばね９を介して受け板１０が設けられてい
る。受け板１０の中央部にはエアバイブレータ１１が取
付けられている。なお、このエアバイブレータ１１は設
けなくてもよい。1 and 2, the plating tank 1 is composed of a polygonal container having an open upper surface, an inner surface thereof is provided with an insulating lining 5, and an anode 6 is provided at an appropriate position. An anode lead 7 extends from the anode 6 to the outside through an opening in the top surface of the plating tank 1. Supporting flanges 8 are provided on both upper ends of the plating tank 1, and receiving plates 10 are provided via springs 9 arranged at both ends of the upper surface thereof. An air vibrator 11 is attached to the center of the receiving plate 10. The air vibrator 11 may not be provided.
【００１０】１２は被メッキ物を収容して支持する収容
かごであり、上方に支持部１３が突設され、その上端に
左右両側に延びてその両端が受け板１０上に載置支持さ
れる一対の支持棹１４が設けられている。また、受け板
１０における支持棹１４の載置部には絶縁層１５を介し
て陰極用電極１６が設けられ、支持棹１４をこの陰極用
電極１６上に載置することにより収容かご１２を陰極に
帯電するように構成されている。陰極用電極１６からは
陰極リード１７が外部に延出されている。メッキ槽１内
にはメッキ液１８が収容されている。Reference numeral 12 is a storage basket for storing and supporting the object to be plated. A support portion 13 is provided so as to project upward, extends to the left and right sides at its upper end, and both ends thereof are placed and supported on the receiving plate 10. A pair of support rods 14 are provided. Further, a cathode electrode 16 is provided on the mounting portion of the support rod 14 of the receiving plate 10 via an insulating layer 15. By mounting the support rod 14 on the cathode electrode 16, the storage basket 12 is made into a cathode. It is configured to be charged. A cathode lead 17 extends from the cathode electrode 16 to the outside. A plating solution 18 is contained in the plating tank 1.
【００１１】尚、図示は省略しているが、メッキ槽１の
上面開口には必要に応じて開閉可能な蓋を設けることに
より、揺動時にメッキ液１８等が外部に飛散するのを防
止することができる。また、必要に応じてメッキ槽１内
に導電性粒状体を収容してもよい。Although not shown in the drawings, a lid that can be opened and closed as needed is provided at the top opening of the plating tank 1 to prevent the plating solution 18 and the like from splashing outside during rocking. be able to. Moreover, you may store a conductive granular body in the plating tank 1 as needed.
【００１２】次に、上記構成の装置を用いたメッキ処理
動作を説明する。メッキ液１８を収容したメッキ槽１中
に被メッキ物２０を支持した収容かご１２を挿入し、そ
の支持棹１４を受け板１０上に載置して収容かご１２を
支持固定し、陽極リード７と陰極リード１７間に電圧を
印加しながら揺動駆動部４を作動させてメッキ槽１を揺
動させ、また必要に応じてエアバイブレータ１１を作動
させて収容かご１２を介して被メッキ物２０に振動を与
えながら被メッキ物２０に対してメッキ処理を行う。Next, the plating processing operation using the apparatus having the above-mentioned structure will be described. The housing basket 12 supporting the object to be plated 20 is inserted into the plating tank 1 containing the plating solution 18, and the supporting rod 14 is placed on the receiving plate 10 to support and fix the housing basket 12 and the anode lead 7 While the voltage is applied between the cathode lead 17 and the cathode lead 17, the rocking drive unit 4 is operated to rock the plating tank 1, and the air vibrator 11 is also operated as necessary to move the plated object 20 through the storage basket 12. The object to be plated 20 is plated while being vibrated.
【００１３】このメッキ処理時に、メッキ槽１の揺動に
伴ってメッキ液１８が大きく流動するため、メッキ槽１
内に収容かご１２にて支持されている被メッキ物２０に
対して頻繁にかつあらゆる方向から接触・流動する。さ
らに、被メッキ物２０を振動させると一層接触機会が増
加する。そのため、被メッキ物２０に対するメッキ液１
８の接触・流動が確実に行われ、被メッキ物２０に対す
る通電状態が不均一になったり、メッキ液１８の濃度が
不均一になることがなく、効率的にかつ均一に電気化学
反応が行われ、生産性良く高品質のメッキ処理を実現で
きる。During the plating process, the plating solution 18 largely flows as the plating tank 1 swings, so that the plating tank 1
The object 20 to be plated, which is supported by the cage 12 therein, frequently contacts and flows from all directions. Further, when the plated object 20 is vibrated, the chances of contact are further increased. Therefore, the plating liquid 1 for the object to be plated 20
8 is surely contacted and flowed, the electric current to the object to be plated 20 is not uneven, and the concentration of the plating solution 18 is not uneven, so that the electrochemical reaction can be performed efficiently and uniformly. Therefore, high-quality plating can be realized with high productivity.
【００１４】上記実施例では、収容かご１２をメッキ槽
１にて支持するようにした例を示したが、この実施例の
変形実施例として収容かご１２を固定部材にて支持した
状態でメッキ槽１内に配置し、その状態でメッキ槽１を
揺動駆動してメッキ液１８を流動させてメッキ処理を行
うようにしてもよい。In the above embodiment, an example in which the storage car 12 is supported by the plating tank 1 is shown. However, as a modified example of this embodiment, the plating tank is supported with the storage car 12 supported by a fixed member. Alternatively, the plating bath 1 may be oscillated and the plating solution 18 may be caused to flow to perform the plating treatment.
【００１５】上記実施例では、被メッキ物２０を陰極と
しての収容かご１２で支持してメッキ槽１内に挿入した
例を示したが、次にメッキ槽１内に直接被メッキ物２０
を投入するようにした第２実施例を図４、図５を参照し
ながら説明する。In the above embodiment, the object 20 to be plated was supported by the receiving basket 12 as a cathode and inserted into the plating tank 1. Next, the object 20 to be plated is directly placed in the plating tank 1.
A second embodiment in which the charge is input will be described with reference to FIGS. 4 and 5.
【００１６】図４において、１はメッキ槽で、上記実施
例と同様に揺動駆動部４にて揺動駆動可能に構成されて
いる。このメッキ槽１の内壁面の中間部から上部の間で
全周を取り囲むように陽極用の電極２１が設けられ、適
宜通電手段にて電源に接続されている。メッキ槽１内の
底部には陰極用の投入電極２２が配置され、この投入電
極２２から延出されたリード線２３がメッキ槽１の上端
開口から外部に引き出され、電源に接続されている。In FIG. 4, reference numeral 1 denotes a plating tank, which can be rockably driven by a rocking drive unit 4 as in the above embodiment. An electrode 21 for an anode is provided so as to surround the entire circumference between the middle part and the upper part of the inner wall surface of the plating tank 1, and is appropriately connected to a power source by an energizing means. An input electrode 22 for the cathode is arranged at the bottom of the plating tank 1, and a lead wire 23 extending from the input electrode 22 is drawn out from the upper end opening of the plating tank 1 to the outside and connected to a power supply.
【００１７】メッキ槽１内にはメッキ液１８と被メッキ
物２０が収容されている。必要に応じてカーボンブラッ
クや導電性プラスチックや合成樹脂製粒状体表面に銅メ
ッキを施した導電性粒状体を収容してもよい。なお、メ
ッキ液１８は電極２１の少なくとも一部が常に浸漬する
高さまで収容されている。また、メッキ槽１が揺動する
間に少なくとも電極２１の一部が常にメッキ液１８に浸
漬しかつ被メッキ物２０や電極２２は直接触れないよう
に配設されている。A plating solution 18 and an object 20 to be plated are contained in the plating tank 1. If necessary, conductive black particles, conductive plastics, or synthetic resin particles may have copper particles plated on the surface of the conductive particles. The plating liquid 18 is contained up to a height at which at least a part of the electrode 21 is constantly immersed. Further, it is arranged so that at least a part of the electrode 21 is always immersed in the plating solution 18 and the object to be plated 20 and the electrode 22 are not directly touched while the plating tank 1 swings.
【００１８】投入電極２２の詳細を示す図５において、
３１は絶縁性合成樹脂から成る筒体であり、その両端部
を除いて周壁に多数の通電開口３２が形成されている。
この筒体３１の両端部には絶縁性合成樹脂から成る端部
材３３が挿入され、ビス３４にて着脱自在に固定されて
いる。端部材３３の軸芯部には銅製の導電スリーブ３５
が一体的に配設され、この導電スリーブ３５にリード線
２３の端部が接続されるとともに充填材３６にて封止さ
れている。端部材３３の筒体３１内側端部には導電スリ
ーブ３５に達する挿入穴３７が形成され、棒状電極体３
８の端部３８ａが挿入されて導電スリーブ３５に接続さ
れている。尚、棒状電極体３８は図示例では軸芯方向に
複数分割されるとともに嵌合接続部３８ｂにて互いに接
続されている。そして、この棒状電極体３８と筒体１１
の間の間隙に研磨用メディア３９が自由に移動できるよ
うな状態で充填されている。In FIG. 5, which shows the details of the charging electrode 22,
Reference numeral 31 is a cylindrical body made of an insulating synthetic resin, and a large number of conducting openings 32 are formed in the peripheral wall except for both ends thereof.
End members 33 made of an insulative synthetic resin are inserted into both ends of the tubular body 31, and are fixed detachably with screws 34. A conductive sleeve 35 made of copper is attached to the shaft core of the end member 33.
Are integrally arranged, and the ends of the lead wires 23 are connected to the conductive sleeve 35 and sealed with a filler 36. An insertion hole 37 reaching the conductive sleeve 35 is formed at the inner end of the cylindrical body 31 of the end member 33.
The end portion 38 a of 8 is inserted and connected to the conductive sleeve 35. In the illustrated example, the rod-shaped electrode body 38 is divided into a plurality of parts in the axial direction and connected to each other at the fitting connection part 38b. Then, the rod-shaped electrode body 38 and the cylindrical body 11
The space between them is filled with the polishing medium 39 so that it can move freely.
【００１９】次に、上記構成の装置を用いたメッキ処理
動作を説明する。メッキ槽１内にメッキ液１８と被メッ
キ物２０を収容し、電極２１と投入電極２２に電圧を印
加しながら揺動駆動部４を作動させてメッキ槽１を揺動
させ、被メッキ物２０に対してメッキ処理を行う。Next, the plating processing operation using the apparatus having the above-mentioned structure will be described. The plating solution 18 and the object to be plated 20 are housed in the plating tank 1, and the oscillating drive unit 4 is operated while the voltage is applied to the electrode 21 and the input electrode 22 to oscillate the plating tank 1 and the object to be plated 20. Plating treatment is performed on.
【００２０】このメッキ処理時に、メッキ槽１の揺動に
伴ってメッキ液１８と被メッキ物２０が共に攪乱されな
がら大きく流動するため、メッキ液１８が被メッキ物２
０に対してあらゆる方向に流動し、又メッキ槽１の揺動
に伴って槽内のメッキ液１８が投入電極２２の通電開口
３２を通して流通するため筒体３１内に棒状電極体３８
を配置していても通電性は十分に確保される。かくし
て、被メッキ物２０に対する通電状態が不均一になった
り、メッキ液１８の濃度が不均一になることがなく、効
率的にかつ均一に電気化学反応が行われ、生産性良く高
品質のメッキ処理が行われる。During this plating process, the plating solution 18 and the object to be plated 20 both disturb and largely flow due to the swinging of the plating tank 1, so that the plating solution 18 flows to the object 2 to be plated.
Since the plating solution 18 flows in all directions with respect to 0, and the plating solution 18 in the tank flows through the current-carrying openings 32 of the charging electrode 22 as the plating tank 1 rocks, the rod-shaped electrode body 38 in the cylindrical body 31.
Even if they are arranged, sufficient conductivity is secured. In this way, the electricity is not evenly applied to the object to be plated 20 and the concentration of the plating solution 18 is not uneven, and the electrochemical reaction is efficiently and uniformly carried out, resulting in high productivity and high quality plating. Processing is performed.
【００２１】また、メッキ槽１の揺動時に作用する慣性
とメッキ液１８の流通により筒体３１内に充填された研
磨用メディア３９が絶えず移動し、それに伴って棒状電
極体３８表面がこの研磨用メディア３９によって研磨さ
れる。そのため、棒状電極体３８の表面に腐食膜ができ
ても直ぐに除去されるため、通電性を長く確保すること
ができる。さらに、棒状電極体３８が摩耗した場合に
は、ビス３４を外して端部材３３を抜き出して棒状電極
体３８を交換し、逆の手順で組立てることによって簡単
に交換することができる。In addition, the polishing medium 39 filled in the cylindrical body 31 constantly moves due to the inertia acting when the plating tank 1 swings and the flow of the plating solution 18, and the surface of the rod-shaped electrode body 38 is accordingly polished. It is polished by the media 39 for use. Therefore, even if a corrosion film is formed on the surface of the rod-shaped electrode body 38, the corrosion film is immediately removed, so that it is possible to secure a long electrical conductivity. Further, when the rod-shaped electrode body 38 is worn, the screw 34 can be removed, the end member 33 can be extracted, the rod-shaped electrode body 38 can be replaced, and the rod-shaped electrode body 38 can be easily replaced by reassembling.
【００２２】以上の実施例ではメッキ処理における実施
例を示したが、本発明は防錆処理等の他の電気化学的な
表面処理にも同様に適用することができる。In the above-mentioned embodiments, the embodiment in which the plating process is performed is shown. However, the present invention can be applied to other electrochemical surface treatments such as rust prevention treatment.
【００２３】[0023]
【発明の効果】本発明の揺動式表面処理方法によれば、
処理槽を揺動することにより処理液が大きく流動し、処
理槽内に支持され又は共に流動する被処理物に対する流
動性が高く頻繁にかつあらゆる方向から接触するため、
効率的にかつ均一に電気化学的表面処理が行われ、生産
性良く高品質の表面処理ができる。According to the rocking type surface treatment method of the present invention,
The treatment liquid largely flows by rocking the treatment tank, and since the treatment liquid that is supported or flows together with the treatment tank has high fluidity and frequently and comes in contact with all directions,
Efficient and uniform electrochemical surface treatment is performed, and high quality surface treatment can be performed with high productivity.
【図１】本発明の第１実施例のバレルメッキ装置のメッ
キ槽の縦断正面図である。FIG. 1 is a vertical sectional front view of a plating tank of a barrel plating apparatus according to a first embodiment of the present invention.
【図２】同実施例のメッキ槽の縦断側面図である。FIG. 2 is a vertical sectional side view of the plating tank of the same embodiment.
【図３】同実施例のバレルメッキ装置の全体構成を示す
正面図である。FIG. 3 is a front view showing the overall configuration of the barrel plating apparatus of the embodiment.
【図４】本発明の第２実施例のバレルメッキ装置の縦断
正面図である。FIG. 4 is a vertical sectional front view of a barrel plating apparatus according to a second embodiment of the present invention.
【図５】同実施例の投入電極の部分断面正面図である。FIG. 5 is a partial cross-sectional front view of the closing electrode of the same embodiment.
１ メッキ槽（処理槽） ６ 陽極 １２ 収容かご（陰極） １８ メッキ液（処理液） ２０ 被メッキ物（被処理物） ２１ 電極 ２２ 投入電極 DESCRIPTION OF SYMBOLS 1 Plating tank (treatment tank) 6 Anode 12 Storage cage (cathode) 18 Plating liquid (treatment liquid) 20 Object to be plated (object to be treated) 21 Electrode 22 Input electrode
Claims (1)
中に処理液と被処理物を収容し、処理槽を揺動させなが
ら電極間に電圧を印加して電気化学的に被処理物の表面
処理を行うことを特徴とする揺動式表面処理方法。1. A treatment bath and an object to be treated are housed in a treatment bath which is swingable and provided with electrodes, and a voltage is applied between the electrodes while the treatment bath is swung to electrochemically remove the treatment liquid. An oscillating surface treatment method, characterized in that surface treatment of an object is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27067492A JPH06122998A (en) | 1992-10-09 | 1992-10-09 | Oscillated surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27067492A JPH06122998A (en) | 1992-10-09 | 1992-10-09 | Oscillated surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06122998A true JPH06122998A (en) | 1994-05-06 |
Family
ID=17489370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27067492A Pending JPH06122998A (en) | 1992-10-09 | 1992-10-09 | Oscillated surface treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06122998A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030026875A (en) * | 2001-09-25 | 2003-04-03 | 샤프 가부시키가이샤 | Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof |
-
1992
- 1992-10-09 JP JP27067492A patent/JPH06122998A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030026875A (en) * | 2001-09-25 | 2003-04-03 | 샤프 가부시키가이샤 | Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof |
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