JPH06116795A - Continuous plating device - Google Patents
Continuous plating deviceInfo
- Publication number
- JPH06116795A JPH06116795A JP26515992A JP26515992A JPH06116795A JP H06116795 A JPH06116795 A JP H06116795A JP 26515992 A JP26515992 A JP 26515992A JP 26515992 A JP26515992 A JP 26515992A JP H06116795 A JPH06116795 A JP H06116795A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- transport path
- cathode
- plating tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液相メッキ法により被
メッキ部材に連続的にメッキを施す連続メッキ装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous plating apparatus for continuously plating a member to be plated by a liquid phase plating method.
【０００２】[0002]
【従来の技術】従来より、液相メッキ法のメッキ装置と
して、被メッキ部材をかご状のバレル内に収納してお
き、メッキ液を入れたメッキ槽にバレルを浸漬させてメ
ッキを施し、メッキ終了後にバレルをメッキ槽から取り
出すものが提供されている。2. Description of the Related Art Conventionally, as a plating apparatus using a liquid phase plating method, a member to be plated is stored in a basket-shaped barrel, and the barrel is immersed in a plating bath containing the plating solution to perform plating. It is provided that the barrel can be removed from the plating bath after the completion.
【０００３】[0003]
【発明が解決しようとする課題】上述したメッキ装置で
は、バレルに収納可能な量の被メッキ部材を一度にメッ
キ槽に投入し、メッキが終了してから被メッキ部材を取
り出すというバッチ処理を行うものであるから、１バッ
チ当たりの被メッキ部材の量が少ないとコスト高につな
がり、多品種少量生産には向かないという問題がある。
また、被メッキ部材をバレルに出し入れするものである
から、メッキ作業を完全に自動化するのが難しいという
問題があり、さらに、メッキ槽からバレルを取り出した
ときに、バレルにメッキ液が付着しているから、メッキ
液の消費量が多くなるという問題がある。In the above-described plating apparatus, a batch process is performed in which an amount of the member to be plated that can be stored in the barrel is put into the plating tank at one time and the member to be plated is taken out after the plating is completed. Therefore, if the amount of plated members per batch is small, the cost will increase and there is a problem that it is not suitable for high-mix low-volume production.
Further, since the member to be plated is put in and taken out of the barrel, there is a problem that it is difficult to completely automate the plating work. Furthermore, when the barrel is taken out of the plating tank, the plating solution adheres to the barrel. Therefore, there is a problem that the consumption of the plating solution increases.
【０００４】本発明は上記問題点の解決を目的とするも
のであり、被メッキ部材にメッキを逐次施すようにして
多品種少量生産を容易にし、かつメッキ作業の完全な自
動化を可能とし、しかもバレルを用いる場合に比較して
メッキ液の消費量を少なくした連続メッキ装置を提供し
ようとするものである。SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems, and makes it possible to easily perform high-mix low-volume production by sequentially plating a member to be plated and to completely automate the plating operation. It is an object of the present invention to provide a continuous plating apparatus that consumes less plating solution than when using a barrel.
【０００５】[0005]
【課題を解決するための手段】請求項１の発明では、上
記目的を達成するために、円筒状に形成されて中心線が
上下方向になるように配置されメッキ液が入れられるメ
ッキ槽と、メッキ槽の内周面に沿う螺旋状に形成されて
メッキ槽に固着され被メッキ部材が載置される搬送路
と、被メッキ部材が搬送路に沿って上昇方向に移動する
ようにメッキ槽に対して上下方向および周方向の振動を
与える加振器とを具備するのである。In order to achieve the above object, in the invention of claim 1, there is provided a plating tank which is formed in a cylindrical shape and is arranged with its center line in the vertical direction, and which contains a plating solution, A transport path that is formed in a spiral shape along the inner peripheral surface of the plating tank and is fixed to the plating tank on which the member to be plated is placed, and a plating tank so that the member to be plated moves in the ascending direction along the transport path. And a vibration exciter that gives vibrations in the vertical direction and the circumferential direction.
【０００６】請求項２の発明では、メッキ液が無電解メ
ッキ用に調製されている。請求項３の発明では、メッキ
槽内にはメッキ液に浸漬された陽極が配設され、搬送路
の上面には被メッキ部材に接触可能な櫛状の陰極が櫛歯
を搬送路の幅方向に並べる形で搬送路の全長に亙って多
数個列設され、陽極と陰極との間に通電され被メッキ部
材に電気メッキが施されるのである。In the invention of claim 2, the plating solution is prepared for electroless plating. In the invention of claim 3, the anode immersed in the plating solution is provided in the plating tank, and the comb-shaped cathode capable of contacting the member to be plated has comb teeth on the upper surface of the transport path in the width direction of the transport path. A large number of them are arranged in a line along the entire length of the transport path in a lined manner, and current is applied between the anode and the cathode to electroplate the member to be plated.
【０００７】請求項４の発明では、メッキ槽内にはメッ
キ液に浸漬された陽極が配設され、搬送路の上面には、
被メッキ部材に接触可能なピン状の多数の陰極が配列さ
れるとともに、各陰極がそれぞれ嵌入される貫通穴を有
し陰極の先端部を貫通穴内に収める弾性材料の保護層が
積層され、保護層の弾性は被メッキ部材の重みによって
陰極の先端部を保護層から露出させて被メッキ部材に陰
極を接触させる程度に設定され、陽極と陰極との間に通
電され被メッキ部材に電気メッキが施されるのである。In the invention of claim 4, the anode immersed in the plating solution is disposed in the plating tank, and the upper surface of the transport path is
A large number of pin-shaped cathodes that can come into contact with the plated member are arranged, and a protective layer of elastic material is stacked to protect the cathode by stacking through holes with the through holes inserted into each cathode The elasticity of the layer is set so that the tip of the cathode is exposed from the protective layer by the weight of the member to be plated and the cathode is brought into contact with the member to be plated, and electric current is applied between the anode and the cathode to electroplate the member to be plated. It is given.
【０００８】請求項５の発明では、搬送路は、被メッキ
部材が載置される平板状の主片と、主片の側縁のうち螺
旋の内周側の側縁から上向きに一体に突出する側片とを
有する形状に形成されているのである。請求項６の発明
では、被メッキ部材をメッキ槽に投入してから搬送路の
上端まで移動する間の処理を１過程として、複数過程を
繰り返すのである。According to the fifth aspect of the present invention, the transport path integrally projects upward from the flat plate-shaped main piece on which the member to be plated is placed and the inner peripheral side edge of the spiral among the side edges of the main piece. It is formed in a shape having a side piece to be formed. According to the sixth aspect of the invention, a plurality of processes are repeated, with one process being a process of moving the member to be plated into the plating tank and moving it to the upper end of the transport path.
【０００９】[0009]
【作用】請求項１の構成によれば、円筒状のメッキ槽の
内周面に螺旋状の搬送路を形成するとともに、メッキ槽
を加振器により周方向および上下方向に振動させること
によって、被メッキ部材を搬送路に沿って上向きに移動
させるのであり、メッキ槽内に形成された搬送路に沿っ
て被メッキ部材を一方向に搬送していくことによって、
被メッキ部材のメッキ作業をバッチ処理ではなく連続処
理で行うことができるのである。すなわち、バッチ処理
に比較すれば、被メッキ部材の個数が少ない場合でもメ
ッキに要するコストの増加がなく、多品種を少量生産す
る場合でもメッキ工程でのコスト増が生じないのであ
る。しかも、被メッキ部材は、搬送路を下から上に搬送
されるのであって、メッキを施した被メッキ部材をメッ
キ槽の上部から取り出すことができるから、メッキ槽に
投入した被メッキ部材をメッキ液を流出させることなく
取り出すことができるのであって、従来のようにバレル
を用いる必要がなく、メッキ槽に投入した被メッキ部材
を順次取り出すことができ、結果的にメッキ部材の投入
および取出の作業を完全に自動化することが可能にな
る。さらに、バレルを用いていないからバレルにメッキ
液が付着して外部にメッキ液が持ち出されることがな
く、バレルを用いる場合に比較してメッキ液の消費量が
大幅に減少するのである。また、メッキ槽からのメッキ
液の流出量が減少することによって、環境汚染を軽減す
ることができることになる。According to the structure of claim 1, the spiral transport path is formed on the inner peripheral surface of the cylindrical plating tank, and the plating tank is vibrated in the circumferential direction and the vertical direction by the vibrator. The member to be plated is moved upward along the transport path, and by transporting the member to be plated in one direction along the transport path formed in the plating tank,
It is possible to perform the plating operation of the member to be plated by continuous processing instead of batch processing. That is, as compared with batch processing, the cost required for plating does not increase even when the number of members to be plated is small, and the cost increase in the plating process does not occur even when a large number of different types of products are produced in small quantities. Moreover, since the member to be plated is conveyed from the bottom to the upper part of the conveying path, the plated member to be plated can be taken out from the upper portion of the plating tank. Since the liquid can be taken out without flowing out, there is no need to use a barrel as in the conventional case, and the members to be plated put in the plating tank can be taken out one after another, resulting in the loading and unloading of the plating member. It will be possible to completely automate the work. Further, since the barrel is not used, the plating liquid does not adhere to the barrel and is not brought out to the outside, and the consumption of the plating liquid is greatly reduced as compared with the case where the barrel is used. Further, environmental pollution can be reduced by reducing the outflow amount of the plating solution from the plating tank.
【００１０】請求項２の構成は、メッキ液の一例であっ
てメッキ槽の中で無電解メッキを行うものである。請求
項３の構成は、電気メッキを行う場合の構成の一例であ
って、櫛状に形成した多数の陰極を搬送路の全長に亙っ
て列設しているから、被メッキ部材と陰極とが接触する
機会を多くすることができ、被メッキ部材にメッキによ
って形成される膜の厚みを比較的大きくすることができ
ることになる。The structure of claim 2 is an example of a plating solution, and is for performing electroless plating in a plating tank. The structure of claim 3 is an example of a structure for performing electroplating, and since a large number of comb-shaped cathodes are arranged in a row over the entire length of the transport path, the member to be plated and the cathode are It is possible to increase the chances of contact with each other and to relatively increase the thickness of the film formed on the member to be plated by plating.
【００１１】請求項４の構成は、電気メッキを行う場合
の構成の一例であって、陰極をピン状に形成するととも
に、伝送路の上面に積層した弾性材料の保護層によって
陰極の先端部を囲んでおき、被メッキ部材の重みで保護
層が押されたときに陰極の先端部が保護層から露出して
被メッキ部材に接触するようにしているので、被メッキ
部材が陰極付近に到達するまでは、陰極は保護層からほ
とんど露出せず、陰極にメッキが施されるのを抑制する
ことができる。According to a fourth aspect of the present invention, which is an example of a configuration in which electroplating is performed, the cathode is formed in a pin shape, and the tip of the cathode is formed by a protective layer of an elastic material laminated on the upper surface of the transmission line. Since the tip of the cathode is exposed from the protective layer and contacts the member to be plated when the protective layer is pressed by the weight of the member to be plated, the member to be plated reaches the vicinity of the cathode. Until then, the cathode is barely exposed from the protective layer, and plating of the cathode can be suppressed.
【００１２】請求項５の構成では、搬送路が、被メッキ
部材が載る平板状の主片と、主片の側縁のうち螺旋の内
周側の側縁から上向きに突出する側片とを有する形状に
形成されているので、搬送路の上で被メッキ部材が幅方
向の中央付近に集中することがなく、被メッキ部材をメ
ッキ液に十分に接触させることができ、各被メッキ部材
にほぼ均一にメッキを施すことができるのである。According to the fifth aspect of the present invention, the transport path includes a flat plate-shaped main piece on which the member to be plated is placed, and a side piece protruding upward from a side edge on the inner peripheral side of the spiral among the side edges of the main piece. Since the member to be plated is formed on the conveying path, the member to be plated does not concentrate near the center in the width direction, and the member to be plated can be sufficiently brought into contact with the plating liquid. The plating can be applied almost uniformly.
【００１３】請求項６の構成では、被メッキ部材をメッ
キ槽に投入してから搬送路の上端まで移動する間の処理
を１過程として複数過程を繰り返すので、被メッキ部材
が１つのメッキ槽の中で搬送路を複数回通過するように
したり、被メッキ部材が複数のメッキ槽に順次投入され
るようにすることによって、複数過程でメッキを繰り返
すことができる。したがって、１過程では十分な厚みの
膜を形成できない場合であっても、複数過程でメッキを
施すことによって所要の厚みの膜を容易に形成すること
ができるのである。According to the sixth aspect of the present invention, a plurality of steps are repeated, with one step being a process of moving the member to be plated into the plating tank and moving to the upper end of the transport path. It is possible to repeat the plating in a plurality of steps by making the carrier pass through the conveying path a plurality of times or by sequentially loading the members to be plated into a plurality of plating tanks. Therefore, even if a film having a sufficient thickness cannot be formed in one step, a film having a desired thickness can be easily formed by performing plating in a plurality of steps.
【００１４】[0014]
（実施例１）図１に示すように、下面が閉塞され上面が
開放された円筒状のメッキ槽１の内周面に螺旋状の搬送
路２が一体に形成される。メッキ槽１の底面は中央部が
周部よりも高くなる凸状に形成され、メッキ槽１に投入
されてメッキ槽１の底部に入った被メッキ部材Ａがメッ
キ槽１の周部に集まるようにしてある。搬送路２は、メ
ッキ槽１の内周面に一側縁が固着された平板状の主片２
ａと、主片２ａの他側縁から上方に突出した側片２ｂと
を連続一体に備える形状に塩化ビニル等によって形成さ
れ、主片２ａの上に被メッキ部材Ａが載るようになって
いる。搬送路２はメッキ槽１に対して幅方向の一側縁の
みが固定されて片持ちになっている。搬送路２の主片２
ａの上面には全長に亙って線状の陰極３が配設される。
図１では陰極３を１条だけ設けているが、複数条設ける
ようにしてもよい。一方、メッキ槽１において搬送路２
よりも内周側には、八角形状に形成された陽極保持板４
の周縁に上端部が結合された短冊状の８本の陽極板５が
挿入される。メッキ槽１の周壁の上部には、メッキ槽１
に入れたメッキ液の液面よりも上方で排出口６が開口
し、搬送路２の上端部は排出口６を通してメッキ槽１の
外部に突出する。また、搬送路２の下端はメッキ槽１の
底面に連続している。(Embodiment 1) As shown in FIG. 1, a spiral transport path 2 is integrally formed on the inner peripheral surface of a cylindrical plating tank 1 whose lower surface is closed and whose upper surface is open. The bottom surface of the plating tank 1 is formed in a convex shape such that the central portion is higher than the peripheral portion, so that the members A to be plated that have been introduced into the plating tank 1 and have entered the bottom portion of the plating tank 1 gather at the peripheral portion of the plating tank 1. I am doing it. The transport path 2 is a flat plate-shaped main piece 2 having one side edge fixed to the inner peripheral surface of the plating tank 1.
a and a side piece 2b projecting upward from the other side edge of the main piece 2a are formed integrally from vinyl chloride or the like, and the member A to be plated is placed on the main piece 2a. . The transport path 2 is cantilevered by fixing only one side edge in the width direction with respect to the plating tank 1. Main piece 2 of transport path 2
A linear cathode 3 is provided over the entire length of the upper surface of a.
Although only one cathode 3 is provided in FIG. 1, a plurality of cathodes 3 may be provided. On the other hand, the transport path 2 in the plating tank 1
Anode holding plate 4 formed in an octagonal shape on the inner peripheral side of
Eight strip-shaped anode plates 5 each having an upper end coupled to the peripheral edge thereof are inserted. On the upper part of the peripheral wall of the plating tank 1, the plating tank 1
The discharge port 6 is opened above the liquid surface of the plating liquid put in, and the upper end portion of the transport path 2 projects to the outside of the plating tank 1 through the discharge port 6. Further, the lower end of the transport path 2 is continuous with the bottom surface of the plating tank 1.
【００１５】メッキ槽１の下面には加振器１０の可動台
１１が結合される。加振器１０は、図２に示すように、
防振のためのゴムよりなる据置座１３を備えた固定ベー
ス１２を備え、固定ベース１２の上に２個の電磁ソレノ
イド１４が配置されている。可動台１１は十字形に形成
され、可動台１１の各片が板ばね１５を介して固定ベー
ス１２に結合されることによって、可動台１１は固定ベ
ース１２の上方に配設される。また、可動台１１のうち
の２片には電磁ソレノイド１４に吸引される磁極板１６
が垂設される。板ばね１５は電磁ソレノイド１４が励磁
されていない状態では、図２（ｂ）のように傾斜して配
置されており、電磁ソレノイド１４の励磁によって磁極
板１６が吸引力を受けると、可動台１１が図２（ａ）に
おける左回りに回転し、このとき可動台１１の固定ベー
ス１２に対する距離が板ばね１５によって規制されてい
ることによって、可動台１１は固定ベース１２から離れ
るように移動する。すなわち、電磁ソレノイド１４が励
磁されると、可動台１１は回転しながら上方に移動する
ことになる。電磁ソレノイド１４の励磁を被励磁にする
と、板ばね１５の復帰力によって可動台１１は元の位置
に復帰する。電磁ソレノイド１４は、端子台１７を介し
てリード線１８に接続される。A movable base 11 of the vibrator 10 is coupled to the lower surface of the plating tank 1. The shaker 10 is, as shown in FIG.
A fixed base 12 having a stationary seat 13 made of rubber for vibration isolation is provided, and two electromagnetic solenoids 14 are arranged on the fixed base 12. The movable base 11 is formed in a cross shape, and each piece of the movable base 11 is coupled to the fixed base 12 via the leaf spring 15, so that the movable base 11 is arranged above the fixed base 12. In addition, a magnetic pole plate 16 attracted by the electromagnetic solenoid 14 is provided on two pieces of the movable table 11.
Is erected. When the electromagnetic solenoid 14 is not excited, the leaf springs 15 are arranged so as to be inclined as shown in FIG. 2B. When the magnetic pole plate 16 receives an attractive force due to the excitation of the electromagnetic solenoid 14, the movable table 11 is moved. 2 rotates counterclockwise in FIG. 2A. At this time, the distance between the movable base 11 and the fixed base 12 is regulated by the leaf spring 15, so that the movable base 11 moves away from the fixed base 12. That is, when the electromagnetic solenoid 14 is excited, the movable table 11 moves upward while rotating. When the electromagnetic solenoid 14 is excited to be excited, the movable base 11 returns to its original position by the restoring force of the leaf spring 15. The electromagnetic solenoid 14 is connected to the lead wire 18 via a terminal block 17.
【００１６】上述したように、電磁ソレノイド１４の励
磁・非励磁によって、加振器１０の可動台１１は回転方
向に振動するとともに上下方向に振動するのであって、
可動台１１にはメッキ槽１が結合されているから、加振
器１０によってメッキ槽１を周方向および上下方向に振
動させることができる。したがって、電磁ソレノイド１
４を励磁すれば、搬送路２の上の被メッキ部材Ａが斜め
上向きの力を受けて浮き上がり、ここで電磁ソレノイド
１４を非励磁にすると被メッキ部材Ａは搬送路２の上を
転がりながら上方に進むのである。ここに、搬送路２は
片持ちになっているから、加振器１０によるメッキ槽１
の振動によって、搬送路２が煽り運動を行うことにな
り、図３に矢印で示すように、メッキ槽１に入れられた
メッキ液を攪拌することになる。ここに、加振器１０の
振動周期をメッキ槽１に共振するように設定すれば、搬
送路２の煽り運動によってメッキ槽１の外周側から内周
側に向けて強い水流が生じることになり、被メッキ部材
Ａにメッキ液を十分に接触させることができて、効率よ
くメッキを行うことができる。As described above, the movable base 11 of the vibration exciter 10 vibrates in the rotational direction and the vertical direction by the excitation / non-excitation of the electromagnetic solenoid 14,
Since the plating tank 1 is coupled to the movable table 11, the vibration tank 10 can vibrate the plating tank 1 in the circumferential direction and the vertical direction. Therefore, the electromagnetic solenoid 1
4 is excited, the member A to be plated on the transport path 2 is lifted up by the obliquely upward force, and when the electromagnetic solenoid 14 is de-energized, the member A to be plated rolls on the transport path 2 and moves upward. Proceed to. Since the transfer path 2 is cantilevered here, the plating tank 1 using the vibrator 10 is used.
The vibration of the carrier path 2 causes the transport path 2 to sway, and as shown by the arrow in FIG. 3, the plating solution contained in the plating tank 1 is agitated. If the vibration cycle of the vibrator 10 is set to resonate with the plating tank 1, a strong water flow is generated from the outer peripheral side to the inner peripheral side of the plating tank 1 due to the wobbling motion of the transport path 2. The plating liquid can be sufficiently brought into contact with the member A to be plated, and plating can be performed efficiently.
【００１７】一方、メッキ槽１が振動すると、被メッキ
部材Ａは陰極３から離れやすくなって振動の振幅が大き
いほどメッキが行われる時間が短くなるから、メッキが
行われる時間を長くするために、加振器１０によるメッ
キ槽１の振動は間欠的に行うのが望ましい。すなわち、
メッキ槽１の振動の振幅および周期は、メッキの効率に
関係するのであって、メッキの効率は、図４に示すよう
に、直流電源２４に接続された陰極３と陽極板５との間
の通電電流によって知ることができるから、振動センサ
２１により検出されるメッキ槽１の振動と、電流検出部
２２により検出される陰極３と陽極板５との間の通電電
流とに基づいて、制御回路２０を通して加振器１０によ
る振動の振幅および周期を制御するようにしてある。こ
こに、制御回路２０はマイクロコンピュータなどを用い
たデジタル回路であって、振動センサ２１の出力はＡ／
Ｄ変換器２３によってデジタル信号に変換される。この
ように加振器１０の振動の振幅および周期を、メッキ槽
１の振動およびメッキ電流に基づいて制御することによ
って、メッキ槽１に投入される被メッキ部材Ａの量やメ
ッキ液の種類などによってメッキ槽１の共振周波数が変
動しても、加振器１０の振動周期をメッキ槽１の変化に
対応させることが可能になり、メッキ処理が適切に行わ
れるように制御することができるのである。On the other hand, when the plating tank 1 vibrates, the member A to be plated is easily separated from the cathode 3, and the larger the vibration amplitude is, the shorter the plating time is. Therefore, the plating time is increased. It is desirable that the vibration of the plating tank 1 by the vibrator 10 be performed intermittently. That is,
Since the amplitude and cycle of the vibration of the plating tank 1 are related to the efficiency of plating, the efficiency of plating is, as shown in FIG. 4, between the cathode 3 and the anode plate 5 connected to the DC power supply 24. Since it can be known from the energized current, the control circuit is based on the vibration of the plating tank 1 detected by the vibration sensor 21 and the energized current between the cathode 3 and the anode plate 5 detected by the current detector 22. The amplitude and the cycle of the vibration by the vibration exciter 10 are controlled through 20. Here, the control circuit 20 is a digital circuit using a microcomputer or the like, and the output of the vibration sensor 21 is A /
It is converted into a digital signal by the D converter 23. In this way, by controlling the amplitude and cycle of the vibration of the shaker 10 based on the vibration of the plating tank 1 and the plating current, the amount of the member A to be plated in the plating tank 1, the type of the plating solution, etc. Even if the resonance frequency of the plating tank 1 fluctuates, the vibration cycle of the vibration exciter 10 can be made to correspond to the change of the plating tank 1, and the plating process can be controlled to be performed appropriately. is there.
【００１８】上述の構成によって、搬送路２の内周と陽
極板５との間に被メッキ部材Ａを投入すれば、メッキ槽
１の底面は中央部が周部よりも突出していることによっ
て、加振器１０での振動に伴って被メッキ部材Ａがメッ
キ槽１の周部に集められ搬送路２に導入されることにな
る。その後、メッキ槽１０の振動に伴って被メッキ部材
Ａは搬送路２を上方に移動しながらメッキ処理が施さ
れ、排出口６を通してメッキ槽１の外部に取り出される
のである。With the above structure, when the member A to be plated is put between the inner periphery of the transport path 2 and the anode plate 5, the center of the bottom surface of the plating tank 1 is projected more than the peripheral portion. The member A to be plated is gathered in the peripheral portion of the plating tank 1 and introduced into the transport path 2 in accordance with the vibration in the vibrator 10. Thereafter, the member A to be plated is subjected to a plating process while moving upward in the transport path 2 in accordance with the vibration of the plating tank 10, and is taken out of the plating tank 1 through the discharge port 6.
【００１９】上記構成では陰極３は線状に形成されてい
るが、陰極３を点状に形成し搬送路２の全長に亙って列
設してもよい。また、本実施例では、電気メッキの例を
示したが、陰極３や陽極板５を設けずに、メッキ液を無
電解メッキ用に調製して無電解メッキを行うようにして
もよい。この場合、上述したように、搬送路２の煽り運
動によって被メッキ部材Ａとメッキ液とを十分に接触さ
せることができ、被メッキ部材Ａが搬送路２の上で転が
りながら移動するから、メッキによる膜を効率よくかつ
均一に形成することができるのである。In the above construction, the cathode 3 is formed in a linear shape, but the cathode 3 may be formed in a dot shape and arranged in a line over the entire length of the conveying path 2. In addition, although an example of electroplating is shown in the present embodiment, electroless plating may be performed by preparing a plating solution for electroless plating without providing the cathode 3 and the anode plate 5. In this case, as described above, the member A to be plated and the plating liquid can be sufficiently brought into contact with each other by the tilting motion of the carrier path 2, and the member A to be plated moves while rolling on the carrier path 2. The film can be formed efficiently and uniformly.
【００２０】（実施例２）本実施例では、図５および図
６に示すように、陰極３を銅合金やアルミニウム合金に
よって櫛状に形成している。すなわち、陰極３は板金を
打ち抜くことによって櫛歯３ａを備える形状に形成さ
れ、櫛歯３ａを搬送路２の幅方向に並べる形で、搬送路
２の全長に亙って多数の陰極３が列設されるのである。
陰極３は搬送路２に注入されたエポキシ樹脂等の絶縁層
７によって搬送路２に固着され、絶縁層７の上面に対し
て櫛歯３ａが０．０５〜０．５ｍｍ程度突出するように
配置されている。櫛歯３ａの絶縁層７からの突出量は被
メッキ部材Ａの移動を妨げず、かつ被メッキ部材Ａに櫛
歯３ａの先端部が接触できるように設定されている。ま
た、陰極３の両側部にはリード線３ｂが挿通され、この
リード線３ｂを介して各陰極３が電気的に接続される。(Embodiment 2) In this embodiment, as shown in FIGS. 5 and 6, the cathode 3 is formed in a comb shape from a copper alloy or an aluminum alloy. That is, the cathode 3 is formed in a shape having comb teeth 3 a by punching out a sheet metal, and the comb teeth 3 a are arranged in the width direction of the conveying path 2 so that a large number of cathodes 3 are arranged along the entire length of the conveying path 2. Is set up.
The cathode 3 is fixed to the transport path 2 by an insulating layer 7 made of epoxy resin or the like injected into the transport path 2 and arranged so that the comb teeth 3a protrude from the upper surface of the insulating layer 7 by about 0.05 to 0.5 mm. Has been done. The protruding amount of the comb teeth 3a from the insulating layer 7 is set so as not to hinder the movement of the member A to be plated and to allow the tip end of the comb teeth 3a to come into contact with the member A to be plated. Lead wires 3b are inserted through both sides of the cathode 3, and the cathodes 3 are electrically connected via the lead wires 3b.
【００２１】本実施例の陰極３では、被メッキ部材Ａと
の接触箇所が多くなるから、搬送路２を移動する被メッ
キ部材Ａの陰極３への接触回数が多くなり、結果的に効
率よくメッキを行うことができるのである。また、１本
の櫛歯３ａについては露出面積を小さくすることができ
るから、陰極３に対するメッキによる膜の付着を小さく
することができ、メッキ液の消耗を抑制することができ
る。他の構成は実施例１と同様である。In the cathode 3 of this embodiment, since the number of contact points with the member A to be plated increases, the number of times the member A to be plated moving on the transport path 2 contacts the cathode 3 increases, resulting in efficient and efficient operation. It can be plated. Further, since the exposed area of one comb tooth 3a can be reduced, the adhesion of the film to the cathode 3 due to plating can be reduced, and the consumption of the plating solution can be suppressed. Other configurations are similar to those of the first embodiment.
【００２２】（実施例３）本実施例では、図７に示すよ
うに、搬送路２の上に載置された基板３ｃにピン状の接
触子３ｄを多数本立設した形状の陰極３を用いるととも
に、基板３ｃの上に保護層８を積層し、保護層８に形成
した貫通穴８ａに接触子３ｄを挿通した例を示す。陰極
３は、チタンやステンレスのように、メッキによる膜の
付着強度が小さくなるような材料により形成される。陰
極３の基板３ｃは、搬送路２の上にエポキシ樹脂等の接
着層９ａを介して固着され、さらに基板３ｃの上にエポ
キシ樹脂等の接着層９ｂを介して保護層８が固着され
る。(Embodiment 3) In this embodiment, as shown in FIG. 7, a cathode 3 having a shape in which a large number of pin-shaped contacts 3d are erected on a substrate 3c placed on a conveying path 2 is used. In addition, an example is shown in which the protective layer 8 is laminated on the substrate 3c and the contact 3d is inserted into the through hole 8a formed in the protective layer 8. The cathode 3 is formed of a material such as titanium or stainless steel that reduces the adhesion strength of the film formed by plating. The substrate 3c of the cathode 3 is fixed onto the transport path 2 via an adhesive layer 9a of epoxy resin or the like, and further the protective layer 8 is fixed onto the substrate 3c via an adhesive layer 9b of epoxy resin or the like.
【００２３】保護層８は、ポリウレタンなどよりなる軟
質プラスチックフォームやゴムなどの弾性材料により形
成され、図７（ａ）のように、被メッキ部材Ａが接触子
３ｄの近傍に載置されない状態では、接触子３ｄの先端
部は保護層８に囲まれて外部にほとんど露出しない状態
になっている。ここにおいて、貫通穴８は接触子３ｄよ
りも直径が小さく形成されており、被メッキ部材Ａが接
触子３ｄの近傍で保護層８に載っていない状態では、接
触子３ｄの先端面の一部を保護層８が覆うようになって
いる。また、図７（ｂ）のように、接触子３ｄの近傍で
保護層８に被メッキ部材Ａが載ると、被メッキ部材Ａの
重みで保護層８が撓み、接触子３ｄの先端部が保護層８
から露出して被メッキ部材Ａに接触するようになってい
る。The protective layer 8 is formed of a flexible plastic foam made of polyurethane or the like or an elastic material such as rubber. As shown in FIG. 7A, the plated member A is not placed in the vicinity of the contact 3d. The tip of the contactor 3d is surrounded by the protective layer 8 and is barely exposed to the outside. Here, the through hole 8 is formed with a diameter smaller than that of the contactor 3d, and when the member A to be plated is not placed on the protective layer 8 in the vicinity of the contactor 3d, a part of the tip surface of the contactor 3d is formed. Is covered with a protective layer 8. Further, as shown in FIG. 7B, when the member A to be plated is placed on the protective layer 8 in the vicinity of the contactor 3d, the weight of the member A to be plated bends the protective layer 8 and protects the tip of the contactor 3d. Layer 8
It is exposed from and comes into contact with the member A to be plated.
【００２４】上述したように、被メッキ部材Ａが接触子
３ｄの近傍に移動してくるまでは、接触子３ｄの先端部
は保護層８からほとんど露出せず、しかも陰極３にはメ
ッキによる膜の付着強度の小さい材料が選択されている
から、陰極３に対してメッキによる膜の付着が少なくな
るのである。すなわち、陽極板５の消耗やメッキ液の疲
労が少なくなる。ここで、接触子３ｄの配列形態として
は、図８（ａ）のように千鳥状の配列、図８（ｂ）のよ
うに搬送路２の全長に亙って一列にした配列、図８
（ｃ）のように搬送路２の全長に亙って二列にした配列
などどのような形態としてもよい。他の構成は実施例１
と同様である。As described above, until the member A to be plated moves near the contactor 3d, the tip of the contactor 3d is barely exposed from the protective layer 8 and the cathode 3 is covered with a film by plating. Since the material having a low adhesion strength is selected, the adhesion of the film due to plating on the cathode 3 is reduced. That is, consumption of the anode plate 5 and fatigue of the plating solution are reduced. Here, as the arrangement form of the contacts 3d, a zigzag arrangement as shown in FIG. 8 (a), an arrangement arranged in a line over the entire length of the conveyance path 2 as shown in FIG. 8 (b), and FIG.
As in the case of (c), it may have any form such as an array having two rows over the entire length of the transport path 2. The other configuration is the first embodiment.
Is the same as.
【００２５】（実施例４）本実施例では、図９に示すよ
うに、２個のメッキ槽１を並べて一方のメッキ槽１の搬
送路２の上端部から排出される被メッキ部材Ａをコンベ
アＢの始端に載せるようにし、コンベアＢの終端を他方
のメッキ槽１の上方に位置させた構成を有している。す
なわち、一方のメッキ槽１で被メッキ部材Ａにメッキを
施した後に被メッキ部材ＡをコンベアＢによって他方の
メッキ槽１に搬送して投入することによって、被メッキ
部材Ａのメッキ槽１でのメッキ処理を２回連続して行う
ようにしたものである。すなわち、メッキ槽１での１回
のメッキ処理を１過程とし、同じメッキ処理を２過程行
うことによって、メッキによる膜の厚みを大きくするこ
とができるものである。過程の回数はメッキによる形成
する膜の厚みに応じて適宜選択すればよい。各メッキ槽
１については実施例１ないし実施例３と同様の構成であ
る。なお、各メッキ槽１には個別に加振器１０を設けて
いるが、１個の加振器１０を各メッキ槽１で共用しても
よい。(Embodiment 4) In this embodiment, as shown in FIG. 9, two plating tanks 1 are arranged side by side, and the member A to be plated discharged from the upper end of the transport path 2 of one plating tank 1 is conveyed. It has a structure in which it is placed on the starting end of B and the end of the conveyor B is located above the other plating tank 1. That is, by plating the member A to be plated in one plating tank 1 and then transporting the member A to be plated into the other plating tank 1 by the conveyor B, the member A to be plated in the plating tank 1 is The plating treatment is performed twice continuously. That is, the thickness of a film formed by plating can be increased by performing one plating process in the plating tank 1 as one process and performing the same plating process in two processes. The number of steps may be appropriately selected according to the thickness of the film formed by plating. Each plating tank 1 has the same configuration as that of the first to third embodiments. Although each plating tank 1 is provided with the shaker 10 individually, one shaker 10 may be shared by each plating tank 1.
【００２６】ここで、メッキによる膜の厚みを大きくす
るには、メッキ槽１でのメッキ処理を複数回繰り返せば
よいから、１個のメッキ槽１の内側で排出口６の近傍に
シャタ（図示せず）を設ける構成としてもよい。すなわ
ち、搬送路２を排出口６の近傍まで上昇してきた被メッ
キ部材Ａを排出口６からメッキ槽１の外に出さないよう
にシャッタによって通路を遮断し、かつ搬送路２の内周
と陽極板５との間に被メッキ部材Ａを再投入できるよう
な形状にシャッタを形成しておけば、被メッキ部材Ａに
ついて１つのメッキ槽１の中で複数過程を繰り返すこと
ができ、結果的に複数個のメッキ槽１でメッキ処理を連
続して行う場合と同様のメッキ処理を行うことができ
る。上記過程を所要回数繰り返した後にシャッタを開け
ば、被メッキ部材Ａをメッキ槽１の外部に取り出すこと
ができるのである。このような構成は、複数個のメッキ
槽１を設置する場所が確保できないような場合にとくに
有効である。Here, in order to increase the thickness of the film formed by plating, it is sufficient to repeat the plating treatment in the plating tank 1 a plurality of times, and therefore, in the vicinity of the discharge port 6 inside one plating tank 1 (see FIG. (Not shown) may be provided. That is, the passage is blocked by a shutter so as to prevent the member A to be plated, which has risen up to the vicinity of the discharge port 6 from the discharge port 6, from coming out of the plating tank 1 from the discharge port 6, and the inner periphery of the transport path 2 and the anode. If the shutter is formed between the plate 5 and the member A to be plated again, a plurality of processes can be repeated in one plating tank 1 for the member A to be plated, and as a result, The same plating treatment as in the case where the plating treatment is continuously performed in the plurality of plating tanks 1 can be performed. The member A to be plated can be taken out of the plating tank 1 by opening the shutter after repeating the above process a required number of times. Such a configuration is particularly effective when it is not possible to secure a place for installing a plurality of plating tanks 1.
【００２７】[0027]
【発明の効果】本発明は、円筒状のメッキ槽の内周面に
螺旋状の搬送路を形成するとともに、メッキ槽を加振器
により周方向および上下方向に振動させることによっ
て、被メッキ部材を搬送路に沿って上向きに移動させる
ので、被メッキ部材のメッキ作業をバッチ処理ではなく
連続処理で行うことができるという効果を奏する。すな
わち、バッチ処理に比較すれば、被メッキ部材の個数が
少ない場合でもメッキに要するコストの増加がなく、多
品種を少量生産する場合でもメッキ工程でのコスト増が
生じないという利点がある。しかも、被メッキ部材は、
搬送路を下から上に搬送され、メッキを施した被メッキ
部材をメッキ槽の上部から取り出すことができるから、
メッキ槽に投入した被メッキ部材を順次取り出すことが
でき、結果的にメッキ部材の投入および取出の作業を完
全に自動化することが可能になる。さらに、メッキ槽に
投入した被メッキ部材をメッキ液を流出させることなく
取り出すことができ、しかも、バレルを用いていないか
ら、メッキ液の消費量を大幅に低減することができる。
また、メッキ槽からのメッキ液の流出量が減少すること
によって、環境汚染を軽減することができるという利点
もある。According to the present invention, a member to be plated is formed by forming a spiral conveying path on the inner peripheral surface of a cylindrical plating tank and vibrating the plating tank in the circumferential direction and the vertical direction by a vibrator. Is moved upward along the transport path, so that there is an effect that the plating operation of the member to be plated can be performed by continuous processing instead of batch processing. That is, compared with the batch processing, there is an advantage that the cost required for plating does not increase even when the number of members to be plated is small, and the cost does not increase in the plating process even when a small number of various products are produced. Moreover, the plated member is
Since the member to be plated that has been transported from the bottom to the top of the transport path can be taken out from the top of the plating tank,
The members to be plated that have been put into the plating tank can be sequentially taken out, and as a result, it becomes possible to completely automate the work of putting and taking out the plated members. Furthermore, the member to be plated in the plating tank can be taken out without causing the plating solution to flow out, and since the barrel is not used, the consumption of the plating solution can be greatly reduced.
Further, there is an advantage that environmental pollution can be reduced by reducing the outflow amount of the plating solution from the plating tank.
【００２８】本発明の構成は、電気メッキと無電解メッ
キとのいずれの場合でも利用できるものであって、電気
メッキを行う場合には、請求項３の発明のように、櫛状
に形成された多数の陰極を搬送路の全長に亙って列設す
れば、被メッキ部材と陰極とが接触する機会を多くする
ことができ、被メッキ部材にメッキによって形成される
膜の厚みを比較的大きくすることができるという利点が
ある。The structure of the present invention can be used in both electroplating and electroless plating, and when electroplating is performed, it is formed in a comb shape as in the invention of claim 3. By arranging a large number of cathodes in a row over the entire length of the transport path, it is possible to increase the chances of contact between the member to be plated and the cathode, and to make the thickness of the film formed by plating on the member to be plated relatively large. It has the advantage that it can be made larger.
【００２９】また、電気メッキを行う場合に、請求項４
の発明のように、陰極をピン状に形成するとともに、伝
送路の上面に積層した弾性材料の保護層によって陰極の
先端部を囲んでおき、被メッキ部材の重みで保護層が押
されたときに陰極の先端部が保護層から露出して被メッ
キ部材に接触するようにすれば、被メッキ部材が陰極付
近に到達するまでは、陰極は保護層からほとんど露出せ
ず、陰極にメッキが施されるのを抑制することができる
という利点がある。When the electroplating is performed, the method according to claim 4
When the cathode is formed in a pin shape and the tip of the cathode is surrounded by a protective layer made of an elastic material laminated on the upper surface of the transmission line, and the protective layer is pushed by the weight of the plated member, If the tip of the cathode is exposed from the protective layer and contacts the member to be plated, the cathode is barely exposed from the protective layer until the member to be plated reaches near the cathode, and the cathode is plated. There is an advantage that it can be suppressed.
【００３０】請求項５の発明は、搬送路が、被メッキ部
材が載る平板状の主片と、主片の側縁のうち螺旋の内周
側の側縁から上向きに突出する側片とを有する形状に形
成されているので、搬送路の上で被メッキ部材が幅方向
の中央付近に集中することがなく、被メッキ部材をメッ
キ液に十分に接触させることができ、各被メッキ部材に
ほぼ均一にメッキを施すことができるという効果があ
る。According to a fifth aspect of the present invention, the transport path includes a flat plate-shaped main piece on which the member to be plated is placed, and a side piece protruding upward from a side edge on the inner peripheral side of the spiral of the side edges of the main piece. Since the member to be plated is formed on the conveying path, the member to be plated does not concentrate near the center in the width direction, and the member to be plated can be sufficiently brought into contact with the plating liquid. The effect is that plating can be applied almost uniformly.
【００３１】請求項６の発明は、被メッキ部材をメッキ
槽に投入してから搬送路の上端まで移動する間の処理を
１過程として複数過程を繰り返すので、被メッキ部材が
１つのメッキ槽の中で搬送路を複数回通過するようにし
たり、被メッキ部材が複数のメッキ槽に順次投入される
ようにすることによって、複数過程でメッキを繰り返す
ことができるのであって、結果的に、１過程では十分な
厚みの膜を形成できない場合であっても、複数過程でメ
ッキを施すことによって所要の厚みの膜を容易に形成す
ることができるという利点を有する。In the invention of claim 6, a plurality of steps are repeated, with one step being a process of moving the member to be plated into the plating tank and moving to the upper end of the transport path. It is possible to repeat the plating in a plurality of steps by making the carrier pass through the transport path a plurality of times or by sequentially loading the members to be plated into a plurality of plating tanks. Even if a film having a sufficient thickness cannot be formed in the process, there is an advantage that a film having a required thickness can be easily formed by performing plating in a plurality of processes.
【図１】実施例１を示し、（ａ）は平面図、（ｂ）は縦
断面図である。1A and 1B show a first embodiment, in which FIG. 1A is a plan view and FIG. 1B is a vertical sectional view.
【図２】実施例１に用いる加振器を示し、（ａ）は平面
図、（ｂ）は側面図である。2A and 2B show a vibrator used in Example 1, where FIG. 2A is a plan view and FIG. 2B is a side view.
【図３】実施例１の動作説明図である。FIG. 3 is an operation explanatory diagram of the first embodiment.
【図４】実施例１のブロック図である。FIG. 4 is a block diagram of a first embodiment.
【図５】実施例２の要部斜視図である。FIG. 5 is a perspective view of a main part of the second embodiment.
【図６】実施例２の要部断面図である。FIG. 6 is a cross-sectional view of a main part of the second embodiment.
【図７】実施例３を示し、（ａ）は被メッキ部材がない
ときの要部断面図、（ｂ）は被メッキ部材があるときの
要部断面図である。7A and 7B show Example 3 in which FIG. 7A is a sectional view of a main part when there is no member to be plated, and FIG. 7B is a sectional view of a main part when there is a member to be plated.
【図８】実施例３における陰極の配列例を示し、（ａ）
は千鳥状配置の要部平面図、（ｂ）は一列配置の要部平
面図、（ｃ）は二列配置の要部平面図である。FIG. 8 shows an example of arrangement of cathodes in Example 3, (a)
Is a plan view of main parts in a staggered arrangement, (b) is a plan view of main parts in one row, and (c) is a plan view of main parts in two rows.
【図９】実施例４の概略構成図である。FIG. 9 is a schematic configuration diagram of a fourth embodiment.
１ メッキ槽 ２ 搬送路 ２ａ 主片 ２ｂ 側片 ３ 陰極 ３ａ 櫛歯 ３ｂ リード線 ３ｃ 基板 ３ｄ 接触子 ４ 陽極保持板 ５ 陽極板 ６ 排出口 ７ 絶縁層 ８ 保護層 ８ａ 貫通穴 １０ 加振器 Ａ 被メッキ部材 DESCRIPTION OF SYMBOLS 1 Plating tank 2 Transport path 2a Main piece 2b Side piece 3 Cathode 3a Comb tooth 3b Lead wire 3c Substrate 3d Contactor 4 Anode holding plate 5 Anode plate 6 Discharge port 7 Insulating layer 8 Protective layer 8a Through hole 10 Exciter A Cover Plated member
───────────────────────────────────────────────────── フロントページの続き (72)発明者 柘植 久司 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Tsuge 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd.
Claims (6)
なるように配置されメッキ液が入れられるメッキ槽と、
メッキ槽の内周面に沿う螺旋状に形成されてメッキ槽に
固着され被メッキ部材が載置される搬送路と、被メッキ
部材が搬送路に沿って上昇方向に移動するようにメッキ
槽に対して上下方向および周方向の振動を与える加振器
とを具備することを特徴とする連続メッキ装置。1. A plating tank which is formed in a cylindrical shape and is arranged with its center line in the vertical direction and in which a plating solution is placed,
A transport path that is formed in a spiral shape along the inner peripheral surface of the plating tank and is fixed to the plating tank on which the member to be plated is placed, and a plating tank so that the member to be plated moves in the ascending direction along the transport path. A continuous plating apparatus comprising: a vibrator for applying vertical and circumferential vibrations.
いることを特徴とする請求項１記載の連続メッキ装置。2. The continuous plating apparatus according to claim 1, wherein the plating solution is prepared for electroless plating.
極が配設され、搬送路の上面には被メッキ部材に接触可
能な櫛状の陰極が櫛歯を搬送路の幅方向に並べる形で搬
送路の全長に亙って多数個列設され、陽極と陰極との間
に通電され被メッキ部材に電気メッキが施されることを
特徴とする請求項１記載の連続メッキ装置。3. A plating bath is provided with an anode immersed in a plating solution, and a comb-shaped cathode capable of contacting a member to be plated has comb teeth arranged in the width direction of the transport path on the upper surface of the transport path. 2. A continuous plating apparatus according to claim 1, wherein a large number of rows are provided in a line over the entire length of the transport path, and current is applied between the anode and the cathode to electroplat the member to be plated.
極が配設され、搬送路の上面には、被メッキ部材に接触
可能なピン状の多数の陰極が配列されるとともに、各陰
極がそれぞれ嵌入される貫通穴を有し陰極の先端部を貫
通穴内に収める弾性材料の保護層が積層され、保護層の
弾性は被メッキ部材の重みによって陰極の先端部を保護
層から露出させて被メッキ部材に陰極を接触させる程度
に設定され、陽極と陰極との間に通電され被メッキ部材
に電気メッキが施されることを特徴とする請求項１記載
の連続メッキ装置。4. An anode submerged in a plating solution is provided in the plating tank, and a large number of pin-shaped cathodes capable of contacting the member to be plated are arranged on the upper surface of the transport path. A protective layer made of an elastic material having a through hole into which the cathode tip portion is housed in the through hole is laminated, and the elasticity of the protective layer exposes the cathode tip portion from the protective layer due to the weight of the member to be plated. 2. The continuous plating apparatus according to claim 1, wherein the plating target member is set so as to come into contact with the cathode, and electric current is applied between the anode and the cathode to electroplate the plating target member.
板状の主片と、主片の側縁のうち螺旋の内周側の側縁か
ら上向きに一体に突出する側片とを有する形状に形成さ
れて成ることを特徴とする請求項１記載の連続メッキ装
置。5. The transport path includes a flat plate-shaped main piece on which a member to be plated is placed, and a side piece integrally projecting upward from a side edge on an inner peripheral side of a spiral among side edges of the main piece. The continuous plating apparatus according to claim 1, wherein the continuous plating apparatus is formed in a shape having the shape.
搬送路の上端まで移動する間の処理を１過程として、複
数過程を繰り返すことを特徴とする請求項１ないし請求
項５のいずれかに記載の連続メッキ装置。6. The process according to claim 1, wherein a plurality of processes are repeated, with one process being a process of moving the member to be plated into the plating tank and moving it to the upper end of the transport path. The continuous plating apparatus described in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4265159A JPH0794720B2 (en) | 1992-10-02 | 1992-10-02 | Continuous plating apparatus and continuous plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4265159A JPH0794720B2 (en) | 1992-10-02 | 1992-10-02 | Continuous plating apparatus and continuous plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06116795A true JPH06116795A (en) | 1994-04-26 |
| JPH0794720B2 JPH0794720B2 (en) | 1995-10-11 |
Family
ID=17413442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4265159A Expired - Lifetime JPH0794720B2 (en) | 1992-10-02 | 1992-10-02 | Continuous plating apparatus and continuous plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0794720B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007246964A (en) * | 2006-03-15 | 2007-09-27 | Murata Mfg Co Ltd | Plating device and plating method |
| WO2011027528A1 (en) * | 2009-09-04 | 2011-03-10 | 日立金属株式会社 | Plating device |
| JP2011230065A (en) * | 2010-04-28 | 2011-11-17 | Hitachi Metals Ltd | Apparatus for treatment of solid particle |
| KR101156551B1 (en) * | 2009-09-29 | 2012-06-20 | 주식회사 라이프덴토메디칼 | A helical anodizing apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58100698A (en) * | 1981-12-10 | 1983-06-15 | Bunya Goto | Plating device |
| JPS59145789A (en) * | 1983-02-08 | 1984-08-21 | Sahei Wazawa | Continuous surface treating device for small parts |
| JPS60114597A (en) * | 1983-11-28 | 1985-06-21 | Masayuki Otsuki | Method and device for vibration stirring type composite plating |
-
1992
- 1992-10-02 JP JP4265159A patent/JPH0794720B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58100698A (en) * | 1981-12-10 | 1983-06-15 | Bunya Goto | Plating device |
| JPS59145789A (en) * | 1983-02-08 | 1984-08-21 | Sahei Wazawa | Continuous surface treating device for small parts |
| JPS60114597A (en) * | 1983-11-28 | 1985-06-21 | Masayuki Otsuki | Method and device for vibration stirring type composite plating |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007246964A (en) * | 2006-03-15 | 2007-09-27 | Murata Mfg Co Ltd | Plating device and plating method |
| WO2011027528A1 (en) * | 2009-09-04 | 2011-03-10 | 日立金属株式会社 | Plating device |
| CN102666942A (en) * | 2009-09-04 | 2012-09-12 | 日立金属株式会社 | Plating device |
| TWI495765B (en) * | 2009-09-04 | 2015-08-11 | Hitachi Metals Ltd | Plating device |
| KR101156551B1 (en) * | 2009-09-29 | 2012-06-20 | 주식회사 라이프덴토메디칼 | A helical anodizing apparatus |
| JP2011230065A (en) * | 2010-04-28 | 2011-11-17 | Hitachi Metals Ltd | Apparatus for treatment of solid particle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0794720B2 (en) | 1995-10-11 |
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