JPH06113214A - Solid-state image pickup device - Google Patents
Solid-state image pickup deviceInfo
- Publication number
- JPH06113214A JPH06113214A JP4258561A JP25856192A JPH06113214A JP H06113214 A JPH06113214 A JP H06113214A JP 4258561 A JP4258561 A JP 4258561A JP 25856192 A JP25856192 A JP 25856192A JP H06113214 A JPH06113214 A JP H06113214A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- image pickup
- state image
- light receiving
- photoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- Endoscopes (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子内視鏡等の固体撮像
装置に関連し、特に電極取出しの改良により小型化の改
良を施した固体撮像装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device such as an electronic endoscope, and more particularly to a solid-state image pickup device which is improved in miniaturization by improving electrode extraction.
【０００２】[0002]
【従来の技術】特開平２−２７０３７５では固体撮像素
子の受光面に設けられた配線手段であるところの複数の
電極パッドを特定の一辺により多く配置し、その一辺の
側面においてフレシキブルプリント基板（ＦＰＣ）と接
続、固体撮像素子の小型化をしている。2. Description of the Related Art In Japanese Patent Laid-Open No. 2-270375, a plurality of electrode pads, which are wiring means provided on a light-receiving surface of a solid-state image sensor, are arranged on a specific side, and a flexible printed circuit board (FPC) is provided on a side surface of the side. ), The size of the solid-state image sensor has been reduced.
【０００３】[0003]
【発明が解決しようとする問題点】特開平２−２７０３
７５では、固体撮像素子の側面に実装基板であるＦＰＣ
を接続しているため、受光面側から観ると、光電変換素
子と配線手段電極パッドを有するチップキャリヤの受光
面とＦＰＣの側面を合わせた大きさとなってしまう。Problems to be Solved by the Invention
In 75, the FPC which is a mounting substrate on the side surface of the solid-state image sensor.
Therefore, when viewed from the light receiving surface side, the light receiving surface of the chip carrier having the photoelectric conversion element and the wiring means electrode pad and the side surface of the FPC are combined.
【０００４】本発明は上述した点にかんがみてなされた
もので、固体撮像素子と実装基板の接続の方法を改良
し、電子内視鏡の挿入先端部の細径化や超小型カメラ
（フィンガーサイズ）等に登載できるより小型化の固体
撮像装置を提供することを目的とする。The present invention has been made in view of the above points, and has improved the method of connecting a solid-state image pickup device and a mounting board to reduce the diameter of the insertion end portion of an electronic endoscope and an ultra-small camera (finger size). It is an object of the present invention to provide a more compact solid-state imaging device that can be mounted on the above.
【０００５】[0005]
【問題点を解決するための手段及び作用】本発明では、
より一層の小型化をはかるため、固体撮像素子における
多数の光電変換素子が配置された受光面に設けられた導
電部材に対し最も近傍の側面より導電部材の一部を切り
欠き、且つ、受光面と対向する面（便宜上裏面）に向か
うにつれ、その溝の深さが深くなるように溝を斜めに形
成し、この傾斜した溝部に前記導電部材とを導通する接
続部材を設け、別に設けられた実装基板より延長された
配線手段をこの接続部材で電気的に接続し、固体撮像素
子の裏面において、受光面より観て固体撮像素子から実
装基板および基板上に設けられる電気部品がはみ出さな
いように素子と実装基板を電気的に接続した。[Means and Actions for Solving Problems] In the present invention,
In order to further reduce the size, a part of the conductive member is cut away from the side surface closest to the conductive member provided on the light receiving surface where a large number of photoelectric conversion elements are arranged in the solid-state image sensor, and the light receiving surface The groove was formed obliquely so that the depth of the groove became deeper toward the surface (the back surface for convenience) opposite to and the connecting member for conducting the conductive member to the inclined groove was provided separately. Electrically connect the wiring means extended from the mounting board with this connecting member so that the mounting board and the electrical components provided on the board do not protrude from the solid-state imaging element on the back surface of the solid-state imaging element when viewed from the light receiving surface. The element and the mounting board were electrically connected to each other.
【０００６】[0006]
【実施例】以下、図面を参照して本発明の実施例を説明
する。図１及び図２は本発明の第１実施例に係り、図１
は第１実施例の固体撮像装置を斜視図で示し、図２は溝
部を断面図で示す。Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 relate to a first embodiment of the present invention.
Shows a perspective view of the solid-state imaging device of the first embodiment, and FIG. 2 shows a sectional view of the groove.
【０００７】図１及び図２に示すように本発明の第１実
施例の固体撮像装置１は光を受光する受光面２に撮像エ
リア（受光領域）２ａが形成された固体撮像素子３と、
この固体撮像素子３と接続された実装基板４とから構成
される。As shown in FIGS. 1 and 2, a solid-state image pickup device 1 according to a first embodiment of the present invention includes a solid-state image pickup device 3 having an image pickup area (light receiving region) 2a formed on a light receiving surface 2 for receiving light.
It is composed of the solid-state imaging device 3 and a mounting substrate 4 connected to the solid-state imaging device 3.
【０００８】上記固体撮像素子３は板状のシリコン等の
半導体基板５の一方の面、つまり受光面２側に正方形な
いしは長方形の撮像エリア２が形成され、この撮像エリ
ア２には受光した光に対し光電変換する機能を備えた多
数の光電変換素子６が配置されている。The solid-state image pickup device 3 has a square or rectangular image pickup area 2 formed on one surface of a semiconductor substrate 5 such as a plate-like silicon, that is, on the light receiving surface 2 side. A large number of photoelectric conversion elements 6 having a function of performing photoelectric conversion are arranged.
【０００９】この撮像エリア２を囲む４つの辺部（側
部）の１辺部には、多数の光電変換素子６をドライブす
る信号を伝えるためと、光電変換された信号を伝送する
ために複数の銅箔材などからなる導電手段７が撮像エリ
ア２から１辺部の側面側に延出され、側面に沿って一定
のピッチ等でそれぞれ設けられた複数の電極パッド８と
接続されている。A plurality of sides for transmitting a signal for driving a large number of photoelectric conversion elements 6 and transmitting a photoelectrically converted signal are provided on one side of the four sides (sides) surrounding the image pickup area 2. The conductive means 7 made of a copper foil or the like extends from the imaging area 2 to the side surface side of one side and is connected to a plurality of electrode pads 8 provided along the side surface at a constant pitch or the like.
【００１０】上記側面に沿って形成された複数の電極パ
ッド８は、例えば正方形ないし長方形状で、側面に臨む
側の中央が一部削り取られ（或いは切り欠かれ）、図２
に示すように撮像エリア２が形成された表面と反対側と
なる裏面に行くにつれ、その溝深さを増す、複数の傾斜
溝部９が設けられている。The plurality of electrode pads 8 formed along the above-mentioned side surface are, for example, square or rectangular, and the center of the side facing the side surface is partly cut (or cut out).
As shown in (3), a plurality of inclined groove portions 9 are provided so that the depth of the groove increases toward the back surface opposite to the surface on which the imaging area 2 is formed.
【００１１】各傾斜溝部９には導電性接着剤１１を電極
パッド８に接するように充填され、この傾斜溝部９に実
装基板４より、基板面と平行に一定間隔で延出された外
部リード１２を差し入れることにより、各電極パッド８
は各外部リード１２と電気的に接続されると共に、導電
性接着剤１１により各外部リード１２を各傾斜溝部９で
接着固定することにより、固体撮像素子３と実装基板４
を機械的に固定している（尚、図１では外部リード１２
が傾斜溝部９内に収納されていることを分かり易くする
ため、導電性接着剤１１を図示しない状態で示してい
る。導電性接着剤１１に付いては図２参照）。A conductive adhesive 11 is filled in each of the inclined groove portions 9 so as to contact the electrode pad 8, and the external leads 12 extended from the mounting substrate 4 into the inclined groove portions 9 in parallel with the substrate surface at regular intervals. Each electrode pad 8 by inserting
Are electrically connected to the respective external leads 12, and the external leads 12 are bonded and fixed to the inclined groove portions 9 by the conductive adhesive 11, whereby the solid-state imaging device 3 and the mounting substrate 4 are attached.
Is mechanically fixed (in FIG. 1, the external lead 12 is
The conductive adhesive 11 is shown in a state not shown in the drawings in order to make it easy to understand that is stored in the inclined groove portion 9. See FIG. 2 for the conductive adhesive 11.
【００１２】固体撮像素子３と実装基板４が機械的に固
定された状態は図１及び図２から分かるように、実装基
板４の基板面は固体撮像素子３の厚み方向に平行とな
る。換言すると、板状の固体撮像素子３に板状の実装基
板４が直角に接続固定されて、側面方向からみると図２
のように固体撮像装置１はほぼＬ字形状となる。As can be seen from FIGS. 1 and 2, the state where the solid-state image pickup device 3 and the mounting substrate 4 are mechanically fixed is such that the substrate surface of the mounting substrate 4 is parallel to the thickness direction of the solid-state image pickup device 3. In other words, the plate-shaped mounting board 4 is connected and fixed at a right angle to the plate-shaped solid-state imaging device 3, and when viewed from the side direction,
As described above, the solid-state imaging device 1 has a substantially L shape.
【００１３】又、図２から分かるように、実装基板４に
おける固体撮像素子３側の面（裏面）には各種電気部品
１３（抵抗、コンデンサ、ＩＣ，ＬＳＩなど）が実装さ
れている。Further, as can be seen from FIG. 2, various electric parts 13 (resistors, capacitors, ICs, LSIs, etc.) are mounted on the surface (back surface) of the mounting substrate 4 on the solid-state imaging device 3 side.
【００１４】また実装された電気部品１３及び実装基板
４は、上記構成の固体撮像装置１を撮像エリア２が形成
された固体撮像素子３の表面側から観た場合に、固体撮
像素子３の端部からはみ出さない大きさ及び位置で設け
られている。従って、上記実装基板４は固体撮像素子３
の表面より観ると裏側になってまったく観えない位置に
実装されている。Further, the mounted electric components 13 and the mounting substrate 4 have an edge of the solid-state image pickup device 3 when the solid-state image pickup device 1 having the above-mentioned structure is viewed from the front side of the solid-state image pickup device 3 in which the image pickup area 2 is formed. It is provided in a size and position that does not protrude from the section. Therefore, the mounting substrate 4 is the solid-state image sensor 3
It is mounted in a position where you can't see it at the back side when you see it from the surface.
【００１５】固体撮像素子３の端部からはみ出さないの
を確実にするするために、傾斜溝部９で接着固定さらた
外部リード１２は実装基板９に対して若干斜めになるよ
うに折り曲げられている。（図２参照） 上記実装基板４に実装された各種電気部品１３は外部リ
ード１２等と図示しないパターンで接続されて、固体撮
像素子３のドライブ・制御や光電変換された信号の増幅
等を行う固体撮像素子周辺回路を形成している。In order to ensure that the solid-state image pickup device 3 does not protrude from the end portion, the external lead 12 bonded and fixed by the inclined groove portion 9 is bent so as to be slightly inclined with respect to the mounting substrate 9. There is. (See FIG. 2) The various electric components 13 mounted on the mounting board 4 are connected to the external leads 12 and the like in a pattern (not shown) to drive and control the solid-state image sensor 3 and amplify signals photoelectrically converted. A solid-state image sensor peripheral circuit is formed.
【００１６】外部リード１２は 導電性接着剤１１によ
り傾斜溝部９にて接着固定されており、この傾斜溝部９
は固体撮像素子３の裏面側程、溝の深さが大きくなるの
で、その部分に充填される導電性接着剤１１の量を多く
でき、外部リード１２を確実に電気的に接続できると共
に、機械的な固定強度を大きくできるようにしている。The external lead 12 is bonded and fixed in the inclined groove portion 9 by the conductive adhesive 11, and the inclined groove portion 9 is formed.
Since the depth of the groove increases toward the rear surface side of the solid-state imaging device 3, the amount of the conductive adhesive 11 filled in that portion can be increased, and the external lead 12 can be reliably electrically connected and the mechanical It is designed to increase the fixing strength.
【００１７】又、傾斜溝部９から導電性接着剤１１がハ
ミ出して隣接する外部リード１２と互いに導通してしま
うことを確実に防止できるようにしている。このように
構成したので、従来のように実装基板を固体撮像素子の
側面に接続させるのに比べ、実装基板４を固体撮像素子
３の裏面側で接続できるので、実装基板４の（撮像エリ
ア２の電極パッド８が形成された）側面側の大きさだけ
撮像エリア２の面積を小さくでき、小型化が可能とな
る。Further, it is possible to surely prevent the conductive adhesive 11 from leaking out from the inclined groove portion 9 and being electrically connected to the adjacent external lead 12. With this configuration, the mounting substrate 4 can be connected on the back surface side of the solid-state imaging device 3 as compared to the case where the mounting substrate is connected to the side surface of the solid-state imaging device as in the related art. The area of the imaging area 2 can be reduced by the size of the side surface (where the electrode pad 8 is formed) and the size can be reduced.
【００１８】従って、例えば電子内視鏡の先端部に収納
される固体撮像装置に適用すると、先端部を十分に小型
化できることになる。さらに、溝部を傾斜させているの
で、傾斜させない溝部の場合よりも（固体撮像素子サイ
ズを等しくした場合）、受光面側における撮像エリアな
どの面積を大きくできることになる、換言すると撮像エ
リアの面積を等しくした場合、固体撮像素子３のサイズ
（図２の場合、水平方向の長さ）を小さくできる。Therefore, when the present invention is applied to, for example, a solid-state image pickup device housed in the tip of an electronic endoscope, the tip can be made sufficiently small. Furthermore, since the groove is tilted, it is possible to make the area such as the imaging area on the light-receiving surface side larger than that in the case where the groove is not tilted (when the size of the solid-state image sensor is made equal). If they are equal, the size of the solid-state image pickup device 3 (horizontal length in the case of FIG. 2) can be reduced.
【００１９】傾斜溝部９の製作方法は、ダイシング、レ
ーザー加工、ワイヤに研磨材（ダイヤモンド粉など）を
つけたものによる加工、降圧水噴射加工などが適する。Suitable methods for producing the inclined groove portion 9 include dicing, laser processing, processing with a wire to which an abrasive material (diamond powder or the like) is attached, and pressure reducing water injection processing.
【００２０】図３及び図４は本発明の第２実施例に係
り、図３は第２実施例を組立前の斜視図で示し、図４は
断面図で示す。尚、第１実施例と同一の構成要素は同じ
符号で示す。3 and 4 relate to a second embodiment of the present invention, FIG. 3 is a perspective view of the second embodiment before assembly, and FIG. 4 is a sectional view. The same components as those in the first embodiment are designated by the same reference numerals.
【００２１】この第２実施例では固体撮像素子３の表面
における撮像エリア２から略放射状に形成された複数の
導電手段７の端部を一部を削り取るように幅の狭い傾斜
溝部９を形成し、実装基板を構成するフレシキブルプリ
ント基板１４より突出した帯状の複数の外部リード１６
を９０°ねじ曲げ、フレシキブル基板１４に対し、直角
になるようにして傾斜溝部９に嵌め込み、導電性接着剤
１１で固体撮像素子３に接合すると共に、導電手段７と
帯状の外部リード１５の電気的接続をしている。In the second embodiment, a narrow inclined groove portion 9 is formed so as to scrape off the end portions of the plurality of conductive means 7 formed in a substantially radial shape from the image pickup area 2 on the surface of the solid-state image pickup element 3. , A plurality of strip-shaped external leads 16 protruding from the flexible printed circuit board 14 constituting the mounting board
Is bent by 90 °, fitted into the inclined groove portion 9 at right angles to the flexible substrate 14, bonded to the solid-state image sensor 3 with a conductive adhesive 11, and electrically connected to the conductive means 7 and the strip-shaped outer lead 15. You are connected.
【００２２】フレシキブルプリント基板１４にはＩＣ１
６とコンデンサ１７が重ねられ、それぞれボンディング
ワイヤ１８で、例えばコンデンサ１７とＩＣ１６とが、
及びＩＣ１６と基板面とが接続されている。このように
構成したので、第１実施例の電極パッド８の大きさの
分、固体撮像素子３をより小型化できる。The flexible printed circuit board 14 has an IC 1
6 and the capacitor 17 are superposed, and the bonding wire 18 is used to form the capacitor 17 and the IC 16, respectively.
Also, the IC 16 and the substrate surface are connected. With this configuration, the solid-state image sensor 3 can be made smaller by the size of the electrode pad 8 of the first embodiment.
【００２３】また実装基板をガラスエポキシ基板等に比
較して薄いフレシキブルプリント基板１４（例えばポリ
イミド材など）にしたので実装する電気部品のスペース
が大きくとれ、図４に示すように重ねることにより、こ
の図４における上下方向の長さを短くできる。このた
め、例えば、電子スコープの先端部に実装した場合、先
端部の硬質長を短くできることになる。Since the mounting board is made of a flexible flexible printed board 14 (for example, a polyimide material) which is thinner than a glass epoxy board or the like, a large space can be secured for the electric parts to be mounted, and by stacking as shown in FIG. The length in the vertical direction in FIG. 4 can be shortened. Therefore, for example, when it is mounted on the tip of the electronic scope, the hard length of the tip can be shortened.
【００２４】尚、上述の実施例では傾斜溝部９は１つの
側面にのみ形成されているが、本発明はこれに限定され
るものでなく、２つ以上の側面に傾斜溝部９を設けた場
合にも適用できる。Although the inclined groove portion 9 is formed on only one side surface in the above-described embodiment, the present invention is not limited to this, and when the inclined groove portion 9 is provided on two or more side surfaces. Can also be applied to.
【００２５】又、上述の実施例では固体撮像素子の裏面
側にいくにつれ、溝の深さが次第に大きくなる傾斜溝部
９を説明したが、本発明はこれに限定されるものでな
く、固体撮像素子の裏面側にいくにつれ、段階（ステッ
プ）状に溝の深さが大きくなるステップ状（傾斜）溝部
ものでも良い。Further, in the above-described embodiment, the inclined groove portion 9 in which the depth of the groove gradually increases toward the back side of the solid-state image pickup element has been described, but the present invention is not limited to this, and the solid-state image pickup is performed. A step-shaped (inclined) groove portion in which the depth of the groove increases stepwise as it goes to the back surface side of the element may be used.
【００２６】さらに、傾斜溝部９又はステップ状（傾
斜）溝部を受光面２から対向する裏面側に（受光面２
に）垂直に（例えば図１では上下方向に）形成するもの
に限定されるものでなく、傾斜させて（例えば図１では
上下方向及び左右方向）形成したものでも良い。Further, the inclined groove portion 9 or the step-shaped (inclined) groove portion is provided from the light receiving surface 2 to the opposite back surface side (light receiving surface 2
In addition, the present invention is not limited to being formed vertically (for example, in the vertical direction in FIG. 1), but may be formed so as to be inclined (for example, the vertical direction and the horizontal direction in FIG. 1).
【００２７】次に図５に撮像エリア２の裏側に電極を設
ける別の方法を示す。撮像エリア２に複数設けられた光
電変換素子と（直接或いは図示しない半導体素子を介し
て）信号をやりとりするボンディングワイヤ２１の設置
位置の真下にエッチング等の手段により固体撮像素子３
を貫通する微細な穴２２を素子と同数設け、この穴２２
に半田等の導電材料２３を充填し、実装基板４より延出
された外部リード１２を差し込み電気的に接続する。Next, FIG. 5 shows another method of providing electrodes on the back side of the imaging area 2. The solid-state imaging device 3 is provided directly below the installation position of the bonding wire 21 for exchanging signals (directly or via a semiconductor device (not shown)) with a plurality of photoelectric conversion devices provided in the imaging area 2 by means of etching or the like.
The same number of minute holes 22 that penetrate the
Is filled with a conductive material 23 such as solder, and the external lead 12 extended from the mounting substrate 4 is inserted and electrically connected.
【００２８】これにより、比較的大きい電極パッド８
（第１実施例、図１参照）を廃し、ボンディングワイヤ
２１の真下の穴２２を通して導電材料２３を導き、裏面
に電極を形成でき、小型化がはかれる。As a result, the relatively large electrode pad 8
The first embodiment (see FIG. 1) can be eliminated, the conductive material 23 can be guided through the hole 22 directly below the bonding wire 21, and the electrode can be formed on the back surface, thus achieving miniaturization.
【００２９】図６に別の電極形成手段を示す。図６の例
では、図５で示した微細加工による穴２２をダイシング
などの方法により切断して穴２２の内半面を露出させて
複数の半割溝２５を形成し、そこに図５で示す導電材料
２３等を充填するなりして側面電極とし、側面接続を可
能としている。FIG. 6 shows another electrode forming means. In the example of FIG. 6, the hole 22 by the fine processing shown in FIG. 5 is cut by a method such as dicing to expose the inner half surface of the hole 22 to form a plurality of half grooves 25, which are shown in FIG. The side surface electrodes can be formed by filling the conductive material 23 and the like to form side surface electrodes.
【００３０】図７、図８には撮像エリア２が形成された
表面から裏面側に電極を導く方法を示す。図７では、固
体撮像素子３の片側に複数のスルーホール型電極３１を
設け光電変換素子６の電極をボンディングワイヤ２１に
より結線し、スルーホール型電極３１の裏面側にはバン
プ電極３２を形成した。7 and 8 show a method of guiding the electrodes from the front surface on which the imaging area 2 is formed to the back surface side. In FIG. 7, a plurality of through-hole type electrodes 31 are provided on one side of the solid-state image sensor 3, the electrodes of the photoelectric conversion element 6 are connected by the bonding wires 21, and bump electrodes 32 are formed on the back side of the through-hole type electrodes 31. .
【００３１】図８（ａ）の概略断面図、図８（ｂ）の斜
視図に示す例では、固体撮像素子３の表面から側面を沿
って裏面に至るコの字型の銅箔３３を固体撮像素子３の
表面に形成し、光電変換素子６との間の電気信号のやり
とりを裏面のバンプ電極３２に導いている。銅箔の幅は
受光面では小さく、放射状に広がり裏面では幅を大きく
してバンプ電極３２を形成しやすいようになっている
（図８（ｂ）参照）。In the example shown in the schematic cross-sectional view of FIG. 8A and the perspective view of FIG. 8B, the U-shaped copper foil 33 extending from the front surface to the rear surface of the solid-state image pickup device 3 is formed into a solid state. It is formed on the surface of the image pickup device 3, and the exchange of electric signals with the photoelectric conversion device 6 is guided to the bump electrode 32 on the back surface. The width of the copper foil is small on the light receiving surface and spreads radially to increase the width on the back surface so that the bump electrodes 32 can be easily formed (see FIG. 8B).
【００３２】図９にこれまで上げた小型化した固体撮像
装置を内蔵した電子内視鏡の先端部３４、それにつらな
る湾曲部３５、可撓管部３６を示す。この湾曲部３５は
湾曲ゴムを用いずに、湾曲管の表皮樹脂の硬度を一部硬
化して湾曲可能な湾曲管を有するようにしたものであ
る。この例では、湾曲部３５を従来より細径化して、小
型化した固体撮像装置の効果を失わないように工夫がな
されている。FIG. 9 shows a tip portion 34 of an electronic endoscope incorporating the miniaturized solid-state image pickup device, which has been raised up to this point, a curved portion 35 and a flexible tube portion 36, which are associated therewith. The bending portion 35 does not use a bending rubber, but has a bending tube that can be bent by partially hardening the hardness of the skin resin of the bending tube. In this example, the bending portion 35 has a diameter smaller than that of the conventional one, so that the effect of the miniaturized solid-state imaging device is not lost.
【００３３】従来では、内厚０、２ 〜０、３ｍｍ の鋼
管を加工してなる湾曲管を複数個、湾曲可能に連結して
そのうえに線径０、０３〜０、０５ｍｍの網状管（ブレ
ード）を被覆し、さらにその上に柔軟なゴム材料やエラ
ストア材料カラーなる被覆円筒管（肉厚０、３ 〜０、
５ｍｍ）を覆せ、防水していた。Conventionally, a plurality of curved pipes formed by processing a steel pipe having an inner thickness of 0, 2 to 0, 3 mm are connected so as to be bendable, and further, a reticulated pipe (blade) having a wire diameter of 0, 03 to 0, 05 mm. And a coated cylindrical tube (wall thickness 0, 3-0,
5 mm) was covered and waterproofed.
【００３４】このため、総合した肉厚は０、５６〜０、
９ｍｍになり、それぞれの隙間を加味すると直径では
１、２〜２、０ｍｍになっていた。このため、湾曲部の
直径が比較的細いφ５〜φ７ｍｍのスコープでは、相対
的に大きな割合を被覆材が閉めることになり、内蔵物を
細径化、小型化できても、挿入部が細径化できない欠点
があった。Therefore, the total wall thickness is 0, 56 to 0,
The diameter was 9 mm, and when the respective gaps were added, the diameter was 1, 2 to 2 and 0 mm. For this reason, in a scope of φ5 to φ7 mm in which the diameter of the curved portion is relatively thin, a relatively large proportion of the covering material closes, and even if the built-in object can be made smaller and smaller, the insertion portion has a smaller diameter. There was a drawback that could not be realized.
【００３５】そこで、この例では、網状管３７を紫外線
硬化型の樹脂材３８に浸漬した後、一部斜線部３９を除
いた部分のみを硬化させて硬質部４０を形成しその後、
紫外線硬化樹脂を洗い流し、代わりに柔軟なゴム材もし
くはエラストア材に浸漬し引き上げ、今度は逆に斜線部
３９の部位のみに柔軟材を充填し、網状管３７に樹脂の
わずかの厚みを加えた肉厚０、１〜０、２ｍｍの肉厚
で、防水性能と定形の形状で湾曲する性能を有した湾曲
管と被覆柔軟材カバーが兼ね合わせた円筒管が形成され
ている。Therefore, in this example, after the reticulated tube 37 is dipped in the ultraviolet curable resin material 38, only the portion except the shaded portion 39 is cured to form the hard portion 40, and thereafter,
Rinse the UV curable resin, and instead immerse it in a soft rubber material or elastane material and pull it up. On the contrary, fill the soft material only in the shaded portion 39, and add a slight thickness of resin to the mesh tube 37. A cylindrical tube having a thickness of 0, 1 to 0, 2 mm and having a waterproof tube and a curved tube having a fixed shape and a covered soft material cover is formed.
【００３６】これにより、従来直径で１、２〜２、０ｍ
ｍを占めていた湾曲部が０、２〜０、４ｍｍになり細径
化が可能となる。網状管３７の素線は、網線よりも伸縮
性をもつ、超弾性材料が適している。または合成樹脂材
料の遷移（炭素繊線、ケブラー）でもよい。As a result, the conventional diameter is 1, 2 to 2, 0 m.
The curved portion occupying m becomes 0, 2 to 0, 4 mm, and the diameter can be reduced. The strands of the reticulated tube 37 are preferably made of a superelastic material that is more elastic than the braid. Alternatively, it may be a transition of a synthetic resin material (carbon fiber, Kevlar).
【００３７】図１０に上記の固体撮像装置を用いた電子
内視鏡４１の全体像を示す。湾曲部３５が上下左右のど
ちらの方向にも曲がっていない実線で示す状態をニュー
トラル位置といっている。挿入部４２の後端に操作部４
３が形成され、この操作部４３には湾曲ノブ４４、４５
が設けてある。FIG. 10 shows an overall image of an electronic endoscope 41 using the above solid-state image pickup device. A state in which the curved portion 35 is not bent in any of the up, down, left and right directions and is shown by a solid line is called a neutral position. The operation portion 4 is provided at the rear end of the insertion portion 42.
3 is formed, and the operation knob 43 has bending knobs 44, 45.
Is provided.
【００３８】図１１（ａ）に、上記ニュートラル位置に
おける操作部４３内の湾曲機構を示す。但し、この図は
略図であり細い構造については示していない。例えば防
水機構など操作部４３本体に一体に固定される板５９に
軸４６が固定されており、軸４６のフランジ部には図１
１（ｂ）にも示すＶ溝４７が形成されている。FIG. 11A shows the bending mechanism in the operation portion 43 at the neutral position. However, this drawing is a schematic view and does not show a thin structure. For example, the shaft 46 is fixed to a plate 59 that is integrally fixed to the main body of the operation unit 43 such as a waterproof mechanism, and the flange portion of the shaft 46 is shown in FIG.
The V groove 47 shown in 1 (b) is also formed.
【００３９】この軸４６に対し複数の歯を有するＲＬス
プロケット４８が回転自在に挿着され、このＲＬスプロ
ケット４８に形成された凹部４９に嵌め込まれる凸部を
先端に有するＲＬノブ４５が挿着され、このＲＬノブ４
５を回転するとＲＬスプロケット４８が回転し、内視鏡
先端部にワイヤを介して接続されるチェーン５０を押し
引きして左右方向に湾曲部を湾曲させることができるよ
うになっている。An RL sprocket 48 having a plurality of teeth is rotatably inserted into the shaft 46, and an RL knob 45 having a convex portion fitted at a concave portion 49 formed in the RL sprocket 48 is attached. , This RL Knob 4
When 5 is rotated, the RL sprocket 48 is rotated, and the chain 50 connected to the distal end portion of the endoscope via a wire is pushed and pulled to bend the bending portion in the left-right direction.
【００４０】ＲＬノブ４５の外側には左右方向の湾曲機
構に似た上下方向の湾曲を操作するＵＤスプロケット５
１とその凹部５２に嵌め込まれる凸部を先端に有するＵ
Ｄノブ４６と、ＵＤスプロケット５１の歯にかみ合って
前後動するＵＤチェーン５３が構成されている。On the outside of the RL knob 45, a UD sprocket 5 for operating a vertical bending similar to a horizontal bending mechanism.
1 and U having a convex portion fitted in the concave portion 52 at its tip
A D knob 46 and a UD chain 53 that moves back and forth by engaging with the teeth of the UD sprocket 51 are configured.
【００４１】このチェーン５３には先端部まで延長され
るワイヤ（図示しない）が接続されている。ＵＤノブ４
６には有底穴５４が空いていて、その中の圧縮されたバ
ネ５５によりボール５６が図の下方向に力を加えていて
操作部４３の一部に形成されたＶ溝４７にはまってい
る。A wire (not shown) extending to the tip is connected to the chain 53. UD knob 4
6, a bottomed hole 54 is formed, and a compressed spring 55 therein causes a ball 56 to exert a force in the downward direction of the drawing and fits into a V groove 47 formed in a part of the operation portion 43. There is.
【００４２】同様にＲＬスプロケット４８３４にも有底
穴５４、バネ５５、ボール５６があり、固定軸４６のフ
ランジ部に形成されたＶ溝４７にはめこまれている。こ
のように構成したので、アングルノブ４４、４５をニュ
ートラル位置から回転させるにはボール５６がＶ溝４７
を乗り越えるのに必要な力が必要となり、アングルノブ
４４、４５を回転させる手の指に引っ掛かり感が生じ
る。Similarly, the RL sprocket 4834 also has a bottomed hole 54, a spring 55, and a ball 56, and is fitted into a V groove 47 formed in the flange portion of the fixed shaft 46. With this structure, the ball 56 is moved to the V groove 47 to rotate the angle knobs 44 and 45 from the neutral position.
A force necessary to get over the vehicle is required, and the fingers of the hands that rotate the angle knobs 44 and 45 have a feeling of being caught.
【００４３】従って、モニタ面を観ながら体腔内を観察
・診断していてもアングルノブ４４、４５に伝わる感触
からスコープ先端のニュートラル位置が分かるので体腔
内や硬性の案内管（トラカール）から、スコープを抜去
するとき、ニュートラル位置にするのが容易となり、湾
曲したまま抜去して、体腔壁を傷つけたり、スコープ側
を損傷してしまうことがなくなる。Therefore, even when observing and diagnosing the inside of the body cavity while observing the monitor surface, the neutral position at the distal end of the scope can be known from the feel transmitted to the angle knobs 44 and 45, so that the scope can be detected from the body cavity or the rigid guide tube (trocar). It is easy to set the neutral position to the withdrawal position, and the withdrawal without curving the body cavity wall or the scope side is prevented.
【００４４】[0044]
【発明の効果】以上説明したように本発明によれば、受
光面に配置された多数の光電変換素子と、該光電変換素
子に対し、電気信号を伝送するガイドとなる複数の導電
部材とを設けてなる固体撮像素子と、前記光電変換素子
の駆動・制御及び前記光電変換素子からの出力信号の増
幅の少なくとも一方を行うための周辺回路を形成する電
気部品が実装された実装基板とからなる固体撮像装置に
おいて、前記固体撮像素子の受光面から対向面側に至る
側面に、該受光面に配置された前記導電部材の端部を一
部切り欠くと共に、前記対向面寄りに深さが増すように
形成された複数の傾斜溝と、前記固体撮像素子の受光面
上に設けた前記導電部材の端部と、前記実装基板とを前
記傾斜溝で電気的に接続する接続部材とを設けてあるの
で、固体撮像素子の受光面のうち、光電変換素子のある
撮像エリア以外の面積を極力小さくでき、小型化でき
る。As described above, according to the present invention, a large number of photoelectric conversion elements arranged on the light receiving surface and a plurality of conductive members serving as guides for transmitting electric signals to the photoelectric conversion elements are provided. The solid-state image sensor provided, and a mounting board on which electrical components forming a peripheral circuit for driving / controlling the photoelectric conversion element and / or amplifying an output signal from the photoelectric conversion element are mounted. In the solid-state imaging device, a side surface extending from the light-receiving surface of the solid-state image sensor to the facing surface side is partially cut away, and the depth of the conductive member is increased toward the facing surface. A plurality of inclined grooves formed as described above, an end portion of the conductive member provided on the light receiving surface of the solid-state imaging device, and a connection member that electrically connects the mounting substrate with the inclined groove. Since there is a solid-state image sensor Among the light-receiving surface, it can minimize the area of the non-imaging area with a photoelectric conversion element can be miniaturized.
【００４５】又、裏面に電極を設けリードで接続するの
に比べ、固体撮像素子の一部に形成した傾斜溝部内に実
装基板の外部リードを埋設できるので、固体撮像装置の
全長が短縮できる。さらに、傾斜溝部に比較的多量の導
電接着剤や導電材（半田など）を充填できるので、導電
性、強度を向上できる。In addition, since the external leads of the mounting substrate can be embedded in the inclined groove portion formed in a part of the solid-state image sensor, the total length of the solid-state image sensor can be shortened as compared with the case where electrodes are provided on the back surface and the leads are connected. Further, since the inclined groove portion can be filled with a relatively large amount of conductive adhesive or conductive material (solder or the like), conductivity and strength can be improved.
【図１】本発明の第１実施例の固体撮像装置を示す斜視
図。FIG. 1 is a perspective view showing a solid-state imaging device according to a first embodiment of the present invention.
【図２】第１実施例における傾斜溝部を示す断面図。FIG. 2 is a sectional view showing an inclined groove portion in the first embodiment.
【図３】本発明の第２実施例の固体撮像装置を組立前の
状態で示す斜視図。FIG. 3 is a perspective view showing a solid-state imaging device according to a second embodiment of the present invention in a state before assembly.
【図４】第２実施例における傾斜溝部を示す断面図。FIG. 4 is a sectional view showing an inclined groove portion in a second embodiment.
【図５】電極形成手段の１例を示す説明図。FIG. 5 is an explanatory view showing an example of an electrode forming means.
【図６】図５とは異なる電極形成手段の他の例を示す説
明図。FIG. 6 is an explanatory view showing another example of an electrode forming means different from that of FIG.
【図７】受光面からその裏側に電極を導く方法の１例を
示す説明図。FIG. 7 is an explanatory diagram showing an example of a method of guiding an electrode from a light receiving surface to the back side thereof.
【図８】受光面からその裏側に電極を導く方法の他の１
例を示す説明図。FIG. 8 is another method 1 of guiding electrodes from the light receiving surface to the back side thereof.
Explanatory drawing which shows an example.
【図９】湾曲部の形成する１例を示す説明図。FIG. 9 is an explanatory diagram showing an example of forming a curved portion.
【図１０】電子内視鏡を示す外形図。FIG. 10 is an external view showing an electronic endoscope.
【図１１】湾曲機構を示す断面図。FIG. 11 is a sectional view showing a bending mechanism.
１…固体撮像装置 ２…撮像エリア（受光領域） ３…固体撮像素子 ４…実装基板 ５…シリコン基板 ６…光電変換素子 ７…導電手段 ８…電極パッド ９…傾斜溝部 １１…導電性接着剤 １２…外部リード １３…電気部品 DESCRIPTION OF SYMBOLS 1 ... Solid-state imaging device 2 ... Imaging area (light-receiving area) 3 ... Solid-state imaging device 4 ... Mounting substrate 5 ... Silicon substrate 6 ... Photoelectric conversion element 7 ... Conducting means 8 ... Electrode pad 9 ... Inclined groove 11 ... Conductive adhesive 12 ... External lead 13 ... Electrical parts
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年１２月１日[Submission date] December 1, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１９[Correction target item name] 0019
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１９】傾斜溝部９の製作方法は、ダイシング、レ
ーザー加工、ワイヤに研磨材（ダイヤモンド粉など）を
つけたものによる加工、高圧水噴射加工などが適する。Suitable methods for producing the inclined groove portion 9 include dicing, laser processing, processing with a wire to which an abrasive material (diamond powder or the like) is attached, high-pressure water jet processing and the like.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２１[Correction target item name] 0021
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２１】この第２実施例では固体撮像素子３の表面
における撮像エリア２から略放射状に形成された複数の
導電手段７の端部を一部を削り取るように幅の狭い傾斜
溝部９を形成し、実装基板を構成するフレシキブルプリ
ント基板１４より突出した帯状の複数の外部リード１５
を９０°ねじ曲げ、フレシキブル基板１４に対し、直角
になるようにして傾斜溝部９に嵌め込み、導電性接着剤
１１で固体撮像素子３に接合すると共に、導電手段７と
帯状の外部リード１５の電気的接続をしている。In the second embodiment, a narrow inclined groove portion 9 is formed so as to scrape off the end portions of the plurality of conductive means 7 formed in a substantially radial shape from the image pickup area 2 on the surface of the solid-state image pickup element 3. , frame shiki Bull protrudes from the printed circuit board 14 has strip-like plurality of external leads 1 5 constituting the mounting substrate
Is bent by 90 °, fitted into the inclined groove portion 9 at right angles to the flexible substrate 14, bonded to the solid-state image sensor 3 with a conductive adhesive 11, and electrically connected to the conductive means 7 and the strip-shaped outer lead 15. You are connected.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３３[Correction target item name] 0033
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３３】従来では、内厚０、２ 〜０、３ｍｍ の鋼
管を加工してなる湾曲管を複数個、湾曲可能に連結して
そのうえに線径０、０３〜０、０５ｍｍの網状管（ブレ
ード）を被覆し、さらにその上に柔軟なゴム材料やエラ
ストマ材料からなる被覆円筒管（肉厚０、３ 〜０、５
ｍｍ）を覆せ、防水していた。Conventionally, a plurality of curved pipes formed by processing a steel pipe having an inner thickness of 0, 2 to 0, 3 mm are connected so as to be bendable, and further, a reticulated pipe (blade) having a wire diameter of 0, 03 to 0, 05 mm. covering the further coating a cylindrical tube made of a flexible rubber material and gills <br/> strike Ma material thereon (thickness 0,3 ～0,5
mm) was covered and waterproofed.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３４[Correction target item name] 0034
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３４】このため、総合した肉厚は０、５６〜０、
９ｍｍになり、それぞれの隙間を加味すると直径では
１、２〜２、０ｍｍになっていた。このため、湾曲部の
直径が比較的細いφ５〜φ７ｍｍのスコープでは、相対
的に大きな割合を被覆材が占めることになり、内蔵物を
細径化、小型化できても、挿入部が細径化できない欠点
があった。Therefore, the total wall thickness is 0, 56 to 0,
The diameter was 9 mm, and when the respective gaps were added, the diameter was 1, 2 to 2 and 0 mm. Therefore, the scope of the relatively thin φ5~φ7mm diameter of the curved portion is made relatively large proportion Rukoto occupied dressing diameter of the internals, even be downsized, the insertion portion is thin There was a drawback that the diameter could not be reduced.
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３５[Correction target item name] 0035
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３５】そこで、この例では、網状管３７を紫外線
硬化型の樹脂材３８に浸漬した後、一部斜線部３９を除
いた部分のみを硬化させて硬質部４０を形成しその後、
紫外線硬化樹脂を洗い流し、代わりに柔軟なゴム材もし
くはエラストマ材に浸漬し引き上げ、今度は逆に斜線部
３９の部位のみに柔軟材を充填し、網状管３７に樹脂の
わずかの厚みを加えた肉厚０、１〜０、２ｍｍの肉厚
で、防水性能と定形の形状で湾曲する性能を有した湾曲
管と被覆柔軟材カバーが兼ね合わせた円筒管が形成され
ている。Therefore, in this example, after the reticulated tube 37 is dipped in the ultraviolet curable resin material 38, only the portion except the shaded portion 39 is cured to form the hard portion 40, and thereafter,
Washing away the ultraviolet curing resin, dipped pulling a flexible rubber material or elastography Ma material instead, now filled with the flexible material only at the site of the hatched portion 39 in the reverse, plus a slight thickness of the resin to the mesh tube 37 A cylindrical tube having a wall thickness of 0, 1 to 0, 2 mm and having a waterproof pipe and a curved pipe having a fixed shape and a covered soft material cover is formed.
【手続補正６】[Procedure correction 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３６[Correction target item name] 0036
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００３６】これにより、従来直径で１、２〜２、０ｍ
ｍを占めていた湾曲部の被覆材内厚が０、２〜０、４ｍ
ｍになり細径化が可能となる。網状管３７の素線は、鋼
線よりも伸縮性をもつ、超弾性材料が適している。また
は合成樹脂材料の繊維（炭素繊維、ケブラー）でもよ
い。As a result, the conventional diameter is 1, 2 to 2, 0 m.
The inner thickness of the covering material of the curved portion that occupied m was 0, 2 to 0, 4 m
It becomes m and the diameter can be reduced. The strands of the reticulated tube 37 are preferably made of a superelastic material that has more elasticity than the steel wire. Alternatively, a synthetic resin material fiber (carbon fiber , Kevlar) may be used.
【手続補正７】[Procedure Amendment 7]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００４２[Correction target item name] 0042
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００４２】同様にＲＬスプロケット４８にも有底穴５
４、バネ５５、ボール５６があり、固定軸４６のフラン
ジ部に形成されたＶ溝４７にはめこまれている。このよ
うに構成したので、アングルノブ４４、４５をニュート
ラル位置から回転させるにはボール５６がＶ溝４７を乗
り越えるのに必要な力が必要となり、アングルノブ４
４、４５を回転させる手の指に引っ掛かり感が生じる。[0042] Similarly, blind hole 5 in RL sprocket 4 8
4, a spring 55, and a ball 56, which are fitted in a V groove 47 formed in a flange portion of the fixed shaft 46. With this configuration, in order to rotate the angle knobs 44 and 45 from the neutral position, a force necessary for the ball 56 to get over the V groove 47 is required, and the angle knob 4
There is a feeling of being caught in the fingers of the hands that rotate 4, 45.
【手続補正８】[Procedure Amendment 8]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００４５[Name of item to be corrected] 0045
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００４５】又、裏面に電極を設けリードで接続するの
に比べ、固体撮像素子の一部に形成した傾斜溝部内に実
装基板の外部リードを埋設できるので、固体撮像装置の
全長が短縮できる。さらに、傾斜溝部に比較的多量の導
電接着剤や導電材（半田など）を充填できるので、導電
性、強度を向上できる。In addition, since the external leads of the mounting substrate can be embedded in the inclined groove portion formed in a part of the solid-state image sensor, the total length of the solid-state image sensor can be shortened as compared with the case where electrodes are provided on the back surface and the leads are connected. Further, since the inclined groove portion can be filled with a relatively large amount of conductive adhesive or conductive material (solder or the like), conductivity and strength can be improved.
【手続補正９】[Procedure Amendment 9]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図１１[Name of item to be corrected] Figure 11
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１１】 FIG. 11
Claims (1)
と、該光電変換素子に対し、電気信号を伝送するガイド
となる複数の導電部材とを設けてなる固体撮像素子と、 前記光電変換素子の駆動・制御及び前記光電変換素子か
らの出力信号の増幅の少なくとも一方を行うための周辺
回路を形成する電気部品が実装された実装基板と、 からなる固体撮像装置において、 前記固体撮像素子の受光面から対向面側に至る側面に、
該受光面に配置された前記導電部材の端部を一部切り欠
くと共に、前記対向面寄りに深さが増すように形成され
た複数の傾斜溝と、 前記固体撮像素子の受光面上に設けた前記導電部材の端
部と、前記実装基板とを前記傾斜溝で電気的に接続する
接続部材と、 を設けたことを特徴とする固体撮像装置。1. A solid-state imaging device comprising a large number of photoelectric conversion elements arranged on a light-receiving surface and a plurality of conductive members serving as guides for transmitting electric signals to the photoelectric conversion elements, and the photoelectric conversion element. In a solid-state imaging device comprising: a mounting board on which electric components forming a peripheral circuit for driving / controlling an element and / or amplifying an output signal from the photoelectric conversion element are mounted; On the side surface from the light receiving surface to the facing surface side,
A plurality of inclined grooves are formed on the light receiving surface of the solid-state imaging device, the end portions of the conductive member being partially cut out, and the plurality of inclined grooves formed to increase the depth toward the facing surface. A solid-state imaging device comprising: a connecting member that electrically connects the end of the conductive member and the mounting substrate with the inclined groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4258561A JPH06113214A (en) | 1992-09-28 | 1992-09-28 | Solid-state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4258561A JPH06113214A (en) | 1992-09-28 | 1992-09-28 | Solid-state image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06113214A true JPH06113214A (en) | 1994-04-22 |
Family
ID=17321947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4258561A Withdrawn JPH06113214A (en) | 1992-09-28 | 1992-09-28 | Solid-state image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06113214A (en) |
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